Polishing pad loss detection method and device, electronic equipment and storage medium
By obtaining the attribute information and real-time torque value of the polishing pad, the problem of inaccurate polishing pad replacement caused by manual observation is solved, ensuring wafer quality and consumable utilization efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-30
- Publication Date
- 2026-03-24
AI Technical Summary
In existing technologies, the need to adjust the dressing pressure or replace the polishing pad is determined by manually observing the surface condition of the polishing pad. This method is easily affected by factors such as ambient light, leading to inaccurate judgments and affecting the quality of wafer processing.
By acquiring the attribute information of the polishing pad, setting a preset replacement threshold and a preset pressure value, the dresser applies downward pressure to the polishing pad according to the preset pressure value, and acquires the ideal torque value and the actual torque value in real time. Based on the difference in torque value, the wear degree of the polishing pad is judged and an early warning is issued.
This technology enables accurate determination of whether polishing pads need to be replaced without stopping the machine, thus avoiding surface glazing, ensuring wafer processing quality, and reducing material waste.
Smart Images
Figure CN121715976A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor manufacturing technology, and more specifically to a method, apparatus, electronic device, and storage medium for detecting polishing pad loss. Background Technology
[0002] The polishing pad dressing mechanism is an important component of the Chemical Mechanical Polishing (CMP) system. During the processing of polishing pads based on the dresser, the glazing phenomenon on the surface of the polishing pad will become more and more serious without adjusting the pressure of the dresser, which will affect the processing quality of the wafer. Therefore, accurately determining the timing of polishing pad replacement has become a key research topic.
[0003] In related technologies, the surface condition of the polishing pad is usually observed manually to determine whether the polishing pad needs to be adjusted or replaced. However, this method is easily affected by factors such as ambient light and is highly subjective, which can lead to surface glazing of the polishing pad and consequently make it impossible to guarantee the processing quality of the wafer. Summary of the Invention
[0004] This application provides a polishing pad wear detection method, apparatus, electronic device, and storage medium to at least solve the problem in the related art where manual judgment of whether the polishing pad needs to be replaced leads to inaccurate judgment and affects the quality of wafer processing.
[0005] This application provides a method for detecting polishing pad wear, including: Obtain the property information of the polishing pad; wherein, the property information includes a first preset replacement threshold and a preset pressure value; The preset pressure value is sent to the dresser so that the dresser applies downward pressure to the polishing pad according to the preset pressure value in order to dress the polishing pad. Obtain the ideal torque value of the polishing pad when the dresser applies downward pressure; During the polishing process of the polishing pad on the wafer, the actual torque value of the polishing pad when the dresser applies downward pressure is obtained; The first wear degree of the polishing pad is determined based on the actual torque value and the ideal torque value; If the first wear level is greater than the first preset replacement threshold, the polishing pad is determined to be a polishing pad to be replaced, and an early warning is issued.
[0006] This application also provides a polishing pad wear detection device, comprising: The first acquisition module is used to acquire the attribute information of the polishing pad; wherein, the attribute information includes a first preset replacement threshold and a preset pressure value; The sending module is used to send a preset pressure value to the dresser, so that the dresser applies downward pressure to the polishing pad according to the preset pressure value to dress the polishing pad; The second acquisition module is used to acquire the ideal torque value of the polishing pad when the dresser applies downward pressure; The third acquisition module is used to acquire the actual torque value of the polishing pad when the dresser applies downward pressure during the polishing process of the polishing pad on the wafer. The determination module is used to determine the wear rate of the polishing pad based on the actual torque value and the ideal torque value; The early warning module is used to determine that the polishing pad is to be replaced and issue an early warning when the wear level is greater than the first preset replacement threshold.
[0007] A polishing pad dressing system includes: a polishing pad, a dresser, and electronic equipment; Polishing pads are used to polish wafers; The dresser dresses the polishing pad by applying downward pressure to it; The electronic device uses the steps of any of the above-mentioned polishing pad wear detection methods to perform wear detection on the polishing pad.
[0008] This application also provides an electronic device, including: a memory for storing a computer program; and a processor for executing the computer program to implement the steps of any of the above-described polishing pad wear detection methods.
[0009] This application also provides a computer-readable storage medium storing a computer program, wherein when the computer program is executed by a processor, it implements the steps of any of the above-described polishing pad wear detection methods.
