Modular intelligent current probe structure with temperature compensation function and application thereof

Abstract

The invention relates to the technical field of current sensing and testing, in particular to a modular intelligent current probe structure with a temperature compensation function and application thereof, the modular intelligent current probe structure comprises a base, a plurality of current sensing mechanisms are arranged on the top surface of the base, and each current sensing mechanism comprises a probe seat, a main body probe and a sampling probe which are sequentially arranged from outside to inside. According to the modularized intelligent current probe structure with the temperature compensation function and the application thereof, when refrigerant fluid directly and actively dissipates heat for a main body probe and a sampling probe, hydraulic force drives a piston to press downwards, and the hydraulic force is transmitted to a third spring through an outward extending sliding block and a movable ring, so that elastic potential energy of the third spring is converted into additional contact pressure for a movable bottom probe, and the temperature compensation function is realized. And the contact resistance between the movable bottom needle and the test point is reduced by enhancing the contact pressure, the temperature drift is counteracted on a mechanical and electrical coupling layer, and the accuracy and long-term stability of signal acquisition of the current sensing mechanism in a high-temperature environment are ensured through two compensation modes.

Description

Technical Field

[0001] This invention relates to the field of current sensing and testing technology, and more specifically, to a modular intelligent current probe structure with temperature compensation function and its application. Background Technology

[0002] This current probe is a contact-type, sampling resistor-based precision measurement tool. Its classic structure includes a gold-plated metal probe tip, a spring, and a plastic insulating base. The core principle is to allow the current to be measured to flow through its internally integrated precision sampling resistor, converting the current signal into a precise voltage signal according to Ohm's law, which is then read by devices such as oscilloscopes. It is widely used in circuit board debugging, in-circuit testing, and power analysis, and is an ideal choice for directly measuring component pin currents and performing accurate power analysis.

[0003] Patent application number CN202223422584.0 discloses a DCR high-current probe module replacement device, including a substrate with a strip-shaped probe mounting groove in the middle; several telescopic elastic stop pins arranged side by side at the bottom of the substrate; several transition plates with a locking hole on the side and two parallel V-shaped grooves on the top, which are locked to the bottom of the substrate through the locking hole and the telescopic elastic stop pins; several set screws passing through the side of the substrate and abutting against the transition plates; and several positioning beads arranged side by side at the bottom of the substrate, the size and position of which match the V-shaped grooves.

[0004] However, existing current probes have insufficient heat dissipation capacity when dealing with high-temperature conditions, relying mostly on passive heat dissipation or simple air cooling. This cannot effectively suppress the overall temperature rise of the probe caused by high current or high-temperature environments, leading to drift in the characteristics of internal sampling elements and creating basic measurement errors. Secondly, there is a lack of active, physical compensation mechanisms, which cannot compensate for the mechanical stress relaxation and increased contact resistance caused by temperature. This causes the contact pressure between the probe tip and the test point to decrease as the temperature rises, and the contact resistance increases accordingly, further aggravating heat generation and introducing additional measurement errors, forming a vicious cycle.

[0005] In view of this, we propose a modular smart current probe structure with temperature compensation and its application. Summary of the Invention

[0006] The purpose of this invention is to provide a modular intelligent current probe structure with temperature compensation function and its application. By using two compensation methods, namely active cooling by coolant and enhanced contact pressure, the accuracy and long-term stability of signal acquisition by the current sensing mechanism in high-temperature environments are ensured, thereby solving the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: A modular intelligent current probe structure with temperature compensation function includes a base, on the top surface of which are provided several current sensing mechanisms. The current sensing mechanism includes a probe holder, a main probe and a sampling probe arranged sequentially from the outside to the inside. The probe holder includes a sleeve and a piston disposed inside the sleeve, and the sleeve is provided with a liquid storage jacket for the piston to slide. This feature allows the refrigerant to be injected into the liquid storage jacket through a pipe, which in turn squeezes the piston, causing it to move downwards. The sampling probe includes a top pin, a movable bottom pin that slides at the bottom of the top pin, a movable ring that slides on the outside of the top pin, a third spring disposed between the movable bottom pin and the movable ring, and an extended slider disposed on the outer walls of both sides of the movable ring. This setting allows the piston to move downwards and, by contacting the extended slider, drive the movable ring to compress the third spring, increasing the pressure between the movable bottom pin and the test point.

