Liquid cooling heat dissipation device and terminal equipment

Abstract

The invention discloses a liquid cooling heat dissipation device and terminal equipment, the liquid cooling heat dissipation device is provided with an NFC power receiving module and a liquid cooling module, the terminal equipment is provided with an NFC power supply module, a sensing module and an adjusting circuit, the liquid cooling heat dissipation device is used for being fixed to the back face of the terminal equipment, and the terminal equipment senses the existence of the liquid cooling heat dissipation device through the sensing module, and sends the liquid cooling heat dissipation device to the NFC power receiving module. The liquid cooling heat dissipation device can supply power to the liquid cooling mode through the NFC power supply module and can supply electric energy to the NFC power receiving module through the NFC power supply module, when the terminal equipment needs the liquid cooling module to assist in heat dissipation, the liquid cooling heat dissipation device supplies power to the liquid cooling mode through the NFC power receiving module so as to start the liquid cooling heat dissipation function, and when the terminal equipment needs to normally use the NFC function, due to the influence of a power receiving coil of the NFC power receiving module, the liquid cooling heat dissipation function can be started. The terminal equipment adjusts the radio frequency resonant frequency point of the NFC power supply module through the adjusting circuit, so that the NFC function can be normally used; by means of the mode, the liquid cooling heat dissipation function is achieved through NFC power supply, and the problem that normal use of the NFC function is affected by a power receiving coil of NFC is avoided.

Description

Technical Field

[0001] This application relates to the field of mobile phone case application technology, and in particular to a liquid cooling heat dissipation device and terminal equipment. Background Technology

[0002] As processor computing performance improves, the power consumption of mobile terminal SOCs (System on Chip) is also increasing. Especially in scenarios such as AI computing, high-definition photography, and large-scale games, mobile terminals generate significant heat. Currently, the various passive cooling measures built into mobile terminals cannot meet the heat dissipation requirements of SOC performance release.

[0003] Related technologies use liquid-cooled heat dissipation protective shells or liquid-cooled heat dissipation back clips to provide active heat dissipation for mobile terminals. However, the internal components such as micro-pumps and drive circuits need to be powered by the Qi wireless charging technology of the mobile terminal. However, some terminal devices are not equipped with Qi wireless charging technology and do not support the above-mentioned liquid-cooled heat dissipation protective shells or liquid-cooled heat dissipation back clips. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0005] This application provides a liquid cooling heat dissipation device and a terminal device, which enables the terminal device to support liquid cooling heat dissipation function through near field communication technology.

[0006] In a first aspect, embodiments of this application provide a liquid cooling heat dissipation device, including: The housing is used to secure it to the back of the terminal device; An NFC power receiving module is disposed in the housing, and the NFC power receiving module corresponds to the NFC power supply module of the terminal device; A liquid cooling module is disposed in the housing and is connected to the NFC power receiving module to provide liquid cooling heat dissipation for the terminal device.

[0007] Secondly, embodiments of this application also provide a terminal device, including: The NFC power supply module corresponds to the NFC power receiving module in the liquid cooling heat dissipation device fixed on the back of the terminal device; A sensing module is used to sense the presence of the liquid cooling heat dissipation device; Adjust the circuit and connect it to the NFC power supply module; The processor is configured to control the adjustment circuit to adjust the radio frequency resonant frequency of the NFC power supply module based on the sensing results of the sensing module.

[0008] The liquid cooling heat dissipation device and terminal device provided in this application embodiment are as follows: the liquid cooling heat dissipation device is equipped with an NFC power receiving module and a liquid cooling module, and the terminal device is equipped with an NFC power supply module, a sensing module, and an adjustment circuit. The liquid cooling heat dissipation device is fixed to the back of the terminal device. The terminal device senses the presence of the liquid cooling heat dissipation device through the sensing module and can provide power to the NFC power receiving module through the NFC power supply module. When the terminal device needs the liquid cooling module to assist in heat dissipation, the liquid cooling heat dissipation device uses the NFC power receiving module to power the liquid cooling mode to activate the liquid cooling heat dissipation function. In this way, the liquid cooling heat dissipation function is realized by using NFC power supply, which can solve the problem that some terminal devices cannot use liquid cooling heat dissipation protective cases or liquid cooling heat dissipation back clips because they are not equipped with Qi wireless charging technology.

[0009] Other features and advantages of this application will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the application. The objectives and other advantages of this application may be realized and obtained by means of the structures particularly pointed out in the description, claims and drawings. Attached Figure Description

[0010] The accompanying drawings are used to provide a further understanding of the technical solutions of this application and form part of the specification. They are used together with the examples of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application.

[0011] Figure 1 This is a schematic diagram of the module connection of a liquid cooling heat dissipation device provided in one embodiment of this application; Figure 2 This is a circuit diagram of a liquid cooling heat dissipation device provided in one embodiment of this application; Figure 3 This is a schematic diagram of a pump body connection module provided in one embodiment of this application; Figure 4 This is a schematic diagram of the module connection of a terminal device provided in one embodiment of this application; Figure 5 This is a schematic diagram of the module connection of a terminal device provided in one embodiment of this application; Figure 6 This is a circuit diagram of an adjustment circuit and a matching circuit provided in one embodiment of this application; Figure 7 This is another circuit diagram of the adjustment circuit and matching circuit provided in one embodiment of this application; Figure 8 This is another circuit diagram of the adjustment circuit and matching circuit provided in one embodiment of this application; Figure 9 This is a flowchart of a terminal device performing identification and configuration of a liquid cooling heat dissipation device according to an embodiment of this application. Detailed Implementation

[0012] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various implementations. Simultaneously, the steps or actions described in the method description can be rearranged or adjusted in a manner readily apparent to those skilled in the art. Therefore, the various orders in the specification and drawings are merely for the clear description of a particular embodiment and do not imply a mandatory order, unless otherwise stated that a particular order must be followed.

