Substrate transfer robot and method for controlling substrate transfer robot

Abstract

This substrate transfer robot (100) is provided with: contact sensors (41, 42, 43) that detect the contact state of a substrate or a detection jig with a substrate holding hand during a transfer operation of the substrate or the detection jig with respect to a substrate placement unit; an inclination adjustment mechanism (30) that adjusts the inclination of the substrate holding hand; and a control unit (50) that adjusts the relative inclination between the substrate mounting unit and the substrate holding hand by operating the inclination adjustment mechanism (30) on the basis of detection signals from the contact sensors (41, 42, 43).

Description

Technical Field

[0001] This disclosure relates to a substrate handling robot and a control method for the substrate handling robot. Background Technology

[0002] Previously, robots for handling substrates were known. For example, Japanese Patent Application Publication No. 2003-170382 describes a robot for handling substrates, which includes a substrate holding section and a robotic arm. The substrate holding section holds the substrate. The robotic arm supports the substrate holding section and moves the substrate holding section in a horizontal plane. Furthermore, the robot for handling substrates described in Japanese Patent Application Publication No. 2003-170382 includes a contact sensor for detecting the substrate holding status.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2003-170382

[0004] However, when handling substrates using a substrate handling robot as described in Japanese Patent Application Publication No. 2003-170382, a deviation in the tilt angle between the substrate holding hand (the substrate holding part) and the substrate mounting part sometimes occurs. In this case, due to the tilt deviation between the substrate holding hand and the substrate mounting part, the substrate handling operation may not be performed properly, resulting in unnecessary force or vibration being applied to the substrate. During substrate handling, when force or vibration is applied to the substrate, foreign objects may adhere to the substrate surface. Such foreign objects can cause abnormalities in the circuits formed on the substrate. Furthermore, if the substrate handling operation is not performed properly, the substrate may shift position after handling. Therefore, it is desirable to perform the substrate handling operation properly. Summary of the Invention

[0005] This disclosure was made to solve the above-mentioned problems. One object of this disclosure is to provide a substrate handling robot and a control method for the substrate handling robot that can properly perform substrate handling operations.

[0006] The substrate handling robot according to the first aspect of this disclosure includes: a substrate holding hand; a detection fixture that holds a substrate or emulates a substrate; a contact sensor that detects the contact state between the substrate or detection fixture and the substrate holding hand during a handling operation of the substrate or detection fixture relative to the substrate mounting portion; a tilt adjustment mechanism that adjusts the tilt of the substrate holding hand; and a control unit that, based on a detection signal from the contact sensor, activates the tilt adjustment mechanism to adjust the relative tilt of the substrate mounting portion and the substrate holding hand.

[0007] As described above, the substrate handling robot according to the first aspect of this disclosure includes a control unit that activates a tilt adjustment mechanism based on a detection signal from a contact sensor, thereby adjusting the relative tilt of the substrate mounting section and the substrate holding hand. Therefore, by activating the tilt adjustment mechanism based on the detection signal from the contact sensor, deviations in tilt between the substrate holding hand and the substrate mounting section can be suppressed. Consequently, situations where substrate handling becomes inappropriate due to tilt deviations between the substrate holding hand and the substrate mounting section can be prevented. As a result, substrate handling can be performed appropriately.

[0008] The control method for the substrate handling robot according to the second aspect of this disclosure detects the contact state between the substrate holding hand and the substrate or the inspection fixture during the handling operation of the substrate or the inspection fixture relative to the substrate mounting part, and based on the detection signal that detects the contact state between the substrate holding hand and the substrate or the inspection fixture, activates the tilt adjustment mechanism that adjusts the tilt of the substrate holding hand, thereby adjusting the relative tilt of the substrate mounting part and the substrate holding hand.

[0009] As described above, the control method for a substrate handling robot according to the second aspect of this disclosure is based on a detection signal that detects the contact state between the substrate holding hand and the substrate or inspection fixture, thereby activating a tilt adjustment mechanism that adjusts the tilt of the substrate holding hand, and adjusting the relative tilt of the substrate mounting portion and the substrate holding hand. Therefore, by activating the tilt adjustment mechanism based on the detection signal that detects the contact state, deviations in tilt between the substrate holding hand and the substrate mounting portion can be suppressed. Thus, situations where substrate handling becomes inappropriate due to deviations in tilt between the substrate holding hand and the substrate mounting portion can be suppressed. As a result, a control method for a substrate handling robot capable of properly performing substrate handling operations can be provided.

[0010] According to this disclosure, substrate handling operations can be performed appropriately. Attached Figure Description

[0011] Figure 1 This is a perspective view showing the overall structure of the substrate handling robot according to the first embodiment.

[0012] Figure 2 This is a perspective view showing the tilting mechanism involved in the first embodiment.

[0013] Figure 3 This is a cross-sectional view of the tilting mechanism along the vertical direction.

[0014] Figure 4 This is a perspective view illustrating the configuration of the contact sensor held in the hand by the substrate.

[0015] Figure 5 This is a block diagram representing the control structure of a substrate handling robot.

[0016] Figure 6 This is a diagram illustrating the adjustment of tilt during handling operations.

[0017] Figure 7 This is a flowchart illustrating the control method of the substrate handling robot according to the first embodiment.

[0018] Figure 8 This is a perspective view showing the overall structure of the substrate handling robot according to the second embodiment.

[0019] Figure 9 This is a perspective view illustrating the configuration of the contact sensors in the testing fixture.

[0020] Figure 10 This is a top view used to illustrate the configuration of the contact sensor in the substrate mounting portion involved in the first modified example.

[0021] Figure 11 This is a perspective view used to illustrate the substrate holding hand involved in the second modified example.

[0022] Figure 12 This is a perspective view used to illustrate the substrate holding hand involved in the third modified example. Detailed Implementation

[0023] [First Implementation]

[0024] Hereinafter, a first embodiment of the present disclosure, which is embodied in the accompanying drawings, will be described.

[0025] Reference Figures 1 to 6 The structure of the substrate handling robot 100 according to the first embodiment will be described below. Hereinafter, the two directions that are approximately orthogonal to each other in the horizontal plane will be designated as the X direction and the Y direction, respectively. In addition, the vertical direction that is approximately orthogonal to the horizontal plane (XY plane) will be designated as the Z direction.

[0026] (Structure of the substrate handling robot)

[0027] like Figure 1As shown, a substrate handling robot 100 is disposed in a heat treatment apparatus 101. Within the heat treatment apparatus 101, the substrate handling robot 100 performs substrate handling operations between a FOUP 102 (Front Opening Unified Pod) and a substrate mounting section 103. The handling operations performed by the substrate handling robot 100 include both the action of moving the substrate W disposed on the FOUP 102 relative to the substrate mounting section 103, and the action of removing the substrate W from the substrate mounting section 103 relative to the FOUP 102. That is, the handling operations performed by the substrate handling robot 100 include the action of placing the substrate W on the substrate mounting section 103, and the action of picking up the substrate W placed on the substrate mounting section 103.

[0028] FOUP102 is a substrate storage container for holding multiple substrates W. A substrate mounting section 103 is disposed in a heat treatment apparatus 101 and holds multiple substrates W. In the heat treatment apparatus 101, the multiple substrates W placed in the substrate mounting section 103 are heat-treated. The substrate mounting section 103 has columnar holding members 103a that hold the multiple substrates W in a vertical direction, i.e., the Z-direction. Three holding members 103a are disposed in the substrate mounting section 103 extending along the Z-direction. The peripheral portions of each of the multiple substrates W are held by each of the multiple claws of the holding members 103a, thereby arranging the multiple substrates W in the substrate mounting section 103 with their main surfaces facing each other along the Z-direction. The substrate W is a semiconductor wafer having a circular plate shape. The substrate W is formed, for example, from silicon, germanium, or quartz glass.

[0029] The substrate handling robot 100 includes a substrate holding hand 10, a drive mechanism 20, and a control unit 50. The drive mechanism 20 includes a fork tooth holding part 21, a horizontal movement mechanism 22, a rotation mechanism 23, a mounting part 24, and a lifting mechanism 25. Furthermore, in the substrate handling robot 100 according to the first embodiment, a tilting mechanism 30 is disposed in the drive mechanism 20. The tilting mechanism 30 is an example of a tilt adjustment mechanism.

