Heat dissipation structure and electronic equipment

Abstract

The invention discloses a heat dissipation structure and electronic equipment, and relates to the technical field of heat dissipation. The heat dissipation structure comprises a substrate in contact with a target component; the cover plate is arranged on the base plate, the cover plate and the base plate jointly form a containing space, and the cover plate is provided with a cooling medium inlet and a cooling medium outlet; the heat dissipation components are all arranged on the substrate and located in the containing space, a heat dissipation channel is formed between every two adjacent heat dissipation components, and two ports of each heat dissipation channel are used for being communicated with the cooling medium inlet and the cooling medium outlet respectively; in the arrangement direction from the cooling medium inlet to the cooling medium outlet, the distance between the side, relatively close to the cover plate, of each heat dissipation component and the inner top wall of the cover plate is gradually reduced, so that the cooling medium entering the cover plate is cooled by the cooling medium. At least part of gaseous substances formed after heat dissipation of the target component flow out of the cooling medium outlet through the heat dissipation channel.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more specifically, to a heat dissipation structure and electronic device. Background Technology

[0002] In servers and other high-performance electronic devices, the heat generated by chips is typically dissipated efficiently using microchannel cold plates. Traditional microchannel cold plates have multiple parallel microchannels within them, through which coolant flows. Heat is carried away from the chip through heat exchange between the coolant and the chip, thus cooling it. This technology is widely used in the thermal management of high-power-density electronic devices due to its high heat dissipation efficiency and compact structure. Specifically, after entering the microchannel cold plate, the coolant undergoes a phase change from liquid to gas, a process that absorbs a significant amount of heat, resulting in excellent heat dissipation.

[0003] However, after the coolant absorbs heat and undergoes a phase change in the microchannel, the density difference between the gaseous and liquid coolant leads to uneven distribution of the two-phase fluid in the microchannel. Bubbles tend to accumulate in the flow channel, forming airlocks that hinder the flow of liquid coolant and reduce the overall heat exchange efficiency. Summary of the Invention

[0004] This application provides a heat dissipation structure and electronic device to solve the problem of low discharge rate of gaseous substances formed by coolant after absorbing heat in the prior art.

[0005] This application provides a heat dissipation structure, including a substrate, which is used to contact a target component;

[0006] A cover plate is disposed on a substrate to form a receiving space together with the substrate. The cover plate has a cooling medium inlet and a cooling medium outlet to introduce cooling medium into the receiving space through the cooling medium inlet to dissipate heat from the target component, and to lead out the dissipated cooling medium through the cooling medium outlet.

[0007] Multiple heat dissipation components are mounted on the substrate and located within the accommodating space. A heat dissipation channel is formed between two adjacent heat dissipation components, and the two ends of the heat dissipation channel are respectively used to connect to the cooling medium inlet and the cooling medium outlet. Along the arrangement direction from the cooling medium inlet to the cooling medium outlet, the distance between the side of each heat dissipation component that is relatively close to the cover plate and the inner top wall of the cover plate gradually decreases, so that at least part of the gaseous substance formed by the cooling medium entering the cover plate after dissipating heat on the target component flows out through the cooling medium outlet via the heat dissipation channel.

[0008] Furthermore, each heat dissipation component includes a first heat dissipation component and a second heat dissipation component. The first heat dissipation component is disposed on the substrate, and the second heat dissipation component is disposed on the side of the first heat dissipation component away from the substrate. Along the arrangement direction from the cooling medium inlet to the cooling medium outlet, the distance between the side of the first heat dissipation component relatively close to the cover plate and the inner top wall of the cover plate is equal, and the distance between the side of the second heat dissipation component relatively close to the cover plate and the inner top wall of the cover plate gradually decreases.

[0009] Furthermore, the heat dissipation structure also includes multiple auxiliary heat dissipation pipes, which are arranged one-to-one with multiple heat dissipation channels. Each auxiliary heat dissipation pipe is located on the inner top wall of the cover plate, and both ends of each auxiliary heat dissipation pipe are connected to the accommodating space. The outlet end of each auxiliary heat dissipation pipe is located relatively close to the outlet of the cooling medium, so that at least part of the gaseous material formed after the target component is cooled by the cooling medium flows out through the outlet of the cooling medium via each auxiliary heat dissipation pipe.