[0010] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of any of the above-described polishing pad wear detection methods.
[0011] By means of this application, a first preset replacement threshold and a preset pressure value are determined based on the attribute information of the polishing pad. The dresser applies downward pressure to the polishing pad according to the preset pressure value, and at the same time, the ideal torque value is obtained. During the polishing process of the polishing pad on the wafer, the actual torque value is obtained. Based on the actual torque value and the ideal torque value, the first wear degree of the polishing pad is determined. If the first wear degree is greater than the first preset replacement threshold, the polishing pad is determined to be a polishing pad to be replaced and an early warning is issued. By directly obtaining the actual torque value during the polishing process, it is possible to accurately determine whether the polishing pad needs to be replaced based on the first wear degree, avoid the surface glazing phenomenon of the polishing pad, and ensure the processing quality of the wafer. Attached Figure Description
[0012] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0013] Figure 1 This is a schematic diagram of the network structure upon which the embodiments of this application are based; Figure 2 A schematic flowchart illustrating the polishing pad wear detection method provided in this application embodiment; Figure 3 A schematic diagram illustrating the interaction between an exemplary dresser and a polishing pad, provided for embodiments of this application; Figure 4 A schematic diagram illustrating the relationship between the usage time of the polishing pad and the downward pressure at the correction end, provided for embodiments of this application; Figure 5 A schematic diagram of an exemplary polishing pad wear detection method provided in an embodiment of this application; Figure 6 A schematic diagram illustrating the relationship between ideal torque values and static torque values is provided for embodiments of this application. Figure 7 This is a schematic diagram of the polishing pad wear detection device provided in the embodiments of this application; Figure 8 This is a schematic diagram of the polishing pad dressing system provided in an embodiment of this application; Figure 9 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation
[0014] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.
[0015] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.
[0016] The polishing pad dressing mechanism is a crucial component of a CMP system, playing a vital role in extending the lifespan of polishing pads and obtaining silicon wafers with superior surface polishing quality during silicon wafer polishing. The surface flatness and roughness of the polishing pads significantly impact the processing. During processing, the polishing pad surface must be dressed by a polishing pad dresser to restore the used polishing pads to an active roughness value. Under the mechanical friction between the polishing pad and the dresser, without adjusting the downward pressure at the dressing end, the glazing phenomenon on the polishing pad surface will become increasingly severe, affecting the dressing quality. Adjusting the downward pressure according to the rotation torque of the dressing end can ensure both wafer processing quality and efficiency while reducing waste of consumables such as polishing pads and extending their lifespan.
[0017] In related technologies, the polishing pad treatment process on the machine employs a method of applying a fixed downward pressure to the treatment end of the dresser. However, with increased usage time, the treatment effect on the polishing pad deteriorates, affecting the wafer material removal rate. Furthermore, the method only allows manual observation of the polishing pad surface when the machine is stopped to determine whether the downward pressure of the treatment end needs adjustment or the polishing pad needs to be replaced. This approach has poor reliability and is prone to significant errors.
[0018] To address the aforementioned technical problems, this application provides a polishing pad wear detection method, apparatus, electronic device, and storage medium. The method includes: acquiring attribute information of the polishing pad; wherein the attribute information includes a first preset replacement threshold and a preset pressure value; sending the preset pressure value to a dresser, causing the dresser to apply downward pressure to the polishing pad according to the preset pressure value to dress the polishing pad; acquiring an ideal torque value of the polishing pad when the dresser applies downward pressure; acquiring the actual torque value of the polishing pad when the dresser applies downward pressure during the polishing process of the polishing pad on the wafer; determining a first wear degree of the polishing pad based on the actual torque value and the ideal torque value; and determining the polishing pad as a polishing pad to be replaced and issuing a warning if the first wear degree is greater than the first preset replacement threshold. The method provided by the above scheme determines a first preset replacement threshold and a preset pressure value based on the attribute information of the polishing pad. The dresser applies downward pressure to the polishing pad according to the preset pressure value, and at the same time, obtains the ideal torque value. During the polishing process of the polishing pad on the wafer, the actual torque value is obtained. Based on the actual torque value and the ideal torque value, the first wear degree of the polishing pad is determined. If the first wear degree is greater than the first preset replacement threshold, the polishing pad is determined to be a polishing pad to be replaced, and an early warning is issued. By directly obtaining the actual torque value during the polishing process, it is possible to accurately determine whether the polishing pad needs to be replaced based on the first wear degree, avoid the surface glazing phenomenon of the polishing pad, and ensure the processing quality of the wafer.