[0030] The substrate holder 10 has a plurality of fork-shaped tooth members 11 with their ends divided into two parts. The substrate holder 10 holds the substrate W by means of the plurality of fork-shaped tooth members 11. In the substrate holder 10, five fork-shaped tooth members 11 are arranged in a vertical direction, i.e., the Z direction. Each of the five fork-shaped tooth members 11 holds a substrate W. The substrate holder 10 is a passive holding mechanism that holds the substrate W by placing the substrate W on the upper side of the Z direction of the plate-shaped fork-shaped tooth members 11. The substrate holder 10 is moved by the action of the drive mechanism 20.

[0031] The base ends of multiple fork tooth components 11, opposite to the two-part end portions, are connected to the fork tooth holding portion 21. The horizontal movement mechanism 22 has a support body 22a extending in the horizontal direction. The fork tooth holding portion 21 is mounted on the support body 22a of the horizontal movement mechanism 22 and moves horizontally relative to the support body 22a. The horizontal movement mechanism 22 moves the substrate holding hand 10 together with the fork tooth holding portion 21 in the horizontal direction. Furthermore, the horizontal movement mechanism 22 alternates between: moving all five fork tooth components 11 of the substrate holding hand 10 horizontally as a whole, and moving the lowermost fork tooth component among the five fork tooth components 11 horizontally. The rotation mechanism 23 has a rotating shaft portion 23a extending in the Z direction. The support body 22a is mounted on the rotating shaft portion 23a. The rotation mechanism 23 rotates the substrate holding hand 10 together with the support body 22a and the fork tooth holding portion 21 about the rotating shaft portion 23a in a rotational direction about the Z direction. The rotating shaft 23a is rotated by the motor 23b, which will be described later.

[0032] The tilting mechanism 30 adjusts the tilt angle of the substrate holder 10. The tilting mechanism 30 is disposed between the support body 22a and the mounting portion 24. The tilting mechanism 30 tilts the substrate holder 10 by changing the tilt angle of the support body 22a, the fork tooth retaining portion 21, and the substrate holder 10 relative to the mounting portion 24. That is, the tilting mechanism 30 changes the tilt angle of the substrate holder 10 by changing the tilt angle of the support body 22a and the fork tooth retaining portion 21. Additionally, a rotating shaft portion 23a is mounted on the tilting mechanism 30. The lifting mechanism 25 has a support body 25a extending in the Z direction, and a mounting portion 24 is mounted on the support body 25a. The lifting mechanism 25 moves the mounting portion 24 in the Z direction. That is, the lifting mechanism 25 moves the substrate holder 10, the mounting portion 24, the tilting mechanism 30, the rotating mechanism 23, the horizontal movement mechanism 22, and the fork tooth retaining portion 21 together in the Z direction.

[0033] <Details of the tilting mechanism>

[0034] like Figure 2 As shown, the tilting mechanism 30 includes: a plate-shaped lower part 31 disposed on the lower side of the mounting portion 24 in the Z direction; and an upper part 32 disposed opposite to the lower part 31 in the vertical direction, i.e., the Z direction. The lower part 31 is mounted on the mounting portion 24. A support body 22a is mounted on the upper part 32 via a rotating shaft portion 23a. The support body 22a rotates about the rotating shaft portion 23a as a rotation axis. In addition, the tilting mechanism 30 has three spherical sliding bearings 33, 34, and 35 between the lower part 31 and the upper part 32, and these three spherical sliding bearings 33, 34, and 35 are disposed at different locations when viewed from the vertical direction, i.e., the Z direction.

[0035] The spherical sliding bearing 35 is positioned at one end of an imaginary centerline L, which extends from the base end to the end along the center of the tilting mechanism 30 in the width direction (X direction). Spherical sliding bearings 33 and 34 are positioned at a position closer to the base end of the substrate transport robot 100 than the spherical sliding bearing 35. Furthermore, the spherical sliding bearings 33 and 34 are configured to be symmetrical about the imaginary centerline L when viewed from the Z direction. Additionally, the spherical sliding bearings 33 and 34 are positioned at the same height as the spherical sliding bearing 35.

[0036] like Figure 3 As shown, the spherical plain bearing 35 has an inner ring 35a and an outer ring 35b. The outer ring 35b of the spherical plain bearing 35 is mounted to the lower component 31 via an intermediate component 35c, and the inner ring 35a is mounted to the upper component 32 via bolts 35d. Furthermore, the tilting mechanism 30 has two height adjustment mechanisms 36 and 37, respectively, corresponding to two of the three spherical plain bearings 33 and 34. However, no height adjustment mechanism is provided for the spherical plain bearing 35.

[0037] The spherical sliding bearing 33 has an inner ring 33a and an outer ring 33b. The inner ring 33a is mounted on the lower component 31 via an intermediate component 33c and a height adjustment mechanism 36, while the outer ring 33b is mounted on the upper component 32. The height adjustment mechanism 36 has an external thread component 36a and an internal thread component 36b. The external thread component 36a engages with the internal thread component 36b and is rotated by a motor 36c (described later). The internal thread component 36b moves in the Z-direction due to the rotation of the external thread component 36a. Furthermore, the internal thread component 36b is fitted into the inner hole of the inner ring 33a and is mounted on the upper component 32 via the spherical sliding bearing 33. Because the internal thread component 36b moves in the Z-direction, the height position of the upper component 32 is changed.

[0038] The spherical sliding bearing 34 has the same structure as the spherical sliding bearing 33. That is, the spherical sliding bearing 34 has an inner ring 34a and an outer ring 34b. The inner ring 34a of the spherical sliding bearing 34 is mounted on the lower part 31 via the intermediate part 34c and the height position adjustment mechanism 37, and the outer ring 34b is mounted on the upper part 32. The height position adjustment mechanism 37 has the same structure as the height position adjustment mechanism 36. That is, the height position adjustment mechanism 37 has an external threaded part 37a and an internal threaded part 37b. The external threaded part 37a engages with the internal threaded part 37b and is rotated by the motor 37c described later. The internal threaded part 37b moves in the Z direction due to the rotation of the external threaded part 37a. In addition, the internal threaded part 37b is fitted into the inner hole of the inner ring 34a and is mounted on the upper part 32 via the spherical sliding bearing 34. Because the internal threaded part 37b moves in the Z direction, the height position of the upper part 32 is changed.

[0039] By changing the height position of the upper component 32 through at least one of the height position adjustment mechanisms 36 and 37, the tilt angle of the upper component 32 relative to the lower component 31 is changed. This change in tilt angle of the upper component 32 relative to the lower component 31 alters the tilt angle of the support 22a relative to the mounting portion 24, causing the substrate to tilt while maintaining the hand 10's posture. Furthermore, when the upper component 32 is tilted by changing its height position, since the outer ring of the spherical sliding bearing 33, 34, or 35 slides on the surface of the inner ring while the upper component 32 tilts, the upper component 32 can be tilted without twisting it.

[0040] <Structure of the contact sensor and control unit>

[0041] like Figure 4 As shown, in the first embodiment, the substrate handling robot 100 includes three contact sensors 41, 42, and 43. Contact sensors 41, 42, and 43 are disposed on the lowermost fork member 11 of a plurality of fork members 11 arranged vertically on the substrate holding hand 10. Furthermore, in Figure 4Only the lowermost of the five forked members 11 of the substrate holder 10 is shown. Contact sensors 41, 42, and 43 are disposed at three different locations on the substrate holder 10 where they abut against the periphery of the substrate W. Specifically, contact sensors 41 and 42 are each disposed at the two-part end portion of the forked member 11 of the substrate holder 10. Contact sensor 43 is disposed at the base end portion of the forked member 11 of the substrate holder 10. Contact sensors 41, 42, and 43 are each disposed on the upper Z-direction side of the forked member 11 of the substrate holder 10, corresponding to the position where the periphery of the substrate W, which has a circular plate shape, is divided into three parts. Contact sensors 41, 42, and 43 detect the contact state between the substrate W and the substrate holder 10 during the transport of the substrate W relative to the substrate mounting portion 103. Specifically, each of contact sensors 41, 42, and 43 detects whether the substrate W is in contact with the hand 10. Each of contact sensors 41, 42, and 43 includes, for example, a force sensor based on a strain gauge or piezoelectric sensor. Each of contact sensors 41, 42, and 43 detects contact forces in three mutually orthogonal axes. Each of contact sensors 41, 42, and 43 outputs a detection signal indicating the detection result of a contact state to the control unit 50. Contact sensor 41 is an example of a hand sensor and an end-effector sensor. Contact sensor 42 is an example of a hand sensor and an end-effector sensor. Contact sensor 43 is an example of a hand sensor and an end-effector sensor.

