Integrated manufacturing method of high-precision patterned coated ceramic substrate and blind hole structure

Abstract

The invention discloses an integrated manufacturing method for a high-precision patterned coated ceramic substrate and a blind hole structure, and belongs to the technical field of electronic components. The integrated manufacturing method comprises the following steps: preparing a ceramic substrate, metalizing the two sides of the ceramic substrate, patterning the metalized layers on the two sides of the ceramic substrate by utilizing a photoetching process, manufacturing a blind hole array by laser, removing residues by sand blasting, cleaning dust, cutting and slicing, and the like. A double-sided pattern is manufactured on a ceramic substrate by adopting a photoetching process, then a blind hole is manufactured by utilizing a laser cutting machine, and finally dust in the blind hole is removed by utilizing sand blasting equipment, so that the integrated manufacturing of the double-sided high-precision pattern and the blind hole structure of the ceramic substrate is realized, the processing cycle of a product is shortened, and the precision of the product is improved. The problems that in an existing ceramic substrate blind hole manufacturing technology, the LTCC technology is long in period, poor in precision and low in yield, and ceramic breakage is prone to occurring in a mechanical drilling technology are solved. The method is widely applied to the blind hole manufacturing technology of the electronic component substrate.

Description

Technical Field

[0001] This invention belongs to the field of electronic components technology, and more specifically to the field of high heat dissipation substrate technology. In particular, it relates to a method for integrating a high-precision patterned coated ceramic substrate with a blind hole structure. Background Technology

[0002] With the development of technologies such as 5G communication, new energy vehicles, and high-performance chips, the heat dissipation requirements for electronic components are becoming increasingly stringent. To improve the heat dissipation capacity of electronic components, two technical approaches have emerged. The first is from a material perspective, using materials with high thermal conductivity to enhance heat dissipation, such as aluminum nitride ceramics and diamond. The second is through structural design to improve heat dissipation, such as increasing the heat dissipation area by creating blind via arrays. However, the manufacturing of blind vias on ceramic substrates mainly relies on LTCC (Low-Temperature Ceramic Carbide) technology and traditional mechanical drilling, both of which have certain drawbacks. LTCC technology suffers from long production cycles, involving processes such as tape casting, lamination, and sintering, making the process complex and cumbersome. Secondly, it has a low yield; ceramic substrates manufactured using LTCC technology experience shrinkage during sintering, leading to deviations between the actual processed wiring or shape and the designed position. Traditional mechanical drilling is prone to ceramic chipping. Furthermore, due to the high hardness of ceramic materials, drill bits wear easily during processing, requiring frequent drill bit replacements and resulting in high processing costs.

[0003] In view of this, the present invention is hereby proposed. Summary of the Invention

[0004] The technical problem to be solved by this invention is to address the issues of long process cycle, poor precision, low yield, and easy ceramic chipping in the existing ceramic substrate blind hole manufacturing technology, as well as the problem of ceramic chipping caused by mechanical drilling.

[0005] The inventive concept of this invention is as follows: a high-precision patterned coated ceramic substrate and blind hole structure integrated manufacturing method is adopted. First, double-sided coating is performed on the ceramic substrate. Then, double-sided patterns are made on the ceramic substrate using photolithography. Next, blind holes are made using a laser cutting machine. Finally, sandblasting equipment is used to remove dust from the blind holes. This achieves the integrated manufacturing of high-precision double-sided patterns and blind holes on the ceramic substrate, shortening the product processing cycle and improving product precision.

[0006] Therefore, this invention provides a method for integrating a high-precision patterned coated ceramic substrate with a blind via structure, such as... Figure 1-5 As shown. The integrated manufacturing method is as follows: Step 1: Select a ceramic substrate according to the product. Ceramic substrate types include alumina ceramic substrate, aluminum nitride ceramic substrate, silicon nitride ceramic substrate, etc. Clean the ceramic substrate and dry it.

[0007] Step 2: Perform double-sided metallization on the ceramic substrate. Metallization methods include sputtering deposition, electron beam evaporation deposition, electroplating, and chemical plating.

[0008] Step 3: Using photolithography, the metallized ceramic substrate is patterned on both sides to achieve overlay and alignment of front and back patterns and create the marking patterns.

