Polishing carrier and flyer detection method

Abstract

The invention relates to the technical field of semiconductor polishing, in particular to a polishing carrier and a flyer detection method.The polishing carrier comprises a carrier body, the carrier body comprises a first base and a second base which are stacked, and the second base is used for bearing a to-be-polished piece; the detection part is arranged on the second seat and located on the outer side of the range covered by the first seat; the detection assembly comprises a laser sensor, and the detection assembly is arranged on the outer side of the carrier body, located above the detection part and used for monitoring the displacement change of the detection part in the direction perpendicular to the plane where the to-be-polished piece is located. The technical problem that the flyer condition cannot be accurately identified and timely coped in the polishing process is solved, and the technical effect of accurately identifying and timely coping the flyer condition is achieved.

Description

Technical Field

[0001] This application relates to the field of semiconductor polishing technology, and in particular to a polishing carrier and a method for detecting flyer wafers. Background Technology

[0002] Polishing plays an important role in semiconductor processing. Polishing can achieve a mirror finish on the wafer and improve its flatness; it can also remove, to some extent, the damage caused to the wafer surface by the previous process.

[0003] In existing technologies, polishing discs are prone to cracking or fragmentation during the polishing process due to uneven pressure or inherent properties. Once cracking or fragmentation occurs, the adhesion between the polishing head and the disc is disrupted. As the polishing head rotates, the disc fragments are easily flung out by centrifugal force, resulting in "flying discs." These flung fragments remain on the polishing disc, potentially damaging other polishing heads, requiring immediate machine shutdown and removal. Currently, addressing this flying disc issue requires periodic manual observation or real-time monitoring by a vision module. This reliance on human intervention or the potential for errors in vision module analysis hinders accurate identification and timely response to flying disc situations.

[0004] Therefore, the technical problem with existing technology is that it cannot accurately identify and respond to the problem of flying blades during the polishing process. Summary of the Invention

[0005] This application provides a polishing carrier and a method for detecting fly-off pieces, which solves the technical problem of not being able to accurately identify and respond to fly-off pieces during the polishing process, and achieves the technical effect of accurately identifying and responding to fly-off pieces.

[0006] On the one hand, the polishing carrier provided in this application adopts the following technical solution: A polishing carrier, comprising: The carrier body includes a first seat and a second seat stacked together, the second seat being used to support the wafer to be polished; The detection unit is disposed on the second seat and located outside the area covered by the first seat; and The detection component includes a laser sensor disposed on the outside of the carrier body and above the detection unit, for monitoring the displacement change of the detection unit in a direction perpendicular to the plane where the wafer to be polished is located.

[0007] Preferably, the detection unit is located on the outer surface of the second seat, and the detection unit is arranged in a planar manner.

[0008] Preferably, multiple detection units and multiple laser sensors are provided, with each detection unit corresponding to one of the multiple laser sensors.

[0009] Preferably, the plurality of detection units are centrally symmetrically distributed about the rotation center of the movable seat.

[0010] Preferably, the plurality of laser sensors are centrally symmetrically distributed about the rotation center of the movable seat.

[0011] Preferably, the detection component further includes a pressure sensor for monitoring air pressure changes within the sealed first cavity formed between the first seat and the second seat.

[0012] Preferably, the pressure sensor is housed within the first cavity.

[0013] On the other hand, the method for detecting fly-offs in a polishing carrier provided in this application adopts the following technical solution: A method for detecting flyer chips includes the following steps: The maximum displacement fluctuation Hmax of the detection unit in the direction perpendicular to the plane where the piece to be polished is located is set; The displacement value H of the detection unit in the direction perpendicular to the plane where the piece to be polished is located is monitored in real time; Determine whether the detected displacement value H is equal to the maximum displacement fluctuation value Hmax; If H > Hmax, then it is determined that the wafer to be polished has experienced a wafer fly-off.

