Multifunctional integrated board card and use method

Abstract

The invention discloses a multifunctional integrated board card and a use method. The multifunctional integrated board card comprises a substrate, and a main control module, a communication module, a storage module, an interface module and a power supply module are integrated on the substrate; the main control module is electrically connected with the communication module, the storage module and the interface module and used for processing and controlling data of all the modules. The power supply module is electrically connected with the master control module, the communication module, the storage module and the interface module and used for providing working power for all the modules. The interface module at least comprises a USB interface, a network port and a serial port and is used for realizing bidirectional data interaction with external equipment; and the communication module at least comprises a WiFi unit and a Bluetooth unit and is used for realizing short-distance wireless data transmission. Through reasonable module layout and integrated design, integration of multiple functions is realized, the size and the cost of the equipment are reduced, the integration level and the practicability of the equipment are improved, and the equipment is suitable for various electronic equipment scenes.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment technology, specifically to a multifunctional integrated circuit board and its usage method. Background Technology

[0002] Currently, circuit boards are widely used in electronic devices, such as computers, industrial control equipment, and communication equipment. Traditional circuit board designs typically employ a single-function design approach; for example, communication boards are only responsible for data transmission, storage boards are only responsible for data storage, and control boards are only responsible for device control. While this design approach is technically mature, it presents numerous problems in practical applications.

[0003] First, the device is too large. Since multiple functions require multiple circuit boards, each with its own installation space, the internal structure is complex, increasing the overall size and making it difficult to meet the current trend of miniaturization and portability in electronic devices. This is especially true in scenarios with strict size limitations, such as portable testing equipment and small communication terminals, where the application of traditional circuit boards is severely restricted.

[0004] Secondly, the cost is high. The design, production, procurement, installation, and debugging of multiple circuit boards require a significant amount of manpower, material resources, and financial resources. Each circuit board requires independent circuit design, casing, and related accessories, which greatly increases the overall cost of the equipment and is detrimental to the product's market competitiveness. Furthermore, stability and reliability are poor. Multiple boards need to be connected via cables, interfaces, etc. The increased number of connection points increases the probability of failure, such as poor contact and signal interference. At the same time, the coordinated operation between different boards requires complex protocol support. Once the protocol has compatibility issues, the device will not work properly, affecting its stability and reliability. In addition, the power consumption is relatively high. Each independent board requires an independent power supply circuit, and the simultaneous operation of multiple boards will lead to a significant increase in the overall power consumption of the device. This not only increases the energy consumption of the device but also generates a large amount of heat. If heat dissipation is not timely, it will affect the lifespan of the boards and the device. Therefore, it is necessary to design a multi-functional integrated board and its usage method. Summary of the Invention

[0005] The purpose of this invention is to provide a multifunctional integrated board and its usage method to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a multifunctional integrated board, comprising a substrate; The substrate integrates a main control module, a communication module, a storage module, an interface module, and a power supply module. The main control module is electrically connected to the communication module, storage module, and interface module respectively, and is used to process and control the data of each module; The power supply module is electrically connected to the main control module, communication module, storage module and interface module respectively, and is used to provide working power to each module; The interface module includes at least a USB interface, a network port, and a serial port, used to enable bidirectional data interaction with external devices; The communication module includes at least a WiFi unit and a Bluetooth unit for short-range wireless data transmission.

[0007] Preferably, the substrate is a ceramic-epoxy resin composite substrate, which is composed of a bottom ceramic substrate, an intermediate epoxy resin adhesive layer and a top glass cloth layer.

[0008] Preferably, the ceramic substrate of the substrate is made of alumina ceramic material with a thickness of 0.8mm-0.9mm; the epoxy resin adhesive layer has a thickness of 0.2mm-0.3mm and is made of high-temperature resistant epoxy resin; the top glass cloth layer is made of E-glass fiber cloth with a thickness of 0.6mm-0.7mm, and the overall substrate thickness is 1.6mm-1.9mm.

