Light receiving assembly

Abstract

The invention discloses an optical receiving assembly, which comprises a waveguide substrate, a photoelectric detector array and a trans-impedance amplifier, and is characterized in that the photoelectric detector array and the trans-impedance amplifier are arranged on the first surface of the waveguide substrate; an array waveguide grating is arranged in the waveguide substrate, and a wiring pattern layer is arranged on the first surface of the waveguide substrate; the photosensitive surface of the photoelectric detector array faces the first surface of the waveguide substrate, and the photosensitive surface of each photoelectric detector corresponds to each light outlet of the waveguide substrate; the transimpedance amplifier is electrically connected with the photoelectric detector through the wiring pattern layer. According to the invention, the photoelectric detector array and the transimpedance amplifier are arranged on the surface of the waveguide substrate where the array waveguide grating is located, so that the array waveguide grating, the photoelectric detector array and the transimpedance amplifier are located on the same waveguide substrate, thereby effectively reducing the relative position offset between core devices when the temperature changes. The whole optical path is not easy to deform, so that the stability and reliability of the optical receiving assembly are improved.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, specifically to an optical receiving component. Background Technology

[0002] In the field of high-speed optical communication in data centers, optical modules need to meet the requirements of high-capacity and low-cost transmission. Therefore, the optical receiving components at the receiving end often employ wavelength demultiplexing schemes to separate and convert multi-wavelength optical signals. The wavelength demultiplexing devices in the optical receiving components typically use Z-block demultiplexers or arrayed waveguide gratings (AWGs). Due to their lower cost, AWGs have become the mainstream choice for current optical module receivers.

[0003] For optical receiving components employing an arrayed waveguide grating (AWR) scheme, the AWR, photodetector (PD), and transimpedance amplifier (TIA) are typically bonded to a printed circuit board (PCB) using adhesive. Due to the significant differences in the coefficients of thermal expansion among the PCB, adhesive, AWR, and photodetector, the PCB and adhesive are susceptible to deformation due to temperature variations. Temperature fluctuations can cause relative positional shifts between the components, leading to a decrease in optical path alignment accuracy. Summary of the Invention

[0004] This application provides an optical receiving component that can solve the problem that the optical path at the receiving end is easily shifted due to temperature, and has higher stability and reliability.

[0005] Embodiments of this application provide an optical receiving component, including: A waveguide substrate having opposing first and second surfaces, an arrayed waveguide grating being provided within the waveguide substrate, the arrayed waveguide grating including an input waveguide and multiple output waveguides, the first surface having multiple light exit ports, the multiple light exit ports being optically connected to the multiple output waveguides respectively; A photodetector array is disposed on the waveguide substrate, with the photosensitive surface of the photodetector array facing the first surface of the waveguide substrate, and the photosensitive surface of each photodetector corresponding to each of the light-emitting ports. A transimpedance amplifier is disposed on the first surface of the waveguide substrate, and the transimpedance amplifier is electrically connected to the photodetector. The first surface of the waveguide substrate is further provided with a wiring pattern layer, which includes a first pad group, a second pad group and a plurality of conductive traces. Each pad of the first pad group is electrically connected to the corresponding pad in the second pad group through the conductive traces. The photodetector array is flip-mounted on the first pad group to be electrically connected to the first pad group, and the transimpedance amplifier is flip-mounted on the second pad group to be electrically connected to the second pad group.

[0006] In one embodiment of this application, the wiring pattern layer further includes a fan-out trace and a fan-out pad group. The fan-out pad group is arranged along the edge of the waveguide substrate, and the fan-out trace is disposed between the second pad group and the fan-out pad group. A first end of the fan-out trace is connected to a corresponding pad in the second pad group to be electrically connected to the transimpedance amplifier, and a second end of the fan-out trace extends outward toward the edge of the waveguide substrate and is electrically connected to the fan-out pad group.

[0007] In one embodiment of this application, the fan-out trace includes several pairs of fan-out differential lines and multiple fan-out ground lines, with the fan-out ground line corresponding to both sides of each pair of fan-out differential lines.

