Insulating heat-conducting sheath structure of small-size power adapter

Abstract

The invention discloses an insulating heat-conducting sheath structure of a small-size power adapter, the small-size power adapter comprises a PCBA board and a shell, the insulating heat-conducting sheath structure comprises an insulating sheath and a metal temperature-equalizing shell, the insulating sheath is arranged around the PCBA board and is assembled with the PCBA board to form insulating isolation, the metal temperature-equalizing shell is sleeved on the outer wall of the insulating sheath, and the metal temperature-equalizing shell is arranged on the outer wall of the insulating sheath. The metal temperature equalizing shell and the insulating sheath are combined to form a temperature equalizing cover structure, so that internal temperature equalization is realized, and the temperature rise of the shell is reduced; wherein the insulating sheath is integrally formed by injection molding. According to the application, the insulation isolation and uniform temperature heat dissipation functions are simultaneously realized through the insulation sheath and the metal uniform temperature shell which are arranged on the periphery of the PCBA board in a sleeving manner. The integrally injection-molded insulating sheath solves the problems that micro-cracks and pinholes are easy to generate at the edge and the bending part of a traditional insulating sheet, and withstand voltage failure or ESD breakdown occurs. According to the invention, a sheet-shaped heat-conducting foil film can be selected, the metal temperature-equalizing shell and the sheet-shaped heat-conducting foil film are reused, and the heat dissipation effect is effectively improved by combining the temperature-equalizing isolation effect of the insulating sheath.

Description

Technical Field

[0001] This application relates to the field of power adapter technology, and in particular to an insulating and thermally conductive sheath structure for a small-sized power adapter. Background Technology

[0002] With the widespread use of electronic products such as smartphones, laptops, and set-top boxes, the miniaturization, lightweighting, and high power density of power adapters, as key components, have become an inevitable trend in the industry. In particular, the widespread application of PD fast charging technology has significantly improved the power density of adapters while requiring smaller sizes for easier portability and use by users.

[0003] Currently, most mainstream adapter heat dissipation solutions on the market employ a heat spreader structure formed by combining metal heat spreaders (such as copper or aluminum plates) with insulating sheets. However, in practical applications, especially with the miniaturization of adapters, this solution has revealed several shortcomings: First, traditional heat spreaders use a separate design of metal sheets and insulating sheets, which is thick and takes up a lot of space. This makes it difficult to meet the requirements of high power density adapters for extreme miniaturization, resulting in products that are too large and inconvenient to carry.

[0004] Secondly, high power density adapters generate concentrated heat from internal components during operation. Traditional heat dissipation structures have high thermal resistance and limited heat transfer efficiency, resulting in a significant temperature rise on the outer casing surface. This leads to a poor user experience and poses a safety hazard of burns from high temperatures.

[0005] Third, traditional insulating sheets are mostly cut or punched, and the metal heat spreader is thin. Both are prone to defects such as microcracks and pinholes at the edges and bends. Under high voltage conditions, they are prone to withstand voltage (HI-POT) failure or ESD (electrostatic discharge) breakdown, making it difficult to guarantee safety performance.

[0006] In summary, existing adapter heat dissipation solutions struggle to balance insulation reliability, structural integrity, and heat dissipation requirements. Therefore, there is an urgent need for a novel sheath structure that is simple in structure, easy to assemble, has reliable insulation performance, and provides significant temperature uniformity to address these industry pain points. Summary of the Invention

[0007] The purpose of this application is to provide an insulating and thermally conductive sheath structure that, by using an injection-molded insulating shell in conjunction with a metal heat-dissipating shell, ensures structural strength while achieving insulation and heat dissipation functions.

[0008] This application provides an insulating and thermally conductive sheath structure for a small-sized power adapter. The small-sized power adapter includes a PCBA board and a housing. The insulating and thermally conductive sheath structure includes an insulating sheath and a metal heat spreader. The insulating sheath is arranged around the perimeter of the PCBA board and is assembled with the PCBA board to form an insulating barrier. The metal heat spreader is fitted onto the outer wall of the insulating sheath and abuts against the inner wall of the housing. The metal heat spreader and the insulating sheath are combined to form a heat spreader structure, which realizes internal temperature uniformity and reduces the temperature rise of the housing. The insulating sheath is integrally injection molded.

