Grinding control method, control system and device for chip grinding sample preparation, storage medium and program product

Abstract

The invention relates to a grinding control method, control system and device for chip grinding sample preparation, a storage medium and a program product. The method comprises the steps that when it is detected that a to-be-ground chip sample exists on a transmission mechanism of a feeding area, the transmission mechanism is controlled to convey the to-be-ground chip sample to a grinding area for grinding treatment; after it is detected that grinding treatment of the to-be-ground chip sample is completed, the transmission mechanism is controlled to convey the ground to-be-ground chip to a polishing area for polishing treatment; after it is detected that the to-be-ground chip sample is polished, the transmission mechanism is controlled to convey the polished to-be-ground chip to a detection area for quality detection, and a detection result is obtained; according to the method, full-automatic closed-loop treatment of multiple processes including feeding, grinding, polishing, material returning and detecting is achieved, manual operation is not needed, and the chip grinding and sample preparation efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of sample preparation, and in particular to a chip grinding sample preparation grinding control method, a control system, a device, a storage medium and a program product. BACKGROUND

[0002] With the development of sample preparation technology, mechanical grinding technology has become a key means for analyzing the internal structure of a chip. This technology plays an irreplaceable role in chip failure analysis, process verification and reverse engineering due to its unique advantages. In the process of grinding sample preparation, the grinding thickness needs to be accurately controlled within 0.01 mm, and there should be no scratches on the cross section, and the pushing force needs to be controlled during the grinding process to avoid damage to the chip structure caused by excessive stress.

[0003] The commonly used method at present is full manual grinding or semi-automatic grinding. However, there will be great differences in the samples ground by different personnel, and it is difficult to ensure the consistency of chip sample preparation. SUMMARY

[0004] Therefore, it is necessary to provide a chip grinding sample preparation grinding control method, a control system, a device, a storage medium and a program product to solve the above technical problems.

[0005] In a first aspect, the present application provides a chip grinding sample preparation grinding control method, comprising:

[0006] When it is detected that there is a chip sample to be ground on the transmission mechanism of the feeding area, the transmission mechanism is controlled to convey the chip sample to be ground to the grinding area for grinding treatment;

[0007] After it is detected that the chip sample to be ground completes the grinding treatment, the transmission mechanism is controlled to convey the ground chip sample to be ground to the polishing area for polishing treatment;

[0008] After it is detected that the chip sample to be ground completes the polishing treatment, the transmission mechanism is controlled to convey the polished chip sample to be ground to the detection area for quality detection to obtain a detection result.

[0009] In one of the embodiments, when it is detected that there is a chip sample to be ground on the transmission mechanism of the feeding area, the transmission mechanism is controlled to convey the chip sample to be ground to the grinding area for grinding treatment, comprising:

[0010] Collecting pressure data of the pressure sensor on the transmission mechanism of the feeding area, and determining whether there is a chip sample to be ground on the transmission mechanism of the feeding area according to the pressure data;

[0011] When it is detected that there is a chip sample to be ground on the transmission mechanism of the feeding area, the transmission mechanism is controlled to convey the chip sample to be ground to a specified position in the grinding area for grinding treatment.

[0012] In one embodiment, the control transmission mechanism transports the chip sample to be polished to a designated position in the polishing area for polishing, including:

[0013] The system detects the usage status of each grinding fixture in the grinding area, determines the position of the grinding fixture that is idle based on the usage status of each grinding fixture, and sets the position of the grinding fixture as a specified position.

[0014] Determine the travel distance based on the current position and the specified position of the transmission mechanism;

[0015] The control transmission mechanism transports the chip sample to be ground to the first designated position in the grinding area according to the travel distance for grinding.

[0016] In one embodiment, after detecting that the chip sample to be ground has completed the grinding process, the transmission mechanism is controlled to convey the ground chip to the polishing area for polishing, including:

[0017] Determine whether the chip sample to be ground has completed the grinding process based on the preset grinding time or preset grinding requirements;

[0018] After the grinding process is completed, the transmission mechanism will transport the ground chip to the second designated position in the polishing area for polishing.

[0019] In one embodiment, determining whether the chip sample to be ground has completed the grinding process based on a preset grinding time or preset grinding requirements includes:

[0020] If the grinding process takes the required time, the chip sample is considered to have completed the grinding process; if the grinding process takes less than the required time, the chip sample is considered to have not completed the grinding process.