[0008] In one embodiment of this application, the waveguide substrate has a first end and a second end opposite to each other, the arrayed waveguide grating is relatively close to the first end and disposed between the light emission port and the first end, the fan-out trace is relatively close to the second end, the first pad group and the second pad group are disposed between the light emission port and the fan-out trace, and the first pad group is relatively close to the light emission port.

[0009] In one embodiment of this application, the second surface is provided with a grounding layer, the orthographic projection of the grounding layer on the first surface at least covers the fan-out trace, and a ground return hole is provided between the fan-out ground trace and the grounding layer.

[0010] In one embodiment of this application, the fan-out pad group includes a high-frequency pad and a DC pad. The high-frequency pad is arranged sequentially along the edge of the second end of the waveguide substrate and the side edges on both sides of the second end. The DC pad is located on the side edge and is closer to the transimpedance amplifier than the high-frequency pad. The fan-out trace also includes a DC trace, through which the DC terminal of the transimpedance amplifier is fanned out and electrically connected to the DC pad. The fan-out differential line and the fan-out ground line are respectively connected to the corresponding high-frequency pad.

[0011] In one embodiment of this application, the gap between two adjacent pairs of fan-out differential lines at the second end of the fan-out trace is greater than the gap at the first end of the fan-out trace.

[0012] In one embodiment of this application, the optical receiving component further includes a circuit board, the waveguide substrate is disposed on the circuit board, and the first surface faces away from the circuit board; the fan-out pad group is electrically connected to the circuit board.

[0013] In one embodiment of this application, the circuit board is provided with a third pad group and a high-frequency signal line connected to each other. The third pad group corresponds one-to-one with the pads of the fan-out pad group. The fan-out pad group is electrically connected to the third pad group through bonding leads. The high-frequency signal line includes multiple ground lines and multiple pairs of differential signal lines. The multiple ground lines are arranged side by side, and a pair of differential signal lines is provided between two adjacent ground lines.

[0014] In one embodiment of this application, the waveguide substrate is a silicon substrate or a glass substrate.

[0015] In one embodiment of this application, at least two arrayed waveguide gratings are disposed within the waveguide substrate, and each arrayed waveguide grating is arranged side by side along the width direction of the waveguide substrate; the number of light-emitting ports on the first surface is the same as the number of all output waveguides of the arrayed waveguide gratings and they correspond one-to-one. The optical receiving component includes at least two photodetector arrays and two transimpedance amplifiers. Each photodetector array is arranged along the width direction of the waveguide substrate, and each transimpedance amplifier is arranged along the width direction of the waveguide substrate. Each transimpedance amplifier is electrically connected to a corresponding photodetector array, and each photodetector in each photodetector array receives light output from a corresponding output port.

[0016] The beneficial effects of this application are: the photodetector array and the transimpedance amplifier are disposed on the surface of the waveguide substrate on which the array waveguide grating is located, so that the array waveguide grating, the photodetector array, and the transimpedance amplifier are all on the same waveguide substrate, thereby effectively reducing the relative positional offset between the core components when the temperature changes, and the entire optical path is not easily deformed, thereby improving the stability and reliability of the optical receiving component. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the optical receiving component provided in the embodiments of this application; Figure 2 This is a schematic diagram of optical path propagation provided in an embodiment of this application; Figure 3 This is a schematic diagram of the waveguide grating array provided in the embodiments of this application; Figure 4 This is a schematic diagram of the circuit board connection provided in an embodiment of this application; Figure 5 This is another structural schematic diagram of the optical receiving component provided in the embodiments of this application.

[0019] Explanation of reference numerals in the attached figures: 1. Circuit board; 11. Third pad group; 2. Waveguide substrate; 21. First surface; 211. Light outlet; 22. Second surface; 23. First end; 24. Second end; 3. Arrayed waveguide grating; 31. Input waveguide; 32. Output waveguide; 4. Photodetector array; 5. Transimpedance amplifier; 6. Wiring pattern layer; 61. Fan-out trace; 611. Fan-out differential line; 612. Fan-out ground line; 62. Fan-out pad group; 621. High-frequency pad; 622. DC pad; 63. First pad group; 64. Second pad group; 65. Conductive trace; 7. Bonding wire. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0022] Embodiments of this application provide an optical receiving component, such as... Figure 1 As shown, it includes a waveguide substrate 2, a photodetector array 4, and a transimpedance amplifier 5.

