Horizontal automatic measurement module of chip mounting equipment scaling powder platform

Abstract

The invention provides a horizontal automatic measurement module for a chip mounting equipment scaling powder platform, and the module is characterized in that a tool changing platform is connected to a workbench of flip chip mounting equipment through a bolt, and a horizontal test accessory and a chip adsorption accessory are arranged on the tool changing platform in a penetrating manner; the tool dismounting module is arranged on one side of the tool changing platform; during detection, the equipment pauses the chip mounting operation, and the mechanical arm drives the chip adsorption accessory to move to the position over the knife disassembling module; the manipulator pushes one of the two rows of loaded chip adsorption accessories to enter an accessory placing hole; an air cylinder in the cutter dismounting module pushes a cutter dismounting push plate to move back and forth along a guide rail to apply external force to a chip adsorption accessory in an accessory placing hole so as to complete dismounting of the chip adsorption accessory; the manipulator moves to a position above the tool changing platform to clamp a horizontal test accessory corresponding to the required chip; the mechanical arm moves to the position above the scaling powder platform, and horizontal confirmation is carried out by pushing the horizontal testing accessories to make contact with the end faces of the four corners of the scaling powder platform downwards.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment management, and more particularly to the field of flux platform level detection, specifically an automatic measurement module for flux platform level of a chip mounting equipment. Background Technology

[0002] In the semiconductor packaging field, flip chip equipment is a device that uses a placement head to pick up and separate diced chips and then attach them to a substrate containing circuit layers. Since a certain amount of flux adhesive is required during product soldering, the horizontal state of the flux platform directly affects the quality of the product.

[0003] Currently, after the flux is replaced, the flux platform level is checked by manually changing the measuring fixture. This method has problems such as low work efficiency and easy glue contamination, wasting a lot of manpower and resources. A more scientific and convenient system needs to be developed to improve this problem. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide an automatic horizontal measurement module for the flux platform of a chip mounting equipment, which solves the difficulties of the prior art.

[0005] To achieve the above and other related objectives, the present invention provides an automatic horizontal measurement module for the flux platform of a chip mounting equipment, comprising:

[0006] Tool changing platform 1 is bolted to the workbench of flip-chip placement equipment. Horizontal test accessory 131 and chip adsorption accessory 14 are mounted on the tool changing platform 1.

[0007] Tool disassembly module 2, which is disposed on one side of the tool changing platform 1;

[0008] Flux platform 3, wherein a flux carrier box 31 is embedded in the center of the flux platform 3.

[0009] According to the preferred scheme, the tool changing platform 1 includes:

[0010] Inspection tool mounting holes 11 are evenly spaced on one side of the tool changing platform 1;

[0011] Chip nozzle mounting holes 12 are evenly spaced on the side of the tool changing platform 1 away from the fixture mounting holes 11;

[0012] The device includes a horizontal testing accessory 131 and a chip adsorption accessory 14. A support rod 17 is centrally located in both the horizontal testing accessory 131 and the chip adsorption accessory 14. A robotic arm handle 15 is integrally mounted on the top of the support rod 17. A platform placement sleeve 16 is integrally mounted on the outer side of the middle section of the support rod 17. A detection head 131 is integrally mounted on the bottom of the support rod 17 in the horizontal testing accessory 131. A vacuum nozzle 141 is mounted on the bottom of the support rod 17 in the chip adsorption accessory 14. An airflow channel is centrally located in the support rod 17 of the chip adsorption accessory 14.

[0013] According to the preferred embodiment, the outer diameters of the robotic arm handle 15 and the platform placement sleeve 16 in the horizontal testing accessory 131 and the chip adsorption accessory 14 are the same.

[0014] According to a preferred embodiment, the detection head 131 is conical, and the bottom detection surface is arc-shaped, the size of which is the same as the size of the chip to be mounted.

[0015] According to the preferred embodiment, the blade removal module 2 includes:

[0016] Guide rail 21, the guide rail 21 is U-shaped, and guide strips 22 are integrally provided on the inner sidewalls of the left and right sides of the guide rail 21;

[0017] The knife-removing push plate 23 is L-shaped. The top of the knife-removing push plate 23 is engaged with the guide rail 21 and abuts against the guide strip 22. One side of the bottom of the knife-removing push plate 23 abuts against the front or right side wall of the guide rail 21. The knife-removing push plate 23 is provided with accessory placement holes 24 spaced apart. The top of the accessory placement holes 24 is provided with accessory positioning grooves 25.