[0010] Furthermore, each auxiliary heat dissipation pipe includes a main pipe and multiple branch pipes. The main pipe is located on the inner top wall of the cover plate and extends along the arrangement direction from the cooling medium inlet to the cooling medium outlet. The multiple branch pipes are located on the side of the main pipe away from the cover plate. The inlet end of the multiple branch pipes is connected to the heat dissipation channel, and the outlet end of the multiple branch pipes is connected to the main pipe, so that at least some gaseous substances enter the main pipe through the multiple branch pipes and enter the cooling medium outlet through the main pipe.

[0011] Furthermore, the accommodating space includes a conical inlet chamber, an accommodating chamber, and a conical outlet chamber that are interconnected with each other. The conical inlet chamber is connected to the cooling medium inlet, and the conical outlet chamber is connected to the cooling medium outlet. Along the arrangement direction from the cooling medium inlet to the cooling medium outlet, the flow cross-sectional area of ​​the conical inlet chamber gradually increases, and the flow cross-sectional area of ​​the conical outlet chamber gradually decreases. Multiple heat dissipation components are arranged in the accommodating chamber.

[0012] Furthermore, the heat dissipation structure also includes multiple flow-blocking structures, all of which are located in the conical outlet chamber. Each flow-blocking structure has a flow-blocking surface, and each flow-blocking surface is oriented towards the cooling medium outlet.

[0013] Furthermore, each flow-blocking structure includes a flow-blocking body, and each flow-blocking body has an arc-shaped flow-blocking surface.

[0014] Furthermore, each flow-blocking structure also includes a flow-guiding body, which is disposed in the corresponding flow-blocking surface and forms a flow-blocking gap with the flow-blocking surface, so that part of the cooling medium returning from the conical outlet cavity and part of the gaseous substance enter the flow-blocking gap.

[0015] Furthermore, multiple flow-blocking structures form a flow-blocking group, and there are multiple flow-blocking groups, with the flow-blocking structures within each flow-blocking group being staggered.

[0016] According to another aspect of this application, this application also provides an electronic device, which includes a target component and a heat dissipation structure for dissipating heat from the target component, the heat dissipation structure being the aforementioned heat dissipation structure.

[0017] By setting up a cover plate and a substrate to form a receiving space, the cooling medium can flow effectively on the surface of the target component, thereby improving the heat exchange efficiency. The receiving space formed by the cover plate and the substrate together provides a closed and optimized flow channel for the cooling medium, allowing the cooling medium to come into close contact with the target component and enhancing heat dissipation.

[0018] By setting up multiple heat dissipation components and their heat dissipation channels, the cooling medium can evenly cover and deeply contact the target component, achieving more efficient heat exchange. The heat dissipation channel design between the heat dissipation components ensures that the cooling medium can maximize heat exchange with the target component when flowing through it, maintaining good heat dissipation even in high heat density environments.

[0019] The design of the heat dissipation component structure allows at least some gaseous substances to flow rapidly within the heat dissipation channel and exit through the cooling medium outlet, reducing thermal resistance and backflow. As the height of the heat dissipation component gradually decreases near the cover plate, the flow path of the heat dissipation channel gradually narrows. This causes the gaseous substances to flow faster within the heat dissipation channel and be quickly discharged through the cooling medium outlet, avoiding mixing and backflow of liquid cooling medium and gaseous substances within the channel, thus ensuring unobstructed flow of the heat dissipation channel. Attached Figure Description

[0020] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This paper shows an overall structural schematic diagram of the heat dissipation structure according to an embodiment of the present application;

[0022] Figure 2 A schematic diagram of the internal structure of the heat dissipation structure according to an embodiment of this application is shown;

[0023] Figure 3 An embodiment of this application is shown. Figure 2 Enlarged view of point A in the middle;

[0024] Figure 4 A cross-sectional view of a heat dissipation structure according to an embodiment of this application is shown;

[0025] Figure 5 A structural diagram of a heat dissipation component according to an embodiment of this application is shown.