[0013] In the description of this application, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0014] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0015] With the continuous improvement of mobile phone processor computing performance, the power consumption of processors is also increasing proportionally. Especially in scenarios such as AI operation, high-definition photography, and large-scale games, the mobile phone SOC (System on Chip) releases a lot of heat, which can cause the AP / GPU (Application Processor / Graphics Processing Unit) and other modules of the mobile phone SOC to be frequency-limited due to overheating. Although mobile phones have built-in various passive cooling measures, they still cannot meet the heat dissipation requirements for the SOC to release performance. Currently, the mainstream liquid cooling back clips or liquid cooling protective cases adopt Qi wireless charging technology (a common power supply technology in the industry), but this technology can only be configured in high-end flagship models. Mid-range and low-end models do not support the above wireless charging technology due to cost limitations. At present, there are also methods in the industry to power liquid cooling back clips or protective cases through physical interface connections, but due to the structural limitations of the interface, it affects the size of the mobile phone and causes inconvenience in use. It is understood that the terminal device mentioned in this application can be various devices with high integration and concentrated heat generation of their own SOC, such as mobile phones and tablets. For ease of explanation, the following embodiments use mobile phones as an example to represent terminal devices.

[0016] Based on this, this application provides a liquid cooling heat dissipation device and a terminal device. The liquid cooling heat dissipation device is equipped with an NFC receiving module and a liquid cooling module, and the terminal device is equipped with an NFC power supply module, a sensing module, and an adjustment circuit. The liquid cooling heat dissipation device is fixed to the back of the terminal device. The terminal device senses the presence of the liquid cooling heat dissipation device through the sensing module and can provide power to the NFC receiving module through the NFC power supply module. When the terminal device needs the liquid cooling module to assist in heat dissipation, the liquid cooling heat dissipation device uses the NFC receiving module to supply power to the liquid cooling mode to enable the liquid cooling heat dissipation function. When the terminal device needs to use the NFC function normally, due to the influence of the receiving coil of the NFC receiving module, the terminal device adjusts the radio frequency resonant frequency point of the NFC power supply module through the adjustment circuit to enable the NFC function to work normally. In the above way, the liquid cooling heat dissipation function is realized by using NFC power supply and the problem of the NFC receiving coil affecting the normal use of the NFC function is avoided.

[0017] The liquid cooling heat dissipation device and terminal equipment provided in this application will be described in detail below with reference to the accompanying drawings.

[0018] Reference Figure 1 As shown, Figure 1 This is a schematic diagram of the structural connections of a liquid cooling system. The liquid cooling system includes: The housing is used to secure it to the back of the terminal device; An NFC power receiving module is disposed in the housing, and the NFC power receiving module corresponds to the NFC power supply module of the terminal device; A liquid cooling module is disposed in the housing and is connected to the NFC power receiving module to provide liquid cooling heat dissipation for the terminal device.

[0019] Due to differences in shell structure, the way the shell is fixed to the back of the terminal device varies. For example, the shell can be in the form of a mobile phone protective case, with a first accommodating cavity formed inside the protective case to fix the terminal device. The NFC receiving module and the liquid cooling module are disposed in the first accommodating cavity, and the protective case itself is fixed to the terminal device by a side fastening structure so that the liquid cooling module inside the shell can fit against the back of the terminal device. Alternatively, the shell can be a clamping mechanism such as a back clip, which is used to fix the back of the terminal device. The clamping mechanism has a second accommodating cavity for accommodating the NFC receiving module and the liquid cooling module, and the liquid cooling module can fit against the back of the terminal device through the second accommodating cavity.

[0020] The NFC receiving module is used to pair with the NFC power supply module of the terminal device to receive power from the NFC power supply module. The NFC power supply module of the terminal device is actually the module that performs NFC functions. This module uses NFC technology and can operate in transmit mode (also known as reader mode) to provide power to the outside world. The NFC receiving module of the liquid cooling device converts the power received from the NFC power supply module into power for the liquid cooling module, driving the liquid cooling module to operate and providing auxiliary heat dissipation for the terminal device.

[0021] In some embodiments, the NFC receiving module includes a receiving coil, a power supply circuit, and an NFC tag. The receiving coil corresponds to the power supply coil of the NFC power supply module. One end of the power supply circuit is connected to the receiving coil to draw power, and the other end is connected to the NFC tag and the liquid cooling module to provide power. The NFC tag is connected to the liquid cooling module to output a drive control signal.

[0022] Reference Figure 1 The module location distribution shown and Figure 2 The circuit diagram shown is for the NFC power receiving module. The power receiving coil is located in the upper right corner of the housing (the specific location corresponds to the position of the power supply coil in the NFC power supply module of the matching terminal device). Figure 1 (The location of the receiving coil is only one example.) The receiving coil performs voltage conversion through a power supply circuit, providing corresponding voltages to the NFC tag and the liquid cooling module. Specifically, the receiving coil can obtain electrical energy from the power supply coil in the terminal device through electromagnetic induction. The NFC tag has at least two functions: storing an encryption key and providing a drive signal to the liquid cooling module. The encryption key is used by the terminal device to read and decrypt, determining whether the liquid cooling device is compatible with the terminal device. In actual use, after the terminal device senses the liquid cooling device, it reads the encryption key in the NFC tag using NFC technology, and then decrypts the encryption key through a predetermined decryption process to determine whether the liquid cooling device is compatible with the terminal device, such as determining whether the liquid cooling device is a liquid cooling protective case for a mobile phone model.