[0019] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0020] The specific application environment architecture or specific hardware architecture on which the polishing pad wear detection method depends is described here.
[0021] First, the network structure on which this application is based will be explained: The polishing pad wear detection method, apparatus, electronic device, and storage medium provided in this application are applicable to determining whether a polishing pad needs to be replaced. Figure 1 The diagram shown illustrates the network structure upon which this application embodiment is based, primarily including a polishing pad under test, a data acquisition device, and a polishing pad wear detection device. The data acquisition device is used to acquire the attribute information of the polishing pad, and the polishing pad wear detection device is used to determine whether the polishing pad needs to be replaced based on the polishing pad wear detection method provided in this application embodiment.
[0022] This application provides a method for detecting polishing pad wear, used to determine whether the polishing pad needs to be replaced. The execution subject of this application embodiment is an electronic device, such as a server, desktop computer, laptop computer, tablet computer, and other electronic devices that can be used for polishing pad wear detection.
[0023] like Figure 2 The diagram shown is a flowchart illustrating a polishing pad wear detection method provided in an embodiment of this application. The method includes: Step 201: Obtain the property information of the polishing pad.
[0024] The attribute information includes a first preset replacement threshold and a preset pressure value.
[0025] Specifically, the first preset replacement threshold represents the determination that the current polishing pad needs to be replaced when the machine is not stopped. The preset pressure value is the downward pressure applied to the polishing pad by the dresser at the initial moment.
[0026] Step 202: Send the preset pressure value to the dresser so that the dresser applies downward pressure to the polishing pad according to the preset pressure value in order to dress the polishing pad.
[0027] Step 203: Obtain the ideal torque value of the polishing pad when the dresser applies downward pressure.
[0028] Specifically, in the initial state, where the polishing pad, wafer, and dresser are all brand new, the equipment is started, causing the polishing pad to polish the wafer while the dresser dresses the polishing pad. At this point, all three are in motion and the machine is not stopped. At the initial moment of startup, a torque sensor acquires the torque value, which is the ideal torque value. When the polishing pad and dresser slide against each other, sliding friction is generated between the contact surfaces. Based on the characteristics of sliding friction, when a fixed downward pressure is applied by the dressing end, the friction generated between the dressing end and the polishing pad due to rotation is constant. Therefore, the torque generated by the dressing end is ideally constant, meaning the ideal torque value is fixed.
[0029] Correspondingly, by directly obtaining specific torque values through sensors, the timing of polishing pad replacement can be determined more accurately.
[0030] Step 204: During the polishing process of the polishing pad on the wafer, obtain the actual torque value of the polishing pad when the dresser applies downward pressure.
[0031] Specifically, during the polishing process of the polishing pad polishing the wafer, the polishing pad, the wafer, and the dresser are all in motion. The actual torque value is obtained in real time through the torque sensor and the actual torque value is smoothed.
[0032] Step 205: Determine the first wear degree of the polishing pad based on the actual torque value and the ideal torque value.
[0033] Step 206: If the first wear level is greater than the first preset replacement threshold, determine that the polishing pad is a polishing pad to be replaced and issue an early warning.
[0034] Specifically, the difference between the actual torque value and the ideal torque value is the first wear level of the polishing pad. The first wear level characterizes the current wear status of the polishing pad when the machine is not stopped. If the wear status exceeds a first preset replacement threshold, it indicates that the polishing pad needs to be replaced. The warning signals include graphic warning signals and audible and visual warning signals.
[0035] Accordingly, the wear degree of the polishing pad is characterized by a first loss metric. By determining whether the first loss degree exceeds a first preset replacement threshold, the timing of polishing pad replacement is determined more accurately. Simultaneously, by directly acquiring torque values through sensors, the influence of factors such as ambient light on the judgment process is reduced, enabling the detection of the polishing pad's condition without shutting down the machine.
