Heat conduction device

Abstract

The heat conduction device comprises a substrate and a cover plate, the substrate and the cover plate are correspondingly covered and jointly define a cavity, a micro-channel mechanism is arranged in the cavity, the upper end and the lower end of the micro-channel mechanism are connected with the cover plate and the substrate respectively, and the micro-channel mechanism comprises a plurality of micro-channels. The upper end and the lower end of the micro-channel extend to the inner sides of the substrate and the cover plate respectively, and the micro-channel is communicated with the cavity. By arranging the small-gap micro-channels, the contact surface area of the heat conduction device and the liquid is greatly increased, so that the heat dissipation performance is improved. The micro-channel mechanism is connected with the cover plate, so that the pressure bearing capacity of the heat conduction device is improved; and through the arrangement of the middle layer, the bonding strength of the micro-channel mechanism and the cover plate is further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat sinks, in particular to a heat conduction device. BACKGROUND

[0002] With the increasing integration of electronic components, the heat flux density is increasing, and electronic components need more efficient heat sinks to meet their requirements for working environment. However, with the further increase of heat flux density, the traditional heat conduction device cannot meet the heat dissipation requirement.

[0003] The existing liquid cooling plate and other heat conduction devices have the following disadvantages: 1. The contact surface area of the heat conduction device with the liquid is still insufficient; 2. The pressure bearing capacity of the heat conduction device is poor, and if the support in the liquid cooling channel of the heat conduction device is further increased, the contact surface area of the heat conduction device with the liquid will inevitably be reduced.

[0004] Therefore, it is urgent to realize a new heat conduction device to solve the problem that the heat dissipation efficiency and pressure bearing capacity of the existing heat conduction device are difficult to balance and further improve the heat dissipation capacity of the heat conduction device. SUMMARY

[0005] The technical problem to be solved by the embodiments of the present application is to provide a heat conduction device to improve the heat dissipation efficiency.

[0006] In order to solve the above technical problems, the embodiments of the present application provide a heat conduction device, which comprises a substrate and a cover plate, the substrate and the cover plate correspond to each other and are combined to define a cavity, a microchannel mechanism is arranged in the cavity, the upper and lower ends of the microchannel mechanism are connected with the cover plate and the substrate respectively, the microchannel mechanism comprises a plurality of microchannels, the upper and lower ends of the microchannels extend to the inner sides of the substrate and the cover plate respectively, and the microchannels are communicated with the cavity.

[0007] Further, the microchannels are straight channels or wave-shaped channels.

[0008] Further, the microchannel mechanism is composed of a plurality of side-by-side arranged lower tooth parts, the upper and lower ends of the lower tooth parts are connected with the cover plate and the substrate respectively, and the gaps between the lower tooth parts form the microchannels.

[0009] Further, the lower tooth parts are diffusion welded with the substrate, and the lower tooth parts are integrally formed with the cover plate.

[0010] Further, the upper end of the microchannel mechanism is connected with the cover plate through an intermediate layer.

[0011] Further, the intermediate layer is made of pure copper material, or made of one or more of copper, nickel, silver, tin, zinc, phosphorus, silicon, aluminum and manganese.

[0012] Further, the micro-channel mechanism is composed of a plurality of staggered upper teeth and lower teeth, the upper ends of the upper teeth and the lower ends of the lower teeth are connected with the cover plate and the base plate respectively, and the gap between the upper teeth and the lower teeth forms the micro-channel.

[0013] Further, the height of the upper teeth and the lower teeth is less than or equal to the height of the chamber.

[0014] Further, the micro-channel is a three-dimensional turbulence micro-channel, the micro-channel mechanism is composed of a plurality of stacked heat exchange plate bodies, a plurality of flow channel through holes are arranged in an array on the heat exchange plate body, the flow channel through holes on the adjacent layers of heat exchange plate bodies are staggered and connected at the head and tail to form the micro-channel, and the flow channel through holes on one side or multiple sides of the heat exchange plate body are connected with the chamber.

[0015] Further, the width of the micro-channel ranges from 0.05mm to 0.1mm.