[0023] In some embodiments, the power supply circuit includes a rectifier circuit, a first protection circuit, a second protection circuit, and a DC-DC circuit. The input terminal of the rectifier circuit is connected to the power receiving coil, and the output terminal of the rectifier circuit is connected to the input terminal of the DC-DC circuit through the first and second protection circuits. The output terminal of the DC-DC circuit is connected to the NFC tag and the liquid cooling module.

[0024] The NFC power receiving module's receiving coil is connected to the input of the rectifier circuit. The rectifier circuit rectifies the voltage provided by the receiving coil and outputs the rectified voltage to the DC-DC circuit. The DC-DC circuit converts the DC voltage to the corresponding operating voltage. A first protection circuit and a second protection circuit are installed between the rectifier circuit and the DC-DC circuit. These two circuits provide dual overvoltage and overcurrent protection to ensure the reliable and stable operation of the liquid cooling device's power supply. Specifically, dual overvoltage and overcurrent protection is implemented.

[0025] Specifically, the receiving coil outputs two lines, AC1 and AC2, through tuning capacitors C1, C2, and C3. AC1 and AC2 are connected to the input of the rectifier circuit, which consists of four Schottky diodes VD1, VD2, VD3, and VD4. AC1 is connected between VD1 and VD2, and AC2 is connected between VD3 and VD4. The output between VD1 and VD4 is grounded, and the output voltage between VD2 and VD3 is VEC_TECT. The DC-DC circuit is connected to the VEC_TECT node, and after voltage conversion, outputs VCC_OUT to the NFC tag and liquid cooling module. The voltage conversion of the D-DC circuit is implemented by a DC-DC chip with a wide input voltage range. The DC-DC chip has a wide power supply voltage input range to adapt to input voltage fluctuations and perform step-down output, which can effectively solve the voltage fluctuation of the VEC_TECT node during load changes and reduce the impact on the input voltage of the pump in the liquid cooling module. Additionally, the NFC tag is connected to VCC_OUT via a low dropout linear regulator (LDO). This means that the output VCC_OUT is regulated by the LDO before supplying the operating voltage to the NFC tag. Figure 3 As shown, the NFC tag includes two output control pins. One pin outputs the DC-DC_EN signal, and the other pin outputs the Micro Pump_Control signal. The DC-DC_EN signal is sent to the DC-DC chip for enable control, and the Micro Pump_Control signal is sent to the pump body of the liquid cooling module for drive control.

[0026] In some embodiments, the first protection circuit includes a first capacitor and a first Zener diode, the output terminal of the rectifier circuit is grounded through the first capacitor, and the output terminal of the rectifier circuit is grounded through the first Zener diode.

[0027] The first protection circuit provides protection through a first capacitor and a first Zener diode. At the VEC_RECT node, the first capacitor performs energy storage and filtering to store the charge output from the rectifier circuit and smooth voltage fluctuations, ensuring a stable DC output voltage. At the VEC_RECT node, the first Zener diode also stabilizes the voltage filtered by the first capacitor. If this voltage fluctuation exceeds the breakdown voltage of the first Zener diode (typically equal to the maximum operating voltage of the subsequent circuit), the first Zener diode quickly conducts, releasing the charge to ground, thus protecting the subsequent circuit and providing overvoltage protection.

[0028] In some embodiments, the second protection circuit includes a comparator and a protection switch. One input of the comparator is connected to the output of the rectifier circuit, and the other input is connected to a reference voltage source. The output of the comparator is connected to the control terminal of the protection switch, and the output of the rectifier circuit is grounded through the protection switch.

[0029] The second protection circuit mainly uses a comparator to implement overvoltage protection. One input of the comparator is connected to the VEC_RECT node, and the other input is connected to the reference voltage source Vref. When the voltage of the VEC_RECT node (or the voltage after the first protection circuit) exceeds the reference voltage source Vref, the comparator outputs a high level. This high level is applied to the control terminal of the protection switch through resistor R4, which controls the protection switch to turn on and discharges the current of the VEC_RECT node to ground.

[0030] In addition, the second protection circuit also includes a second Zener diode, and the output of the comparator is grounded through the second Zener diode. The second Zener diode is connected to the junction of resistor R4 and the control terminal of the protection switch. When the voltage at this junction is higher than the breakdown voltage of the second Zener diode, the second Zener diode quickly conducts to release the charge to ground, thereby providing protection.

[0031] In some embodiments, the liquid cooling module includes a pump body, a driver chip, and a liquid cooling channel. The pump body is connected to the liquid cooling channel, the driver chip is connected to the NFC power receiving module to obtain the operating voltage, and the driver chip is connected to the pump body to output a drive signal.

[0032] Reference Figure 1 The schematic diagram shows that the pump body is connected to the liquid cooling channel to drive the coolant circulation in the liquid cooling channel. The driver chip matches the pump body, obtains the working voltage from the NFC power receiving module, and receives the Micro Pump_Control signal from the NFC tag. The driver chip converts the Micro Pump_Control signal into a drive signal for the pump body and adjusts the operation of the pump body. For example, the power output of the pump body is increased when the temperature is high to speed up the circulation of the coolant, and the power output of the pump body is stopped when the liquid cooling auxiliary heat dissipation is not needed, etc.

[0033] In some embodiments, the liquid cooling device further includes a magnetic component, which corresponds to the sensing module of the terminal device. The sensing module is used to determine the presence of the liquid cooling device by sensing the magnetic component. The location of the magnetic component corresponds to the location of the sensing module of the terminal device. Figure 1 The location of the magnetic component is only one example of its possible positions.

