Semiconductor cooling and efficiency-improving device

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and discloses a semiconductor cooling and efficiency-improving device which comprises two vertically symmetrical closed boxes. Through cooperation of a closed box, a cooler and other structures, a third hydraulic rod contracts, a bearing box and a bearing plate rotate mutually, a guide plate moves outwards through an arc-shaped groove, the end of the guide plate pushes the guide plate to be folded through a telescopic plate, the air exhaust range is narrowed, meanwhile, the pressure is increased, and the air exhaust efficiency is improved. And the corresponding hydraulic rod IV and the hydraulic rod V are controlled to stretch or contract, so that the top of a cone formed by the guide plate points to a high-temperature area on the chip, heat in the high-temperature area is taken away more quickly and efficiently, the cooling time is shortened, the working efficiency is improved, the cooler can preferably cool the whole chip, and the chip cooling efficiency is improved. Therefore, existing cooling work is replaced, then a certain high-temperature area is rapidly cooled, and unnecessary damage to the chip due to the fact that the temperature reduction rate of the high-temperature area is too high is prevented.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing technology, specifically a device for improving the efficiency of semiconductor cooling. Background Technology

[0002] Semiconductors are materials whose conductivity lies between that of conductors and insulators. Their conductivity can be controlled by factors such as doping, temperature, or electric fields. Chips in various circuits are made of semiconductor materials. When current passes through the semiconductor devices inside the chip, energy is lost due to non-ideal conductivity and is ultimately released as heat. In current packaging technologies, the chip needs to be bonded to the packaging material (such as epoxy resin and solder). Direct high-temperature packaging can lead to a mismatch in the coefficient of thermal expansion (CTE), causing delamination or warping. Therefore, it is necessary to reduce the temperature on the chip to ambient temperature. After chip manufacturing is completed, uneven heat distribution may occur in different parts of the chip due to factors such as functional structure design, current density differences, and uneven thermal resistance of materials. In existing technologies, the chip temperature is generally reduced by means of air cooling or liquid cooling. However, these technologies usually cool the chip uniformly. Therefore, after cooling is completed, the temperature of a certain part of the chip may not have decreased. But because the temperature of other parts has reached the process requirements, the equipment mistakenly judges that the cooling work has been completed, which indirectly leads to problems in subsequent packaging. Summary of the Invention

[0003] To address the problems mentioned in the background section, this invention provides a device for improving semiconductor cooling efficiency. This solves the problem that in existing technologies, when cooling chips uniformly using air cooling or liquid cooling, the temperature of a certain part of the chip may not have decreased after cooling, but because the temperature of other parts has reached the process requirements, the equipment may mistakenly judge that the cooling work has been completed, indirectly causing problems in subsequent packaging.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a device for improving the cooling efficiency of semiconductors, comprising two symmetrically arranged enclosed boxes, the two enclosed boxes being connected by a hydraulic rod; Also includes; An adsorption assembly positioned between two enclosed boxes; A set of storage slots is arranged circumferentially on the closed box, and a limiter is arranged circumferentially on the top of the lower closed box. The position of the limiter corresponds to the storage slots, and the limiter is used to fix the position of the chip. An air supply assembly is arranged circumferentially inside the enclosed box, and two of the air supply assemblies are connected by a connector; Coolers arranged in a circumferential array inside a closed box; The lower cooling device includes a carrier box with a set of slots on the top, a set of guide plates circumferentially hinged to the carrier box, the carrier box and each guide plate are connected by a rubber layer, and a telescopic plate is fixedly installed on the outer periphery of the guide plate; The bottom of the carrier box is rotatably engaged with a carrier plate. The carrier box and the carrier plate are connected by a hydraulic rod. The bottom of the carrier plate is provided with a set of arc-shaped grooves in a circumferential direction. The telescopic plate is hinged to the corresponding arc-shaped grooves through a guide plate. The bottom of the enclosed box is slidably engaged with hydraulic rods four and five, which are perpendicular to each other. The ends of hydraulic rods four and five are both connected to the bottom of the support plate. The lower air supply component is connected to an air pump, and the air supply component is connected to the carrier box.

[0005] Preferably, the rubber layer and each guide plate are combined to form a cone shape, with the top of the cone corresponding to the storage groove.

[0006] Preferably, the lower air supply component includes an air box fixed inside the lower sealed box, the air box is connected to an air pipe extending to the outside of the sealed box, the air pipe can be connected to the air outlet of the air pump, and the air box is connected to the carrier box through a rubber tube.

