Feeding device of semiconductor panel-level forming system

Abstract

The invention relates to the technical field of semiconductor packaging technology, and provides a feeding device of a semiconductor panel-level forming system, which comprises a bottom plate, and a resin feeding assembly, a tray transfer assembly and a film coating assembly are sequentially mounted on the bottom plate; the resin feeding assembly comprises a rotating table and a first air cylinder for driving the rotating table to rotate in the circumferential direction, the rotating table is installed on the bottom plate, a material storage bin is arranged above the rotating table, a vibrator is installed at the bottom of the material storage bin, and a material opening adjusting assembly is arranged at a discharging opening of the material storage bin; the first cylinder is hinged to the bottom plate, and the output end is hinged to the rotating table; by means of the integrated design that film coating is conducted firstly and then feeding is conducted, the whole technological process is optimized, resin feeding and release film laying are integrated in sequence, accurate connection is conducted through the tray transfer assembly, and a smooth automatic workflow is formed; resin spreading is ensured on the basis of a firm and flat film, mutual interference between procedures is avoided, and therefore the performance of a single link is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and more specifically to a feeding device for a semiconductor panel-level molding system. Background Technology

[0002] In the panel-level packaging (PLP) molding process, a release film is first laid on the surface of the mold cavity of the tray mold. Then, resin particles (such as epoxy molding compound EMC) are precisely and uniformly delivered and spread onto the release film surface. This process is crucial to ensuring the molding quality of the final product; however, existing technologies have some shortcomings in this step:

[0003] Firstly, regarding resin feeding, most existing devices have a simplistic design and insufficient reliability. They generally employ a single feeding channel; if resin particles become blocked in this channel, the entire feeding process must be interrupted for cleaning, causing production line shutdown and severely restricting production efficiency and continuity. Simultaneously, existing feeding mechanisms often lack flexible adjustment capabilities. The inclination angle of the feeding plate is usually fixed and cannot be optimized according to the different flow characteristics of resin particles, affecting both the smoothness of feeding and making it difficult to achieve the process requirement of uniform resin spreading on the tray surface.

[0004] Secondly, automation and precision are the main bottlenecks in release film processing. Traditional methods struggle to achieve automatic gripping, tensioning, fixed-length traction, and precise flattening of the release film, resulting in inaccurate alignment with the tray and disrupting the reference plane for subsequent resin feeding.

[0005] Furthermore, resin feeding and release film application are typically designed as two separate processes, lacking integrated and coordinated control. This not only increases the number of process steps and time, but may also lead to damage to the already laid release film due to mismatch between the resin and the film surface during resin delivery, or cause resin spillage.

[0006] To address the aforementioned problems, we propose a feeding device for a semiconductor panel-level molding system. Summary of the Invention

[0007] To address the shortcomings of existing technologies, this invention provides a feeding device for a semiconductor panel-level molding system. This device overcomes the deficiencies of existing technologies by employing a resin feeding assembly that includes a rotary table, a vibrator, and a feed nozzle adjustment component. This enables multi-station cyclic operation, with vibration ensuring smooth resin flow and the feed nozzle adjustment component, which can precisely adjust the nozzle diameter, effectively controlling the amount and speed of material feeding. This ensures the uniformity of subsequent material spreading from the source and lays a solid foundation for molding quality.

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] A feeding device for a semiconductor panel-level molding system includes a base plate, on which a resin feeding assembly, a tray transfer assembly, and a film coating assembly are sequentially mounted.

[0010] The resin feeding assembly includes a rotary table and a first cylinder that drives the rotary table to rotate circumferentially. The rotary table is mounted on a base plate and has a storage chamber above it. A vibrator is installed at the bottom of the storage chamber, and a discharge port adjustment assembly is provided at the discharge port of the storage chamber. The first cylinder is hinged to the base plate and its output end is hinged to the rotary table.

[0011] At least two receiving hoppers are provided below the material inlet adjustment assembly. Each receiving hopper has a feeding plate at its outlet. A vibrator and an angle adjustment frame are arranged in sequence below the feeding plate. The angle adjustment frame is installed on the base plate.

[0012] The film-coating assembly includes a film-coating bracket, which is disposed on a base plate and located between the resin feeding assembly and the tray transfer assembly. One side of the film-coating bracket is provided with a support roller and a guide roller for unwinding the release film. The support roller and the guide roller are both movably mounted on the film-coating bracket. The film-coating bracket is also provided with a drive motor for driving the support roller to rotate.