[0026] The above figures include the following reference numerals:

[0027] 1. Substrate; 2. Cover plate; 21. Cooling medium inlet; 22. Cooling medium outlet; 3. Heat dissipation component; 31. First heat dissipation component; 32. Second heat dissipation component; 4. Auxiliary heat dissipation pipe; 41. Main pipe; 42. Branch pipe; 5. Conical inlet chamber; 6. Conical outlet chamber; 7. Flow obstruction structure; 71. Flow obstruction body; 72. Flow guiding body. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0029] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] In servers and other high-performance electronic devices, the heat generated by chips is typically dissipated efficiently using microchannel cold plates. Traditional microchannel cold plates have multiple parallel microchannels within them, through which coolant flows. Heat is carried away from the chip through heat exchange between the coolant and the chip, thus cooling it. This technology is widely used in the thermal management of high-power-density electronic devices due to its high heat dissipation efficiency and compact structure. Specifically, after entering the microchannel cold plate, the coolant undergoes a phase change from liquid to gas, a process that absorbs a significant amount of heat, resulting in excellent heat dissipation.

[0032] However, after the coolant absorbs heat and undergoes a phase change in the microchannel, the density difference between the gaseous and liquid coolant leads to uneven distribution of the two-phase fluid in the microchannel. Bubbles tend to accumulate in the flow channel, forming airlocks that hinder the flow of liquid coolant and reduce the overall heat exchange efficiency.

[0033] Therefore, the technical solution of this application is to provide a heat dissipation structure and electronic device to address the above problems.

[0034] Example 1

[0035] like Figures 1 to 5 As shown, this application embodiment first provides a heat dissipation structure, including a substrate 1, on which a plurality of heat dissipation components 3 are disposed, and a heat dissipation channel is formed between two adjacent heat dissipation components 3. The heat dissipation structure also includes a cover plate 2, which is disposed on the substrate 1 and together with the cover plate 2 forms an accommodating space. All heat dissipation components 3 are located within the accommodating space. A cooling medium inlet 21 and a cooling medium outlet 22 are respectively provided at both ends of the cover plate 2. The cooling medium inlet 21 and the cooling medium outlet 22 are both connected to the accommodating space and also to the heat dissipation channel. Each heat dissipation component 3 has a trapezoidal structure. Therefore, the heat dissipation channel is a trapezoidal heat dissipation channel. Along the arrangement direction from the cooling medium inlet 21 to the cooling medium outlet 22, the distance between the side of the heat dissipation component 3 near the cover plate 2 and the inner top wall of the cover plate 2 decreases. When in use, the cooling medium enters the receiving space through the cooling medium inlet 21. After absorbing the heat of the target component, part of the cooling medium becomes a gaseous substance, and part of the cooling medium remains liquid. The liquid cooling medium flows from the side of the heat dissipation channel near the cooling medium inlet 21 to the cooling medium outlet 22 under the impetus of the continuously input cooling medium. The gaseous cooling medium flows from the top of the heat dissipation channel to the cooling medium outlet 22.

[0036] Optionally, the target component in this embodiment is a chip.

[0037] As the server chip or other electronic devices continue to operate, a large amount of heat is generated. The heat dissipation component 3, in direct contact with the chip, begins to absorb heat from the heat source. Under the influence of heat, some of the cooling medium changes from a liquid to a gaseous state. This process releases a large amount of latent heat, effectively reducing the temperature of the heat source. The liquid cooling medium, pushed by subsequent cooling media, flows along the trapezoidal heat dissipation channel from the cooling medium inlet 21 to the cooling medium outlet 22. This flow path design effectively reduces flow resistance and accelerates the flow speed of the liquid. The gaseous cooling medium, due to its lower density and higher temperature, naturally rises and tends towards the top of the heat dissipation channel. As the heat dissipation channel approaches the cover plate 2, the top wall of the heat dissipation channel gradually approaches the inner top wall of the cover plate 2, reducing the stagnation space of the gaseous coolant in the channel and forcing the gaseous coolant to move more quickly towards the cooling medium outlet 22, avoiding bubble accumulation and backflow, further improving the heat dissipation effect. Finally, the cooling medium (including gaseous and liquid states) is discharged from the heat dissipation structure through the cooling medium outlet 22, completing the heat dissipation cycle.