[0034] Reference Figure 5 As shown, Figure 5 This is a structural connection diagram of the terminal equipment. The terminal equipment includes: The NFC power supply module corresponds to the NFC power receiving module in the liquid cooling heat dissipation device fixed on the back of the terminal device; The sensing module is used to detect the presence of the liquid cooling heat dissipation device. Adjust the circuit and connect it to the NFC power supply module; The processor is used to control the adjustment circuit to adjust the radio frequency resonant frequency of the NFC power supply module based on the sensing results of the sensing module.

[0035] Reference Figure 6 The diagram shows the connection of the terminal device modules. The terminal device has a module that performs NFC functions. This module uses NFC technology and can operate in transmit mode (also known as reader mode), providing power to the outside world. In this mode, the module acts as an NFC power supply module, supplying power to the NFC receiving module in the liquid cooling device in the above embodiment. The sensing module is used to detect the presence of the liquid cooling device. For example, if the liquid cooling device has magnetic components, the sensing module can be a Hall sensor. Based on the Hall effect, it senses the magnetic components and sends a sensing signal to the processor. The processor then knows that the liquid cooling device is fixed to the back of the terminal device and controls whether the NFC power supply module supplies power to the liquid cooling device for auxiliary heat dissipation based on the heat dissipation status of the terminal device. Understandably, in some cases, the NFC power receiving module in the liquid cooling device starts the pump when it receives power. The terminal device can control whether the NFC power receiving module supplies power to the outside to indirectly control the start and stop of the pump. In other cases, the terminal device can also default to the NFC power receiving module being in the mode of supplying power to the outside after detecting the liquid cooling device. The liquid cooling device then determines whether to receive power through the NFC power receiving module and start the pump based on the temperature of the terminal device.

[0036] In some embodiments, the NFC power supply module includes a power supply coil and a matching circuit, with the processor connected to the power supply coil via the matching circuit. The power supply coil serves as the RF antenna for the NFC function, and the matching circuit forms the basic RF circuit for the NFC RF antenna. When the liquid cooling device is not fixed to the back of the terminal device, the NFC function adjusts the RF resonant frequency to the range of 13.56MHz ± 0.1MHz via the matching circuit. However, when the liquid cooling device is fixed to the back of the terminal device, the proximity of the receiving coil to the power supply coil affects the RF resonant frequency during normal NFC operation. To avoid affecting the normal operation of the NFC function, the RF resonant frequency is adjusted to the range of 13.56MHz ± 0.1MHz via the adjustment circuit, thereby achieving dynamic adjustment of the NFC antenna matching parameters and balancing the auxiliary heat dissipation function of the liquid cooling device with normal NFC functionality.

[0037] In some embodiments, the adjustment circuit includes a switching module, one end of which is connected to a matching circuit and the other end is grounded. The control terminal of the switching module is connected to a processor for controlled switching. The switching module includes at least one of an electronically controlled switching transistor, a tuning switch, and an adjustable capacitor.

[0038] Reference Figures 6-8 The diagram illustrates several implementations of the matching circuit and adjustment circuit. In these implementations, the switching module of the adjustment circuit is used to control the grounding and floating states of the matching circuit at some nodes. For example, in... Figure 6 In this circuit, the matching circuit is grounded through four electronically controlled switches D11, D12, D13, and D14. Each of these switches has a capacitor C17, C18, C19, and C20 connected in series. By controlling the switches D11, D12, D13, and D14 to be in the ON state, the processor can switch capacitors C17, C18, C19, and C20 from floating to ground, thus connecting these capacitors in parallel with the matching circuit. This adjusts the frequency point of the influence of the energized coil on the power supply coil within the liquid cooling device to the expected 13.56MHz ± 0.1MHz. For example, in... Figure 7 In this circuit, the matching circuit is grounded through tuning switches D15 and D16. Capacitors C19 and C20 are connected in series to the two grounding terminals of tuning switch D15, and capacitors C21 and C22 are connected in series to the two grounding terminals of tuning switch D16. The processor controls the on / off state of tuning switches D15 and D16 to dynamically adjust the matching parameters of the power supply coil antenna. For example, in... Figure 8 In this circuit, the matching circuit is grounded through an adjustable capacitor, and the processor dynamically adjusts the matching parameters of the power supply coil antenna by controlling the change in the capacitance value of the adjustable capacitor.

[0039] In some embodiments, the processor controls the adjustment circuit to adjust the radio frequency resonant frequency point of the NFC power supply module based on the sensing result of the sensing module, including: In response to the sensing module detecting the presence of the liquid cooling heat dissipation device, the encryption key of the NFC tag in the NFC receiving module is read and decrypted; Once the liquid cooling device is confirmed to be compatible with the terminal device, a first adjustment signal is sent to the adjustment circuit to set the radio frequency resonant frequency point of the NFC power supply module, so as to supply power to the NFC receiving module through the NFC power supply module.

[0040] As described in the foregoing embodiments, the liquid cooling device includes a magnetic component. The sensing module detects the magnetic component through methods such as the Hall effect, allowing the processor to determine the presence of the liquid cooling device (e.g., fixed to the back of the terminal device). Subsequently, the processor reads the encryption key of the NFC tag in the NFC receiving module via the NFC power supply module, and then decrypts the encryption key through a predetermined decryption process. This determines whether the liquid cooling device is compatible with the terminal device, for example, whether it is a liquid cooling protective case for a mobile phone matching the terminal device's model. If the liquid cooling device is determined to be compatible with the terminal device's model, the RF resonant frequency of the NFC power supply module can be adjusted by setting the circuit, allowing the power supply coil of the NFC power supply module to provide power to the receiving coil.

[0041] In some embodiments, power is supplied to the NFC receiving module via the NFC power supply module, specifically including: In response to entering the target scenario, the reader mode of the NFC power supply module is continuously activated to supply power to the NFC power receiving module; wherein, the target scenario includes at least one of the following: the temperature monitoring value of the terminal device is greater than the temperature threshold, the target application is running, the target hardware is running, and the target charging mode is running.