[0009] Step 4: Laser fabrication of blind vias: After the pattern is fabricated on the coated ceramic substrate, protective tape (thickness 50μm ~ 300μm) is applied to both sides, exposing the laser alignment marks on the back side; a green picosecond laser is used to position and process the blind via array based on the back side positioning pattern.

[0010] Step 5: Sandblasting to remove residue: Fix the hole-making surface of the coated ceramic substrate upwards, and use glass beads of a certain size to spray vertically at a certain angle under low air pressure to thoroughly remove ceramic residue from the hole.

[0011] Step 6: Dust Cleaning: Use deionized water to rinse away the dust on the surface of the coated ceramic substrate. After tearing off the protective tape, place the product in the cleaning basket, pour in alcohol and ultrasonically clean for 3 to 10 minutes. Then rinse with deionized water and dry with a nitrogen air gun.

[0012] Step 7: Cutting and segmenting. Use mechanical grinding wheel cutting or laser cutting to segment the product into independent units.

[0013] Advantages and benefits of the present invention (1) Improved precision: Photolithography technology achieves pattern linewidth accuracy ≤ ±5μm and alignment accuracy error between metal pattern and blind hole ≤ ±5μm; (2) Shorter production cycle: Compared with the LTCC process, the production cycle is reduced by about half by eliminating the casting and sintering steps. (3) Improved yield: The trial production pass rate exceeded 80%, and there were no issues with pattern alignment deviation caused by the shrinkage rate of ceramic sintering in the LTCC process or the chipping problem caused by traditional mechanical drilling. (4) Cost reduction: Compared with LTCC process, the investment in casting / sintering equipment is reduced, and energy consumption is reduced by 30%~50%; compared with traditional mechanical drilling process, there is no problem of drill bit wear and replacement, saving material and labor costs.

[0014] The technical solution of this invention can be widely applied to the blind via fabrication technology of electronic component substrates. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the process flow of the present invention.

[0016] Figure 2 This is a schematic diagram of the front structure of the product.

[0017] Figure 3 This is a schematic diagram of the structure on the back of the product.

[0018] Figure 4 This is a schematic diagram of the product's cross-sectional structure.

[0019] Figure 5 This is an enlarged schematic diagram of the cross-sectional structure of the blind aperture array.

[0020] In the diagram: 1 is the ceramic substrate, 2 is the front metal pattern, 3 is the positioning mark, 4 is the back metal pattern, and 5 is the blind via. Detailed Implementation

[0021] like Figure 1-5 As shown, the specific implementation method of the high-precision patterned coated ceramic substrate and blind via structure integration manufacturing method is as follows: (1) Substrate cleaning and drying: Take an aluminum nitride ceramic substrate (50.8×50.8×0.635mm), clean it with a cleaning solution using ultrasound, and then dry it.

[0022] (2) Metallization coating: A conductive seed layer is made by magnetron sputtering, and then electroplating is performed to thicken it to the required film thickness; (3) Double-sided patterning: First, the back pattern is made. The specific steps include: coating photoresist → pre-baking → mask exposure → development → etching metal layer → removing photoresist; then the front pattern is overlaid: the back mark is used as a reference for exposure alignment, and the front pattern is made in the same way (pattern line width accuracy ±5μm). (4) Blind hole machining: Double-sided protective tape is applied, exposing the alignment marking pattern on the back; a Φ0.5mm blind hole array (hole depth 0.25mm) is processed by pulsed laser (preferably 532nm, pulse width 10ps, frequency 100kHz); (5) Residue removal: The hole-forming surface of the coated ceramic substrate is fixed upwards, and sandblasting is performed under low pressure to allow the glass beads to fully contact and rub against the dust in the blind holes at a certain angle to remove it. Finally, the appearance of the hole wall is checked under a 30x microscope and no dust residue is found.

[0023] (6) Dust cleaning: Remove surface dust by deion rinsing, then ultrasonically clean with anhydrous ethanol for 10 minutes, rinse with deionized water for 5 minutes, and finally dry with nitrogen.

[0024] (7) Cutting into pieces: Using an abrasive wheel for cutting, with a cutting width of 0.2mm, it is cut into individual products.

[0025] Effects: Increases the heat dissipation area of ​​the coated ceramic, improves the product's heat dissipation capacity, and is suitable for aerospace, high-power electronic equipment, etc.