[0038] The heat dissipation structure of this embodiment can significantly improve the circulation efficiency of the cooling medium, especially for the cooling system of gas-liquid two-phase flow. It avoids the problems of bubble blockage and backflow, and ensures the smooth flow of the cooling medium. The special design of the trapezoidal heat dissipation channel not only increases the heat dissipation area, but also optimizes the natural upward path of the gaseous cooling medium, improves the heat exchange efficiency, and reduces the thermal resistance, thereby achieving more efficient heat removal.

[0039] In some embodiments of this application, the heat dissipation component 3 includes a first heat dissipation component 31 directly disposed on the substrate 1. The first heat dissipation component 31 has a rectangular structure. The heat dissipation component 3 also includes a second heat dissipation component 32 disposed on the first heat dissipation component 31 away from the substrate 1. The second heat dissipation component 32 has a triangular shape, and the longitudinal cross-sectional area of ​​the second heat dissipation component 32 gradually decreases from the arrangement direction from the cooling medium inlet 21 to the cooling medium outlet 22.

[0040] Within the channel of the second heat dissipation component 32, the fluid velocity increases as the cross-sectional area of ​​the flow channel decreases. This is because, within a given time, the same volume of fluid must pass through a smaller space, leading to an increase in flow rate. This effect is particularly pronounced in the gaseous state because gases are more compressible. When the cooling medium undergoes heat exchange and some of the liquid coolant is converted into a gaseous state, the gas tends to rise in the channel due to its lower density. The triangular design of the second heat dissipation component 32, with its gradually narrowing top, creates a top-down "squeezing" effect, forcing the rising gaseous coolant to move towards the outlet end more quickly, reducing the residence time of the gas inside the channel.

[0041] During heat exchange, the phase change of the cooling medium (from liquid to gas) is accompanied by the absorption of a large amount of heat. As the cross-sectional area of ​​the second heat dissipation component 32 gradually decreases, the gas-liquid interface area in the channel decreases relatively, which causes the phase change process to occur in a shorter time, thereby accelerating the generation and emission of gaseous coolant.

[0042] Gaseous coolant accumulates at the top of the channel, creating a temperature gradient due to its higher temperature compared to the surrounding environment. This gradient propels the hot gas towards the cooling medium outlet 22, accelerating gas flow. As the top of the second heat dissipation component 32 gradually narrows, this temperature gradient further accelerates the gas flow, ensuring rapid gas discharge.

[0043] The first heat dissipation component 31 is in direct contact with the substrate 1, enabling it to quickly absorb heat from the server chip or other heat sources. The second heat dissipation component 32 provides an additional heat dissipation path, increasing the heat dissipation area and further improving heat exchange efficiency. Its cross-sectional area gradually decreases from the cooling medium inlet 21 to the cooling medium outlet 22. This design allows the gaseous substances formed after heat exchange to effectively collect and be guided to the cooling medium outlet 22, avoiding disordered diffusion and stagnation of the gaseous coolant within the channel. This ensures a good distribution of the gas-liquid two-phase flow within the heat dissipation structure and improves overall heat dissipation efficiency. Yes, the triangular design of the second heat dissipation component 32 conforms to the principles of fluid mechanics, which can guide the cooling medium to form a more concentrated flow stream, which is conducive to the rapid discharge of the gaseous cooling medium, thereby reducing flow resistance and accelerating the circulation speed of the cooling medium. The special design of the second heat dissipation component 32 enables the gaseous and liquid cooling media to be effectively separated during the flow process. Due to its lower density, the gaseous cooling medium naturally moves upward and is quickly guided to the outlet through the gradually narrowing channel, reducing the chance of mixing with the liquid cooling medium and avoiding the risk of backflow to the cooling medium inlet 21, thus maintaining the stable operation of the cooling system.

[0044] In some embodiments of this application, the heat dissipation structure further includes a plurality of auxiliary heat dissipation pipes 4, which are arranged one-to-one with a plurality of heat dissipation channels. Each auxiliary heat dissipation pipe 4 is arranged on the inner top wall of the cover plate 2, and both ends of each auxiliary heat dissipation pipe 4 are connected to the accommodating space. The outlet end of each auxiliary heat dissipation pipe 4 is arranged relatively close to the cooling medium outlet 22, so that at least part of the gaseous material formed after the target component is cooled by the cooling medium flows out from the cooling medium outlet 22 through each auxiliary heat dissipation pipe 4.