[0023] like Figure 2As shown, the waveguide substrate 2 has a first surface 21 and a second surface 22 opposite to each other, wherein the first surface 21 is used for mounting devices and wiring, and the second surface 22 is used for extending grounding and connecting to other carriers. Figure 3 As shown, the waveguide substrate 2 is provided with an arrayed waveguide grating 3, which is used for demultiplexing optical signals.

[0024] Specifically, such as Figure 3 As shown, each arrayed waveguide grating 3 includes an input waveguide 31 and multiple output waveguides 32. An input waveguide 31 receives mixed light of multiple wavelengths from an external source, and each output waveguide 32 transmits an optical signal corresponding to one channel wavelength. The first surface 21 has multiple exit ports 211, which are optically connected to the multiple output waveguides 32. The optical signal transmitted in each output waveguide 32 is output through its corresponding exit port 211 and incident on the photodetector array 4.

[0025] A photodetector array 4 is disposed on the waveguide substrate 2, with its photosensitive surface facing the first surface 21 of the waveguide substrate 2. The photosensitive surface of each photodetector corresponds to a light outlet 211. The photodetector array 4 is used to receive the optical signal output from the arrayed waveguide grating 3 and convert it into an electrical signal. In this embodiment, the photosensitive surface of the photodetector array 4 is directly aligned with the light outlet 211, eliminating the need for a lens and reducing costs.

[0026] The transimpedance amplifier 5 is disposed on the first surface 21 of the waveguide substrate 2 and is electrically connected to the photodetector. The transimpedance amplifier 5 is used to process the electrical signal output by the photodetector array 4, converting the received weak current signal into a voltage signal that can be processed subsequently.

[0027] The first surface 21 of the waveguide substrate 2 is also provided with a wiring pattern layer 6. For example... Figure 4 As shown, the wiring pattern layer 6 includes a first pad group 63, a second pad group 64, and a plurality of conductive traces 65. Each pad of the first pad group 63 is electrically connected to the corresponding pad in the second pad group 64 through the conductive traces 65.

[0028] The first pad group 63 is adapted for flip-chip soldering of the photodetector array 4, and each pad of the first pad group 63 corresponds to an electrode or pin of the photodetector array 4. The second pad group 64 is adapted for flip-chip soldering of the transimpedance amplifier 5, and each pad of the second pad group 64 corresponds to a signal terminal or power supply pin of the transimpedance amplifier 5.

[0029] Specifically, both the photodetector array 4 and the transimpedance amplifier 5 are flip-chip bonded to the first surface 21 of the waveguide substrate 2. The photodetector array 4 is flip-chip bonded to the first pad group 63 for electrical connection, and the transimpedance amplifier 5 is flip-chip bonded to the second pad group 64 for electrical connection. The photodetector array 4 and the transimpedance amplifier 5 are electrically connected via conductive traces 65 on the first surface 21. This flip-chip bonding method shortens the electrical connection distance between the photodetector array 4 and the transimpedance amplifier 5, avoiding signal loss caused by using bonding wires 7. This solves the problem of significant signal attenuation caused by using bonding wires 7 to connect the transimpedance amplifier 5 and the photodetector array 4. Furthermore, no bonding wires 7 are needed between the photodetector and the transimpedance amplifier 5, eliminating the wire bonding process and effectively improving assembly efficiency.

[0030] In some embodiments, the wiring pattern layer 6 further includes fan-out traces 61 and fan-out pad groups 62, the fan-out pad groups 62 being arranged along the edge of the waveguide substrate 2, for example along the edge of the second end 24 of the waveguide substrate 2 and the side edges.

