Spray header calibration device and method

Abstract

The invention provides a spray header calibration device and method, and belongs to the field of semiconductor manufacturing, and the spray header calibration device comprises a base plate; the first sleeve is fixedly arranged in the center of the base plate; the first end of the second sleeve is used for being connected with a centering spraying head in a sleeving mode, and the second end of the second sleeve is used for being embedded into the first sleeve; the spray header calibration device is configured to obtain the current position of the centering spray header when the first sleeve and the second sleeve are embedded, and the current position of the centering spray header serves as the centering position of the spray header. According to the spray header calibration device and method, accurate calibration of the process position of the spray header is realized, and the wafer yield is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor manufacturing, and in particular to a shower head calibration device and method. BACKGROUND

[0002] Cleaning of the wafer surface is generally performed by using physical or chemical methods to remove contaminants on the wafer surface. There are two ways to clean the wafer, namely tank cleaning and single wafer cleaning. Single wafer cleaning refers to cleaning a single wafer with a shower head each time. The cleaning of a single process is usually completed by using multiple cleaning liquids from different shower heads, thus involving the connection between multiple shower heads.

[0003] In a wafer cleaning device, the position of the shower head is closely related to the yield of the wafer, especially the centering position, the connection position of the shower head and the swing range of the shower head. In the prior art, the centering position, the connection position of the shower head and the swing range of the shower head are determined by manual visual inspection, and manual adjustment and calibration are performed before cleaning, which has a large error and further affects the yield of the wafer.

[0004] How to accurately calibrate the centering position, the connection position of the shower head and the swing range of the shower head before wafer cleaning is a technical problem that needs to be solved by those skilled in the art. SUMMARY

[0005] In view of the problems in the prior art, the present application provides a shower head calibration device and method.

[0006] The present application provides a shower head calibration device, comprising:

[0007] a base plate;

[0008] a first sleeve fixedly arranged at the center of the base plate;

[0009] a second sleeve, a first end of the second sleeve being used for sleeving with a centering shower head, and a second end of the second sleeve being used for embedding with the first sleeve;

[0010] The shower head calibration device is configured to: when the first sleeve and the second sleeve are embedded, the current position of the centering shower head is acquired, and the current position of the centering shower head is taken as the centering position of the shower head.

[0011] According to the shower head calibration device provided by the present application, the shower head further comprises a to-be-connected shower head, and the shower head calibration device further comprises a connection limiting piece for calibrating the waiting position of the to-be-connected shower head.

[0012] According to the shower head calibration device provided in the application, the connecting limiting piece comprises a connecting piece, two ends of the connecting piece are respectively provided with arc-shaped buckles, the two arc-shaped buckles are respectively used for clamping the centering shower head and the to-be-connected shower head, and the length of the connecting piece is the target distance between the centering shower head and the to-be-connected shower head.

[0013] According to the shower head calibration device provided in the application, the connecting limiting piece comprises a connecting limiting ring, the connecting limiting ring is used for being sleeved outside the centering shower head and the to-be-connected shower head, the inner diameter of the connecting limiting ring is the sum of the target distance between the centering shower head and the to-be-connected shower head, the outer diameter of the centering shower head and the outer diameter of the to-be-connected shower head.

[0014] According to the shower head calibration device provided in the application, the periphery of the base disc is provided with an edge limiting wall, and the inner diameter of the edge limiting wall is equal to the diameter of the wafer.

[0015] According to the shower head calibration device provided in the application, the material of the shower head calibration device is a plastic material.

[0016] The application further provides a shower head calibration method, which is realized based on the shower head calibration device according to any one of the above-mentioned embodiments and comprises the following steps.

[0017] The base disc is fixed on the chuck;

[0018] The second sleeve is sleeved on the centering shower head;

[0019] The first sleeve and the second sleeve are embedded;

[0020] The position coordinates of the centering shower head when the first sleeve and the second sleeve are embedded are obtained, and the position coordinates are taken as the centering position coordinates of the shower head.

[0021] According to the shower head calibration method provided in the application, the shower head further comprises a to-be-connected shower head, and the method further comprises the following steps.