[0009] Furthermore, a limiting structure is provided on the outer surface of the insulating sheath, and at least one end of the metal heat exchange shell is abutted against the limiting structure.

[0010] Furthermore, the insulating sleeve includes a first insulating sleeve and a second insulating sleeve, which are arranged around the perimeter of the PCBA board. The first insulating sleeve and the second insulating sleeve are fitted and fixed by a snap-fit ​​structure and assembled to form a ring structure.

[0011] Furthermore, the first insulating sleeve and the second insulating sleeve are disposed opposite each other on the top, bottom, left, right or front and back sides of the PCBA board, and at least one nested structure is provided on the opposite sides of the first insulating sleeve and the second insulating sleeve.

[0012] Furthermore, the metal heat exchange shell is an annular shell, which is fitted onto the outer wall of the insulating sheath from one side and abuts against the limiting structure located on the other side of the insulating sheath.

[0013] Furthermore, the metal heat exchanger is a split structure, including a first metal heat exchanger corresponding to the first insulating sheath and a second metal heat exchanger corresponding to the second insulating sheath. The first metal heat exchanger shell and the second metal heat exchanger shell are assembled on the outside of the first insulating sleeve and the second insulating sleeve through a fitting structure. The fitting structure includes at least one of the following: a snap and a slot, a positioning post and a positioning groove, and a tenon and mortise structure.

[0014] Furthermore, a first limiting structure and a second limiting structure are respectively provided at both ends of the first insulating sleeve and the second insulating sleeve. The first metal heat exchange shell and the second metal heat exchange shell are sleeved on the outside of the first insulating sleeve and the second insulating sleeve, and their ends abut against the first limiting structure and the second limiting structure respectively to complete the positioning assembly.

[0015] Furthermore, the insulating and thermally conductive sheath structure also includes a sheet-like thermally conductive foil film, which is attached to the outer wall surface of the metal heat exchanger and is completely consistent with the shape of the metal heat exchanger.

[0016] Furthermore, the material of the metal heat spreader includes at least one of aluminum sheet, copper sheet, metal sheet or graphene thermal conductive material; the material of the sheet-like thermal conductive foil film includes at least one of copper sheet, aluminum sheet, metal sheet or graphene thermal conductive material.

[0017] Furthermore, the shapes of the first insulating sheath and the second insulating sheath are set according to the shape of the PCBA board, wherein the shape of the PCBA board includes at least one of rectangular, square or irregular shapes.

[0018] Unlike existing technologies, the insulating sheath and PCBA board assembly in this application maintain a safe insulating distance between them, effectively preventing high-voltage HI-POT withstand voltage test failure and ESD electrostatic discharge risks. The nested design of the metal heat spreader shell and the insulating sheath in this application constitutes a heat spreader structure, which is simple to assemble, has fewer production steps, and lower production costs.

[0019] The insulating sleeve of this application is manufactured using injection molding. The insulating shell can be prepared from materials with different thermal conductivity coefficients, making it suitable for adapters with different heat dissipation requirements. Furthermore, molds can be quickly customized according to different PCBA board shapes, achieving multi-variety adaptation without altering the overall structure, resulting in strong product applicability. Simultaneously, the one-piece injection-molded insulating sleeve has a smooth and dense surface, free of pinholes and cracks, fundamentally avoiding the micro-crack defects caused by cutting and bending of traditional insulating sheets. Moreover, the raw material cost is lower than the waste material loss from cutting insulating sheets.

[0020] On the other hand, this application significantly reduces the temperature rise of key components inside the power adapter and the surface of the outer casing by reusing the metal heat-equalizing shell and the sheet-like heat-conducting foil film, combined with the heat-equalizing and isolation function of the insulating sleeve. By effectively controlling the temperature rise of the outer casing, it greatly improves the user's comfort when holding the device, eliminates the risk of high-temperature burns, and meets safety requirements.

