Packaging substrate and intelligent device
By setting the pad spacing and annular groove design, the leakage and electrical spark problems during electrical testing of the packaged substrate were solved, achieving insulation and mechanical protection and extending the service life of the electrical testing equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-08
- Publication Date
- 2026-03-17
AI Technical Summary
During electrical testing, the small spacing between the pads on the packaged substrate can easily cause leakage and electrical sparks, leading to breakdown and probe damage, which affects the lifespan of the electrical testing equipment.
By setting the pad spacing L1 to 50μm≤L1≤80μm, the pad spacing is expanded, annular grooves are set to accommodate conductive impurities, and protrusions are formed on the pad surface to support electrical test probes, thereby enhancing insulation and mechanical protection.
It effectively prevents leakage and electrical sparks, protects the packaging substrate and electrical test probes, extends the service life of equipment, and avoids breakdown and burn-out.
Smart Images
Figure CN121693103A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor packaging, in particular to a packaging substrate and a smart device. BACKGROUND
[0002] As a connecting carrier between a chip and an external circuit, the packaging substrate needs to be tested for electrical performance after manufacturing to screen out products of unqualified quality.
[0003] In the related art, some specific pads on the packaging substrate are generally selected as the measurement points of the electrical measurement probe. On the one hand, the area between the above pads often has copper residues, burrs and other pollutants, which may contain conductive particles or absorb moisture, thereby reducing the insulation performance of the substrate. On the other hand, the distance between the pads on the packaging substrate is small, which results in insufficient insulation between the two adjacent pads.
[0004] The above two reasons cause the probe to easily form a leakage current and generate an electric spark when measuring the measurement points, thereby causing a breakdown between the pads of the packaging substrate. In addition, the electric spark also burns the probe and the switch card connected to the probe, which reduces the conductivity of the probe and shortens the service life of the probe, thereby causing damage to the entire electrical measurement equipment.
[0005] Therefore, there is a need in the art for a packaging substrate and a smart device to overcome the above-mentioned defects. SUMMARY
[0006] The present application aims to at least partially solve one of the technical problems in the related art. To this end, embodiments of the present application propose a packaging substrate and a smart device. By setting the L1 distance, the electrical measurement probe is less likely to cause a leakage current when measuring the measurement points, preventing the occurrence of an electric spark and avoiding the breakdown of the packaging substrate. In addition, the electrical measurement probe and the switch card connected thereto are also prevented from being burned out.
[0007] The packaging substrate of the embodiments of the present application includes a substrate body and pads. The pads are formed on the substrate body and at least a portion of the pads are configured as measurement points of the electrical measurement probe. The distance between any pad configured as a measurement point and an adjacent pad is L1, and the L1 satisfies the relationship: 50 μm≤L1≤80 μm.
[0008] In some embodiments, the distance between any two pads configured as measurement points is L2, and the L2 satisfies the relationship: L2≥140 μm.
[0009] In some embodiments, the substrate body has a conductive circuit thereon, and the distance between any pad configured as a measurement point and an adjacent conductive circuit is L3, and the L3 satisfies the relationship: 15 μm≤L3≤20 μm.
[0010] In some embodiments, the periphery of the pad configured as the measurement point is provided with an annular groove extending along the profile direction thereof, and the annular groove is used for accommodating the conductive impurities.
[0011] In some embodiments, the groove depth H and the groove width W of the annular groove satisfy the relationship: 2≤H / W≤3.
[0012] In some embodiments, the groove depth H of the annular groove is 5-15 μm.
[0013] In some embodiments, the surface of the pad configured as the measurement point is provided with a protrusion, and the protrusion forms a plane away from one side of the pad and has an area greater than the needle tip of the electrical measurement probe, and the plane is used for receiving the electrical measurement probe.
[0014] In some embodiments, the plane comprises a rough surface.
[0015] In some embodiments, the protrusion comprises a circular truncated cone structure made of copper, and a mesa of the circular truncated cone structure away from the pad constitutes the plane; or the protrusion comprises a copper column, and an end surface of the copper column away from the pad constitutes the plane.
[0016] The intelligent device of the embodiments of the present application comprises a shell and the packaging substrate of any one of the above embodiments, and the packaging substrate is arranged in the shell.
