Glass ceramic degumming temperature control process method

Abstract

The invention discloses a glass ceramic degumming temperature control process method and belongs to the technical field of glass ceramic processing. The method comprises the following steps: bonding microcrystalline glass on a workpiece structural plate and cutting; glass remaining on the workpiece plate is taken down in a water boiling degumming mode; the water temperature is slowly increased from 10 DEG C to 55 DEG C through steam or electric heating, the temperature increasing process is controlled within 30-35 minutes, and the water temperature is made to be uniform through stirring or gas bubbling; after the temperature reaches 55 DEG C, the constant temperature is kept for 10-15 minutes, so that the adhesive is fully softened to realize degumming; and then slowly adding cold water, reducing the water temperature to normal temperature within 30-35 minutes, synchronously opening an overflow port to maintain the water level constant in the cooling process, and continuously stirring or bubbling to ensure uniform cooling. By accurately controlling the heating and cooling rate and the temperature uniformity, the glass ceramics are effectively prevented from being broken due to sudden change of thermal stress, and the degumming yield is remarkably improved.

Description

Technical Field

[0001] This invention belongs to the field of microcrystalline glass processing technology, and specifically relates to a temperature control process for debonding microcrystalline glass. Background Technology

[0002] Currently, slurry wire cutting or diamond wire cutting are the mainstream cutting methods in the cutting and processing of microcrystalline glass. Before cutting, the microcrystalline glass must be bonded and fixed to the workpiece plate, and then the assembly is placed on the cutting equipment for cutting. After the cutting process is completed, the microcrystalline glass remaining on the workpiece structural plate needs to be successfully removed. However, the traditional water boiling debonding process has obvious technical defects. Because microcrystalline glass is extremely sensitive to temperature changes, if the temperature change rate is too fast, it will inevitably lead to uneven release of internal stress in the glass, eventually causing the glass to crack, which makes it difficult to reliably guarantee product quality.

[0003] Therefore, there is an urgent need for a debonding method that can achieve precise temperature control in order to effectively prevent the microcrystalline glass from cracking during the debonding process and significantly improve the product qualification rate.

[0004] Several invention patents exist to address the problem of uneven stress release and cracking of microcrystalline glass due to rapid temperature changes during the debonding process. For example, patent CN117464850A discloses a method for cutting microcrystalline glass. This method involves moving the microcrystalline glass horizontally under the drive of a clamping unit and cutting it in contact with a cutting wire mesh, wherein the swing angle formed by the swing motion of the microcrystalline glass does not exceed 6°. This method incorporates a swinging process, which can reduce the cutting gap on the microcrystalline glass cutting surface, maintain the flatness of the cutting surface, increase the yield rate, shorten the cutting time, and improve production capacity. However, this patent does not address the temperature control issue during microcrystalline glass debonding, leaving a potential risk of cracking due to uneven stress release caused by rapid temperature changes during the debonding process. Patent CN114940582A discloses a glass sheet processing method for preparing fluorophosphate glass sheets. During the degumming process, the glass sheet to be degummed is immersed in a degumming solution, which is heated to a temperature within the range of 60-100°C and maintained at this temperature for 5-20 minutes to degumme the glass sheet. This method allows for the complete degumming of over 90% of the glass sheet. Furthermore, because the degumming solution is heated only after the glass sheet is immersed, there are virtually no drastic temperature fluctuations during the entire degumming process, effectively preventing the fluorophosphate glass sheet from cracking, reducing material loss, and improving material utilization. However, this patent focuses on fluorophosphate glass sheets and does not address the temperature control issues during the degumming of microcrystalline glass.

[0005] In summary, the existing technology has the following main drawbacks: 1. Rapid temperature changes during the debonding process of microcrystalline glass lead to uneven stress release and cracking, making it difficult to guarantee product quality. Secondary drawbacks include: 2. Traditional boiling debonding processes cannot precisely control temperature changes, failing to prevent microcrystalline glass from cracking due to rapid temperature fluctuations. 3. Existing technologies lack a temperature control method that can gradually increase the temperature to the debonding temperature and stabilize it for a certain period, thus failing to effectively prevent microcrystalline glass cracking. 4. Existing technologies lack a process for gradual cooling after debonding, failing to prevent microcrystalline glass from cracking due to sudden temperature drops. 5. Existing processes do not clearly define the impact of heating and cooling rates on microcrystalline glass. 6. Existing technologies cannot precisely control the temperature change curve during the debonding process of microcrystalline glass, making it difficult to guarantee product qualification rates. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a temperature control process for debonding microcrystalline glass. The present invention effectively avoids the cracking of microcrystalline glass due to sudden thermal stress by precisely controlling the heating and cooling rate and temperature uniformity, and significantly improves the yield of debonded products.