[0013] Along the direction of unwinding the release film, the film-coating bracket is sequentially provided with a rear film clamping mechanism, a front film clamping mechanism, a cleaning and dust collection box, and a tray positioning box. The film-coating bracket is equipped with a film-cutting mechanism directly below the rear film clamping mechanism. The film-coating bracket is also provided with a lifting cylinder for adjusting the height of the cleaning and dust collection box.

[0014] The front-end film clamping mechanism is slidably mounted on the film application bracket, located between the rear-end film clamping mechanism and the cleaning and dust collection box, and is driven by the film pulling drive to adjust the length of the release film covering the tray.

[0015] Preferably, the material outlet adjustment assembly includes a second cylinder and a movable frame. The second cylinder is mounted on the storage chamber and its output end is hinged to the middle of the movable frame. The two ends of the movable frame are respectively hinged to the storage chamber and the movable plate. The movable plate is slidably engaged with the outlet of the storage chamber to adjust the diameter of the outlet.

[0016] Preferably, a height-adjustable vision acquisition bracket is provided above the two receiving hoppers; the vision acquisition bracket is mounted on the base plate.

[0017] Preferably, the pallet transfer assembly includes a pallet and a pallet conveying mechanism. The pallet conveying mechanism is disposed at the bottom of the pallet and is used to drive the pallet to move in mutually perpendicular left-right and front-back directions to achieve precise positioning. The pallet conveying mechanism is mounted on a base plate, and the surface of the pallet is provided with suction cups for adsorbing release film.

[0018] Preferably, the film cutting mechanism includes a cutting drive and a cutter disposed above the cutting drive. The cutting drive drives the cutter to move horizontally to cut off the release film that is pressed by the rear film clamping mechanism and clamped by the front film clamping mechanism.

[0019] The film cutting mechanism is configured such that when the cutter cuts the release film, a section of release film is reserved between the rear clamping mechanism and the cut, and the reserved release film is used for the front clamping mechanism to perform the next clamping operation.

[0020] The clamping part of the front-end clamping mechanism is equipped with an infrared sensor to detect whether the release film is in a clamping state after movement and transfer.

[0021] Preferably, the front-end film clamping mechanism includes a front-end film clamping mounting plate, which is mounted on the film pulling drive component. A front-end upper film clamping pressure plate is provided on one side of the plate, and a front-end lower film clamping pressure plate is provided below to cooperate with and clamp the front-end upper film clamping pressure plate.

[0022] The front end upper clamping plate is provided with a front end clamping guide post assembly that slides in cooperation with the front end clamping mounting plate;

[0023] The front-end membrane clamping drive is mounted on the front-end membrane clamping mounting plate, and its output end is connected to the front-end lower membrane clamping pressure plate.

[0024] Preferably, both the film stretching drive and the cutting drive include a lead screw and a moving platform sleeved on the lead screw. The two ends of the lead screw are rotatably mounted on the film application bracket via bearing seats. The film application bracket is also provided with a servo motor for driving the lead screw to rotate. The front end clamping plate is mounted on the moving platform.

[0025] Preferably, the rear-end clamping mechanism includes a lower rear-end clamping plate and an upper rear-end clamping plate disposed above it, wherein the upper rear-end clamping plate is connected to the output end of the rear-end clamping drive unit mounted on the film-applying bracket;

[0026] The film-applying bracket has rear-end film-clamping guide post assemblies on both sides of the rear-end film-clamping drive component, which are used to guide the rear-end upper film-clamping pressure plate to move linearly.

[0027] This invention provides a feeding device for a semiconductor panel-level molding system. It offers the following advantages: addressing the problem of existing single-path systems being prone to blockages leading to complete line shutdowns, at least two receiving hoppers and feeding plates are installed below the material inlet adjustment component, forming parallel redundant feeding paths. When one path becomes blocked or requires maintenance, the system can immediately switch to another path to continue operation, achieving online switching without stopping the system. This greatly ensures the continuity and stability of production and effectively improves the overall efficiency of the equipment.

[0028] Each feed plate is equipped with an independent angle adjustment bracket, allowing operators to precisely adjust the tilt angle of the feed plate according to the flow characteristics of different resin particles. This not only optimizes the resin flow and prevents clogging at the source, but also ensures that the resin is evenly spread on the release film surface at the optimal angle, providing a high-quality semi-finished product for subsequent molding processes. The flexible and adjustable design allows this device to widely adapt to diverse material and process requirements.