[0021] Based on the principles of thermal radiation and thermal conduction, the metal heat spreader shell and the sheet-like thermally conductive foil form an efficient heat diffusion network, making the internal heat distribution more uniform, avoiding the problem of local hot spots in traditional structures, and improving the overall product reliability.

[0022] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this application. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the first embodiment of the insulating and thermally conductive sheath structure of this application; Figure 2 yes Figure 1 Exploded view of the structure of the intermediate insulating and thermally conductive sheath; Figure 3 This is a schematic diagram of the structure of the second embodiment of the insulating and thermally conductive sheath structure of this application; Figure 4 yes Figure 3 Exploded view of the structure of the intermediate insulating and thermally conductive sheath; Figure 5 This is a schematic diagram of the third embodiment of the insulating and thermally conductive sheath structure of this application; Figure 6 yes Figure 5 Exploded view of the structure of the intermediate insulating and thermally conductive sheath; Figure 7 This is a schematic diagram of the fourth embodiment of the insulating and thermally conductive sheath structure of this application; Figure 8 yes Figure 7 Exploded view of the structure of the intermediate insulating and thermally conductive sheath; Figure 9 This is a schematic diagram of the fifth embodiment of the insulating and thermally conductive sheath structure of this application; Figure 10 This is a schematic diagram of the sixth embodiment of the insulating and thermally conductive sheath structure of this application; Figure 11 This is the temperature test simulation curve of the insulating and thermally conductive sheath structure of this application; Icon labels: 10-Insulating sleeve; 11-First insulating sleeve; 12-Second insulating sleeve; 13-Limiting structure; 131-Limiting structure; 132-Second limiting structure; 101-First elastic buckle; 102-Second elastic buckle; 103-Limiting groove; 104-First positioning post; 105-First positioning groove; 106-Second positioning post; 107-Second positioning groove; 20 - Metal vapor chamber; 21 - First metal vapor chamber; 22 - Second metal vapor chamber; 201 - First interlocking structure; 202 - Second interlocking structure; 30-Sheet-shaped thermally conductive foil film; 4-PCBA board; 41-First mating groove; 42-Second mating groove. Detailed Implementation

[0025] To enable those skilled in the art to better understand the technical solutions of this application, the insulating and thermally conductive sheath structure provided by this application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It is understood that the described embodiments are merely some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0026] The terms "first," "second," etc., used in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0027] Because existing small-sized power adapters generally use a heat dissipation solution that combines insulating sheets with metal heat sinks, there are problems such as poor mechanical structure adaptability, easy deformation and breakage, insulation performance degradation, significant safety risks, failure of ESD protection capability, and limited heat dissipation effect. It is difficult to simultaneously meet the insulation reliability, structural integrity and heat dissipation requirements of miniaturized adapters. Therefore, this application provides an insulating and thermally conductive sheath structure for small-sized power adapters. By using an injection-molded insulating shell combined with a metal heat spreader shell, the structure strength is guaranteed while achieving insulation isolation and heat dissipation functions.

[0028] The small-size power adapter of this application includes a PCBA board 4 and a housing. Optionally, the small-size power adapter can be a high-power-density PD power supply. The insulating and thermally conductive sheath structure of this application includes an insulating sheath 10 and a metal heat spreader 20. The insulating sheath 10 is arranged around the PCBA board 4 and assembled with the PCBA board 4 to form an insulating isolation. The metal heat spreader 20 is sleeved on the outer wall of the insulating sheath 10 and abuts against the inner wall of the housing. The metal heat spreader 20 and the insulating sheath 10 are combined to form a heat spreader structure, so as to achieve internal temperature uniformity and reduce the temperature rise of the housing.

[0029] Optionally, the insulating and thermally conductive sheath structure of this application can selectively connect the metal heat spreader shell 20 to the ground (primary ground or secondary ground) on the PCBA board 4 by welding or riveting, or connect it to the cold spot on the PCBA board 4, according to the EMI test (Electromagnetic Interference Testing) results, so as to further achieve the shielding effect.