[0007] Preferably, the docking device includes a second hydraulic rod fixed to the outer periphery of the lower closed box, and a sleeve is installed at the top of the second hydraulic rod, which is sleeved on the two air boxes.

[0008] Preferably, the adsorption assembly includes a filter screen that is movably snapped between two closed boxes, a set of filter plates being snapped into the inner wall of the filter screen in a circumferential array, a motor being fixedly installed inside the lower closed box, a fan being driven by the output shaft of the motor, and a slot for fan exhaust being provided on the top of the lower closed box.

[0009] Preferably, the adsorption assembly further includes a guide head fixed to the bottom of the upper closed box, the bottom of the guide head being conical.

[0010] Preferably, the limiter includes a set of rubber rods hinged to the top of the lower closed box, and each set of rubber rods is circumferentially distributed around the periphery of the storage slot; The rubber rod is connected to the top of the closed box by a spring sheet, and a guide ring is fixed to the bottom of the upper end of the closed box. The inner wall of the guide ring is inclined.

[0011] Preferably, the top edge of the rubber rod is inclined, and the spring sheet pulls the rubber rod vertically.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention utilizes a combination of a sealed box and a cooler. The retraction of hydraulic rod three causes the carrier box and carrier plate to rotate relative to each other. A guide plate moves outward through an arc-shaped groove, and the end of the guide plate is pushed by a telescopic plate to fold the guide plate, reducing the range of air exhaust while increasing air pressure. This controls the extension or retraction of corresponding hydraulic rods four and five, causing the top of the guide plate to form a cone pointing towards the hottest area on the chip. This allows for faster and more efficient removal of heat from the high-temperature area, shortening the cooling time and improving efficiency. The cooler can also prioritize cooling the entire chip, replacing existing cooling methods, and then rapidly cool a specific high-temperature area, preventing excessively rapid temperature drops in the high-temperature zone that could cause unnecessary damage to the chip.

[0013] This invention utilizes a combination of a cooler and a sealed box structure. Air is rapidly discharged from the bottom of the chip through the slot at the top of the lower support box, pushing the chip upwards. It is then discharged through the upper support box. However, because the process to enter the upper support box is longer, the air pressure is much lower than that of the lower support box. At this time, the chip is suspended between the two sealed boxes, and the circulating air will better reduce the temperature on the chip. Moreover, the entire chip can be cooled, avoiding the situation in existing air-cooling technology where only one side of the chip is cooled, while the other side may still remain at a high temperature.

[0014] This invention, through the combination of an adsorption component and a cooler, uses a motor-driven fan to rotate, causing the air to flow upwards and impact the bottom of the guide head. Since the guide head is conical, the air is guided to move in all directions and impacts the chip and the upper and lower carrier boxes to expel the air. At this time, the dust on the chip blown out by the air from the carrier boxes will be guided to the filter plate and filter screen and retained there, preventing the dust from returning to the chip or drifting to the outside. This also reduces the possibility of the chip being damaged or scrapped during subsequent power-on testing due to dust. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the external structure of the present invention; Figure 2 This is a schematic diagram of the second working position of the upper closed box of the present invention; Figure 3 This is a schematic diagram of the internal structure of the sealed box of the present invention; Figure 4 This is a schematic diagram of the top structure of the sealed box of the present invention; Figure 5 For the present invention Figure 5 Enlarged view of point A in the middle; Figure 6 This is a schematic diagram of the bottom structure of the cooler of the present invention; Figure 7 This is a schematic diagram of the internal structure of the rubber layer of the present invention; Figure 8 This is a front cross-sectional view of the internal structure of the carrier box of the present invention; Figure 9 This is a schematic diagram of the bottom structure of the support plate of the present invention.

