Coil component, method for manufacturing coil component, and electronic / electrical device

Abstract

One embodiment of the present invention is a coil component (100A) comprising: a coil part (10) having a first spiral conductive part (11) which has a spiral shape when viewed in a first direction, and comprising a coil conductive part (20); a main body part 30 that includes a magnetic powder, has an outer side surface extending in the first direction and two intersecting surfaces arranged in the first direction, and covers at least a part of the coil part 10 at the intersecting surfaces; and a support part (701A, 701B) that is in contact with the coil part (10), forms a first interface (70A) intersecting the first direction, and has a support exposed surface (70B) that is exposed from the body part (30), the support exposed surface (70B) including a first exposed surface (70C) in an in-plane direction along the first direction.

Description

Technical Field

[0001] This invention relates to coil components, methods for manufacturing coil components, and electronic / electrical machines. Background Technology

[0002] Patent Documents 1 and 2 describe coil components in coil assemblies that connect the lead-out portion to an external electrode via connecting electrodes and support electrodes inside the main body. Patent Document 3 describes a coil component having connecting electrodes that connect to the main body along its length in the coil assembly, spanning the lead-out portion, and whose surface perpendicular to the length direction protrudes from the main body. Patent Document 4 describes a coil component in which a planar spiral conductor and an external electrode (lower surface) are connected within a resin layer containing metallic magnetic powder using a protruding electrode formed on the upper surface of a dummy lead-out conductor. Patent Documents 5, 6, and 7 describe coil components in which lead-out electrodes and columnar portions within the blank extend along the axial direction of the coil to connect the coil to a terminal electrode (lower surface).

[0003] [Existing Technical Documents]

[0004] [Patent Literature]

[0005] Patent Document 1: U.S. Patent Application Publication No. 2022 / 0105456

[0006] Patent Document 2: U.S. Patent Application Publication No. 2022 / 0189680

[0007] Patent Document 3: U.S. Patent Application Publication No. 2022 / 0183561

[0008] Patent Document 4: Japanese Patent Application Publication No. 2014-013815

[0009] Patent Document 5: Japanese Patent Application Publication No. 2017-103359

[0010] Patent Document 6: Japanese Patent Application Publication No. 2017-199719

[0011] Patent Document 7: Japanese Patent Application Publication No. 2018-160610 Summary of the Invention

[0012] [The problem the invention aims to solve]

[0013] In coil components, the magnetic properties of the product can change significantly due to the magnetic field generated around the connecting electrodes, support components, etc. Furthermore, when the coil portion is covered by a body portion including magnetic powder, it is desirable to ensure sufficient positional accuracy of the coil portion relative to the body portion and to reduce the resistance of the interface between the connecting electrodes and the leads.

[0014] The object of the present invention is to provide a coil component, a method for manufacturing the coil component, and an electronic / electrical machine that can obtain sufficient positional accuracy of the coil portion relative to the body portion and obtain stable magnetic properties.

[0015] [Technical means to solve the problem]

[0016] One embodiment of the present invention relates to a coil component, characterized in that it comprises: a coil portion having a coil conductive portion, the coil conductive portion including a spiral portion that is spirally shaped when viewed along a first direction; a body portion having an outer surface extending along the first direction and two intersecting surfaces arranged along the first direction, and covering at least a portion of the coil portion on the intersecting surfaces, and including magnetic powder; and a support portion contacting the coil portion and forming a first interface intersecting the first direction; the support portion having a support exposed surface exposed from the body portion, the support exposed surface including a first exposed surface having an in-plane direction along the first direction.

[0017] With this structure, the support portion that contacts the coil portion provides reinforcement in the first direction, thereby improving the positioning accuracy of the coil portion relative to the body portion and increasing the strength of the coil component.

[0018] In the aforementioned coil component, the support portion includes a conductive support conductor portion, and at least a portion of the first interface can be formed by a contact interface between the conductive surface of the support conductor portion and the conductive surface of the coil conductive portion. This increases the connection area between the coil component and conductive materials (e.g., external terminals, solder, etc.).

[0019] In the aforementioned coil component, the exposed support surface may include an exposed conductive surface formed by a support conductor portion. This stabilizes the welding joint between the exposed conductive surface and the external electrode. In this case, the exposed support surface may include an exposed conductive surface exposed between two intersecting surfaces arranged along a first direction.

[0020] At this time, at least a portion of the first exposed surface can be composed of an exposed conductive surface. As a result, the adhesion between the exposed conductive surface of at least a portion of the first exposed surface of the coil component and the conductive material (e.g., external terminal, solder, etc.) is improved.

[0021] In the above-described coil component, the supporting exposed surface includes a second exposed surface intersecting the first direction, and at least a portion of the second exposed surface may be composed of an exposed conductive surface. Therefore, the adhesion between the exposed conductive surface, which is at least a portion of the second exposed surface of the coil component, and a conductive material (e.g., external terminals, solder, etc.) is improved.

[0022] In the above-described coil component, at least a portion of the first exposed surface may be composed of an exposed conductive surface. As a result, the adhesion between the exposed conductive surface, which is at least a portion of the first exposed surface of the coil component, and the conductive material (e.g., external terminal, solder, etc.), and the adhesion between the exposed conductive surface, which is at least a portion of the second exposed surface, and the conductive material (e.g., external terminal, solder, etc.) are improved.

[0023] In the aforementioned coil component, the outer surface can be entirely insulated. This prevents solder from adhering to the outer surface of the coil component and reduces the installation area of ​​the coil component.

[0024] In the aforementioned coil component, at least one of the two intersecting surfaces can be insulated by an insulating layer. This insulates the opposite sides of the mounting surfaces in the coil component, reducing the installation area of ​​the coil component.

[0025] In the aforementioned coil component, the insulating layer may comprise a layer of resin with an average thickness of 0.10 μm to 10.0 μm. This prevents a decrease in magnetic properties caused by the supporting conductor portion and maintains the magnetic properties of the coil component.

[0026] In the aforementioned coil component, an external electrode that contacts the exposed conductive surface can be further provided. This stabilizes the welding joint surface utilizing the external electrode.

[0027] In the coil component described above, the outermost part can also be composed of an exposed conductive surface. This allows the exposed conductive surface to be directly connected to conductive components (e.g., external terminals, solder, etc.), thus miniaturizing the coil component due to the absence of external electrodes.

[0028] In the aforementioned coil component, the coil conductive portion includes a helical portion and a lead-out portion continuously connected to the helical portion in a direction perpendicular to the first direction. The lead-out portion has a lead-out surface exposed from the outer side of the body portion, and at least a portion of the first interface may be formed by a contact interface between the conductive surface of the lead-out portion and the conductive surface of the supporting conductor portion. This suppresses the increase in the length of the lead-out portion and reduces the magnetic flux canceled out by the leads-out portions.

[0029] In the aforementioned coil component, the support portion can be configured to contact the conductive surface of the coil's conductive portion in a gradually tapering manner. This increases the volume of the magnetic powder near the coil's conductive portion, effectively utilizing the magnetic flux.

[0030] In the aforementioned coil component, the exposed lead surface can be configured to extend in a direction perpendicular to the first direction. This improves the adhesion between the exposed lead surface and conductive components (e.g., external terminals, solder, etc.).

[0031] In the aforementioned coil component, the body portion can be configured such that two surfaces parallel to the first direction are connected via a support portion. This reduces the degradation of the magnetic properties of the coil component and improves the adhesion between the support portion and conductive components (e.g., external terminals, solder, etc.).

[0032] In the above-described coil component, the outer surface includes multiple surfaces, and two adjacent surfaces are connected by a connecting portion. The support portion may be configured to protrude from the main body portion at least a portion of the connecting portion. Thus, by using the support portion protruding from the main body portion as the connecting portion, the adhesion between the outer surface of the coil component and conductive components (e.g., external terminals, solder, etc.) is improved.

[0033] In the aforementioned coil component, the body portion has a first recessed portion that is recessed in the first direction for at least one of the two surfaces arranged along the first direction, and at least a portion of the exposed conductive surface can be a concave surface located in the first recessed portion. Thus, the concave surface of the first recessed portion reduces the volume (height) occupied by the coil component after soldering.

[0034] In the aforementioned coil component, the coil portion has a second recess that is recessed in a first direction. At least a portion of the first interface can be formed by at least a portion of the recessed surface, which is formed by the opening edge of the second recess and its internal surface, and the contact interface with the support portion. This ensures the contact interface between the support portion and the coil portion, and improves the bonding strength between the support portion and the coil portion.

[0035] In the aforementioned coil component, the support portion includes a conductive support conductor portion, and at least a portion of the first interface can be formed by a contact interface between the conductive surface of at least a portion of the recessed surface and the conductive surface of the support conductor portion. Thus, conductive contact is achieved between the second recess and the support portion.

[0036] In the aforementioned coil component, the support portion includes a support for the soft magnetic portion, and at least a portion of the first interface is formed by the contact interface between the support for the soft magnetic portion and the coil portion. The relative permeability of the support for the soft magnetic portion in a first direction can be configured to be greater than the relative permeability of the main body portion in a first direction. Therefore, by supporting the soft magnetic portion with the support portion, the magnetic properties of the coil component are improved.

[0037] In the aforementioned coil component, the main body can be configured such that two surfaces parallel to the first direction are connected via a support portion. This improves the magnetic properties of the coil component.

[0038] In the above-described coil component, the outer surface has multiple surfaces, and two adjacent surfaces are connected by a connecting portion. The support portion may be configured to protrude from the main body portion at least a portion of the connecting portion. Thus, by using the support portion protruding from the main body portion as the connecting portion, the adhesion between the outer surface of the coil component and conductive components (e.g., external terminals, solder, etc.) is improved.

[0039] In the aforementioned coil component, the body portion includes a cuboid shape with sides parallel to the first direction, and the support portion can be configured to include at least one of the four ends of the body portion parallel to the first direction. This improves the magnetic properties of the coil component.

[0040] In the aforementioned coil components, the supporting soft magnetic part can be an insulator. This reduces the eddy current losses of the coil components.

[0041] In the aforementioned coil component, the support portion has a structure that supports a soft magnetic portion, and the relative permeability of the supporting soft magnetic portion in a first direction is greater than the relative permeability of the main body portion in a first direction. This improves the magnetic properties of the coil component.

[0042] Another embodiment of the present invention relates to a method for manufacturing a coil component, comprising: a first step of forming a conductor pattern including a plurality of helical portions that are spirally shaped when viewed along a first direction and connecting portions connecting the plurality of helical portions; a second step of forming a support member extending from the connecting portions in the first direction after the first step; a third step of supplying a material including magnetic powder to cover at least two sides of the conductor pattern in the first direction and forming it into a sheet; and a fourth step of cutting the sheet in a manner parallel to the cutting surface in the first direction, separating the sheet into a plurality of first components (articles) including a portion of the helical portions and the connecting portions and a second component including a residual portion of the connecting portions. In the fourth step, the second component includes all or part of the support member. This simplifies the manufacturing process of the coil component while improving the positional accuracy of the coil portion relative to the body portion.

[0043] In the above-described method for manufacturing coil components, the first step may include a configuration that, after forming a conductor pattern, provides an insulating portion on the surface of the conductor pattern.

[0044] In the above-described method for manufacturing coil components, the second step may include forming an insulating portion on the surface of the conductor pattern and the surface of the supporting component after forming the supporting component.

[0045] In the above-described method for manufacturing coil components, the first component separated in the fourth step may include a portion of the support component.

[0046] In the above-mentioned method for manufacturing coil components, in the fourth step, the structure may be as follows: before separating the first component from the second component, the portion of the plate in which the support component is disposed is half-cut from the first direction to form a linear recess in which the support component is exposed on the bottom surface and extends along a second direction orthogonal to the first direction; the plate is cut by passing the dividing line between the first component and the second component through the bottom surface of the linear recess to form a step portion on the first component in which the support component is exposed below the step.

[0047] In the above-described method for manufacturing coil components, the fourth step may include: removing a portion of the connecting portion or a portion of the supporting component to expose a conductive surface, forming an electrode electrically connected to the conductive surface, and then separating the first component and the second component.

[0048] In the above-described method for manufacturing coil components, the fourth step may include the entire configuration of the second component, including the supporting component.

[0049] In the above-described method for manufacturing coil components, in the fourth step, the first component may include a portion of a support component, with the support component protruding from the surface of the first component.

[0050] In the above-described method for manufacturing a coil component, a fifth step may be included, which further comprises forming an external electrode on the conductive surface of the first component.

[0051] Another embodiment of the present invention provides an electronic / electrical machine in which the above-described coil component is mounted. In this electronic / electrical machine, the coil component has a terminal portion provided at each of the exposed conductive portions at both ends of the coil conductive portion, which is exposed to the outside, and is connected to a substrate.

[0052] [The effects of the invention]

[0053] According to the present invention, a coil component capable of obtaining sufficient positional accuracy of the coil portion relative to the body portion and capable of obtaining stable magnetic properties, a method for manufacturing the coil component, and an electronic / electrical machine can be provided. Attached Figure Description

[0054] Figure 1 This is a perspective view conceptually illustrating the shape of the coil component according to the first embodiment of the present invention.

[0055] Figure 2 This is a diagram illustrating the structure of the coil conductive portion of the coil component according to the first embodiment of the present invention.

[0056] Figure 3 This is an XY plan view illustrating the structure of the first helical conductive portion of the coil component according to the first embodiment of the present invention.

[0057] Figure 4 This is an XY plan view illustrating the structure of the second helical conductive portion of the coil component according to the first embodiment of the present invention.

[0058] Figure 5A This is an XZ plane cross-sectional view illustrating the structure of the coil component according to the first embodiment of the present invention.

[0059] Figure 5B This is a YZ plane cross-sectional view illustrating the structure of the coil component according to the first embodiment of the present invention.

[0060] Figure 6 This is an XY plan view illustrating the structure of the first helical conductive portion of the coil component according to the second embodiment of the present invention.

[0061] Figure 7A This is an XZ plane cross-sectional view illustrating the structure of the coil component according to the second embodiment of the present invention.

[0062] Figure 7B This is a YZ plane cross-sectional view illustrating the structure of the coil component according to the second embodiment of the present invention.

[0063] Figure 8 This is an XY plan view illustrating the structure of the first helical conductive part of the coil component according to the third embodiment of the present invention.

[0064] Figure 9A This is an XZ plane cross-sectional view illustrating the structure of the coil component according to the third embodiment of the present invention.

[0065] Figure 9B This is a YZ plane cross-sectional view illustrating the structure of the coil component according to the third embodiment of the present invention.

[0066] Figure 10 This is an XY plan view illustrating the structure of the first helical conductive portion of the coil component according to the fourth embodiment of the present invention.

[0067] Figure 11A This is an XZ plane cross-sectional view illustrating the structure of the coil component according to the fourth embodiment of the present invention.

[0068] Figure 11B This is a YZ plane cross-sectional view illustrating the structure of the coil component according to the fourth embodiment of the present invention.

[0069] Figure 12 This is an XY plan view illustrating the structure of the first helical conductive portion of the coil component according to the fifth embodiment of the present invention.

[0070] Figure 13A This is an XZ plane cross-sectional view illustrating the structure of the coil component according to the fifth embodiment of the present invention.

[0071] Figure 13B This is a YZ plane cross-sectional view illustrating the structure of the coil component according to the fifth embodiment of the present invention.

[0072] Figure 14 This is an XY plan view illustrating the structure of the first helical conductive portion of the coil component according to the sixth embodiment of the present invention.

[0073] Figure 15A This is an XZ plane cross-sectional view illustrating the structure of the coil component according to the sixth embodiment of the present invention.

[0074] Figure 15B This is a YZ plane cross-sectional view illustrating the structure of the coil component according to the sixth embodiment of the present invention.

[0075] Figure 16 This is an XY plan view illustrating the structure of the first helical conductive portion of the coil component according to the seventh embodiment of the present invention.

[0076] Figure 17A This is an XZ plane cross-sectional view illustrating the structure of the coil component according to the seventh embodiment of the present invention.

[0077] Figure 17B This is a YZ plane cross-sectional view illustrating the structure of the coil component according to the seventh embodiment of the present invention.

[0078] Figure 18 This is a partial cross-sectional view showing an example of the second recess.

[0079] Figure 19A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0080] Figure 19B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0081] Figure 20A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0082] Figure 20B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0083] Figure 21A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0084] Figure 21B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0085] Figure 22A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0086] Figure 22B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0087] Figure 23A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0088] Figure 23B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0089] Figure 24A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0090] Figure 24B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0091] Figure 25A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0092] Figure 25B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0093] Figure 26A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0094] Figure 26B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0095] Figure 26C This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0096] Figure 27A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0097] Figure 27B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0098] Figure 27C This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the first embodiment.

[0099] Figure 28A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0100] Figure 28BThis is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0101] Figure 29A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0102] Figure 29B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0103] Figure 30A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0104] Figure 30B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0105] Figure 31A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0106] Figure 31B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0107] Figure 32A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0108] Figure 32B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0109] Figure 33A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0110] Figure 33B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0111] Figure 34A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0112] Figure 34B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0113] Figure 35A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0114] Figure 35B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0115] Figure 35C This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0116] Figure 36A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0117] Figure 36B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0118] Figure 36C This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the second embodiment.

[0119] Figure 37A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the third embodiment.

[0120] Figure 37B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the third embodiment.

[0121] Figure 38A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the third embodiment.

[0122] Figure 38B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the third embodiment.

[0123] Figure 39A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the third embodiment.

[0124] Figure 39B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the third embodiment.

[0125] Figure 39C This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the third embodiment.

[0126] Figure 40A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the third embodiment.

[0127] Figure 40B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the third embodiment.

[0128] Figure 40C This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the third embodiment.

[0129] Figure 41A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fourth embodiment.

[0130] Figure 41B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fourth embodiment.

[0131] Figure 42A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fourth embodiment.

[0132] Figure 42B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fourth embodiment.

[0133] Figure 43A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fourth embodiment.

[0134] Figure 43B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fourth embodiment.

[0135] Figure 43C This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fourth embodiment.

[0136] Figure 44A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fourth embodiment.

[0137] Figure 44B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fourth embodiment.

[0138] Figure 44C This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fourth embodiment.

[0139] Figure 45A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fifth embodiment.

[0140] Figure 45B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fifth embodiment.

[0141] Figure 46A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fifth embodiment.

[0142] Figure 46B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fifth embodiment.

[0143] Figure 46C This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the fifth embodiment.

[0144] Figure 47A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0145] Figure 47B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0146] Figure 48A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0147] Figure 48B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0148] Figure 49A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0149] Figure 49B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0150] Figure 50A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0151] Figure 50B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0152] Figure 51A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0153] Figure 51B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0154] Figure 52A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0155] Figure 52B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0156] Figure 53A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0157] Figure 53B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0158] Figure 54A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0159] Figure 54B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0160] Figure 54C This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0161] Figure 55A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0162] Figure 55B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0163] Figure 55C This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the sixth embodiment.

[0164] Figure 56A This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0165] Figure 56B This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0166] Figure 57A This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0167] Figure 57B This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0168] Figure 58A This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0169] Figure 58B This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0170] Figure 59A This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0171] Figure 59B This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0172] Figure 60A This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0173] Figure 60B This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0174] Figure 61AThis is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0175] Figure 61B This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0176] Figure 62A This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0177] Figure 62B This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0178] Figure 63A This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0179] Figure 63B This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0180] Figure 64A This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0181] Figure 64B This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0182] Figure 65A This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0183] Figure 65B This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0184] Figure 66A This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0185] Figure 66B This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0186] Figure 66C This is an explanatory diagram illustrating an example of another manufacturing method for the coil component of the second embodiment.

[0187] Figure 67A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0188] Figure 67BThis is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0189] Figure 68A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0190] Figure 68B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0191] Figure 69A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0192] Figure 69B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0193] Figure 70A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0194] Figure 70B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0195] Figure 71A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0196] Figure 71B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0197] Figure 72A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0198] Figure 72B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0199] Figure 73A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0200] Figure 73B This is an explanation of an example of the method for manufacturing a coil component according to the seventh embodiment.