[0022] After the centering position coordinates are obtained, the position of the centering shower head is kept unchanged, the to-be-connected shower head is moved, and the connecting limiting piece clamps the centering shower head and the to-be-connected shower head;

[0023] The position coordinates of the to-be-connected shower head when the connecting limiting piece clamps the centering shower head and the to-be-connected shower head are obtained, and the position coordinates are taken as the waiting position coordinates of the to-be-connected shower head.

[0024] According to the shower head calibration method provided in the application, the shower head further comprises a to-be-connected shower head, and the method further comprises:

[0025] After the centering position coordinates are acquired, the position of the centering shower head is kept unchanged, the to-be-joined shower head is moved, and the joining limiting member is sleeved outside the centering shower head and the to-be-joined shower head;

[0026] When the joining limiting member is sleeved outside the centering shower head and the to-be-joined shower head, the position coordinates of the to-be-joined shower head are acquired, and the position coordinates are taken as the waiting position coordinates of the to-be-joined shower head.

[0027] According to the shower head calibration method provided in the application, the method further comprises:

[0028] The shower head is moved along the diameter direction of the chuck;

[0029] When the shower head contacts the edge limiting wall of the base plate, the position coordinates are acquired, and the position coordinates are taken as the edge position coordinates of the shower head.

[0030] The shower head calibration device provided in the application limits the process position of the shower head. The shower head calibration device comprises a base plate, a first sleeve fixed at the center of the base plate, and a second sleeve used for being embedded with the first sleeve. The first end of the second sleeve is sleeved with the centering shower head, and the second end is embedded with the first sleeve. When the first sleeve and the second sleeve are embedded, it indicates that the shower head reaches the centering position of the wafer. The coordinates of the position are taken as the preset shower head centering position of the machine table in the subsequent process, which avoids the error caused by manual calibration and improves the yield of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the application or prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0032] Figure 1 is a structural schematic diagram of a shower head calibration device according to an embodiment of the application;

[0033] Figure 2 is a structural schematic diagram of a shower head calibration device according to an embodiment of the application;

[0034] Figure 3 is a structural schematic diagram of a shower head calibration device according to an embodiment of the application;

[0035] Figure 4 is a structural schematic diagram of a shower head calibration device according to an embodiment of the application;

[0036] Figure 5 Figure 1 is a flow diagram of a shower head calibration method according to an embodiment of the present application. DETAILED DESCRIPTION

[0037] In order to make the objectives, technical solutions, and advantages of the present application clearer, the technical solutions in the present application will be described clearly and completely below with reference to the drawings in the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0038] It should be noted that the device in the present embodiment is applied before the wafer is placed. In the process of cleaning the wafer surface, the process position of the shower head is very important. The centering position is generally set at the center position of the wafer to ensure the uniformity of the sprayed cleaning liquid, better realize the liquid film coverage, and in the process of connecting and alternating the cleaning liquid, the connection of the shower head will be involved. Based on the summary of the existing process data, when the shower head is connected, the optimal distance between the waiting position of the shower head to be connected and the centered shower head is 40 mm. Therefore, how to accurately obtain the process position coordinates of the shower head before cleaning is beneficial to the subsequent positioning of the shower head each time, which is a technical problem to be solved by the current technical personnel in the field.

[0039] Referring to Figures 1 to 5 , the present embodiment provides a shower head calibration device and method.

[0040] The shower head calibration device of the present embodiment is applied to a single wafer cleaning equipment machine of a shower head type, and is used in the machine adjustment process before wafer cleaning, that is, before placing the wafer to be processed, the shower head calibration device of the present embodiment is placed on the wafer chuck, the corresponding position coordinates are obtained through the sensor on the mechanical arm connected with the shower head, and the process position of the shower head is preset by the program of the cleaning equipment machine.

[0041] Referring to Figure 1 , the shower head calibration device of the present embodiment includes a base disc 101, a first sleeve 102, and a second sleeve 103. In use, the base disc 101 is used to be placed on the wafer chuck 104 and is placed concentrically with the wafer chuck 104.

