EMI (Electro-Magnetic Interference) power supply filtering device with anti-reverse-connection module
By using metal plates to separate the chambers and organic thin-film feedthrough filters in the filtering equipment, combined with the reverse connection protection function of the N-channel MOSFET, the crosstalk and electromagnetic interference problems between multiple signals are solved, and the electromagnetic compatibility and safety of the system are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-28
- Publication Date
- 2026-03-17
AI Technical Summary
Existing filtering equipment suffers from crosstalk between multiple signals, and connecting cables may carry electromagnetic interference noise, lacking effective shielding and filtering measures.
The outer casing is divided into multiple independent chambers by a metal plate, and organic thin-film feedthrough filters and N-channel MOS transistors are used in combination with distributed and centralized filtering schemes to achieve physical isolation and electromagnetic shielding of signals and prevent crosstalk coupling.
It effectively suppresses electromagnetic compatibility issues between different signals, improves system safety and signal integrity, simplifies system integration, and reduces the risk of misoperation.
Smart Images

Figure CN121689790A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the technical field of power supply filtering, and in particular relates to an EMI power supply filtering device with a reverse connection protection module. Background Technology
[0002] With the rapid development of modern electronic technology, various electronic devices and systems, especially those used in complex electromagnetic environments such as aerospace, communications, and industrial control, are becoming increasingly integrated and functionally complex. These systems often need to process multiple different types of signals simultaneously, such as power supplies, CAN buses, and RS-422 serial ports. During transmission and conversion, these signals inevitably generate electromagnetic interference (EMI). Simultaneously, electromagnetic noise from the external environment can also intrude into the system, seriously threatening the stable operation of the equipment and signal integrity. Therefore, electromagnetic compatibility (EMC) design has become crucial for ensuring the reliability of electronic systems. Power supply filtering devices, as the first line of defense against electromagnetic interference, directly determine the anti-interference capability of the entire system.
[0003] Existing filtering equipment uses ordinary cables to connect multiple signals within its internal circuits, and generally lacks shielding between the various cavities. This inevitably leads to crosstalk between the signals. Furthermore, if shielding and filtering measures are inadequate, due to the antenna effect of electromagnetic interference, the internal connecting cables may still carry electromagnetic interference noise at the filtering end. Therefore, we provide an EMI power supply filter with a reverse connection protection module to solve the aforementioned problems. Summary of the Invention
[0004] The purpose of this invention is to provide an EMI power filter device with a reverse connection protection module. By using a metal plate, the interior of the housing can be divided into multiple independent chambers. At the same time, the use of an organic thin-film through-hole filter can provide multiple filtering methods, thereby solving the electromagnetic compatibility problems of multiple different signals and their mutual interference.
[0005] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution:
[0006] This invention relates to an EMI power filter device with a reverse connection protection module, comprising a housing; four arrayed circular connectors are provided on the lower end face of the housing; the interior of the housing is divided into two independent chambers, chamber one and chamber two, by a fixed metal plate; an L-shaped circuit board assembly is bolted inside chamber one; four evenly distributed inductors are soldered to the lower end face of the circuit board assembly; a relay is installed inside chamber two; disassembly ports one and two are respectively provided at the two ends of chamber two; the four inductors are respectively located inside chamber one, chamber two, disassembly port one, and disassembly port two; five evenly distributed anti-interference magnetic rings are fixed to the upper end face of the stepped portion inside chamber two; and a cover plate is bolted to the upper end face of the housing.
[0007] The invention is further configured such that the second chamber is connected to the corresponding first and second dispensing ports through multiple openings on the side wall of the metal plate.
[0008] The invention is further configured such that the lower end face of the outer shell has four sets of positioning grooves that are respectively connected to the interior of chamber one, chamber two, dispensing port one and dispensing port two, and four sets of circular connectors are respectively installed in the corresponding positioning grooves, wherein the circular connector in chamber one is a power signal connector, and the other circular connectors are multiple sets of serial port signal input connectors.
[0009] The present invention is further configured such that organic thin-film through-core filters are provided on the sidewalls of the metal plate above the multiple ports, and the cable ends of each group of organic thin-film through-core filters are soldered to the circuit board assembly.
[0010] The present invention is further configured such that each group of organic thin film through-core filters is provided with a circuit board 2 at the end of the second chamber, and the organic thin film through-core filters and the circuit board 2 are insulated from each other.
[0011] The present invention is further configured such that a circuit board is provided at the end of the second chamber where the relay is located, and the relay and the circuit board are provided with positional insulation.