[0009] Preferably, the main control module adopts an ARM architecture microprocessor, the microprocessor model is STM32F407ZGT6, which integrates SPI, I2C and UART peripheral interfaces, and the microprocessor is soldered to the corresponding area of ​​the ceramic substrate of the substrate through immersion gold process.

[0010] Preferably, the storage module includes a RAM memory and a ROM memory; the RAM memory uses a DDR3 chip; the ROM memory uses a Flash chip; and the storage module is connected to the main control module through a high-speed differential signal line inside the substrate.

[0011] Preferably, the power supply module includes a power management chip, a filter circuit, and a voltage regulator circuit; the power management chip is an MP2359, and an independent copper foil grounding layer is provided on the substrate corresponding to the power supply module area, and the grounding layer is connected to the bottom grounding terminal of the substrate through multiple vias.

[0012] Preferably, the substrate is further provided with a heat dissipation module; the heat dissipation module includes a heat sink and a cooling fan, the heat sink is attached to the ceramic substrate surface of the substrate by thermally conductive silicone, the cooling fan is a DC fan, and the cooling fan is fixed to the edge of the substrate by a metal bracket.

[0013] Preferably, each interface of the interface module is connected in series with a protection circuit; the protection circuit includes an electrostatic discharge (ESD) protection chip and an overvoltage protection chip, wherein the ESD protection chip is model SMF05C and the overvoltage protection chip is model SGM2036.

[0014] Preferably, the communication module also integrates a GPS unit, which uses an UBlox NEO-6M chip. The substrate has a shielding cavity in the area corresponding to the GPS unit, and the shielding cavity is connected to the substrate grounding layer through conductive adhesive.

[0015] Preferably, a method of using a multi-functional integrated board includes the following steps: Step A: Power Supply Start-up and Initialization. Connect the external power supply to the corresponding power supply interface of the interface module. After receiving the external power, the power management chip of the power supply module filters out current impurities through the filter circuit and stabilizes the voltage to the specifications of each module through the voltage regulation circuit. It then synchronously outputs working power to the main control module, communication module, storage module, and interface module. After the main control module is powered on, it automatically starts the initialization program. It detects the connection status of the communication module and storage module through the SPI and I2C peripheral interfaces, respectively, and detects the path integrity of each interface of the interface module through the UART interface. At the same time, the heat dissipation module is started, the cooling fan starts running, and the heat sink absorbs the heat on the surface of the ceramic substrate through the thermally conductive silicone and conducts it outward. Step B: Connect the external device to the interface module via its USB port, Ethernet port, or serial port, and send a communication mode selection command to the main control module. If wireless communication mode is selected, the main control module controls the communication module to start the WiFi unit or Bluetooth unit, configure the WiFi unit's SSID, encryption method, and connection password, or configure the Bluetooth unit's pairing name and communication baud rate. If positioning functionality is required, the GPS unit is activated, shielded from external electromagnetic interference, to receive satellite positioning signals and transmit them to the main control module. If wired communication mode is selected, the main control module establishes a bidirectional data link with the external device via the Ethernet port or serial port, configuring the Ethernet port's IP address, subnet mask, or the serial port's communication rate, data bits, and stop bit parameters. Step C: Data Interaction and Storage. In wired communication scenarios, external devices send data through the USB interface, Ethernet port, or serial port of the interface module. After the interface module's protection circuit protects the input data from electrostatic discharge and overvoltage, the data is transmitted to the main control module. In wireless communication scenarios, the WiFi or Bluetooth unit of the communication module receives external wireless data, or the GPS unit receives location data, and transmits it synchronously to the main control module. The main control module parses and processes the received data. If temporary storage is required, the data is written to the DDR3 RAM memory of the storage module through high-speed differential signal lines. If long-term storage is required, the data is written to the Flash ROM memory. At the same time, historical data in the storage module can be transmitted back to the external device according to external instructions. Step D: System Operation Monitoring and Shutdown. During data interaction, the main control module collects the operating parameters of each module in real time and feeds them back to external devices for user monitoring via the interface module. When the substrate surface temperature exceeds the preset threshold, the main control module controls the cooling fan to increase its speed to enhance heat dissipation. When a shutdown command is received from an external device, the main control module first stops data interaction, writes the unsaved temporary data in the storage module to the ROM memory, and then sends a power-off signal to the power supply module. The power supply module sequentially cuts off the power supply to the communication module, storage module, interface module, and heat dissipation module, and finally cuts off the power to the main control module itself, completing the system shutdown.