[0016] In the diagram: 1. Enclosed box; 2. Hydraulic rod one; 3. Connector; 31. Hydraulic rod two; 32. Sleeve; 4. Adsorption assembly; 41. Filter screen; 42. Filter plate; 43. Guide head; 44. Motor; 45. Fan; 5. Storage slot; 6. Limiter; 61. Rubber rod; 62. Spring plate; 63. Guide ring; 7. Cooler; 71. Carrier box; 72. Guide plate; 73. Rubber layer; 74. Telescopic plate; 75. Carrier plate; 76. Hydraulic rod three; 77. Arc groove; 78. Hydraulic rod four; 79. Hydraulic rod five; 70. Guide plate; 8. Air supply assembly; 81. Air box; 82. Air pipe. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] like Figures 1 to 9 As shown, the present invention provides a device for improving the cooling efficiency of semiconductors, comprising two symmetrically arranged enclosed boxes 1, which are connected by a hydraulic rod 2. Also includes; An adsorption assembly 4 is positioned between two enclosed boxes 1; A set of storage slots 5 are arranged circumferentially on the closed box 1, and a limiter 6 is arranged circumferentially on the top of the lower closed box 1. The position of the limiter 6 corresponds to the storage slots 5, and the limiter 6 is used to fix the position of the chip. An air supply assembly 8 is arranged circumferentially inside the enclosed box 1, and two of the air supply assemblies 8 are connected by a connector 3; Coolers 7 are arranged in a ring array inside the enclosed box 1; The lower cooling device 7 includes a carrier box 71 with a set of slots on the top. A set of guide plates 72 are circumferentially hinged on the carrier box 71. The carrier box 71 and each guide plate 72 are connected by a rubber layer 73. A telescopic plate 74 is fixedly installed on the outer periphery of the guide plate 72. The bottom of the carrier box 71 is rotatably latched with a carrier plate 75. The carrier box 71 and the carrier plate 75 are connected by a hydraulic rod 76. The bottom of the carrier plate 75 is provided with a set of arc grooves 77 in a circumferential direction. The telescopic plate 74 is hinged to the corresponding arc grooves 77 through a guide plate 70. The bottom of the enclosed box 1 is slidably connected to hydraulic rods 78 and 79, which are perpendicular to each other. The ends of hydraulic rods 78 and 79 are connected to the bottom of the support plate 75. The lower air supply component 8 is connected to an air pump, and the air supply component 8 is connected to the carrier box 71.

[0019] The lower air supply assembly 8 includes an air box 81 fixed inside the lower sealed box 1. An air pipe 82 extending to the outside of the sealed box 1 is connected to the air box 81. The air pipe 82 can be connected to the air outlet of the air pump. The air box 81 is connected to the carrier box 71 through a rubber tube.

[0020] The rubber layer 73 and each guide plate 72 are combined to form a cone shape, with the top of the cone corresponding to the storage groove 5.

[0021] Using the above scheme: First, the hydraulic rod 2 can be controlled to lift the upper closed box 1, so that the robot or manual can place each chip in the storage slot 5 of the lower closed box 1 in sequence, so that it is in a snap-fit ​​state with the storage slot 5. Then, control the hydraulic rod 2 to merge the two closed boxes 1. At this time, start the air pump to compress the air and enter the air supply assembly 8, and then inject it into the carrier box 71 through the air supply assembly 8. Since the two air supply components 8 are also connected through the connector 3, air can circulate inside each carrier box 71. Since the compressed air from the air pump is preferentially connected to the lower air supply component 8, the air will quickly be discharged to the bottom of the chip through the slot at the top of the lower support box 71, thereby pushing the chip upward through air pressure. Then the compressed air will be rapidly discharged through the upper support box 71. However, since the process of entering the upper support box 71 is longer, the air pressure is much lower than that of the lower support box 71. At this time, the chip is suspended between the two closed boxes 1, and the circulating air will better reduce the temperature on the chip. At this time, the entire chip can be cooled, while avoiding the situation in the existing air cooling technology where only one side of the chip is cooled, while the other side may still remain at a high temperature. After the cooling process has been running for a period of time, the position of the chip can be fixed by the limit switch 6. Subsequently, the hydraulic rod 76 retracts, causing the carrier box 71 and the carrier plate 75 to rotate relative to each other. Since the telescopic plate 74 is hinged to the top of the carrier box 71, it can only swing in the vertical direction. When the carrier plate 75 rotates, the guide plate 70 gradually moves outward through the arc groove 77. During this period, the end of the guide plate 70 pushes the telescopic plate 74, causing the end of the telescopic plate 74 to push the guide plate 72 to fold towards the central axis of the carrier box 71, thereby reducing the range of air discharge and increasing the air pressure generated when the air flows. At this time, the corresponding hydraulic rods 78 and 79 are extended or retracted, causing the top of the guide plate 72 to point towards the high-temperature area on the chip. During this period, the other areas are not deliberately cooled. However, due to the limitation of each guide plate 72, the air pressure increases and the airflow speed increases, which can more quickly and efficiently remove the heat from the high-temperature area, shorten the cooling time, and further improve the working efficiency. At the same time, in the initial state, the cooler 7 can prioritize cooling the entire chip, thereby replacing the existing cooling work, and then quickly cooling a certain high-temperature area. This will prevent the temperature of the high-temperature area from dropping too quickly, thus avoiding unnecessary damage to the chip.

