Wire cutting process for male die of punching aluminum substrate die

Abstract

The invention discloses a male die wire cutting process of a punching aluminum substrate die. The male die wire cutting process comprises the following steps that S1, a blanking taper area with the inclined back face is firstly machined through wire cutting; s2, an inverted cone part with the front face depth ranging from 0.5 mm to 1.0 mm is machined, and detection is conducted through a punching needle with the diameter smaller than 0.05 mm; and S3, a middle straight knife edge is machined. According to the technology, the jig stamping stability, the product yield and the die service life are improved, and the technology is particularly suitable for precise punching machining of the aluminum-based circuit board.

Description

Technical Field

[0001] This application relates to the technical field of mold making, and more specifically, it relates to a wire cutting process for a punching aluminum substrate mold. Background Technology

[0002] In the field of aluminum substrate punching die manufacturing, the design of the die cutting edge structure and its processing technology directly affect the stamping efficiency, product yield, and service life of the die. Traditional aluminum substrate punching dies often employ a straight-body die cutting edge structure, which is prone to clogging during stamping due to scrap adhering to the cutting edge surface, requiring frequent machine stops for cleaning and severely impacting production efficiency. Furthermore, scrap is prone to jamming or rebounding during the blanking process, causing product damage, dimensional errors, and other problems, especially prominent in thin-plate or multi-hole precision stamping.

[0003] While existing technologies have attempted to improve blanking performance by using tapered or angled cutting edges, their structural parameter design largely relies on experience and lacks systematic parameterization specifications, resulting in poor processing consistency and unstable die life. Furthermore, conventional wire EDM processes typically use a single-stage cutting process, making it difficult to balance the precision of the straight section with the chip removal performance of the tapered section, easily leading to accelerated punch wear and uneven blanking force. Summary of the Invention

[0004] To address the issues that existing die cutters often employ a straight-body structure, which easily leads to material jamming and product damage, and the lack of systematic parameterization for tapered or angled cutters, this application provides a wire cutting process for punching aluminum substrate dies.

[0005] A wire cutting process for a punched aluminum substrate mold includes the following steps:

[0006] Step S1: Wire EDM machining of the tapered portion of the blanking on the reverse side of the male mold;

[0007] Step S2: Wire cut the tapered part on the front of the male mold, and use a punch 0.05mm smaller than the front cutting edge size for insertion test, controlling the tapered depth within the range of 0.50-1.0mm;

[0008] Step S3: Wire EDM the straight blade section in the middle.

[0009] Preferably, the die cutting edge includes a straight section and an inverted tapered section, the thickness of the straight section is TA, and the thickness of the inverted tapered section is TB.

[0010] Preferably, the straight clearance of the male mold cutting edge is K1, which is calculated based on the plate thickness and the proportional coefficient, and the value of the proportional coefficient is in the range of 0.12-0.16.

[0011] Preferably, the taper clearance K2 of the male mold cutting edge is calculated based on K1 and the verification parameter, and the value range of the verification parameter is 0.03-0.06.

[0012] Preferably, the diameter of the cutting edge on the front of the male mold is K2mm larger than the diameter of the cutting edge below TB.

[0013] Preferably, the blanking area on the reverse side of the die cutter is designed with an angled structure and enlarged to facilitate the shedding of waste material.

[0014] Preferably, the process is applicable to punching dies for aluminum-based circuit boards.

[0015] In summary, this application includes at least one of the following beneficial technical effects:

[0016] 1. By designing the die cutter edge as a combination of a straight section and an inverted conical section, and employing a design with increased slope in the blanking area, the scrap is effectively guided to fall smoothly, avoiding scrap jamming or rebound. This significantly reduces die blockage caused by scrap adsorption, improving the stability and production efficiency of continuous stamping. The sequential processing of the reverse taper, front inverted taper, and middle straight section ensures the dimensional accuracy of the straight section. The inverted conical structure optimizes the scrap discharge path, reducing punch wear and uneven stress during the blanking process, thus improving punching quality and die reliability. By controlling the inverted taper depth within the range of 0.50-1.0mm and using small-diameter punches for insertion detection, the die edge size is ensured to be precisely controllable. This reduces damage to the aluminum substrate during stamping, improving product yield, and is particularly suitable for thin-plate or multi-hole precision stamping applications.

[0017] 2. By introducing a calculation method based on the proportional coefficient and verification parameters of plate thickness, the systematic and standardized design of the cutting edge clearance is realized, which reduces the uncertainty of relying on experience in traditional processing, improves the consistency and repeatability of mold processing, and thus extends the service life of the mold. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the male mold cutting edge in this embodiment. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] A wire cutting process for a punched aluminum substrate mold includes the following steps:

[0021] Step S1: Wire-cut the blanking tapered portion on the reverse side of the male mold. This portion is located at the bottom of the male mold and its structure is designed with an incline and its size is larger than the traditional design, so that the waste generated by stamping can slide smoothly down the incline and be discharged from the mold, effectively preventing the waste from accumulating and clogging in the blanking cavity; if the reverse side of the mold itself is designed with a clearance structure, this processing step can be omitted.