[0021] The thickness data output by the chip thickness detection device in the grinding area is collected. If the thickness data indicates that the grinding thickness of the chip sample to be ground meets the preset grinding requirements, it is determined that the grinding process of the chip sample to be ground is completed; if the thickness data indicates that the grinding thickness of the chip sample to be ground does not meet the preset grinding requirements, it is determined that the grinding process of the chip sample to be ground is not completed.

[0022] In one embodiment, the control transmission mechanism conveys the polished chip to the detection area for quality inspection, and the inspection results include:

[0023] If the test results indicate that the quality of the chip sample to be ground is unqualified, the transmission structure controlling the test area will transfer the chip sample to the feeding area for reprocessing; the processing includes grinding and polishing.

[0024] Secondly, this application also provides a chip grinding sample preparation control system, including:

[0025] The chip grinding sample preparation system includes: a transmission mechanism, a grinding fixture, a polishing tool, a detection device, a sensor, and a control device; the control device is connected to the transmission mechanism, the grinding fixture, the polishing tool, the detection device, and the sensor.

[0026] Thirdly, this application also provides a grinding control device for chip grinding sample preparation, comprising:

[0027] The grinding module is used to control the transmission mechanism to transfer the chip sample to the grinding area for grinding when it detects that there is a chip sample to be ground on the transmission mechanism in the feeding area.

[0028] The polishing module is used to control the transmission mechanism to transport the polished chip to the polishing area for polishing after detecting that the chip sample to be polished has completed the polishing process.

[0029] The detection module is used to control the transmission mechanism to transport the polished chip sample to the detection area for quality detection after the polishing process is completed, and to obtain the detection results.

[0030] Fourthly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0031] When a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transfer the chip sample to the grinding area for grinding.

[0032] After the grinding process of the chip sample is detected, the transmission mechanism is controlled to transfer the ground chip to the polishing area for polishing.

[0033] After the polishing process of the chip sample to be polished is detected, the transmission mechanism is controlled to transport the polished chip to the detection area for quality inspection and obtain the detection results.

[0034] Fifthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, performs the following steps:

[0035] When a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transfer the chip sample to the grinding area for grinding.

[0036] After the grinding process of the chip sample is detected, the transmission mechanism is controlled to transfer the ground chip to the polishing area for polishing.

[0037] After the polishing process of the chip sample to be polished is detected, the transmission mechanism is controlled to transport the polished chip to the detection area for quality inspection and obtain the detection results.

[0038] Sixthly, this application also provides a computer program product, including a computer program that, when executed by a processor, performs the following steps:

[0039] When a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transfer the chip sample to the grinding area for grinding.

[0040] After the grinding process of the chip sample is detected, the transmission mechanism is controlled to transfer the ground chip to the polishing area for polishing.

[0041] After the polishing process of the chip sample to be polished is detected, the transmission mechanism is controlled to transport the polished chip to the detection area for quality inspection and obtain the detection results.

[0042] The aforementioned chip grinding sample preparation method, control system, device, storage medium, and program product, when detecting the presence of a chip sample to be ground on the transmission mechanism in the feeding area, control the transmission mechanism to transport the chip sample to the grinding area for grinding; after detecting that the chip sample has completed grinding, control the transmission mechanism to transport the ground chip to the polishing area for polishing; after detecting that the chip sample has completed polishing, control the transmission mechanism to transport the polished chip to the detection area for quality inspection, and obtain the inspection results. This method, by setting high-precision sensors in the feeding area, grinding area, polishing area, and detection area, and combining them with control equipment, achieves unmanned operation of the entire chip grinding sample preparation process from feeding to quality inspection. This control method not only avoids operational errors caused by manual grinding but also ensures the consistency of chip sample grinding, improving the preparation accuracy and batch pass rate of chip samples. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is an application environment diagram of a chip grinding sample preparation control method in one embodiment;

[0045] Figure 2 This is one of the schematic flowcharts of a chip grinding and sample preparation method in one embodiment;

[0046] Figure 3 This is a second schematic flowchart of a chip grinding and sample preparation method in one embodiment;

[0047] Figure 4 This is the third flowchart illustrating the chip grinding and sample preparation method in one embodiment;

[0048] Figure 5 This is the fourth flowchart illustrating the chip grinding and sample preparation method in one embodiment;

[0049] Figure 6 This is the fifth flowchart illustrating the chip grinding and sample preparation method in one embodiment;

[0050] Figure 7 This is a schematic diagram of the polishing control method for chip polishing sample preparation in one embodiment (Figure 6).