[0014] As a preferred option, it also includes: Set the maximum air pressure fluctuation value Pmax in the first chamber and the maximum displacement fluctuation value Hmax of the detection unit in the direction perpendicular to the plane where the piece to be polished is located; The air pressure value P in the first cavity and the displacement value H of the detection unit in the direction perpendicular to the plane where the piece to be polished are located are monitored in real time. The monitored air pressure value P is compared with the maximum air pressure fluctuation value Pmax, and the displacement value H is compared with the maximum displacement fluctuation value Hmax. If P>Pmax and H>Hmax, then it is determined that the wafer to be polished has experienced a wafer fly-off.

[0015] As a preferred option, it also includes: if H≤Hmax and P>Pmax, then it is determined that no flying chip situation has occurred.

[0016] In summary, this application includes at least one of the following beneficial technical effects: In this application, the first and second seats of the polishing carrier are movably connected, forming a first cavity between them. By pressurizing the first cavity and applying pressure to the second seat, the movable connection between the first and second seats absorbs the fluctuations generated during the polishing process and ensures that the polished discs are subjected to stable pressure, thus reducing the occurrence of fly-off discs. The air pressure fluctuations in the first cavity are monitored by a detection component, and timely feedback is provided when fly-off discs are detected, allowing for corresponding shutdown measures. This solves the technical problem of accurately identifying and responding to fly-off discs during the polishing process, achieving the technical effect of accurately identifying and responding to fly-off discs.

[0017] The first and second bearings slide perpendicular to the plane of the polishing pad via a linear bearing. This not only absorbs the fluctuations generated during polishing and improves the polishing quality of the polished pad, but also guides the displacement direction of the second bearing, ensuring that it can only move vertically and not horizontally, thus preventing tilting. This gives the second bearing greater rigidity to resist the overturning moment exerted by the polishing pad, reduces the angle between the second bearing and the polishing pad, and lowers the possibility of the polished pad flying out between the second bearing and the polishing pad.

[0018] The detection component monitors the air pressure in the first chamber and the displacement of the detection unit. By comprehensively judging whether the ejector disc has flown out through the above two sets of monitoring indicators, the accuracy of detecting ejector disc flight is improved.

[0019] The pressure plate in the second chamber abuts against the soft base pad. By filling the second chamber with pressure, the soft base pad is inflated and can be evenly pressed onto the upper surface of the pressure plate. The pressure is transmitted from the pressure plate to the polishing sheet, and the pressure distribution is uniform with no eccentric load, thus improving the flatness of the polishing sheet. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the polishing carrier described in this application; Figure 2 , 3 yes Figure 1 A sectional view; Figure 4 yes Figure 3 Enlarged view of A in the middle; Figure 5 yes Figure 3 Enlarged view of B in the middle; Figure 6 This is a schematic diagram of the first process of the fly-out detection method for the polishing carrier described in this application; Figure 7 This is a schematic diagram of the second process for the fly-out detection method of the polishing carrier described in this application.

[0021] Explanation of reference numerals in the attached drawings: 100, first seat; 110, first air passage; 120, first cavity; 130, first connecting part; 140, limiting groove; 200, second seat; 210, second seat body; 211, second air passage; 212, fixing ring; 220, soft base pad; 230, pressure plate; 240, second cavity; 250, second connecting part; 300, connecting assembly; 310, linear bearing; 400, sealing assembly; 410, sealing ring; 500, limiting assembly; 510, limiting part; 600, detection assembly; 610, laser sensor; 620, detection part; W, polishing plate; M, polishing pad. Detailed Implementation

[0022] The serial numbers assigned to components in this document, such as "first" and "second," are used solely to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages). It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used solely for the convenience of describing this application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0023] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] This application provides a polishing carrier and a method for detecting fly-off pieces, which solves the technical problem of not being able to accurately identify and respond to fly-off pieces during the polishing process, and achieves the technical effect of accurately identifying and responding to fly-off pieces.

[0025] To better understand the above technical solutions, a detailed description of the technical solutions will be provided below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit the scope of this application.