[0022] Step S2 involves wire cutting the inverted conical portion of the male mold's front side. This portion is located in the top cutting edge area of ​​the male mold, and is machined into an inverted conical structure with a depth strictly controlled within the range of 0.5 to 1.6 mm. After machining, a standard punch with a diameter 0.05 mm smaller than the designed front cutting edge size is used for insertion testing to ensure the dimensional accuracy and shape consistency of the inverted cone. This design creates a controllable micro-gap between the punch and the cutting edge wall during the punching process, reducing friction and the possibility of waste being drawn upwards and carried away.

[0023] Step S3 involves wire cutting the straight section of the cutting edge connecting the front and back sides. This section forms the vertical body of the cutting edge, and its machining must ensure the straightness and dimensional accuracy of the sidewalls to ensure a clean and efficient cut of the aluminum sheet during punching, creating a precisely sized hole. The straight section, the upper inverted tapered section, and the lower sloping blanking area must achieve a smooth transition to maintain the overall structural strength and punching stability of the cutting edge.

[0024] Based on the above structural processing, the key dimensions of the die cutting edge are determined according to systematic parameter calculations. Specifically, the single-sided clearance value K1 of the straight section is obtained by multiplying the thickness of the aluminum substrate to be stamped by a proportional coefficient ranging from 0.12 to 0.16. This clearance ensures basic stamping sharpness and reasonable stress distribution. For example, for a 1mm thick plate, K1 straight section clearance = 1 * 0.15 = 0.15mm. The single-sided clearance value K2 of the tapered section on the front side is obtained by adding a verification parameter ranging from 0.03 to 0.06 to K1. This increased clearance is specifically used to optimize the chip removal path. For example, for a 1mm thick plate, K2 tapered clearance = K1 + 0.04 = 0.19mm. Furthermore, the diameter of the die cutting edge on the front side needs to be increased by K2 compared to the cutting edge diameter for thicknesses below TB to form a clearly defined tapered guide surface.

[0025] The die formed by the above process, during stamping, when the punch descends, first enters the inverted conical area on the front side of the die. The inverted conical structure pre-guides and initially punches the product, causing the subsequently formed scrap to have an inward contraction force, making it fall more closely to the hole wall. The punching is then completed in the straight section, and the scrap continues to descend under the push of the punch, entering the blanking area on the reverse side with a larger slope. This slope provides a lateral release force to the scrap, causing it to quickly deviate from the cutting edge area, eliminating the "material carrying" phenomenon caused by vacuum adsorption. This application achieves comprehensive benefits from preventing scrap blockage, reducing product damage, to improving die life and stamping efficiency, and is especially suitable for high-efficiency, high-precision aluminum-based circuit board punching production.

[0026] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wire cutting process for a punching aluminum substrate mold, characterized in that, Includes the following steps: Step S1: Wire EDM machining of the tapered portion of the blanking on the reverse side of the male mold; Step S2: Wire cut the tapered part on the front of the male mold, and use a punch 0.05mm smaller than the front cutting edge size for insertion test, controlling the tapered depth within the range of 0.50-1.0mm; Step S3: Wire EDM the straight blade section in the middle.

2. The wire cutting process for a punched aluminum substrate mold according to claim 1, characterized in that: The die cutting edge includes a straight section and an inverted tapered section, the thickness of the straight section is TA, and the thickness of the inverted tapered section is TB.

3. The wire cutting process for a punched aluminum substrate mold according to claim 1, characterized in that: The straight clearance of the die cutter is K1, which is calculated based on the plate thickness and the proportional coefficient. The value of the proportional coefficient ranges from 0.12 to 0.

16.

4. The wire cutting process for a punched aluminum substrate mold according to claim 3, characterized in that: The taper clearance K2 of the die cutter is calculated based on K1 and the verification parameters, with the verification parameters ranging from 0.03 to 0.

06.

5. The wire cutting process for a punched aluminum substrate mold according to claim 1, characterized in that: The diameter of the cutting edge on the front of the public mold is K2mm larger than that of the cutting edge below TB.

6. The wire cutting process for a punched aluminum substrate mold according to claim 1, characterized in that: The blanking area on the reverse side of the die cutter is designed with an angled structure and enlarged to facilitate the shedding of waste material.

7. The wire cutting process for a punched aluminum substrate mold according to claim 1, characterized in that: The process described is applicable to punching dies for aluminum-based circuit boards.

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