[0012] The present invention is further configured such that a ground plate 1 for sealing the upper end of the dispensing port 1 is provided at one end of the inner side of the chamber 1, and a ground plate 2 for sealing the upper end of the dispensing port 2 is provided at the other end of the inner side of the chamber 1.
[0013] The present invention is further configured such that N-channel MOS transistors are soldered to the outer corners of the lower end of the L-shaped circuit board assembly.
[0014] The present invention is further configured such that a power supply chamber is provided in a cavity located above the circuit board assembly, wherein the power supply line is electrically connected to the circuit board assembly.
[0015] The present invention has the following beneficial effects:
[0016] 1. The partitions between each chamber in this invention have a shielding function, preventing crosstalk coupling between interfering signals. The internal design of the outer shell employs multiple chambers separated by metal partitions, effectively suppressing coupling between different signals and thus solving electromagnetic compatibility issues during signal transmission between systems. Furthermore, the installation of N-channel MOSFETs provides reverse power connection protection, enhancing system safety.
[0017] 2. This invention, through the setting of an organic thin-film through-core filter, enables the entire device to have the signal transmission and operation functions of internal power signals, CAN signals, RS-422 signals, etc. At the same time, it is combined with the organic thin-film through-core filter to adopt corresponding filtering methods. Furthermore, it utilizes a combination of distributed and centralized electromagnetic interference solutions within the entire component to ultimately solve the electromagnetic compatibility problems of multiple different signals and their mutual interactions.
[0018] Of course, any product implementing this invention does not necessarily need to achieve all of the above advantages at the same time. Attached Figure Description
[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of the structure of the present invention.
[0021] Figure 2 This refers to the circuit board assembly, relay, and organic thin-film feedthrough filter in this invention.
[0022] Figure 3 This is a bottom structural diagram of the outer shell in this invention.
[0023] Figure 4 This is a bottom structural diagram of the circuit board assembly in this invention.
[0024] Figure 5 This is a structural diagram of the overall assembly of the outer casing and circuit board in this invention.
[0025] Figure 6 This is a structural diagram of the outer shell and cover plate in this invention.
[0026] Figure 7 This is a diagram of the internal structure of the outer shell in this invention.
[0027] Figure 8 This is a bottom structural diagram of the circuit board assembly and relay in this invention.
[0028] Figure 9 This is the overall circuit schematic diagram of the present invention.
[0029] Figure 10 This is one of the wiring diagrams for the circular connector in this invention.
[0030] Figure 11 This is one of the wiring diagrams for the circular connector in this invention.
[0031] Figure 12 This is one of the wiring diagrams for the circular connector in this invention.
[0032] Figure 13 This is one of the wiring diagrams for the circular connector in this invention.
[0033] Figure 14 This is one of the wiring diagrams for the relay in this invention.
[0034] The attached diagram lists the components represented by each number as follows:
[0035] 1-Outer shell, 101-Circular connector, 102-Anti-interference magnetic ring, 103-Metal plate, 104-Cavity 1, 105-Cavity 2, 106-Sub-assembly port 1, 107-Sub-assembly port 2, 108-Positioning slot, 2-Cover plate, 3-Circuit board assembly, 301-Ground plate 1, 302-Ground plate 2, 303-N-channel MOSFET, 304-Inductor, 4-Relay, 401-Circuit board 1, 5-Organic thin film feedthrough filter, 501-Circuit board 2. Detailed Implementation
[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0037] Example
[0038] Please see Figures 1 to 14This invention is an EMI power filter device with a reverse connection protection module, including a housing 1; four arrayed circular connectors 101 are provided on the lower end face of the housing 1; the interior of the housing 1 is divided into two independent chambers 104 and 2nd chamber 105 by a fixed metal plate 103; an L-shaped circuit board assembly 3 is bolted inside the chamber 104; four evenly distributed inductors 304 are welded to the lower end face of the circuit board assembly 3; a relay 4 is installed inside the chamber 205; a first dispensing port 106 and a second dispensing port 107 are respectively provided at both ends of the chamber 205; the four inductors 304 are respectively located inside the chamber 104, chamber 205, dispensing port 106 and dispensing port 207; five evenly distributed anti-interference magnetic rings 102 are fixed on the upper end face of the stepped portion inside the chamber 205.