[0042] like Figure 5 As shown, the control unit 50 controls the actions of each part of the substrate handling robot 100. Specifically, the control unit 50 controls the handling actions of the substrate handling robot 100 by controlling the horizontal movement mechanism 22, the rotation mechanism 23, the lifting mechanism 25, and the tilting mechanism 30. Specifically, motors 22b, 23b, 25b, 36c, and 37c, which serve as drive sources, are respectively arranged in the horizontal movement mechanism 22, the rotation mechanism 23, the lifting mechanism 25, the height position adjustment mechanism 36, and the height position adjustment mechanism 37. The control unit 50 controls the handling actions of the substrate handling robot 100 on the substrate W by controlling the motors 22b, 23b, 25b, 36c, and 37c. Each of the motors 22b, 23b, 25b, 36c, and 37c is a servo motor. In addition, the control unit 50 acquires detection signals from contact sensors 41, 42, and 43.

[0043] The control unit 50 includes an arithmetic unit such as a CPU (Central Processing Unit), a memory such as RAM (Random Access Memory) and ROM (Read Only Memory), and a storage device such as a hard disk. The control unit 50 executes control processing using the arithmetic unit based on programs and parameters stored in the storage devices. Furthermore, the control unit 50 includes a main CPU that controls the entire movement of the board handling robot 100; and a servo CPU that controls the current supplied to the drive sources including motors 22b, 23b, 25b, 36c, and 37c.

[0044] In the first embodiment, the control unit 50 activates the tilting mechanism 30 based on detection signals from contact sensors 41, 42, and 43, thereby adjusting the relative tilt of the substrate mounting portion 103 and the substrate holding hand 10. The control unit 50 adjusts the relative tilt of the substrate mounting portion 103 and the substrate holding hand 10 based on the differences in the changes in the detection signals from the three contact sensors 41, 42, and 43. Furthermore, the control unit 50 obtains the detection value along one axis in the vertical direction based on the detection signals from the contact sensors 41, 42, and 43, thereby adjusting the relative tilt of the substrate mounting portion 103 and the substrate holding hand 10. Therefore, the contact sensors 41, 42, and 43 need to be sensors that detect at least one axis of contact force along the vertical direction.

[0045] Specifically, the control unit 50 obtains the detection value of one axis along the vertical direction, i.e., the Z direction, from the detection results of the contact force along the three axes detected by the contact sensors 41, 42, and 43, based on the detection signals from the contact sensors 41, 42, and 43. For example, the control unit 50 determines whether the detection value of the obtained detection signal is greater than a preset threshold, thereby determining whether contact with the substrate W is detected in each of the contact sensors 41, 42, and 43 disposed on the substrate holder 10.

[0046] like Figure 6As shown, when the surface of the substrate holding hand 10 holding the substrate W is inclined relative to the mounting surface of the substrate mounting portion 103, the timing of the change in the detection signals of contact sensors 41, 42, and 43 during the action of removing the substrate W from the substrate mounting portion 103 becomes different for each other. For example, when the end of the fork member 11 of the substrate holding hand 10 is inclined downward in the vertical direction, during the action of removing the substrate W, contact sensor 43 detects contact with the substrate W before contact sensors 41 and 42. The control unit 50 detects the relative inclination of the substrate holding hand 10 relative to the substrate mounting portion 103 based on the difference in the timing of the change in the detection signals of contact sensors 41, 42, and 43. Furthermore, during the operation of moving the substrate W relative to the substrate mounting portion 103, each of the contact sensors 41, 42, and 43 detects a change in the detection signal from the state where the substrate W is in contact with the substrate holding hand 10, to the state where the substrate W is placed on the substrate mounting portion 103 and no longer in contact with the substrate holding hand 10. Additionally, in Figure 6 In the image, only the bottommost of the five forked tooth components 11 of the substrate holding hand 10 is shown.

[0047] To eliminate the relative tilt between the substrate mounting portion 103 and the substrate holding hand 10, the control unit 50 controls the operation of the tilting mechanism 30. Specifically, the control unit 50 adjusts the tilt of the fork-tooth holding portion 21 relative to the mounting portion 24 by activating the tilting mechanism 30, thereby adjusting the relative tilt of the substrate holding hand 10 relative to the substrate mounting portion 103. Based on the detection signals from contact sensors 41, 42, and 43, the control unit 50 adjusts the tilt of the upper component 32 relative to the lower component 31 via height position adjustment mechanisms 36 and 37. Thus, the control unit 50 adjusts the relative tilt of the substrate holding hand 10 relative to the substrate mounting portion 103. By activating the tilting mechanism 30, the control unit 50 eliminates the differences in the changes in the detection signals of the three contact sensors 41, 42, and 43. For example, during the removal of substrate W, if the change in the detection signal of the contact sensor 43 located at the base of the substrate holder 10 occurs earlier than the change in the detection signals of the contact sensors 41 and 42 located at the tip, the control unit 50 adjusts the tilt of the substrate holder 10 by actuating the tilting mechanism 30 to lift the tip. In this way, the control unit 50 actuates the tilting mechanism 30 based on the detection signals from each of the contact sensors 41, 42, and 43, thereby reducing the difference in the timing of the detection signal changes.

[0048] For example, during the installation of the substrate handling robot 100 or during routine maintenance, the control unit 50 performs a tilt setting operation. In this tilt setting operation, a setting value for activating the tilting mechanism 30 is set based on the detection signals from each of the contact sensors 41, 42, and 43. The control unit 50 adjusts the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 through the tilt setting operation. The control unit 50, based on the preset setting value, uses the tilting mechanism 30 to set the tilt of the substrate holding hand 10 to a predetermined value, and then performs a substrate W transport operation relative to the substrate mounting section 103. In the tilt setting operation, for example, the control unit 50 repeatedly performs the actions of placing the substrate W on the substrate mounting section 103 and removing the substrate W from the substrate mounting section 103, and adjusts the operation of the tilting mechanism 30 multiple times based on the detection signals from each of the contact sensors 41, 42, and 43 obtained during the repeated insertion and removal actions. For example, the control unit 50 sets a value where the difference in the timing of the changes in the detection signals of the three contact sensors 41, 42, and 43 becomes smaller than a predetermined threshold as the adjustment result of the tilt mechanism 30 in the tilt setting operation, and stores it in the storage device. The setting value set as the adjustment result of the tilt mechanism 30 is stored as the setting value of the height position adjustment mechanisms 36 and 37 of the tilt mechanism 30 in the transport operation of the substrate W.

[0049] Furthermore, when the control unit 50 moves multiple substrates W relative to the substrate mounting unit 103 based on the setting value set in the tilt setting operation, it updates the setting value of the tilting mechanism 30 if it detects the relative tilt of the substrate mounting unit 103 and the substrate holding hand 10. For example, if the control unit 50 detects a change in the detection signal in some of the multiple contact sensors 41, 42, and 43, and after a predetermined time (which is a predetermined threshold) has elapsed, and no change in the detection signal is detected in any of the multiple contact sensors 41, 42, and 43, it considers the difference in the change of the detection signal to be above the predetermined threshold and determines that the relative tilt of the substrate mounting unit 103 and the substrate holding hand 10 has been detected. In this case, the control unit 50 controls the operation of the tilting mechanism 30 in such a way that the detection signal changes in the contact sensors 41, 42, and 43 where no change in the detection signal was detected. For example, during the operation of removing the substrate W, if the contact sensor 43 contacts the substrate W before the contact sensors 41 and 42, only the detection signal from the contact sensor 43 changes. If, in this case, the difference in the change of the detection signal is determined to be above a predetermined threshold, the control unit 50 activates the tilting mechanism 30 in such a way that the detection signal from the contact sensor 43 remains unchanged, while the detection signals from the contact sensors 41 and 42 change. The control unit 50 also updates the setting value at the moment when the detection signals from the contact sensors 41 and 42 change as a new setting value for the operation of the tilting mechanism 30. For example, the control unit 50 sets the operation of the tilting mechanism 30 so that the surface of the substrate W held in the substrate holder 10, i.e., the upper side of the fork tooth member 11 in the Z direction, is parallel to the mounting surface of the substrate W in the substrate mounting section 103. That is, during the transport operation of the substrate W, the control unit 50 activates the tilting mechanism 30 so that the substrate W held by the substrate holder 10 and the substrate W mounted on the substrate mounting section 103 become parallel to each other.