[0016] The present application has the following beneficial effects: the present application greatly improves the contact surface area of the heat conduction device and the liquid by arranging the micro-channel with a small gap, thereby improving the heat dissipation performance. The present application improves the pressure bearing capacity of the heat conduction device by connecting the micro-channel mechanism with the cover plate, and further improves the bonding strength of the micro-channel mechanism and the cover plate by arranging the intermediate layer. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is an exploded view of a conventional heat conduction device.

[0018] Figure 2 is a schematic view of the heat conduction device of embodiment 1 of the present application.

[0019] Figure 3 is a cross-sectional schematic view of the heat conduction device of embodiment 1 of the present application.

[0020] Figure 4 is a top view of the base plate of embodiment 1 of the present application.

[0021] Figure 5 is a cross-sectional schematic view of the heat conduction device of embodiment 3 of the present application.

[0022] Figure 6 is a structural schematic view of the micro-channel mechanism of embodiment 2 of the present application.

[0023] Figure 7 is a cross-sectional schematic view of the heat conduction device of embodiment 4 of the present application.

[0024] Figure 8 is a top structural schematic view of the micro-channel mechanism of embodiment 5 of the present application.

[0025] Figure 9 is a cross-sectional schematic view of the micro-channel mechanism of embodiment 5 of the present application.

[0026] BRIEF DESCRIPTION OF DRAWINGS 1, cover plate, 2, base plate, 3, chamber, 4, micro-channel mechanism, 5, micro-channel, 6, lower tooth part, 7, middle layer, 8, upper tooth part, 9, heat exchange plate body, 10, flow channel through hole, 11, support rib, 12, water outlet groove, 13, water inlet groove, 14, flow channel through hole on heat exchange plate body of adjacent layer, 15, flow through side, 16, non-flow through side. DETAILED DESCRIPTION

[0027] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict, and the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0028] In the embodiments of the present application, if there is a directional indication (such as up, down, left, right, front, back, etc.), it is only used to explain the relative position relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directional indication will also change accordingly.

[0029] In addition, in the present application, if the description involves "first", "second", etc., it is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features.

[0030] Please refer to Figure 1 , the heat conduction device includes a base plate and a cover plate, the base plate and the cover plate correspond to each other and are combined to jointly define a chamber. This part is prior art, which will not be described here. The chamber is provided with a support rib. The chamber is filled with a working medium.

[0031] Embodiment 1: Please refer to Figures 2-4 , the chamber is provided with a micro-channel mechanism, the upper and lower ends of the micro-channel mechanism are connected with the cover plate and the base plate respectively, and the micro-channel mechanism includes a plurality of micro-channels. The micro-channels are located between the base plate and the cover plate. The upper and lower ends of the micro-channels extend to the inner sides of the base plate and the cover plate respectively, that is, the top surface and the bottom surface of the micro-channel are the inner side of the cover plate (towards the chamber side) and the inner side of the base plate (towards the chamber side) respectively. The micro-channels are in communication with the chamber. The micro-channel mechanism not only improves the heat dissipation efficiency, but also plays a supporting role, thereby improving the pressure bearing capacity of the heat conduction device. In specific implementation, a plurality of micro-channel mechanisms are arranged in the chamber, the micro-channel mechanisms are spaced apart by a predetermined distance, and water outlet grooves / water inlet grooves are formed. The micro-channels are straight channels.

[0032] Embodiment 2, please refer to Figure 6The microchannel is a wavy channel. In specific implementation, the microchannel structure can be directly fabricated on the substrate by means of precision chiseling, laser engraving, etching, additive manufacturing, etc., that is, by opening straight grooves or wavy grooves (i.e., microchannels) on the substrate.

[0033] Example 3, please refer to Figure 5 The upper end of the microchannel mechanism is connected to the cover plate via an intermediate layer. The intermediate layer is made of pure copper, or one or more of copper, nickel, silver, tin, zinc, phosphorus, silicon, aluminum, and manganese. This invention adds an intermediate layer to facilitate the metallurgical connection between the microchannel mechanism and the cover plate.

[0034] In one implementation, the microchannel mechanism consists of multiple lower teeth arranged side by side. The upper and lower ends of each lower tooth are connected to a cover plate and a substrate, respectively, and the gaps between the lower teeth form microchannels. Diffusion bonding can also be used between the lower teeth and the substrate. Metal bonding can be performed between the lower teeth and the cover plate; the lower teeth and the cover plate can be metallurgically connected or integrally formed.