[0031] The waveguide substrate 2 is connected to the circuit board 1 via a wiring pattern layer 6. The end of the wiring pattern layer 6 closest to the circuit board 1 is electrically connected to the third pad group 11 on the circuit board 1 via a bonding wire 7. The number of pads in the third pad group 11 matches the number of terminals of the cross-group amplifier.

[0032] A fan-out trace 61 is disposed between the second pad group 64 and the fan-out pad group 62. The first end of the fan-out trace 61 is electrically connected to the corresponding pad in the second pad group 64, thereby electrically connecting to the transimpedance amplifier 5 flip-chip mounted on the second pad group 64, realizing the electrical connection between the fan-out trace 61 and the signal output terminal of the transimpedance amplifier 5. The second end of the fan-out trace 61 extends towards the edge of the waveguide substrate 2, forming a signal fan-out. That is, it gradually extends from the densely packed terminal area near the transimpedance amplifier 5 towards the dispersed area at the edge of the waveguide substrate 2, ultimately connecting to the corresponding pad in the fan-out pad group 62.

[0033] In some embodiments, the optical receiving component further includes a circuit board 1, a waveguide substrate 2 disposed on the circuit board 1, and a first surface 21 facing away from the circuit board 1.

[0034] In some embodiments, the circuit board 1 is provided with a third pad group 11 and a high-frequency signal line connected together. The third pad group 11 corresponds one-to-one with the pads of the fan-out pad group 62, and the fan-out pad group 62 is electrically connected to the third pad group 11 via bonding leads 7. The high-frequency signal line includes multiple ground lines and multiple pairs of differential signal lines. The multiple ground lines are arranged side-by-side, and a pair of differential signal lines is provided between two adjacent ground lines to form a GSSG signal transmission line.

[0035] To integrate more signal channels and achieve GSSG signal transmission, thereby reducing signal crosstalk between channels, the output signal terminals of the transimpedance amplifier 5 also include multiple sets of GSSG pins. In multi-channel optical receiver components, to integrate more signal channels, such as eight or even sixteen channels, the spacing between the signal terminals of the transimpedance amplifier 5 is relatively small. However, due to limitations in manufacturing processes, wiring space, and external interface compatibility requirements, the size and channel spacing of the signal traces and pads on the circuit board 1 cannot be matched with the size and spacing of the terminals of the transimpedance amplifier 5. Figure 5 As shown, if bonding wires are directly used to connect the transimpedance amplifier 5 and the circuit board 1, the dimensions and spacing of the terminals of the transimpedance amplifier 5 and the pads of the circuit board 1 cannot be matched. Therefore, the bonding wires at the channel edges need to be relatively long. Long bonding wires introduce significant parasitic inductance and capacitance. In high-frequency signal transmission scenarios, parasitic parameters can lead to severe signal attenuation and phase shift. Furthermore, adjacent bonding wires are prone to crossing or running parallel in close proximity, severely affecting signal transmission quality. Additionally, because the dimensions and spacing of the differential signal lines on the circuit board 1 are larger than the terminals of the transimpedance amplifier 5, the GSSG lines of the circuit board 1 cannot be arranged around the terminals of the transimpedance amplifier 5.

[0036] Therefore, embodiments of this application provide GSSG differential fan-out lines in the wiring pattern layer 6 between the transimpedance amplifier 5 and the circuit board 1 to fan out the terminals of the transimpedance amplifier 5. For details, please refer to... Figure 3 and 4 The fan-out trace 61 includes several pairs of fan-out differential lines 611 and multiple fan-out ground lines 612. Each pair of fan-out differential lines 611 has a corresponding fan-out ground line 612 on both sides. The multiple fan-out ground lines 612 are fanned out side by side, and a pair of fan-out differential traces are set between two adjacent fan-out ground lines 612. The electrical signal output by the transimpedance amplifier 5 is first transmitted to the wiring pattern layer 6 of the waveguide substrate 2, and after being fanned out by the wiring pattern layer 6, it is transmitted to the circuit board 1 through the bonding wire 7.