[0045] The auxiliary heat dissipation pipe 4 corresponds one-to-one with each heat dissipation channel, providing a priority discharge path when the cooling medium undergoes heat exchange and partially transforms into a gaseous substance. Especially when gaseous cooling medium accumulates within the heat dissipation channels, the auxiliary heat dissipation pipe 4 can quickly remove these high-heat-energy gaseous substances, avoiding efficiency reduction and potential backflow problems caused by gas-liquid mixing within the heat dissipation channels. This design ensures efficient discharge of the gaseous cooling medium, enhancing the heat dissipation performance of the heat dissipation structure for the target components.

[0046] The auxiliary heat dissipation pipe 4 is located on the inner top wall of the cover plate 2, with its outlet end close to the cooling medium outlet 22. This design reduces the distance the gaseous cooling medium travels from the evaporation point to the cooling medium outlet 22, thereby significantly reducing the internal thermal resistance of the system. Compared with traditional heat dissipation structures, the gaseous cooling medium does not need to travel long distances within the heat dissipation channel, reducing the flow resistance caused by narrow or bent channels. This allows the gaseous cooling medium to be discharged more smoothly to the outside through the auxiliary heat dissipation pipe 4, achieving rapid heat dissipation.

[0047] The presence of auxiliary heat dissipation pipe 4 enables the heat dissipation structure to respond more quickly to the high thermal load of the target component. Especially in high-power applications such as server chips, the rapid discharge of gaseous cooling medium can remove a large amount of heat in time, prevent the chip from overheating, and maintain its stable operation.

[0048] In some embodiments of this application, each auxiliary heat dissipation pipe 4 includes a main pipe 41 and multiple branch pipes 42. The main pipe 41 is disposed on the inner top wall of the cover plate 2 and extends along the arrangement direction from the cooling medium inlet 21 to the cooling medium outlet 22. The multiple branch pipes 42 are disposed on the side of the main pipe 41 away from the cover plate 2. The inlet end of the multiple branch pipes 42 is connected to the heat dissipation channel, and the outlet end of the multiple branch pipes 42 is connected to the main pipe 41, so that at least some gaseous substances enter the main pipe 41 through the multiple branch pipes 42 and enter the cooling medium outlet 22 through the main pipe 41.

[0049] Branch pipe 42 is connected to the heat dissipation channel, and its inlet end faces the gaseous coolant generated in the heat dissipation channel. This layout can effectively achieve gas-liquid separation. The gaseous coolant preferentially enters the main pipe 41 through branch pipe 42, which reduces the impact of gas-liquid mixing on the heat dissipation system and improves heat dissipation efficiency.

[0050] By integrating multiple branch pipes 42 into the main pipe 41, the discharge path of the gaseous coolant can be controlled, allowing it to flow more smoothly to the cooling medium outlet 22. This design ensures the rapid discharge of the gaseous coolant, reduces the residence time inside the heat dissipation structure, avoids bubbles clogging the heat dissipation channels, and maintains the high-efficiency operation of the system.

[0051] The main pipe 41 extends from the cooling medium inlet 21 to the cooling medium outlet 22, and multiple branch pipes 42 are evenly distributed on the main pipe 41. This layout makes the discharge of gaseous coolant more uniform, which helps to achieve a balanced distribution of heat in the entire heat dissipation structure and improves the overall heat dissipation efficiency.

[0052] In some embodiments of this application, the accommodating space includes a conical inlet chamber 5, an accommodating chamber, and a conical outlet chamber 6 that are interconnected. The conical inlet chamber 5 is connected to the cooling medium inlet 21, and the conical outlet chamber 6 is connected to the cooling medium outlet 22. Along the arrangement direction from the cooling medium inlet 21 to the cooling medium outlet 22, the flow cross-sectional area of ​​the conical inlet chamber 5 gradually increases, and the flow cross-sectional area of ​​the conical outlet chamber 6 gradually decreases. Multiple heat dissipation components 3 are disposed in the accommodating chamber.