[0042] In order to avoid the influence of the deviation of the base disc 101 on the deviation of the center position of the base disc 101 and the wafer chuck 104, in the specific implementation, the base disc 101 is fixed on the wafer chuck 104 through a plurality of fixing pins 105 on the wafer chuck 104. The center position of the base disc 101 is guaranteed to coincide with the center position of the wafer placed subsequently on the wafer chuck 104.

[0043] In some embodiments, the diameter of the base plate 101 is smaller than the diameter of the wafer chuck 104, and the diameter of the base plate 101 is larger than the diameter of the wafer to be processed, which can be set according to the size of the wafer to be processed in the cavity. In the present embodiment, the shower head is the centering shower head 107.

[0044] The base plate 101 and the first sleeve 102 are provided as an integral part, one end of the first sleeve 102 is fixedly arranged at the center position of the base plate 101, and the other end of the first sleeve is used to be movably nested with the second sleeve 103. In the present embodiment, the distance between the liquid outlet of the shower head and the surface of the wafer is 30 mm, in order to make the first sleeve 102 and the second sleeve 103 stably nested with each other, the height of the first sleeve 102 in the present embodiment can be 15-18 mm, and the length of the second sleeve 103 can be 18-20 mm.

[0045] The first end of the second sleeve 103 is nested with the centering shower head 107 of the cleaning pipeline 106, and the second end of the second sleeve 103 is used to be movably nested with the first sleeve 102. The inner diameter of the second sleeve 103 is larger than the outer diameter of the centering shower head 107. In a specific implementation, in order to be stably nested with the centering shower head 107, the inner diameter of the second sleeve 103 is 1-1.2 mm larger than the pipe diameter of the centering shower head 107, and the outer diameter of the second sleeve 103 is smaller than the inner diameter of the first sleeve 102, and the difference between the outer diameter of the second sleeve 103 and the inner diameter of the first sleeve 102 is also controlled within 1-1.2 mm, which is beneficial to the stable nesting of the two ends of the second sleeve 103.

[0046] Specifically, for single wafer cleaning, when the shower head is located directly above the center of the wafer, it can ensure that the cleaning liquid sprayed by the shower head is sprayed on the wafer surface to form a liquid film that covers more evenly, and the distribution of the liquid film on the wafer surface is strongly related to the cleaning and etching effect of the wafer. Therefore, before the wafer is cleaned, it is necessary to ensure that the shower head is located directly above the center of the wafer. Before placing the wafer on the wafer chuck, the position of the shower head is calibrated by the shower head calibration device of the present embodiment, so that the working position of the shower head is located directly above the center of the wafer.

[0047] In practice, the base plate 101 is fixed to the wafer chuck 104 by various fixing pins 105, and placed concentrically with the wafer chuck 104, so that the center of the first sleeve 102 at the center of the base plate 101 coincides with the center of the wafer chuck 104. Then, the first end of the second sleeve 103 is sleeved onto the alignment spray head 107, and the position of the alignment spray head 107 is moved until the second end of the second sleeve 103 is aligned with the first sleeve 102. The second sleeve 103 and the first sleeve 102 are then fitted and fixed, indicating that the current position of the alignment spray head 107 is the center position of the base plate, which is also the center position of the wafer to be placed subsequently.

[0048] Then, the positioning sensor on the robotic arm connected to the cleaning pipeline 106 obtains the position coordinates of the centering spray head 107 when the second sleeve 103 and the first sleeve 102 are fitted and fixed. These position coordinates are used as the centering position coordinates of the spray head during the process and are sent back to the control unit of the cleaning equipment for preset. In the subsequent cleaning process, after the wafer is placed on the wafer chuck 104, the control unit directly moves the centering spray head 107 to the position corresponding to the centering position coordinates. The centering position coordinates ensure that the centering spray head 107 is located directly above the center of the wafer, that is, the spray head is located at the centering position of the wafer.