[0008] In the technical solution of the present invention, the base includes a base plate, two parallel liquid-passing pipes arranged on the top surface of the base plate, a number of branch pipes arranged on the top surface of the liquid-passing pipes, and clamps that are snapped and fixed to the top surface of the base plate for fixing the liquid-passing pipes. The ends of the liquid-passing pipes on the left and right sides are respectively connected to the liquid inlet and liquid outlet of the micro water pump.

[0009] This setup establishes a centralized, independently circulating cooling system framework, providing a foundation for the synchronous and efficient heat dissipation and coordinated temperature management of multiple current sensing mechanism modules.

[0010] In the technical solution of the present invention, the sleeve is fixedly connected to the top surface of the base plate by screws. The inner walls of the front and rear sides of the sleeve are provided with through grooves that communicate with the liquid storage jacket. The transverse cross-sectional dimensions of the upper and lower annular grooves of the liquid storage jacket are different, with the transverse cross-sectional dimension of the upper annular groove being smaller than that of the lower annular groove.

[0011] In the technical solution of the present invention, the probe holder further includes a drain port and a liquid inlet integrally formed on the outer walls of the left and right sides of the sleeve, and a second spring sleeved on the outside of the piston. The bottom end of the piston is integrally formed with an outwardly protruding annular structure.

[0012] In the technical solution of the present invention, the upper and lower ends of the second spring respectively abut against the piston and the bottom surface of the inner wall of the liquid storage jacket. When the second spring is in its natural state, the top of the piston seals the inner opening of the drain port, and the bottom surface of the integrally formed convex annular structure of the bottom end of the liquid storage jacket is located above the through groove.

[0013] The above settings enable precise conversion and automatic reset of hydraulic pressure into mechanical displacement, providing a stable and reliable driving force for subsequent mechanical compensation actions.

[0014] In the technical solution of the present invention, the main probe is fixedly connected to the inside of the sleeve by bolts, and a storage slot for placing the sampling probe is opened inside the main probe. A heat dissipation hole communicating with the storage slot is opened on the outer wall of the main probe at the corresponding position of the through slot.

[0015] In the technical solution of the present invention, a first spring is sleeved on the outer side of the main probe, and the upper and lower ends of the first spring abut against the bottom end of the main probe and the inner top surface of the sleeve, respectively. A conductive wire clamp is also fixedly connected to the top end of the main probe by bolts.

[0016] The above configuration constitutes the load-bearing and signal transmission center of the current sensing mechanism, ensuring stable grounding and signal output, while also providing space for the internal compensation mechanism and a heat dissipation path.

[0017] In the technical solution of the present invention, the ejector pin is snapped and fixed inside the storage groove, the movable bottom pin and the movable ring are slidably connected to the outside of the ejector pin, the front and rear sides of the movable ring are provided with storage holes, the outer wall of the ejector pin is provided with an annular structure to restrict the upward movement of the movable ring, and the elastic force provided by the third spring pushes the movable bottom pin to move downward.

[0018] In the technical solution of the present invention, the extended slider is slidably connected to the inside of the receiving hole, the end of the extended slider extends through the heat dissipation hole to the inside of the through groove, and a fourth spring is adhered between the inner end of the extended slider and the hole wall of the receiving hole.

[0019] The above setup constitutes the core mechanical compensation execution unit, which transforms the drive into precise pressure regulation, directly acting on the test point to optimize and stabilize the contact resistance.

[0020] On the other hand, the present invention also provides an application of a modular intelligent current probe with temperature compensation function in high-frequency current sensing and current testing.