[0026] This application proposes a polishing carrier, such as Figure 1 As shown, the polishing carrier has the effect of reducing the flying off of the polishing blade W or providing timely feedback after it flies off. The polishing carrier includes a carrier body and a detection component 600. The carrier body is used to adsorb the polishing blade W and serve as the polishing head during the polishing process. The detection component 600 is used to detect whether the polishing blade W has flown off.

[0027] The main body of the carrier, such as Figure 1 , 2 As shown, the carrier body is used to adsorb the polishing disc W, which serves as the polishing head during the polishing process. The carrier body includes a first seat 100, a second seat 200, a connecting component 300, a sealing component 400, and a limiting component 500; the first seat 100 and the second seat 200 are stacked together to form the carrier body; the second seat 200 is used to connect the polishing disc W; the connecting component 300 is used to connect the first seat 100 and the second seat 200, allowing them to move between each other; the sealing component 400 is used to seal the interior of the first seat 100 and the second seat 200; and the limiting component 500 is used to limit the displacement between the second seat 200 and the first seat 100.

[0028] The first one is 100, such as Figure 2 , 3 As shown, the first seat 100 and the second seat 200 are stacked together to form the carrier body. The first seat 100 is located directly above the second seat 200. The interior of the first seat 100 is recessed, so that the first seat 100 and the second seat 200 are stacked and connected to form a first cavity 120 between the first seat 100 and the second seat 200. A first air passage 110 is provided on the first seat 100, which communicates with the first cavity 120. The first air passage 110 can pressurize or depressurize the first cavity 120, so that the air pressure in the first cavity 120 is adjustable. It can be understood that the top of the rotation center of the first seat 100 is connected to a rotating shaft. By rotating, the first seat 100 and the second seat 200 are driven to rotate, thereby driving the throwing plate W to rotate. In one embodiment, the first air passage 110 is opened in the rotating shaft.

[0029] The second one is 200, such as Figure 2-4As shown, the second seat 200 and the first seat 100 are stacked together to form the carrier body, and the second seat 200 is used to connect the spade W. The second seat 200 is located directly below the first seat 100. The outer ring of the first seat 100 has a first connecting portion 130, and the outer ring of the second seat 200 has a second connecting portion 250. The first connecting portion 130 covers the outer ring of the second connecting portion 250. The second seat 200 is connected to the bottom surface of the first seat 100 through a connecting component 300, thereby forming a first cavity 120 between the first seat 100 and the second seat 200. The sealing of the first cavity 120 is ensured by providing a sealing component 400 between the first seat 100 and the second seat 200. The second seat 200 includes a main body, a soft base pad 220, and a pressure plate 230. The main body of the second seat 200 is connected to the bottom of the first seat 100 via a connecting assembly 300. The bottom surface of the main body of the second seat 200 has a concave surface, which is evenly distributed on the bottom surface of the main body of the second seat 200 and is centrally symmetrical about the rotation center of the second seat 200 to improve the uniformity of pressure applied to the throwing plate W. The soft base pad 220 covers the bottom of the main body of the second seat 200, that is, the soft base pad 220 covers the concave surface, so that a second cavity 240 is formed between the soft base pad 220 and the concave surface. The main body of the second seat 200 has a second air passage 211, through which air is supplied to the first seat 100. The two chambers 240 are pressurized or depressurized to adjust the pressure on the polishing plate W. In one embodiment, the second air passage 211 is opened at the rotation center of the main body of the second seat 200 and passes through the rotating shaft through a connector. The pressure plate 230 is located below the soft base pad 220 and is used to connect the polishing plate W. It is worth noting that the bottom edge of the main body of the second seat 200 has a fixing ring 212 and the pressure plate 230 is located in the inner ring of the fixing ring 212. In this way, the soft base pad 220 expands under pressure and acts evenly on the pressure plate 230. The pressure plate 230 acts on the polishing plate W, making the pressure on the polishing plate W more uniform. In one embodiment, the pressure plate 230 can be a ceramic disc.