[0018] Cylinder 26 is located on one side of guide rail 21. Cylinder rod 261 passes through the center of cylinder 26. Push block 262 is integrally provided on the top of cylinder rod 261. Push block 262 is connected to disassembly tool push plate 23 by bolts.

[0019] According to the preferred embodiment, the inner diameter of the accessory positioning groove 25 is the same as the outer diameter of the platform placement sleeve 16.

[0020] This invention employs a tool changing platform and a tool disassembly module; by optimizing the original manual inspection design logic of the equipment, the following beneficial effects are achieved:

[0021] (1) It can realize the automated plane detection process of flux platform to confirm whether its plane level is out of tolerance, and ensure that the chip can be evenly dipped in flux.

[0022] The preferred embodiments of the invention will be described in more detail below with reference to the accompanying drawings, so as to facilitate an understanding of the features and advantages of the invention. Attached Figure Description

[0023] Figure 1 The diagram shows the locations of the tool changing platform, tool disassembly module, and flux platform of the present invention.

[0024] Figure 2 The diagram shown is an enlarged three-dimensional structural schematic of the horizontal testing accessory in this invention.

[0025] Figure 3 The diagram shown is an enlarged three-dimensional structural schematic of the chip adsorption accessory in this invention.

[0026] Figure 4 The diagram shown is an enlarged three-dimensional structural schematic of the guide rail in this invention.

[0027] Figure 5 The diagram shown is an enlarged three-dimensional structural schematic of the blade-removing push plate in this invention.

[0028] Figure 6 This is the display window for the horizontal position information of the device control terminal after detection according to the present invention.

[0029] Label Explanation

[0030] 1. Tool changing platform;

[0031] 11. Inspection fixture mounting hole; 12. Chip suction nozzle mounting hole; 13. Horizontal testing accessories; 131. Detection head; 14. Chip adsorption accessories; 141. Vacuum suction nozzle; 15. Robotic arm gripping handle; 16. Platform placement sleeve; 17. Support rod;

[0032] 2. Tool disassembly module;

[0033] 21. Guide rail; 22. Guide bar; 23. Tool removal push plate; 24. Parts placement hole; 25. Parts positioning slot; 26. Cylinder; 261. Cylinder rod; 262. Push block;

[0034] 3. Flux platform; 31. Flux carrier box; Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0036] Compared to the embodiments shown in the accompanying drawings, feasible embodiments within the scope of protection of this invention may have fewer components, other components not shown in the drawings, different components, components arranged differently, or components with different connections, etc. Furthermore, two or more components in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.

[0037] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms “first,” “second,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, “an” or “a” and similar terms do not necessarily indicate a quantity limitation. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the element or object listed following the word and its equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0038] This invention proposes an automatic measurement module for the level of the flux platform in a chip mounting equipment, used in the flux platform level detection process. This invention does not limit the type of flux platform, but the structure of the tool changing platform 1 and the tool removal module 2 is particularly suitable for detecting the flux platform before chip mounting.

[0039] In general, the automatic horizontal measurement module for the flux platform of the chip mounting equipment proposed in this invention mainly includes: a tool changing platform 2 and a tool removal module 2. (See also...) Figure 1 It shows the arrangement of the tool changing platform 2 and the tool disassembly module 2.

[0040] The detection logic of the automatic measurement module for flux platform level in the chip mounting equipment proposed in this invention includes:

[0041] S1: The equipment pauses the chip placement operation, and the robotic arm moves the chip adsorption accessory 14 to directly above the blade removal module 2.

[0042] S2: The robotic arm pushes one of the two rows of chip adsorption accessories 14 into the accessory placement hole 24;

[0043] S3: In the disassembly module 2, the cylinder 26 pushes the disassembly push plate 23 to move back and forth along the guide rail 21, applying external force to the chip adsorption accessory 14 in the accessory placement hole 24 to complete the disassembly of the chip adsorption accessory 14.