[0021] Compared with the prior art, the beneficial effects of the present invention are: 1. The modular intelligent current probe structure with temperature compensation function and its application: When the coolant directly and actively dissipates heat to the main probe and sampling probe, the liquid pressure drives the piston to press down. Through the extended slider and the movable ring, the liquid pressure is transmitted to the third spring, so that its elastic potential energy is converted into additional contact pressure on the movable base needle. By increasing the contact pressure, the contact resistance between the movable base needle and the test point is reduced, and temperature drift is offset at the mechanical and electrical coupling level. Through these two compensation methods, the accuracy and long-term stability of the current sensing mechanism in high-temperature environments are ensured.

[0022] 2. The modular intelligent current probe structure with temperature compensation function and its application: the function is transmitted between various mechanical components through linkage design. The piston achieves precise displacement and automatic reset under the cooperation of hydraulic pressure and the second spring. The movable base needle and movable ring form a pressure adaptive mechanism under the constraint of the third spring and the extended slider. This not only ensures the execution of the temperature compensation process and automatic reset, but also compensates for mechanical wear and contact changes caused by long-term use or environmental fluctuations through the adaptability of the mechanical structure, thereby improving the long-term reliability and lifespan of the entire probe system under complex working conditions. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the base structure in this invention; Figure 3 This is one of the structural schematic diagrams of the current sensing mechanism in this invention; Figure 4 This is the second schematic diagram of the current sensing mechanism in this invention; Figure 5 This is a cross-sectional test diagram of the current sensing mechanism in this invention; Figure 6 This is a cross-sectional schematic diagram of the probe holder structure in this invention; Figure 7 This is a cross-sectional schematic diagram of the sleeve structure in this invention; Figure 8 This is a partial structural diagram of the present invention; Figure 9 This is a cross-sectional schematic diagram of a portion of the structure in this invention; Figure 10 This is a cross-sectional schematic diagram of the main probe structure in this invention; Figure 11 This is a schematic diagram showing the structural breakdown of the sampling probe in this invention; Explanation of reference numerals in the attached figures: 100. Base; 110. Base plate; 120. Liquid inlet pipe; 130. Branch pipe; 140. Clamp; 200. Current sensing mechanism; 210. Probe holder; 211. Sleeve; 2110. Liquid storage jacket; 2111. Through groove; 212. Liquid inlet; 213. Liquid outlet; 214. Piston; 215. Second spring; 220. Main probe; 221. Storage tank; 222. Heat dissipation hole; 240. First spring; 250. Conductive clamp; 230. Sampling probe; 231. Top pin; 232. Movable bottom pin; 233. Movable ring; 2330. Storage hole; 234. Third spring; 235. Extending slider; 236. Fourth spring. Detailed Implementation

[0024] The technical solutions of this invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0025] Please see Figures 1-2 As shown, this embodiment provides the following technical solution: A modular intelligent current probe structure with temperature compensation function is used in high-frequency current sensing and current testing, including a base 100, on the top surface of which are provided several current sensing mechanisms 200. Specifically, the base 100 includes a base plate 110, two parallel liquid-conducting pipes 120 arranged on the top surface of the base plate 110, several branch pipes 130 arranged on the top surface of the liquid-conducting pipes 120, and clamps 140 snapped and fixed to the top surface of the base plate 110 for fixing the liquid-conducting pipes 120. The ends of the liquid-conducting pipes 120 on the left and right sides are respectively connected to the liquid inlet and liquid outlet of the micro water pump.

[0026] Furthermore, the base plate 110 serves as an installation platform for fixing the liquid-passing pipes 120 and the current sensing mechanisms 200. The two liquid-passing pipes 120 form the main cooling circuit, responsible for supplying refrigerant within the system. The branch pipes 130 distribute the refrigerant from the main cooling circuit to each independent current sensing mechanism 200. The clamps 140 are used to fix the liquid-passing pipes, ensuring their stability during operation. In use, when the temperature sensor integrated within the detection module detects that the temperature exceeds the preset threshold due to a large current or environmental factors, the control system immediately activates the external micro water pump, allowing the refrigerant to flow through the two liquid-passing pipes 120 and form a circulating cooling circuit in multiple independent current sensing mechanisms 200. This setup constructs a centralized liquid supply and independent circulation cooling system framework, providing a foundation for the synchronous and efficient heat dissipation and coordinated temperature management of multiple current sensing mechanism 200 modules.