[0029] The film-applying assembly of this invention, through the precise coordination of the rear and front clamping mechanisms, the film-pulling drive, and the film-cutting mechanism, automatically grasps, pulls, tensions, and cuts the release film, ultimately precisely covering the tray surface with a flat, wrinkle-free release film. This provides a flat, stable, and precisely positioned substrate for subsequent resin feeding.

[0030] By integrating the design of "film application first, material feeding later", the overall process flow is optimized. The resin feeding and release film application sequence are integrated and precisely connected by the pallet transfer component, forming a smooth automated workflow. This ensures that the resin is laid on a solid and flat film base, avoiding mutual interference between processes, thereby improving the performance of individual links and achieving efficiency improvement. Attached Figure Description

[0031] Figure 1 This is a three-dimensional schematic diagram of the structure of the present invention;

[0032] Figure 2 This is a schematic diagram of the storage compartment structure of the present invention;

[0033] Figure 3 This is a schematic diagram of the movable frame structure of the present invention;

[0034] Figure 4 This is a schematic diagram of the material receiving hopper structure of the present invention;

[0035] Figure 5 This is a schematic diagram of the cutting mechanism structure of the present invention;

[0036] Figure 6 This is a schematic diagram of the membrane support structure of the present invention;

[0037] Figure 7 This is a schematic diagram of the membrane stretching drive structure of the present invention;

[0038] Figure 8 This is a schematic diagram of the front-end membrane mounting plate structure of the present invention;

[0039] Figure 9 This is a schematic diagram of the front-end lower clamping plate structure of the present invention;

[0040] Figure 10 This is a schematic diagram of the suction cup structure of the present invention;

[0041] Figure 11 This is a schematic diagram of the structure of the film application assembly and the tray transfer assembly of the present invention;

[0042] Figure 12 This is a three-dimensional structural diagram of the film application assembly and the tray transfer assembly of the present invention;

[0043] The attached figures are labeled as follows: 100, base plate; 1, feeding assembly; 2, film-coating assembly; 3, pallet transfer assembly; 11, rotary table; 12, vibrator; 13, storage bin; 14, first cylinder; 21, second cylinder; 22, movable frame; 23, moving plate; 31, vision acquisition bracket; 32, receiving hopper; 33, adjusting frame; 34, feeding plate; 41, film-coating bracket; 42, support roller; 43, infrared sensor; 44, rear film clamping mechanism; 45, front film clamping mechanism. ; 46. Cleaning and dust collection box; 47. Pallet positioning box; 51. Pallet conveying mechanism; 52. Pallet; 61. Film cutting mechanism; 71. Rear end film clamping drive; 72. Rear end upper film clamping pressure plate; 461. Lifting cylinder; 421. Guide roller; 422. Drive motor; 451. Film pulling drive; 452. Front end film clamping mounting plate; 453. Front end film clamping guide column assembly; 454. Front end lower film clamping pressure plate; 521. Suction cup; 611. Cutter; 612. Cutting drive. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] See attached document Figures 1-12 As shown, a feeding device for a semiconductor panel-level molding system includes a base plate 100, on which a resin feeding assembly 1, a tray transfer assembly 3, and a film coating assembly 2 are sequentially mounted.

[0046] The resin feeding assembly 1 includes a rotary table 11 and a first cylinder 14 that drives the rotary table 11 to rotate circumferentially. The rotary table 11 is mounted on a base plate 100, and a storage chamber 13 is provided above it. A vibrator 12 is installed at the bottom of the storage chamber 13, and a discharge port adjustment assembly is provided at the discharge port of the storage chamber 13. The first cylinder 14 is hinged to the base plate 100 and its output end is hinged to the rotary table 11.

[0047] At least two receiving hoppers 32 are provided below the material outlet adjustment assembly. Each receiving hopper 32 is provided with a feeding plate 34 at its outlet. A vibrator 12 and an angle adjustment frame 33 are arranged in sequence below the feeding plate 34. The angle adjustment frame 33 is installed on the base plate 100.

[0048] The film-coating assembly 2 includes a film-coating bracket 41, which is disposed on the base plate 100 and located between the resin feeding assembly 1 and the tray transfer assembly 3. One side of the film-coating bracket 41 is provided with a support roller 42 and a guide roller 421 for unwinding the release film. The support roller 42 and the guide roller 421 are both movably mounted on the film-coating bracket 41. The film-coating bracket 41 is also provided with a drive motor 422 for driving the support roller 42 to rotate.