[0042] When the temperature reading on the terminal device exceeds the temperature threshold, it indicates that liquid cooling is required to assist in heat dissipation. In this case, the NFC power supply module's reader mode remains continuously activated, and the power supply coil continuously supplies power to the external circuitry, enabling the NFC receiving module to obtain power to drive the pump. Alternatively, when running target applications (such as high-definition camera applications, large games, or applications requiring high-definition encoding and decoding), the NFC power supply module's reader mode is activated by default, ensuring the power supply coil continuously supplies power to the external circuitry, thus enabling the NFC receiving module to obtain power to drive the pump. Or, when running target hardware (such as high-performance processors or high-power graphics processors), the NFC power supply module's reader mode is activated by default, ensuring the power supply coil continuously supplies power to the external circuitry, thus enabling the NFC receiving module to obtain power to drive the pump. During operation, these hardware components generate a significant amount of heat. Therefore, the NFC power supply module's reader mode is also enabled by default to ensure continuous power supply to the power coil. This allows the NFC receiving module to stably obtain power to drive the pump, accelerating coolant circulation and improving heat dissipation efficiency. Alternatively, when running a target charging mode, such as fast charging, the terminal device itself generates considerable heat. To prevent heat buildup from affecting charging efficiency and device performance, the NFC power supply module's reader mode is also continuously enabled, allowing the NFC receiving module to continuously obtain power to drive the pump, assisting in heat dissipation and ensuring stable operation of the device during charging.

[0043] In some embodiments, the processor is further configured to: in response to exiting the target scene and / or detecting that the NFC function is enabled, send a second adjustment signal to the adjustment circuit to set the radio frequency resonant frequency point of the NFC power supply module.

[0044] When exiting the aforementioned target scenario, if it is determined that the liquid cooling device is not needed to assist in heat dissipation of the terminal device, then power supply to the NFC receiving module via the NFC power supply module is stopped. At this time, the terminal device can switch to a state where the NFC function can be used normally, i.e., by adjusting the radio frequency resonant frequency point of the NFC power supply module through the circuit. When the user manually enables the NFC function or the terminal device determines that the NFC function needs to be enabled, the auxiliary function of the liquid cooling device needs to be disabled, and power supply to the NFC receiving module via the NFC power supply module is stopped. At this time, the terminal device can switch to a state where the NFC function can be used normally, i.e., by adjusting the radio frequency resonant frequency point of the NFC power supply module through the circuit. When the presence of the liquid cooling device is not detected (e.g., the sensing module detects that the liquid cooling device is not present), the terminal device can switch to a state where the NFC function can be used normally, i.e., by adjusting the radio frequency resonant frequency point of the NFC power supply module through the circuit.

[0045] In summary, the liquid cooling device includes an NFC power receiving module and a liquid cooling module, while the terminal device includes an NFC power supply module, a sensing module, and an adjustment circuit. The liquid cooling device is fixed to the back of the terminal device. The terminal device detects the presence of the liquid cooling device through the sensing module and can supply power to the NFC power receiving module through the NFC power supply module. When the terminal device requires the liquid cooling module for auxiliary heat dissipation, the liquid cooling device uses the NFC power receiving module to power the liquid cooling mode and activate the liquid cooling function. When the terminal device needs to use the NFC function normally, due to the influence of the NFC power receiving module's receiving coil, the terminal device adjusts the radio frequency resonant frequency of the NFC power supply module through the adjustment circuit to ensure normal NFC function operation. In this way, liquid cooling is achieved using NFC power supply, avoiding the problem of the NFC receiving coil affecting the normal operation of the NFC function.

[0046] The liquid cooling heat dissipation device and terminal equipment of this application will be described in detail below through a specific embodiment.

[0047] This embodiment utilizes the widespread NFC function in mobile phones to power a liquid-cooled back clip / liquid-cooled protective case. This embodiment designs an identification mechanism for the liquid-cooled back clip / liquid-cooled protective case and an NFC antenna RF adjustment circuit to intelligently adjust the NFC RF matching parameters. This enables the application of the liquid-cooled back clip / liquid-cooled protective case on ordinary mobile phones, and wearing the liquid-cooled back clip / liquid-cooled protective case does not affect the normal use of the NFC antenna performance.

[0048] The following explanation uses a liquid cooling heat dissipation protective case (phone liquid cooling protective case) as an example: The identification mechanism of the liquid cooling heat dissipation protective case in this embodiment, namely the mobile phone liquid cooling protective case accessory detection and identification circuit, is as follows: Figure 1 The phone has a built-in Hall sensor. After the liquid cooling case is installed on the phone, a magnet is set in the area of ​​the case corresponding to the phone's Hall sensor to detect the dedicated case magnet. After the magnet is installed on the phone, the Hall sensor will output a detection signal to tell the phone's SOC to actively activate the NFC reader function, thereby recognizing the NFC tag built into the case. The NFC Tag IC built into the case contains an encrypted private key. The phone uses a proprietary reading and decryption process to determine whether it is a dedicated liquid cooling case. If the determination is successful, it is confirmed to be a dedicated liquid cooling case.