[0026] Finally, it should be noted that the above embodiments are merely examples for clear illustration. This invention includes, but is not limited to, the above embodiments, and it is neither necessary nor possible to exhaustively describe all possible implementations. Those skilled in the art can make other variations or modifications based on the above description. All implementation schemes that meet the requirements of this invention are within the protection scope of this invention.

Claims

1. A method for integrating a high-precision patterned coated ceramic substrate with a blind via structure, characterized in that, The integrated manufacturing method is as follows: Step 1: Select a ceramic substrate according to the product. The types of ceramic substrates include alumina ceramic substrates, aluminum nitride ceramic substrates, or silicon nitride ceramic substrates. Clean the ceramic substrate and dry it. Step 2: Perform double-sided metallization on the ceramic substrate. Metallization methods include sputtering deposition, electron beam evaporation deposition, electroplating, or chemical plating. Step 3: Using photolithography, the metallized ceramic substrate is patterned on both sides to achieve overlay of front and back patterns and the creation of alignment markings; Step 4: Laser fabrication of blind vias: After the pattern is fabricated, the coated ceramic substrate is covered with protective tape on both sides, exposing the laser alignment marks on the back side; a green picosecond laser is used to position and process the blind via array based on the pattern on the back side. Step 5: Sandblasting to remove residue: Fix the hole-making surface of the coated ceramic substrate with the hole facing upwards, and use glass beads of a certain size to spray vertically at a certain angle under low air pressure to thoroughly remove ceramic residue in the hole. Step 6: Dust cleaning: Use deionized water to rinse away the dust on the surface of the coated ceramic substrate. After tearing off the protective tape, place the product in the cleaning basket, pour in alcohol for ultrasonic cleaning, rinse with deionized water, and blow dry with a nitrogen air gun. Step 7: Cutting and segmenting. Use mechanical grinding wheel cutting or laser cutting to segment the product into independent units.

2. The high-precision patterned coated ceramic substrate and blind via structure integration manufacturing method as described in claim 1, characterized in that: The thickness of the tape is 50μm to 300μm.

3. The high-precision patterned coated ceramic substrate and blind via structure integration manufacturing method as described in claim 1, characterized in that: The time for the alcohol ultrasonic cleaning is 3 to 10 minutes.

4. The high-precision patterned coated ceramic substrate and blind via structure integration manufacturing method as described in claim 1, characterized in that: The double-sided metallized coating is produced by creating a conductive seed layer through magnetron sputtering, followed by electroplating to thicken it to the required film thickness.

5. The high-precision patterned coated ceramic substrate and blind via structure integration manufacturing method as described in claim 1, characterized in that: The patterning process involves first creating the back pattern, with specific steps including: coating photoresist → pre-baking → mask exposure → development → etching the metal layer → removing the photoresist; then performing front overlay: using the back mark as a reference for exposure alignment, and creating the front pattern in the same way.

6. The method for integrating a high-precision patterned coated ceramic substrate with a blind via structure as described in claim 1, characterized in that: The blind holes are fabricated by applying protective tape to both sides, exposing the alignment marking pattern on the back; the blind hole array is then processed using pulsed laser.

7. The method for integrating a high-precision patterned coated ceramic substrate with a blind via structure as described in claim 6, characterized in that: The pulsed laser has a wavelength of 532nm, a pulse width of 10ps, and a frequency of 100kHz.

8. The method for integrating a high-precision patterned coated ceramic substrate with a blind via structure as described in claim 1, characterized in that: The removal of the residue is as follows: the hole-making surface of the coated ceramic substrate is fixed upwards, and sandblasting is performed under low pressure so that the glass beads can fully contact and rub against the dust in the blind hole at a certain angle to remove it. Finally, the appearance of the hole wall is checked under a 30x microscope and no dust residue is found.

9. The high-precision patterned coated ceramic substrate and blind via structure integration manufacturing method as described in claim 1, characterized in that: The dust cleaning process involves: removing surface dust using deionized water rinsing, followed by ultrasonic cleaning with anhydrous ethanol for 3 to 10 minutes, rinsing with deionized water for 3 to 5 minutes, and finally drying with nitrogen.

10. The method for integrating a high-precision patterned coated ceramic substrate with a blind via structure as described in claim 1, characterized in that: The depth of the blind hole is 0.1mm to 0.3mm.

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