[0050] (Control method for substrate handling robot)

[0051] Reference Figure 7 The control method of the substrate handling robot 100 in the first embodiment will be described based on the flowchart. The control processing in steps S1 to S4 is performed by the control unit 50.

[0052] First, in step S1, during the transport operation of the substrate W relative to the substrate mounting portion 103, detection signals from multiple contact sensors 41, 42 and 43 are obtained, thereby detecting the contact state between the substrate holding hand 10 and the substrate W.

[0053] Next, in step S2, it is determined whether the difference in the changes of the detection signals of the multiple contact sensors 41, 42, and 43 is less than a predetermined threshold. If the difference in the changes of the detection signals is determined to be less than the predetermined threshold, the control process ends. If the difference in the changes of the detection signals is not determined to be less than the predetermined threshold, the process proceeds to step S3.

[0054] In step S3, the tilting mechanism 30 is activated based on the differences in the changes in the detection signals of the multiple contact sensors 41, 42, and 43, thereby eliminating the differences in the changes in the detection signals of the multiple contact sensors 41, 42, and 43, and adjusting the relative tilt of the substrate mounting portion 103 and the substrate holding hand 10. For example, if a change in the detection signal is detected in some of the multiple contact sensors 41, 42, and 43, the tilting mechanism 30 is activated in such a way that the change in the detection signal is detected in the remaining contact sensors of the multiple contact sensors 41, 42, and 43 where no change in the detection signal was detected, thereby eliminating the differences in the changes in the detection signals of the multiple contact sensors 41, 42, and 43.

[0055] Next, in step S4, the setting value of the tilting mechanism 30 is stored in the state where the relative tilt of the substrate mounting part 103 and the substrate holding hand 10 has been adjusted in step S2.

[0056] [Effects of the first embodiment]

[0057] The substrate handling robot 100 includes a control unit 50. Based on detection signals from contact sensors 41, 42, and 43, the control unit 50 activates a tilting mechanism 30, which serves as a tilt adjustment mechanism, thereby adjusting the relative tilt of the substrate mounting section 103 and the substrate holding hand 10. Thus, by activating the tilting mechanism 30 based on the detection signals from contact sensors 41, 42, and 43, deviations in the tilt between the substrate holding hand 10 and the substrate mounting section 103 can be suppressed. Therefore, situations where improper handling of the substrate W due to tilt deviations between the substrate holding hand 10 and the substrate mounting section 103 can be prevented. As a result, the substrate W can be handled appropriately.

[0058] Multiple contact sensors 41, 42, and 43 are configured. The control unit 50 adjusts the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 based on the differences in the changes of the detection signals of the multiple contact sensors 41, 42, and 43. Here, when the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 is detected by a single contact sensor, a contact sensor that detects forces in mutually orthogonal triaxial directions is used. However, when using a single contact sensor, since the detection point is a single location, the accuracy of the detection result is considered to decrease if the substrate W is warped, and the accuracy of adjusting the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 is reduced. Therefore, by adjusting the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 based on the differences in the changes of the detection signals of the multiple contact sensors 41, 42, and 43, the tilt can be adjusted more easily and with higher accuracy compared to adjusting the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 based on the detection signal from a single contact sensor. As a result, the substrate W can be transported more appropriately.

[0059] The substrate handling robot 100 includes contact sensors 41, 42, and 43, which are disposed on the substrate holding hand 10 and detect the contact state between the substrate W and the substrate holding hand 10. Therefore, since the contact sensors 41, 42, and 43 are disposed on the substrate holding hand 10, the relative tilt angle between the substrate holding hand 10 and the substrate mounting portion 103 can be adjusted even during actual substrate W handling. Thus, even if the relative tilt angle between the substrate holding hand 10 and the substrate mounting portion 103 changes during substrate W handling, the tilt angle can be adjusted by the tilting mechanism 30, allowing for more appropriate substrate W handling. Furthermore, when the substrate W disposed on the substrate mounting portion 103 is detected by a mapping sensor such as a photoelectric sensor disposed on the substrate holding hand 10, only the near-front side of the substrate W disposed on the substrate mounting portion 103 can be detected, making it difficult to detect the inner side of the substrate W. In contrast, by using the contact sensors 41, 42, and 43 disposed on the substrate holder 10, not only the near-front side of the substrate W placed on the substrate mounting portion 103 can be easily detected, but also the inner side can be easily detected. Therefore, based on the detection results from the contact sensors 41, 42, and 43 disposed on the substrate holder 10, the relative tilt of the substrate holder 10 and the substrate mounting portion 103 can be detected with higher accuracy. As a result, the substrate W can be transported more appropriately.

[0060] The substrate handling robot 100 has contact sensors 41, 42, and 43, which function as hand sensors, arranged at at least three different positions on the substrate holder 10 where it abuts against the substrate W. Therefore, the contact between the substrate W and the substrate holder 10 at three different points can be detected by the three contact sensors 41, 42, and 43. Based on the detection results from the three contact sensors 41, 42, and 43, the relative three-dimensional tilt of the substrate holder 10 and the substrate mounting portion 103 can be easily detected. Therefore, the relative three-dimensional tilt of the substrate holder 10 and the substrate mounting portion 103 can be easily adjusted, thus enabling more appropriate handling of the substrate W.

[0061] The substrate holder 10 has a bifurcated shape with its end portion divided into two parts. The hand sensors of the substrate handling robot 100 include: contact sensors 41 and 42, each disposed at one end portion of the substrate holder 10 as an end-part sensor, and a contact sensor 43 disposed at the base end portion as a base-end sensor. Therefore, the contact state between the substrate W and the substrate holder 10 can be detected with higher precision using the contact sensors 41, 42, and 43 disposed at positions in the bifurcated substrate holder 10 that contact the substrate W. As a result, the handling of the substrate W using the bifurcated substrate holder 10 can be performed more appropriately.

[0062] The substrate W has a circular plate shape. Contact sensors 41, 42, and 43 are each arranged corresponding to a position dividing the circumference of the circular plate-shaped substrate W into three parts, relative to the periphery of the substrate W. Therefore, by arranging one contact sensor 41, 42, and 43 corresponding to a position dividing the circumference of the circular plate-shaped substrate W into three parts, each of the contact sensors 41, 42, and 43 can be positioned at a more separated location. As a result, based on the detection results of the contact sensors 41, 42, and 43, the relative tilt of the substrate holding hand 10 relative to the substrate mounting portion 103 can be detected with higher accuracy, thus enabling more appropriate handling of the substrate W.

[0063] The control unit 50 obtains a detection value along one axis in the vertical direction based on the detection signals from contact sensors 41, 42, and 43, thereby adjusting the relative tilt of the substrate mounting unit 103 and the substrate holding hand 10. Therefore, compared to configuring the control unit 50 to adjust the relative tilt of the substrate mounting unit 103 and the substrate holding hand 10 based on detection values ​​of multiple axes, it is sufficient to configure the contact sensors 41, 42, and 43 to detect the detection value of at least one axis, thus suppressing structural complexity of the contact sensors 41, 42, and 43. As a result, structural complexity of the substrate handling robot 100 can be suppressed.