[0030] In this application, the insulating sleeve 10 is integrally injection molded, which has a certain rigidity compared with the existing insulating sheet structure. This avoids the problem of micro-cracks and pinholes that are easy to occur at the edges and bends of thin insulating sheets. At the same time, it is not easy to deform after being assembled with PCBA board 4, and it is not easy to touch the circuit components set on PCBA board 4, thus avoiding short circuits, interference, poor heat dissipation, mechanical stability problems and safety risks.

[0031] Optionally, the outer surface of the insulating sleeve 10 of this application is provided with a limiting structure 13. When the metal heat exchanger shell 20 is sleeved on the outer wall of the insulating sleeve 10, at least one side of it abuts against the limiting structure 13 to realize the positioning and installation of the metal heat exchanger shell 20.

[0032] Specifically, the insulating sleeve 10 of this application includes a first insulating sleeve 11 and a second insulating sleeve 12. The first insulating sleeve 11 and the second insulating sleeve 12 cooperate to surround the perimeter of the PCBA board 4. The first insulating sleeve 11 and the second insulating sleeve 12 are fitted and fixed by a snap-fit ​​structure and assembled to form a ring structure, which has many advantages, including electrical safety, such as effectively isolating the electrical connection between the PCBA board 4 and external conductive components (such as metal casings, other circuit boards, etc.), preventing short circuits caused by accidental contact, or preventing electrical leakage between high-voltage or low-voltage circuits on the PCBA board 4 and external conductive components; electromagnetic compatibility, for example, can reduce the electrical leakage of the PCBA board. The electromagnetic signals inside board 4 can prevent interference from the external environment, while also preventing external electromagnetic signals from interfering with PCBA board 4, or reducing electromagnetic radiation generated by high-frequency signals and switching power supplies on PCBA board 4; mechanical protection, for example, can prevent external objects (such as tools, metal fragments, etc.) from directly contacting PCBA board 4, avoiding physical collisions and scratches, or can serve as a support material to help fix the position of PCBA board 4 inside the equipment, preventing PCBA board 4 from shifting due to vibration or impact; heat dissipation management, for example, can guide the heat generated by the circuit components on PCBA board 4 to the insulating sleeve 10, preventing heat from accumulating between PCBA board 4 and external components.

[0033] Optionally, the material of the metal heat spreader 20 of this application includes at least one of aluminum sheet, copper sheet, metal sheet or graphene thermal conductive material.

[0034] The metal heat spreader shell 20 and the insulating sleeve 10 of this application are combined to form a heat spreader structure, which can be adapted to PCBA boards 4 of different shapes. Specifically, the first insulating sleeve 11 and the second insulating sleeve 12 are injection molded parts, and their shapes can be set according to the shape of the PCBA board 4. The shape of the PCBA board 4 includes at least one of rectangular, square or irregular shapes (irregular shape, multi-cavity). Compared with the single structure of traditional heat spreaders, it has stronger applicability.

[0035] First Embodiment Please see Figure 1 and Figure 2 In this embodiment, the first insulating sleeve 11 and the second insulating sleeve 12 are disposed opposite to each other on the upper and lower sides of the PCBA board 4. The first insulating sleeve 11 and the second insulating sleeve 12 are respectively provided with a first elastic buckle 101 and a second elastic buckle 102 on the opposite side. The edge of the PCBA board 4 is provided with a first fitting groove 41 and a second fitting groove 42 at intervals. The first elastic buckle 101 is embedded in the first fitting groove 41 to fix the first insulating sleeve 11 and the PCBA board 4. The second elastic buckle 102 is embedded in the second fitting groove 42 to fix the second insulating sleeve 12 and the PCBA board 4. Among them, the first insulating sleeve 11 is provided with a limiting groove 103 on the same side as the first elastic buckle 101, and the first elastic buckle 101 is limited in the limiting groove 103 to realize the fixed connection between the first insulating sleeve 11 and the second insulating sleeve 12.

[0036] Optionally, in this embodiment, there are two first elastic buckles 101 and two second elastic buckles 102. The two first elastic buckles 101 are disposed at both ends of the first insulating sleeve 11 and are arranged diagonally. The two second elastic buckles 102 are disposed at both ends of the second insulating sleeve 12 and are arranged diagonally.