[0049] Along the direction of unwinding the release film, the film-coating bracket 41 is sequentially provided with a rear end film clamping mechanism 44, a front end film clamping mechanism 45, a cleaning and dust collection box 46, and a tray positioning box 47. The film-coating bracket 41 is equipped with a film cutting mechanism 61 directly below the rear end film clamping mechanism 44. The film-coating bracket 41 is also provided with a lifting cylinder 461 for adjusting the height of the cleaning and dust collection box 46.

[0050] The front-end film clamping mechanism 45 is slidably mounted on the film-applying bracket 41, located between the rear-end film clamping mechanism 44 and the cleaning and dust collection box 46, and is driven by the film-pulling drive component 451 to adjust the length of the release film covering the tray 52.

[0051] The material outlet adjustment assembly includes a second cylinder 21 and a movable frame 22. The second cylinder 21 is mounted on the storage chamber 13 and its output end is hinged to the middle of the movable frame 22. The two ends of the movable frame 22 are respectively hinged to the storage chamber 13 and the movable plate 23. The movable plate 23 is slidably engaged with the outlet of the storage chamber 13 to adjust the diameter of the outlet.

[0052] Above the two receiving hoppers 32 is a height-adjustable vision acquisition bracket 31; the vision acquisition bracket 31 is mounted on the base plate 100.

[0053] The pallet transfer assembly 3 includes a pallet 52 and a pallet conveying mechanism 51. The pallet conveying mechanism 51 is located at the bottom of the pallet 52 and is used to drive the pallet 52 to move in mutually perpendicular left-right and front-back directions to achieve precise positioning. The pallet conveying mechanism 51 is mounted on the base plate 100. The surface of the pallet 52 is provided with suction cups 521 for adsorbing release film.

[0054] The film cutting mechanism 61 includes a cutting drive 612 and a cutter 611 disposed above the cutting drive 612. The cutting drive 612 drives the cutter 611 to move horizontally to cut off the release film that is pressed by the rear clamping mechanism 44 and clamped by the front clamping mechanism 45.

[0055] The film cutting mechanism 61 is configured such that when the cutter 611 cuts the release film, a section of release film is reserved between the rear clamping mechanism 44 and the cut, and the reserved release film is used for the front clamping mechanism 45 to perform the next clamping operation.

[0056] The clamping part of the front-end clamping mechanism 45 is equipped with an infrared sensor 43, which is used to detect whether the release film is in a clamping state after movement and transfer.

[0057] The front-end film clamping mechanism 45 includes a front-end film clamping mounting plate 452, which is mounted on the film pulling drive component 451. A front-end upper film clamping pressure plate is provided on one side, and a front-end lower film clamping pressure plate 454 is provided below to cooperate with and clamp the front-end upper film clamping pressure plate.

[0058] The front end upper clamping plate is provided with a front end clamping guide post assembly 453 that slides in cooperation with the front end clamping mounting plate 452;

[0059] The front-end membrane clamping drive is mounted on the front-end membrane clamping mounting plate 452, and its output end is connected to the front-end lower membrane clamping pressure plate 454.

[0060] Both the film stretching drive 451 and the cutting drive 612 include a lead screw and a moving platform sleeved on the lead screw. The two ends of the lead screw are rotatably mounted on the film application bracket 41 through bearing seats. The film application bracket 41 is also provided with a servo motor for driving the lead screw to rotate. The front end clamping film mounting plate 452 is mounted on the moving platform.

[0061] The rear-end clamping mechanism 44 includes a rear-end lower clamping plate and a rear-end upper clamping plate 72 disposed above it. The rear-end upper clamping plate 72 is connected to the output end of the rear-end clamping drive 71 mounted on the film-applying bracket 41.

[0062] The film-coating bracket 41 has rear-end film-coating guide post assemblies on both sides of the rear-end film-coating drive 71, which are used to guide the rear-end upper film-coating pressure plate 72 to move linearly.

[0063] Working principle: First stage: Release film preparation and initial clamping:

[0064] The drive motor 422 starts and drives the support roller 42 to rotate, releasing the rolled release film; the release film passes through the guide roller 421 and is guided to the film application area, and the guide roller 421 ensures that the film enters in a smooth and wrinkle-free manner.

[0065] The rear clamping mechanism 44 operates first: its rear clamping drive 71 pushes the rear upper clamping plate 72 down, cooperating with the rear lower clamping plate to firmly press the starting end of the release film onto the film-applying bracket 41, which serves as the fixed reference point for the entire film-applying process.