[0036] For example, such as Figure 3The diagram shows an exemplary structural relationship between a dresser and a polishing pad provided in an embodiment of this application. The dresser applies downward pressure to the polishing pad according to a preset pressure value. Torque and pressure values are obtained through a torque sensor and a pressure sensor. In the non-stop state, the dresser, polishing pad, and wafer rotate in a preset direction and at a certain speed, causing the polishing pad to polish the wafer. The actual torque value is obtained in real time through a torque sensor. During wafer polishing, the wear status of the polishing pad is monitored in real time, and a first wear level is used to determine whether replacement is necessary. In the stopped state, the dresser and polishing pad rotate in a preset direction and at the same speed. The wear status of the polishing pad is monitored, and a second wear level is used to determine whether replacement is necessary.
[0037] Specifically, in one embodiment, when the polishing pad does not polish the wafer, the static torque value of the polishing pad when the dresser applies downward pressure is obtained; based on the static torque value and the ideal torque value, a second wear degree of the polishing pad is determined; if the second wear degree is greater than a second preset replacement threshold, the polishing pad is determined to be a polishing pad to be replaced, and an early warning is issued.
[0038] The first preset replacement threshold is greater than the second preset replacement threshold.
[0039] Specifically, the second preset replacement threshold indicates whether the polishing pad needs to be replaced during the shutdown state, and the second wear level indicates the wear status of the polishing pad during the shutdown state. When the polishing pad is not polishing the wafer, it is in a shutdown state; the wafer stops moving, but the polishing pad and dresser are still in motion. The static torque value is obtained through a torque sensor, and the difference between the static torque value and the ideal torque value is the second wear level. If the second wear level is greater than the second preset replacement threshold, it indicates that the polishing pad needs to be replaced; therefore, the polishing pad is determined to be a polishing pad to be replaced. Warning signals include graphic warning signals and audible and visual warning signals.
[0040] In the process of polishing the wafer with a polishing pad without stopping the machine, a chemical solution is used. The chemical solution reduces the friction between the polishing pad and the wafer, affecting the judgment of polishing pad replacement. In order to reduce the interference of normal fluctuations of the chemical solution on the judgment, the first preset replacement threshold is greater than the second preset replacement threshold.
[0041] Accordingly, the degree of wear of the polishing pad is characterized by the second degree of wear. By determining whether the second degree of wear is greater than the second preset replacement threshold, the timing of the polishing pad replacement can be determined more accurately.
[0042] Specifically, in one embodiment, the usage time of the polishing pad is obtained; based on the usage time of the polishing pad, a preset pressure value is adjusted so that the dressing device applies downward pressure to the polishing pad according to the adjusted preset pressure value.
[0043] Specifically, as the polishing pad is used for longer periods, its surface roughness continuously decreases. With the same downward pressure applied to the dressing end, the torque at the dressing end continuously decreases. Therefore, it is necessary to increase the downward pressure at the dressing end to maintain the dressing effect of the dresser, preserve the roughness of the polishing pad, and prevent a decrease in processing efficiency.
[0044] Specifically, in one embodiment, the preset pressure value can be adjusted based on the following formula:
[0045] Where P represents the adjusted preset pressure value, k represents the ratio coefficient between pressure and usage time, and T represents the usage time of the polishing pad. This indicates the preset pressure value before adjustment.
[0046] Specifically, the downward pressure applied by the dresser to the polishing pad is dynamically adjusted based on the pad's usage time. Assume the pressure gradient at the dressing end is set to... The polishing pad usage time gradient is set to .
[0047] The ratio of pressure to usage time is determined based on the following formula:
[0048] The preset pressure value before adjustment is determined based on the following formula:
[0049] Accordingly, by dynamically adjusting the downward pressure according to the duration, the dressing effect of the dresser is maintained, and the roughness of the polishing pad is preserved, preventing a decrease in processing efficiency.
[0050] For example, such as Figure 4 The diagram illustrates the relationship between the polishing pad's usage time and the downward pressure at the correction end, as provided in an embodiment of this application. When the system is not stopped for testing, it is integrated into the CMP system and operates simultaneously with the CMP system. When the dresser dresses the polishing pad, it automatically calculates the downward pressure to be applied at the correction end based on the polishing pad's usage time. The actual torque value at the correction end is measured while the dresser is operating. The difference between the actual torque value and the ideal torque value, i.e., the first wear degree, is calculated. This first wear degree is compared with a first preset replacement threshold. If the first wear degree is greater than the first preset replacement threshold, a graphic or audible / visual alarm signal is issued to remind the user to replace the polishing pad, and corresponding wafer protection measures are taken.