[0037] In this embodiment, the metal heat exchange shell 20 is an annular shell that is fitted onto the outer wall of the insulating sleeve 10 from one side and abuts against the limiting structure 13 provided on the other side of the insulating sleeve 10.

[0038] Second Embodiment Please see Figure 3 and Figure 4 Unlike the first embodiment, the metal heat exchanger shell 20 in this embodiment is a split structure, including a first metal heat exchanger shell 21 corresponding to the first insulating sleeve 11 and a second metal heat exchanger shell 22 corresponding to the second insulating sleeve 12. Specifically, the first metal heat exchanger shell 21 and the second metal heat exchanger shell 22 are nested one above the other.

[0039] The first metal heat exchanger shell 21 and the second metal heat exchanger shell 22 are respectively provided on opposite sides of each other by a first fitting structure 201 and a second fitting structure 202. The first fitting structure 201 and the second fitting structure 202 are nested together to achieve a fixed connection. The first fitting structure 201 and the second fitting structure 202 include at least one of the following: a buckle and a slot, a positioning post and a positioning groove, and a tenon and mortise structure.

[0040] Specifically, in this embodiment, the first fitting structure 201 and the second fitting structure 202 are slots and buckles, and the number of the first fitting structure 201 and the second fitting structure 202 are four. The four buckles are divided into two groups and disposed at both ends of the second metal heat spreader 22, and the buckles in the same group are spaced apart. The four slots are divided into two groups and disposed at both ends of the first metal heat spreader 21, and the slots in the same group are spaced apart.

[0041] Third Embodiment Please see Figure 5 and Figure 6 In this embodiment, the first insulating sleeve 11 and the second insulating sleeve 12 are disposed opposite to each other on the left and right sides of the PCBA board 4. The first insulating sleeve 11 and the second insulating sleeve 12 are respectively provided with a first positioning post 104 and a first positioning groove 105 on the opposite side. The first positioning post 104 and the first positioning groove 105 are inserted into each other to fix the first insulating sleeve 11 and the second insulating sleeve 12. The two sets of first positioning posts 104 and first positioning grooves 105 are respectively located on the upper and lower sides of the PCBA board 4.

[0042] Optionally, each set of first positioning posts 104 and first positioning grooves 105 includes two spaced-apart first positioning posts 104 and two spaced-apart first positioning grooves 105.

[0043] Unlike the second embodiment, in this embodiment, the first metal heat exchanger shell 21 and the second metal heat exchanger shell 22 are nested together. In this embodiment, the limiting structures 13 are located at the left and right ends of the insulating sleeve 10, namely, the first limiting structure 131 and the second limiting structure 132 located at the ends of the first insulating sleeve 11 and the second insulating sleeve 12, respectively. When the first metal heat exchanger shell 21 and the second metal heat exchanger shell 22 are nested around the outer periphery of the insulating sleeve 10, the ends of the first metal heat exchanger shell 21 and the second metal heat exchanger shell 22 respectively abut against the limiting structures 13 on both sides, that is, their ends abut against the first limiting structure 131 and the second limiting structure 132 respectively, to complete the positioning assembly, and the metal heat exchanger shell 20 and the insulating sleeve 10 are fixedly connected.

[0044] Fourth embodiment Please see Figure 7 and Figure 8 In this embodiment, the first insulating sleeve 11 and the second insulating sleeve 12 are disposed opposite to each other on the front and rear sides of the PCBA board 4. The first insulating sleeve 11 and the second insulating sleeve 12 are respectively provided with a second positioning post 106 and a second positioning groove 107 on the opposite side. The second positioning post 106 and the second positioning groove 107 are inserted into each other to fix the first insulating sleeve 11 and the second insulating sleeve 12. The two sets of second positioning posts 106 and second positioning grooves 107 are respectively located on the upper and lower sides of the PCBA board 4.

[0045] Optionally, each set of first positioning posts 104 and first positioning grooves 105 includes two spaced-apart first positioning posts 104 and two spaced-apart first positioning grooves 105.