[0017] The packaging substrate in the present application expands the distance between the pad configured as the measurement point and the adjacent pad by setting the L1 distance, so that the parasitic capacitance between the pads is reduced or even eliminated. Although the copper residues and burrs are not eliminated in the above distance, the copper residues and burrs are dispersed due to the expansion of the distance, and it is difficult to form a bridging effect between the two pads and to form a conductive path, thereby blocking the formation of a breakdown channel. Therefore, when the electrical measurement probe is used to electrically measure the measurement point (pad) in the present application, it is difficult to cause electric leakage, the occurrence of electric sparks is prevented, the packaging substrate can be prevented from being broken down, the structure of the packaging substrate is protected, and the electrical measurement probe and the switch card connected thereto are also protected, and the entire electrical measurement device is protected. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.
[0019] Figure 1 is a schematic view of a cross section of the packaging substrate in the embodiments of the present application.
[0020] Figure 2This is a schematic diagram of the structure of the pads configured as measuring points and the adjacent conductive lines in the embodiments of this application.
[0021] Figure 3 This is a top view of the pads configured as test points in an embodiment of this application.
[0022] Figure 4 This is a cross-sectional schematic diagram of the pads and protrusions configured as measuring points in the embodiments of this application.
[0023] Figure label: 100. Electrical probe; 1. Substrate body; 2. Pad; 21. Annular groove; 22. Protrusion; 221. Plane; 3. Conductive circuitry. Detailed Implementation
[0024] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.
[0025] In related technologies, to achieve high-density integration of the packaging substrate, the wiring spacing is often continuously reduced. For example, the spacing between copper pads is designed to be 18μm or even smaller. Such a narrow spacing increases the parasitic capacitance between the copper pads. Furthermore, copper residue, burrs, or other metallic foreign matter remain in this spacing area. When electrical test probes test the copper pads used as test points, under the instantaneous voltage or current of the test, these contaminants can easily create an electric arc between adjacent copper pads, generating electrical sparks and causing damage to the packaging substrate.
[0026] The following is combined Figures 1-4 This application describes the packaging substrate and smart device in the embodiments.
[0027] refer to Figure 1 This application provides a packaging substrate, including a substrate body 1 and pads 2. Multiple pads 2 are formed on the substrate body 1. At least a portion of the multiple pads 2 are configured as test points of an electrical test probe 100. The distance between any pad 2 configured as a test point and its adjacent pad 2 is L1, where L1 satisfies the relationship: 50μm≤L1≤80μm.
[0028] More specifically, L1 is the minimum distance between the outer edge of the pad 2 configured as a measuring point and the outer edge of the adjacent pad 2. It is understood that the pad 2 in this embodiment is a copper pad 2.
[0029] In this embodiment of the packaging substrate, the spacing between the pads 2 configured as test points and adjacent pads 2 is increased by setting the L1 spacing, thereby reducing or even eliminating the parasitic capacitance between the pads 2. Although copper residues and burrs are not eliminated in the above spacing, due to the increased spacing, the copper residues and burrs are dispersed, making it difficult to form a bridging effect between the two pads 2, making it difficult to form a conductive path, thus blocking the formation of a breakdown channel. Therefore, when the electrical test probe 100 performs electrical tests on the test points (pads 2) in this embodiment, leakage is less likely to occur, preventing the occurrence of electrical sparks, avoiding breakdown of the packaging substrate, protecting the structure of the packaging substrate, and also protecting the electrical test probe 100 and its connected switch card (not shown in the figure), preventing the electrical test probe 100 and the switch card from being burned out, ensuring the service life of the electrical test probe 100, and avoiding damage to the entire electrical test equipment.
[0030] In this embodiment, L1 is preferably 50 μm. 50 μm serves as the spacing between the pad 2 configured as the measurement point and the adjacent pad 2. This avoids both excessive spacing, which would affect the wiring density of the package substrate, and excessive spacing, which would compromise the insulation performance between the two pads 2. While satisfying the wiring requirements, it also improves the insulation effect between the two pads 2, protecting the package substrate from breakdown.
[0031] refer to Figure 1 In some embodiments, the distance between any two pads 2 configured as measurement points is L2, and L2 satisfies the relationship: L2≥140μm.
[0032] More specifically, L2 is the minimum distance between the outer edges of any two pads 2 configured as measurement points.
[0033] Therefore, the setting of L2 ensures that a set safe distance is maintained between any two test points. When two electrical test probes 100 test the two test points simultaneously, the distance L2 can ensure that there is sufficient insulating medium and insulating path between any two pads 2 configured as test points, preventing electric arcs from occurring between the two test points during electrical testing, avoiding the formation of electric sparks, and preventing damage to the packaging substrate.