[0053] Because the flow cross-sectional area of ​​the conical inlet chamber 5 gradually increases along the direction from the cooling medium inlet 21 to the cooling medium outlet 22, this ensures that the flow velocity of the cooling medium can smoothly transition when entering the heat dissipation structure, avoiding turbulence and energy loss caused by sudden changes in flow velocity, thereby improving the efficiency of heat exchange. Conversely, the flow cross-sectional area of ​​the conical outlet chamber 6 gradually decreases. This design utilizes the Venturi effect in fluid mechanics, that is, when the fluid passes through the contraction area, its flow velocity increases and its pressure decreases. In the conical outlet chamber 6, after the gaseous coolant and part of the liquid coolant exchange heat through the heat dissipation channel, they will pass through the gradually narrowing outlet chamber, which leads to a significant increase in flow velocity, thereby accelerating the discharge of the cooling medium, reducing the internal thermal resistance of the system, and achieving rapid heat dissipation.

[0054] The heat dissipation components 3 are evenly distributed in the receiving chamber. This design ensures that the cooling medium can fully contact the heat dissipation components 3 and carry out efficient heat exchange. At the same time, the progressively enlarged design of the conical inlet chamber 5 allows the cooling medium to gradually adapt to the flow rate and pressure of the working environment before entering the receiving chamber, making the heat exchange process smoother and improving the overall heat dissipation efficiency.

[0055] In some embodiments of this application, the heat dissipation structure further includes a plurality of flow-blocking structures 7, all of which are disposed within the conical outlet chamber 6. Each flow-blocking structure 7 has a flow-blocking surface, and each flow-blocking surface is disposed toward the cooling medium outlet 22.

[0056] In some embodiments of this application, each flow-blocking structure 7 includes a flow-blocking body 71, and each flow-blocking body 71 has an arc-shaped flow-blocking surface.

[0057] In some embodiments of this application, each flow-blocking structure 7 further includes a flow-guiding body 72, each flow-guiding body 72 is disposed in the flow-blocking surface corresponding to it, and a flow-blocking gap is formed between the flow-blocking surface and the flow-blocking surface, so that part of the cooling medium and part of the gaseous substances returning from the conical outlet cavity enter the flow-blocking gap.

[0058] like Figure 3 As shown, the flow guiding body 72 includes two inclined surfaces, and the intersection of the two inclined surfaces forms an angle. This angle is set towards the cooling medium outlet 22. In this way, the two inclined surfaces can not only guide the gaseous material in the heat dissipation channel to the cooling medium outlet 22, but also allow the returning gaseous material to smoothly enter the flow-blocking gap. Under the action of the flow-blocking gap, it flows vertically towards the cooling medium outlet 22 again through the two inclined surfaces.

[0059] Inside the conical outlet chamber 6, the arc-shaped flow-blocking surface of the flow-blocking body 71 is positioned facing the cooling medium outlet 22. When the cooling medium approaches the outlet, the gaseous substance, due to its lightness, tends to rise within the conical outlet chamber 6 and attempt to flow back. However, the arc-shaped flow-blocking surface effectively blocks this backflow, guiding the cooling medium to be discharged stably along a predetermined path. Each flow-blocking structure 7 also includes a flow-guiding body 72, which is positioned inside its corresponding flow-blocking surface, forming a flow-blocking gap with the flow-blocking surface. When some of the cooling medium (including gaseous and liquid states) attempts to flow back, it is guided into the flow-blocking gap. The placement of the flow-guiding body 72 not only reduces backflow but also utilizes the flow-blocking gap to redirect this portion of the cooling medium back to the cooling medium outlet 22, ensuring smooth discharge of the cooling medium.

[0060] The arc-shaped flow-blocking surface design of the flow-blocking body 71 utilizes the principle of Bernoulli's theorem, which states that as the fluid velocity increases, the fluid pressure decreases. In the conical outlet chamber 6, the density of the gaseous cooling medium is low, making it easy to rise. The arc-shaped design of the flow-blocking surface can promote this hydrodynamic effect, causing the cooling medium to accelerate as it approaches the outlet, reducing the possibility of it flowing back into the conical inlet chamber 5.

[0061] The flow guide body 72, when used in conjunction with the flow obstruction surface, can precisely control and guide the direction of the fluid. When the cooling medium attempts to flow back, the structure of the flow guide body 72 can effectively change the movement path of the fluid, reduce the turbulence and energy loss of the fluid, and ensure that it is smoothly discharged from the cooling medium outlet 22.