[0030] It is worth noting that in the chemical mechanical polishing process of polishing plate W, there are generally two mainstream processing methods: one is to use one or more air pressure chambers to apply pressure to polishing plate W through air bags, and the other is to use a ceramic disc as a medium to apply pressure to polishing plate W. From a practical application perspective, both methods have some drawbacks. The surface of the polished wafer W, produced by airbag pressure polishing, often exhibits a wavy morphology, making it difficult to achieve high flatness requirements. Due to its high rigidity and flatness, the ceramic disc undergoes minimal deformation during the polishing process, and the morphology of the polished wafer W can, to some extent, "imprint" its quality. However, it can also lead to significant differences in the amount of material removed in the circumferential direction of the polished wafer W due to a certain degree of eccentricity in the force applied to the ceramic disc, or over-polishing or under-polishing of the edges of the polished wafer due to the inability to adjust the pressure distribution at the edges of the polished wafer W. In this application, the soft base pad 220 expands under pressure and acts uniformly on the pressure plate 230. The pressure transmitted to the silicon wafer through the pressure plate 230 is uniformly distributed with almost no eccentricity, thereby ensuring the high flatness quality of the polished wafer.

[0031] Connection component 300, such as Figure 2 , 3 As shown, the connecting component 300 is used to connect the first seat 100 and the second seat 200. The connecting component 300 is positioned between the first seat 100 and the second seat 200, allowing the first seat 100 and the second seat 200 to move together. By pressurizing or depressurizing the first cavity 120, the force exerted by the fixing ring 212 of the second seat 200 on the polishing pad M can be adjusted. Conversely, when the air pressure in the first cavity 120 remains constant, during the polishing process, the upward displacement of the second seat 200 can compress the air pressure in the first cavity 120, thereby increasing the air pressure in the first cavity 120. Specifically, the connecting component 300 is positioned between the bottom surface of the first seat 100 and the top surface of the second seat 200, allowing the second seat 200 to move relative to the first seat 100, thereby causing changes in the volume of the first cavity 120 or changes in the air pressure within the first cavity 120.

[0032] In one embodiment, the second seat 200 is slidably connected to the bottom surface of the first seat 100 via a connecting component 300, and the sliding direction is perpendicular to the plane where the piece to be fired W is located, i.e., in the vertical direction. Thus, the second seat 200 can be displaced vertically relative to the first seat 100. In one embodiment, the connecting component 300 is a linear bearing 310, which is connected between the bottom surface of the first seat 100 and the top surface of the second seat 200. There are multiple linear bearings 310, which are centrally symmetrically distributed about the rotation center of the carrier body. Thus, under the action of the linear bearings 310... This design enables the second seat 200 to move vertically relative to the first seat 100, absorbing the fluctuations caused by polishing during the polishing process. It also restricts the second seat 200 from moving horizontally or tilting relative to the first seat 100, guiding the direction of the second seat 200's displacement so that it can only move vertically and cannot move horizontally to avoid tilting. The second seat 200 has greater rigidity to resist the overturning moment exerted by the polishing pad M on the second seat 200, reducing the angle formed between the second seat 200 and the polishing pad M, and reducing the possibility of the polishing disc W flying out between the second seat 200 and the polishing pad M.

[0033] Based on the above, the second seat 200 and the first seat 100 are movably connected by a linear bearing 310. On the one hand, the telescopic structure can absorb the fluctuations caused during the polishing process. On the other hand, it also limits the tilt angle between the second seat 200 and the polishing pad M, reducing the possibility of the polishing disc W flying out. Even if the polishing disc W flies out from between the second seat 200 and the polishing pad M, the second seat 200 is raised at the moment the polishing disc W flies out, causing the gas in the first cavity 120 to be compressed and form fluctuations. Such air pressure fluctuations are used to characterize whether the polishing disc W has flown out and to provide feedback.