[0064] The tilt mechanism 30, serving as a tilt adjustment mechanism, includes: a lower component 31; an upper component 32, disposed opposite to the lower component 31 in the vertical direction; three spherical sliding bearings 33, 34, and 35, disposed between the lower component 31 and the upper component 32 at different locations when viewed from the vertical direction; and two height position adjustment mechanisms 36 and 37, respectively provided corresponding to two of the three spherical sliding bearings 33, 34, and 35, i.e., the spherical sliding bearings 33 and 34. Based on detection signals from contact sensors 41, 42, and 43, the control unit 50 adjusts the tilt of the upper component 32 relative to the lower component 31 via the height position adjustment mechanisms 36 and 37, thereby adjusting the relative tilt of the substrate mounting unit 103 and the substrate holding hand 10. Therefore, by using three spherical sliding bearings 33, 34 and 35 and two height position adjustment mechanisms 36 and 37, the relative tilt of the substrate mounting part 103 and the substrate holding hand 10 can be adjusted without the lower part 31 and the upper part 32 twisting relative to each other, thus enabling more appropriate handling of the substrate W.

[0065] The substrate holder 10 includes multiple fork-tooth members 11, each holding a substrate W. A fork-tooth holding portion 21 is connected to the multiple fork-tooth members 11. The control unit 50 adjusts the tilt angle of the fork-tooth holding portion 21 by activating a tilt mechanism 30, which is a tilt adjustment mechanism, based on detection signals from contact sensors 41, 42, and 43, thereby adjusting the relative tilt angle between the substrate mounting portion 103 and the substrate holder 10. Therefore, by adjusting the tilt angle of the fork-tooth holding portion 21 connected to the multiple fork-tooth members 11 using the tilt mechanism 30, the tilt angle of the multiple fork-tooth members 11 can be adjusted centrally. As a result, compared to adjusting the tilt angle of the multiple fork-tooth members 11 individually, the complexity of the device structure can be reduced.

[0066] The control unit 50 adjusts the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 in the heat treatment apparatus 101 for heat treatment of the substrate W based on detection signals from contact sensors 41, 42, and 43. Here, the substrate mounting section 103 in the heat treatment apparatus 101 may sometimes deform due to heat treatment of the substrate W. In this case, a deviation occurs in the tilt between the substrate mounting section 103 and the substrate holding hand 10. Therefore, by adjusting the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 in the heat treatment apparatus 101, the substrate W can be transported effectively and appropriately.

[0067] (The effect of the control method for the substrate handling robot)

[0068] In the first embodiment, as described above, the control method of the substrate handling robot 100 is based on a detection signal that detects the contact state between the substrate holding hand 10 and the substrate W, and activates the tilt adjustment mechanism, i.e., the tilt mechanism 30, which adjusts the tilt of the substrate holding hand 10, thereby adjusting the relative tilt of the substrate mounting portion 103 and the substrate holding hand 10. Therefore, by activating the tilt mechanism 30 based on the detection signal that detects the contact state, deviations in the tilt between the substrate holding hand 10 and the substrate mounting portion 103 can be suppressed. Thus, situations where the handling operation of the substrate W becomes inappropriate due to deviations in the tilt between the substrate holding hand 10 and the substrate mounting portion 103 can be suppressed. As a result, a control method for the substrate handling robot 100 capable of properly performing the handling operation of the substrate W can be provided.

[0069] The control method of the substrate handling robot 100 detects the contact state between the substrate holding hand 10 and the substrate W by acquiring detection signals from multiple contact sensors 41, 42, and 43. Furthermore, the control method of the substrate handling robot 100 eliminates the differences in the changes of the detection signals from the multiple contact sensors 41, 42, and 43 by activating a tilting mechanism 30, which serves as a tilting adjustment mechanism, thereby adjusting the relative tilt of the substrate mounting section 103 and the substrate holding hand 10. Thus, by activating the tilting mechanism 30 to eliminate the differences in the changes of the detection signals from the multiple contact sensors 41, 42, and 43, the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 can be adjusted with high precision. As a result, a control method for the substrate handling robot 100 that can more appropriately perform the handling of the substrate W can be provided.

[0070] [Second Implementation]

[0071] Next, refer to Figure 8 and Figure 9 The structure of the substrate handling robot 200 according to the second embodiment will be described. In the second embodiment, the substrate handling robot 200 differs from the substrate handling robot 100 of the first embodiment, in which contact sensors 41, 42, and 43 are disposed on the substrate holding hand 10; in this embodiment, contact sensors 241, 242, and 243 are disposed on the detection fixture 204. The same reference numerals are used for structures identical to those in the first embodiment, and descriptions are omitted.

[0072] like Figure 8As shown, the substrate handling robot 200 of the second embodiment, like the substrate handling robot 100 of the first embodiment, performs a substrate W handling operation between the FOUP 102 and the substrate mounting section 103 in the heat treatment apparatus 101. The substrate handling robot 200 includes a substrate holding hand 210, a drive mechanism 20, a tilting mechanism 30, and a control unit 250.

[0073] The substrate holding hand 210 holds the substrate W in the same manner as the substrate holding hand 10 in the first embodiment. Furthermore, in the second embodiment, the substrate holding hand 210 holds the detection fixture 204, which mimics the substrate W, during the tilt setting operation described later. Also, unlike the substrate holding hand 10 in the first embodiment, the substrate holding hand 210 does not have a contact sensor. The other structures of the substrate holding hand 210 are the same as those of the substrate holding hand 10 in the first embodiment.

[0074] like Figure 9 As shown, in the second embodiment, three contact sensors 241, 242, and 243 are disposed on the detection fixture 204. The detection fixture 204, like the substrate W, has a circular plate shape. The contact sensors 241, 242, and 243 are disposed at three different positions in the detection fixture 204: a position where they abut against the substrate holding hand 210 and a position where they abut against the substrate mounting portion 103. For example, the contact sensors 241, 242, and 243 are disposed at positions in the detection fixture 204 that abut against the two-part end portion of the fork tooth member 11 of the substrate holding hand 210 and at the base end portion. That is, one of each of the contact sensors 241, 242, and 243 is disposed corresponding to the position described below, which is the position where they abut against the substrate holding hand 210 and the position where the circumference of the detection fixture 204, which has a circular plate shape, is divided into three parts. Furthermore, contact sensors 241, 242, and 243 detect the contact state between the detection fixture 204 and the substrate and the hand 10 during the transport operation of the detection fixture 204 relative to the substrate mounting portion 103. Each of contact sensors 241, 242, and 243, similar to contact sensors 41, 42, and 43 in the first embodiment, includes, for example, a force sensor based on a strain gauge or piezoelectric sensor, detecting contact forces in three mutually orthogonal axes. Each of contact sensors 241, 242, and 243 outputs a detection signal indicating the detection result of a detected contact state to the control unit 250. For example, each of contact sensors 241, 242, and 243 outputs a detection signal to the control unit 250 via wireless communication. Contact sensors 241, 242, and 243 are an example of fixture sensors.

[0075] Like the control unit 50 in the first embodiment, the control unit 250 controls the actions of each part of the substrate handling robot 200. The hardware structure of the control unit 250 is the same as that of the control unit 50 in the first embodiment. Like the control unit 50 in the first embodiment, the control unit 250 adjusts the relative tilt of the substrate mounting unit 103 and the substrate holding hand 210 through a tilt setting operation. In the second embodiment, the control unit 250 activates the tilting mechanism 30 based on detection signals from contact sensors 241, 242, and 243, thereby adjusting the relative tilt of the substrate mounting unit 103 and the substrate holding hand 210.

[0076] In the second embodiment, during the tilt setting operation of setting the tilt mechanism 30, the control unit 250 uses the substrate transport robot 200 to transport the detection fixture 204 to the substrate mounting unit 103 instead of the substrate W, thereby acquiring detection signals from the contact sensors 241, 242, and 243. Based on the differences in the changes of the detection signals of the three contact sensors 241, 242, and 243 acquired during the transport operation of the detection fixture 204, the control unit 50 adjusts the relative tilt of the substrate mounting unit 103 and the substrate holding hand 210.