[0027] Please see Figures 3-7 As shown, in this embodiment, the current sensing mechanism 200 includes a probe holder 210, a main probe 220, and a sampling probe 230 arranged sequentially from the outside to the inside.

[0028] Specifically, the probe holder 210 includes a sleeve 211 and a piston 214 disposed inside the sleeve 211. The sleeve 211 has a liquid storage jacket 2110 for the piston 214 to slide inside. After the refrigerant is injected into the liquid storage jacket 2110 through the pipeline, it will squeeze the piston 214 and drive the piston 214 to move down.

[0029] Furthermore, the sleeve 211 is fixedly connected to the top surface of the base plate 110 by screws. The inner walls of the front and rear sides of the sleeve 211 are provided with through grooves 2111 that communicate with the liquid storage jacket 2110. The transverse cross-sectional dimensions of the upper and lower annular grooves of the liquid storage jacket 2110 are different, with the transverse cross-sectional dimension of the upper annular groove being smaller than that of the lower annular groove.

[0030] Furthermore, the probe holder 210 also includes a drain port 213 and a liquid inlet 212 integrally formed on the outer walls of the left and right sides of the sleeve 211, as well as a second spring 215 sleeved on the outside of the piston 214. The bottom end of the piston 214 is integrally formed with an outwardly protruding annular structure.

[0031] Furthermore, the upper and lower ends of the second spring 215 abut against the piston 214 and the bottom surface of the inner wall of the liquid storage jacket 2110, respectively. When the second spring 215 is in its natural state, the top of the piston 214 seals the inner opening of the drain port 213, and the bottom surface of the integrally formed outwardly convex annular structure of the bottom end of the liquid storage jacket 2110 is located above the through groove 2111.

[0032] Furthermore, the sleeve 211 is used to form the main structure of the probe holder 210. The liquid storage jacket 2110 inside it is used to store the refrigerant and transmit the liquid pressure to the piston 214. The through groove 2111 provides a movement channel for the linkage components in the sampling probe 230. As the refrigerant is continuously injected into the liquid storage jacket 2110, its hydraulic pressure pushes the piston 214 down, compressing the second spring 215, so that the piston 214 moves down to the opening below the drain port 213. After the hydraulic pressure is released, the second spring 215 provides the elastic force to reset the piston 214. This setting realizes the precise conversion of hydraulic pressure to mechanical displacement and automatic reset, providing a stable and reliable driving force for subsequent mechanical compensation actions.

[0033] Please see Figures 5-10 As shown, in this embodiment, the main probe 220 is fixedly connected to the inside of the sleeve 211 by bolts. The inside of the main probe 220 is provided with a storage slot 221 for placing the sampling probe 230. The outer wall of the main probe 220 is provided with a heat dissipation hole 222 at the corresponding position of the through slot 2111, which is connected to the storage slot 221.

[0034] Specifically, a first spring 240 is sleeved on the outside of the main probe 220. The upper and lower ends of the first spring 240 abut against the bottom end of the main probe 220 and the inner top surface of the sleeve 211, respectively. A conductive wire clamp 250 is also fixedly connected to the top of the main probe 220 by bolts.

[0035] Furthermore, the main body probe 220 carries the core sampling probe 230 and is responsible for signal transmission. Its internal storage slot 221 is used to accurately install the sampling probe 230, and the heat dissipation hole 222 is used to improve heat dissipation efficiency and provide a channel for mechanical linkage. The first spring 240 provides grounding pressure between the main body probe 220 and the test board, and the conductive clamp 250 stably outputs the measurement signal to the external device. This setting constitutes the load-bearing and signal transmission center of the current sensing mechanism 200, which not only ensures stable grounding and signal output, but also provides activity space and heat dissipation path for the internal compensation mechanism.