[0046] Unlike the second and third embodiments, the first fitting structure 201 and the second fitting structure 202 in this embodiment are interference fit structures. The first fitting structure 201 is arranged around the edge of the first metal heat exchanger shell 21, and the second fitting structure 202 is arranged around the edge of the second metal heat exchanger shell 22.

[0047] Fifth Embodiment Please see Figure 9 The insulating and thermally conductive sheath structure of this embodiment also includes a sheet-like thermally conductive foil 30, which is attached to the outer wall surface of the metal heat spreader 20 and has a shape completely consistent with the metal heat spreader 20. Specifically, the sheet-like thermally conductive foil 30 can be attached to the outer wall surface of the metal heat spreader 20 as in any of the above embodiments, and the attachment can be achieved by methods such as hot pressing, adhesive bonding, pressure application, vacuum adsorption, or electrostatic adsorption.

[0048] Optionally, the material of the sheet-like thermally conductive foil 30 of this application includes at least one of copper sheet, aluminum sheet, metal sheet or graphene thermally conductive material.

[0049] Sixth Embodiment Please see Figure 10 In this embodiment, a notch is formed at the lower left corner of the PCBA board 4. The insulating sleeve 10 and the metal heat spreader 20 are modified accordingly to adapt to the shape of the PCBA board 4. The assembly structure and assembly method of the insulating sleeve 10 and the metal heat spreader 20 can be any of the structures and methods described in the above embodiments, and are not limited here.

[0050] Optionally, the insulating and thermally conductive sheath structure of this application can be adjusted according to the product temperature by adding or removing all or part of the structure of the metal heat spreader shell 20 or the sheet-like thermally conductive foil 30 to meet the temperature performance requirements.

[0051] Based on the Stefan Boltzmann law, this application can calculate the heat transferred by thermal radiation per unit time, and its basic formula is shown in formula (1): (1) in, It represents the amount of heat transferred through radiation per unit time, measured in W. Emissivity is the ability of an object to radiate energy. Here is the Stefan Boltzmann constant, which has a value of approximately 5.67 × 10⁻⁶. -8 W / m 2 ·K 4 ; The radiation area is expressed in meters (m²). 2 ; and These are the surface temperature of the object and the ambient temperature, respectively.

[0052] The insulating sheath 10 of this application is arranged around the printed circuit board 31. By increasing the area for receiving thermal radiation, the insulating sheath 10 can radiate and transfer the received heat per unit time.

[0053] Meanwhile, the thermal conductivity value can be calculated according to Fourier's law. Thermal conductivity is the transfer of heat through direct contact, and its basic formula is shown in formula (2): (2) in, It is the thermal conductivity of the material. It is the contact area. It's a temperature difference. It refers to the thickness of the material. It is the heat transfer time.

[0054] While keeping other parameter values ​​unchanged, this application can increase the amount of heat transferred per unit heat transfer time by increasing the contact area between the metal heat spreader 20, the insulating sheath 10 and the outer shell, thereby improving the heat uniformity and heat dissipation effect.

[0055] The temperature test results of the insulating and thermally conductive sheath structure of this application are shown in Table 1. The temperature of the outer shell of the power adapter of this application (including the six sides of the top, bottom, front, back, left and right) has dropped significantly. At the same time, the temperature of the internal components of the power adapter of this application (including transformer, capacitor, bridge rectifier and IC) has also dropped significantly.

[0056] Table 1 The temperature test simulation data for the insulating and thermally conductive sheath structure of this application are shown in Table 2, and the simulation curves are shown in Table 3. Figure 11 As shown.

[0057] Table 2 in, Figure 11 The curves S1-S10 in the figure correspond to S1 bridge rectifier - old, S2 IC - old, S3 IC - new, S4 bridge rectifier - new, S5 capacitor - old, S6 transformer - old, S7 transformer - new, S8 capacitor - new, S9 casing - old, and S10 casing - new, respectively.

[0058] Combined with Table 2 Figure 11It can be seen that, compared with the old model, the temperature of the power adapter of the new model is significantly lower, both in terms of the outer shell and the internal circuit components. Moreover, the temperature difference between the two gradually increases over time, which clearly shows that the insulating and heat-conducting sheath structure of this application effectively improves the heat dissipation effect of the power adapter.