[0051] Specifically, in one embodiment, during the polishing process of the polishing pad on the wafer, the rotation speed value of the polishing pad is obtained; when the polishing pad is not polishing the wafer, the polishing pad is controlled to rotate according to the rotation speed value.
[0052] Specifically, to more accurately determine the usage of the polishing pad in the stopped state, it is necessary to simulate the rotational speed in the active state even when the machine is stopped. The rotational speed of the polishing pad is obtained in the active state, while in the stopped state, the polishing pad rotates at the original rotational speed.
[0053] Correspondingly, by continuing to rotate at the original speed even when the machine is stopped, the dynamic working state in the non-stop state is effectively simulated, avoiding the distortion of the surface state caused by a complete shutdown, thereby improving the accuracy of the judgment.
[0054] Based on the above embodiments, as an implementable approach, in one embodiment, a preset pressure value is sent to the dresser, so that the dresser applies downward pressure to the polishing pad according to the preset pressure value to dress the polishing pad, including: Step 2021: Obtain the actual pressure value of the polishing pad when the dresser applies downward pressure; Step 2022: If the actual pressure value is less than the preset pressure value, determine the compensation pressure value based on the difference between the actual pressure value and the preset pressure value. Step 2023: Determine a new preset pressure value based on the compensation pressure value and the preset pressure value; Step 2024: Send the new preset pressure value to the dresser so that the dresser applies downward pressure to the polishing pad according to the new preset pressure value to dress the polishing pad.
[0055] Specifically, when the dresser applies downward pressure to the polishing pad, due to mechanical reasons, the downward pressure of the dresser does not reach the preset downward pressure value. Therefore, the actual pressure value is obtained by the pressure sensor, and a compensation pressure value is determined based on the difference between the preset pressure value and the actual pressure value. Based on the compensation pressure value, a new preset pressure value is determined, and the dresser applies downward pressure to the polishing pad according to the new preset pressure value.
[0056] Accordingly, by compensating for the pressure value, the dresser applies downward pressure to the polishing pad according to the preset pressure value.
[0057] For example, such as Figure 5The diagram shown is a schematic representation of an exemplary polishing pad wear detection method provided in this application embodiment. During detection, the system first uses a calibration dressing end to apply downward pressure, ensuring the applied pressure reaches the target pressure. Simultaneously, under ideal conditions, when the rotational speeds of the dressing end and the polishing table remain constant, the dressing end applies downward pressure, and the ideal rotational torque of the dressing end is measured. Then, on polishing pads with different usage durations, the downward pressure applied by the dressing end is continuously increased from a preset pressure value until the rotational torque of the dressing end reaches the ideal torque value, at which point the corresponding data for the polishing pad usage duration and the dressing end downward pressure are recorded.
[0058] For example, such as Figure 6 The diagram illustrates the relationship between an exemplary ideal torque value and a static torque value provided in this embodiment of the application. During shutdown testing, the static torque value of the dressing end is obtained by setting the rotational speed and pressure parameters during calibration on the polishing table and the dressing end. In actual operation, the static torque value is less than the ideal torque value. The difference between the static torque value and the ideal torque value is calculated, which is the second wear rate. The second wear rate is compared with a second preset replacement threshold. If the second wear rate is greater than the second preset replacement threshold, a graphic or audible / visual alarm signal is issued to remind the user to replace the polishing pad, maintaining a stable removal rate and avoiding premature replacement of consumables due to misjudgment, thus preventing waste. Here, Y represents the torque value, and X represents time.
[0059] The polishing pad wear detection method provided in this application includes: acquiring attribute information of the polishing pad; wherein the attribute information includes a first preset replacement threshold and a preset pressure value; sending the preset pressure value to a dresser so that the dresser applies downward pressure to the polishing pad according to the preset pressure value to dress the polishing pad; acquiring the ideal torque value of the polishing pad when the dresser applies downward pressure; acquiring the actual torque value of the polishing pad when the dresser applies downward pressure during the polishing process of the polishing pad on the wafer; determining a first wear degree of the polishing pad based on the actual torque value and the ideal torque value; and determining the polishing pad as a polishing pad to be replaced and issuing an early warning if the first wear degree is greater than the first preset replacement threshold. The method provided by the above scheme determines a first preset replacement threshold and a preset pressure value based on the attribute information of the polishing pad. The dresser applies downward pressure to the polishing pad according to the preset pressure value, and at the same time, obtains the ideal torque value. During the polishing process of the polishing pad on the wafer, the actual torque value is obtained. Based on the actual torque value and the ideal torque value, the first wear degree of the polishing pad is determined. If the first wear degree is greater than the first preset replacement threshold, the polishing pad is determined to be a polishing pad to be replaced, and an early warning is issued. By directly obtaining the actual torque value during the polishing process, it is possible to accurately determine whether the polishing pad needs to be replaced based on the first wear degree, avoid the surface glazing phenomenon of the polishing pad, and ensure the processing quality of the wafer.