[0016] Beneficial effects: This invention integrates multiple functions through a reasonable modular layout and integrated design, reducing the size and cost of the device, improving its integration and practicality, and making it suitable for various electronic device scenarios.

[0017] This invention reduces the number of connection points such as cables and interfaces between boards, avoiding the risk of failures such as poor contact and signal interference. Each module is connected through optimized methods such as high-speed differential signal lines inside the substrate, and is combined with designs such as an independent copper foil grounding layer for the power supply module and a shielding cavity for the GPS unit to reduce electromagnetic interference, ensure data transmission and module coordination stability, eliminate the need for complex compatibility protocols, and reduce the probability of equipment malfunctions.

[0018] The above description is merely an overview of the technical solutions of the embodiments of this application. In order to better understand the technical means of the embodiments of this application and to implement them in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the embodiments of this application more apparent and understandable, specific implementation methods of this application are described below. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a cross-sectional view of the substrate of the present invention; Figure 3 This is a schematic diagram of the heat dissipation module installation of the present invention; Figure 4 This is a block diagram illustrating the control principle of the present invention. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims and drawings of this application are intended to cover non-exclusive inclusion.

[0022] The term "embodiment" as used herein means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of the phrase "embodiment" in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0023] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, "connection" or "joining" in mechanical structures can refer to a physical connection, such as a fixed connection, for example, a connection fixed by fasteners, such as a connection fixed by screws, bolts, or other fasteners; a physical connection can also be a detachable connection, such as a snap-fit ​​or interlocking connection; a physical connection can also be an integral connection, such as a connection formed by welding, bonding, or integral molding. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0024] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0025] Please see Figures 1-4The present invention discloses a multifunctional integrated board, including a substrate 1; The base plate 1 integrates a main control module 2, a communication module 3, a storage module 4, an interface module 5, and a power supply module 6. The main control module 2 is electrically connected to the communication module 3, the storage module 4, and the interface module 5 respectively, and is used to process and control the data of each module; The power supply module 6 is electrically connected to the main control module 2, the communication module 3, the storage module 4, and the interface module respectively, and is used to provide working power to each module; The interface module 5 includes at least a USB interface, a network port, and a serial port, used to enable bidirectional data interaction with external devices; The communication module 3 includes at least a WiFi unit and a Bluetooth unit for short-range wireless data transmission.

[0026] In this invention, the substrate 1 is a ceramic-epoxy resin composite substrate, which is composed of a bottom ceramic substrate 7, an intermediate epoxy resin adhesive layer 8, and a top glass cloth layer 9. The ceramic substrate 7 of the substrate is made of alumina ceramic material with a thickness of 0.8mm-0.9mm. The epoxy resin adhesive layer 8 has a thickness of 0.2mm-0.3mm and is made of high-temperature resistant epoxy resin. The top glass cloth layer 9 is made of E-glass fiber cloth with a thickness of 0.6mm-0.7mm. The overall substrate thickness is 1.6mm-1.9mm.

[0027] In this invention, the main control module 2 adopts an ARM architecture microprocessor, specifically an STM32F407ZGT6, which integrates SPI, I2C, and UART peripheral interfaces. The microprocessor is soldered onto the corresponding area of ​​the ceramic substrate using an immersion gold process. The main control module possesses strong data processing capabilities, enabling it to quickly process data received by the communication module, read / write data from the storage module, and interactive data from the interface modules, ensuring efficient operation of the board.