[0051] Figure 8 This is the seventh flowchart illustrating the chip grinding and sample preparation method in one embodiment;

[0052] Figure 9 This is a structural block diagram of a chip grinding and sample preparation control device in one embodiment;

[0053] Figure 10 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0055] It should be noted that the terms "first," "second," etc., used in this application can be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from the second element. The terms "comprising" and "having," and any variations thereof, used in this application, are intended to cover non-exclusive inclusion. The term "multiple" used in this application refers to two or more. The term "and / or" used in this application refers to one of the embodiments, or any combination of multiple embodiments.

[0056] With the development of sample preparation technology, mechanical polishing has become a key method for analyzing the internal structure of chips. This technology, with its unique advantages, plays an irreplaceable role in chip failure analysis, process verification, and reverse engineering. During the polishing sample preparation process, the polishing thickness needs to be precisely controlled within 0.01 mm, and the cross-section must be free of scratches. Furthermore, the polishing force needs to be controlled to avoid excessive stress that could damage the chip structure.

[0057] Currently, the commonly used methods are fully manual grinding or semi-automatic grinding. However, samples ground by different personnel can vary significantly, making it difficult to guarantee the consistency of chip sample preparation.

[0058] In view of the above-mentioned technical problems, this application provides a grinding control method for chip grinding and sample preparation. The following embodiments will specifically illustrate the grinding control method for chip grinding and sample preparation.

[0059] The chip grinding sample preparation method provided in this application embodiment can be applied to, for example... Figure 1 The chip grinding sample preparation system shown includes a conveying mechanism 101, a feeding device 102, a grinding device 103, a polishing device 104, a material removal device 105, a detection device 106, and a control device 107. The conveying mechanism 101 includes a slide rail device in the feeding area, the grinding area, and the polishing area, and a guide rail device in the detection area. The feeding device 102 includes a detection sensor. The grinding device 103 includes a grinding tool, a grinding belt system, a grinding transmission system, and a detection sensor. The polishing device 104 includes a polishing tool, a polishing belt system, a polishing transmission system, and a detection sensor. The material removal device 105 includes a detection sensor. The detection device includes an optical microscope, an imaging system, and an image analysis system. The feeding device 102 is located in the feeding area, the grinding device 103 is located in the grinding area, the polishing device 104 is located in the polishing area, the material removal device 105 is located in the material removal area, and the detection device 106 is located in the detection area. The chip grinding and sample preparation process using the aforementioned chip grinding and sample preparation control system includes: the control device 107 can send control commands to the conveying mechanism 101, feeding device 102, grinding device 103, polishing device 104, unloading device 105, and detection device 106 to control the conveying mechanism 101, feeding device 102, grinding device 103, polishing device 104, unloading device 105, and detection device 106 to work together to perform loading, grinding, polishing, unloading, and detection of the chip sample in a streamlined process, completing the fully automated chip sample grinding and sample preparation process. The grinding fixture with the sample fixed is placed on the slide rail; the detection sensors include a series of sensors that can detect the state of the chip sample, such as infrared sensors, pressure sensors, and image sensors.

[0060] Those skilled in the art will understand that Figure 1 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the chip grinding and sample preparation control system to which the present application is applied. The specific control system may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0061] In one exemplary embodiment, such as Figure 2 As shown, a grinding control method for chip grinding and sample preparation is provided, which is applied to... Figure 1 The following explanation uses the control equipment in the example:

[0062] S201, when a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transfer the chip sample to the grinding area for grinding.

[0063] The transmission mechanism includes a slide rail and a drive cylinder. A grinding fixture for fixing the chip sample to be ground is placed on the slide rail; the drive cylinder drives the slide rail to move; the transmission mechanism can transport the chip sample to be ground, fixed on the grinding fixture, from the feeding area to a designated position in the grinding area for grinding.