[0062] During the heat exchange process, some of the liquid coolant is converted into gaseous substances. This phase change is accompanied by the absorption of a large amount of heat energy. The design of the flow-blocking structure 7 ensures that the gaseous coolant can avoid unnecessary heat energy accumulation during the discharge process, thereby improving the thermal energy management efficiency of the heat dissipation structure.

[0063] By incorporating a flow-blocking body 71 with an arc-shaped flow-blocking surface and a flow-guiding body 72 within the conical outlet chamber 6, the heat dissipation structure of this embodiment achieves refined management of the cooling medium discharge process. This design significantly improves heat dissipation efficiency and reduces the backflow of the cooling medium by optimizing the fluid path and heat energy distribution, ensuring stable operation of the system under high heat flux density applications.

[0064] In some embodiments of this application, multiple flow-blocking structures 7 form a flow-blocking group, and there are multiple flow-blocking groups, with the flow-blocking structures 7 in each flow-blocking group being staggered.

[0065] like Figure 3 As shown in the figure, there are three flow-blocking groups. The first flow-blocking group includes five flow-blocking structures 7, the second flow-blocking group includes four flow-blocking structures 7, and the third flow-blocking group includes one flow-blocking structure 7. Each flow-blocking structure 7 in the second flow-blocking group is respectively set between two adjacent flow-blocking structures 7 in the first flow-blocking group.

[0066] When the cooling medium passes through heat exchange and enters the conical outlet chamber 6, the first set of flow-blocking structures 7 first blocks and guides the returning cooling medium. Then, the second set of flow-blocking structures (which has fewer flow-blocking structures 7 but more precise positions) is staggered and further optimizes the fluid path, reducing the possibility of the cooling medium flowing back to the conical inlet chamber 5.

[0067] The misaligned flow-blocking structure 7 can create a series of local pressure changes in the fluid path. These changes help to disperse and reduce the pressure of the cooling medium backflow, so that the cooling medium can be stably discharged along the predetermined path instead of flowing in the opposite direction, thereby reducing the thermal resistance and energy loss inside the system.

[0068] The staggered arrangement of the flow-blocking structure 7 also helps to suppress fluid turbulence and guide the cooling medium to flow towards the cooling medium outlet 22. Turbulence increases the kinetic energy loss of the fluid, while the staggered flow-blocking structure 7 can reduce this loss, ensuring efficient discharge of the cooling medium, especially effective for gaseous substances, as gaseous substances are more susceptible to the effects of turbulence.

[0069] During the heat exchange process, the cooling medium is partially converted into a gaseous substance. This process is accompanied by a large amount of heat energy absorption. The grouping arrangement of the flow-blocking structure 7 can ensure that the heat energy of the gaseous substance is fully managed before it reaches the cooling medium outlet 22, reducing unnecessary heat energy loss and improving the heat energy utilization efficiency of the entire heat dissipation structure.

[0070] Example 2

[0071] This application also provides an electronic device, which includes a target component and a heat dissipation structure for dissipating heat from the target component, wherein the heat dissipation structure is the aforementioned heat dissipation structure.

[0072] The above provides a detailed description of the heat dissipation structure and electronic device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat dissipation structure, characterized in that, include: A substrate (1) is used to contact the target component; Cover plate (2), the cover plate (2) is disposed on the substrate (1) to form a receiving space together with the substrate (1). The cover plate (2) has a cooling medium inlet (21) and a cooling medium outlet (22) to introduce the cooling medium into the receiving space through the cooling medium inlet (21) to dissipate heat from the target component, and to lead out the dissipated cooling medium through the cooling medium outlet (22). Multiple heat dissipation components (3) are disposed on the substrate (1) and located within the accommodating space. A heat dissipation channel is formed between two adjacent heat dissipation components (3). The two ends of the heat dissipation channel are respectively used to communicate with the cooling medium inlet (21) and the cooling medium outlet (22). Along the arrangement direction from the cooling medium inlet (21) to the cooling medium outlet (22), the distance between the side of each heat dissipation component (3) that is relatively close to the cover plate (2) and the inner top wall of the cover plate (2) gradually decreases, so that at least part of the gaseous substance formed by the cooling medium entering the cover plate (2) after dissipating heat on the target component flows out through the cooling medium outlet (22) through the heat dissipation channel.