[0049] The power supply circuit of the liquid-cooled protective case in this embodiment supports NFC wireless power reception. This module consists of a rectifier circuit, an energy storage and voltage regulator circuit, and a DC-DC power supply voltage conversion circuit with a wide input voltage range. The energy storage and voltage regulator circuit includes a capacitor C4, a Zener diode VT1, a resistor R1, an N-channel MOSFET D4, a Zener diode VT2, resistors R2-R4, and a comparator D5. Capacitor C4 primarily serves as an energy storage filter, storing the charge output from the full-bridge rectifier circuit and smoothing voltage fluctuations to ensure a stable DC output. This capacitor is merely an example; the design should use at least one. The Zener diode VT1 stabilizes the voltage after passing through the energy storage and filtering circuit. If a voltage fluctuation exceeds the Zener diode's breakdown voltage (usually equal to the maximum operating voltage of the subsequent circuit), the Zener diode VT1 will release the charge to ground, thus protecting the subsequent circuit, i.e., providing overvoltage protection. Resistor R1, N-channel MOSFET D4, Zener diode VT2, resistors R2-R4, and comparator D5 form an overvoltage and overcurrent protection circuit. This circuit protects against excessive current and voltage surges in the energy storage circuit when the subsequent circuits are not operating and the full-bridge rectifier circuit is lightly loaded. This dual protection prevents overcurrent and overvoltage surges that could affect the safety and stability of the subsequent circuits. D5 is the comparator circuit, which samples the voltage at the VEC_RECT node. When the voltage exceeds a certain threshold, the output is high (the level of D5's VCC). This high level is processed by R4 and the Zener diode (reducing the level to within the safe range of the N-channel MOSFET's Vgs voltage), controlling D4 to conduct and discharge the current at the VEC_RECT node to ground. The power supply voltage conversion circuit is implemented using a wide-input-voltage-range DC-DC power supply, providing a wide input voltage range to accommodate voltage fluctuations in the input power supply.

[0050] The NFC TAG IC in the receiver circuit of the liquid-cooled protective case not only has encrypted private key functions programmed into it, but also supports the management and control of subsequent circuits, including control functions for the power supply voltage conversion circuit and the micro-pump drive control circuit. For example... Figure 2 and Figure 3 As shown.

[0051] After the phone recognizes the protective case, a radio frequency (RF) antenna is designed on the case corresponding to the phone's NFC antenna location to receive RF signals sent by the phone. When the phone case is installed on the phone, the case antenna affects the RF resonant frequency of the phone's antenna. The design parameters of the phone's NFC antenna and matching circuit are intended to set the antenna's RF resonant frequency within the 13.56MHz ± 0.1MHz range specified in the NFC standard to achieve optimal compatibility for device read and write operations. However, because the protective case antenna is close to the phone, the external antenna affects the resonant frequency of the phone's internal antenna, resulting in reduced RF radiation efficiency. Therefore, an RF matching parameter adjustment circuit needs to be designed on the phone.

[0052] When the mobile phone recognizes the dedicated NFC-enabled liquid-cooled heat dissipation protective case, the antenna on the protective case will affect the phone's NFC matching circuit. (The phone's NFC antenna and matching circuit parameters are designed to set the antenna resonant frequency within the 13.56MHz ± 0.1MHz range specified in the NFC standard to achieve optimal device read / write operation compatibility. The liquid-cooled protective case has an NFC coil for receiving RF signals and read / write commands from the phone. When the protective case is installed on the phone, its antenna will be in close contact with the phone's NFC antenna. This external metal antenna will affect the resonant frequency of the phone's internal NFC antenna, causing a deviation in the resonant frequency. This deviation will generally increase or decrease towards the specified frequency. Therefore, an RF matching parameter adjustment circuit needs to be designed on the phone. When the protective case affects the phone's antenna resonant frequency, the SOC controls the matching circuit to adjust the parameters, bringing the antenna resonant frequency deviation back within 13.56MHz ± 0.1MHz.) The phone's NFC matching circuit needs to be adjusted accordingly. The SOC switches the NFC matching circuit adapted to the protective case via the NFC_Match_Control signal. Figure 5 As shown.

[0053] Figure 6 This is the NFC matching circuit on the mobile phone side. L1, C10, L2, and C11 are EMC filtering circuits for the NFC transmission signal; C12, C13, C14, and R13 are the NFC (transmit link) matching circuits; and R11, C15, R12, and C16 are the NFC receive link matching circuits. These components form the basic matching circuit for the NFC antenna. Figure 6 Devices R14-R17, C17-C20, and D11-14 constitute the antenna matching adjustment circuit in this embodiment. When the system detects the liquid-cooled protective case being worn, the RF resonant frequency is affected by the metal antenna attached to the case. The SOC sets the NFC_Match_Control signal to a high level, controlling the N-channel MOSFETs D11-D14 to conduct. This causes devices C17, C18, C19, and C20 to be grounded and integrated into the NFC antenna matching circuit. This adjusts the frequency at which the receiving antenna inside the liquid-cooled protective case affects the phone's NFC antenna to the expected 13.56MHz ± 0.1MHz. Alternatively, this operation can be configured so that when the phone is not wearing a protective case, the SOC sets the NFC_Match_Control signal to a high level, controlling the N-channel MOSFETs D11-D14 to conduct; and when the liquid-cooled protective case is worn, the N-channel MOSFETs D11-D14 are turned off (i.e., VGS = 0V). In the above-mentioned adjustment and matching circuit, components R14-R17, C17-C20, and D11-14 are... Figure 6The descriptions are for illustrative purposes only. For example, R14-R17 can be a single resistor with parameters such as 0 ohms, or a combination of multiple resistors in series or parallel, or this resistor can be omitted from the circuit. C17-C20 are similar; for example, C17 can be a parallel design of multiple individual capacitors to form a required capacitor.

[0054] Figure 7 This is another architecture for the NFC matching circuit on the mobile phone. It uses R14-R17, C17-C20, and antenna TunnerSwitch D15-16 devices as the antenna matching adjustment circuit in this embodiment. The SOC controls the antenna Tunner Switch D15-D16 devices to turn on and off through the NFC_Match_Control signal, thereby realizing the dynamic adjustment of NFC antenna matching parameters.