[0064] In this embodiment, when a user prepares to process a chip sample to be ground, they first pre-configure the parameters involved in the chip preparation process on the control device's operation panel via human-machine interaction (e.g., different grinding pressures, rotation speeds, polishing times, and other grinding parameters corresponding to different chip materials). After completing the parameter configuration, the control device can immediately activate the detection sensors (e.g., pressure sensors) arranged on the transmission mechanism in the feeding area to detect whether a chip sample to be ground exists on the transmission mechanism. When the control device detects the presence of a chip sample to be ground on the transmission mechanism, it can further acquire images of the chip sample to be ground using a high-resolution industrial camera, and combine this with artificial intelligence algorithms to identify and detect the number of chip samples to be ground, the state of the chip samples to be ground (e.g., whether there are cracks or dirt on the surface of the chip samples to be ground), and the position of the chip samples to be ground, ensuring that the chip samples to be ground meet the pre-processing requirements of the grinding process. Once the chip sample to be ground meets the pretreatment requirements of the grinding process, the control equipment sends a command to the transmission mechanism. Upon receiving the command, the drive cylinder in the transmission mechanism drives the slide rail to transport the chip sample, fixed on the grinding fixture, from the feeding area to the designated or starting position in the grinding area, facilitating subsequent grinding processing. The designated position refers to the operating position corresponding to an idle grinding tool in the grinding area; the starting position refers to the entrance position of the grinding area. After the transmission mechanism transports the chip sample to the starting position, it is necessary to subsequently transport the chip sample to the designated position.

[0065] Waiting for the control equipment to send the grinding instruction. After receiving the start grinding instruction from the control equipment, the device in the grinding area begins grinding the chip sample at the beginning position of the grinding area.

[0066] S202: After detecting that the chip sample to be ground has completed the grinding process, the transmission mechanism is controlled to transfer the ground chip to the polishing area for polishing.

[0067] In one embodiment of this application, when the control device conveys the chip sample to be polished to the starting position of the polishing area based on the aforementioned steps, the control device can first use sensors or detection devices to detect the status of at least one polishing tool. When an idle polishing tool is detected, the control device can control the conveying mechanism to convey the chip sample to be polished from the starting position to the designated position, and then control the polishing device to polish the chip sample accordingly. In another scenario, when the control device conveys the chip sample to be polished to the designated position of the polishing area based on the aforementioned steps, it indicates that an idle polishing tool exists in the polishing area. In this case, the polishing tool can be directly controlled to polish the chip sample. The control device can use a corresponding thickness sensor or other type of detector to detect whether the chip sample has completed the polishing process. When the polishing process is detected, the control device sends a conveying command to the transmission mechanism, driving the slide rail in the transmission mechanism to convey the polished chip sample to the designated or starting position of the polishing area for subsequent polishing.

[0068] S203: After detecting that the chip sample to be polished has completed the polishing process, the transmission mechanism is controlled to transport the polished chip to the detection area for quality inspection and obtain the detection result.

[0069] The detection area mainly consists of a slide rail, an optical microscope, an imaging and image analysis module, and a servo motor.

[0070] In this embodiment, when the control device begins polishing a chip sample to be polished at a designated position in the polishing area, two scenarios exist. One scenario is that when the control device, based on the aforementioned steps, transfers the polished chip sample to the starting position of the polishing area, the control device can first use sensors or detection devices to detect the status of at least one polishing tool. When an idle polishing tool is detected, the control device can control the conveying mechanism to transfer the polished chip sample from the starting position to the designated position, and then correspondingly control the polishing device to polish the polished chip sample. Another scenario is that when the control device, based on the aforementioned steps, transfers the polished chip sample to the designated position in the polishing area, it indicates that an idle polishing tool exists in the polishing area. In this case, the control device can directly control the polishing tool to polish the polished chip sample. When the control device detects that the polished chip sample has completed polishing, it triggers a process switching mechanism. The control device sends a transfer command to the transmission system via industrial Ethernet, driving the slide rail to transfer the polished chip sample to the unloading area for inspection. After receiving the start-of-detection command from the control device, the device in the detection area uses a servo motor to drive a slide rail to transport the chip sample from the unloading area to a designated position in the detection area, i.e., a specific observation position. Once the chip sample reaches the designated position, the servo motor drives the optical microscope to focus, magnifying the microstructure of the polished area of ​​the chip sample. Simultaneously, the high-sensitivity camera in the imaging module continuously captures magnified cross-sectional images of the chip sample through the optical microscope. The acquired images are transmitted in real-time via Ethernet to the image analysis module. This module uses a deep learning model to process the images, comparing and analyzing them with a standard template library to analyze and judge the polishing effect and obtain the detection results. Additionally, the control device can display the chip sample processing progress on the operation panel, allowing users to easily monitor the process. For example, it can display synchronously updated status information and progress bars for "feeding, polishing, conveying, polishing, and detection." Correspondingly, the control device can automatically record all relevant parameters of this polishing process and store them in a background database for easy access by the user.