[0060] Furthermore, by directly acquiring specific torque values through sensors, the timing of polishing pad replacement is determined more accurately. A first loss metric characterizes the degree of polishing pad wear; by determining whether the first loss metric exceeds a first preset replacement threshold, the timing of polishing pad replacement is more accurately determined. Simultaneously, directly acquiring torque values through sensors reduces the influence of factors such as ambient light during the judgment process, enabling polishing pad condition detection without stopping the machine. A second loss metric characterizes the degree of polishing pad wear; by determining whether the second loss metric exceeds a second preset replacement threshold, the timing of polishing pad replacement is more accurately determined. Dynamically adjusting the downward pressure based on time maintains the dressing effect of the dresser and preserves the roughness of the polishing pad, preventing a decrease in processing efficiency. By continuing to rotate at the original speed even when the machine is stopped, the dynamic working state in the active state is effectively simulated, avoiding surface distortion caused by complete machine shutdown, thereby improving the accuracy of judgment. By compensating for the pressure value, the dresser applies downward pressure to the polishing pad according to a preset pressure value.
[0061] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.
[0062] Embodiments of this application also provide a polishing pad wear detection device for performing the polishing pad wear detection method provided in the above embodiments.
[0063] like Figure 7 The diagram shown is a schematic representation of the polishing pad wear detection device provided in an embodiment of this application. The polishing pad wear detection device 70 includes: a first acquisition module 701, a sending module 702, a second acquisition module 703, a third acquisition module 704, a determination module 705, and an early warning module 706.
[0064] The system comprises the following modules: a first acquisition module for acquiring attribute information of the polishing pad, including a first preset replacement threshold and a preset pressure value; a sending module for sending the preset pressure value to the dresser, so that the dresser applies downward pressure to the polishing pad according to the preset pressure value to dress the polishing pad; a second acquisition module for acquiring the ideal torque value of the polishing pad when the dresser applies downward pressure; a third acquisition module for acquiring the actual torque value of the polishing pad when the dresser applies downward pressure during the polishing process of the polishing pad on the wafer; a determination module for determining the wear degree of the polishing pad based on the actual torque value and the ideal torque value; and a warning module for determining that the polishing pad is a polishing pad to be replaced and issuing a warning when the wear degree is greater than the first preset replacement threshold.
[0065] For a description of the features in the embodiment corresponding to the polishing pad wear detection device, please refer to the relevant description of the embodiment corresponding to the polishing pad wear detection method, which will not be repeated here.
[0066] Embodiments of this application also provide a polishing pad wear detection system for performing the polishing pad wear detection method provided in the above embodiments.
[0067] like Figure 8 The diagram shown is a structural schematic of the polishing pad wear detection system provided in an embodiment of this application. The polishing pad dressing system includes a polishing pad, a dresser, and electronic equipment.
[0068] Among them, the polishing pad is used to polish the wafer; the dresser dresses the polishing pad by applying downward pressure; the electronic device performs wear detection on the polishing pad by adopting the steps of any of the above polishing pad wear detection methods.
[0069] Embodiments of this application also provide an electronic device, such as... Figure 9 The diagram shown is a schematic diagram of the structure of an electronic device provided in an embodiment of this application, including a processor 10 and a memory 20. The memory 20 stores a computer program, and the processor 10 is configured to run the computer program to execute the steps in any of the above-described polishing pad wear detection method embodiments.
[0070] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above embodiments of the polishing pad wear detection method when running.
[0071] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.
[0072] Embodiments of this application also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in any of the above embodiments of the polishing pad wear detection method.
[0073] Embodiments of this application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps in any of the above embodiments of the polishing pad wear detection method.
[0074] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.
[0075] The above provides a detailed description of a polishing pad wear detection method, apparatus, electronic device, and storage medium provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only intended to help understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.