[0037] In embodiments of this application, the first ends of fan-out traces 61 are uniformly arranged around the terminals of the transimpedance amplifier 5 via a wiring pattern layer 6. Simultaneously, the fan-out traces 61 fan out to match the spacing of their second ends with the spacing of the differential signal lines on the circuit board 1. The second ends of the fan-out traces 61 are connected to a fan-out pad group 62, which is then electrically connected to a third pad group 11 on the circuit board 1 via bonding leads 7. That is, the gap between two adjacent pairs of fan-out differential lines 611 at the second end of the fan-out trace 61 is greater than the gap at the first end of the fan-out trace 61.

[0038] The differential fan-out line is provided by a wiring pattern layer 6 disposed on the waveguide substrate 2. It is compatible with semiconductor manufacturing processes, has high processing precision, and can be processed to produce differential fan-out lines whose size and spacing match the terminals of the transimpedance amplifier 5. This solves the problem caused by the mismatch between the size and spacing of the third pad group 11 and the high-frequency signal lines of the circuit board 1 and the terminals of the transimpedance amplifier 5.

[0039] Thus, the transimpedance amplifier 5 and the fan-out trace 61 can be directly connected via flip-chip soldering. The bond wire lengths of each channel between the fan-out trace 61 and the differential signal lines on the circuit board 1 are also relatively similar, and the bond wire lengths can be shortened, thereby reducing parasitic inductance and capacitance, reducing signal attenuation and signal phase shift, and ensuring the quality and timing consistency of multi-channel signals. Furthermore, the combination of the fan-out differential line 611 and the fan-out ground line 612 to form a GSSG structure can further suppress signal crosstalk.

[0040] like Figure 2 and Figure 3 As shown, in some embodiments, the waveguide substrate 2 has a first end 23 and a second end 24 opposite to each other, and the arrayed waveguide grating 3 is relatively close to the first end 23 and disposed between the light exit port 211 and the first end 23. The fan-out trace 61 is relatively close to the second end 24 and disposed between the light exit port 211 and the second end 24. The first pad group 63 and the second pad group 64 are disposed between the light exit port 211 and the fan-out trace 61, and the first pad group 63 is relatively close to the light exit port 211.

[0041] In other words, in addition to the arrayed waveguide grating 3 of the waveguide substrate 2, an additional extended substrate portion is provided for fabricating the wiring pattern layer 6 and mounting the photodetector array 4 and transimpedance amplifier 5. This allows for the fabrication of more complex circuits, such as conductive vias, without affecting the arrayed waveguide grating 3.

[0042] For example, in some embodiments, the second surface 22 of the waveguide substrate 2 is provided with a ground layer, the orthographic projection of which at least covers the fan-out trace 61 on the first surface 21, and a ground return via is provided between the fan-out ground line 612 and the ground layer. This ground return via electrically connects the ground layer and the fan-out ground line 612 to optimize the return path and suppress signal crosstalk on the fan-out differential line 611. Since the wiring pattern layer 6 is located on an extended substrate portion outside the arrayed waveguide grating 3, providing a ground return via on this portion of the substrate does not affect the function of the arrayed waveguide grating 3, enabling more flexible circuit optimization design.

[0043] Specifically, the grounding layer is a large-area metal layer, such as a copper layer. It covers the bottom surface of the waveguide substrate 2 and provides a potential reference surface for the fan-out differential line 611 and the fan-out ground line 612. When the fan-out differential line 611 transmits high-speed signals, the grounding layer can absorb electromagnetic interference from the surrounding environment, and at the same time suppress the electromagnetic energy radiated outward by the fan-out differential line 611.

[0044] The ground return via electrically connects the fan-out ground wire 612 to the ground plane. In high-speed signal transmission, the return current of the signal requires a low-impedance path. By setting multiple or densely packed ground return vias to directly connect the fan-out ground wire 612 to the ground plane, the impedance of the return path can be reduced, optimizing the return path. Between adjacent fan-out differential lines 611, the presence of the ground return vias and the ground plane can greatly weaken the electromagnetic coupling path, thereby suppressing signal crosstalk between channels.