[0071] In the above-described chip grinding sample preparation method, when a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transport the chip sample to the grinding area for grinding. After the grinding process is completed, the transmission mechanism is controlled to transport the ground chip to the polishing area for polishing. After the polishing process is completed, the transmission mechanism is controlled to transport the polished chip to the detection area for quality inspection, and the inspection results are obtained. This method achieves a fully automated closed-loop process encompassing multiple stages from feeding, grinding, polishing, unloading, and inspection, eliminating the need for manual operation. This significantly improves the efficiency of chip grinding sample preparation. Furthermore, this method not only avoids operational errors caused by manual grinding but also ensures the consistency of chip sample grinding, improving the preparation accuracy and batch pass rate of chip samples.

[0072] In an exemplary embodiment, the phrase "when a chip sample to be ground is detected on the transmission mechanism in the feeding area, control the transmission mechanism to convey the chip sample to the grinding area for grinding processing" in S201 above is as follows: Figure 3 As shown, it includes:

[0073] S301: Collect pressure data from the pressure sensor on the transmission mechanism in the feeding area, and determine whether there is a chip sample to be ground on the transmission mechanism in the feeding area based on the pressure data.

[0074] In this embodiment, the worker neatly places the chip sample to be ground on the slide rail at the starting position of the feeding area according to the preset positioning reference. When the pressure sensor on the transmission mechanism detects the pressure sensing data of the chip sample to be ground on the slide rail, it feeds it back to the control device. After receiving the pressure data, the control device confirms the presence of the chip sample to be ground at the starting position by judging the threshold.

[0075] S302, when a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transport the chip sample to be ground to a designated position in the grinding area for grinding.

[0076] The designated position in the grinding area can be the preparation position of the grinding area or the working position of each grinding fixture.

[0077] In this embodiment, when the control device detects a chip sample to be ground on the transmission mechanism, it further acquires an image of the chip sample using a high-resolution industrial camera. This image is then combined with an artificial intelligence algorithm to detect the number of chip samples, their condition (e.g., whether there are cracks or dirt on the surface), and their location, ensuring that the chip samples meet the pre-processing requirements of the grinding process. After all parameters are verified, the control device sends a command to the transmission mechanism to transport the chip sample to a designated position in the grinding area for grinding.

[0078] In an exemplary embodiment, the "controlling the transmission mechanism to transport the chip sample to be polished to a designated position in the polishing area for polishing processing" in S302 above, such as Figure 4 As shown, it includes:

[0079] S401, detect the usage status of each grinding tool in the grinding area, determine the position of the grinding tool in the idle state according to the usage status of each grinding tool, and determine the position of the grinding tool as a specified position.

[0080] Among them, the grinding tool, as the core part of the grinding process, mainly achieves the grinding of the chip sample to be ground through the grinding belt system; the grinding transmission system is the core of the sandbag movement and positioning, mainly composed of three-axis transmission modules of X-axis, Y-axis and Z-axis, and its power comes from the grinding motor; the X-axis transmission module mainly drives the sand belt grinding system to perform reciprocating linear motion in the horizontal direction; the Y-axis transmission module mainly drives the feed of the sand belt grinding system in the horizontal direction; the Z-axis transmission module mainly adjusts the height position of the sand belt grinding system in the vertical direction.

[0081] In this embodiment, the control device detects the usage status of each grinding tool in the grinding area, determines the position of the grinding tool in the idle state based on the usage status of each grinding tool, and feeds back the position information of the grinding tool in the idle state to the control device. The control device then uses the position information of the grinding tool in the idle state as the position information of the transmission mechanism to transport the chip sample to be ground to the designated position in the grinding area.

[0082] S402, determine the travel distance based on the current position and the specified position of the transmission mechanism.

[0083] In this embodiment, after receiving a command for a specified position from the control device, the transmission system retrieves the current real-time position information of the chip sample to be ground via an industrial Ethernet network and compares it with the position information of the specified position in the grinding area. Then, the transmission system determines the moving distance according to the motion control algorithm in the control device.