[0201] Figure 74A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0202] Figure 74B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0203] Figure 75 This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0204] Figure 76A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0205] Figure 76B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0206] Figure 77A This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0207] Figure 77B This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0208] Figure 77C This is an explanatory diagram illustrating an example of the coil component manufacturing method according to the seventh embodiment.

[0209] Figure 78A This is an explanatory diagram illustrating an example of the pad structure in this embodiment.

[0210] Figure 78B This is an explanatory diagram illustrating an example of the pad structure in this embodiment.

[0211] Figure 79A This is a schematic cross-sectional view of the installation status of the example supported components.

[0212] Figure 79B This is a schematic cross-sectional view of the installation status of the example supported components.

[0213] Figure 80A This is an explanatory diagram illustrating another example of the pad structure in this embodiment.

[0214] Figure 80B This is a schematic cross-sectional view of the installation status of the example supported components. Detailed Implementation

[0215] The following is a reference to the appendix. Figure 1 The embodiments of the present invention will be described in detail below.

[0216] (Coil component)

[0217] (First Implementation)

[0218] Figure 1 This is a perspective view conceptually illustrating the shape of the coil component according to the first embodiment. Figure 2This is a diagram illustrating the structure of the coil conductive portion included in the coil component of the first embodiment. Figure 2 For ease of explanation, the conductive part of the coil is depicted with solid lines, the body part is depicted with dashed lines, and the representation of other constituent elements is omitted. Figure 3 This is an XY plan view illustrating the structure of the first helical conductive portion of the coil component according to the first embodiment. Figure 3 For ease of explanation, the conductive part of the coil is depicted with solid lines, the main body is depicted with dashed lines, and the representation of other constituent elements is omitted. Figure 4 This is an XY plan view used to explain the structure of the second spiral conductive part provided by the coil component in the first embodiment. Figure 5A and Figure 5B This is a cross-sectional view used to illustrate the coil section structure of the coil component in the first embodiment. Furthermore, Figure 2 This is a diagram obtained from the Z1 side of the Z1-Z2 direction. Figure 3 These are also diagrams viewed from the Z1 side in the Z1-Z2 direction. In these diagrams, only the coil conductive part is shown in the coil section, while the body, terminal part, and outer casing are indicated by dashed lines. Figure 4 Only the conductive portion of the coil as seen from the Z2 side in the Z1-Z2 direction is depicted. Figure 5A In the diagram, the main body, terminal parts, and outer casing are indicated by dashed lines, and the diagram shows... Figure 3 The cross-section at line A-A' is taken as the XZ cross-section. Figure 5B In the diagram, the main body and outer casing are indicated by dashed lines, and the diagram shows... Figure 3 The section at line B-B' is used as the YZ section.

[0219] (Overall composition)

[0220] According to one embodiment of the present invention, the coil component 100 includes: a coil portion 10 having a coil conductor portion 20, a body portion 30, a first external electrode 41, a second external electrode 42, an outer casing 50, 60, and support portions 701A, 701B.

[0221] (coil)

[0222] like Figure 2 and Figure 3 As shown, the coil portion 10 has an axis O extending along a first direction (Z1-Z2 direction). A first helical conductor portion 11, extending from the inner circumferential end 12 of one pair of ends of the first helical conductor portion 11 towards the outer circumferential end 13 of the same pair of ends, presents a helical shape away from the axis O, and includes a coil conductor portion 20 as a first coil conductor portion 201. That is, the first helical conductor portion 11 is one of the helical portions included in the coil conductor portion 20. Figure 2 In the first helical conductor portion 11, when viewed from the Z1 side in the Z1-Z2 direction, the conductor is arranged in a clockwise spiral shape from the inner peripheral end 12 to the outer peripheral end 13. In this specification, the "spiral direction" of the helical portion refers to the direction extending from the inner peripheral end to the outer peripheral end.

[0223] The conductor (conductive material) constituting the coil conductor portion 20 is not limited as long as it has suitable conductivity. Copper, copper alloys, aluminum, aluminum alloys, and other metals are specific examples of conductors constituting the coil conductor portion 20. For example, the coil conductor portion 20 can be manufactured using film-forming techniques such as electroplating. The coil portion 10 has an insulating coil insulation portion (…) on the surface of its coil conductor portion 20. Figures 1 to 4 (Not shown). This coil insulation ensures insulation between adjacent conductors (between opposing conductor surfaces) in the coil conductor section 20. The coil insulation is made of, for example, resin material. No coil insulation is provided at the ends of the two ends of the coil conductor section 20 (first lead-out 14, second lead-out 24), where the coil section 10 can be electrically connected to other components.

[0224] like Figure 2 and Figure 4 As shown, the coil conductor portion 20 includes a second coil conductor portion 202, which has a second helical conductor portion 21 arranged side-by-side with the first helical conductor portion 11 along a first direction. That is, in this embodiment, the coil conductor portion 20 includes a plurality of helical portions, specifically, the coil conductor portion 20 includes two helical portions formed by the first helical conductor portion 11 and the second helical conductor portion 21. The second helical conductor portion 21, around the axis O in the first direction (Z1-Z2 direction), extends from one end 22 of the inner peripheral side of the second helical conductor portion 21 toward the other end 23 of the outer peripheral side of the second helical conductor portion 21, presenting a helical shape away from the axis O. When viewed from the Z1 side in the Z1-Z2 direction, the conductor of the second helical conductor portion 21 is in the opposite direction to the first helical conductor portion 11. Figure 2 The coil is arranged in a spiral (counter-clockwise). The average value of the spacing between the first spiral conductor portion 11 and the second spiral conductor portion 21 in the first direction (Z1-Z2 direction) is not particularly limited. A smaller spacing makes it easier to reduce the height (Z1-Z2 direction dimension) of the coil component 100, but if it is too small, the insulation between the first spiral conductor portion 11 and the second spiral conductor portion 21 is easily reduced. From the perspective of balancing low height and high insulation of the coil component 100, the spacing is preferably 0.4 μm or more and 20 μm or less. In terms of manufacturing, to reduce deviations in the spacing and more reliably support the coil in the same plane, the spacing is more preferably 1.0 μm or more, and even more preferably 5.0 μm or more.

[0225] The end 12 of the first helical conductor portion 11 and the end 22 of the second helical conductor portion 21 are electrically connected through a through-hole portion VP. Starting from the portion connecting the through-hole portion VP, the first helical conductor portion 11 and the second helical conductor portion 21 spiral in opposite directions. The through-hole portion VP can be made of the same conductor as the coil conductor portion 20. In one specific example, the through-hole portion VP is made of the same material as the first helical conductor portion 11 and the second helical conductor portion 21, and the first helical conductor portion 11 and the second helical conductor portion 21 are manufactured simultaneously. In this case, the through-hole portion VP is integrated with the end 12 of the first helical conductor portion 11 and the end 22 of the second helical conductor portion 21.

[0226] The first lead-out portion 14 is connected to the end 13 of the first helical conductor portion 11 as part of the first coil conductor portion 201, and the second lead-out portion 24 is connected to the end 23 of the second helical conductor portion 21 as part of the second coil conductor portion 202. Therefore, the end 13 of the first helical conductor portion 11 is essentially the interface with the first lead-out portion 14, and the end 23 of the second helical conductor portion 21 is essentially the interface with the second lead-out portion 24. In one specific example, the first lead-out portion 14 and the second lead-out portion 24 are made of the same material as the first helical conductor portion 11 and the second helical conductor portion 21, and are manufactured simultaneously with them. In this case, the first lead-out portion 14 has an integrated portion without an interface with the end 13 of the first helical conductor portion 11, and the second lead-out portion 24 has an integrated portion without an interface with the end 23 of the second helical conductor portion 21.

[0227] In other words, in this embodiment, the coil conductor portion 20 includes: a first coil conductor portion 201 having a first spiral conductor portion 11 and a first lead-out portion 14, a second coil conductor portion 202 having a second spiral conductor portion 21 and a second lead-out portion 24, and a through-hole portion VP, and these components are formed of a common conductive material.

[0228] (Main part)

[0229] The body portion 30 includes magnetic powder, has an outer surface formed by a plurality of surfaces extending along a first direction, and two intersecting surfaces arranged along the first direction. The body portion 30 covers at least a portion of the coil portion 10 through the two intersecting surfaces. In this embodiment, the body portion 30 has a generally cuboid shape, has two outer surfaces 30a and 30b arranged along the X1-X2 direction and two outer surfaces 30c and 30d arranged along the Y1-Y2 direction, and has two intersecting surfaces 30e and 30f arranged along the first direction, which serve as the plurality of surfaces. Furthermore, the body portion 30 includes the portion other than the outermost (X2 side in the X1-X2 direction) end face of the first lead-out portion 14 located at the end of the coil portion 10, and the outermost (X1 side in the X1-X2 direction) end face of the second lead-out portion 24.

[0230] The microstructure of magnetic powders is not limited. This microstructure can contain either a crystalline or amorphous phase. Here, crystalline materials are defined as materials composed of a crystalline phase, amorphous materials are defined as materials composed of an amorphous phase, and composite materials are defined as materials composed of both crystalline and amorphous phases. When the diffraction spectrum obtained using conventional X-ray diffraction contains sharp diffraction peaks that can identify the type of crystalline phase, the material does not contain a crystalline phase. Furthermore, when the diffraction spectrum obtained using conventional X-ray diffraction contains broad peaks representing an amorphous phase, the material contains an amorphous phase. When the DSC curve obtained by differential thermal analysis shows peaks indicating crystallization, i.e., when there is heat generated accompanying the phase transition from an amorphous phase to a crystalline phase, the material also contains an amorphous phase.

[0231] There are no limitations on the types of materials used in magnetic powders. Specific examples of crystalline materials include Fe-Si-Cr alloys, Fe-Ni alloys, Fe-Co alloys, Fe-V alloys, Fe-Al alloys, Fe-Si alloys, Fe-Si-Al alloys, pure iron, and ferrites. Carbonyl iron powder is preferred as a pure iron powder. Specific examples of amorphous materials include Fe-Si-B alloys, Fe-PC alloys, and Co-Fe-Si-B alloys. Specific examples of composite materials include Fe-Zr alloys, Fe-Zr-B alloys, Fe-Si-B-Nb-Cu alloys, and Fe-Si-BP-Cu alloys. If the magnetic powder is an Fe-containing metal powder, the synergistic effect on improving magnetic properties is particularly significant.

[0232] The chemical composition of the magnetic powder is not limited. For example, an Fe-Si-Cr alloy may consist of 1.0 to 10.0% by mass of Si, 1.0 to 10.0% by mass of Cr, Fe, and the remainder consisting of impurities. Similarly, an Fe-Ni alloy may consist of 1.0 to 99.0% by mass of Ni, Fe, and the remainder consisting of impurities. Furthermore, an Fe-PC alloy may consist of 1.0 to 13.0 atomic% of P, 1.0 to 13.0 atomic% of C, Fe, and the remainder consisting of impurities. This Fe-PC alloy may contain one or more elements selected from the group consisting of Ni, Sn, Cr, B, and Si. In this case, for example, the amount of Ni may be 0 to 10.0 atomic%, the amount of Sn may be 0 to 3.0 atomic%, the amount of Cr may be 0 to 6.0 atomic%, the amount of B may be 0 to 9.0 atomic%, and the amount of Si may be 0 to 7.0 atomic%. The amount of Fe is preferably 65 atomic% or more. Alternatively, for example, Fe-Si-B-Nb-Cu alloys may contain 1.0 to 16.0 atomic% Si, 1.0 to 15.0 atomic% B, 0.50 to 5.0 atomic% Nb, 0.50 to 5.0 atomic% Cu, and the remainder consisting of Fe and impurities. In this case, the amount of Fe is preferably 65 atomic% or more.

[0233] The shape of the magnetic powder is not limited. The magnetic powder can be spherical, elliptical, flake-like, or have an amorphous shape. The manufacturing method used to obtain these shapes is also not limited.

[0234] The particle size distribution of the magnetic powder is not limited. For example, the particle size distribution can be obtained by analyzing an image (secondary electron image) of a cross-section of the body portion 30 taken using a scanning electron microscope. For instance, the average equivalent circle diameter of the magnetic powder can be 0.50 to 50.0 μm. The distribution of the equivalent circle diameter can also contain multiple peaks.

[0235] Magnetic powders can undergo surface insulation treatment. When the magnetic powder undergoes surface insulation treatment, the insulation resistance of the body portion 30 increases. There is no limitation on the type of surface insulation treatment applied to the magnetic powder. Examples include phosphoric acid treatment, phosphate treatment, oxidation treatment, etc. The magnetic powder can have an insulating film on the surface of the magnetic particles. This insulating film can contain at least one element selected from the group consisting of Si, P, and B, and O (oxygen).

[0236] Magnetic powder can also be a mixture of multiple powder materials. Preferably, the magnetic powder is a strongly magnetic material, and more preferably, a soft magnetic material.

[0237] The main body 30 may also contain any auxiliary material. Such auxiliary material may be, for example, a binder or a modifier. The binder binds the magnetic powder or other particles contained in the main body 30 together. To impart insulation resistance to the main body 30, this binder is preferably an insulating material.

[0238] The adhesive material can be either organic or inorganic. Organic materials can be resins. Examples of resins include acrylic resins, silicone resins, epoxy resins, phenolic resins, urea-formaldehyde resins, melamine resins, and polyester resins. Inorganic materials can be glass-like materials such as water glass. The adhesive material can be a product of a reaction such as thermal decomposition, or a mixture of multiple materials.

[0239] Modifiers can be used to improve the flowability of powders or adjust the curing speed of binder materials. Modifiers can be glass-based materials.

[0240] The dimensions of the body portion 30 are not limited. For example, the maximum dimension of the body portion 30 may be 3.2 mm or less.

[0241] (external terminal)

[0242] like Figure 2 As shown, the outermost (X2 side in the X1-X2 direction) end face (lead-out surface 140) of the first lead-out portion 14 located at the end of the coil portion 10 and the outermost (X1 side in the X1-X2 direction) end face (lead-out surface 240) of the second lead-out portion 24 are exposed from the body portion 30 on the side surface of the body portion 30 arranged in the X1-X2 direction. The first terminal portion 41 is configured to make electrical contact with the lead-out surface 140, and the second terminal portion 42 is configured to make electrical contact with the lead-out surface 240.

[0243] The first terminal portion 41 has a side portion 41a that covers the side portion of the main body portion 30 on the X2 side in the X1-X2 direction. The second terminal portion 42 has a side portion 42a that covers the side portion of the main body portion 30 on the X1 side in the X1-X2 direction. The first terminal portion 41 also has a bottom portion that is provided to cover a portion of the bottom surface (the surface on the Z2 side in the Z1-Z2 direction) of the main body portion 30. Furthermore, the second terminal portion 42 has a bottom portion on the bottom surface of the main body portion 30 that is separately provided from the bottom portion of the first terminal portion 41 and covers a portion of its bottom surface. These bottom portions are the portions that face the substrate during use.

[0244] The positions of the first terminal portion 41 and the second terminal portion 42 are not limited to the positions described above. The first terminal portion 41 and the second terminal portion 42 may be formed to cover a portion of the upper surface (the surface on the Z1 side in the Z1-Z2 direction) of the main body portion 30. Alternatively, the first terminal portion 41 and the second terminal portion 42 may be provided only on a portion of the bottom surface (the surface on the Z2 side in the Z1-Z2 direction) of the main body portion 30. In this case, the coil conductor portion 20 may have a connecting conductor portion (not shown) that connects to the bottom surface of the main body portion 30 through the interior of the main body portion 30 from the two ends (first lead-out portion 14, second lead-out portion 24) of the coil portion 10. In this case, the two ends (lead-out portions exposed surfaces 140, 240) of the coil portion 10 may not be exposed to the side surface of the main body portion 30, but the connecting conductor portion may be exposed to the bottom surface of the main body portion 30.

[0245] The materials and structures of the first terminal portion 41 and the second terminal portion 42 are not limited as long as they have suitable conductivity. As a non-limiting example of the first terminal portion 41 and the second terminal portion 42, a layer with a Cu / Ni / Sn plating structure is provided starting from the side near the surface of the body portion 30. The first terminal portion 41 and the second terminal portion 42 may also be composed of a coating-type electrode formed by dispersing a conductive material such as silver in a resin or the like. Furthermore, the first terminal portion 41 and the second terminal portion 42 may also be a combination of a plating layer and a coating-type electrode.

[0246] The materials and structures of the first terminal portion 41 and the second terminal portion 42 are not limited as long as they have suitable conductivity. As a non-limiting example of the first terminal portion 41 and the second terminal portion 42, a layer with a Cu plating / Ni plating / Sn plating structure on one side near the surface of the body portion 30 can be cited. The first terminal portion 41 and the second terminal portion 42 may also be composed of a coating-type electrode formed by dispersing a conductive material such as silver in a resin or the like. Furthermore, the first terminal portion 41 and the second terminal portion 42 may also be a combination of a plating and a coating-type electrode.

[0247] (Outer packaging)

[0248] An insulating outer sheath 50 and 60, serving as an insulating layer, are respectively provided on a cross surface 30f on the Z2 side in the Z1-Z2 direction of the main body 30 and on the side surface arranged along the Y1-Y2 direction. The outer sheath 50 and 60 may also be provided on the mounting surface of the coil component 100A (the surface on the cross surface 30e side in the Z1-Z2 direction of the main body 30). For example, when each of the first terminal portion 41 and the second terminal portion 42 has a bottom portion extending to a portion of the cross surface 30e side of the main body 30, the insulating outer sheath may also be provided on the portion of the cross surface 30e of the main body 30 where these bottom portions are not provided. The outer sheath 50 and 60 may comprise a layer of resin with an average thickness of 0.10 μm to 10.0 μm. Therefore, it is easy to maintain the magnetic properties of the coil component 100A, or to improve the reliability of the coil component 100A by increasing the insulation of its surface, or to improve its appearance. Furthermore, the coil component 100A may not have the outer casing 50, 60. The outer casing 50, 60 can be formed at any position on the surface of the body portion 30, depending on the purpose.

[0249] (Imagine a conductive part)

[0250] The coil component 100A of this embodiment includes a first dummy conductive portion 72 and a second dummy conductive portion 71 that are non-spiral in shape. For example... Figure 5A as well as Figure 5B As shown, the first dummy conductive portion 72 and the first lead-out portion 14 sandwich the first insulating portion 90 facing each other in the first direction (Z1-Z2 direction), and each has a portion that contacts the first insulating portion 90. Furthermore, the first dummy conductive portion 72 and the second conductive portion 202 (specifically the second outer peripheral side turn 213) are spaced apart from each other in a direction intersecting the first direction (specifically the X1-X2 direction).

[0251] Due to the presence of the first dummy conductive part 72, a component made of conductor is arranged in the first direction of the first lead-out part 14, similar to the first spiral conductive part 11. Therefore, when an external force is applied along the first direction to arrange magnetic powder around the coil part 10, pressure deviation is less likely to occur, thereby reducing the likelihood of deformation of the coil part 10.

[0252] Furthermore, in this example, since there is no conductive material between the first dummy conductive portion 72 and the first lead-out portion 14, when the coil portion 10 is observed alone, the first dummy conductive portion 72 and the first lead-out portion 14 are electrically insulated from each other. Therefore, the first dummy conductive portion 72 is electrically insulated from both the first conductive portion 201 and the second conductive portion 202.

[0253] In addition, Figure 5AIn this configuration, the outer side (X2 side in the X1-X2 direction) end (dummy end face 72E) of the first dummy conductive portion 72 is exposed, but it is not limited to this. For example, it may be configured such that the second insulating portion 80 contacts the dummy end face 72E.