[0039] Meanwhile, the circular connector 101 in chamber 104 is a power signal connector, and the other circular connectors 101 are multiple sets of serial port signal input connectors. The housing serves as the external support and shielding structure for the filtering components. The multiple sets of circular connectors 101 at the lower end of the housing 1 are used to receive external input signals. The signal output connector at the upper end of the housing 1 leads out the filtered signal through internal wiring. The interior of the housing is divided into multiple independent chambers, each corresponding to an input connector, achieving physical isolation. At the same time, it provides mechanical protection and environmental isolation to prevent external physical damage or contamination. Furthermore, the chamber design avoids direct contact between different signals, reducing the possibility of misoperation. The overall housing 1 is combined with grounding to enhance electromagnetic shielding effectiveness and reduce the impact of external electromagnetic interference on internal signals.
[0040] With the above structure, four independent chambers (chamber 1 104, chamber 2 105, dispensing port 1 106, and dispensing port 2 107) correspond one-to-one with four circular connectors 101. The chambers are separated by metal partitions. A dedicated filtering module is installed in each chamber to filter the input signal of the circular connector 101. The filtered signal is connected to the output connector of the outer shell 1 through internal wiring, realizing independent processing of signals in each chamber, preventing crosstalk coupling between different signals, improving signal integrity through physical isolation, and ensuring that each group of signals remains pure during transmission. This structure simplifies system integration. The output signal can be directly plugged into the output device through a cable, reducing intermediate connection links. Because the interface is clear and independent, the risk of misoperation is also reduced.
[0041] N-channel MOSFETs 303 are soldered to the outer corner of the lower end of the L-shaped circuit board assembly 3. A cover plate 2 is bolted to the upper end of the housing 1. The output signal line of the device is set on the cover plate 2. The use of N-channel MOSFETs 303 can avoid reverse connection of the circuit.
[0042] The chamber 104 located above the circuit board assembly 3 is configured as a power supply chamber, wherein the power supply line is electrically connected to the circuit board assembly 3.
[0043] Among them, the second chamber 105 is connected to the corresponding first dispensing port 106 and second dispensing port 107 through multiple openings on the side wall of the metal plate 103. The lower end face of the outer shell 1 is provided with four sets of positioning grooves 108 that are connected to the interior of the first chamber 104, the second chamber 105, the first dispensing port 106 and the second dispensing port 107 respectively. The four sets of circular connectors 101 are respectively installed in the corresponding positioning grooves 108. The circular connectors 101 are respectively installed in the positioning grooves 108 and positioned by the positioning grooves 108, so that the circular connectors 101 are respectively inserted into the corresponding first chamber 104, the second chamber 105, the first dispensing port 106 and the second dispensing port 107.
[0044] Specifically, according to Figures 10 to 14 It can be seen that organic thin film through-hole filters 5 are provided on the side walls of the metal plate 103 above multiple ports, and the cable ends of each group of organic thin film through-hole filters 5 are soldered to the circuit board assembly 3. Each group of organic thin film through-hole filters 5 is provided with a circuit board 2 501 at the end of the second chamber 105. The organic thin film through-hole filters 5 and the circuit board 2 501 are insulated from each other. The relay 4 is provided with a circuit board 1 401 at the end of the second chamber 105. The relay 4 and the circuit board 1 401 are insulated from each other. The organic thin film through-hole filters 5 in each chamber are connected to the corresponding circular connector 101 according to their characteristics to achieve distributed filtering. At the same time, multiple organic thin film through-hole filters 5 are centrally installed on the metal plate 103, which simplifies the system design.
[0045] It should be noted that before the circular connector 101 is connected to the organic thin-film through-core filter 5, the cables on the multiple circular connectors 101 first pass through the inside of the corresponding anti-interference magnetic ring 102, and then are electrically connected to the circuit board 2 501 on the corresponding organic thin-film through-core filter 5. The output terminal of the relay 4 is electrically connected to the circuit board 1 401. After the cable on the circuit board 1 401 passes through the designated anti-interference magnetic ring 102, it is connected to the output signal terminal on the housing 1. The input terminal of the relay 4 is electrically connected to the circuit board assembly 3.
[0046] Furthermore, one end of the inner side of the chamber 104 is provided with a ground plane 301 for sealing the upper end of the dispensing port 106, and the other end of the inner side of the chamber 104 is provided with a ground plane 302 for sealing the upper end of the dispensing port 2 107. The port positions of the dispensing port 106 and the dispensing port 2 107 are shielded by the ground plane 301 and the ground plane 302, so that the dispensing port 106, the dispensing port 2 107 and the chamber 104 are each in a single chamber.