[0059] This application presents a small-sized power adapter equipped with an insulating and thermally conductive sheath structure, namely a high-power-density PD power supply. It has better and safer insulation performance, extremely low temperature rise and good perceived temperature. It has a simple structure, is easy to manufacture, has lower cost, smaller size and is easy to carry, providing users with lower costs and a better user experience.

[0060] The above are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An insulating and thermally conductive sheath structure for a small-sized power adapter, the small-sized power adapter comprising a PCBA board and a housing, characterized in that, The insulating thermally conductive sheath structure includes an insulating sheath and a metal heat spreader shell. The insulating sheath is arranged around the perimeter of the PCBA board and assembled with the PCBA board to form an insulating isolation. The metal heat spreader shell is fitted onto the outer wall of the insulating sheath and abuts against the inner wall of the outer shell. The metal heat spreader shell and the insulating sheath are combined to form a heat spreader cover structure to achieve internal temperature uniformity and reduce the temperature rise of the outer shell. The insulating sheath is integrally injection molded.

2. The insulating and thermally conductive sheath structure according to claim 1, characterized in that, The outer surface of the insulating sheath is provided with a limiting structure, and at least one end of the metal heat-equalizing shell is abutted against the limiting structure.

3. The insulating and thermally conductive sheath structure according to claim 1, characterized in that, The insulating sleeve includes a first insulating sleeve and a second insulating sleeve. The first insulating sleeve and the second insulating sleeve are arranged around the perimeter of the PCBA board, and the first insulating sleeve and the second insulating sleeve are fitted and fixed by a snap-fit ​​structure and assembled to form a ring structure.

4. The insulating and thermally conductive sheath structure according to claim 3, characterized in that, The first insulating sleeve and the second insulating sleeve are disposed opposite to each other on the top, bottom, left, right or front and back sides of the PCBA board, and at least one nested structure is provided on the opposite sides of the first insulating sleeve and the second insulating sleeve.

5. The insulating and thermally conductive sheath structure according to claim 3, characterized in that, The metal heat exchange shell is an annular shell that is fitted onto the outer wall of the insulating sheath from one side and abuts against a limiting structure located on the other side of the insulating sheath.

6. The insulating and thermally conductive sheath structure according to claim 3, characterized in that, The metal heat exchanger shell is a split structure, including a first metal heat exchanger shell corresponding to the first insulating sheath and a second metal heat exchanger shell corresponding to the second insulating sheath. The first metal heat exchanger shell and the second metal heat exchanger shell are assembled on the outside of the first insulating sleeve and the second insulating sleeve through a fitting structure. The fitting structure includes at least one of the following: a snap and a slot, a positioning post and a positioning groove, and a tenon and mortise structure.

7. The insulating and thermally conductive sheath structure according to claim 6, characterized in that, The first insulating sleeve and the second insulating sleeve are respectively provided with a first limiting structure and a second limiting structure at their two ends. The first metal heat spreader and the second metal heat spreader are sleeved on the outside of the first insulating sleeve and the second insulating sleeve, and their two ends respectively abut against the first limiting structure and the second limiting structure to complete the positioning assembly.

8. The insulating and thermally conductive sheath structure according to claim 1, characterized in that, The insulating and thermally conductive sheath structure also includes a sheet-like thermally conductive foil film, which is attached to the outer wall surface of the metal heat exchanger shell and has a shape that is completely consistent with that of the metal heat exchanger shell.

9. The insulating and thermally conductive sheath structure according to claim 8, characterized in that, The material of the metal heat spreader shell includes at least one of aluminum sheet, copper sheet, metal sheet or graphene thermal conductive material; the material of the sheet-like thermal conductive foil film includes at least one of copper sheet, aluminum sheet, metal sheet or graphene thermal conductive material.

10. The insulating and thermally conductive sheath structure according to claim 3, characterized in that, The shapes of the first insulating sheath and the second insulating sheath are set according to the shape of the PCBA board, wherein the shape of the PCBA board includes at least one of rectangular, square or irregular shapes.

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