[0254] The structure of the second dummy conductive portion 71 is the same as that of the first dummy conductive portion 72. That is, the second dummy conductive portion 71 and the second lead-out portion 24 sandwich the first insulating portion 90 in the first direction (Z1-Z2 direction), have a portion that contacts the first insulating portion 90, and are spaced apart from the first conductive portion 201 (specifically the first outer peripheral side turn 113) in a direction intersecting the first direction (specifically the X1-X2 direction). With this configuration, the second dummy conductive portion 71 is also electrically insulated from both the first conductive portion 201 and the second conductive portion 202. In addition, since the first dummy conductive portion 72 and the first conductive portion 201 are electrically connected to each other through the first terminal portion 41, they do not necessarily need to be in an insulating state. Similarly, since the second dummy conductive portion 71 and the second conductive portion 202 are electrically connected to each other through the second terminal portion 42, they do not necessarily need to be in an insulating state. Therefore, the first dummy conductive portion 72 and the first conductive portion 201 can be in direct contact or electrically connected through a conductor portion in a through hole. Similarly, the second dummy conductive part 71 and the second conductive part 202 can also be in direct contact or electrically connected through a conductor in a via. This electrical connection helps to expand the current path of the coil, thereby reducing DCR.

[0255] (First Insulation Section)

[0256] like Figure 5A As shown in the cross-sectional view of FIG5, the coil insulation portion includes a first insulation portion 90 that contacts one of the ends of the first helical conductor portion 11 on the first direction side, specifically, at least a portion of the end opposite to the second helical conductor portion 21 (Z2 side in the Z1-Z2 direction). The first insulation portion 90 shown in the cross-sectional view of FIG5 contacts one of the ends of the second helical conductor portion 21 on the first direction side, specifically, at least a portion of the end opposite to the first helical conductor portion 11 (Z1 side in the Z1-Z2 direction), on the opposite side (Z2 side in the Z1-Z2 direction). In other words, the first insulation portion 90 is located between and contacts the first helical conductor portion 11 and the second helical conductor portion 21 arranged along the first direction. Thus, the first insulation portion 90 contacts the first helical conductor portion 11, thereby ensuring the insulation of the first helical conductor portion 11. Furthermore, as... Figure 5BAs shown in the cross-sectional view, the first insulating part 90 simultaneously contacts the first spiral conductor part 11 and the second spiral conductor part 21, thereby stably preventing short circuits between the first spiral conductor part 11 and the second spiral conductor part 21.

[0257] The material constituting the first insulating part 90 is not limited, as long as it has suitable insulating properties. The volume resistivity of the first insulating part 90, measured according to ASTM D257, is preferably 1.0 × 10⁻⁶. 14 Ω·cm or more, more preferably 1.0 × 10 15 Ω·cm or higher, more preferably 1.0 × 10⁻⁶ 16 Above Ω·cm. There is no specific upper limit to the volume resistivity. The volume resistivity may not exceed 1.0 × 10⁻⁶. 20 Ω·cm. Furthermore, the first insulating portion 90 preferably has good dielectric properties; specifically, its dielectric constant at 60 Hz, as measured according to ASTM D150, is preferably 4.0 or less, more preferably 3.5 or less, and even more preferably 3.0 or less. There is no particular limitation on the lower limit of the dielectric constant. The dielectric constant may be 1.0 or higher. The methods for determining the volume resistivity and dielectric constant of the first insulating portion 90 are not limited as long as results equivalent to ASTM D257 and D150 can be obtained. For example, a test sample of the required size can be prepared from a material equivalent to the first insulating portion 90, the constituent materials can be determined by analytical methods such as compositional analysis or FT-IR, and the properties such as volume resistivity of the material can be evaluated.

[0258] The material constituting the first insulating part 90 can be an organic material, an inorganic material, or a composite material of organic and inorganic materials. When the first insulating part 90 is composed of a composite material, the inorganic material can be in particulate form and dispersed in a matrix composed of organic materials. Specific examples of organic materials include: polyimide resin, polyethylene resin, polypropylene resin, polyamide resin, polyester resin, polyamide-imide resin, polysulfone resin, polycarbonate resin, liquid crystal polymer resin, polyvinylidene fluoride resin, polytetrafluoroethylene resin, etc. Inorganic materials, especially inorganic materials in composite materials, include: oxides, carbides, nitrides, inorganic salts, etc. For example, oxides include silicon dioxide, alumina, and zirconium oxide; carbides and nitrides include silicon carbide and boron nitride, respectively; inorganic salts include wollastonite, kaolin, mica, etc. In terms of cost and insulation, oxide-based materials such as oxides, silicates, and phosphates are more preferred. For example, the inorganic material preferably contains at least one selected from the group consisting of silicon (Si), phosphorus (P), boron (B), and calcium (Ca).

[0259] (Second Insulation Section)

[0260] The coil insulation portion has a second insulation portion 80, such as Figure 5A As shown, the second insulating portion 80 is disposed on at least a portion of the surface of the first helical conductor portion 11 and the surface of the second helical conductor portion 21.

[0261] In this embodiment, the material constituting the second insulating portion 80 is not limited as long as it has suitable insulating properties. For example, the second insulating portion 80 is a thermoplastic material, including thermoplastic resins containing p-xylene-based polymers. Other examples of thermoplastic resins include polyethylene, polypropylene, polyamide, polyester, polyamide-imide, polyimide, polysulfone, polycarbonate, liquid crystal polymers, polyvinylidene fluoride, polytetrafluoroethylene, etc. It is preferred that the second insulating portion 80 is thermoplastic as a whole. In addition, inorganic insulating particles may be contained in the above-mentioned thermoplastic resin. Furthermore, the second insulating portion 80 may be made of the same material as the first insulating portion 90.

[0262] The second insulating portion 80 preferably has excellent insulation properties; specifically, its volume resistivity, measured according to ASTM D257, is preferably 1.0 × 10⁻⁶. 14 Ω·cm or more, more preferably 1.0 × 10 15 Ω·cm or higher, more preferably 1.0 × 10⁻⁶ 16 Above Ω·cm. There is no specific upper limit to the volume resistivity. The volume resistivity may not exceed 1.0 × 10⁻⁶. 20 Ω·cm. Furthermore, the second insulating portion 80 preferably has good dielectric properties; specifically, its dielectric constant at 60 Hz, as measured according to ASTM D150, is preferably 4.0 or less, more preferably 3.5 or less, and even more preferably 3.0 or less. There is no particular limitation on the lower limit of the dielectric constant. The dielectric constant may be 1.0 or higher. The volume resistivity and specific dielectric constant can be determined by preparing a test sample of the required size from the material corresponding to the second insulating portion 80. The material corresponding to the second insulating portion 80 can be confirmed by analytical methods such as compositional analysis or FT-IR, in the same manner as the determination method for the first insulating portion 90.

[0263] (Support Department)

[0264] The support portions 701A and 701B can be, for example, solder balls, heterogeneous solder balls (copper-core solder balls, resin-core solder balls, etc.), or columnar components made of conductive materials (e.g., copper). The support portions 701A and 701B contact the coil portion 10, forming a first interface 70A intersecting the first direction (Z1-Z2 direction). In this example, the support portions 701A and 701B are disposed on the Z1 side of the coil portion 10 in the Z1-Z2 direction. Specifically, the support portion 701A is disposed on the Z1 side of the first lead-out portion 14 in the Z1-Z2 direction, and the support portion 701B is disposed on the Z1 side of the first dummy conductive portion 72 in the Z1-Z2 direction. That is, the support portions 701A and 701B are provided at the central portion in the Y1-Y2 direction of each end of the body portion 30 in the X1-X2 direction.

[0265] Furthermore, when viewed along the first direction (Z1-Z2 direction), the support portion 701A overlaps with the first lead-out portion 14 and the first dummy conductive portion 72 of the coil portion 10, and the support portion 701B overlaps with the second lead-out portion 24 and the first dummy conductive portion 72 of the coil portion 10.

[0266] Support portions 701A and 701B have support exposure surfaces 70B that protrude from the body portion 30. The support exposure surface 70B includes a first exposure surface 70C having an in-plane direction along a first direction. The first exposure surface 70C protrudes from two outer side surfaces 30a and 30b that are parallel to the YZ plane of the body portion 30.

[0267] When the support portions 701A and 701B1 include conductive support conductor portions, at least a portion of the first interface 70A may also be formed by the contact interface between the conductive surface of the support conductor portion and the conductive surface of the coil conductive portion 20. Furthermore, when the support portions 701A and 701B include conductive support conductor portions, at least a portion of the first exposed surface 70C of the support exposed surface 70B may also be formed by the exposed conductive surface formed by the support conductor portion.

[0268] A first terminal portion 41 is provided on the outer side surface 30a, and a second terminal portion 42 is provided on the outer side surface 30b. By engaging the first terminal portion 41 and the second terminal portion 42 with the first exposed surface 70C respectively, not only is the bonding strength and conductivity between the coil conductive portion 20 and the first terminal portion 41 and the second terminal portion 42 improved, but the connection area between the coil component 100A and the conductive material (external terminal, solder, etc.) is also increased.

[0269] Furthermore, the first dummy conductive portion 72 has a dummy end face 72E exposed from the outer side of the body portion 30. Additionally, the first lead-out portion 14 and the second lead-out portion 24 have end faces (lead-out exposure faces 140 and 240) exposed from the outer side of the body portion 30. The first terminal portion 41 is bonded to the dummy end face 72E and the lead-out exposure face 140, and the second terminal portion 42 is bonded to the dummy end face 71E and the lead-out exposure face 240. Moreover, when at least a portion of the first interface 70A is formed by the contact interface between the conductive surfaces of the first lead-out portion 14 and the second lead-out portion 24 and the conductive surface of the supporting conductor portion, not only is the bonding strength and conductivity between the coil conductive portion 20 and the first terminal portion 41 and the second terminal portion 42 improved, but the connection area between the coil component 100A and the conductive material (external terminal or solder) is also increased.

[0270] (Second Implementation)

[0271] The coil component of the second embodiment will be described below. In the following description, the parts that are common to the coil component of the first embodiment will be omitted.

[0272] Figure 6 This is an XY plan view illustrating the structure of the first helical conductive portion of the coil component in the second embodiment. Figure 6 For ease of explanation, the conductive part of the coil is depicted with solid lines, the body part is depicted with dashed lines, and the representation of other constituent elements is omitted. Figure 7A and Figure 7B This is a cross-sectional view used to illustrate the coil section structure of the coil component in the second embodiment. Furthermore, Figure 7A It shows Figure 6 The cross-section at line A-A' is taken as the XZ cross-section. Figure 7B It shows Figure 6 The section at line B-B' is used as the YZ section.

[0273] (First connecting section)

[0274] In the coil component 100B of the second embodiment, first connecting portions 15A, 15B, 15C, and 15D are respectively provided on two outer surfaces 30a and 30b parallel to the YZ plane of the main body 30. The first connecting portion 15A is connected to the first lead-out portion 14 and is provided on the Z1 side of the first insulation portion 90 in the Z1-Z2 direction, extending along the Y1-Y2 direction. The first connecting portion 15A is provided across the two outer surfaces 30c and 30d parallel to the XZ plane of the main body 30. In a specific example, the first connecting portion 15A is made of the same material as the first spiral conductive portion 11 and the first lead-out portion 14, and is manufactured simultaneously with the first spiral conductive portion 11 and the first lead-out portion 14.

[0275] The first connecting portion 15A, which is connected to the first lead-out portion 14, is included in the coil conductive portion 20. When the first connecting portion 15A is integrally provided with the first lead-out portion 14, the first connecting portion 15A can also be a part of the first lead-out portion 14. In this case, the surface of the first connecting portion 15A exposed from the body portion 30 is the lead-out exposed surface 140.

[0276] The first connecting portion 15B is connected to the second dummy conductive portion 71 and is disposed on the Z1 side of the first insulating portion 90 in the Z1-Z2 direction, extending along the Y1-Y2 direction. The first connecting portion 15B is disposed across two outer surfaces 30c and 30d parallel to the XZ plane of the main body portion 30. In a specific example, the first connecting portion 15B is made of the same material as the first spiral conductive portion 11 and the first dummy conductive portion 72, and is manufactured simultaneously with the first spiral conductive portion 11 and the first dummy conductive portion 72. When the first connecting portion 15B is integrally disposed with the first dummy conductive portion 72, the first connecting portion 15B can also be part of the first dummy conductive portion 72. In this case, the surface of the first connecting portion 15B exposed from the outer surface 30b of the main body portion 30 is the dummy end face 71E.

[0277] The first connecting portion 15C is connected to the first dummy conductive portion 72 and is disposed on the Z2 side of the first insulating portion 90 in the Z1-Z2 direction, extending along the Y1-Y2 direction. The first connecting portion 15C is disposed across two outer surfaces 30c and 30d parallel to the XZ plane of the body portion 30. In a specific example, the first connecting portion 15C is made of the same material as the second spiral conductive portion 21 and the first dummy conductive portion 72, and is manufactured simultaneously with the second spiral conductive portion 21 and the first dummy conductive portion 72. When the first connecting portion 15C is integrally disposed with the first dummy conductive portion 72, the first connecting portion 15C can also be part of the first dummy conductive portion 72. In this case, the surface of the first connecting portion 15C exposed from the outer surface 30a of the body portion 30 is the dummy end face 72E.

[0278] The first connecting portion 15D is connected to the second lead-out portion 24 and is provided on the Z2 side of the first insulating portion 90 in the Z1-Z2 direction, extending along the Y1-Y2 direction. The first connecting portion 15D is provided across two outer side surfaces 30c and 30d parallel to the XZ plane of the body portion 30. In a specific example, the first connecting portion 15D is made of the same material as the second spiral conductive portion 21 and the second lead-out portion 24, and is manufactured simultaneously with the second spiral conductive portion 21 and the second lead-out portion 24. The first connecting portion 15D connected to the second lead-out portion 24 is included in the coil conductive portion 20. When the first connecting portion 15D is integrally provided with the second lead-out portion 24, the first connecting portion 15D can also be part of the second lead-out portion 24. In this case, the surface of the first connecting portion 15D exposed from the body portion 30 is the lead-out portion exposed surface 240.

[0279] (Support Department)

[0280] Support parts 704A and 704B are the same as support parts 701A and 701B, and can be, for example, solder balls, heterogeneous solder balls (copper-core solder balls, resin-core solder balls, etc.), or columnar components made of conductive materials (e.g., copper). Support parts 704A and 704B contact the coil part 10, forming a first interface 70A that intersects the first direction (Z1-Z2 direction). In this example, support parts 704A and 704B are provided on the Z2 side of the coil part 10 in the Z1-Z2 direction. Specifically, support part 704A is provided on the Z2 side of the first dummy conductive part 72 in the Z1-Z2 direction, and support part 704B is provided on the Z2 side of the second lead-out part 24 in the Z1-Z2 direction. That is, support parts 704A and 704B are provided at the central portion of the Y1-Y2 direction at each end of the body part 30 in the X1-X2 direction.

[0281] Furthermore, when viewed along the first direction (Z1-Z2 direction), the support portion 704A overlaps with the first lead-out portion 14 and the first dummy conductive portion 72 of the coil portion 10, and the support portion 704B overlaps with the second lead-out portion 24 and the first dummy conductive portion 72 of the coil portion 10.

[0282] Support portions 704A and 704B include a support exposure surface 70B that protrudes from the body portion 30. The support exposure surface 70B includes a first exposure surface 70C that has an in-plane direction along a first direction. The first exposure surface 70C protrudes from two outer side surfaces 30a and 30b that are parallel to the YZ plane of the body portion 30.

[0283] When the support portions 704A and 704B include conductive support conductor portions, at least a portion of the first interface 70A may also be formed by the contact interface between the conductive surface of the support conductor portion and the conductive surface of the coil conductive portion 20. Furthermore, when the support portions 704A and 704B include conductive support conductor portions, at least a portion of the first exposed surface 70C of the support exposed surface 70B may also be formed by the exposed conductive surface formed by the support conductor portion.

[0284] A first terminal portion 41 is provided on the outer surface 30a, and a second terminal portion 42 is provided on the outer surface 30b. By engaging the first terminal portion 41 and the second terminal portion 42 with the first exposed surface 70C respectively, not only is the bonding strength and conductivity between the coil conductive portion 20 and the first terminal portion 41 and the second terminal portion 42 improved, but the connection area between the coil component 100B and the conductive material (external terminal or solder) is also increased.

[0285] Support parts 702A, 702B, 703A, 703B, 705A, 705B, 706A, and 706B, like support parts 701A, 701B, 704A, and 704B, can be made of solder balls, heterogeneous solder balls (copper-core solder balls, resin-core solder balls, etc.), or columnar components made of conductive materials (e.g., copper). Support parts 702A, 702B, 703A, 703B, 705A, 705B, 706A, and 706B contact the coil part 10, forming a first interface 70A that intersects the first direction (Z1-Z2 direction). In this example, support parts 702A, 702B, 703A, and 703B are provided on the Z1 side of the coil part 10 in the Z1-Z2 direction. Specifically, support parts 702A and 703A are provided on the Z1 side of the first connecting part 15A in the Z1-Z2 direction, and support parts 702B and 703B are provided on the Z1 side of the first connecting part 15B in the Z1-Z2 direction. Support parts 702A, 702B, 703A, and 703B are respectively provided at the corners of the main body part 30.

[0286] Furthermore, support parts 705A, 705B, 706A, and 706B are provided on the Z2 side of the coil part 10 in the Z1-Z2 direction. Specifically, support parts 705A and 706A are provided on the Z2 side of the first connecting part 15C in the Z1-Z2 direction, and support parts 705B and 706B are provided on the Z2 side of the first connecting part 15D in the Z1-Z2 direction. Support parts 705A, 705B, 706A, and 706B are respectively provided at the corners of the body part 30.

[0287] Support portions 702A, 702B, 703A, 703B, 705A, 705B, 706A, and 706B have support exposure surfaces 70B that protrude from the body portion 30. Each support exposure surface 70B includes a first exposure surface 70C having an in-plane direction along a first direction. Specifically, the first exposure surface 70C of support portions 702A and 705A located at the corners of outer surfaces 30a and 30c protrudes from outer surfaces 30a and 30c. The first exposure surface 70C of support portions 703A and 706A located at the corners of outer surfaces 30a and 30d protrudes from outer surfaces 30a and 30d. The first exposure surface 70C of support portions 702B and 705B located at the corners of outer surfaces 30b and 30c protrudes from outer surfaces 30b and 30c. The first exposed surface 70C of the support portions 703B and 706B located at the corners of the outer surfaces 30b and 30d is exposed from the outer surfaces 30b and 30d.

[0288] Furthermore, the exposed surface 70B may also include a second exposed surface 70D intersecting the first direction. At least a portion of the second exposed surface 70D is composed of an exposed conductive surface. That is, the second exposed surfaces 70D of the support portions 703A, 703B, 704A, and 704B are exposed from the outer surface of the body portion 30 on the Z1 side in the Z1-Z2 direction, and the second exposed surfaces 70D of the support portions 705A, 705B, 706A, and 706B are exposed from the outer surface of the body portion 30 on the Z2 side in the Z1-Z2 direction. Thus, the exposed conductive surface constitutes a portion of the outermost surface of the coil component 100B. Also, when it is necessary to impart insulation to the outermost surface of the coil component 100B, the outer covering 50 and 60 may be appropriately extended toward the second exposed surface 70D and contact the second exposed surface 70D. Furthermore, when it is necessary to improve the peel strength of the first terminal portion 41 and the second terminal portion 42, the first terminal portion 41 and the second terminal portion 42 may be extended toward the second exposed surface 70D and contact the second exposed surface 70D.

[0289] When the support portions 702A, 702B, 703A, 703B, 705A, 705B, 706A, and 706B include conductive support conductor portions, at least a portion of the first interface 70A may also be formed by the contact interface between the conductive surface of the support conductor portion and the conductive surface of the coil conductive portion 20. Furthermore, when the support portions 702A, 702B, 703A, 703B, 705A, 705B, 706A, and 706B have conductive support conductor portions, at least a portion of the first exposed surface 70C of the support exposed surface 70B may also be formed by the exposed conductive surface formed by the support conductor portion.