[0045] In some embodiments, the fan-out pad group 62 includes a high-frequency pad 621 and a DC pad 622. The high-frequency pad 621 is arranged sequentially along the edge of the second end 24 of the waveguide substrate 2 and the side edges on both sides of the second end 24. The DC pad 622 is located on the side edge and is closer to the transimpedance amplifier 5 than the high-frequency pad 621.

[0046] The fan-out trace 61 also includes a DC trace. The DC terminal of the transimpedance amplifier 5 is fanned out through the DC trace and electrically connected to the DC pad 622. The fan-out differential line 611 and the fan-out ground line 612 are respectively connected to the corresponding high-frequency pad 621.

[0047] In the optical receiving assembly, the DC terminals of the transimpedance amplifier 5 mainly include a DC power supply terminal (Voltage Common Collector, VCC), a bus terminal (Inter-Integrated Circuit, IIC), and a Received Signal Strength Indicator (RSSI) terminal. The electrical signal processed by the transimpedance amplifier 5 is a high-frequency signal, which is output through the fan-out differential line 611 and the fan-out ground line 612. The fan-out trace 61 of this application needs to be routed differently depending on the signal type, such as high-frequency signals or DC signals. The DC trace is used to transmit the DC signal of the transimpedance amplifier 5. One end of the DC trace is electrically connected to the DC terminal of the transimpedance amplifier 5, and the other end extends towards the edge of the waveguide substrate 2, finally connecting to the DC pad 622. DC signals from the circuit board 1 or external sources are introduced into the DC trace through the DC pad 622.

[0048] In some embodiments, the material of the waveguide substrate 2 needs to meet the requirements for manufacturing the arrayed waveguide grating 3. For example, the waveguide substrate 2 can be a silicon substrate. In other embodiments, the waveguide substrate 2 can also be a glass substrate.

[0049] In some embodiments, the optical receiving component can be expanded to multiple channels by integrating multiple arrayed waveguide gratings 3, photodetector arrays 4 and transimpedance amplifiers 5 in parallel on the same waveguide substrate 2, to achieve multi-channel parallel transmission on a single substrate, such as 8 channels or 16 channels, to adapt to high-bandwidth, high-density optical communication scenarios.

[0050] like Figure 1-3 As shown, this application uses two sets of optical receiving components with a total of 8 channels as an example. At least two arrayed waveguide gratings 3 are disposed in the waveguide substrate 2, and each arrayed waveguide grating 3 is arranged side by side along the width direction of the waveguide substrate 2; the number of light outlets 211 on the first surface 21 is the same as the number of all output waveguides 32 of the arrayed waveguide gratings 3 and they correspond one-to-one.

[0051] Similarly, the optical receiving component includes at least two photodetector arrays 4 and two transimpedance amplifiers 5. Each photodetector array 4 is arranged along the width direction of the waveguide substrate 2, and each transimpedance amplifier 5 is arranged along the width direction of the waveguide substrate 2. Each transimpedance amplifier 5 is electrically connected to a corresponding photodetector array 4, and each photodetector of each photodetector array 4 receives light output from a light output port 211.

[0052] Compared to splicing multiple substrates, which requires splicing between multiple substrates and each substrate needs independent circuit layout space, resulting in a large overall size, this application eliminates the need for multiple substrates by arranging multiple groups of devices side by side along the width direction of the same waveguide substrate 2. Furthermore, these devices share the edge area of ​​the same waveguide substrate 2. For example, the fan-out pad group 62 can be concentrated along the two sides of the substrate width direction, reducing the overall size and achieving miniaturization.

[0053] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. An optical receiving component, characterized in that, include: A waveguide substrate having opposing first and second surfaces, an arrayed waveguide grating being provided within the waveguide substrate, the arrayed waveguide grating including an input waveguide and multiple output waveguides, the first surface having multiple light exit ports, the multiple light exit ports being optically connected to the multiple output waveguides respectively; A photodetector array is disposed on the waveguide substrate, with the photosensitive surface of the photodetector array facing the first surface of the waveguide substrate, and the photosensitive surface of each photodetector corresponding to each of the light-emitting ports. A transimpedance amplifier is disposed on the first surface of the waveguide substrate, and the transimpedance amplifier is electrically connected to the photodetector. The first surface of the waveguide substrate is further provided with a wiring pattern layer, which includes a first pad group, a second pad group and a plurality of conductive traces. Each pad of the first pad group is electrically connected to the corresponding pad in the second pad group through the conductive traces. The photodetector array is flip-mounted on the first pad group to be electrically connected to the first pad group, and the transimpedance amplifier is flip-mounted on the second pad group to be electrically connected to the second pad group.