[0028] In this invention, the storage module 4 includes a RAM memory 10 and a ROM memory 11; the RAM memory uses a DDR3 chip; the ROM memory uses a Flash chip; the storage module and the main control module are connected via high-speed differential signal lines inside the substrate. The DDR3 chip features large storage capacity and fast read / write speed, and can be used as the board's running memory for temporary storage of data processed by the main control module. Its storage capacity can be selected according to actual needs, such as 2GB, 4GB, etc.; the Flash chip is non-volatile and can be used for long-term storage of the board's running programs, configuration parameters, and user data, etc. Its storage capacity can be selected as 16GB, 32GB, etc., to meet the data storage needs of different scenarios.

[0029] In this invention, the power supply module 6 includes a power management chip 12, a filter circuit 13, and a voltage regulator circuit 14. The power management chip 12 is an MP2359. An independent copper foil grounding layer is provided on the substrate corresponding to the power supply module area. This grounding layer is connected to the bottom grounding terminal of the substrate through multiple vias. The filter circuit includes capacitors and inductors, which can filter out noise and interference signals in the input voltage, ensuring the stability of the input voltage. The voltage regulator circuit uses a three-terminal regulator, which can further stabilize the output voltage, avoid voltage fluctuations affecting each module, provide stable and reliable operating power to each module, and ensure the stable operation of the board.

[0030] In this invention, a heat dissipation module is also provided on the substrate 1; the heat dissipation module includes a heat sink 15 and a cooling fan 16. The heat sink 15 is attached to the surface of the ceramic substrate 7 of the substrate by thermally conductive silicone. The cooling fan 16 is a DC fan and is fixed to the edge of the substrate 1 by a metal bracket 17. Its air outlet faces the heat sink, which can accelerate the airflow on the surface of the heat sink and quickly dissipate heat into the air, effectively reducing the temperature of the main control module and the communication module, ensuring that the board works in a suitable temperature environment, and improving the stability and service life of the board.

[0031] In this invention, each interface of interface module 5 is connected in series with a protection circuit; the protection circuit includes an electrostatic discharge (ESD) protection chip and an overvoltage protection chip, wherein the ESD protection chip is model SMF05C and the overvoltage protection chip is model SGM2036. The ESD protection chip can effectively absorb electrostatic charges, preventing ESD from damaging the interface and internal modules; the overvoltage protection chip can quickly cut off the circuit or limit the voltage when the input voltage is too high, avoiding damage to the interface and internal modules due to overvoltage, and improving the anti-interference capability and reliability of the board.

[0032] In addition, communication module 3 integrates a GPS unit using an UBlox NEO-6M chip. The substrate has a shielded cavity corresponding to the GPS unit area, and this shielded cavity is connected to the substrate ground layer via conductive adhesive. The GPS unit can receive satellite signals to locate the board's position with an accuracy of up to 10 meters. This positioning function can be applied to scenarios requiring location information, such as logistics tracking equipment and vehicle-mounted electronic devices, enriching the board's functionality and improving its applicability.