[0290] A first terminal portion 41 is provided on the outer side surface 30a, and a second terminal portion 42 is provided on the outer side surface 30b. By engaging the first terminal portion 41 with the lead-out surface 140, the connecting surface 150, and the first exposed surface 70C exposed from the outer side surface 30a, and engaging the second terminal portion 42 with the lead-out surface 240, the connecting surface 150, and the first exposed surface 70C exposed from the outer side surface 30b, not only is the bonding strength and conductivity between the coil conductive portion 20 and the first terminal portion 41 and the second terminal portion 42 improved, but the connection area between the coil component 100B and the conductive material (external terminal or solder) is also increased.

[0291] (Third implementation method)

[0292] Next, the coil component of the third embodiment will be described. In the following description, the parts that are common to the coil component of the first embodiment will be omitted.

[0293] Figure 8This is an XY plan view illustrating the structure of the first helical conductive portion of the coil component in the third embodiment. Figure 8 For ease of explanation, the conductive part of the coil is depicted with solid lines, the body part is depicted with dashed lines, and the representation of other constituent elements is omitted. Figure 9A and Figure 9B This is a cross-sectional view used to illustrate the coil section structure of the coil component in the third embodiment. Furthermore, Figure 9A It shows Figure 8 The cross-section at line A-A' is taken as the XZ cross-section. Figure 9B It shows Figure 8 The section at line B-B' is used as the YZ section.

[0294] (External electrode)

[0295] External electrodes 16A and 16B extend along the Y1-Y2 direction on the Z1 side of the Z1-Z2 direction of the main body 30. External electrode 16A contacts the exposed conductive surface of the support exposed surface 70B of the support portion 701A, and external electrode 16B contacts the exposed conductive surface of the support exposed surface 70B of the support portion 701B. This exposed conductive surface constitutes a part of the outermost surface of the main body 30.

[0296] In this example, the external electrodes 16A and 16B are disposed across two outer surfaces 30c and 30d parallel to the XZ plane of the body portion 30. The external electrodes 16A and 16B may also have a first recess 161 recessed in the first direction (Z2 side of the Z1-Z2 direction). Thus, the concave surface of the first recess 161 can reduce the volume (height) occupied by the coil component 100C after welding.

[0297] A first terminal portion 41 can be provided on the outer surface 30a, and a second terminal portion 42 can be provided on the outer surface 30b. By engaging the first terminal portion 41 with the lead-out surface 140, the dummy end portion 72E, the first exposed surface 70C, and the external electrode 16A exposed from the outer surface 30a, and engaging the second terminal portion 42 with the lead-out surface 240, the dummy end portion 71E, the first exposed surface 70C, and the external electrode 16B exposed from the outer surface 30b, not only is the bonding strength and conductivity between the coil conductive portion 20 and the first terminal portion 41 and the second terminal portion 42 improved, but the connection area between the coil component 100C and the conductive material (external terminal or solder) is also increased. Here, if the mounting area of ​​the coil component 100C is further reduced, the first terminal portion 41 and the second terminal portion 42 can also be omitted. In this case, from the viewpoint of improving the surface insulation of the coil component 100C to improve reliability, the outer surfaces 30a and 30b can also be in contact with the outer casing 60. This point also applies to subsequent embodiments that include external electrodes 16A and 16B.

[0298] (Fourth Implementation)

[0299] Next, the coil component of the fourth embodiment will be described. In the following description, the parts that are common to the coil component of the first embodiment will be omitted.

[0300] Figure 10 This is an XY plan view illustrating the structure of the first helical conductive portion of the coil component according to the fourth embodiment. Figure 10 For ease of explanation, the conductive part of the coil is depicted with solid lines, the body part is depicted with dashed lines, and the representation of other constituent elements is omitted. Figure 11A and Figure 11B This is a cross-sectional view used to illustrate the coil section structure of the coil component in the fourth embodiment. Furthermore, Figure 11A It shows Figure 10 The cross-section at line A-A' is taken as the XZ cross-section. Figure 11B It shows Figure 10 The section at line B-B' is used as the YZ section.

[0301] (Support Department)

[0302] In the coil component 100D of the fourth embodiment, the support portions 701A, 701B, 702A, 702B, 703A, and 703B are the same as those in the coil component 100B of the second embodiment.

[0303] (External electrode)

[0304] In the coil component 100D of the fourth embodiment, the external electrodes 16A and 16B are the same as those in the coil component 100C of the third embodiment. That is, the external electrodes 16A and 16B are provided extending along the Y1-Y2 direction on the Z1 side of the Z1-Z2 direction of the main body 30.

[0305] The exposed conductive surface in the support exposed surface 70B of the external electrode 16A contacts the support exposed surface 70B of the support support parts 701A, 702A, and 703A, and the exposed conductive surface in the support exposed surface 70B of the external electrode 16B contacts the support exposed surface 70B of the support parts 701B, 702B, and 703B.

[0306] In this example, the external electrodes 16A and 16B are disposed across two outer surfaces 30c and 30d that are parallel to the XZ plane of the body portion 30. The external electrodes 16A and 16B may also have a first recess 161 recessed in the first direction (Z2 side of the Z1-Z2 direction).

[0307] A first terminal portion 41 may be provided on the outer side surface 30a, and a second terminal portion 42 may be provided on the outer side surface 30b. By engaging the first terminal portion 41 with the lead-out surface 140, the connecting surface 150, the first exposed surface 70C, and the external electrode 16A exposed from the outer side surface 30a, and engaging the second terminal portion 42 with the lead-out surface 240, the connecting surface 150, the first exposed surface 70C, and the external electrode 16B exposed from the outer side surface 30b, not only is the bonding strength and conductivity between the coil conductive portion 20 and the first terminal portion 41 and the second terminal portion 42 improved, but the connection area between the coil component 100D and the conductive material (external terminal or solder) is also increased.

[0308] (Fifth Implementation)

[0309] Next, the coil component of the fifth embodiment will be described. In the following description, the parts that are common to the coil component of the first embodiment will be omitted.

[0310] Figure 12 This is an XY plan view illustrating the structure of the first helical conductive portion of the coil component according to the fifth embodiment. Figure 12 For ease of explanation, the conductive part of the coil is depicted with solid lines, the body part is depicted with dashed lines, and the representation of other constituent elements is omitted. Figure 13A and Figure 13B This is a cross-sectional view used to illustrate the coil section structure of the coil component in the fifth embodiment. Furthermore, Figure 13A It shows Figure 12 The cross-section at line A-A' is taken as the XZ cross-section. Figure 13B It shows Figure 12 The section at line B-B' is used as the YZ section.

[0311] In the coil component 100E of the fifth embodiment, the first terminal portion 41 and the second terminal portion 42 of the coil component 100B of the second embodiment are not provided. That is, the lead-out surface 140, the connecting surface 150, and the first exposed surface 70C exposed from the outer side 30a of the body portion 30 serve as the connection surface (mounting electrode surface) with the conductive material (external terminal or solder), and the lead-out surface 240, the connecting surface 150, and the first exposed surface 70C exposed from the outer side 30b of the body portion 30 serve as the connection surface (mounting electrode surface) with the conductive material (external terminal or solder). Therefore, the first terminal portion 41 and the second terminal portion 42 are not required, which enables miniaturization of the coil component 100E, reduction of manufacturing processes, and cost reduction.

[0312] (Sixth Implementation Method)

[0313] Next, the coil component of the sixth embodiment will be described. In the following description, the parts that are common to the coil component of the first embodiment will be omitted.

[0314] Figure 14 This is an XY plan view illustrating the structure of the first helical conductive portion of the coil component according to the sixth embodiment. Figure 14 For ease of explanation, the conductive part of the coil is depicted with solid lines, the body part is depicted with dashed lines, and the representation of other constituent elements is omitted. Figure 15A and Figure 15B This is a cross-sectional view used to illustrate the coil section structure of the coil component according to the sixth embodiment. Furthermore, Figure 15A It shows Figure 14 The cross-section at line A-A' is taken as the XZ cross-section. Figure 15B It shows Figure 14 The section at line B-B' is used as the YZ section.

[0315] (Support Department)

[0316] Support portions 702A, 702B, 703A, and 703B are disposed at the corners of the main body 30 in the first direction (Z1 side of the Z1-Z2 direction). Support portions 705A, 705B, 706A, and 706B are disposed at the corners of the main body 30 in the first direction (Z2 side of the Z1-Z2 direction). Support portions 702A, 702B, 703A, 703B, 705A, 705B, 706A, and 706B have soft magnetic portions (supporting soft magnetic portions). At least a portion of the first interface 70A is formed by a contact interface between the supporting soft magnetic portion and the coil portion 10, and the relative permeability of the supporting soft magnetic portion in the first direction (Z1-Z2 direction) is greater than the relative permeability of the main body 30 in the first direction (Z1-Z2 direction). Here, the supporting soft magnetic portion may contain magnetic powder or may be an insulator.

[0317] In this example, two surfaces of the body portion 30 parallel to the first direction are connected to each other via support portions 702A, 702B, 703A, 703B, 705A, 705B, 706A, and 706B. When the body portion 30 has a cuboid shape, the support portions 702A, 702B, 703A, 703B, 705A, 705B, 706A, and 706B are configured to include at least one end of one of the four sides of the body portion 30 parallel to the first direction.

[0318] By configuring the aforementioned support portions 702A, 702B, 703A, 703B, 705A, 705B, 706A, and 706B, the magnetic characteristics of the coil component 100F can be improved. Specifically, in the coil component 100F, which has an approximately cuboid shape, the magnetic flux density tends to decrease at the corners of the main body 30, leading to a decrease in inductance. By providing support portions 702A, 702B, 703A, 703B, 705A, 705B, 706A, and 706B, which support soft magnetic portions, at the corners of the main body 30 as shown in this embodiment, magnetic flux can easily pass through the corners, thereby improving the magnetic characteristics (inductance) of the coil component 100F.

[0319] (Seventh Implementation)

[0320] Next, the coil component of the seventh embodiment will be described. In the following description, the parts that are common to the coil component of the first embodiment will be omitted.

[0321] Figure 16 This is an XY plan view used to explain the structure of the first helical conductive portion of the coil component in the seventh embodiment. Figure 16 For ease of explanation, the conductive part of the coil is depicted with solid lines, the body part is depicted with dashed lines, and the representation of other constituent elements is omitted. Figure 17A and Figure 17B This is a cross-sectional view used to illustrate the coil section structure of the coil component according to the seventh embodiment. Furthermore, Figure 17A It shows Figure 16 The cross-section at line A-A' is taken as the XZ cross-section. Figure 17B It shows Figure 16 The section at line B-B' is used as the YZ section.

[0322] (Support Department)

[0323] In the coil component 100G of the seventh embodiment, the support portion 701A is provided at a position overlapping the first lead-out portion 14 when viewed along the first direction (Z1-Z2 direction), and the support portion 701B is provided at a position overlapping the second lead-out portion 24 when viewed along the first direction (Z1-Z2 direction). The support portions 701A and 701B have conductive support conductor portions, and the support exposed surface 70B of the support conductor portion is exposed from the Z1 side of the body portion 30 in the Z1-Z2 direction.

[0324] (External electrode)

[0325] In the coil component 100G of the seventh embodiment, the external electrodes 16A and 16B are the same as those in the coil component 100C of the third embodiment. That is, the external electrodes 16A and 16B are provided on the Z1 side in the Z1-Z2 direction of the main body 30 and extend along the Y1-Y2 direction. The external electrode 16A contacts the exposed conductive surface in the support exposed surface 70B of the support portion 701A, and the external electrode 16B contacts the exposed conductive surface in the support exposed surface 70B of the support portion 701B.

[0326] In this example, the external electrodes 16A and 16B are disposed across two outer surfaces 30c and 30d that are parallel to the XZ plane of the body portion 30. The external electrodes 16A and 16B may also have a first recess 161 recessed in the first direction (Z2 side of the Z1-Z2 direction).

[0327] A first terminal portion 41 may be provided on the outer side surface 30a, and a second terminal portion 42 may be provided on the outer side surface 30b. By engaging the first terminal portion 41 with the lead-out surface 140, the dummy end portion 72E, and the external electrode 16A exposed from the outer side surface 30a, and engaging the second terminal portion 42 with the lead-out surface 240, the dummy end portion 71E, and the external electrode 16B exposed from the outer side surface 30b, not only is the bonding strength and conductivity between the coil conductive portion 20 and the first terminal portion 41 and the second terminal portion 42 improved, but the connection area between the coil component 100G and the conductive material (external terminal or solder) is also increased.

[0328] (Example of second concave portion)

[0329] Figure 18 This is a partial cross-sectional view showing an example of the second recess. Figure 18 The image shows a partial cross-sectional view of a portion of the coil section 10 on the X2 side in the X1-X2 direction.

[0330] A second recess 17, recessed in the first direction (Z1 side of the Z1-Z2 direction), may be provided in the coil portion 10. In this example, the second recess 17 is provided in the first lead-out portion 14. The second recess 17 may be a concave curved surface or a rectangular recess. A support portion (support portion 701A in this example) is disposed in the second recess 17.

[0331] When the second recess 17 is provided, at least a portion of the first interface 70A can also be formed by the contact interface between at least a portion of the recessed surface formed by the opening edge of the second recess 17 and its internal surface and the support portion 701A. By providing such a second recess 17, the contact interface between the support portion 701A and the coil portion 10 can be ensured, and the bonding strength between the support portion 701A and the coil portion 10 can be improved.

[0332] Furthermore, when the support portion 701A has a conductive support conductor portion, at least a portion of the first interface 70A can also be formed by a contact interface between the conductive surface of at least a portion of the recessed surface formed by the surface inside the second recess 17 and the conductive surface of the support conductor portion of the support portion 701A. Thus, conductive contact between the support portion 701A and the coil portion 10 (e.g., the first lead-out portion 14 provided with the second recess 17) can be achieved through the recessed surface of the second recess 17.

[0333] Furthermore, in this case, the support portion 701A can also contact the conductive surface of the coil conductive portion in a gradually tapering manner. This increases the volume of the magnetic powder near the coil conductive portion, thereby enabling efficient utilization of magnetic flux. Additionally, the tapering direction can be either a first direction or a direction orthogonal to the first direction.

[0334] A first terminal portion 41 is provided on the outer surface 30a. By engaging the first terminal portion 41 with the lead-out surface 140, the dummy end portion 72E, the first exposed surface 70C, and the external electrode 16A exposed from the outer surface 30a, not only is the bonding strength and conductivity between the coil conductive portion 20 and the first terminal portion 41 improved, but the connection area between the coil component 100G and the conductive material (external terminal or solder) is also increased.

[0335] Furthermore, the second recess 17 can also be provided in a location connected to a support other than the support 701A. For example, the second recess 17 can be provided in the location connected to the support 702A, support 703A, etc., i.e., the first connecting portion 15A. In addition, in the coil portion 10 on the X1 side in the X1-X2 direction, the second recess 17 can also be provided in the location connected to the support 701B, i.e., the first dummy conductive portion 72.

[0336] (Manufacturing method of coil components)

[0337] The manufacturing method of the coil component in this embodiment is not particularly limited. As a non-limiting example of this manufacturing method, it is described below. It should be noted that the following manufacturing method describes an example of simultaneously manufacturing multiple coil components in batches.

[0338] (Manufacturing method of coil component 100A)

[0339] Figures 19A to 27C This is an explanatory diagram illustrating an example of a method for manufacturing the coil component 100A according to the first embodiment.

[0340] First, such as Figure 19A XY plane diagram and Figure 19B XZ cross-sectional view ( Figure 19A As shown in the cross-section at line C-C', multiple spiral portions (first spiral conductive portion 11, second spiral conductive portion 21) are formed (first step). Specifically, the first spiral conductive portion 11 is formed on one side of the insulating sheet substrate 91 (specifically, the Z1 side in the Z1-Z2 direction), and the second spiral conductive portion 21 is formed on the other side of the sheet substrate 91 (specifically, the Z2 side in the Z1-Z2 direction). The forming process of the first spiral conductive portion 11 and the second spiral conductive portion 21 is not particularly limited, and can be formed by, for example, by a plating process. In this embodiment, the via portion VP, the first lead-out portion 14, and the second lead-out portion 24 are also formed simultaneously in this process.

[0341] When this step includes a plating process, the coil conductive portion 20, which includes the first conductive portion 201, includes a portion formed by the plating. Furthermore, the plating process also forms a first dummy conductive portion 72.

[0342] Furthermore, using the same plating process, connecting portions 151 extending in the Y1-Y2 direction and connecting portions 152 extending in the X1-X2 direction are formed around the coil conductive portions 20 when viewed along the first direction (Z1-Z2 direction). Connecting portions 151 and 152 are arranged in a grid pattern at the midpoint between adjacent coil conductive portions 20, and are also positioned around the outer periphery of the entire area of ​​the plurality of coil conductive portions 20. Connecting portions 151 and 152 are part of the conductor pattern, structurally connecting the plurality of coil conductive portions 20 to improve conformability, and also serving as energized portions in the plating process. Thus, in the first step, a conductor pattern comprising a plurality of spiral portions (first spiral conductive portion 11, second spiral conductive portion 21) and connecting portions (connecting portions 151, connecting portions 152) for connecting the plurality of spiral portions are formed.

[0343] When forming the connecting portions 151 and 152, pads 155 may also be formed at the intersection of the extension line of the first lead-out portion 14 and the connecting portion 151, and at the intersection of the extension line of the second dummy conductive portion 71 and the connecting portion 151. The pads 155 may be circular or rectangular with a width greater than the width of the first lead-out portion 14 and the connecting portion 151. Here, the first spiral conductive portion 11, the second spiral conductive portion 21, the via portion VP, the first lead-out portion 14, the second lead-out portion 24, the first dummy conductive portion 72, the second dummy conductive portion 71, the connecting portion 151, and the connecting portion 152 may be integrally formed on the sheet substrate 91. Figure 19A and Figure 19B In the diagram, although boundaries are shown between the aforementioned elements that can be formed as a single unit, these elements may also exist without boundaries. The same applies to subsequent diagrams.

[0344] Here, the sheet substrate 91 is not particularly limited as long as it possesses the mechanical properties required to serve as a support for forming the first helical conductive portion 11, the second helical conductive portion 21, the connecting portion 151, and the connecting portion 152, and its suitability (removal properties) in the processes described later. Examples of constituent materials for the sheet substrate 91 include organic materials, inorganic materials, and composite materials thereof. Specific examples of organic materials include thermoplastic resins such as polyimide resin and polyethylene resin, thermosetting resins such as epoxy resin and phenolic resin, and cellulose. Specific examples of inorganic materials include oxide materials such as glass and alumina, metallic materials such as aluminum and magnesium, and inorganic salt materials such as calcium carbonate. Specific examples of composite materials include structures in which inorganic materials are dispersed in an organic material matrix. Among these materials, polyimide resin and epoxy resin are preferred, especially when used in combination with a coating process, polyimide resin is most preferred.

[0345] In the next step, at least a portion of the sheet substrate 91 is removed. Specifically, when viewed along the first direction (Z1-Z2 direction), the portion of the sheet substrate 91 including the area surrounded by the inner edge of the first helical conductive portion 11 is removed.

[0346] The specific removal process for the sheet-like substrate 91 is appropriately set according to the constituent materials of the sheet-like substrate 91. The removal process can be broadly divided into dry processes such as plasma etching and wet processes such as wet etching. This removal process can remove a portion of the sheet-like substrate 91, or it can retain the remaining portion. For example, when the sheet-like substrate 91 is composed of a composite material of organic and inorganic materials, only the organic material can be removed in the removal process.

[0347] Next, as Figure 20A XY plane diagram and Figure 20B XZ cross-sectional view ( Figure 20A As shown in the cross-section at line C-C', flux 155a is applied above pad 155 (on the Z1 side in the Z1-Z2 direction). The method of applying flux 155a is not limited. For example, it can be applied by attaching flux 155a to the tips of multiple pins and transferring flux 155a from multiple pins to each pad 155, or by applying it by screen printing using a mask such as a metal mask.