[0034] Sealing component 400, such as Figure 3 , 5As shown, the sealing assembly 400 is used to seal the first cavity 120. The outer ring of the first seat 100 has a first connecting portion 130, and the outer ring of the second seat 200 has a second connecting portion 250. The first connecting portion 130 covers the outer ring of the second connecting portion 250. A sealing assembly 400 is disposed between the first connecting portion 130 and the second connecting portion 250. The sealing assembly 400 includes a sealing ring 410. The sealing ring 410 is arranged such that its center is located at the rotation center of the carrier body. The sealing ring 410 is embedded in the first connecting portion 130, and the sealing ring 410 abuts and fits against the second connecting portion 250 at all points, so that the first cavity 120 is sealed. In one embodiment, the sealing ring 410 is embedded in the second connecting portion 250, and the sealing ring 410 abuts and fits against the first connecting portion 130 at all points, so that the first sealing ring 410 is sealed. During the displacement of the second seat 200, the sealing ring 410 can also maintain contact with the second connecting portion 250 at all points, thereby maintaining the sealing of the first cavity 120.

[0035] Limiting component 500, such as Figure 2 , 3As shown, the limiting component 500 is used to limit the displacement between the second seat 200 and the first seat 100. The limiting component 500 is connected between the first seat 100 and the second seat 200, and the maximum distance between the first seat 100 and the second seat 200 is limited by the limiting component 500, that is, the maximum space of the first cavity 120 is limited. In this embodiment, a limiting groove 140 is formed on the bottom surface of the first seat 100. The limiting component 500 includes a limiting part 510, which is located within the first cavity 120 and is fixedly connected to the top surface of the second seat body 210. The limiting part 510 is accommodated in the limiting groove 140 and is used to abut against the limiting groove 140, thereby restricting the movement of the second seat 200 relative to the first seat 100. The limiting groove 140 has a space for the limiting part 510 to move in a direction perpendicular to the plane where the piece to be fired W is located. That is, when the limiting part 510 is located in the limiting groove 140, the limiting part 510 can move one distance in the vertical direction, so that the first cavity 120 has a maximum or minimum space. In one embodiment, the limiting groove 140 is formed on the top surface of the second seat body 210. 0. The limiting component 500 includes a limiting part 510, which is located in the first cavity 120 and fixedly connected to the top surface of the first seat 100. The limiting part 510 is accommodated in the limiting groove 140 and is used to abut against the limiting groove 140, thereby restricting the movement of the second seat 200 relative to the first seat 100. The limiting groove 140 has a space for the limiting part 510 to move in a direction perpendicular to the plane of the piece to be thrown W. That is, when the limiting part 510 is located in the limiting groove 140, the limiting part 510 can move one distance in the vertical direction, so that the first cavity 120 has the maximum or minimum space. In other embodiments, there are multiple limiting components 500 and corresponding limiting grooves 140, all of which are centrally symmetrically arranged about the rotation center of the carrier body.

[0036] Detection component 600, such as Figure 2 , 3 As shown, the detection component 600 is used to detect whether the throwing piece W has experienced a flying piece situation. The detection component 600 includes a pressure sensor and a laser sensor 610; the pressure sensor is used to monitor the air pressure change in the first cavity 120; the laser sensor 610 is used to monitor the position change of the second seat 200.

[0037] A pressure sensor is used to monitor changes in air pressure within the first cavity 120. The pressure sensor is located inside the first cavity 120 and monitors air pressure fluctuations in real time. When the second seat 200 moves relative to the first seat 100, the air pressure in the first cavity 120 increases due to the upward movement of the second seat 200; conversely, the air pressure decreases due to the downward movement of the second seat 200. In one embodiment, multiple pressure sensors are evenly distributed within the first cavity 120, all used to monitor and provide feedback on air pressure fluctuations within the first cavity 120. Thus, during polishing, if the polishing disc W flies out from between the second seat 200 and the polishing pad M, due to the thickness of the polishing disc W, the edge of the second seat 200 will inevitably be lifted by the polishing disc W, causing the gas in the first cavity 120 to be compressed, resulting in an increase in air pressure within the first cavity 120.