[0035] Example 4, please refer to Figure 7 The microchannel mechanism consists of multiple staggered upper and lower toothed sections. The upper ends of the upper toothed sections and the lower ends of the lower toothed sections are connected to the cover plate and the substrate, respectively. The gaps between the upper and lower toothed sections form microchannels. This embodiment of the invention, through its staggered arrangement, allows for smaller gaps in the microchannels, further increasing the contact surface area between the heat-conducting device and the liquid, resulting in higher heat dissipation efficiency. Preferably, the height of the upper and lower toothed sections is less than or equal to the height of the chamber. That is, there are gaps between the top of the lower toothed section and the cover plate, and between the bottom of the upper toothed section and the substrate, facilitating the conversion of vapor into liquid and its recirculation, further improving heat dissipation efficiency.

[0036] Example 5, please refer to Figures 8-9 The microchannel is a three-dimensional turbulent microchannel, and the microchannel structure is composed of several stacked heat exchange plates. Each heat exchange plate has several arrayed flow channel holes. The flow channel holes on the heat exchange plates are staggered and connected end-to-end to form the microchannel. The staggered and connected flow channel holes of each heat exchange plate form a three-dimensional turbulent microchannel, which can improve the heat dissipation efficiency of the heat conduction device. One or more flow channel holes on one or more edges of one or more heat exchange plates are connected to the chamber; that is, one or more edges of the heat exchange plates are flow sides, and the rest are non-flow sides.

[0037] In one implementation, the width of the microchannel ranges from 0.05mm to 0.1mm.

[0038] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat conducting device comprising a base plate and a cover plate, the base plate and the cover plate corresponding to each other and jointly defining a chamber, characterized in that, The chamber is provided with a micro-channel mechanism, the upper and lower ends of the micro-channel mechanism are connected with the cover plate and the base plate respectively, the micro-channel mechanism comprises a plurality of micro-channels, the upper and lower ends of the micro-channels extend to the inner sides of the base plate and the cover plate respectively, and the micro-channels are communicated with the chamber.

2. The heat conducting device of claim 1, wherein The micro-channels are straight channels or wavy channels.

3. The heat conducting device of claim 1, wherein, The micro-channel mechanism is composed of a plurality of lower tooth portions arranged side by side, the upper and lower ends of the lower tooth portions are connected with the cover plate and the base plate respectively, and the gaps between the lower tooth portions form the micro-channels.

4. The heat conducting device of claim 3, wherein The lower tooth portions are diffusion welded with the base plate, and the lower tooth portions are integrally formed with the cover plate.

5. The heat-conducting device of claim 1, wherein The upper end of the micro-channel mechanism is connected with the cover plate through an intermediate layer.

6. The heat conducting device of claim 5, wherein The intermediate layer is made of pure copper material, or made of one or more of copper, nickel, silver, tin, zinc, phosphorus, silicon, aluminum and manganese.

7. The heat-conducting device of claim 1, wherein The micro-channel mechanism is composed of a plurality of upper tooth portions and lower tooth portions arranged alternately, the upper ends of the upper tooth portions and the lower ends of the lower tooth portions are connected with the cover plate and the base plate respectively, and the gaps between the upper tooth portions and the lower tooth portions form the micro-channels.

8. The thermally conductive device of claim 1, wherein, The heights of the upper tooth portions and the lower tooth portions are less than or equal to the height of the chamber.

9. The thermally conductive device of claim 1, wherein, The micro-channels are three-dimensional turbulence micro-channels, the micro-channel mechanism is composed of a plurality of heat exchange plate bodies arranged in layers, a plurality of flow passage through holes are arranged in an array on the heat exchange plate bodies, the flow passage through holes on the heat exchange plate bodies of adjacent layers are staggered and connected at the head and tail to form the micro-channels, and the flow passage through holes of one or more side edges of the heat exchange plate bodies are communicated with the chamber.

10. The thermally conductive device of claim 1, wherein, The width of the micro-channels ranges from 0.05mm to 0.1mm.

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