[0055] Figure 8 This is another architecture for the NFC matching circuit on the mobile phone. Resistors R14-R17 and adjustable capacitors C17-C20 are used as the antenna matching adjustment circuit in this embodiment. The SOC controls the capacitor driver to adjust the capacitance value of the adjustable capacitors C17-C20 through the NFC_Match_Control signal, thereby realizing the dynamic adjustment of the NFC antenna matching parameters.

[0056] Figure 1 To protect the NFC receiving module on the casing side, capacitors C1-C3 form the NFC receiver matching circuit (tuning capacitor), Schottky diodes VD1-VD4 form the AC signal rectification circuit, capacitor C4 forms the energy storage filter circuit, and Zener diode VT1 forms the voltage regulator circuit. Zener diode VT1 is used to stabilize the voltage passing through the energy storage filter circuit. If the voltage fluctuation exceeds the breakdown voltage of the Zener diode (usually equal to the maximum operating voltage of the subsequent circuit), Zener diode VT1 will release the charge to ground, thereby protecting the subsequent circuit, i.e., it plays the role of overvoltage protection.

[0057] This embodiment designs a dual overvoltage and overcurrent protection circuit, which consists of resistor R1, N-channel MOSFET D4, Zener diode VT2, resistors R2-R4, and comparator D5. This circuit provides dual protection against overcurrent and overvoltage surges that could affect the safety and stability of subsequent circuits when the full-bridge rectifier circuit is not operating and the output is lightly loaded. Specifically, D5 is a comparator circuit that samples the voltage at the VEC_TECT node. When the voltage exceeds a certain threshold, it outputs a high level (the VCC level of D5). This high level is then processed by R4 and the Zener diode (reducing the level to within the safe range of the N-channel MOSFET's Vgs voltage), controlling D4 to conduct and discharging the current at the VEC_TECT node to ground. The power supply voltage conversion circuit is implemented using a DC-DC power supply with a wide input voltage range (to accommodate voltage fluctuations in the input power supply). D1 is a buck DC-DC circuit with a wide input voltage range, effectively resolving voltage fluctuations during the VEC_RECT phase of load changes and reducing the impact on the input voltage of the liquid micropump module. Module D3 is an LDO, which will provide the operating voltage for the NFC TAG IC.

[0058] Figure 2 The diagram shows the pump drive circuit on the protective casing side. C9 is the input capacitor for the Micro Pump Driver circuit, acting as a filter and energy storage capacitor to provide a stable input power supply voltage for the Micro Pump Driver circuit. D4 is the Micro Pump Driver circuit, which provides the drive voltage signal to the liquid working fluid pump, driving the liquid working fluid pump to operate. D5 is the Micro Pump module, which realizes the control of... Figure 1 The liquid in the liquid-cooled flow channel of the right-side protective shell is pumped, driving the liquid flow. In this circuit architecture, after the phone recognizes the liquid-cooled protective shell installed (Hall sensor detection complete, SOC recognizes the proprietary encryption key built into the NFC TAG on the protective shell via NFC), the SOC continuously supplies power to the protective shell via the NFC antenna coil. It also controls the NFC TAG IC inside the protective shell via NFC air interface commands, powering the Micro Pump Driver circuit by setting the DCDC_EN signal high, and controlling the Micro Pump Driver IC's operation via the MicroPump_CONTROL signal, adjusting the drive signal to control the working power (flow rate) of the Micro Pump module.

[0059] When the liquid-cooled protective case is fixed on the phone and recognized by the phone's SOC, the SOC switches the NFC matching circuit to the corresponding RF mode of the liquid-cooled protective case and incorporates the control of the liquid-cooling module into the system control. When the system detects that the temperature of the corresponding module monitored by the phone's built-in reaches a certain threshold, or when fast charging is initiated, the system intelligently activates the liquid-cooling module. At this time, the NFC function is disabled, and only the NFC TX function (card reader mode) is continuously activated to wirelessly power the protective case. (When the liquid-cooling pump of the protective case is working to dissipate heat, if the user wants to use the full-featured NFC, they need to enable the NFC function through the quick switch on the phone's UI interface or in the settings. During the NFC activation phase, the SOC will turn off the liquid-cooling module on the protective case.) If the above conditions and scenarios do not meet the threshold and scenario, the liquid-cooling module will be turned off to save power. At this time, all NFC functions are normal. This embodiment utilizes the continuous transmission function of NFC, differing from current technologies such as wireless charging-powered liquid-cooled protective cases and DOCKPIN-powered protective cases. It employs a continuous signal transmission function based on NFC reader mode, designing a related circuit system that satisfies the power requirements of the liquid-cooled protective case. This allows the mobile phone SOC to control and implement the circuit functions of the liquid-cooled protective case without affecting the phone's NFC function when the liquid cooling function is not active. When the liquid cooling module of the protective case is running, if the phone needs to enable NFC, it can be done by enabling NFC in the phone's settings.

[0060] Reference Figure 9 The diagram shows the detection and configuration process for the NFC-powered liquid-cooled protective case. Specifically, the determination of "whether to enable liquid cooling" in the flowchart is as follows: when Y is executed, that is, the liquid cooling can be enabled by continuously enabling the NFC TX function. If no other command is input at this time, the liquid cooling will be activated while the NFC TX function is continuously enabled. In this process, it is detected whether the user has enabled the normal NFC function. When the phone needs to enable the normal NFC function, the action of enabling NFC is executed. If no command to enable the normal NFC function is received, the process continues in the loop of enabling liquid cooling.

[0061] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0062] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0063] The above is a detailed description of the preferred embodiments of this application. However, this application is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this application. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A liquid cooling heat dissipation device, characterized in that, include: The housing is used to secure it to the back of the terminal device; An NFC power receiving module is disposed in the housing, and the NFC power receiving module corresponds to the NFC power supply module of the terminal device; A liquid cooling module is disposed in the housing and is connected to the NFC power receiving module to provide liquid cooling heat dissipation for the terminal device.