[0049] The spray head calibration device of this application embodiment is applied in a wafer cleaning equipment. Before placing the wafer, the spray head calibration device defines the process position of the spray head. The spray head calibration device includes a base plate, a first sleeve fixed at the center of the base plate, and a second sleeve for engaging with the first sleeve. One end of the second sleeve engages with the first sleeve, and the other end is sleeved on the spray head. The engagement of the first and second sleeves calibrates the centering position of the spray head. When the first and second sleeves are engaged, it indicates that the spray head has reached the centering position of the wafer. The coordinates of this position are used as the preset centering position of the spray head for subsequent processes, avoiding errors caused by manual calibration and improving wafer yield.

[0050] For single-wafer cleaning, different cleaning solutions need to be switched, which involves the connection between two spray heads. In this embodiment, refer to... Figure 2The cleaning device includes a centering spray head 107 and a spray head 109 to be connected. Based on the standardized data of the cleaning machine, the optimal waiting position for the spray head 109 to be connected is determined when the distance between it and the centering spray head 107 is the target distance, minimizing the impact on the uniformity of the liquid film on the wafer surface. This target distance can be obtained based on experimental results and preset in the standardized data of the cleaning machine. In this embodiment, the spray head calibration device also includes a connection limiting member for calibrating the relative position of the spray head to be connected and the centering spray head. In one embodiment, when the target distance between the spray head 109 to be connected and the centering spray head 107 is 40 mm, the impact on the liquid film on the wafer surface is minimized.

[0051] In one embodiment, reference Figure 2 The connecting limiting component is a connecting limiting device 108. The connecting limiting device is a plate-like structure with a certain thickness, and its length is the optimal distance between the spray head to be connected and the centering spray head; in this embodiment, this length is 40mm. Arc-shaped buckles matching the outer diameters of the centering spray head 107 and the spray head to be connected 109 are provided on both sides of the connecting limiting device 108. The inner diameter of the arc-shaped buckles is larger than the outer diameters of the centering spray head 107 and the spray head to be connected 109, with the difference controlled between 1mm and 1.2mm. In this embodiment, the distance between the arc-shaped buckles on both sides of the connecting limiting device 108 is 40mm. The connecting limiting device 108 is fixed between the centering spray head 107 and the spray head to be connected 109 by the arc-shaped buckles on both sides, limiting the relative position of the centering spray head 107 and the spray head to be connected 109.

[0052] In practice, the position of the centering spray head 107 is determined by the first sleeve 102 and the second sleeve 103, which is the working position of the spray head during the process. The centering spray head 107 is kept stationary, and then fixed to the side wall of the centering spray head 107 by the arc-shaped buckle on one side of the connecting limiting device 108. The spray head 109 to be connected is moved until the arc-shaped buckle on the other side of the connecting limiting device 108 can be fixed to the side wall of the spray head 109 to be connected.

[0053] In this configuration, the distance between the centering spray head 107 and the spray head 109 to be connected is strictly limited by the connection limiting device 108 to the standardized 40mm. At its current position, the spray head 109 switches liquid output with the centering spray head 107, minimizing the impact on the liquid film on the wafer surface. The current position of the spray head 109 is obtained by the positioning sensor of the robotic arm connected to it, serving as the waiting position coordinates for the spray head during the process, and is transmitted back to the cleaning equipment for pre-setting.

[0054] In another embodiment, the relative position restriction between the centering spray head 107 and the spray head 109 to be connected can also be achieved by a limiting ring.

[0055] refer to Figure 3 In this embodiment of the application, the connecting limiting component of the spray head calibration device is a connecting limiting ring 110. The connecting limiting ring 110 has a ring-shaped structure, and its inner diameter r is equal to the standardized limiting connecting distance + the outer diameter r1 of the centering spray head + the outer diameter r2 of the spray head to be connected. In this embodiment, the standardized limiting connecting distance is 40mm, so the inner diameter r of the connecting limiting ring 110 is 40mm + the outer diameter r1 of the centering spray head + the outer diameter r2 of the switching spray head. In specific implementation, after determining the position of the centering spray head 107 using the first sleeve 102 and the second sleeve 103, the position of the centering spray head 107 is kept fixed. The connecting limiting ring is then placed on the centering spray head 107, and the position of the connecting limiting ring 110 remains unchanged. The spray head 109 to be connected is moved until it reaches the farthest point within the connecting limiting ring 110 from the centering spray head 107. That is, the relative positions of the centering spray head 107 and the spray head 109 to be connected are fixed, located at both ends of the inner diameter line of the connecting limiting ring. The positioning sensor of the robotic arm connected to the spray head 109 obtains the current position coordinates of the spray head 109 to be connected, which are used as the waiting position coordinates of the spray head to be connected during the process and transmitted back to the cleaning equipment for preset.