Claims
1. A method of detecting a loss of a polishing pad, characterized by, The method comprises: acquiring attribute information of the polishing pad; wherein the attribute information comprises a first preset replacement threshold and a preset pressure value; sending the preset pressure value to the trimmer, so that the trimmer applies a downward pressure to the polishing pad according to the preset pressure value to trim the polishing pad; acquiring an ideal torque value of the polishing pad when the trimmer applies a downward pressure; acquiring an actual torque value of the polishing pad when the trimmer applies a downward pressure during polishing of the wafer by the polishing pad; determining a first degree of loss of the polishing pad according to the actual torque value and the ideal torque value; if the first degree of loss is greater than the first preset replacement threshold, determining that the polishing pad is a polishing pad to be replaced, and performing a warning.
2. The method of claim 1, wherein The method further comprises: acquiring a static torque value of the polishing pad when the trimmer applies a downward pressure when the polishing pad is not polishing the wafer; determining a second degree of loss of the polishing pad according to the static torque value and the ideal torque value; if the second degree of loss is greater than a second preset replacement threshold, determining that the polishing pad is a polishing pad to be replaced, and performing a warning; wherein the first preset replacement threshold is greater than the second preset replacement threshold.
3. The method of claim 1, wherein The method further comprises: acquiring a use duration of the polishing pad; adjusting the preset pressure value according to the use duration of the polishing pad, so that the trimmer applies a downward pressure to the polishing pad according to the adjusted preset pressure value.
4. The method of claim 3, wherein The adjustment of the preset pressure value according to the use duration of the polishing pad, so that the trimmer applies a downward pressure to the polishing pad according to the adjusted preset pressure value, comprises: adjusting the preset pressure value based on the following formula: wherein P represents a preset pressure value after adjustment, k represents a proportional coefficient of pressure and usage time length, T represents the usage time length of the polishing pad, represents a preset pressure value before adjustment.
5. The method of claim 1, wherein The method further comprises: acquiring a rotational speed value of the polishing pad during polishing of the wafer by the polishing pad; controlling the polishing pad to rotate at the rotational speed value when the polishing pad is not polishing the wafer.
6. The method of claim 1, wherein The sending of the preset pressure value to the trimmer, so that the trimmer applies a downward pressure to the polishing pad according to the preset pressure value to trim the polishing pad, comprises: acquiring an actual pressure value of the polishing pad when the trimmer applies a downward pressure; if the actual pressure value is less than the preset pressure value, determining a compensation pressure value according to the difference between the actual pressure value and the preset pressure value; determining a new preset pressure value according to the compensation pressure value and the preset pressure value; sending the new preset pressure value to the trimmer, so that the trimmer applies a downward pressure to the polishing pad according to the new preset pressure value to trim the polishing pad.
7. A polishing pad wear detection apparatus characterized by comprising: The device comprises: a first acquisition module for acquiring attribute information of the polishing pad; wherein the attribute information comprises a first preset replacement threshold and a preset pressure value; a sending module for sending the preset pressure value to the trimmer, so that the trimmer applies a downward pressure to the polishing pad according to the preset pressure value to trim the polishing pad; a second acquisition module for acquiring an ideal torque value of the polishing pad when the trimmer applies a downward pressure; A third obtaining module is configured to obtain an actual torque value of the polishing pad when the polisher exerts a pressure on the polishing pad during polishing of a wafer by the polishing pad; A determining module is configured to determine a wear degree of the polishing pad according to the actual torque value and the ideal torque value; An early warning module is configured to determine that the polishing pad is a polishing pad to be replaced and perform early warning when the wear degree is greater than the first preset replacement threshold.
8. A polishing pad conditioning system characterized by, The system comprises a polishing pad, a polisher and an electronic device; The polishing pad is configured to polish a wafer; The polisher is configured to trim the polishing pad by exerting a pressure on the polishing pad; The electronic device adopts the polishing pad wear detection method according to any one of claims 1 to 6 to perform wear detection on the polishing pad.
9. An electronic device, comprising: comprises: a memory configured to store a computer program; a processor configured to implement the steps of the polishing pad wear detection method according to any one of claims 1 to 6 when executing the computer program.
10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores a computer program, and the computer program is executed by the processor to implement the steps of the polishing pad wear detection method according to any one of claims 1 to 6.