[0038] A laser sensor 610 is used to monitor the positional changes of the second seat 200. The laser sensor 610 is disposed outside the carrier body and is used to monitor the displacement fluctuations of the second seat 200. The second seat 200 has a detection unit 620, which is located outside the area covered by the first seat 100, i.e., the detection unit 620 is located on the outer surface of the second seat 200 and is planar. Furthermore, the laser sensor 610 is positioned directly above the detection unit 620, which is the object of detection by the laser sensor 610. The laser sensor 610 monitors the positional fluctuations of the detection unit 620 in real time. When the second seat 200 moves relative to the first seat 100, the position of the detection unit 620 rises with the second seat 200, and the laser sensor 610 detects this upward displacement. In one embodiment, there are multiple detection units 620 and detection components 600, with one-to-one correspondence between the detection units 620 and the detection components 600, and they are centrally symmetrically distributed about the rotation center of the carrier. Each detection component 600 is used to detect the position fluctuation of the corresponding detection unit 620 and provide feedback. Thus, during the polishing process, if the polishing disc W flies out from between the second seat 200 and the polishing pad M, due to the thickness of the polishing disc W itself, the edge of the second seat 200 will inevitably be lifted up by the polishing disc W and float upward. The position of the detection unit 620 floats up with the second seat 200, and the laser sensor 610 detects the upward displacement of the position of the detection unit 620.

[0039] The detection component 600 monitors the air pressure fluctuation in the first cavity 120 and the position fluctuation of the detection part 620 in the second seat 200 in real time. The two sets of monitoring indicators are mutually verified, so as to obtain a more accurate judgment on whether a flying piece has appeared or not.

[0040] This application also provides a method for detecting fly-off in a polishing carrier, used to detect whether fly-off occurs during the polishing process. The fly-off detection method includes: setting a maximum air pressure fluctuation P within the first cavity 120. max Real-time monitoring of the air pressure value P in the first chamber 120; comparison of the monitored air pressure value P with the maximum air pressure fluctuation value P. max If P > P max This indicates that the piece is flying off the plate (W). Figure 6 As shown, specifically: S1: The maximum air pressure fluctuation value in the first chamber 120 is preset to P. max The maximum pressure fluctuation is P max It is set relative to the original filling pressure value P0 of the first chamber 120, and P max If, during the polishing process, the original pressure value P0 of the first chamber 120 needs to be adjusted to P1, then the corresponding maximum air pressure fluctuation value also needs to be adjusted accordingly. max1 It is understandable that P max A certain error range can also be set; S2: During the polishing process, the pressure sensor monitors the air pressure value P in the first chamber 120 in real time; S3: Determine the difference between the monitored air pressure value P and the maximum air pressure fluctuation value P. max : S31: If P≤P max The air pressure in the first chamber 120 is below the maximum air pressure fluctuation value, that is, the air pressure in the first chamber 120 is kept within the normal range. The upward displacement of the second seat 200 is insufficient to throw out the throwing piece W, so it is judged that no flying piece situation has occurred. S32: If P > P max If the air pressure in the first chamber 120 is above the maximum air pressure fluctuation value, that is, the air pressure in the first chamber 120 is outside the normal range, and the second seat 200 is displaced upward or tilted enough to throw out the polishing disc W, it is judged that a flying disc has occurred, and the polishing equipment needs to be stopped to remove the flying disc W.