2. The heat dissipation structure according to claim 1, characterized in that, Each of the heat dissipation components (3) includes a first heat dissipation component (31) and a second heat dissipation component (32). The first heat dissipation component (31) is disposed on the substrate (1), and the second heat dissipation component (32) is disposed on the side of the first heat dissipation component (31) away from the substrate (1). Along the arrangement direction from the cooling medium inlet (21) to the cooling medium outlet (22), the distance between the side of the first heat dissipation component (31) relatively close to the cover plate (2) and the inner top wall of the cover plate (2) is equal, and the distance between the side of the second heat dissipation component (32) relatively close to the cover plate (2) and the inner top wall of the cover plate (2) gradually decreases.

3. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure also includes a plurality of auxiliary heat dissipation pipes (4), which are arranged one-to-one with the plurality of heat dissipation channels. Each of the auxiliary heat dissipation pipes (4) is arranged on the inner top wall of the cover plate (2), and both ends of each of the auxiliary heat dissipation pipes (4) are connected to the accommodating space. The outlet end of each of the auxiliary heat dissipation pipes (4) is arranged relatively close to the cooling medium outlet (22) so that at least part of the gaseous substance formed after the target component is cooled by the cooling medium flows out through the cooling medium outlet (22) through each of the auxiliary heat dissipation pipes (4).

4. The heat dissipation structure according to claim 3, characterized in that, Each of the auxiliary heat dissipation pipes (4) includes a main pipe (41) and multiple branch pipes (42). The main pipe (41) is disposed on the inner top wall of the cover plate (2). The main pipe (41) extends along the arrangement direction from the cooling medium inlet (21) to the cooling medium outlet (22). The multiple branch pipes (42) are disposed on the side of the main pipe (41) away from the cover plate (2). The inlet end of the multiple branch pipes (42) is connected to the heat dissipation channel, and the outlet end of the multiple branch pipes (42) is connected to the main pipe (41), so that at least part of the gaseous substance enters the main pipe (41) through the multiple branch pipes (42) and enters the cooling medium outlet (22) through the main pipe (41).

5. The heat dissipation structure according to claim 1, characterized in that, The accommodating space includes a conical inlet chamber (5), an accommodating chamber, and a conical outlet chamber (6) that are connected to each other. The conical inlet chamber (5) is connected to the cooling medium inlet (21), and the conical outlet chamber (6) is connected to the cooling medium outlet (22). Along the arrangement direction from the cooling medium inlet (21) to the cooling medium outlet (22), the flow cross-sectional area of ​​the conical inlet chamber (5) gradually increases, and the flow cross-sectional area of ​​the conical outlet chamber (6) gradually decreases. Multiple heat dissipation components (3) are arranged in the accommodating chamber.

6. The heat dissipation structure according to claim 5, characterized in that, The heat dissipation structure also includes multiple flow-blocking structures (7), all of which are disposed in the conical outlet chamber (6). Each flow-blocking structure (7) has a flow-blocking surface, and each flow-blocking surface is disposed toward the cooling medium outlet (22).

7. The heat dissipation structure according to claim 6, characterized in that, Each of the flow-blocking structures (7) includes a flow-blocking body (71), and each of the flow-blocking bodies (71) has an arc-shaped flow-blocking surface.

8. The heat dissipation structure according to claim 7, characterized in that, Each of the flow-blocking structures (7) further includes a flow-guiding body (72), each of the flow-guiding bodies (72) is disposed in the flow-blocking surface corresponding to it, and forms a flow-blocking gap with the flow-blocking surface, so that part of the cooling medium and part of the gaseous substance flowing back from the conical outlet cavity enter the flow-blocking gap.

9. The heat dissipation structure according to claim 6, characterized in that, Multiple flow-blocking structures (7) form a flow-blocking group, and there are multiple flow-blocking groups. The flow-blocking structures (7) in each flow-blocking group are staggered.

10. An electronic device, comprising a target component and a heat dissipation structure for dissipating heat from the target component, characterized in that, The heat dissipation structure is the heat dissipation structure described in any one of claims 1 to 9.

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