[0044] S4: The robotic arm moves above the tool changing platform 1 and clamps the horizontal test accessory 131 corresponding to the required chip;

[0045] S5: The robotic arm moves above the flux platform 3 and pushes the horizontal test accessory 131 downward to contact the four corner end faces of the flux platform 3 to confirm the horizontality;

[0046] S6: The detection information is displayed synchronously on the equipment control terminal for easy personnel status confirmation.

[0047] The automatic horizontal measurement module for the flux platform of the chip mounting equipment proposed in this invention can also change tools when different chips need to be mounted. During mechanical preparation, the second set of chip adsorption accessories 14 to be replaced is placed on one of the accessory placement holes 24 in the tool changing platform 1 and the tool removal module 2. When the processing batch changes and tool change is required, the operation logic is as follows:

[0048] S1: The robotic arm moves the first set of chip adsorption accessories 14 to the top of the disassembly module 2, and pushes one row of chip adsorption accessories 14 into the empty accessory placement hole 24 for disassembly.

[0049] S2: The second set of chip adsorption accessories 14 on the robotic arm clamping and disassembly push plate 23;

[0050] S3: The robotic arm pushes the first set of chip adsorption accessories 14 in another row to the replacement accessory placement hole 24 for disassembly;

[0051] S4: The robotic arm moves above the tool changing platform 1 to grab the remaining second set of chip adsorption accessories 14 on the tool changing platform 1, and then performs a horizontal detection.

[0052] It should be noted that the accessory placement holes 24 in the tool removal module 2 have one more hole per row than the loading position per row on the robotic arm; otherwise, horizontal detection cannot be performed after tool replacement.

[0053] The aforementioned tool changing platform 1 is bolted to the workbench of the flip-chip placement equipment. A horizontal testing accessory 131 and a chip suction accessory 14 are mounted on the tool changing platform 1. Gripper holes 11 are evenly spaced on one side of the tool changing platform 1, and chip suction nozzle holes 12 are located on the other side. A support rod 17 is centrally located between the horizontal testing accessory 131 and the chip suction accessory 14. A robotic arm handle 15 is integrally mounted on the top of the support rod 17, and a platform placement sleeve 16 is integrally mounted on the outer side of the middle section of the support rod 17. A detection head 131 is integrally mounted on the bottom of the support rod 17 within the horizontal testing accessory 131. The chip suction accessory... In component 14, a vacuum nozzle 141 is provided at the bottom of the support rod 17. An airflow channel is provided in the center of the support rod 17 in the chip adsorption accessory 14. The outer diameters of the robotic arm gripping handle 15 and the platform placement sleeve 16 in the horizontal test accessory 131 and the chip adsorption accessory 14 are the same. It should be noted that the horizontal test accessory 131 and the chip adsorption accessory 14 adopt a standardized interface design. They can be directly gripped by the robotic arm without any adjustment or by any accessory below the tool removal module 2, just like the automatic tool changing system of a machining center. It should also be noted that the bottom is a conical detection head, and the curvature of its arc detection surface matches the size of the chip to be mounted.

[0054] The aforementioned tool removal module 2 is located on one side of the tool changing platform 1. This module is the core for realizing the part replacement action. It mainly consists of a U-shaped guide rail 21, an L-shaped tool removal push plate 23, and a cylinder 26. The guide rail 21 has guide strips 22 integrally installed on the inner sidewalls of both sides. In addition to supporting and guiding the tool removal push plate 23, the guide strips 22 also form a clearance space for the parts at the bottom. The top of the tool removal push plate 23 is engaged with the guide rail 21 and abuts against the guide strips 22. One side of the bottom of the tool removal push plate 23 abuts against the front or right sidewall of the guide rail 21. The tool removal push plate 23 has part placement holes 24 spaced apart. The top of the part placement holes 24 has a part positioning groove 25. The cylinder 26 is located on one side of the guide rail 21. A cylinder rod 261 passes through the center of the cylinder 26. A push block 262 is integrally installed on the top of the cylinder rod 261. The push block 262 is connected to the tool removal push plate 23 by bolts.

[0055] The flux platform 3 is equipped with a flux carrier box 31 embedded in the center. The flux platform 3 is an existing flux dipping system device.