[0348] Next, as Figure 21A XY plane diagram and Figure 21B XZ cross-sectional view ( Figure 21AAs shown in the cross-section at line C-C', support members 700 for the support portions 701A and 701B are mounted above the pads 155 on which flux 155a has been applied in the previous step (Z1 side in the Z1-Z2 direction) (second step). This forms a support member 700 extending from the connecting portions 151 and 152 to one side in the first direction (Z1 side in the Z1-Z2 direction). The mounting method of the support member 700 is not limited; for example, a method can be used where the support member 700 is mounted onto each flux 155a through a mask with mask openings corresponding to the positions of the flux 155a (hereinafter also referred to as the shake-drop method). Alternatively, this second step can be performed before removing the sheet substrate 91.

[0349] As the support component 700, solder balls, heteronuclear solder balls (copper-core solder balls, resin-core solder balls, etc.), and copper pillars (cylindrical, cylindrical with joints, spherical, truncated conical, laminated, etc.) can be used. For example, when using copper-core solder balls, compared with uncore solder balls, they have advantages in terms of coplanarity as a support, as well as excellent conductivity, plating adhesion equivalent to copper wire, and because they are spherical, they are easy to install by vibration dropping.

[0350] Furthermore, when using copper pillars, compared to coreless solder balls, they offer advantages in terms of coplanarity as pillars, excellent conductivity, plating adhesion comparable to copper wire, and, when cylindrical, surface contact can be achieved through the planar portion to reduce contact resistance, while also effectively utilizing the occupied space. For example, when using copper pillars and no solder is applied to the connection surface, solder paste can be applied instead of flux 155a in the above steps.

[0351] The size of the support component 700 is not limited; for example, when it is spherical, a support component 700 with a diameter of approximately 300 μm can be used. After the support component 700 is installed, it is fixed to the pad 155 by reflow soldering.

[0352] After the support component 700 is fixed to the pad 155, an insulating coating is applied to the exposed surfaces of the connecting portions 151 and 152, the support component 700, the first spiral conductive portion 11, and the second spiral conductive portion 21. The forming process of the insulating coating is appropriately set according to the constituent material of the second insulating portion 80. For example, when the second insulating portion 80 is made of a para-xylene-based polymer, it can be formed by a dry process (CVD); when the second insulating portion 80 contains a curable resin material such as epoxy resin, it can be formed by adhering a powder or liquid containing the constituent material of the second insulating portion 80 to the exposed surface and then curing the adhering material by heating or other means. Other processes that can be used include dip coating, sputtering, PVD, self-extraction, etc.

[0353] Next, a material containing magnetic powder is supplied to cover the conductor pattern on both sides at least in the first direction (Z1-Z2 direction), and formed into a sheet (third step). As an example of this molding process, a molding process in which a material containing magnetic material surrounds the coil portion 10 can be cited. Specific examples of this molding process include placing the manufactured product A1 formed up to the previous steps in a mold, compressing the material containing magnetic material, or transferring the material containing magnetic powder or its raw material into a mold.

[0354] Figures 22A to 23B The schematic cross-sectional view illustrates the compression molding process. First, as... Figure 22A As shown, a material containing magnetic material is placed inside the cavity C of mold M, and the manufactured product A1 is mounted on the support substrate P. Subsequently, as... Figure 22B As shown, the manufactured part A1, mounted on the support substrate P, is inserted into the cavity C of the mold M, and compression is performed between the mold M and the support substrate P. During this process, the support member 700 is positioned between the support substrate P and the coil part 10, and the support member 700 acts as a pillar to ensure a certain gap between the coil part 10 and the support substrate P.

[0355] During this compression molding process, the material containing the magnetic material flows and expands into the cavity C under a compressive force applied between the mold M and the support substrate P. Therefore, stress is applied to the manufactured product A1 during material filling. In particular, as the material flows and expands within the cavity C, it moves from the cavity C towards the support substrate P, thus applying a relatively strong stress to the manufactured product A1 from the cavity C towards the support substrate P. In this embodiment, since the manufactured product A1 is supported on the support substrate P by the support member 700, deformation of the manufactured product A1 can be suppressed even if it is pressed against the support substrate P by the material. That is, the displacement of the positions of each coil portion 10 in the manufactured product A1 can be effectively suppressed.

[0356] After the material containing magnetic material is filled into cavity C, it is allowed to solidify or harden. Demolding is then performed (see...). Figure 23B ). Figure 24A The XY plan view of the sheet-like manufactured part B1 obtained by demolding is shown. Figure 24B It shows Figure 24A A cross-sectional view at line C-C'. In manufacture B1, the entire periphery of manufacture A1 is covered by body material 300 (made of a material containing magnetic material that has been solidified or hardened).

[0357] Next, the sheet-like manufactured object B1 is cut along the first direction (Z1-Z2 direction) in a direction parallel to the cutting surface, and the fourth step is performed to obtain multiple first components including helical portions (first helical conductive portion 11, second helical conductive portion 21). Specifically, as follows... Figure 25A XY plane diagram and Figure 25B XZ cross-sectional view ( Figure 25A As shown in the cross-section at line C-C', the manufactured article B1 is divided at a predetermined position. In this step, the manufactured article B1 is cut along the respective directions of the connecting portions 151 and 152. Figure 25A and Figure 25B The dashed line in the diagram represents the dividing line (dividing center line) formed by cutting. Through cutting, a first component, C1, is formed, which has coil portions 10 and a body portion 30 composed of divided body material 300 covering these coil portions 10. The portion separated from the component C1 by cutting from the component B1 is the second component C1A. Figure 25A and Figure 25B In the example shown, since the connecting parts (connecting parts 151, 152) are completely removed during cutting (crushed, cut off or ground), neither the manufacture C1 nor the second part C1A contains the connecting parts (connecting parts 151, connecting parts 152).

[0358] As described above, in the manufactured product C1, the connecting portions 151 and 152 are removed without leaving any residue by cutting, but a portion of the support member 700 is still retained. When the cutting width is narrow, there may also be a situation where at least a portion of the connecting portions 151, 152, and support member 700 remains in the portion that was not made into the manufactured product C1 after cutting and was not removed (a portion C1A' of the second member C1A).

[0359] A portion of the support member 700 remaining on the C1 side of the manufactured product forms support portions 701A and 701B, and has a portion that contacts the coil portion 10. Furthermore, the cut surface of the support member 700 exposed from the cut surface of the body material 300 forms the support exposure surface 70B (first exposure surface 70C) of the support portions 701A and 701B. Simultaneously, the cut surface of the first lead-out portion 14 exposed from the cut surface of the body material 300 forms the lead-out exposure surface 140, the cut surface of the first dummy conductive portion 72 forms the dummy end portion 72E, the cut surface of the second lead-out portion 24 forms the lead-out exposure surface 240, and the cut surface of the second dummy conductive portion 71 forms the dummy end portion 71E.

[0360] Next, as Figure 26A XY plane diagram Figure 26B XZ plan and Figure 26CAs shown in the YZ plan view, an insulating coating 600 is applied to a portion of the surface of the manufacture C1. The surface on which the insulating coating 600 is applied is the outer surface of the manufacture C1 where electrodes will not be formed in subsequent steps. In this embodiment, the insulating coating 600 is applied to the outer surface excluding the exposed surfaces of the lead-out portions 140 and 240. Depending on the surface on which the insulating coating 600 is applied, this insulating coating 600 may also be performed before or during the fourth step.

[0361] Next, as Figure 27A XY plane diagram Figure 27B XZ plan and Figure 27C As shown in the YZ plan view, a first terminal portion 41 and a second terminal portion 42, serving as external electrodes, are formed on the surface of the manufactured product C1 where the insulating coating 600 is not applied and which includes a conductive surface (fifth step). The method for forming the first terminal portion 41 and the second terminal portion 42 is not limited; for example, a plating process or a printing process using a conductive paste can be employed. Thus, the coil component 100A of this embodiment is manufactured.

[0362] The first terminal portion 41 engages with the lead-out exposed surface 140 and the dummy terminal portion 72E, as well as the support exposed surface 70B of the support portion 701A. The second terminal portion 42 engages with the lead-out exposed surface 240 and the dummy terminal portion 71E, as well as the support exposed surface 70B of the support portion 701B. Thus, by reducing the contact resistance of the first terminal portion 41 and the second terminal portion 42, the direct current resistance (DCR) is improved, and by increasing the bonding strength between the first terminal portion 41 and the second terminal portion 42, the reliability of the coil component 100A is improved.

[0363] (Manufacturing method of coil component 100B)

[0364] Figures 28A to 36C This is an explanatory diagram illustrating an example of the manufacturing method of the coil component 100B according to the second embodiment.

[0365] First, such as Figure 28A XY plane diagram and Figure 28B XZ cross-sectional view ( Figure 28AAs shown in the cross-section at line C-C', multiple spiral portions (first spiral conductive portion 11, second spiral conductive portion 21) are formed (first step). Specifically, the first spiral conductive portion 11 is formed on one side of the insulating sheet substrate 91 (specifically, the Z1 side in the Z1-Z2 direction), and the second spiral conductive portion 21 is formed on the other side of the sheet substrate 91 (specifically, the Z2 side in the Z1-Z2 direction). The forming process of the first spiral conductive portion 11 and the second spiral conductive portion 21 is not particularly limited, and can be formed, for example, by a plating process. In this embodiment, the via portion VP and the first lead-out portion 14 and the second lead-out portion 24 are also formed simultaneously in this process.

[0366] When this step includes a plating process, the coil conductive portion 20, which includes the first conductive portion 201, includes a portion formed by the plating. Furthermore, the plating process also forms a first dummy conductive portion 72.

[0367] Furthermore, using the same plating process, connecting portions 151 extending in the Y1-Y2 direction and connecting portions 152 extending in the X1-X2 direction are formed around the coil conductive portions 20 when viewed along the first direction (Z1-Z2 direction). Connecting portions 151 and 152 are arranged in a grid pattern at the midpoint between adjacent coil conductive portions 20, and are also positioned around the outer periphery of the entire area of ​​the plurality of coil conductive portions 20. Connecting portions 151 and 152 not only structurally connect the plurality of coil conductive portions 20 to improve conformability, but also serve as energized portions in the plating process. Thus, in the first step, a conductor pattern comprising a plurality of spiral portions (first spiral conductive portion 11, second spiral conductive portion 21) and connecting portions (connecting portions 151, connecting portions 152) of the plurality of spiral portions is formed.

[0368] In the next step, at least a portion of the sheet-like substrate 91 is removed. Specifically, when viewed along the first direction (Z1-Z2 direction), the portion of the sheet-like substrate 91 including the area surrounded by the inner edge of the first helical conductive portion 11 is removed. The specific removal process of the sheet-like substrate 91 is the same as the aforementioned manufacturing method.

[0369] Next, as Figure 29A XY plane diagram and Figure 29B XZ cross-sectional view ( Figure 29AAs shown in the cross-section at line C-C', flux 155a is applied above the connector 151 (on the Z1 side in the Z1-Z2 direction). The flux 155a is applied at the intersection of the extension line of the first lead-out portion 14 and the connector 151, the intersection of the extension line of the second dummy conductive portion 71 and the connector 151, and the intersection of the connector 151 and the connector 152. The method of applying flux 155a is not limited; for example, a transfer method or a screen printing method using a metal mask can be used.

[0370] Next, as Figure 30A XY plane diagram and Figure 30B XZ cross-sectional view ( Figure 30A As shown in the cross-section at line C-C' in the diagram, a support member 700 (part of the second step) is installed above the position where flux 155a was applied in the aforementioned step (Z1 side in the Z1-Z2 direction). This forms a support member 700 extending from the connecting portions 151, 152 towards one side in the first direction (Z1 side in the Z1-Z2 direction). Thus, support portions 701A and 701B are formed from this support member 700. The installation method of the support member 700 is not limited; for example, the same shaking method as described above can be used. Furthermore, similar to the aforementioned manufacturing method, solder balls, heteronuclear solder balls (copper-core solder balls, resin-core solder balls, etc.), and copper pillars (cylindrical, cylindrical with joints, spherical, truncated conical, laminated, etc.) can be used as the support member 700. After installing the support member 700, it is fixed to the connecting portion 151 by reflow soldering.

[0371] Subsequently, as Figure 31A and Figure 31B As shown in the XZ cross-sectional view, the flux 155a applied to the connecting portion 151 (Z1 side in the Z1-Z2 direction) of the coil portion 10 in the previous step, as well as the installation and fixation of the support member 700, are also applied to the other side (Z2 side in the Z1-Z2 direction) of the coil portion 10 (another part of the second step) by the same process. The support member 700 thus provided forms support portions 704A and 704B.

[0372] After the support member 700 is fixed to the connecting portion 151, an insulating coating is applied to the exposed surfaces of the connecting portions 151 and 152, the support member 700, the first spiral conductive portion 11, and the second spiral conductive portion 21. The process for forming this insulating coating is the same as the aforementioned manufacturing method.

[0373] Next, a material containing magnetic powder is supplied to cover the conductor pattern on at least both sides in the first direction (Z1-Z2 direction), and formed into a sheet (third step). As an example of this molding process, a molding process in which a material containing magnetic material surrounds the coil portion 10 can be cited. Specific examples of this molding process include placing the manufactured product A2 formed up to the previous steps in a mold, compressing the material containing magnetic material, or transferring the material containing magnetic powder or its raw material into a mold.

[0374] Figures 32A to 32B The schematic cross-sectional view illustrates the compression molding process. First, as... Figure 32A As shown, a material containing magnetic material is placed inside the cavity C of the mold M, and the manufactured part A2 is mounted on the support substrate P. Then, the manufactured part A2 mounted on the support substrate P is inserted into the cavity C of the mold M, and compression is performed between the mold M and the support substrate P. During this process, a support member 700 on one side is positioned between the support substrate P and the coil part 10, acting as a support pillar to ensure a certain gap between the coil part 10 and the support substrate P. Similarly, a support member 700 on the other side is positioned between the cavity C of the mold M and the coil part 10, acting as a support pillar to ensure a certain gap between the coil part 10 and the cavity C.

[0375] During this compression molding process, the material containing the magnetic material flows and expands into the cavity C under a compressive force applied between the mold M and the support substrate P. Therefore, stress is applied to the manufactured product A2 during material filling. In particular, when the material flows and expands within the cavity C, it moves from the cavity C towards the support substrate P, thus applying a relatively strong stress to the manufactured product A2 from the cavity C towards the support substrate P. In this embodiment, since the manufactured product A2 is supported on the support substrate P by the support member 700, deformation of the manufactured product A2 can be suppressed even if it is pressed against the support substrate P by the material. That is, the displacement of the positions of each coil portion 10 in the manufactured product A2 can be effectively suppressed.

[0376] After the material containing magnetic material is filled into cavity C, it is allowed to solidify or harden. Demolding is then performed (see...). Figure 32B ). Figure 33A The XY plan view of the sheet-like manufactured part B2 obtained by demolding is shown. Figure 33B It shows Figure 33A A cross-sectional view at line C-C'. In manufacture B2, the entire periphery of manufacture A2 is covered by body material 300 (made of a material containing magnetic material that has been solidified or hardened).

[0377] Next, the sheet-like manufactured object B2 is cut along the first direction (Z1-Z2 direction) in a direction parallel to the cutting surface, and the fourth step is performed to obtain multiple first components including helical portions (first helical conductive portion 11, second helical conductive portion 21). Specifically, as follows... Figure 34A XY plane diagram and Figure 34B XZ cross-sectional view ( Figure 34A As shown in the cross-section at line C-C', the manufactured article B2 is divided at a predetermined position. In this step, the manufactured article B2 is cut along the respective directions of the connecting portions 151 and 152. Figure 34A and Figure 34B The dashed line in the figure represents the cutting line (dividing line) formed by cutting. By cutting, a first component, C2, is formed, which has each coil portion 10 and a body portion 30 composed of the divided body material 300 covering these coil portions 10. In the component C2, the connecting portion 152 is removed without leaving any residue by cutting, but a portion of the connecting portion 151 and a portion of the support member 700 are still retained.

[0378] On one hand, the part of manufacture B2 that is cut and separated from manufacture C2 is the second component C2A. Figure 34A and Figure 34B In the example shown, the second component C2A includes a portion of one or both of the connecting portion 151 and the supporting portion 700. Furthermore, neither the connecting portion 151 nor the supporting portion 700 remains in the second component C2A′.

[0379] A portion of the connecting portion 151 remaining on the C2 side of the manufactured item forms first connecting portions 15A, 15B, 15C, and 15D. The cut surface of the first connecting portion 15A, exposed by the cut surface of the body material 300, forms a lead-out exposed surface 140. The cut surface of the first connecting portion 15B, exposed by the cut surface of the body material 300, forms a dummy end face 71E. The cut surface of the first connecting portion 15C, exposed by the cut surface of the body material 300, forms a dummy end face 72E. The cut surface of the first connecting portion 15D, exposed by the cut surface of the body material 300, forms a lead-out exposed surface 240.

[0380] Furthermore, a portion of the support member 700 remaining on the C2 side of the manufactured product forms support portions 701A, 701B, 702A, 702B, 703A, 703B, 704A, 704B, 705A, 705B, 706A, and 706B. The cut surface of the support member 700 exposed from the cut surface of the body material 300 forms a support exposure surface 70B (first exposure surface 70C). Additionally, when the support member 700 has a cylindrical or other planar portion that contacts the support substrate P or the cavity C, this planar portion is exposed from the Z1 side surface and the Z2 side surface in the Z1-Z2 direction of the body material 300, and this exposed planar portion forms a support exposure surface 70B (second exposure surface 70D).

[0381] Next, as Figure 35A XY plane diagram Figure 35B XZ plan and Figure 35C As shown in the YZ plan view, an insulating coating 600 is applied to a portion of the surface of the manufacture C2. The surface on which the insulating coating 600 is applied is the outer surface of the manufacture C2 that will not form electrodes in subsequent steps. In this embodiment, the insulating coating 600 is applied to the outer surface of the manufacture C2 other than the outer surface exposed by the lead-out surfaces 140 and 240.

[0382] Next, as Figure 36A XY plane diagram Figure 36B XZ plan and Figure 36C As shown in the YZ plan view, a first terminal portion 41 and a second terminal portion 42, serving as external electrodes, are formed on the conductive surface of the manufactured product C2 where the insulating coating 600 is not applied (fifth step). The method for forming the first terminal portion 41 and the second terminal portion 42 is not limited; for example, a plating process or a printing process using conductive paste can be employed. Thus, the coil component 100B of this embodiment is manufactured.

[0383] The first terminal portion 41, in addition to engaging with the lead-out exposed surface 140 and the dummy terminal portion 72E, also engages with the support exposed surfaces 70B of the support portions 701A, 702A, 703A, 704A, 705A, and 706A. The second terminal portion 42, in addition to engaging with the lead-out exposed surface 240 and the dummy terminal portion 71E, also engages with the support exposed surfaces 70B of the support portions 701B, 702B, 703B, 704B, 705B, and 706B. Thus, by reducing the contact resistance of the first terminal portion 41 and the second terminal portion 42, the direct current resistance (DCR) is improved, and by increasing the bonding strength of the first terminal portion 41 and the second terminal portion 42, the reliability of the coil component 100B is improved.

[0384] (Manufacturing method of coil component 100C)

[0385] Figures 37A to 40C This is an explanatory diagram illustrating an example of the manufacturing method of the coil component 100C according to the third embodiment.

[0386] In the manufacturing method of the coil component 100C according to the third embodiment, from the forming process of the coil portion 10 to the molding process of the body material 300 surrounding the coil portion 10 with a material containing magnetic material, it is the same as the manufacturing method of the coil component 100A according to the first embodiment, and therefore the description is omitted. It should be noted that in the manufacturing method of the coil component 100C according to the third embodiment, the manufactured product obtained by the molding process of the body material 300 (third step) is referred to as manufactured product B3.