[0036] Please see Figure 11 As shown, in this embodiment, the sampling probe 230 includes a top pin 231, a movable bottom pin 232 sliding at the bottom of the top pin 231, a movable ring 233 sliding on the outside of the top pin 231, a third spring 234 disposed between the movable bottom pin 232 and the movable ring 233, and an extended slider 235 disposed on the outer walls of both sides of the movable ring 233. After the piston 214 moves down, it abuts against the extended slider 235, causing the movable ring 233 to squeeze the third spring 234, thereby increasing the pressure between the movable bottom pin 232 and the test point.

[0037] Specifically, the ejector pin 231 is snapped and fixed inside the storage slot 221, the movable bottom pin 232 and the movable ring 233 are slidably connected to the outside of the ejector pin 231, the movable ring 233 has storage holes 2330 on both the front and rear sides, the outer wall of the ejector pin 231 has an annular structure that restricts the upward movement of the movable ring 233, and the elastic force provided by the third spring 234 pushes the movable bottom pin 232 downward.

[0038] Furthermore, the extended slider 235 is slidably connected to the inside of the receiving hole 2330, and the end of the extended slider 235 extends through the heat dissipation hole 222 into the inside of the through groove 2111. A fourth spring 236 is adhered between the inner end of the extended slider 235 and the hole wall of the receiving hole 2330.

[0039] Furthermore, the ejector pin 231 serves as the static reference and signal transmission axis of the sampling probe 230, while the movable base pin 232 directly contacts the test point. Its pressure can be dynamically adjusted to change the contact resistance. The downward-moving piston 214 presses the extended sliders 235 on both sides of the sampling probe 230, driving the movable ring 233 to move down and compress the third spring 234. The elastic potential energy accumulated by the spring is converted into additional pressure on the movable base pin 232, thereby enhancing the contact pressure between its bottom end and the test point of the circuit board under test. This reduces the contact resistance and suppresses the thermoelectric effect, achieving secondary temperature compensation at the mechanical and electrical coupling level, ensuring the accuracy and stability of the detection signal. This setting constitutes the core mechanical compensation execution unit, transforming the drive into precise pressure control, which directly acts on the test point to optimize and stabilize the contact resistance.

[0040] When the modular intelligent current probe structure with temperature compensation function of the present invention is in use, when the temperature sensor integrated in the detection module detects that the temperature exceeds the preset threshold due to the passage of large current or environmental factors, the control system immediately turns on the external micro water pump to pump the refrigerant from the right liquid pipe 120 through the branch pipe 130 into the liquid inlet 212 of the sleeve 211. As refrigerant is continuously injected into the liquid storage jacket 2110, its hydraulic pressure pushes the piston 214 downward, compressing the second spring 215, causing the piston 214 to move down to the opening below the drain port 213. The refrigerant flows back to the left liquid pipe 120 through the drain port 213 and returns to the water pump inlet, forming a circulating cooling circuit. This provides active heat dissipation for the main probe 220 and the internal sampling probe 230, achieving preliminary temperature compensation for the current sensing mechanism 200. At the same time, the downward-moving piston 214 presses the extended sliders 235 on both sides of the sampling probe 230, driving the movable ring 233 to move down and compress the third spring 234. The elastic potential energy accumulated by the spring is converted into additional pressure on the movable bottom pin 232, thereby increasing the contact pressure between its bottom end and the test point of the circuit board under test. In this way, secondary temperature compensation is achieved at the mechanical and electrical coupling level by reducing contact resistance and suppressing thermoelectric effect, ensuring the accuracy and stability of the detection signal. When the test is completed or the temperature returns to normal, the micro water pump is turned off, the second spring 215 and the third spring 234 release their stored energy, and drive the piston 214 and the moving ring 233 to reset respectively, and the system returns to the initial standby state.

[0041] The foregoing description of specific exemplary embodiments of the invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the invention to the precise forms disclosed, and it will be apparent that many changes and variations can be made in accordance with the foregoing teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the invention, as well as various different choices and variations. The scope of the invention is intended to be defined by the specification and its equivalents.