[0041] Furthermore, such as Figure 7 As shown, the fly-off detection method further includes: setting the maximum displacement fluctuation H of the detection unit 620 in the direction perpendicular to the plane where the fly-off piece W is located. max ; Real-time monitoring of the displacement value of the detection unit 620 in the direction perpendicular to the plane where the piece to be polished W is located; Determining the difference between the monitored displacement value H and the maximum displacement fluctuation value H. max If H > H max And P > P max The judgment is that the ejector plate W has a flying plate situation; specifically: S1 ’ The maximum displacement fluctuation of the detection unit 620 is preset to H.max The displacement direction is perpendicular to the plane containing the piece W to be ejected, i.e., in the vertical direction; it can be understood that H max A certain error range can also be set; S2 ’ During the polishing process, the laser sensor 610 monitors the displacement value H of the detection unit 620 in real time; S3 ’ : Determine the monitored displacement value H and the maximum displacement fluctuation value as H max ; S31 ’ If H≤H max The displacement value of the detection unit 620 is below the maximum displacement fluctuation value, that is, the position of the detection unit 620 is kept within the normal range. The upward displacement of the second unit 200 is insufficient to throw out the throwing piece W, so it is judged that no flying piece situation has occurred. S32 ’ If H > H max If the displacement value of the detection unit 620 is above the maximum displacement fluctuation value, that is, the position of the detection unit 620 is outside the normal range, and the second seat 200 is displaced upward or tilted enough to throw out the polishing piece W, it is judged that a flying piece has occurred, and the polishing equipment needs to be stopped to remove the flying polishing piece W.

[0042] In one embodiment, the pressure fluctuation detection process of the first cavity 120 and the displacement fluctuation detection process of the detection unit 620 are performed simultaneously. The two detection indicators are used to comprehensively determine whether a flying disc situation has occurred, that is, when H > H max And P > P max Only then was it determined that the piece was flying off the plate (W).

[0043] In other embodiments, when the displacement of the detection unit 620 is the same, and H≤H max In the case where the second chamber 200 is vertically displaced upwards as a whole, compared to when it tilts, the compression of the first chamber 120 is greater, meaning the pressure increase within the first chamber 120 is larger. This triggers feedback from the pressure sensor, i.e., H ≤ H. max And P > P max At this point, it is determined that there is no flying piece, but rather a false trigger caused by the vibration of the polishing disc or the overall vibration of the polishing head, thus improving the accuracy of flying piece detection.

[0044] Working principle / steps: The pressure inside the first cavity 120 acts on the edge of the second seat 200, and the edge of the second seat 200 acts downward on the polishing pad M to prevent the polishing disc W from flying out. The second seat 200 and the first seat 100 are movably connected by a linear bearing 310, which is used to absorb a certain amount of vibration during the polishing process and guide the movement of the first seat 100. The second seat 200 has greater rigidity to resist the overturning moment exerted by the polishing pad M on the second seat 200, reduce the angle formed between the second seat 200 and the polishing pad M, and reduce the possibility of the polishing disc W flying out from between the second seat 200 and the polishing pad M.

[0045] The detection component 600 monitors the air pressure fluctuation in the first cavity 120 and the position fluctuation of the detection unit 620 of the second seat 200 in real time. The air pressure value P in the first cavity 120 is monitored in real time, and the monitored air pressure value P is compared with the maximum air pressure fluctuation value P. max ; Real-time monitoring of the displacement value of the detection unit 620 in the direction perpendicular to the plane where the piece to be polished W is located; Determining the difference between the monitored displacement value H and the maximum displacement fluctuation value H. max The two sets of monitoring indicators are cross-validated to obtain a more accurate judgment on whether or not fly-through particles have appeared.

[0046] Technical effects: 1. In this application, the first seat 100 and the second seat 200 of the polishing carrier are movably connected, forming a first cavity 120 between them. By pressurizing the first cavity 120 and applying it to the second seat 200, the movable connection structure between the first seat 100 and the second seat 200 absorbs the fluctuations generated during the polishing process, and makes the polishing blade W subject to stable pressure, thus reducing the occurrence of flying blades. The detection component 600 monitors the air pressure fluctuations in the first cavity 120, and promptly provides feedback when it is determined that flying blades have occurred, and takes corresponding shutdown measures. This solves the technical problem of not being able to accurately identify and respond to flying blades in a timely manner during the polishing process, and achieves the technical effect of accurately identifying and responding to flying blades in a timely manner.