[0077] Furthermore, the control method of the substrate handling robot 200 that adjusts the relative tilt of the substrate mounting part 103 and the substrate holding hand 210 according to the second embodiment differs only in that, instead of detecting the substrate W during the handling action of the substrate W, the detection fixture 204 is detected during the handling action of the detection fixture 204. Otherwise, it is the same as the control method of the substrate handling robot 100 according to the first embodiment.

[0078] [Effects of the second embodiment]

[0079] The substrate handling robot 200 includes contact sensors 241, 242, and 243, which are disposed on the inspection fixture 204 and detect the contact state between the inspection fixture 204 and the substrate holding hand 210, serving as fixture sensors. Therefore, since the contact sensors 241, 242, and 243 are disposed on the inspection fixture 204, the relative tilt angle between the substrate holding hand 210 and the substrate mounting portion 103 can be adjusted without arranging contact sensors on the substrate holding hand 210. Thus, the structural complexity of the substrate handling robot 200 can be suppressed, and the relative tilt angle between the substrate holding hand 210 and the substrate mounting portion 103 can be easily adjusted. As a result, the structural complexity of the substrate handling robot 200 can be suppressed, and the substrate W handling operation can be performed appropriately.

[0080] The substrate handling robot 200 includes at least three contact sensors 241, 242, and 243, which serve as fixture sensors. The contact sensors 241, 242, and 243 are configured at at least three different locations within the detection fixture 204, including the location where the substrate holding hand 210 abuts against the substrate mounting portion 103. Therefore, contact at these three different points can be detected by the three contact sensors 241, 242, and 243, and the relative three-dimensional tilt of the substrate holding hand 210 and the substrate mounting portion 103 can be easily detected based on the detection results from the three contact sensors 241, 242, and 243. Thus, the relative three-dimensional tilt of the substrate holding hand 210 and the substrate mounting portion 103 can be easily adjusted, allowing for more appropriate substrate handling operations.

[0081] The detection fixture 204 has a circular plate shape. Contact sensors 241, 242, and 243 are each arranged corresponding to a position dividing the circumference of the circular plate-shaped detection fixture 204 into three parts. Therefore, by arranging one contact sensor 241, 242, and 243 corresponding to a position dividing the circumference of the circular plate-shaped detection fixture 204 into three parts, each of the contact sensors 241, 242, and 243 can be positioned at a further separated location. As a result, based on the detection results of the contact sensors 241, 242, and 243, the relative tilt of the substrate holding hand 210 relative to the substrate mounting portion 103 can be detected with higher accuracy, thus enabling more appropriate handling of the substrate W.

[0082] Furthermore, the other effects in the second embodiment are the same as those in the first embodiment. Additionally, the control method of the substrate handling robot 200 in the second embodiment also has the same effect as the control method of the substrate handling robot 100 in the first embodiment, the only difference being that instead of detecting the substrate W during the handling action of the substrate W, the detection fixture 204 is detected during the handling action of the detection fixture 204.

[0083] [Variation Example]

[0084] Furthermore, the embodiments disclosed herein should be considered illustrative in all respects and not limiting. The scope of this disclosure is indicated by the scope of the claims rather than by the description of the embodiments described above, and also includes the meaning equivalent to the scope of the claims and all modifications (variations) within that scope.

[0085] For example, in the first and second embodiments described above, an example was shown where the relative tilt of the substrate mounting portion 103 and the substrate holding hands 10 and 210 disposed in the heat treatment apparatus 101 was adjusted by activating the tilt mechanism 30, which serves as a tilt adjustment mechanism. However, this disclosure is not limited to this. In this disclosure, the relative tilt of the FOUP, which serves as the substrate mounting portion, and the substrate holding hands can also be adjusted by activating the tilt adjustment mechanism. In addition, the relative tilt of the substrate mounting portion and the substrate holding hands disposed in a processing apparatus that performs etching, processing, or other processing on the substrate, other than heat treatment, can also be adjusted. Furthermore, the relative tilt of the substrate holding hands can also be adjusted relative to substrate mounting portions such as loading locking portions that hold substrates in an EFEM (Equipment Front End Module), or substrate mounting portions in alignment devices used to adjust the orientation of the substrate. That is, the tilt adjustment mechanism can be activated during transport operations between any two of the following: the FOUP serving as a substrate mounting unit, the substrate mounting unit disposed in the processing apparatus, the loading locking unit, and the substrate mounting unit in the alignment apparatus, thereby adjusting the relative tilt. Furthermore, the tilt adjustment mechanism can be activated during any transport operation between the FOUP serving as substrate mounting units, between the substrate mounting units disposed in the processing apparatus, between the substrate mounting units disposed in the loading locking unit, and between the substrate mounting units in the alignment apparatus, thereby adjusting the relative tilt.

[0086] Furthermore, in the first embodiment described above, an example was shown where contact sensors 41, 42, and 43, serving as hand sensors, were configured on the substrate holding hand 10. In the second embodiment described above, an example was shown where contact sensors 241, 242, and 243, serving as fixture sensors, were configured on the detection fixture 204. However, this disclosure is not limited to these examples. In this disclosure, contact sensors serving as fixture sensors may also be configured on the substrate mounting portion. For example, as shown... Figure 10 As shown in the first modified example, contact sensors 341, 342, and 343, serving as sensors for the mounting portion, are disposed on the substrate mounting portion 303 of the substrate W. Contact sensors 341, 342, and 343 detect the contact state between the substrate mounting portion 303 and the substrate W or the detection fixture 204, thereby detecting the contact state between the substrate W or the detection fixture 204 and the substrate holding hand 310. Figure 10In this example, the substrate mounting section 303, where the substrate is mounted in an EFEM, is equipped with contact sensors 341, 342, and 343. Similar to the contact sensors 41, 42, and 43 in the first embodiment, each of the contact sensors 341, 342, and 343 is positioned corresponding to a point on the periphery of the substrate W, which has a circular plate shape, corresponding to a position dividing the circumference into three parts. Furthermore, no contact sensor is provided on the substrate holding hand 310 that holds the substrate W. In this case, the contact sensors 341, 342, and 343, which also serve as sensors for the mounting section, are also provided on the substrate mounting section 303. By detecting the contact state between the substrate mounting section 303 and the substrate W or the detection fixture 204, the contact state between the substrate W or the detection fixture 204 and the substrate holding hand 310 can be detected. This allows adjustment of the relative tilt angle between the substrate mounting section 103 and the substrate holding hand 310, thus enabling appropriate handling of the substrate W.

[0087] Furthermore, in the first embodiment described above, an example was shown where three contact sensors 41, 42, and 43, serving as hand sensors, were arranged in the substrate holding hand 10 at positions where the circumference of the circular plate-shaped substrate W was divided into three parts. In the second embodiment, an example was shown where three contact sensors 241, 242, and 243, serving as fixture sensors, were arranged in the detection fixture 204 at positions where the circumference of the circular plate-shaped detection fixture 204 was divided into three parts. However, this disclosure is not limited to these examples. In this disclosure, the number of contact sensors may be two or less, or four or more. Additionally, the positions where the contact sensors are arranged may not correspond to the periphery of the substrate or detection fixture. For example, the contact sensors may be arranged at the center of the circle of the substrate or detection fixture.

[0088] Furthermore, in the first and second embodiments described above, examples are shown where the fork-tooth member 11 in the substrate holding hands 10 and 210 is a passive hand with a two-pronged shape, but this disclosure is not limited thereto. In this disclosure, it is also possible to... Figure 11 The substrate holding hand 410 shown in the second modified example is configured as a flat plate-shaped substrate holding hand without a forked shape. Alternatively, a vacuum adsorption type hand for adsorbing the substrate or an active type hand with a chuck for fixing the substrate may be configured instead of a passive hand.

[0089] Furthermore, in the second embodiment described above, an example is shown where contact sensors 241, 242, and 243, which serve as fixture sensors, are positioned in the detection fixture 204 and abut against the substrate holding hand 210; however, this disclosure is not limited thereto. In this disclosure, contact sensors, which serve as fixture sensors, may also be positioned in the detection fixture at a position where they abut against the substrate mounting portion when the detection fixture is placed on the substrate mounting portion.