Claims

1. A modular intelligent current probe structure with temperature compensation function, characterized in that: It includes a base, and its top surface is provided with several current sensing mechanisms. The current sensing mechanism includes a probe holder, a main probe and a sampling probe arranged sequentially from the outside to the inside. The probe holder includes a sleeve and a piston disposed inside the sleeve. The sleeve is provided with a liquid storage jacket for the piston to slide. After the refrigerant is injected into the liquid storage jacket through the pipe, it will squeeze the piston and drive the piston to move downward. The sampling probe includes a top pin, a movable bottom pin that slides at the bottom of the top pin, a movable ring that slides on the outside of the top pin, a third spring that is disposed between the movable bottom pin and the movable ring, and an extended slider disposed on both sides of the outer wall of the movable ring. After the piston moves down, it drives the movable ring to squeeze the third spring by abutting against the extended slider, thereby increasing the pressure between the movable bottom pin and the test point.

2. The modular intelligent current probe structure with temperature compensation function according to claim 1, characterized in that: The base includes a base plate, two parallel liquid-passing pipes arranged on the top surface of the base plate, several branch pipes arranged on the top surface of the liquid-passing pipes, and clamps that are snapped and fixed to the top surface of the base plate for fixing the liquid-passing pipes. The ends of the liquid-passing pipes on the left and right sides are respectively connected to the liquid inlet and liquid outlet of the micro water pump.

3. The modular intelligent current probe structure with temperature compensation function according to claim 2, characterized in that: The sleeve is fixed to the top surface of the base plate by screws. The inner walls of the front and rear sides of the sleeve are provided with through grooves that communicate with the liquid storage jacket. The transverse cross-sectional dimensions of the upper and lower annular grooves of the liquid storage jacket are different, with the transverse cross-sectional dimension of the upper annular groove being smaller than that of the lower annular groove.

4. The modular intelligent current probe structure with temperature compensation function according to claim 3, characterized in that: The probe holder also includes a drain port and a liquid inlet integrally formed on the outer walls of the left and right sides of the sleeve, as well as a second spring sleeved on the outside of the piston. The bottom end of the piston is integrally formed with an outwardly protruding annular structure.

5. The modular intelligent current probe structure with temperature compensation function according to claim 4, characterized in that: The upper and lower ends of the second spring abut against the piston and the bottom surface of the inner wall of the liquid storage jacket, respectively. When the second spring is in its natural state, the top of the piston seals the inner opening of the drain port, and the bottom surface of the integrally formed outward convex annular structure of the liquid storage jacket is located above the through groove.

6. The modular intelligent current probe structure with temperature compensation function according to claim 5, characterized in that: The main probe is fixedly connected to the inside of the sleeve by bolts. The inside of the main probe is provided with a storage slot for placing the sampling probe. The outer wall of the main probe is provided with a heat dissipation hole connected to the storage slot at the corresponding position of the through slot.

7. The modular intelligent current probe structure with temperature compensation function according to claim 6, characterized in that: A first spring is sleeved on the outside of the main probe. The upper and lower ends of the first spring abut against the bottom end of the main probe and the inner top surface of the sleeve, respectively. A conductive wire clamp is also fixedly connected to the top end of the main probe by bolts.

8. The modular intelligent current probe structure with temperature compensation function according to claim 7, characterized in that: The ejector pin is snapped and fixed inside the storage slot. The movable bottom pin and the movable ring are slidably connected to the outside of the ejector pin. The movable ring has storage holes on both the front and rear sides. The outer wall of the ejector pin has an annular structure that restricts the upward movement of the movable ring. The elastic force provided by the third spring pushes the movable bottom pin downward.

9. The modular intelligent current probe structure with temperature compensation function according to claim 8, characterized in that: The extended slider is slidably connected to the inside of the receiving hole. The end of the extended slider extends through the heat dissipation hole into the inside of the through groove. A fourth spring is adhered between the inner end of the extended slider and the hole wall of the receiving hole.

10. An application of a modular intelligent current probe with temperature compensation function, wherein the modular intelligent current probe structure with temperature compensation function according to claim 9 is characterized in that: Applications in high-frequency current sensing and current testing.

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