[0056] It should be noted that, in this embodiment, in order to ensure the accurate positioning of the centering spray head 107 and the spray head 109 to be connected, the material of the above-mentioned limiting device is a non-elastic material, preferably a PTFE-type plastic.

[0057] In conventional mode, there are generally two cleaning processes for a single wafer. One is the situation described above, where the spray head is located directly above the center of the wafer, i.e., in a centered position. The other is a sweeping spray, which has stronger cleaning power and a larger cleaning range.

[0058] In this embodiment, the arc range of the sweeping spray head in the sweeping spray process is defined by software calculation and will not be described in detail here. In practice, when the sweeping spray position of the spray head exceeds the edge of the wafer, the cleaning fluid sprayed by the spray head will splash onto the fixing pin, causing backsplashing on the wafer surface and resulting in significant process defects. Therefore, this embodiment limits the edge position of the sweeping spray.

[0059] refer to Figure 4In some embodiments, the spray head calibration device of this application further includes an edge limiting wall 111. The edge limiting wall 111 is fixedly disposed around the periphery of the base plate 101, and is a limiting sidewall with a certain height and thickness. In this application embodiment, its height can be 30mm-35mm, and its thickness is 1.2mm-1.5mm. The inner diameter of the edge limiting wall 111 is the same as the diameter of the wafer, the diameter of the base plate 101 is larger than the diameter of the wafer to be processed, and considering the thickness of the edge limiting wall 111, the diameter of the base plate 101 is 1.5mm larger than the diameter of the wafer to be processed.

[0060] In practice, the sweeping position of the spray head is checked to ensure it does not exceed the wafer edge. The sweeping range of the spray head is strictly limited during the calibration process by using the position of the edge limiting wall 111, ensuring that the sweeping position of the spray head does not exceed the wafer edge. During the spray head sweeping process, the spray head position coordinates are recorded when it contacts the edge limiting wall 111. In practice, the coordinates of two positions at both ends of the diameter line within the circumference formed by the edge limiting wall are recorded and transmitted back to the machine tool. These two position coordinates are used as the preset edge sweeping position coordinates of the spray head during the machine tool's process.

[0061] This application also provides a spray head calibration method, which can be implemented using the above-mentioned spray head calibration device, but is not limited thereto.

[0062] refer to Figure 5 The sprinkler head calibration method of this application includes the following steps:

[0063] S501. Connect the second sleeve to the spray head and fix the base plate on the chuck.

[0064] S502. Obtain the position coordinates of the spray head when the first sleeve and the second sleeve on the base plate are engaged, as the centering position of the spray head during the cleaning process.

[0065] In some embodiments, the spray head calibration method further includes calibrating the spray head to be connected, specifically:

[0066] In step S502, after the first and second sleeves are engaged, the centering position of the spray head is determined. Then, one side of the arc-shaped buckle of the connecting device is fixed to the side wall of the spray head, and the position of the spray head to be connected is moved until the other side of the arc-shaped buckle of the connecting limiting device is fixed to the side wall of the spray head to be connected. The position coordinates of the spray head to be connected at the current moment are obtained as the waiting position coordinates of the spray head to be connected in the process, and are sent back to the motor program to preset the waiting position coordinates of the spray head to be connected.