[0090] Furthermore, in the first and second embodiments described above, examples were shown where control units 50 and 250 adjusted the relative tilt of the substrate mounting unit 103 and the substrate holding hands 10 and 210 by acquiring detection values ​​along one axis in the vertical direction; however, this disclosure is not limited to this. In this disclosure, the relative tilt of the substrate mounting unit and the substrate holding hands can also be adjusted based on detection values ​​along two or three axes.

[0091] Furthermore, in the first and second embodiments described above, an example was shown where the tilt mechanism 30, as a tilt adjustment mechanism, has three spherical sliding bearings 33, 34, and 35 and two height position adjustment mechanisms 36 and 37, but this disclosure is not limited thereto. In this disclosure, a tilt adjustment mechanism without spherical sliding bearings may also be configured. Additionally, a height position adjustment mechanism may not be configured in the tilt adjustment mechanism. For example, the tilt adjustment mechanism may also adjust the tilt by configuring a rotation mechanism. Furthermore, the drive source of the tilt adjustment mechanism may be an actuator based on pneumatic or hydraulic cylinders, a piezoelectric element, a solenoid coil, or a linear motor, etc.

[0092] Furthermore, in the first and second embodiments described above, examples are shown where the substrate handling robots 100 and 200 include a horizontal movement mechanism 22 serving as a drive mechanism 20, and multiple fork-tooth components 11, each holding a substrate W or a detection fixture 204, are arranged in the substrate holding hand 10. However, this disclosure is not limited to this. In this disclosure, the substrate handling robot may also have a robot arm with multiple joint axes as a drive mechanism for moving the substrate holding hand. In this case, the robot arm may be horizontally multi-jointed or vertically multi-jointed. Additionally, the substrate handling robot may also have a drive mechanism with a parallel link structure. Furthermore, it may also be as follows... Figure 12 As shown in the third modified example, the substrate holding hand 510 holds a substrate. Figure 12 In the third variation shown, the substrate holder 510 is mounted on the robot arm 520, which serves as a drive mechanism. In this case, the tilting mechanism 30, which serves as a tilt adjustment mechanism, is disposed, for example, between the end portion of the robot arm 520 and the substrate holder 510. In this case, a contact sensor can be disposed on the substrate holder 510, on a detection fixture, or on the substrate mounting portion. Alternatively, multiple substrate holders holding a single substrate can be disposed. For example, one substrate holder holding a single substrate can be disposed on each of multiple robot arms.

[0093] Furthermore, in the first embodiment described above, an example was shown where contact sensors 41, 42, and 43, serving as hand sensors, are disposed in the lowermost fork member 11 among a plurality of fork members 11 arranged in a vertical direction; however, this disclosure is not limited thereto. In this disclosure, a hand sensor may also be disposed in the uppermost fork member among a plurality of fork members arranged in a vertical direction, or in the central fork member. Alternatively, a hand sensor may be disposed in each of the plurality of fork members.

[0094] Furthermore, in the first embodiment described above, an example of three contact sensors 41, 42, and 43 configured as force sensors was shown. In the second embodiment, an example of three contact sensors 241, 242, and 243 configured was shown, but this disclosure is not limited thereto. In this disclosure, the contact sensor for detecting the contact state may also be a mechanical switch. Alternatively, the contact sensor may be a sensor that detects the degree of contact using analog values, such as an electrostatic capacitance sensor or a distance sensor. Additionally, the contact sensor may detect contact force in a uniaxial direction instead of a triaxial direction. Furthermore, instead of three, two or four or more contact sensors may be configured. Additionally, when contact sensors are configured on a substrate holding hand holding multiple substrates, a contact sensor may be configured on each of the multiple fork tooth components. In this case, for example, if there is only one tilt adjustment mechanism, the detection results of each of the multiple fork tooth components may be averaged to activate the tilt adjustment mechanism. Alternatively, multiple tilt adjustment mechanisms may be configured in a manner corresponding to each of the multiple fork tooth components. When multiple tilt adjustment mechanisms are configured in a manner corresponding to each of the multiple fork tooth components, the corresponding tilt adjustment mechanism can also be controlled individually based on the detection results of each of the multiple fork tooth components.

[0095] Furthermore, in the first and second embodiments described above, control units 50 and 250, which control the movements of various parts of the substrate handling robots 100 and 200, are shown as obtaining the relative tilt angle between the substrate holding hand 10 and the substrate mounting part 103 based on detection signals from contact sensors 41, 42, 43, 241, 242, and 243. However, this disclosure is not limited to this. In this disclosure, the calculation processing for detecting the relative tilt angle between the substrate holding hand and the substrate mounting part based on the detection results can also be performed by a control device different from the control device controlling the movements of the substrate handling robot. Alternatively, the control unit of the substrate handling robot can be composed of a single CPU.

[0096] The functions of the elements disclosed in this specification can be executed using circuits or processing circuits including general-purpose processors, special-purpose processors, integrated circuits, ASICs (Application Specific Integrated Circuits), existing circuits, and / or combinations thereof, configured or programmed to perform the disclosed functions. A processor, because it includes transistors and other circuitry, is considered a processing circuit or circuit. In this disclosure, a circuit, unit, or mechanism is hardware that performs the listed functions, or hardware programmed to perform the listed functions. The hardware can be the hardware disclosed in this specification, or other known hardware programmed or configured to perform the listed functions. In the case of a processor where the hardware is considered a type of circuit, the circuit, mechanism, or unit is a combination of hardware and software, with the software used in the structure of the hardware and / or the processor.

[0097] [Way]

[0098] Those skilled in the art should understand that the above exemplary embodiments are specific examples of the following methods.

[0099] (Method 1)

[0100] A substrate handling robot, wherein,

[0101] have:

[0102] A substrate holding hand, or a testing fixture that holds the substrate or imitates the aforementioned substrate;

[0103] The contact sensor detects the hand contact between the substrate or the detection fixture and the substrate during the transport operation of the substrate or the detection fixture relative to the substrate mounting portion.

[0104] A tilt adjustment mechanism adjusts the tilt of the substrate to hold the hand in place; and

[0105] The control unit activates the tilt adjustment mechanism based on the detection signal from the contact sensor, thereby adjusting the relative tilt of the substrate mounting part and the substrate to maintain hand position.

[0106] (Method 2)

[0107] According to the substrate handling robot described in Method 1, wherein,

[0108] The above-mentioned contact sensors are configured in multiple ways.

[0109] The control unit adjusts the relative tilt of the substrate mounting part and the substrate to maintain the hand based on the differences in the changes of the detection signals of the multiple contact sensors.

[0110] (Method 3)

[0111] According to the substrate handling robot described in method 1 or 2, wherein,

[0112] The aforementioned contact sensor includes at least one of the following sensors: a hand sensor disposed on the substrate holding hand, for detecting the contact state between the substrate and the substrate holding hand; a fixture sensor disposed on the detection fixture, for detecting the contact state between the detection fixture and the substrate holding hand; and a mounting portion sensor disposed on the substrate mounting portion, for detecting the contact state between the substrate mounting portion and the substrate or the detection fixture, thereby detecting the contact state between the substrate or the detection fixture and the substrate holding hand.

[0113] (Method 4)

[0114] According to the substrate handling robot described in Method 3, wherein,

[0115] The aforementioned contact sensors include at least three of the aforementioned hand sensors.

[0116] The aforementioned hand sensor is disposed at at least three different positions in the position where the hand abuts against the aforementioned substrate.

[0117] (Method 5)

[0118] According to the substrate handling robot described in Method 4, wherein,

[0119] The aforementioned substrate retains a forked shape with the end portion divided into two parts.

[0120] The aforementioned hand sensor includes: an end-part sensor, one of which is disposed on each of the two-part end-parts held in the hand on the aforementioned substrate; and a base-end sensor, disposed on the base end.

[0121] (Method 6)

[0122] According to the substrate handling robot described in Method 3, wherein,

[0123] The aforementioned contact sensors include at least three of the aforementioned fixture sensors.

[0124] The aforementioned fixture sensor is disposed in at least three different positions in the aforementioned detection fixture, including the position where it is in contact with the aforementioned substrate and the position where it is in contact with the aforementioned substrate mounting portion.

[0125] (Method 7)

[0126] According to the substrate handling robot described in any of methods 1 to 6, wherein,

[0127] The aforementioned substrate and the aforementioned testing fixture have a circular plate shape.