[0047] 2. The first seat 100 and the second seat 200 slide perpendicular to the plane of the polishing piece W through a linear bearing 310. This not only absorbs the fluctuations generated during the polishing process and improves the polishing quality of the polishing piece W, but also guides the displacement direction of the second seat 200, so that the second seat 200 can only move in the vertical direction and cannot move in the horizontal direction to avoid tilting. In this way, the second seat 200 has greater rigidity to resist the overturning moment exerted by the polishing pad M on the second seat 200, reduce the angle formed between the second seat 200 and the polishing pad M, and reduce the possibility of the polishing piece W flying out from between the second seat 200 and the polishing pad M.

[0048] 3. The detection component 600 monitors the air pressure in the first chamber 120 and the displacement of the detection unit 620. By comprehensively judging whether the ejector plate W has flown out through the above two sets of monitoring indicators, the accuracy of detecting whether the ejector plate W has flown out is improved.

[0049] 4. The pressure plate 230 in the second seat 200 abuts against the soft base pad 220. By filling the second cavity 240 with pressure, the soft base pad 220 can be evenly pressed on the upper surface of the pressure plate 230 after being inflated. The pressure is transmitted from the pressure plate 230 to the polishing sheet W, and the pressure distribution is uniform with no eccentric load, thus improving the flatness of the polishing sheet W.

[0050] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0051] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A polishing carrier, characterized in that, include: The carrier body includes a first seat (100) and a second seat (200) stacked together, the second seat (200) being used to carry the wafer (W) to be fired. The detection unit (620) is disposed on the second seat (200) and located outside the area covered by the first seat (100); and The detection component (600) includes a laser sensor (610) disposed on the outside of the carrier body and above the detection unit (620), for monitoring the displacement change of the detection unit (620) in a direction perpendicular to the plane of the piece to be polished (W).

2. The polishing carrier according to claim 1, characterized in that, The detection unit (620) is located on the outer surface of the second seat (200), and the detection unit (620) is arranged in a planar manner.

3. The polishing carrier according to claim 1, characterized in that, Multiple detection units and multiple laser sensors are provided, with each detection unit corresponding to one of the multiple laser sensors.

4. A polishing carrier according to claim 3, characterized in that, The plurality of detection units are centrally symmetrically distributed about the rotation center of the movable seat.

5. A polishing carrier according to claim 4, characterized in that, The multiple laser sensors are centrally symmetrically distributed about the rotation center of the movable seat.

6. A polishing carrier according to claim 1, characterized in that, The detection component (600) further includes a pressure sensor for monitoring pressure changes within a sealed first cavity (120) formed between the first seat (100) and the second seat (200).

7. A polishing carrier according to claim 6, characterized in that, The pressure sensor is housed within the first cavity (120).

8. A method for detecting flyer chips, characterized in that, Includes the following steps: The maximum displacement fluctuation Hmax of the detection unit (620) in the direction perpendicular to the plane where the piece to be polished (W) is located is set; The displacement value H of the detection unit (620) in the direction perpendicular to the plane where the piece to be polished (W) is located is monitored in real time; Determine whether the detected displacement value H is equal to the maximum displacement fluctuation value Hmax; If H > Hmax, then it is determined that the wafer to be polished (W) has experienced a wafer fly-off.

9. The method for detecting flyer wafers according to claim 8, characterized in that, Also includes: Set the maximum air pressure fluctuation value Pmax in the first cavity (120) and the maximum displacement fluctuation value Hmax of the detection unit (620) in the direction perpendicular to the plane where the piece to be polished (W) is located; Real-time monitoring of the air pressure value P in the first cavity (120) and the displacement value H of the detection unit (620) in the direction perpendicular to the plane where the piece to be polished (W) is located; The monitored air pressure value P is compared with the maximum air pressure fluctuation value Pmax, and the displacement value H is compared with the maximum displacement fluctuation value Hmax. If P>Pmax and H>Hmax, then it is determined that the wafer to be polished (W) has experienced a wafer fly-off.

10. The method for detecting flyer wafers according to claim 9, characterized in that, Also includes: If H≤Hmax and P>Pmax, then it is determined that no flying chip situation has occurred.

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