[0034] In this embodiment, L2 is preferably 140 μm. 140 μm serves as the spacing between any two pads 2 configured as measurement points, avoiding both excessive spacing that would affect the wiring density of the packaging substrate and excessive spacing that would compromise the insulation performance between the two measurement points. This achieves a balance between the wiring and insulation performance of the packaging substrate.
[0035] refer to Figure 2 In some embodiments, the substrate body 1 has conductive lines 3, and the distance between any pad 2 configured as a measuring point and the adjacent conductive line 3 is L3, where L3 satisfies the relationship: 15μm≤L3≤20μm.
[0036] More specifically, L3 is the minimum distance between the edge of any pad 2 configured as a measurement point and the edge of the adjacent conductive line 3.
[0037] In related technologies, the spacing between the pad 2 configured as a test point and the adjacent conductive line 3 is relatively narrow, for example, 9.5µm. When the electrical test probe 100 contacts the test point, there may be a small amount of slippage. The aforementioned narrow spacing makes it easy for the sidewall of the probe to contact the adjacent conductive line 3, which may cause a short circuit and damage the package substrate during electrical testing.
[0038] In this embodiment, the L3 setting expands the above-mentioned spacing. The L3 spacing provides a larger margin for the sliding of the electrical test probe 100, preventing the sidewall of the electrical test probe 100 from contacting the conductive line 3, thereby preventing short circuit during electrical testing and protecting the packaging substrate from damage.
[0039] In addition, the increased L3 spacing also means that the pads 2 configured as test points are isolated from the adjacent conductive lines 3 by more insulating medium, making it less likely to form conductive paths. This prevents leakage discharge during electrical testing, avoids the occurrence of electrical sparks, and prevents breakdown of the packaging substrate.
[0040] In this embodiment, L3 is preferably 15μm. 15μm serves as the spacing between any pad 2 configured as a measurement point and the adjacent conductive line 3. This avoids both excessive spacing affecting the wiring density of the packaging substrate and insufficient spacing ensuring adequate space and insulation performance between the pad 2 and the conductive line 3. This approach ensures both effective wiring and protection of the packaging substrate.
[0041] refer to Figure 3 In some embodiments, the outer periphery of the pad 2 configured as a measuring point is provided with an annular groove 21 extending along its contour direction, the annular groove 21 being used to accommodate conductive impurities.
[0042] It is understandable that the shape of the annular groove 21 is consistent with the outline shape of the pad 2 configured as the measuring point, and the annular groove 21 is a closed groove with closed ends. The annular groove 21 can be fabricated by a semi-etching process.
[0043] Therefore, the annular groove 21 can accommodate conductive impurities such as copper residue formed during the manufacturing process of the packaging substrate, preventing such conductive impurities from remaining between the pad 2 configured as the test point and the adjacent pad 2, and preventing such conductive impurities from remaining between the pad 2 configured as the test point and the adjacent conductive line 3. This further reduces the bridging effect caused by conductive impurities between pads 2 and between pads 2 and conductive line 3, eliminates the formation of conductive paths, and avoids the occurrence of electrical sparks during electrical testing.
[0044] In addition, when the electrical test probe 100 contacts the pad 2 configured as a test point, the annular groove 21 can also act as a enclosure, confining the electrical test probe 100 in the inner ring solid area of the annular groove 21 within the pad 2, thereby reducing the slippage of the electrical test probe 100.
[0045] refer to Figure 3 In some embodiments, the groove depth H and groove width W of the annular groove 21 satisfy the relationship: 2≤H / W≤3.
[0046] Within the aforementioned ratio range, the space inside the annular groove 21 can be narrower and deeper. This facilitates the containment of conductive impurities such as copper residues and reduces the likelihood of these impurities escaping from the annular groove 21 under external interference, thereby improving the restraint effect of the annular groove 21 on impurities such as copper residues.
[0047] In this embodiment, H / W is preferably 2.
[0048] In some embodiments, the groove depth H of the annular groove 21 is 5-15 μm.
[0049] The aforementioned range of groove depth H prevents the annular groove 21 from being too shallow to accommodate conductive impurities, while also preventing the annular groove 21 from being too deep, which would prolong the etching time and increase the difficulty and cost of the process.
[0050] refer to Figure 3 In this embodiment, the groove depth H of the annular groove 21 is preferably 10 μm.