[0047] The working principle of this embodiment is as follows: The interior of the housing is divided into four independent shielded chambers: chamber 104, chamber 2 105, dispensing port 106, and dispensing port 2 107 by metal plate 103, ground plate 103, and ground plate 301. Each chamber corresponds strictly to the circular connector 101 at the lower end of the housing 1, forming an independent electromagnetic shielding space. Power signals, CAN signals, RS-422 signals, etc. from the outside are physically isolated in different chambers from the moment they enter the interior of the housing 1.
[0048] The metal plate 103 is made of conductive material and is connected to the ground. When electromagnetic waves encounter the metal plate 103, they will be reflected or absorbed, forming an electromagnetic shielding barrier. The metal plate 103 completely isolates different signal chambers to prevent electric and magnetic fields from coupling.
[0049] This structure simplifies system integration. The output signal can be directly plugged into the output device via a cable. The signal of the cable connected to the organic thin-film feedthrough filter 5 is routed on the circuit board assembly 3. The critical signal traces adopt short path and impedance matching design. The circuit board is covered with copper over a large area and connected to the system ground to form a low impedance ground plane.
[0050] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0051] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims
1. An EMI power filter device with reverse connection prevention module comprising a housing (1); characterized in that: The lower end face of the shell (1) is provided with four groups of circular connectors (101) arranged in an array, the inside of the shell (1) is divided into two independent chambers one (104) and chamber two (105) by a fixed metal plate (103), the inside of the chamber one (104) is bolted with an L-shaped circuit board assembly (3), the lower end face of the circuit board assembly (3) is welded with four groups of evenly arranged inductors (304), the relay (4) is installed in the chamber two (105), the chamber two (105) is provided with a sub-packing port one (106) and a sub-packing port two (107) at both end positions, four groups of the inductors (304) are arranged in the chamber one (104), the chamber two (105), the sub-packing port one (106) and the sub-packing port two (107), five groups of evenly arranged anti-interference magnetic rings (102) are fixed on the upper end face of the stepped portion in the chamber two (105), and the upper end face of the shell (1) is bolted with a cover plate (2).
2. An EMI power filter device with reverse connection prevention module according to claim 1, characterized in that, The chamber two (105) is connected with the corresponding sub-packing port one (106) and sub-packing port two (107) through a plurality of through holes on the side wall of the metal plate (103).
3. An EMI power filter with reverse connection prevention module as claimed in claim 2 wherein, The lower end face of the shell (1) is provided with four groups of circular connectors (101) arranged in an array, the inside of the shell (1) is divided into two independent chambers one (104) and chamber two (105) by a fixed metal plate (103), the inside of the chamber one (104) is bolted with an L-shaped circuit board assembly (3), the lower end face of the circuit board assembly (3) is welded with four groups of evenly arranged inductors (304), the relay (4) is installed in the chamber two (105), the chamber two (105) is provided with a sub-packing port one (106) and a sub-packing port two (107) at both end positions, four groups of the inductors (304) are arranged in the chamber one (104), the chamber two (105), the sub-packing port one (106) and the sub-packing port two (107), five groups of evenly arranged anti-interference magnetic rings (102) are fixed on the upper end face of the stepped portion in the chamber two (105), and the upper end face of the shell (1) is bolted with a cover plate (2).
4. An EMI power filter with reverse connection prevention module according to claim 1, wherein, The metal plate (103) side wall above the plurality of through holes is provided with two groups of organic thin film through-hole filters (5), and the cable end of each group of organic thin film through-hole filters (5) is welded on the circuit board assembly (3).
5. An EMI power filter with reverse connection prevention module according to claim 4, wherein, Each group of the organic thin film through-hole filters (5) is provided with a circuit board two (501) at the end of the chamber two (105), and the position between the organic thin film through-hole filter (5) and the circuit board two (501) is insulated.
6. An EMI power filter with reverse connection prevention module according to claim 5, wherein, The relay (4) is provided with a circuit board one (401) at the end of the chamber two (105), and the position between the relay (4) and the circuit board one (401) is insulated.
7. An EMI power filter with reverse connection prevention module according to claim 1, wherein, One end of the inside of the chamber one (104) is provided with a ground plate one (301) for packaging the upper end of the sub-packing port one (106), and the other end of the inside of the chamber one (104) is provided with a ground plate two (302) for packaging the upper end of the sub-packing port two (107).
8. An EMI power filter with reverse connection prevention module according to claim 1, wherein, The corners of the lower end of the L-shaped circuit board assembly (3) are welded with N-channel MOS tubes (303).
9. An EMI power filter with reverse connection prevention module according to claim 1, wherein, The chamber one (104) above the circuit board assembly (3) is provided with a power supply chamber, and the power supply line is electrically connected with the circuit board assembly (3).