[0007] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: A temperature-controlled process for debonding microcrystalline glass, comprising the following steps: Step 1: Adhere the microcrystalline glass to the workpiece structure plate and cut the microcrystalline glass; Step 2: Remove the microcrystalline glass remaining on the workpiece structural plate after cutting by boiling it in water to remove the glue. Step 3: Determine if the water temperature in the tank has reached the degumming temperature; Step 4: If the water temperature reaches the debonding temperature, maintain the temperature for a period of time to allow the microcrystalline glass to separate from the workpiece structural plate. Step 5: Gradually cool down the water by adding cold water.

[0008] Preferably, the workpiece structure plate is an L-shaped structure plate, and the cutting is a longitudinal cutting.

[0009] Preferably, in step two, the water tank is heated by steam or electric heating, and the water temperature is gradually increased to 55°C.

[0010] Preferably, the opening degree of the steam valve or the current of the electric heater is controlled by the PID regulation of the PLC and the temperature controller to precisely control the heating rate of the water.

[0011] Preferably, during the gradual increase of water temperature, the temperature is raised from an initial temperature of 10°C, and the water is tumbled by stirring or introducing gas bubbles to ensure uniform water temperature.

[0012] Preferably, the process of gradually increasing the water temperature takes 30 to 35 minutes.

[0013] Preferably, in step four, maintaining the temperature at a constant temperature for a period of time specifically means maintaining a constant temperature at 55°C for 10 to 15 minutes.

[0014] Preferably, in step five, cold water is slowly added so that the water temperature drops to room temperature within 30 to 35 minutes.

[0015] Preferably, the overflow outlet of the water tank is opened when cold water is added to ensure that the total amount of water remains constant.

[0016] Preferably, during the gradual cooling process, the water is stirred or bubbled with gas to ensure that the water temperature is uniform throughout the body.

[0017] The present invention can achieve the following beneficial effects: This method first involves bonding microcrystalline glass to an L-shaped workpiece structural plate. The microcrystalline glass is then longitudinally cut using a diamond wire cutter. Following this, a water-boiling debonding process is employed to remove the remaining glass from the workpiece structural plate intact. Throughout the process, the water temperature is precisely controlled, slowly and steadily increasing to 55°C. Once the required debonding temperature is reached, this temperature is maintained for a period of time to allow the adhesive between the glass and the structural workpiece to fully soften, thus facilitating successful debonding. Finally, cold water is gradually added to achieve the final debonding goal through a gradual cooling process, effectively preventing uneven stress release and cracking of the microcrystalline glass caused by rapid temperature changes. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments: Figure 1 This is a comparison chart of the heating time and the number of damages in this invention. Detailed Implementation

[0019] Microcrystalline glass is a novel functional material widely used in 5G, electronics, military, aerospace, optics, and medical fields. Currently, the cutting process for microcrystalline glass mainly employs slurry wire cutting or diamond wire cutting. During the cutting operation, the microcrystalline glass must first be firmly bonded to the workpiece plate, and then the assembly of the workpiece plate and the microcrystalline glass is installed onto the cutting equipment for the cutting operation.

[0020] After the microcrystalline glass has been cut, a crucial step is to safely and intact remove it from the workpiece structure. Traditionally, this is done by boiling it in water to remove the adhesive. However, due to the unique physical properties of microcrystalline glass, if the temperature change rate is too rapid during the debonding process, the internal stress release will be uneven, potentially leading to breakage. Therefore, precisely and effectively controlling the rate of water temperature change is key to preventing breakage of the microcrystalline glass due to abnormal temperature variations.