2. The liquid cooling heat dissipation device according to claim 1, characterized in that, The NFC receiving module includes a receiving coil, a power supply circuit, and an NFC tag. The receiving coil corresponds to the power supply coil of the NFC power supply module. One end of the power supply circuit is connected to the receiving coil to draw power, and the other end is connected to the NFC tag and the liquid cooling module to supply power. The NFC tag is connected to the liquid cooling module to output a drive control signal.

3. The liquid cooling heat dissipation device according to claim 2, characterized in that, The NFC tag stores an encryption key, which is used by the terminal device to read and decrypt the liquid cooling device to determine whether it matches the terminal device.

4. The liquid cooling heat dissipation device according to claim 2, characterized in that, The power supply circuit includes a rectifier circuit, a first protection circuit, a second protection circuit, and a DC-DC circuit. The input terminal of the rectifier circuit is connected to the receiving coil, and the output terminal of the rectifier circuit is connected to the input terminal of the DC-DC circuit through the first protection circuit and the second protection circuit. The output terminal of the DC-DC circuit is connected to the NFC tag and the liquid cooling module.

5. The liquid cooling heat dissipation device according to claim 4, characterized in that, The first protection circuit includes a first capacitor and a first Zener diode. The output terminal of the rectifier circuit is grounded through the first capacitor, and the output terminal of the rectifier circuit is grounded through the first Zener diode.

6. The liquid cooling heat dissipation device according to claim 4, characterized in that, The second protection circuit includes a comparator and a protection switch. One input terminal of the comparator is connected to the output terminal of the rectifier circuit, and the other input terminal is connected to a reference voltage source. The output terminal of the comparator is connected to the control terminal of the protection switch. The output terminal of the rectifier circuit is grounded through the protection switch.

7. The liquid cooling heat dissipation device according to claim 6, characterized in that, The second protection circuit also includes a second Zener diode, and the output of the comparator is grounded through the second Zener diode.

8. The liquid cooling heat dissipation device according to claim 1, characterized in that, The liquid cooling module includes a pump body, a driver chip, and a liquid cooling channel. The pump body is connected to the liquid cooling channel, the driver chip is connected to the NFC power receiving module to obtain the operating voltage, and the driver chip is connected to the pump body to output a drive signal.

9. The liquid cooling heat dissipation device according to claim 1, characterized in that, The liquid cooling heat dissipation device also includes a magnetic component, which corresponds to the sensing module of the terminal device. The sensing module is used to determine the presence of the liquid cooling heat dissipation device by sensing the magnetic component.

10. The liquid cooling heat dissipation device according to claim 1, characterized in that, The housing is a protective shell, and a first accommodating cavity for fixing the terminal device is formed inside the protective shell. The NFC power receiving module and the liquid cooling module are disposed in the first accommodating cavity. Alternatively, the housing may be a clamping mechanism for fixing to the back of the terminal device, and the clamping mechanism may have a second accommodating cavity for accommodating the NFC power receiving module and the liquid cooling module.

11. A terminal device, characterized in that, include: The NFC power supply module corresponds to the NFC power receiving module in the liquid cooling heat dissipation device fixed on the back of the terminal device; A sensing module is used to sense the presence of the liquid cooling heat dissipation device; Adjust the circuit and connect it to the NFC power supply module; The processor is configured to control the adjustment circuit to adjust the radio frequency resonant frequency of the NFC power supply module based on the sensing results of the sensing module.

12. The terminal device according to claim 11, characterized in that, The NFC power supply module includes a power supply coil and a matching circuit, and the processor is connected to the power supply coil through the matching circuit.

13. The terminal device according to claim 12, characterized in that, The adjustment circuit includes a switch module, one end of which is connected to the matching circuit and the other end is grounded. The control terminal of the switch module is connected to the processor for controlled switching.

14. The terminal device according to claim 13, characterized in that, The switching module includes at least one of an electronically controlled switch, a tuning switch, and an adjustable capacitor.

15. The terminal device according to claim 11, characterized in that, The step of controlling the adjustment circuit to adjust the radio frequency resonant frequency point of the NFC power supply module based on the sensing result of the sensing module includes: In response to the sensing module detecting the presence of the liquid cooling heat dissipation device, the encryption key of the NFC tag in the NFC receiving module is read and the encryption key is decrypted; If the liquid cooling device is confirmed to be compatible with the terminal device after decryption, a first adjustment signal is sent to the adjustment circuit to set the radio frequency resonant frequency point of the NFC power supply module, so as to supply power to the NFC receiving module through the NFC power supply module.

16. The terminal device according to claim 15, characterized in that, The step of supplying power to the NFC receiving module through the NFC power supply module includes: In response to entering a target scenario, the reader mode of the NFC power supply module is continuously activated to supply power to the NFC power receiving module; wherein, the target scenario includes at least one of the following: the temperature monitoring value of the terminal device is greater than a temperature threshold, the target application is running, the target hardware is running, and the target charging mode is running.

17. The terminal device according to claim 16, characterized in that, The processor is also used for: In response to exiting the target scene and / or detecting that the NFC function is enabled, a second adjustment signal is sent to the adjustment circuit to set the radio frequency resonant frequency point of the NFC power supply module.

18. The terminal device according to claim 11, characterized in that, The step of controlling the adjustment circuit to adjust the radio frequency resonant frequency point of the NFC power supply module based on the sensing result of the sensing module includes: In response to the sensing module detecting the absence of the liquid cooling heat dissipation device, a second adjustment signal is sent to the adjustment circuit to set the radio frequency resonant frequency point of the NFC power supply module.

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