[0066] Phase Two: Release Film Grabbing and Traction

[0067] The film-pulling drive 451 is activated, driving the front-end film clamping mechanism 45 (which is currently in the open state) to move along the film-applying bracket 41 towards the rear end, bringing it close to the release film clamped at the rear end. After positioning, the front-end film clamping drive actuates, pushing the front-end lower film clamping plate 454 upward to cooperate with the front-end upper film clamping plate, clamping the release film at the front-end station.

[0068] The front-end clamping guide post assembly 453 ensures that the upper and lower pressure plates move smoothly and are accurately aligned during the clamping process, and the rear-end clamping mechanism 44 releases the release film; the film pulling drive 451 works again, precisely driving the front-end clamping mechanism 45, which has clamped the release film, to move away from the rear end (i.e. towards the tray 52), pulling out the release film of a predetermined length; the drive motor 422 rotates the support roller 42 in a timely manner during the traction process to assist in unwinding and maintain stable film tension; after traction to the desired position, the rear-end clamping mechanism 44 immediately operates again to clamp the release film.

[0069] Phase Three: Tray 52 Positioning and Film Application:

[0070] The pallet conveying mechanism 51 moves an empty pallet 52 into the pallet positioning box 47. The pallet positioning box 47 provides initial constraint and coarse positioning for the pallet 52; subsequently, the pallet conveying mechanism 51 makes fine adjustments based on the reference of the pallet positioning box 47, driving the pallet 52 to move in the left-right (X-axis) and front-back (Y-axis) directions, so that it accurately reaches the "release film laying station".

[0071] The lifting cylinder 461 is activated, driving the cleaning and dust collection box 46 to descend to the surface of the release film, starting and sucking away the dust on the film surface to ensure the cleanliness of the film application; the front clamping mechanism 45 releases the release film; at the same time, the suction cup 521 on the surface of the tray 52 is activated, generating negative pressure to firmly adsorb the release film suspended above it onto the surface of the tray 52.

[0072] The film cutting mechanism 61 starts working: the cutting drive 612 drives the cutter 611 to move horizontally and cut the tensioned release film; the cutting path is precisely set so that after cutting, a piece of film head is still retained at the rear clamping mechanism 44 to prepare for the next cycle; at this time, an independent release film sheet is flatly fixed on the tray 52.

[0073] Phase 4: Resin feeding and spreading

[0074] When the resin feeding assembly 1 is activated, the first cylinder 14 drives the rotary table 11 to rotate, positioning a designated receiving hopper 32 directly below the outlet of the storage chamber 13. The vibrator 12 at the bottom of the storage chamber 13 is activated to prevent resin particles from bridging and clogging at the outlet. The discharge port adjustment assembly then operates: the second cylinder 21 drives the moving plate 23 to slide via the movable frame 22, adjusting the outlet opening and controlling the resin flow rate. The resin falls into the receiving hopper 32, and the vision system on the vision acquisition bracket 31 monitors the material level within the receiving hopper 32.

[0075] Resin falls from the receiving hopper 32 into the feeding plate 34. The vibrator 12 below the feeding plate 34 works to promote resin flow. The angle adjustment frame 33 has been pre-adjusted to the optimal tilt angle so that the resin can be conveyed and spread evenly on the release film fixed on the surface of the tray 52 with a uniform flow rate and distribution.

[0076] Phase 5: System Reset and Looping

[0077] After the front-end film clamping mechanism 45 releases the film, the infrared sensor 43 at its clamping part detects and confirms that the release film has been completely detached; the film pulling drive 451 drives the front-end film clamping mechanism 45 to return to the initial position, ready for the next gripping.

[0078] The pallet conveying mechanism 51 removes the pallet 52 with the resin laid material and sends it to the next molding station; the rear clamping mechanism 44 holds the film head in place and waits for the start of the next cycle; a new empty pallet 52 is fed in, and the device repeats the above process.

[0079] If the current feeding path (such as receiving hopper 32A) becomes blocked, the system can immediately control the rotary table 11 to switch to another receiving hopper 32 (such as receiving hopper 32B) to continue feeding, thus achieving non-stop operation.