[0051] refer to Figure 1 and Figure 4 In some embodiments, the surface of the pad 2 configured as a test point is provided with a protrusion 22. The side of the protrusion 22 away from the pad 2 forms a plane 221 with an area larger than the tip of the electrical test probe 100. The plane 221 is used to receive the electrical test probe 100.
[0052] The protrusion 22 is formed on the surface of the pad 2 using an electroplating process, and the material of the protrusion 22 is copper.
[0053] During electrical testing, if the test probe 100 directly contacts the pad 2, it can easily damage the pad 2. In this embodiment, the protrusion 22 serves as a transition between the pad 2 and the test probe 100. The flat surface 221 of the protrusion 22 receives the test probe 100; that is, when the tip of the test probe 100 contacts the protrusion 22, mechanical stress is concentrated on the protrusion 22, preventing damage to the pad 2 and achieving indirect protection of the pad 2. Simultaneously, when the test probe 100 punctures or compresses the protrusion 22, it can form a better electrical contact with the protrusion 22, resulting in a more stable and reliable contact.
[0054] refer to Figure 4In some embodiments, plane 221 includes a rough surface.
[0055] The aforementioned plane 221 is set as a rough surface, which increases the static friction between the tip of the electrical probe 100 and the plane 221, and can reduce the slippage / displacement of the electrical probe 100.
[0056] refer to Figure 4 In some embodiments, the protrusion 22 includes a frustum-shaped structure made of copper, with one end of the frustum-shaped structure facing away from the pad 2 forming a plane 221. Alternatively, the protrusion 22 includes a copper pillar, with one end of the copper pillar facing away from the pad 2 forming a plane 221.
[0057] In this embodiment, both the copper pillar and the frustum structure can achieve the formation of the plane 221. Both the copper pillar and the frustum structure are structurally stable and can withstand the mechanical stress of the electrical probe 100, ensuring the reliability of the electrical contact.
[0058] This application also provides a smart device, including a housing and a packaging substrate as described in any of the above embodiments, wherein the packaging substrate is disposed inside the housing.
[0059] In this embodiment, the smart device can be a smartphone, tablet computer, digital camera, industrial robot, etc.
[0060] The technical advantages of the smart device in this application embodiment are the same as those of the packaging substrate in the above embodiments, and will not be repeated here.
[0061] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0062] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0063] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0064] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0065] In this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0066] Although the above embodiments have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Any changes, modifications, substitutions and variations made to the above embodiments by those skilled in the art are within the protection scope of the present invention.
Claims
1. A package substrate, characterized by, The application relates to a packaging substrate, comprising: a substrate body; a plurality of pads formed on the substrate body, at least part of the pads being configured as measuring points of an electrical measuring probe, the distance between any pad configured as a measuring point and an adjacent pad being L1, the L1 satisfying the relationship 50 mu m<=L1<=80 mu m.
2. The package substrate of claim 1, wherein The distance between any two pads configured as measuring points is L2, the L2 satisfying the relationship L2>=140 mu m.
3. The package substrate of claim 1, wherein The substrate body has a conductive circuit, the distance between any pad configured as a measuring point and an adjacent conductive circuit being L3, the L3 satisfying the relationship 15 mu m<=L3<=20 mu m.
4. The package substrate of claim 1, wherein The periphery of the pad configured as a measuring point is provided with an annular groove extending along the profile direction of the pad, the annular groove being used for accommodating conductive impurities.
5. The package substrate of claim 4, wherein, The groove depth H and groove width W of the annular groove satisfy the relationship 2<=H / W<=3.
6. The package substrate of claim 4, wherein, The groove depth H of the annular groove is 5-15 mu m.
7. The package substrate of claim 1, wherein The pad configured as a measuring point is provided with a protrusion, the side of the protrusion away from the pad forming a plane and having an area greater than the needle tip of the electrical measuring probe, the plane being used for receiving the electrical measuring probe.
8. The package substrate of claim 7, wherein, The plane comprises a rough surface.
9. The package substrate of claim 7, wherein, The protrusion comprises a circular truncated cone structure made of copper, the truncated cone structure comprising a table surface away from the pad and constituting the plane; or The protrusion comprises a copper column, the copper column comprising an end surface away from the pad and constituting the plane.
10. A smart device, comprising: The application further relates to a packaging device, comprising a shell and the packaging substrate as claimed in any one of claims 1-9, the packaging substrate being arranged in the shell.