[0021] To effectively address the aforementioned technical challenges, this invention proposes an innovative solution for precisely controlling water temperature changes. Specifically, the microcrystalline glass is first bonded to the workpiece structural plate. A diamond wire cutter is then used to longitudinally cut the microcrystalline glass. Next, a boiling debonding method is employed to successfully remove the glass remaining on the workpiece structural plate. Throughout the debonding process, the water temperature is precisely controlled and gradually increased to 55°C. Once the predetermined debonding temperature is reached, it is maintained at a stable temperature for a certain period, thereby achieving effective separation of the glass from the structural workpiece. Finally, cold water is gradually added to slowly lower the water temperature, thus preventing the microcrystalline glass from cracking due to excessive temperature fluctuations. The specific implementation is as follows: I. Experimental Objective This experiment aims to study the breakage of glass-ceramics under different heating times in order to evaluate the effect of temperature changes on the stress of glass-ceramics.

[0022] II. Test Samples The test sample consisted of microcrystalline glass measuring 300 mm in length, 150 mm in width, and 10 mm in thickness. Twenty samples of microcrystalline glass were taken for each temperature change.

[0023] III. Test Conditions Temperature range: from 10℃ to 55℃.

[0024] Heating times: 5 minutes, 10 minutes, 15 minutes, 20 minutes, 25 minutes, 30 minutes, 35 minutes, 40 minutes, and 45 minutes respectively.

[0025] IV. Test Methods 1. Place the microcrystalline glass sample in a temperature-measuring water bath and use steam heating to rapidly heat the water.

[0026] 2. By controlling the flow rate of steam, heating is carried out according to the preset heating time and temperature change range.

[0027] 3. Record the damage status of the glass-ceramic at each heating time.

[0028] V. Test Results When the heating time is 5 minutes, the sample damage is as follows: 15 pieces are damaged.

[0029] When the heating time was 10 minutes, the sample damage was as follows: 12 pieces were damaged.

[0030] When the heating time was 15 minutes, the sample damage was as follows: 9 pieces were damaged.

[0031] When the heating time was 20 minutes, the sample damage was as follows: 5 pieces were damaged.

[0032] When the heating time is 25 minutes, the sample damage status is: 1 piece is damaged.

[0033] When the heating time is 30 minutes, the sample damage status is: 0 pieces are damaged.

[0034] When the heating time is 35 minutes, the sample damage status is: 0 pieces are damaged.

[0035] When the heating time is 40 minutes, the sample damage status is: 0 pieces are damaged.

[0036] When the heating time is 45 minutes, the sample damage status is: 0 pieces are damaged.

[0037] VI. Conclusion The test results can be used to determine the breakage trend of glass-ceramics under different heating times. When the temperature difference changes from 10℃ to 55℃ and 45℃, rapid heating within 20 minutes results in severe breakage of the glass-ceramics. When the temperature is increased by 20-30 minutes, the breakage is basically stable, and no breakage occurs after 30 minutes.

[0038] Experiments have shown that rapid heating and cooling can cause microcrystalline glass to break due to rapid stress changes. The purpose of this invention is to overcome the shortcomings of existing processes and provide a method for debonding microcrystalline glass, comprising: Step 1: Bond the microcrystalline glass to the L-shaped workpiece structure plate, and cut the microcrystalline glass longitudinally using a diamond wire cutter. Step 2: Remove the remaining glass from the workpiece structural plate using a water-boiling degumming method. This includes: Step 201: Heat the water tank using steam or electric heating. Use a PLC and a temperature controller's PID control to regulate the heating rate at 1.2-1.5℃ / minute by controlling the proportional valve in the steam pipe or the current of the electric heater.

[0039] Step 202: Use stirring or gas bubbling to make the water roll, ensuring that the heating temperature of the entire water body is uniform. Step 203: Gradually increase the water temperature to 55℃. Start heating from 10℃ and control the heating time to 30 minutes. Slowly increase the temperature to 55℃ at a rate of 1.5℃ / minute to allow the microcrystalline glass to slowly absorb heat and avoid the microcrystalline glass from cracking due to excessive temperature change. Step 204: When the water temperature reaches 55℃, keep the temperature stable for 10 minutes. At this temperature, the adhesive between the microcrystalline glass and the structural workpiece can be fully softened, making it easy to remove the adhesive. Step 205: Remove the glass residue remaining on the workpiece structural plate by boiling it in water to remove the adhesive. Step 3: Determine if the degumming temperature has been reached. If yes, proceed to step 4; otherwise, proceed to step 2. Step 4: Stabilize the temperature for a certain period of time to de-adhere and separate the glass from the structural workpiece; Step 5: Gradually cool down the water by adding cold water, specifically including: Step 501: Slowly add cold water to allow the water temperature to drop to room temperature within 30-35 minutes, cooling it slowly at a rate of 1.5℃ / minute. Step 502: When adding cold water, turn on the overflow to ensure that the total water volume remains unchanged. At the same time, use stirring or gas bubbling to make the water churn and ensure that the temperature of the entire water body drops evenly.