[0080] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A feeding device for a semiconductor panel-level molding system, characterized in that, The base plate includes a resin feeding assembly, a pallet transfer assembly, and a film coating assembly, which are sequentially mounted on the base plate. The resin feeding assembly includes a rotary table and a first cylinder that drives the rotary table to rotate circumferentially. The rotary table is mounted on a base plate and has a storage chamber above it. A vibrator is installed at the bottom of the storage chamber, and a discharge port adjustment assembly is provided at the discharge port of the storage chamber. The first cylinder is hinged to the base plate and its output end is hinged to the rotary table. At least two receiving hoppers are provided below the material inlet adjustment assembly. Each receiving hopper has a feeding plate at its outlet. A vibrator and an angle adjustment frame are arranged in sequence below the feeding plate. The angle adjustment frame is installed on the base plate. The film-coating assembly includes a film-coating bracket, which is disposed on a base plate and located between the resin feeding assembly and the tray transfer assembly. One side of the film-coating bracket is provided with a support roller and a guide roller for unwinding the release film. The support roller and the guide roller are both movably mounted on the film-coating bracket. The film-coating bracket is also provided with a drive motor for driving the support roller to rotate. Along the direction of unwinding the release film, the film-coating bracket is sequentially provided with a rear film clamping mechanism, a front film clamping mechanism, a cleaning and dust collection box, and a tray positioning box. The film-coating bracket is equipped with a film-cutting mechanism directly below the rear film clamping mechanism. The film-coating bracket is also provided with a lifting cylinder for adjusting the height of the cleaning and dust collection box. The front-end film clamping mechanism is slidably mounted on the film application bracket, located between the rear-end film clamping mechanism and the cleaning and dust collection box, and is driven by the film pulling drive to adjust the length of the release film covering the tray.

2. The feeding device for a semiconductor panel-level molding system according to claim 1, characterized in that, The material outlet adjustment assembly includes a second cylinder and a movable frame. The second cylinder is mounted on the storage chamber and its output end is hinged to the middle of the movable frame. The two ends of the movable frame are respectively hinged to the storage chamber and the movable plate. The movable plate is slidably engaged with the outlet of the storage chamber to adjust the diameter of the outlet.

3. The feeding device for a semiconductor panel-level molding system according to claim 1, characterized in that, The two receiving hoppers are equipped with height-adjustable vision acquisition brackets; the vision acquisition brackets are mounted on the base plate.

4. The feeding device for a semiconductor panel-level molding system according to claim 1, characterized in that, The pallet transfer assembly includes a pallet and a pallet conveying mechanism. The pallet conveying mechanism is located at the bottom of the pallet and is used to drive the pallet to move in mutually perpendicular left-right and front-back directions to achieve precise positioning. The pallet conveying mechanism is mounted on a base plate, and the surface of the pallet is provided with suction cups for adsorbing release film.

5. The feeding device for a semiconductor panel-level molding system according to claim 1, characterized in that, The film cutting mechanism includes a cutting drive and a cutter disposed above the cutting drive. The cutting drive drives the cutter to move horizontally to cut off the release film that is pressed by the rear film clamping mechanism and clamped by the front film clamping mechanism. The film cutting mechanism is configured such that when the cutter cuts the release film, a section of release film is reserved between the rear clamping mechanism and the cut, and the reserved release film is used for the front clamping mechanism to perform the next clamping operation. The clamping part of the front-end clamping mechanism is equipped with an infrared sensor to detect whether the release film is in a clamping state after movement and transfer.

6. The feeding device for a semiconductor panel-level molding system according to claim 1, characterized in that, The front-end film clamping mechanism includes a front-end film clamping mounting plate, which is mounted on the film pulling drive component. A front-end upper film clamping pressure plate is provided on one side of the plate, and a front-end lower film clamping pressure plate is provided below to cooperate with and clamp the front-end upper film clamping pressure plate. The front end upper clamping plate is provided with a front end clamping guide post assembly that slides in cooperation with the front end clamping mounting plate; The front-end membrane clamping drive is mounted on the front-end membrane clamping mounting plate, and its output end is connected to the front-end lower membrane clamping pressure plate.

7. The feeding device for a semiconductor panel-level molding system according to claim 6, characterized in that, Both the film stretching drive and the cutting drive include a lead screw and a moving platform sleeved on the lead screw. The two ends of the lead screw are rotatably mounted on the film application bracket through bearing seats. The film application bracket is also equipped with a servo motor for driving the lead screw to rotate. The front end clamping plate is mounted on the moving platform.

8. The feeding device for a semiconductor panel-level molding system according to claim 1, characterized in that, The rear-end clamping mechanism includes a rear-end lower clamping plate and a rear-end upper clamping plate disposed above it. The rear-end upper clamping plate is connected to the output end of the rear-end clamping drive unit mounted on the film-applying bracket. The film-applying bracket has rear-end film-clamping guide post assemblies on both sides of the rear-end film-clamping drive component, which are used to guide the rear-end upper film-clamping pressure plate to move linearly.

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