[0033] Working principle: A method for using a multi-functional integrated board includes the following steps: Step A: Power Supply Start-up and Initialization. Connect the external power supply to the corresponding power supply interface of the interface module. After receiving the external power, the power management chip of the power supply module filters out current impurities through the filter circuit and stabilizes the voltage to the specifications of each module through the voltage regulation circuit. It then synchronously outputs working power to the main control module, communication module, storage module, and interface module. After the main control module is powered on, it automatically starts the initialization program. It detects the connection status of the communication module and storage module through the SPI and I2C peripheral interfaces, respectively, and detects the path integrity of each interface of the interface module through the UART interface. At the same time, the heat dissipation module is started, the cooling fan starts running, and the heat sink absorbs the heat on the surface of the ceramic substrate through the thermally conductive silicone and conducts it outward. Step B: Connect the external device to the interface module via its USB port, Ethernet port, or serial port, and send a communication mode selection command to the main control module. If wireless communication mode is selected, the main control module controls the communication module to start the WiFi unit or Bluetooth unit, configure the WiFi unit's SSID, encryption method, and connection password, or configure the Bluetooth unit's pairing name and communication baud rate. If positioning functionality is required, the GPS unit is activated, shielded from external electromagnetic interference, to receive satellite positioning signals and transmit them to the main control module. If wired communication mode is selected, the main control module establishes a bidirectional data link with the external device via the Ethernet port or serial port, configuring the Ethernet port's IP address, subnet mask, or the serial port's communication rate, data bits, and stop bit parameters. Step C: Data Interaction and Storage. In wired communication scenarios, external devices send data through the USB interface, Ethernet port, or serial port of the interface module. After the interface module's protection circuit protects the input data from electrostatic discharge and overvoltage, the data is transmitted to the main control module. In wireless communication scenarios, the WiFi or Bluetooth unit of the communication module receives external wireless data, or the GPS unit receives location data, and transmits it synchronously to the main control module. The main control module parses and processes the received data. If temporary storage is required, the data is written to the DDR3 RAM memory of the storage module through high-speed differential signal lines. If long-term storage is required, the data is written to the Flash ROM memory. At the same time, historical data in the storage module can be transmitted back to the external device according to external instructions. Step D: System Operation Monitoring and Shutdown. During data interaction, the main control module collects the operating parameters of each module in real time and feeds them back to external devices for user monitoring via the interface module. When the substrate surface temperature exceeds the preset threshold, the main control module controls the cooling fan to increase its speed to enhance heat dissipation. When a shutdown command is received from an external device, the main control module first stops data interaction, writes the unsaved temporary data in the storage module to the ROM memory, and then sends a power-off signal to the power supply module. The power supply module sequentially cuts off the power supply to the communication module, storage module, interface module, and heat dissipation module, and finally cuts off the power to the main control module itself, completing the system shutdown.

[0034] In summary, this invention, through reasonable module layout and integrated design, achieves the integration of multiple functions, reduces the size and cost of the device, improves the integration and practicality of the device, and is applicable to various electronic device scenarios.

[0035] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A multi-functional integrated board card, characterized by: Including substrate (1); The substrate (1) integrates a main control module (2), a communication module (3), a storage module (4), an interface module (5), and a power supply module (6). The main control module (2) is electrically connected to the communication module (3), the storage module (4), and the interface module (5) respectively, and is used to process and control the data of each module; The power supply module (6) is electrically connected to the main control module (2), communication module (3), storage module (4) and interface module respectively, and is used to provide working power to each module; The interface module (5) includes at least a USB interface, a network port and a serial port, used to realize bidirectional data interaction with external devices; The communication module (3) includes at least a WiFi unit and a Bluetooth unit for short-range wireless data transmission.

2. The multi-functional integrated board card of claim 1, wherein: The substrate (1) is a ceramic-epoxy resin composite substrate, which is composed of a bottom ceramic substrate (7), a middle epoxy resin adhesive layer (8) and a top glass cloth layer (9).

3. A multi-functional integrated board card according to claim 2, characterized in that: The ceramic substrate (7) of the substrate is made of alumina ceramic material with a thickness of 0.8mm-0.9mm; the epoxy resin adhesive layer (8) has a thickness of 0.2mm-0.3mm and is made of high-temperature resistant epoxy resin; the top glass cloth layer (9) is made of E-glass fiber cloth with a thickness of 0.6mm-0.7mm, and the overall substrate thickness is 1.6mm-1.9mm.

4. The multi-functional integrated board card of claim 1, wherein: The main control module (2) adopts an ARM architecture microprocessor, the microprocessor model is STM32F407ZGT6, and integrates SPI, I2C and UART peripheral interfaces. The microprocessor is soldered to the corresponding area of ​​the ceramic substrate of the substrate through immersion gold process.

5. The multi-functional integrated board card of claim 1, wherein: The storage module (4) includes a RAM memory (10) and a ROM memory (11); the RAM memory uses a DDR3 chip; the ROM memory uses a Flash chip; the storage module and the main control module are connected through a high-speed differential signal line inside the substrate.

6. The multi-functional integrated board card of claim 1, wherein: The power supply module (6) includes a power management chip (12), a filter circuit (13) and a voltage regulator circuit (14); the power management chip (12) is an MP2359, and an independent copper foil grounding layer is provided on the substrate corresponding to the power supply module area. The grounding layer is connected to the bottom grounding terminal of the substrate through multiple vias.