[0067] Furthermore, when the cleaning process is a sweeping spray process, the spray head calibration method also includes calibrating the movement range of the spray head, specifically:

[0068] Adjust the sweeping position of the spray head, specifically by adjusting the sweeping position of the spray head along the diameter direction of the chuck. Record the two position coordinates when the spray head contacts the edge limiting wall of the base plate as the third target coordinates. That is, the two position coordinates at both ends of the diameter line on the circumference formed by the spray head contacting the edge limiting wall are used as the third target coordinates. Set the edge position of the spray head when sweeping and spraying through the motor program.

[0069] The spray head calibration method of this application embodiment is based on the above-mentioned spray head calibration device. Before placing the wafer, the spray head calibration device calibrates the centering position of the spray head, the waiting position of the spray head to be connected, and the edge position of the spray head during sweeping spraying. The corresponding position coordinates are obtained and sent back to the machine for program setting. The preset is performed before placing the wafer, avoiding the error caused by manual visual adjustment and improving the wafer yield.

[0070] In the description of this application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0071] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0072] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A spray head calibration device, characterized in that, include: Base plate; The first sleeve is fixedly installed at the center of the base plate; The second sleeve has a first end for engaging with the centering spray head and a second end for fitting into the first sleeve. The spray head calibration device is configured to: when the first sleeve and the second sleeve are engaged, obtain the current position of the centering spray head, and use the current position of the centering spray head as the centering position of the spray head.

2. The spray head calibration device according to claim 1, characterized in that, The spray head also includes a spray head to be connected, and the spray head calibration device also includes a connection limiting component for calibrating the waiting position of the spray head to be connected.

3. The spray head calibration device according to claim 2, characterized in that, The connecting limiting component includes a connector, each end of which is provided with an arc-shaped buckle. The two arc-shaped buckles are used to engage the centering spray head and the spray head to be connected, respectively. The length of the connector is the target distance between the centering spray head and the spray head to be connected.

4. The spray head calibration device according to claim 2, characterized in that, The connecting limiting component includes a connecting limiting ring, which is used to be sleeved on the outside of the centering spray head and the spray head to be connected. The inner diameter of the connecting limiting ring is the sum of the target distance between the centering spray head and the spray head to be connected, the outer diameter of the centering spray head, and the outer diameter of the spray head to be connected.

5. The spray head calibration device according to claim 1, characterized in that, The base plate is provided with an edge limiting wall around its perimeter, and the inner diameter of the edge limiting wall is equal to the diameter of the wafer.

6. The spray head calibration device according to any one of claims 1-5, characterized in that, The spray head calibration device is made of a plastic material.

7. A spray head calibration method, implemented based on the spray head calibration device according to any one of claims 1-6, characterized in that, include: Secure the base plate to the chuck; Fit the second sleeve onto the centering spray head; To make the first sleeve and the second sleeve fit together; Obtain the position coordinates of the spray head when the first sleeve and the second sleeve are engaged, and use the position coordinates as the centering position coordinates of the spray head.

8. The spray head calibration method according to claim 7, characterized in that, The spray head also includes a spray head to be connected, and the method further includes: After obtaining the centering position coordinates, keep the position of the centering spray head unchanged, move the spray head to be connected, so that the connecting limiting member engages the centering spray head and the spray head to be connected; When the connecting limiting component engages the centering spray head and the spray head to be connected, the position coordinates of the spray head to be connected are obtained, and the position coordinates are used as the waiting position coordinates of the spray head to be connected.

9. The spray head calibration method according to claim 7, characterized in that, The spray head also includes a spray head to be connected, and the method further includes: After obtaining the centering position coordinates, keep the position of the centering spray head unchanged, move the spray head to be connected, so that the connecting limiting member is sleeved on the outside of the centering spray head and the spray head to be connected; When the connecting limiting component is sleeved on the outside of the centering spray head and the spray head to be connected, the position coordinates of the spray head to be connected are obtained, and the position coordinates are used as the waiting position coordinates of the spray head to be connected.

10. The spray head calibration method according to claim 7, characterized in that, The method further includes: The spray head is moved along the diameter direction of the chuck; Obtain the position coordinates when the spray head contacts the edge limiting wall of the base plate, and use the position coordinates as the edge position coordinates of the spray head.

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