[0022] It should be noted that the distance by which hydraulic rods 78 and 79 retract or extend determines the position to which the top of the guide plate 72 points. However, the actual distance depends on the actual heat-generating location of the chip. Different chips with different specifications, sizes, and designs have different high-temperature areas. Therefore, the specific distance by which hydraulic rods 78 and 79 retract or extend is not specified in this article to avoid unnecessary misunderstandings.

[0023] like Figures 1-9 As shown, the docking device 3 includes a hydraulic rod 31 fixed to the outer periphery of the lower closed box 1. A sleeve 32 is installed at the top of the hydraulic rod 31, and the sleeve 32 is sleeved on the two air boxes 81.

[0024] The above scheme is adopted: when the hydraulic rod 2 pushes the upper closed box 1 to rise and finally descends, the top of the hydraulic rod 31 can lift the sleeve 32, and the inner wall of the sleeve 32 is also inlaid with a rubber sealing ring, which can make the two air pipes 82 more tightly connected, thereby avoiding the possibility of air leakage.

[0025] like Figures 1-9 As shown, the adsorption assembly 4 includes a filter screen 41 that is movably snapped between two closed boxes 1. A set of filter plates 42 are snapped into the inner wall of the filter screen 41 in a circumferential array. A motor 44 is fixedly installed inside the lower closed box 1. A fan 45 is driven and installed on the output shaft of the motor 44. A slot for exhaust air from the fan 45 is provided on the top of the lower closed box 1.

[0026] The adsorption assembly 4 also includes a guide head 43 fixed to the bottom of the upper closed box 1, and the bottom of the guide head 43 is conical.

[0027] The above scheme is adopted: when the device starts cooling, the motor 44 starts at the same time, and its output shaft drives the fan 45 to rotate, which pushes the air upward and hits the bottom of the guide head 43. Since the guide head 43 is conical, the air is guided to move in all directions and hits the chip and the upper and lower carrier boxes 71 to discharge the air. At this time, the dust on the chip blown out by the air discharged by the carrier box 71 will be guided to the filter plate 42 and the filter screen 41 and remain on it, preventing the dust from returning to the chip or drifting to the outside. At the same time, it reduces the possibility of the chip being damaged or scrapped during subsequent power-on testing due to dust. It should be noted that the carrier box 71 is snapped onto the closed box 1, while the guide plate 72 is snapped onto the carrier box 71. This indicates that the carrier box 71 and the guide plate 72 are independent mechanisms, and both can be disassembled separately, which facilitates subsequent disassembly, cleaning or replacement, and further improves the ease of use of the device.

[0028] like Figures 1-9 As shown, the limiter 6 includes a set of rubber rods 61 hinged to the top of the lower closed box 1, and each set of rubber rods 61 is circumferentially distributed around the periphery of the storage groove 5. The rubber rod 61 is connected to the top of the closed box 1 by a spring sheet 62. A guide ring 63 is fixedly installed at the bottom of the upper end of the closed box 1, and the inner wall of the guide ring 63 is inclined.

[0029] The top edge of the rubber rod 61 is inclined, and the spring plate 62 pulls the rubber rod 61 vertically.

[0030] Using the above scheme: when the chip as a whole has been cooled down, and it is necessary to cool down a certain area, the hydraulic rod 2 is controlled to retract again, so that the upper closed box 1 drives the guide ring 63 to descend. The inclined surface of the inner wall of the guide ring 63 presses and guides each corresponding rubber rod 61 to approach the center of the storage slot 5, and fixes the chip by clamping. When the position of the carrier box 71 changes and the diameter of the cone-shaped top exhaust port of the guide plate 72 changes, the chip remains horizontal and faces the cooler 7. The rubber rod 61 is made of a flexible material, which also prevents damage to the edges of the chip during clamping.