[0387] After the molding process (third step) of the body material 300, such as Figure 37A XY plane diagram and Figure 37B XZ cross-sectional view ( Figure 37A As shown in the cross-section at line C-C', as part of the fourth step, the manufactured object B3 is half-cut at a predetermined position. In this step, the manufactured object B3 is half-cut along the connecting portion 151 into the body material 300 until the support member 700 is exposed. The width of the half-cut is set to be the width of the support member 700 or more. As a result, a linear recess LD is formed that extends along a second direction (Y1-Y2 direction) orthogonal to the first direction (Z1-Z2 direction) and is recessed towards the Z2 side of the Z1-Z2 direction, so that the support member 700 is exposed from the bottom surface of the linear recess LD.

[0388] Next, as Figure 38A XY plane diagram and Figure 38B XZ cross-sectional view ( Figure 38A As shown in the cross-section at line C-C' in the diagram, as another part of the fourth step, the workpiece B3 is cut at a predetermined position (dividing line). In this step, along the extension direction (Y1-Y2 direction) of the linear recess LD formed in the previous step, the width (cutting width) of the portion removed by the cutting (e.g., the area of ​​the cutting edge width used for cutting, the area between two cutting positions, etc.) is less than the width of the bottom surface of the linear recess LD, and the workpiece B3 is cut (full cut) with the center position of the bottom surface of the linear recess LD in the width direction (X1-X2 direction) or near it as the dividing line. Figure 38A and Figure 38B A single chain line in the diagram represents the dividing line of the cut. Through this cut, the body part 30 obtained by cutting the body material 300 covering each coil part 10 constitutes a plurality of manufactured parts C3 as first components.

[0389] In manufacture C3, connecting portions 151 and 152 have been removed and are no longer present due to cutting, but a portion of the support member 700 is retained. On the other hand, in the portion that was not cut and became manufacture C3 (e.g. Figure 38A and Figure 38B In the second component (C3A), at least one of the connecting part 151, connecting part 152 and supporting part 700 may remain.

[0390] A portion of the support member 700 remaining on the C3 side of the manufactured product forms support portions 701A and 701B. Furthermore, the cut surface of the support member 700 exposed by the cut surface of the body material 300 forms the support exposure surface 70B (first exposure surface 70C) of the support portions 701A and 701B. Simultaneously, the cut surface of the first lead-out portion 14 exposed by the cut surface of the body material 300 forms the lead-out exposure surface 140, the cut surface of the first dummy conductive portion 72 forms the dummy end portion 72E, the cut surface of the second lead-out portion 24 forms the lead-out exposure surface 240, and the cut surface of the second dummy conductive portion 71 forms the dummy end portion 71E.

[0391] Furthermore, since the cutting width is smaller than the width of the linear recess LD, and the cutting is performed at or near the center of the bottom surface of the linear recess LD, although the bottom surface of the linear recess LD is divided, the support member 700 remains exposed from the divided bottom surface. The exposed surface of this support member 700 forms the support exposure surface 70B (second exposure surface 70D) of the support portions 701A and 701B. In other words, the manufacture C3, as the first component, has a stepped portion originating from the linear recess LD, and the support portions 701A and 701B formed based on the support member 700 are exposed (support exposure surface 70B) on the lower surface of this stepped portion (the lower surface of the step originating from the bottom surface of the linear recess LD).

[0392] Next, as Figure 39A XY plane diagram Figure 39B XZ plan and Figure 39C As shown in the YZ plan view, an insulating coating 600 is applied to a portion of the surface of the manufacture C3. The surface on which the insulating coating 600 is applied can be the entire outer surface of the manufacture C3, or a portion of the outer surface where electrodes will not be formed in subsequent steps. In this embodiment, the insulating coating 600 is applied to the entire outer surface of the manufacture C3.

[0393] Next, as Figure 40A XY plane diagram Figure 40B XZ plan and Figure 40CAs shown in the YZ plan view, external electrodes 16A and 16B are formed on the exposed outer surface of the support surface 70B in the manufactured product C3 (fifth step). The method for forming the external electrodes 16A and 16B is not limited, for example, a plating process or a printing process can be used.

[0394] External electrodes 16A and 16B are formed in recesses created by cutting the bottom surface of the linear recess LD of the manufacture C3. Specifically, external electrode 16A contacts the exposed conductive surface of the support exposed surface 70B of the support portion 701A, and external electrode 16B contacts the exposed conductive surface of the support exposed surface 70B of the support portion 701B, and extends along the Y1-Y2 direction. External electrodes 16A and 16B, for example, are positioned across two outer surfaces 30c and 30d parallel to the XZ plane of the body portion 30.

[0395] Furthermore, since the external electrodes 16A and 16B are formed in a recess created by cutting the bottom surface of the linear recess LD of the manufacture C3, the external electrodes 16A and 16B form a first recess 161 recessed in the first direction (Z2 side of the Z1-Z2 direction) along this recess. Thus, the coil component 100C of this embodiment is manufactured.

[0396] Next, the first terminal portion 41 and the second terminal portion 42 may be formed as needed. When an insulating coating 600 is applied to the entire outer surface of the manufacture C3, the insulating coating 600 will be removed from the portions where the first terminal portion 41 and the second terminal portion 42 are formed.

[0397] Here, if the mounting area of ​​the coil component 100C is further reduced, the first terminal portion 41 and the second terminal portion 42 can be omitted. In this case, from the viewpoint of improving the surface insulation of the coil component 100C to improve reliability, the insulating coating 600 (outer covering 60) can also contact the outer surfaces 30a and 30b. That is, the insulating coating 600 (outer covering 60) can also be made to contact the outer surfaces 30a and 30b. Figure 40A , Figure 40B , Figure 40C The first terminal portion 41 and the second terminal portion 42 are replaced with an insulating coating 600. The omission of the first terminal portion 41 and the second terminal portion 42 also applies to subsequent embodiments that include external electrodes 16A and 16B.

[0398] (Manufacturing method of coil component 100D)

[0399] Figures 41A to 44C This is an explanatory diagram illustrating an example of the manufacturing method of the coil component 100D according to the fourth embodiment.

[0400] In the manufacturing method of the coil component 100D according to the fourth embodiment, from the first step to the third step, that is, from the forming process of the coil portion 10 to the molding process of surrounding the body material 300 with a material containing magnetic material around the coil portion 10, the process is the same as that of the manufacturing method of the coil component 100C according to the third embodiment, and therefore the description is omitted. In the manufacturing method of the coil component 100D according to the fourth embodiment, the arrangement of the support member 700 is the same as that of the manufacturing method of the coil component 100B according to the second embodiment, in which the support member 700 is arranged on both sides of the connecting portion 151 in the Z1-Z2 direction. Furthermore, in the manufacturing method of the coil component 100D according to the fourth embodiment, the sheet-like manufactured product obtained by the molding process (third step) of the body material 300 is called the manufactured product B4.

[0401] After the molding process (third step) of the body material 300, such as Figure 41A XY plane diagram and Figure 41B XZ cross-sectional view ( Figure 41A As shown in the cross-section at line C-C', the manufactured object B4 is partially cut at a predetermined position (part of the fourth step). In this step, the manufactured object B4 is partially cut along the connecting portion 151 into the body material 300 until the support member 700 is exposed. The width of the partial cut is set to the width of the support member 700 or more. As a result, a linear recess LD is formed extending along the Y1-Y2 direction and recessed towards the Z2 side in the Z1-Z2 direction, so that the support member 700 is exposed from the bottom surface of the linear recess LD.

[0402] Next, as Figure 42A XY plane diagram and Figure 42B XZ cross-sectional view ( Figure 42A As shown in the cross-section at line C-C' in the diagram, as another part of the fourth step, the manufactured object B4 is cut at a predetermined position (dividing line). In this step, along the extension direction (Y1-Y2 direction) of the linear recess LD formed in the previous step, the width of the portion removed by the cut is less than the width of the bottom surface of the linear recess LD, and the manufactured object B3 is cut (full cut) with the center position of the bottom surface of the linear recess LD in the width direction (X1-X2 direction) or near it as the dividing line. Figure 42A and Figure 42B A single chain line in the diagram represents the cutting line (dividing line). Through this cutting, the body portion 30 obtained by cutting each coil portion 10 and the body material 300 covering each coil portion 10 constitutes a plurality of manufactured items C4 as first components.

[0403] In manufacture C4, the connecting portion 152 has been removed and is no longer present due to cutting, but the connecting portion 151 and a portion of the support member 700 are retained. On the other hand, in the portion that was not cut and became manufacture C4 (e.g. Figure 42A and Figure 42B In the second component C4A, at least one of the connecting part 151, connecting part 152 and supporting part 700 may remain.

[0404] A portion of the connecting portion 151 remaining on the C4 side of the manufactured item forms first connecting portions 15A, 15B, 15C, and 15D. The cut surface of the first connecting portion 15A exposed by the cut surface of the body material 300 forms a lead-out exposed surface 140. The cut surface of the first connecting portion 15B exposed by the cut surface of the body material 300 forms a dummy end face 71E. The cut surface of the first connecting portion 15C exposed by the cut surface of the body material 300 forms a dummy end face 72E. The cut surface of the first connecting portion 15D exposed by the cut surface of the body material 300 forms a lead-out exposed surface 240.

[0405] Additionally, a portion of the support member 700 remaining on the C4 side of the manufactured product forms support portions 701A, 701B, 702A, 702B, 703A, and 703B. Furthermore, the cut surface of the support member 700 exposed from the cut surface of the body material 300 forms the support exposure surface 70B (first exposure surface 70C) of the support portions 701A, 701B, 702A, 702B, 703A, and 703B. Additionally, when the support member 700 has a planar portion that contacts a cylindrical or other support substrate P or cavity C, this planar portion is exposed from the Z1 side in the Z1-Z2 direction of the body material 300, and this exposed planar portion forms the support exposure surface 70B (second exposure surface 70D).

[0406] Furthermore, since the cutting width is smaller than the width of the linear recess LD, and the cutting is performed at or near the center of the bottom surface of the linear recess LD, although the bottom surface of the linear recess LD is divided, the support member 700 remains exposed from the divided bottom surface. The exposed surface of this support member 700 forms the support exposed surface 70B (second exposed surface 70D) of the support portions 701A, 701B, 702A, 702B, 703A, and 703B.

[0407] Next, as Figure 43A XY plane diagram Figure 43B XZ plan and Figure 43CAs shown in the YZ plan view, an insulating coating 600 is applied to a portion of the surface of the manufacture C4. The surface on which the insulating coating 600 is applied can be the entire outer surface of the manufacture C4, or a portion of the outer surface where electrodes will not be formed in subsequent steps. In this embodiment, the insulating coating 600 is applied to the entire outer surface of the manufacture C4.

[0408] Next, as Figure 44A XY plane diagram Figure 44B XZ plan and Figure 44C As shown in the YZ plan view, external electrodes 16A and 16B are formed on the surface of the manufactured product C4 where the insulating coating 600 is not applied. The method for forming the external electrodes 16A and 16B is not limited; for example, a plating process or a printing process can be used.

[0409] External electrodes 16A and 16B are formed in recesses created by cutting the bottom surface of the linear recess LD of the manufacture C4. Specifically, external electrode 16A contacts the exposed conductive surface of the support exposed surface 70B of the support portions 701A, 702A, and 703A, and external electrode 16B contacts the exposed conductive surface of the support exposed surface 70B of the support portions 701B, 702B, and 703B, and extends along the Y1-Y2 direction. External electrodes 16A and 16B, for example, are provided across two outer surfaces 30c and 30d parallel to the XZ plane of the body portion 30.

[0410] Furthermore, since the external electrodes 16A and 16B are formed in a recess created by cutting the bottom surface of the linear recess LD of the manufacture C4, the external electrodes 16A and 16B form a first recess 161 recessed in the first direction (Z2 side of the Z1-Z2 direction) along this recess. Thus, the coil component 100D of this embodiment is manufactured.

[0411] Next, the first terminal portion 41 and the second terminal portion 42 may be formed as needed. When an insulating coating 600 is applied to the entire outer surface of the manufacture C3, the insulating coating 600 will be removed from the portions where the first terminal portion 41 and the second terminal portion 42 are formed.

[0412] (Manufacturing method of coil component 100E)

[0413] Figures 45A to 46C This is an explanatory diagram illustrating an example of the manufacturing method of the coil component 100E according to the fifth embodiment.

[0414] In the manufacturing method of the coil component 100E according to the fifth embodiment, from the forming process of the coil portion 10 to the molding process of the body material 300 surrounding the coil portion 10 with a material containing magnetic material, it is the same as the manufacturing method of the coil component 100B according to the second embodiment, so the description is omitted. In the manufacturing method of the coil component 100E according to the fifth embodiment, the sheet-like manufactured article obtained by the molding process of the body material 300 is called manufactured article B5.

[0415] After the molding process of the body material 300, the sheet-shaped manufactured part B5 is cut along the first direction (Z1-Z2 direction) in a direction parallel to the cutting surface, and the fourth step is performed to obtain a plurality of first parts including spiral portions (first spiral conductive portion 11, second spiral conductive portion 21). Specifically, as Figure 45A XY plane diagram and Figure 45B XZ cross-sectional view ( Figure 45A As shown in the cross-section at line C-C', the manufactured article B5 is divided at a predetermined position. In this step, the manufactured article B5 is cut along the directions of the connecting portion 151 and the connecting portion 152, respectively. Figure 45A and Figure 45B The dashed line in the figure represents the cutting line formed by cutting. Through this cutting, the body part 30 obtained by cutting each coil part 10 and the body material 300 covering each coil part 10 constitutes a plurality of manufactured parts C5 as first components.

[0416] In manufacture C5, the connecting portion 152 has been removed and is no longer present due to cutting, but the connecting portion 151 and a portion of the support member 700 are retained. On the other hand, in the portion that was not cut and became manufacture C2 (e.g. Figure 45A and Figure 45B In the second component (C5A), at least one of the connecting part 151, connecting part 152 and supporting part 700 may remain.

[0417] A portion of the connecting portion 151 remaining on the C5 side of the manufactured item forms first connecting portions 15A, 15B, 15C, and 15D. The cut surface of the first connecting portion 15A exposed by the cut surface of the body material 300 forms a lead-out exposed surface 140. The cut surface of the first connecting portion 15B exposed by the cut surface of the body material 300 forms a dummy end face 71E. The cut surface of the first connecting portion 15C exposed by the cut surface of the body material 300 forms a dummy end face 72E. The cut surface of the first connecting portion 15D exposed by the cut surface of the body material 300 forms a lead-out exposed surface 240.

[0418] Additionally, a portion of the support member 700 remaining on the C5 side of the manufactured product forms support portions 701A, 701B, 702A, 702B, 703A, 703B, 704A, 704B, 705A, 705B, 706A, and 706B. Furthermore, the cut surface of the support member 700 exposed from the cut surface of the body material 300 forms a support exposure surface 70B (first exposure surface 70C). Additionally, when the support member 700 has a planar portion that contacts a cylindrical or other support substrate P or a cavity C, this planar portion is exposed from the Z1 side surface and the Z2 side surface in the Z1-Z2 direction of the body material 300, and this exposed planar portion forms a support exposure surface 70B (second exposure surface 70D).

[0419] like Figure 46A XY plane diagram Figure 46B XZ plan and Figure 46C As shown in the YZ plane diagram, in this embodiment, the lead-out surface 140, the dummy end face 72E, the support surface 70B, the lead-out surface 240, and the dummy end face 71E, which are exposed on the outer side of the YZ plane as the cutting surface in the manufactured part C5, are directly used as welding electrode surfaces for mounting. Thus, the coil component 100E of this embodiment is obtained.

[0420] (Manufacturing method of coil component 100F)

[0421] Figures 47A to 55C This is an explanatory diagram illustrating an example of the manufacturing method of the coil component 100F according to the sixth embodiment.

[0422] First, such as Figure 47A XY plane diagram and Figure 47B XZ cross-sectional view ( Figure 47A As shown in the cross-section at line C-C', multiple spiral portions (first spiral conductive portion 11, second spiral conductive portion 21) are formed (first step). Specifically, the first spiral conductive portion 11 is formed on one side of the insulating sheet substrate 91 (specifically, the Z1 side in the Z1-Z2 direction), and the second spiral conductive portion 21 is formed on the other side of the sheet substrate 91 (specifically, the Z2 side in the Z1-Z2 direction). The forming process of the first spiral conductive portion 11 and the second spiral conductive portion 21 is not particularly limited, and can be formed, for example, by a plating process. In this embodiment, the via portion VP and the first lead-out portion 14 and the second lead-out portion 24 are also formed simultaneously in this process.

[0423] When this step includes a plating process, the coil conductive portion 20, which includes the first conductive portion 201, includes a portion formed by the plating. Furthermore, the plating process also forms a first dummy conductive portion 72.

[0424] Furthermore, using the same plating process, connecting portions 151 extending in the Y1-Y2 direction and connecting portions 152 extending in the X1-X2 direction are formed around the coil conductive portions 20 when viewed along the first direction (Z1-Z2 direction). Connecting portions 151 and 152 are arranged in a grid pattern at the midpoint between adjacent coil conductive portions 20, and are also positioned around the outer periphery of the entire area of ​​the plurality of coil conductive portions 20. Connecting portions 151 and 152 not only structurally connect the plurality of coil conductive portions 20 to improve conformability, but also serve as energized portions in the plating process. Pads 155 can be formed at the intersection of connecting portions 151 and 152. Thus, in the first step, a conductor pattern comprising a plurality of spiral portions (first spiral conductive portion 11, second spiral conductive portion 21) and connecting portions (connecting portions 151, connecting portions 152) of the plurality of spiral portions is formed.

[0425] In the next step, at least a portion of the sheet-like substrate 91 is removed. Specifically, when viewed along the first direction (Z1-Z2 direction), the portion of the sheet-like substrate 91 including the area surrounded by the inner edge of the first helical conductive portion 11 is removed. The specific removal process of the sheet-like substrate 91 is the same as the aforementioned manufacturing method.

[0426] Next, as Figure 48A XY plane diagram and Figure 48B XZ cross-sectional view ( Figure 48A As shown in the cross-section at line C-C', adhesive 155b is applied above the connector 151. Adhesive 155b is, for example, a thermosetting adhesive. The adhesive 155b is applied at the intersection of connector 151 and connector 152. When a pad 155 is provided at the intersection of connector 151 and connector 152, adhesive 155b is applied to the pad 155. The method of applying adhesive 155b is not limited. For example, the adhesive 155b can be attached to multiple pin tips and transferred from multiple pins to the application position of connector 151, or the adhesive can be applied by screen printing using a mask such as a metal mask.

[0427] Next, as Figure 49A XY plane diagram and Figure 49B XZ cross-sectional view ( Figure 49AAs shown in the cross-section at line C-C', a support member 700 (part of the second step) is installed above the position where adhesive 155b was applied in the aforementioned step (Z1 side in the Z1-Z2 direction). This forms a support member 700 extending from the connecting portions 151, 152 towards one side in the first direction (Z1 side in the Z1-Z2 direction). Thus, support portions 702A, 702B, 703A, and 703B are formed from this support member 700. The installation method of the support member 700 is not limited; for example, the same shaking method as described above can be used. Furthermore, the support member 700 has a soft magnetic portion (supporting soft magnetic portion). The supporting soft magnetic portion may contain magnetic powder or may be an insulator. The composition of the supporting soft magnetic portion is not particularly limited. For example, a powder core formed by powder pressing or a ferrite core prepared by sintering or the like can be used. The shape of the support component 700 is not limited; for example, it can be spherical, cylindrical, cuboid, hexagonal prism, or other shapes. After the support component 700 is installed, it is fixed to the connecting part 151 by means of thermosetting or other methods.