2. The optical receiving component according to claim 1, characterized in that, The wiring pattern layer further includes fan-out traces and fan-out pad groups. The fan-out pad groups are arranged along the edge of the waveguide substrate. The fan-out traces are located between the second pad group and the fan-out pad group. The first end of the fan-out trace is connected to the corresponding pad in the second pad group to be electrically connected to the transimpedance amplifier. The second end of the fan-out trace extends outward toward the edge of the waveguide substrate and is electrically connected to the fan-out pad group.

3. The optical receiving component according to claim 2, characterized in that, The fan-out trace includes several pairs of fan-out differential lines and multiple fan-out ground lines, with the fan-out ground line corresponding to both sides of each pair of fan-out differential lines.

4. The optical receiving component according to claim 3, characterized in that, The waveguide substrate has a first end and a second end opposite to each other. The arrayed waveguide grating is relatively close to the first end and is disposed between the light outlet and the first end. The fan-out trace is relatively close to the second end. The first pad group and the second pad group are disposed between the light outlet and the fan-out trace, and the first pad group is relatively close to the light outlet.

5. The optical receiving component according to claim 4, characterized in that, The second surface is provided with a grounding layer, and the orthographic projection of the grounding layer on the first surface at least covers the fan-out trace. A ground return hole is provided between the fan-out ground line and the grounding layer.

6. The optical receiving component according to claim 4, characterized in that, The fan-out pad group includes a high-frequency pad and a DC pad. The high-frequency pad is arranged sequentially along the edge of the second end of the waveguide substrate and the side edges on both sides of the second end. The DC pad is located on the side edge and is closer to the transimpedance amplifier than the high-frequency pad. The fan-out trace also includes a DC trace, through which the DC terminal of the transimpedance amplifier is fanned out and electrically connected to the DC pad. The fan-out differential line and the fan-out ground line are respectively connected to the corresponding high-frequency pad.

7. The optical receiving component according to claim 3, characterized in that, The gap between two adjacent pairs of fan-out differential lines at the second end of the fan-out trace is greater than the gap at the first end of the fan-out trace.

8. The optical receiving component according to claim 2, characterized in that, The optical receiving component further includes a circuit board, the waveguide substrate is disposed on the circuit board, and the first surface faces away from the circuit board; the fan-out pad group is electrically connected to the circuit board.

9. The optical receiving component according to claim 8, characterized in that, The circuit board is provided with a third pad group and a high-frequency signal line connected to each other. The third pad group corresponds one-to-one with the pads of the fan-out pad group. The fan-out pad group is electrically connected to the third pad group through bonding leads. The high-frequency signal line includes multiple ground lines and multiple pairs of differential signal lines. The multiple ground lines are arranged side by side, and a pair of differential signal lines is set between two adjacent ground lines.

10. The optical receiving component according to claim 1, characterized in that, The waveguide substrate is a silicon substrate or a glass substrate.

11. The optical receiving component according to claim 1, characterized in that, At least two arrayed waveguide gratings are disposed within the waveguide substrate, and each arrayed waveguide grating is arranged side by side along the width direction of the waveguide substrate; the number of light outlets on the first surface is the same as the number of all output waveguides of the arrayed waveguide gratings and they correspond one-to-one. The optical receiving component includes at least two photodetector arrays and two transimpedance amplifiers. Each photodetector array is arranged along the width direction of the waveguide substrate, and each transimpedance amplifier is arranged along the width direction of the waveguide substrate. Each transimpedance amplifier is electrically connected to a corresponding photodetector array, and each photodetector in each photodetector array receives light output from a corresponding output port.

Images