[0031] Working principle and usage process of this invention: The hydraulic rod 2 is controlled to lift the upper closed box 1, so that the robot or manual can place each chip in the storage slot 5 of the lower closed box 1 in sequence; Then, control the hydraulic rod 2 to merge the two closed boxes 1, start the air pump, so that the air is compressed and enters the air box 81 through the air pipe 82, and then is injected into the bearing box 71 through the air box 81. Since the two air tubes 82 are also connected through the sleeve 32, the air inside each carrier box 71 can circulate. The air pressure pushes the chip upward and suspends it between the two enclosed boxes 1, allowing the entire chip to be cooled; After the cooling process has been running for a period of time, the hydraulic rod 2 retracts again, causing the upper closed box 1 to drive the guide ring 63 to descend. The inclined surface of the inner wall of the guide ring 63 presses and guides each corresponding rubber rod 61 toward the center of the storage slot 5, and clamps and fixes the chip. Subsequently, the hydraulic rod 76 retracts, causing the carrier box 71 and the carrier plate 75 to rotate relative to each other. The guide plate 70 gradually moves outward through the arc groove 77, and pushes the telescopic plate 74 during this period. The end of the telescopic plate 74 pushes the guide plate 72 to fold and reduce the range of air discharge, while increasing the air pressure. By controlling the extension or retraction of the corresponding hydraulic rods 78 and 79, the guide plate 72 is directed towards the high-temperature area on the chip, quickly and efficiently removing the heat from the high-temperature area.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0033] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A device for improving the cooling efficiency of semiconductors, comprising two symmetrically arranged enclosed boxes (1), characterized in that, The two enclosed boxes (1) are connected by a hydraulic rod (2); Also includes; An adsorption assembly (4) is disposed between two closed boxes (1); A set of storage slots (5) are arranged circumferentially on the closed box (1), and a limiter (6) is arranged circumferentially on the top of the lower closed box (1). The position of the limiter (6) corresponds to the storage slots (5), and the limiter (6) is used to fix the position of the chip. An air supply assembly (8) is arranged circumferentially inside the enclosed box (1), and two of the air supply assemblies (8) are connected by a connector (3); Coolers (7) arranged in a ring array inside a closed box (1); The lower cooling device (7) includes a carrier box (71) with a set of slots on the top. A set of guide plates (72) are circumferentially hinged on the carrier box (71). The carrier box (71) and each guide plate (72) are connected by a rubber layer (73). A telescopic plate (74) is fixed on the outer periphery of the guide plate (72). The bottom of the carrier box (71) is rotatably connected to the carrier plate (75). The carrier box (71) and the carrier plate (75) are connected by a hydraulic rod (76). The bottom of the carrier plate (75) is provided with a set of arc grooves (77). The telescopic plate (74) is hinged to the corresponding arc grooves (77) through the guide plate (70). The bottom of the closed box (1) is slidably connected to hydraulic rods four (78) and five (79) which are perpendicular to each other. The ends of hydraulic rods four (78) and five (79) are connected to the bottom of the support plate (75). The lower air supply component (8) is connected to an air pump, and the air supply component (8) is connected to the carrier box (71).

2. The semiconductor cooling and efficiency improvement device according to claim 1, characterized in that: The rubber layer (73) and each guide plate (72) are combined to form a cone shape, with the top of the cone corresponding to the storage groove (5).

3. The semiconductor cooling and efficiency improvement device according to claim 1, characterized in that: The lower air supply assembly (8) includes an air box (81) fixed inside the lower closed box (1). The air box (81) is connected to an air pipe (82) extending to the outside of the closed box (1). The air pipe (82) can be connected to the air outlet of the air pump. The air box (81) is connected to the carrier box (71) through a rubber tube.

4. The semiconductor cooling and efficiency improvement device according to claim 3, characterized in that: The docking device (3) includes a hydraulic rod two (31) fixed to the outer periphery of the lower closed box (1), and a sleeve (32) is installed at the top of the hydraulic rod two (31), and the sleeve (32) is fitted onto the two air boxes (81).

5. The semiconductor cooling and efficiency improvement device according to claim 1, characterized in that: The adsorption component (4) includes a filter screen (41) that is movably snapped between two closed boxes (1) and a set of filter plates (42) are snapped into the inner wall of the filter screen (41) in a circumferential array.

6. The semiconductor cooling and efficiency improvement device according to claim 5, characterized in that: The lower end of the enclosed box (1) has a motor (44) fixedly installed inside. The output shaft of the motor (44) is driven by a fan (45). The top of the lower end of the enclosed box (1) has a slot for exhausting air from the fan (45).

7. The semiconductor cooling and efficiency improvement device according to claim 5, characterized in that: The adsorption assembly (4) also includes a guide head (43) fixed to the bottom of the upper closed box (1), and the bottom of the guide head (43) is conical.

8. The semiconductor cooling and efficiency improvement device according to claim 1, characterized in that; The limiter (6) includes a set of rubber rods (61) hinged to the top of the lower closed box (1). Each set of rubber rods (61) is distributed circumferentially around the storage slot (5). The rubber rods (61) are connected to the top of the closed box (1) by spring plates (62).

9. The semiconductor cooling and efficiency improvement device according to claim 8, characterized in that; The bottom of the upper closed box (1) is fixed with a guide ring (63), and the inner wall of the guide ring (63) is inclined.

10. The semiconductor cooling and efficiency improvement device according to claim 9, characterized in that: The top edge of the rubber rod (61) is inclined, and the spring plate (62) pulls the rubber rod (61) vertically.

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