[0428] Subsequently, as Figure 50A and Figure 50B As shown in the XY cross-sectional view, the adhesive 155b applied to the connecting portion 151 on one side (Z1 side in the Z1-Z2 direction) of the coil portion 10 in the previous step, as well as the installation and fixation of the support member 700, are also applied to the other side (Z2 side in the Z1-Z2 direction) of the coil portion 10 (another part of the second step) by the same process. The support member 700 thus provided forms support portions 705A, 705B, 706A, and 706B.

[0429] After fixing the support member 700 to the connecting part 151, an insulating coating is applied to the exposed surfaces of the connecting parts 151 and 152, the support member 700, the first spiral conductive part 11, and the second spiral conductive part 21. The process for forming the insulating coating is the same as the aforementioned manufacturing method.

[0430] Next, a material containing magnetic powder is supplied to cover the conductor pattern on at least both sides in the first direction (Z1-Z2 direction) and formed into a sheet (third step). As an example of this molding process, a molding process in which a material containing magnetic material surrounds the coil portion 10 can be described. Specific examples of this molding process include placing the manufactured product A6 formed up to the previous steps in a mold, compressing the material containing magnetic material, or transferring the material containing magnetic powder or its raw material into a mold.

[0431] Figures 51A to 51B The schematic cross-sectional view illustrates the compression molding process. First, as... Figure 51AAs shown, a material containing magnetic material is placed inside the cavity C of the mold M, and the manufactured part A6 is mounted on the support substrate P. Then, the manufactured part A6 mounted on the support substrate P is inserted into the cavity C of the mold M, and compression is performed between the mold M and the support substrate P. During this process, a support member 700 on one side is positioned between the support substrate P and the coil part 10, acting as a support pillar to ensure a certain gap between the coil part 10 and the support substrate P. Similarly, a support member 700 on the other side is positioned between the cavity of the mold M and the coil part 10, acting as a support pillar to ensure a certain gap between the coil part 10 and the cavity C.

[0432] During this compression molding process, the material containing the magnetic material flows and expands into the cavity C under a compressive force applied between the mold M and the support substrate P. Therefore, stress is applied to the manufactured product A6 during material filling. In particular, when the material flows and expands within the cavity C, a strong stress is applied to the manufactured product A6 from the cavity C towards the support substrate P as the material moves from the cavity C towards the support substrate P. In this embodiment, since one side of the manufactured product A6 is supported on the support substrate P by the support member 700, deformation of the manufactured product A6 can be suppressed even if it is pressed against the support substrate P by the material. Furthermore, in this embodiment, since the other side of the manufactured product A6 is supported on the cavity C by the support member 700, deformation of the manufactured product A6 towards the cavity C can be suppressed. That is, the displacement of the positions of each coil portion 10 in the manufactured product A6 can be effectively suppressed.

[0433] After the material containing magnetic material is filled into cavity C, it is allowed to solidify or harden. Demolding is then performed (see...). Figure 51B ). Figure 52A The XY plan view of the sheet-like manufactured part B6 obtained by demolding is shown. Figure 52B It shows Figure 52A XZ cross-sectional view at line C-C'. In manufacture B6, the entire periphery of manufacture A6 is covered by body material 300 (made of material containing magnetic material solidified or hardened).

[0434] Next, the sheet-like manufactured object B6 is cut along the first direction (Z1-Z2 direction) in a direction parallel to the cutting surface, and the fourth step is performed to obtain multiple first components including helical portions (first helical conductive portion 11, second helical conductive portion 21). Specifically, as follows... Figure 53A XY plane diagram and Figure 53B XZ cross-sectional view ( Figure 53A As shown in the cross-section at line C-C', the manufactured article B6 is divided at a predetermined position. In this step, the manufactured article B6 is cut along the directions of the connecting portion 151 and the connecting portion 152, respectively. Figure 53A and Figure 53B The dashed line in the figure represents a cutting line (dividing line). By cutting, a first component, C6, is formed, which has coil portions 10 and a body portion 30 composed of divided body material 300 covering these coil portions 10. In the component C6, the connecting portion 152 is removed without leaving any residue by cutting, but a portion of the connecting portion 151 and a portion of the support member 700 are still retained. On the other hand, in the portion that is not part of the component C6 (e.g., ...), the cutting also removes the connecting portion 152. Figure 53A and Figure 53B In the second component (C6A), at least one of the connecting part 151 and the supporting part 700 may remain.

[0435] A portion of the connecting portion 151 remaining on the C6 side of the manufactured item forms first connecting portions 15A, 15B, 15C, and 15D. The cut surface of the first connecting portion 15A exposed by the cut surface of the body material 300 forms a lead-out exposed surface 140. The cut surface of the first connecting portion 15B exposed by the cut surface of the body material 300 forms a dummy end face 71E. The cut surface of the first connecting portion 15C exposed by the cut surface of the body material 300 forms a dummy end face 72E. The cut surface of the first connecting portion 15D exposed by the cut surface of the body material 300 forms a lead-out exposed surface 240.

[0436] Furthermore, a portion of the support member 700 remaining on the C6 side of the manufactured product forms support portions 702A, 702B, 703A, 703B, 705A, 705B, 706A, and 706B. The cut surface of the support member 700 exposed by the cut surface of the body material 300 forms a support exposure surface 70B (first exposure surface 70C). Additionally, when the support member 700 has a cylindrical or other planar portion that contacts the support substrate P or the cavity C, this planar portion is exposed from the Z1 side surface and the Z2 side surface in the Z1-Z2 direction of the body material 300, and this exposed planar portion forms a support exposure surface 70B (second exposure surface 70D).

[0437] Next, as Figure 54A XY plane diagram Figure 54B XZ plan and Figure 54C As shown in the YZ plan view, an insulating coating 600 is applied to a portion of the surface of the manufacture C6. The surface on which the insulating coating 600 is applied is the outer surface of the manufacture C6 that will not form electrodes in subsequent steps. In this embodiment, the insulating coating 600 is applied to the outer surface of the manufacture C6 other than the outer surface exposed by the lead-out surfaces 140 and 240.

[0438] Next, as Figure 55A XY plane diagram Figure 55B XZ plan and Figure 55C As shown in the YZ plan view, a first terminal portion 41 and a second terminal portion 42, serving as external electrodes, are formed on the conductive surface of the manufactured product C6 where the insulating coating 600 is not applied (fifth step). The method for forming the first terminal portion 41 and the second terminal portion 42 is not limited; for example, a plating process or a printing process using conductive paste can be employed. Thus, the coil component 100F of this embodiment is manufactured.

[0439] The first terminal portion 41, in addition to engaging with the lead-out exposed surface 140 and the dummy terminal portion 72E, also engages with the support exposed surfaces 70B of the support portions 702A, 703A, 705A, and 706A. The second terminal portion 42, in addition to engaging with the lead-out exposed surface 240 and the dummy terminal portion 71E, also engages with the support exposed surfaces 70B of the support portions 702B, 703B, 705B, and 706B. Thus, by reducing the contact resistance of the first terminal portion 41 and the second terminal portion 42, the direct current resistance (DCR) is improved, and by increasing the engagement strength of the first terminal portion 41 and the second terminal portion 42, the reliability of the coil component 100F is improved.

[0440] Furthermore, as shown in this embodiment, by providing support portions 702A, 702B, 703A, 703B, 705A, 705B, 706A, and 706B with support portions for soft magnetic portions at the corners of the main body portion 30, magnetic flux can easily pass through the corners, thereby improving the magnetic characteristics (inductance) of the coil component 100F.

[0441] (Other manufacturing methods for coil component 100B)

[0442] Figures 56A to 66C This is an explanatory diagram illustrating an example of another manufacturing method for the coil component 100B of the second embodiment.

[0443] First, such as Figure 56A XY plane diagram and Figure 56B XZ cross-sectional view ( Figure 56AAs shown in the cross-section at line C-C', multiple spiral portions (first spiral conductive portion 11, second spiral conductive portion 21) are formed (first step). Specifically, the first spiral conductive portion 11 is formed on one side of the insulating sheet substrate 91 (specifically, the Z1 side in the Z1-Z2 direction), and the second spiral conductive portion 21 is formed on the other side of the sheet substrate 91 (specifically, the Z2 side in the Z1-Z2 direction). The forming process of the first spiral conductive portion 11 and the second spiral conductive portion 21 is not particularly limited, and can be formed, for example, by a plating process. In this embodiment, the via portion VP and the first lead-out portion 14 and the second lead-out portion 24 are also formed simultaneously in this process.

[0444] When this step includes a plating process, the coil conductive portion 20, which includes the first conductive portion 201, includes a portion formed by the plating. Furthermore, the plating process also forms a first dummy conductive portion 72.

[0445] Furthermore, using the same plating process, connecting portions 151 extending in the Y1-Y2 direction and connecting portions 152 extending in the X1-X2 direction are formed around the coil conductive portions 20 when viewed along the first direction (Z1-Z2 direction). Connecting portions 151 and 152 are arranged in a grid pattern at the midpoint between adjacent coil conductive portions 20, and are also positioned around the outer periphery of the entire area of ​​the plurality of coil conductive portions 20. Connecting portions 151 and 152 not only structurally connect the plurality of coil conductive portions 20 to improve conformability, but also serve as energized portions in the plating process. Furthermore, using the same plating process, an outer peripheral component 153 connected to the connecting portion 151 is formed on the outside of the connecting portion 151 when viewed along the first direction (Z1-Z2 direction). Thus, in the first step, a conductor pattern is formed that includes multiple spiral portions (first spiral conductive portion 11, second spiral conductive portion 21), connecting portions of multiple spiral portions (connecting portion 151, connecting portion 152), and an outer peripheral component 153.

[0446] In the next step, at least a portion of the sheet-like substrate 91 is removed. Specifically, when viewed along the first direction (Z1-Z2 direction), the portion of the sheet-like substrate 91 including the area surrounded by the inner edge of the first helical conductive portion 11 is removed. The specific removal process of the sheet-like substrate 91 is the same as the aforementioned manufacturing method.

[0447] Next, as Figure 57A XY plane diagram and Figure 57B XZ cross-sectional view ( Figure 57AAs shown in the cross-section at line C-C', flux 155a is applied above the connector 151 (on the Z1 side in the Z1-Z2 direction). The flux 155a is applied at the intersection of the extension line of the first lead 14 and the connector 151, the intersection of the extension line of the second dummy conductive part 71 and the connector 151, and the intersection of the connector 151 and the connector 152. The method of applying flux 155a is not limited. For example, it can be applied by attaching flux 155a to the tips of multiple leads and transferring flux 155a from the multiple leads to the application position of the connector 151, or by applying it using a mask such as a metal mask through screen printing.

[0448] Next, as Figure 58A XY plane diagram and Figure 58B XZ cross-sectional view ( Figure 58A As shown in the cross-section at line C-C' in the diagram, a support member 700 (part of the second step) is installed above the position where flux 155a was applied in the aforementioned step (Z1 side in the Z1-Z2 direction). This forms a support member 700 extending from the connecting portions 151 and 152 towards one side in the first direction (Z1 side in the Z1-Z2 direction). Thus, support portions 701A, 701B, 702A, 702B, 703A, and 703B are formed from this support member 700. The installation method of the support member 700 is not limited; for example, the same shaking method as described above can be used. Furthermore, similar to the aforementioned manufacturing method, solder balls, heteronuclear solder balls (copper-core solder balls, resin-core solder balls, etc.), and copper pillars (cylindrical, cylindrical with joints, spherical, truncated conical, laminated, etc.) can be used as the support member 700. After the support component 700 is installed, it is fixed to the connecting part 151 by reflow soldering.

[0449] Subsequently, as Figure 59A and Figure 59B As shown in the XY cross-sectional view, the flux 155a applied to the connecting portion 151 and the support member 700 installed and fixed on one side (Z1 side in the Z1-Z2 direction) of the coil portion 10 in the previous step are also applied to the other side (Z2 side in the Z1-Z2 direction) of the coil portion 10 (another part of the second step) by the same process. The support member 700 thus provided forms support portions 704A, 704B, 705A, 705B, 706A, and 706B.

[0450] After the support member 700 is fixed to the connecting part 151, an insulating coating is applied to the exposed surfaces of the connecting parts 151 and 152, the support member 700, the first spiral conductive part 11, and the second spiral conductive part 21. The process for forming the insulating coating is the same as the aforementioned manufacturing method.

[0451] Next, a material containing magnetic powder is supplied to cover the conductor pattern on at least both sides in the first direction (Z1-Z2 direction) and formed into a sheet (third step). As an example of this molding process, a molding process in which a material containing magnetic material surrounds the coil portion 10 can be cited. Specific examples of this molding process include placing the manufactured product A2a formed up to the previous steps in a mold, compressing the material containing magnetic material, or transferring the material containing magnetic powder or its raw material into a mold.

[0452] Figures 60A to 60B The schematic cross-sectional view illustrates the compression molding process. First, as... Figure 60A As shown, a material containing magnetic material is placed inside the cavity C of the mold M, and the manufactured part A2a is mounted on the support substrate P. Then, the manufactured part A2a mounted on the support substrate P is inserted into the cavity C of the mold M, and compression is performed between the mold M and the support substrate P. During this process, a support member 700 on one side is positioned between the support substrate P and the coil part 10, acting as a support pillar to ensure a certain gap between the coil part 10 and the support substrate P. Similarly, a support member 700 on the other side is positioned between the cavity of the mold M and the coil part 10, acting as a support pillar to ensure a certain gap between the coil part 10 and the cavity C.

[0453] During this compression molding process, the material containing the magnetic material flows and expands into the cavity C under a compressive force applied between the mold M and the support substrate P. Therefore, stress is applied to the manufactured product A2a during material filling. In particular, when the material flows and expands within the cavity C, a strong stress is applied to the manufactured product A2a from the cavity C towards the support substrate P as the material moves from the cavity C towards the support substrate P. In this embodiment, since one side of the manufactured product A2a is supported on the support substrate P by the support member 700, deformation of the manufactured product A2a can be suppressed even if it is pressed against the support substrate P by the material. Furthermore, in this embodiment, since the other side of the manufactured product A2a is supported on the cavity C by the support member 700, deformation of the manufactured product A2a towards the cavity C can be suppressed. That is, the displacement of the positions of each coil portion 10 in the manufactured product A2a can be effectively suppressed.

[0454] After the material containing magnetic material is filled into cavity C, it is allowed to solidify or harden. Demolding is then performed (see...). Figure 60B ). Figure 61A The XY plan view of the sheet-like manufactured part B2a obtained by demolding is shown. Figure 61B It shows Figure 61AA cross-sectional view at line C-C'. In manufacture B2a, the entire periphery of manufacture A2a is covered by body material 300 (made of a material containing magnetic material that has been solidified or hardened).

[0455] Next, as Figure 62A XY plane diagram and Figure 62B XZ cross-sectional view ( Figure 62A As shown in the cross-section at line C-C', a cut is made at a predetermined position on the manufacture B2a. That is, in this step, the manufacture B2a is completely cut along the connecting portion 151, but a portion of the connecting portion 151 and a portion of the support member 700 are still retained. In addition, in the X1-X2 direction, a cut is made on the portion located further inside the outer periphery of the outer peripheral member 153. Through this cut, the lead-out surface 140, the dummy end portion 71E, the lead-out surface 240, the dummy end portion 72E, and the first exposed surface 70C are exposed from the cut surface of the body material 300.

[0456] Next, as Figure 63A XY plane diagram and Figure 63B XZ cross-sectional view ( Figure 63A As shown in the cross section at line C-C', the body material 300 is half-cut so that the outer peripheral component 153 is exposed when viewed in the Z1-Z2 direction.

[0457] Next, as Figure 64A As shown in the schematic cross-sectional view, the electrode terminal T is mounted onto the outer peripheral component 153 exposed from the body material 300 in the previous step. The electrode terminal T is mounted by clamping the outer peripheral component 153. Then, current is applied from the electrode terminal T to the conductive portion of the manufacture B2a, and plating is performed by an electrolytic plating method. Through this plating, as... Figure 64B As shown in the schematic cross-sectional view, the plated electrode PE1 is formed on the cut surface (exposed surface) formed by the full cut.

[0458] Next, the sheet-like manufactured object B2a is cut along the first direction (Z1-Z2 direction) in a direction parallel to the cutting surface, and the fourth step is performed to obtain multiple first components including helical portions (first helical conductive portion 11, second helical conductive portion 21). Specifically, as follows... Figure 65A XY plane diagram and Figure 65B XZ cross-sectional view ( Figure 65A As shown in the cross-section at line C-C', the manufactured article B2a is divided at a predetermined position. In this step, the manufactured article B2a is cut along the directions of the connecting portion 151 and the connecting portion 152, respectively. Figure 65A and Figure 65BThe dashed line in the figure represents a cutting line (dividing line). By cutting, a manufacture C2a, which is the first component, is formed, having each coil portion 10 and a body portion 30 composed of the divided body material 300 covering these coil portions 10. In the manufacture C2a, the connecting portion 152 is removed without leaving any residue by cutting, but a portion of the connecting portion 151 and a portion of the support member 700 are still retained.

[0459] like Figure 66A XY plane diagram Figure 66B XZ plan and Figure 66C As shown in the YZ plan view, in the manufacturing method of this embodiment, the plating electrode PE1 becomes the first terminal portion 41 and the second terminal portion 42. Thus, the coil component 100B of this embodiment is manufactured. In this embodiment, when forming the plating electrode PE1 as the first terminal portion 41 and the second terminal portion 42, only the portion to be plating is exposed as the cut surface, so the process of providing a protective film on the portion outside the plating can be partially or completely omitted. Furthermore, a protective film can also be formed on the portion of the coil component 100B that exposes the conductive component from the outer surface exposed by the cut.

[0460] (Manufacturing method of coil component 100G)

[0461] Figures 67A to 77C This is an explanatory diagram illustrating an example of the manufacturing method of the coil component 100G according to the seventh embodiment.

[0462] First, such as Figure 67A XY plane diagram and Figure 67B XZ cross-sectional view ( Figure 67A As shown in the cross-section at line C-C', multiple spiral portions (first spiral conductive portion 11, second spiral conductive portion 21) are formed (first step). Specifically, the first spiral conductive portion 11 is formed on one side of the insulating sheet substrate 91 (specifically, the Z1 side in the Z1-Z2 direction), and the second spiral conductive portion 21 is formed on the other side of the sheet substrate 91 (specifically, the Z2 side in the Z1-Z2 direction). The forming process of the first spiral conductive portion 11 and the second spiral conductive portion 21 is not particularly limited, and can be formed, for example, by a plating process. In this embodiment, the via portion VP and the first lead-out portion 14 and the second lead-out portion 24 are also formed simultaneously in this process.

[0463] When this step includes a plating process, the coil conductive portion 20, which includes the first conductive portion 201, includes a portion formed by the plating. Furthermore, the plating process also forms a first dummy conductive portion 72.

[0464] Furthermore, using the same plating process, connecting portions 151 extending in the Y1-Y2 direction and connecting portions 152 extending in the X1-X2 direction are formed around the coil conductive portions 20 when viewed along the first direction (Z1-Z2 direction). Connecting portions 151 and 152 are arranged in a grid pattern at the midpoint between adjacent coil conductive portions 20, and are also positioned around the outer periphery of the entire area of ​​the plurality of coil conductive portions 20. Connecting portions 151 and 152 not only structurally connect the plurality of coil conductive portions 20 to improve conformability, but also serve as energized portions in the plating process. Furthermore, using the same plating process, an outer peripheral component 153 connected to connecting portions 151 and 152 is formed on the outer periphery when viewed along the first direction (Z1-Z2 direction), and pads 156 are formed at positions overlapping with the first lead-out portion 14 and with the first dummy conductive portion 72. Thus, in the first step, a conductor pattern is formed that includes multiple spiral portions (first spiral conductive portion 11, second spiral conductive portion 21), connecting portions of multiple spiral portions (connecting portion 151, connecting portion 152), outer peripheral component 153, and pad 156.

[0465] In the next step, at least a portion of the sheet-like substrate 91 is removed. Specifically, when viewed along the first direction (Z1-Z2 direction), the portion of the sheet-like substrate 91 including the area surrounded by the inner edge of the first helical conductive portion 11 is removed. The specific removal process of the sheet-like substrate 91 is the same as the aforementioned manufacturing method.