7. The multi-functional integrated board card of claim 1, wherein: The substrate (1) is also provided with a heat dissipation module; the heat dissipation module includes a heat sink (15) and a heat dissipation fan (16). The heat sink (15) is attached to the surface of the ceramic substrate (7) of the substrate by thermally conductive silicone. The heat dissipation fan (16) is a DC fan and is fixed to the edge of the substrate (1) by a metal bracket (17).

8. The multi-functional integrated board card of claim 1, wherein: Each interface of the interface module (5) is connected in series with a protection circuit; the protection circuit includes an electrostatic discharge protection chip and an overvoltage protection chip, the electrostatic discharge protection chip is model SMF05C; the overvoltage protection chip is model SGM2036.

9. The multi-functional integrated board card of claim 1, wherein: The communication module (3) also integrates a GPS unit, which uses an UBlox NEO-6M chip. The substrate has a shielding cavity in the area corresponding to the GPS unit, and the shielding cavity is connected to the substrate grounding layer through conductive adhesive.

10. A method of using a multi-functional integrated board card, characterized by: Includes the following steps: Step A: Power Supply Start-up and Initialization. Connect the external power supply to the corresponding power supply interface of the interface module. After receiving the external power, the power management chip of the power supply module filters out current impurities through the filter circuit and stabilizes the voltage to the specifications of each module through the voltage regulation circuit. It then synchronously outputs working power to the main control module, communication module, storage module, and interface module. After the main control module is powered on, it automatically starts the initialization program. It detects the connection status of the communication module and storage module through the SPI and I2C peripheral interfaces, respectively, and detects the path integrity of each interface of the interface module through the UART interface. At the same time, the heat dissipation module is started, the cooling fan starts running, and the heat sink absorbs the heat on the surface of the ceramic substrate through the thermally conductive silicone and conducts it outward. Step B: Connect the external device to the interface module via its USB port, Ethernet port, or serial port, and send a communication mode selection command to the main control module. If wireless communication mode is selected, the main control module controls the communication module to start the WiFi unit or Bluetooth unit, configure the WiFi unit's SSID, encryption method, and connection password, or configure the Bluetooth unit's pairing name and communication baud rate. If positioning functionality is required, the GPS unit is activated, shielded from external electromagnetic interference, to receive satellite positioning signals and transmit them to the main control module. If wired communication mode is selected, the main control module establishes a bidirectional data link with the external device via the Ethernet port or serial port, configuring the Ethernet port's IP address, subnet mask, or the serial port's communication rate, data bits, and stop bit parameters. Step C: Data Interaction and Storage. In wired communication scenarios, external devices send data through the USB interface, Ethernet port, or serial port of the interface module. After the interface module's protection circuit protects the input data from electrostatic discharge and overvoltage, the data is transmitted to the main control module. In wireless communication scenarios, the WiFi or Bluetooth unit of the communication module receives external wireless data, or the GPS unit receives location data, and transmits it synchronously to the main control module. The main control module parses and processes the received data. If temporary storage is required, the data is written to the DDR3 RAM memory of the storage module through high-speed differential signal lines. If long-term storage is required, the data is written to the Flash ROM memory. At the same time, historical data in the storage module can be transmitted back to the external device according to external instructions. Step D: System Operation Monitoring and Shutdown. During data interaction, the main control module collects the operating parameters of each module in real time and feeds them back to external devices for user monitoring via the interface module. When the substrate surface temperature exceeds the preset threshold, the main control module controls the cooling fan to increase its speed to enhance heat dissipation. When a shutdown command is received from an external device, the main control module first stops data interaction, writes the unsaved temporary data in the storage module to the ROM memory, and then sends a power-off signal to the power supply module. The power supply module sequentially cuts off the power supply to the communication module, storage module, interface module, and heat dissipation module, and finally cuts off the power to the main control module itself, completing the system shutdown.

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