[0128] The aforementioned contact sensors are configured in at least three parts, and one of each is arranged corresponding to the position that divides the circumference into three parts, relative to the periphery of the aforementioned substrate or the aforementioned detection fixture which has a circular plate shape.

[0129] (Method 8)

[0130] According to the substrate handling robot described in Method 2, wherein,

[0131] Based on the detection signal from the contact sensor, the control unit obtains the detection value along an axis in the vertical direction, thereby adjusting the relative tilt of the substrate mounting unit and the substrate to maintain the hand's position.

[0132] (Method 9)

[0133] According to the substrate handling robot described in any of methods 1 to 8, wherein,

[0134] The aforementioned tilt adjustment mechanism includes:

[0135] Lower component;

[0136] The upper component is configured to be opposite the lower component in the vertical direction;

[0137] Three spherical sliding bearings are disposed between the lower and upper components at different locations when viewed from above and below; and

[0138] Two height adjustment mechanisms are respectively provided corresponding to two of the three spherical sliding bearings mentioned above.

[0139] Based on the detection signal from the contact sensor, the control unit adjusts the tilt of the upper component relative to the lower component via the height position adjustment mechanism, thereby adjusting the relative tilt of the substrate mounting part and the substrate to maintain hand position.

[0140] (Method 10)

[0141] According to the substrate handling robot described in any of methods 1 to 9, wherein,

[0142] The aforementioned substrate holding hand includes multiple fork-tooth components, each holding the aforementioned substrate or the aforementioned testing fixture.

[0143] The aforementioned substrate handling robot also includes a fork holding part that connects to the aforementioned multiple fork components.

[0144] Based on the detection signal from the contact sensor, the control unit activates the tilt adjustment mechanism to adjust the tilt of the fork tooth holding part, thereby adjusting the relative tilt of the substrate mounting part and the substrate holding hand.

[0145] (Method 11)

[0146] According to the substrate handling robot described in any of methods 1 to 10, wherein,

[0147] Based on the detection signal from the contact sensor, the control unit adjusts the relative tilt of the substrate mounting section and the substrate in the heat treatment apparatus for heat treatment of the substrate to maintain the hand position.

[0148] (Method 12)

[0149] A control method for a substrate handling robot, wherein,

[0150] During the transport of a substrate or a testing fixture that imitates the substrate relative to the substrate mounting portion, it is detected that the substrate or the substrate of the testing fixture is kept in contact with the hand holding the substrate or the testing fixture.

[0151] Based on the detection signal that detects the contact state between the substrate holding hand and the substrate or the detection fixture, the tilt adjustment mechanism that adjusts the tilt of the substrate holding hand is activated, thereby adjusting the relative tilt of the substrate mounting portion and the substrate holding hand.

[0152] (Method 13)

[0153] According to the control method of the substrate handling robot described in Method 12, wherein,

[0154] By acquiring detection signals from multiple contact sensors, the system detects whether the substrate maintains contact between the hand and the substrate or the detection fixture.

[0155] Based on the differences in the changes of the detection signals of the multiple contact sensors, the tilt adjustment mechanism is activated to eliminate the differences in the changes of the detection signals of the multiple contact sensors, thereby adjusting the relative tilt of the substrate mounting portion and the substrate to maintain the hand.

Claims

1. A substrate handling robot, characterized in that, have: A substrate holding hand, or a detection fixture that holds the substrate or mimics the substrate; The contact sensor detects the hand contact between the substrate or the detection fixture and the substrate during the transport operation of the substrate or the detection fixture relative to the substrate mounting portion. A tilt adjustment mechanism adjusts the tilt of the base plate to maintain the hand's tilt; and The control unit, based on the detection signal from the contact sensor, activates the tilt adjustment mechanism to adjust the relative tilt of the substrate mounting part and the substrate to maintain the hand's position.

2. The substrate handling robot according to claim 1, characterized in that, The contact sensors are configured in multiple ways. The control unit adjusts the relative tilt of the substrate mounting part and the substrate to maintain the hand's position based on the differences in the changes of the detection signals of the multiple contact sensors.

3. The substrate handling robot according to claim 1, characterized in that, The contact sensor includes at least one of the following sensors: a hand sensor, disposed on the substrate holding hand, for detecting the contact state between the substrate and the substrate holding hand; and a fixture sensor, disposed on the detection fixture, for detecting the contact state between the detection fixture and the substrate holding hand. A mounting sensor is disposed on the substrate mounting portion, and by detecting the contact state between the substrate mounting portion and the substrate or the detection fixture, the sensor detects the state in which the substrate or the detection fixture maintains hand contact with the substrate.

4. The substrate handling robot according to claim 3, characterized in that, The contact sensor includes at least three of the hand sensors. The hand sensor is configured at at least three different positions in the position where the hand holds the substrate and abuts against the substrate.

5. The substrate handling robot according to claim 4, characterized in that, The substrate retains the hand's bifurcation shape, with the end portion divided into two parts. The hand sensor includes: an end-part sensor, one of which is disposed on each of the two-part end-parts held in the hand by the substrate; and a base-end sensor, disposed on the base end.

6. The substrate handling robot according to claim 3, characterized in that, The contact sensor includes at least three of the fixture sensors. The fixture sensor is configured in at least three different positions within the detection fixture: a position where it contacts the substrate by hand, and a position where it contacts the substrate mounting portion.

7. The substrate handling robot according to claim 1, characterized in that, The substrate and the detection fixture have a circular plate shape. The contact sensor is configured in at least three parts, and one part is configured corresponding to each position that divides the circumference into three parts, relative to the periphery of the substrate or the detection fixture which has a circular plate shape.

8. The substrate handling robot according to claim 2, characterized in that, The control unit obtains a detection value along an axis in the vertical direction based on the detection signal from the contact sensor, thereby adjusting the relative tilt of the substrate mounting part and the substrate to maintain the hand's position.

9. The substrate handling robot according to claim 1, characterized in that, The tilt adjustment mechanism includes: Lower component; The upper component is configured to be opposite the lower component in the vertical direction; Three spherical sliding bearings are disposed between the lower and upper components at different locations when viewed from above and below; and Two height adjustment mechanisms are respectively provided corresponding to two of the three spherical sliding bearings. Based on the detection signal from the contact sensor, the control unit adjusts the tilt of the upper component relative to the lower component via the height position adjustment mechanism, thereby adjusting the relative tilt of the substrate mounting part and the substrate to maintain the hand position.

10. The substrate handling robot according to claim 1, characterized in that, The substrate holding hand includes multiple fork-tooth components, each holding the substrate or the detection fixture. The substrate handling robot also includes a fork tooth retaining part connected to the plurality of fork tooth components. The control unit activates the tilt adjustment mechanism based on the detection signal from the contact sensor to adjust the tilt of the fork tooth holding part, thereby adjusting the relative tilt of the substrate mounting part and the substrate holding hand.

11. The substrate handling robot according to claim 1, characterized in that, Based on the detection signal from the contact sensor, the control unit adjusts the relative tilt angle between the substrate mounting part, which is configured in the heat treatment apparatus for heat treatment of the substrate, and the substrate to maintain the hand position.

12. A control method for a substrate handling robot, characterized in that, During the transport of a substrate or a detection fixture that mimics the substrate relative to a substrate mounting portion, it is detected that the substrate or the substrate of the detection fixture remains in contact with the hand. Based on a detection signal that detects the contact state between the substrate holding hand and the substrate or the detection fixture, a tilt adjustment mechanism that adjusts the tilt of the substrate holding hand is activated, thereby adjusting the relative tilt of the substrate mounting portion and the substrate holding hand.

13. The control method for the substrate handling robot according to claim 12, characterized in that, By acquiring detection signals from multiple contact sensors, the system detects whether the substrate maintains contact between the hand and the substrate or the detection fixture. Based on the differences in the changes of the detection signals of the multiple contact sensors, the tilt adjustment mechanism is activated to eliminate the differences in the changes of the detection signals of the multiple contact sensors, thereby adjusting the relative tilt of the substrate mounting portion and the substrate to maintain the hand.

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