[0466] Next, as Figure 68A XY plane diagram and Figure 68B XZ cross-sectional view ( Figure 68A As shown in the cross-section at line C-C' in the diagram, flux 155a is applied above pad 156 (on the Z1 side in the Z1-Z2 direction). The method of applying flux 155a is not limited. For example, it can be applied by attaching flux 155a to the tips of multiple pins and transferring flux 155a from the multiple pins to the application position of the connector 151, or by applying it using a mask such as a metal mask through screen printing.

[0467] Next, as Figure 69A XY plane diagram and Figure 69B XZ cross-sectional view ( Figure 69AAs shown in the cross-section at line C-C' in the previous step, a support member 700 (part of the second step) is installed above the position where flux 155a was applied (Z1 side in the Z1-Z2 direction) to which support portions 701A and 701B are provided. This forms a support member 700 extending from pad 156 to one side in the first direction (Z1 side in the Z1-Z2 direction). The installation method of the support member 700 is not limited; for example, the same drop method as described above can be used. Furthermore, similar to the aforementioned manufacturing method, solder balls, heteronuclear solder balls (copper-core solder balls, resin-core solder balls, etc.), and copper pillars (cylindrical, cylindrical with joints, spherical, truncated conical, laminated, etc.) can be used as the support member 700. After installing the support member 700, it is fixed to pad 156 by reflow soldering.

[0468] After the support member 700 is fixed to the connecting part 151, an insulating coating is applied to the exposed surfaces of the connecting parts 151 and 152, the support member 700, the first spiral conductive part 11, and the second spiral conductive part 21. The process for forming the insulating coating is the same as the aforementioned manufacturing method.

[0469] Next, a material containing magnetic powder is supplied to cover the conductor pattern on at least both sides in the first direction (Z1-Z2 direction), and formed into a sheet (third step). As an example of this molding process, a molding process in which a material containing magnetic material surrounds the coil portion 10 can be described. Specific examples of this molding process include placing the manufactured product A7 formed up to the previous steps in a mold, compressing the material containing magnetic material, or transferring the material containing magnetic powder or its raw material into a mold.

[0470] Figures 70A to 71B The schematic cross-sectional view illustrates the compression molding process. First, as... Figure 70A As shown, a material containing magnetic material is placed inside the cavity C of the mold M, and the manufactured part A7 is mounted on the support substrate P. Then, the manufactured part A7 mounted on the support substrate P is inserted into the cavity C of the mold M, and compression is performed between the mold M and the support substrate P. During this process, a support member 700 is interposed between the support substrate P and the coil part 10. The support member 700 acts as a pillar, thereby ensuring a certain gap between the coil part 10 and the support substrate P.

[0471] During this compression molding process, the material containing the magnetic material flows and expands into the cavity C under a compressive force applied between the mold M and the support substrate P. Therefore, stress is applied to the manufactured product A7 during material filling. In particular, when the material flows and expands within the cavity C, a relatively strong stress is applied to the manufactured product A7 from the cavity C towards the support substrate P because the material moves from the cavity C towards the support substrate P. In this embodiment, since the manufactured product A7 is supported on the support substrate P by the support member 700, deformation of the manufactured product A7 can be suppressed even if the manufactured product A7 is pressed towards the support substrate P by the material. That is, the displacement of the positions of each coil portion 10 in the manufactured product A7 can be effectively suppressed.

[0472] After the material containing magnetic material is filled into cavity C, it is allowed to solidify or harden. Demolding is then performed (see...). Figure 71B ). Figure 72A The XY plan view of the sheet-like manufactured part B7 obtained by demolding is shown. Figure 72B It shows Figure 72A A cross-sectional view at line C-C'. In manufacture B7, the entire periphery of manufacture A1 is covered by body material 300 (made of a material containing magnetic material that has been solidified or hardened).

[0473] Next, as Figure 73A XY plane diagram and Figure 73B XZ cross-sectional view ( Figure 73A As shown in the cross-section at line C-C', a half-cut is made at a predetermined position on the manufactured part B7. That is, in this step, the body material 300 is half-cut along the connecting portion 151 to the depth at which the support member 700 is exposed, thereby forming a linear recess LD that extends in the Y1-Y2 direction and is recessed towards the Z2 side in the Z1-Z2 direction. The width of the half-cut is wider than the width of the support member 700. Furthermore, for the portions of the support members 700 adjacent in the X1-X2 direction (the portions where the support members 700 are adjacent without the coil portion 10 in between), the width of the linear recess LD is set to include the width of the adjacent support members 700. As a result, the support member 700 is exposed from the bottom surface of the linear recess LD. In addition, the body material 300 is half-cut so that the outer peripheral member 153 is exposed when viewed in the Z1-Z2 direction.

[0474] Next, as Figure 74A As shown in the schematic cross-sectional view, the electrode terminal T is mounted onto the outer peripheral component 153 exposed from the body material 300 in the previous step. The electrode terminal T is mounted in a manner that clamps the outer peripheral component 153. Then, current is applied from the electrode terminal T to the conductive portion of the manufacture B7, and plating is performed by an electrolytic plating method. Through this plating, as... Figure 74BAs shown in the schematic cross-sectional view, a plated electrode PE2 is formed on the support member 700 exposed on the bottom surface of the linear recess LD. Figure 75 In the XY plane diagram, the part indicated by the shaded line is the plated electrode PE2 formed along the linear recess LD formed by the half-cut.

[0475] Next, the sheet-like manufactured object B7 is cut along the first direction (Z1-Z2 direction) in a direction parallel to the cutting surface, and the fourth step is performed to obtain multiple first components including spiral portions (first spiral conductive portion 11, second spiral conductive portion 21). Specifically, as follows... Figure 76A XY plane diagram and Figure 76B XZ cross-sectional view ( Figure 76A As shown in the cross-section at line C-C', the manufactured article B7 is divided at a predetermined position. In this step, the manufactured article B7 is cut along the directions of the connecting portion 151 and the connecting portion 152, respectively. Figure 76A and Figure 76B The dashed line in the figure represents a cutting line (dividing line). By cutting, a first component, C7, is formed, comprising a body portion 30 consisting of individual coil portions 10 and a divided body material 300 covering these coil portions 10. Furthermore, the plated electrode PE2, formed across adjacent support members 700 in the X1-X2 direction, is also divided. In the component C7, the connecting portion 152 is removed without leaving any residue by cutting, but a portion of the connecting portion 151 and a portion of the support member 700 remain. On the other hand, the portion that is not part of the component C7 (e.g., ...) is also cut away by cutting. Figure 76A and Figure 76B In the second component C7A, at least one of the connecting part 151, connecting part 152 and supporting part 700 may remain.

[0476] like Figure 77A XY plane diagram Figure 77B XZ plan and Figure 77C As shown in the YZ plan view, in the manufacturing method of this embodiment, the plating electrode PE2 becomes the external electrodes 16A and 16B. Thus, the coil component 100G of this embodiment is manufactured. In this embodiment, when forming the plating electrode PE2 as the first terminal portion 41 and the second terminal portion 42, only the portion to be plating is exposed as the cut surface, thus eliminating the need for a process of providing a protective film on the portion outside the plating. Furthermore, a protective film can also be formed on the portion of the conductive component exposed from the outer surface of the coil component 100G exposed by the cut.

[0477] (Structure of solder pads)

[0478] Figure 78A and Figure 78BThis is a diagram illustrating the pad structure of this embodiment. Figure 78A The XY plan view of the pads is shown. Figure 78B The cross-section of the pads in the XZ plane is shown as a cross-sectional view.

[0479] Pad 155 can be flat in the XY plane, but if... Figure 78A and Figure 78B As shown, a recess 155c is preferably provided at approximately the center. When the pad 155 is formed by a plating process, if the central portion of the pad 155 protrudes, it will become unstable when the support member 700 is mounted onto the pad 155. In order to stably mount the support member 700 onto the pad 155, it is preferable to pre-provide a recess 155c at approximately the center of the pad 155.

[0480] Figure 79A and Figure 79B A schematic cross-sectional view showing the supporting components in their installed state is shown. Figure 79A The image shows the state of the spherical support component 700 being installed. Figure 79B The diagram shows the installation of the prism-shaped (cubic) support component 700. During installation... Figure 79A When the spherical support component 700 is shown, it is mounted by embedding the lower side of the sphere into the recess 155c of the pad 155. During installation... Figure 79B When the prism-shaped support member 700 is shown, although the support member 700 is not embedded in the recess 155c of the pad 155, the surface of the pad 155 is at least not raised, so it can be installed stably.

[0481] Figure 80A and Figure 80B This is a schematic diagram illustrating other pads 155. Figure 80A The XY plan view of the pads is shown. Figure 80B The schematic cross-sectional view shows the state in which the support component is mounted on the pad. Figure 80A and Figure 80B Although the pad 155 shown has a recess 155c slightly in the center, in XY plane perspective (viewed along the Z1-Z2 direction), a portion of it has a gap 155d (not closed). Even with this shape of pad 155, the support member 700 is embedded in the slightly central recess 155c, thereby achieving stable mounting. Furthermore, since the pad 155 is not closed, the peelability of the resist film is improved during the formation of the pad 155. In addition, even though the pad 155 is not closed, the pad 155 is reinforced by the support member 700 fixedly mounted on the pad 155.

[0482] (Electronic / Electrical Machinery)

[0483] An electronic / electrical device according to one embodiment of the present invention is an electronic / electrical device equipped with the coil components 100A to 100G described above according to one embodiment of the present invention. The coil components 100A to 100G are connected to a substrate at exposed conductive portions at each of the two ends of the coil conductive portion 20. In coil components 100A, 100B, and 100F, the first terminal portion 41 and the second terminal portion 42 correspond to the exposed conductive portions; in coil components 100C, 100D, and 100G, the first terminal portion 41, the second terminal portion 42, and the external electrodes 16A and 16b correspond to the exposed conductive portions; in coil component 100E, the lead-out exposed surfaces 140 and 240, the dummy end portions 71E and 72E, the connecting exposed surface 150, and the first exposed surface 70C correspond to the exposed conductive portions. Furthermore, when the coil components 100C, 100D, and 100G do not include the first terminal portion 41 and the second terminal portion 42, the external electrodes 16A and 16b are equivalent to exposed conductive portions. Since the electronic / electrical machine according to one embodiment of the present invention is equipped with the coil components 100A to 100G according to one embodiment of the present invention, miniaturization of the machine is also facilitated. Furthermore, even when a large current flows through the machine or a high frequency is applied, malfunctions caused by a decrease in the function of the coil components 100A to 100G or overheating are less likely to occur.

[0484] The embodiments and examples described above are provided for ease of understanding of the present invention and are not intended to limit the present invention. Therefore, the elements disclosed in the above embodiments are intended to include all design changes and equivalents that fall within the scope of the present invention.

[0485] For example, while the above description shows an example where the coil conductive portion 20 has both a first conductive portion 201 and a second conductive portion 202, it could also have a structure with only either the first conductive portion 201 or the second conductive portion 202. Furthermore, although the coil conductive portion 20 is made of a single conductive material, it is not limited to this. It could also be made of multiple materials.

[0486] The reference numerals in the attached figures are explained as follows: 100A~100G: Coil components 10: Coil section 11: First spiral conductive part (spiral part) 12, 13, 22, 23: end 14: First Introduction 15A, 15B, 15C, 15D: First connecting part 16A, 16B: External electrodes (exposed conductive parts) 17: Second recess 20: Conductive part of the coil 21: Second spiral conductive part (spiral part) 24: Second Introduction 30: Body part 30a, 30b, 30c, 30d: Outer surface 30e, 30f: Intersecting surfaces 41: First terminal section 41a, 42a: Side view 42: Second terminal section 50, 60: Outer packaging 70A: First Interface 70B: Supports exposed surfaces 70C: First exposed surface (exposing conductive parts) 70D: Second Exposed Surface 71: Second dummy conductive part 72: First dummy conductive part 71E, 72E: Dummy End Face 80: Second Insulation Section 90: First Insulation Section 91: Sheet substrate 140, 240: Lead-out portion exposed (conductive portion exposed) 150: Connector exposed (conductive part exposed) 151, 152: Connecting parts 153: Peripheral components 155, 156: solder pads 155a: Flux 155b: Adhesive 155c: Concave 155d: Gap 161: First recess 201: First conductive part 202: Second conductive part 213: Second outer peripheral side turn 300: Body material 600: Insulating coating 700: Supporting components 701A, 701B, 702A, 702B, 703A, 703B, 704A, 704B, 705A, 705B, 706A, 706B: Support Department A1, A2, A2a, A6, A7: Manufactured products B1, B2, B2a, B3, B4, B5, B6, B7: Manufactured products C1, C2, C2a, C3, C4, C5, C6, C7: Manufactured products C1A, C2A, C3A, C4A, C5A, C6A, C7A: Second component C1A', C2A': Part of the second component C: Cavity LD: Linear concave portion O: Axis P: Support substrate PE1, PE2: Coated electrodes M: Mold T: Electrode terminal VP: Through-hole section

Claims

1. A coil member comprising: a coil portion having a coil conductive portion including a spiral portion in a spiral shape when viewed in a first direction; a body portion having an outer side surface extending in the first direction and two intersecting surfaces arranged in the first direction, and covering at least a portion of the coil portion at the intersecting surfaces, and including a magnetic powder; and a support portion in contact with the coil portion and forming a first interface intersecting the first direction, characterized in that: the support portion has a support exposed surface exposed from the body portion, the support exposed surface including a first exposed surface having a surface direction in the first direction.

2. The coil member according to claim 1, wherein the support portion includes a support conductor portion having electrical conductivity, and at least a portion of the first interface is constituted by a contact interface of an electrically conductive surface of the support conductor portion and an electrically conductive surface of the coil conductive portion.

3. The coil member according to claim 2, wherein the support exposed surface includes an exposed conductive surface constituted by the support conductor portion.

4. The coil member according to claim 3, wherein the support exposed surface includes the exposed conductive surface exposed between the two intersecting surfaces arranged in the first direction.

5. The coil member according to claim 4, wherein at least a portion of the first exposed surface is constituted by the exposed conductive surface.

6. The coil member according to claim 4, wherein the support exposed surface includes a second exposed surface intersecting the first direction, at least a portion of the second exposed surface being constituted by the exposed conductive surface.

7. The coil member according to claim 6, wherein at least a portion of the first exposed surface is constituted by the exposed conductive surface.

8. The coil member according to claim 7, wherein the outer side surface is entirely insulated.

9. The coil member according to claim 8, wherein at least one of the two intersecting surfaces is insulated by an insulating layer.

10. The coil member according to claim 9, wherein the insulating layer includes a layer constituted by a resin having an average thickness of 0.10 μm to 10.0 μm.

11. The coil member according to any one of claims 4 to 10, further comprising an external electrode in contact with the exposed conductive surface.

12. The coil member according to any one of claims 4 to 10, wherein a portion of the outermost surface is constituted by the exposed conductive surface.

13. The coil member according to claim 3, wherein: the coil conductive portion includes the spiral portion and a lead-out portion continuously connected to the spiral portion in a direction perpendicular to the first direction, the lead-out portion has a lead-out portion exposed surface exposed from the outer side surface of the body portion, and at least a portion of the first interface is constituted by a contact interface of an electrically conductive surface of the lead-out portion and an electrically conductive surface of the support conductor portion.

14. The coil member according to claim 3, wherein the support portion is in contact with an electrically conductive surface of the coil conductive portion in a tapered manner.

15. The coil member according to claim 13, wherein the lead-out portion exposed surface extends in a direction perpendicular to the first direction.

16. The coil member according to claim 3, wherein in the body portion, two faces parallel to the first direction are connected via the support portion.

17. The coil member according to claim 3, wherein: the outer side face includes a plurality of faces, two adjacent faces of the plurality of faces are connected by a connecting portion, and the support portion is exposed from the body portion on at least a portion of the connecting portion.

18. The coil member according to claim 4, wherein: the body portion has a first recessed portion recessed toward the first direction at least one of two faces arranged in the first direction, and at least a portion of the exposed conductive face is located on a recessed face of the first recessed portion.

19. The coil member according to claim 2, wherein: the coil portion has a second recessed portion recessed toward the first direction, and at least a portion of the first interface is constituted by at least a portion of a recessed face of an opening edge and an inner face of the second recessed portion constituting a contact interface of the support portion.

20. The coil member according to claim 19, wherein: the support portion includes a support conductor portion having conductivity, and at least a portion of the first interface is constituted by a contact interface of a conductive surface of at least a portion of the recessed face and a conductive surface of the support conductor portion.

21. The coil member according to claim 1, wherein: the support portion has a support soft magnetic portion, at least a portion of the first interface is constituted by a contact interface of the support soft magnetic portion and the coil portion, and a relative permeability of the support soft magnetic portion in the first direction is greater than a relative permeability of the body portion in the first direction.

22. The coil member according to claim 21, wherein in the body portion, two faces parallel to the first direction are connected via the support portion.

23. The coil member according to claim 21, wherein: the outer side face has a plurality of faces, two adjacent faces of the plurality of faces are connected by a connecting portion, and the support portion is exposed from the body portion on at least a portion of the connecting portion.

24. The coil member according to claim 21, wherein: the body portion includes a cuboid shape having edges parallel to the first direction, and the support portion is arranged to include at least one of end portions of four edges of the body portion parallel to the first direction.

25. The coil member according to claim 21, wherein the support soft magnetic portion is an insulator.

26. The coil member according to claim 21, wherein a relative permeability of the support soft magnetic portion in the first direction is greater than a relative permeability of the body portion in the first direction.

27. A manufacturing method of a coil member, comprising: a first step of forming a conductor pattern including a plurality of spiral portions having a spiral shape when viewed in a first direction and a connecting portion connecting the plurality of spiral portions; a second step of forming a support member extending in the first direction from the connecting portion after the first step; a third step of supplying a material including a magnetic powder to cover the conductor pattern of at least two faces in the first direction and forming a sheet; and ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ a fourth step of cutting the board in the first direction parallel to the cut surface to separate the board into a plurality of first parts including the spiral portion and a second part obtained by cutting out the first part from the board, wherein in the fourth step, the second part includes all or a part of the support portion.

28. The method of manufacturing a coil component according to claim 27, wherein the first step includes providing an insulating portion on a surface of the conductor pattern after the conductor pattern is formed.

29. The method of manufacturing a coil component according to claim 27, wherein the second step includes providing an insulating portion on a surface of the conductor pattern and a surface of the support portion after the support portion is formed.

30. The method of manufacturing a coil component according to claim 27, wherein the first part separated in the fourth step includes a part of the support portion.

31. The method for manufacturing a coil member according to Claim 27, wherein in the fourth step: before separating the first part from the second part, performing a half cut on a portion of the board in which the support portion is disposed in the first direction to form a linear recess in which the support portion is exposed on a bottom surface and extends in a second direction perpendicular to the first direction, and cutting the board in such a manner that a separation line of the first part from the second part passes through the bottom surface of the linear recess to form a step portion on the first part in which the support portion is exposed under a step.

32. The method of manufacturing a coil component according to Claim 27, wherein the fourth step includes: after removing a part of the connecting portion or a part of the support portion to expose the conductive surface and forming an electrode electrically connected to the conductive surface, separating the first part from the second part.

33. The method of manufacturing a coil component according to claim 27, wherein in the fourth step, the second part includes all of the support portion.

34. The method of manufacturing a coil component according to claim 27, wherein: in the fourth step, the first part includes a part of the support portion, and the support portion is exposed on a surface of the first part.

35. The method of manufacturing a coil component according to claim 27, further comprising a fifth step of forming an external electrode on a conductive surface of the first part.

36. An electronic / electrical device provided with the coil component according to claim 1, wherein the coil component is provided with a terminal portion at each of two end portions of the coil conductive portion, at an outwardly exposed exposed conductive portion, respectively, and connected to a substrate.

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