[0040] Step 503: Avoid rapid cooling, which could cause the microcrystalline glass to crack due to excessively rapid temperature changes.

[0041] 1. By precisely controlling the rate of change of water temperature, the problem of uneven stress release and cracking of microcrystalline glass due to excessively rapid temperature changes is avoided, effectively improving the integrity of microcrystalline glass and the product qualification rate; 2. By gradually increasing the water temperature to the debonding temperature and stabilizing it for a certain period of time, the sensitivity of microcrystalline glass to temperature changes is met, allowing it sufficient time to adapt to temperature changes and enabling the internal stress to be released slowly. 3. By gradually cooling down the glass with cold water, damage to the microcrystalline glass during rapid cooling is avoided, ensuring the safety and reliability of the debonding process; 4. Based on the characteristics of microcrystalline glass materials, the temperature control process curve was optimized to meet the stress release requirements of microcrystalline glass during temperature changes, thereby improving debonding efficiency and product quality; 5. This method is simple to operate, low in cost, and easy to implement, providing an effective temperature-controlled debonding method for the microcrystalline glass processing field, and has good application prospects.

[0042] The above embodiments are merely preferred technical solutions of the present invention and should not be considered as limitations on the present invention. The scope of protection of the present invention should be limited to the technical solutions described in the claims, including equivalent substitutions of the technical features described in the claims. That is, equivalent substitutions and improvements within this scope are also within the scope of protection of the present invention.

Claims

1. A temperature-controlled process for debonding microcrystalline glass, characterized in that, Includes the following steps: Step 1: Adhere the microcrystalline glass to the workpiece structure plate and cut the microcrystalline glass; Step 2: Remove the microcrystalline glass remaining on the workpiece structural plate after cutting by boiling it in water to remove the glue. Step 3: Determine if the water temperature in the tank has reached the degumming temperature; Step 4: If the water temperature reaches the debonding temperature, maintain the temperature for a period of time to allow the microcrystalline glass to separate from the workpiece structural plate. Step 5: Gradually cool down the water by adding cold water.

2. The microcrystalline glass debonding temperature control process according to claim 1, characterized in that, The workpiece structure plate is an L-shaped structure plate, and the cutting is a longitudinal cutting.

3. The microcrystalline glass debonding temperature control process according to claim 1, characterized in that, In step two, the water tank is heated by steam or electricity, and the water temperature is gradually increased to 55°C.

4. The microcrystalline glass debonding temperature control process according to claim 3, characterized in that, The opening degree of the steam valve or the current of the electric heater is controlled by the PLC and the PID regulation of the temperature controller to precisely control the heating rate of the water.

5. The microcrystalline glass debonding temperature control process according to claim 3, characterized in that, During the gradual increase of water temperature, the initial temperature of 10°C is raised, and the water is turbulent by stirring or introducing gas bubbles to ensure uniform water temperature.

6. The microcrystalline glass debonding temperature control process according to claim 5, characterized in that, The process of gradually increasing the water temperature takes 30 to 35 minutes.

7. The microcrystalline glass debonding temperature control process according to claim 1, characterized in that, In step four, maintaining the temperature at a constant temperature for a period of time specifically means maintaining a constant temperature of 55°C for 10 to 15 minutes.

8. The microcrystalline glass debonding temperature control process according to claim 1, characterized in that, In step five, slowly add cold water, allowing the water temperature to drop to room temperature within 30 to 35 minutes.

9. The temperature control process for debonding microcrystalline glass according to claim 8, characterized in that, Open the overflow outlet of the water tank when adding cold water to ensure that the total amount of water remains constant.

10. The microcrystalline glass debonding temperature control process according to claim 8, characterized in that, During the gradual cooling process, the water is stirred or bubbled with gas to make it tumble, ensuring that the temperature of the entire water body drops evenly.

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