[0056] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. An automatic horizontal measurement module for flux platform of a chip mounting equipment, characterized in that, include: Tool changing platform (1), the tool changing platform (1) is bolted to the workbench of the flip-chip placement equipment, and the tool changing platform (1) is equipped with a horizontal test accessory (131) and a chip adsorption accessory (14); Tool disassembly module (2), wherein the tool disassembly module (2) is disposed on one side of the tool changing platform (1); Flux platform (3), with a flux carrier box (31) embedded in the center of the flux platform (3).

2. The automatic horizontal measurement module for flux platform of the chip mounting equipment according to claim 1, characterized in that, The tool changing platform (1) includes: The tool mounting holes (11) are evenly spaced on one side of the tool changing platform (1); Chip nozzle mounting holes (12) are evenly spaced on the side of the tool changing platform (1) away from the fixture mounting holes (11); The horizontal testing accessory (131) and the chip adsorption accessory (14) are provided with a support rod (17) in the center of the horizontal testing accessory (131) and the chip adsorption accessory (14). The top of the support rod (17) is integrally provided with a robotic arm handle (15). The outer side of the middle section of the support rod (17) is integrally provided with a platform placement sleeve (16). The bottom of the support rod (17) in the horizontal testing accessory (131) is integrally provided with a detection head (131). The bottom of the support rod (17) in the chip adsorption accessory (14) is provided with a vacuum nozzle (141). An airflow channel is provided in the center of the support rod (17) in the chip adsorption accessory (14).

3. The automatic horizontal measurement module for flux platform of the chip mounting equipment according to claim 2, characterized in that, The outer diameters of the robotic arm gripper (15) and the platform placement sleeve (16) in the horizontal testing accessory (131) and chip adsorption accessory (14) are the same.

4. The automatic horizontal measurement module for flux platform of the chip mounting equipment according to claim 3, characterized in that, The detection head (131) is conical, and the bottom detection surface is arc-shaped. The size of the arc is the same as the size of the chip to be mounted.

5. The automatic horizontal measurement module for flux platform of the chip mounting equipment according to claim 4, characterized in that, The blade removal module (2) includes: The guide rail (21) is U-shaped, and guide strips (22) are integrally provided on the inner sidewalls of the left and right sides of the guide rail (21); The knife-removing push plate (23) is L-shaped. The top of the knife-removing push plate (23) is stuck on the guide rail (21) and abuts against the guide strip (22). The bottom side of the knife-removing push plate (23) abuts against the front or right side wall of the guide rail (21). The knife-removing push plate (23) is provided with accessory placement holes (24) spaced apart. The top of the accessory placement holes (24) is provided with accessory positioning grooves (25). The cylinder (26) is located on one side of the guide rail (21). A cylinder rod (261) is inserted through the center of the cylinder (26). A push block (262) is integrally provided on the top of the cylinder rod (261). The push block (262) is connected to the disassembly knife push plate (23) by bolts.

6. The automatic horizontal measurement module for flux platform of the chip mounting equipment according to claim 5, characterized in that, The inner diameter of the accessory positioning groove (25) is the same as the outer diameter of the platform placement sleeve (16).

7. The detection logic of the automatic measurement module for flux platform level in the chip mounting equipment proposed in this invention includes: S1: The equipment pauses the chip placement operation, and the robotic arm moves the chip adsorption accessory (14) to directly above the chip removal module (2); S2: The robotic arm pushes one of the two rows of chip adsorption accessories (14) into the accessory placement hole (24); S3: The cylinder (26) in the disassembly module (2) pushes the disassembly push plate (23) to move back and forth along the guide rail (21) to apply external force to the chip adsorption accessory (14) in the accessory placement hole (24) to complete the disassembly of the chip adsorption accessory (14); S4: The robotic arm moves to the tool change platform (1) and clamps the horizontal test accessory (131) corresponding to the required chip; S5: The robot arm moves above the flux platform (3) and pushes the horizontal test accessory (131) downward to contact the four corner end faces of the flux platform (3) to confirm the horizontality; S6: The detection information is displayed synchronously on the equipment control terminal for easy personnel status confirmation.

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