[0084] S403, the control transmission mechanism transports the chip sample to be ground to the first designated position in the grinding area for grinding according to the moving distance.

[0085] In this embodiment, the transmission system moves according to the movement distance determined by the motion control algorithm (such as proportional-integral-derivative closed-loop control and trajectory planning) in the control device, conveying the chip sample to be ground to a first designated position in the grinding area. After the chip sample reaches the first designated position, the pressure sensor at the first designated position sends a pressure signal to the control device, triggering a "sample in place" confirmation command. After receiving the arrival signal, the control equipment sends a start-up command to the grinding fixture. First, the grinding fixture fixes the chip sample to be ground. Then, the control equipment automatically starts the grinding process according to the parameters preset by the operator: the grinding belt system polishes the surface of the chip sample, while the built-in pressure feedback device monitors the tension of the grinding belt in real time to ensure the uniformity of grinding. Then, the X-axis, Y-axis, and Z-axis three-axis transmission modules work together. The X-axis transmission module drives the grinding belt to reciprocate along the width of the chip; the Y-axis transmission module precisely controls the cutting depth of the grinding belt according to the grinding amount preset by the operator; and the Z-axis transmission module dynamically adjusts the height of the grinding belt according to the chip thickness data fed back by the control equipment in real time. Thus, the transmission system and the grinding fixture work together to complete the grinding process.

[0086] In an exemplary embodiment, the phrase "after detecting that the chip sample to be ground has completed the grinding process, controlling the transmission mechanism to convey the ground chip to the polishing area for polishing" in S202 above is as follows: Figure 5 As shown, it includes:

[0087] S501 determines whether the chip sample to be ground has completed the grinding process based on the preset grinding time or preset grinding requirements.

[0088] Among them, grinding requirements refer to the grinding parameters that the staff pre-set for chip samples of different materials, such as grinding pressure, rotation speed, polishing time and other grinding sample preparation parameters.

[0089] In this embodiment, during the grinding process, the control device determines whether the chip sample to be ground in the grinding area has completed the grinding process according to the grinding time or grinding requirements preset by the operator. When the grinding process reaches the preset time or preset requirements, the grinding automatically stops and triggers the retraction action of the grinding belt.

[0090] S502, after detecting that the chip sample to be ground has completed the grinding process, the transmission mechanism will transport the ground chip to the second designated position in the polishing area for polishing.

[0091] The second designated position is the preparation position for the polishing area; the polishing process refers to the polishing of the cross-section of the chip sample that has already undergone grinding, using polishing belts and polishing motors according to the instructions of the control equipment.

[0092] In this embodiment, when the retraction action of the abrasive belt is triggered, the abrasive fixture immediately places the polished chip sample onto the transmission system. The transmission system then transports the polished chip to a preparation position in the polishing area for polishing. Once the chip sample reaches the second designated position, the pressure sensor at that position sends a pressure signal to the control device, triggering a "sample in place" confirmation command. Upon receiving the in place signal, the control device sends a start polishing command to the polishing fixture. Upon receiving the command, the polishing fixture begins to fix the chip sample. The control device, based on parameters pre-set by the operator, automatically initiates the polishing process, polishing the cross-section of the polished chip sample. During polishing, the control device determines whether the chip sample in the polishing area has completed polishing based on the pre-set polishing time or requirements. When the polishing process reaches the preset time or requirements, polishing automatically stops, triggering the retraction action of the abrasive belt and transporting the polished chip to a designated position in the detection area for detection.

[0093] In an exemplary embodiment, the phrase "determine whether the chip sample to be ground has completed the grinding process according to the preset grinding time or preset grinding requirements" in S501 above is as follows: Figure 6 As shown, it includes:

[0094] S601, if the grinding time reaches the grinding time limit, the chip sample to be ground is determined to have completed the grinding process; if the grinding time does not reach the grinding time limit, the chip sample to be ground is determined to have not completed the grinding process.

[0095] In this embodiment, the control device monitors the working status of the grinding fixture in the grinding area in real time to determine whether the grinding fixture has completed the grinding time preset by the operator. If the grinding fixture has completed the grinding time preset by the operator, it is determined that the chip sample to be ground has completed the grinding process; if the grinding fixture has not completed the grinding time preset by the operator, it is determined that the chip sample to be ground has not completed the grinding process, and the chip sample that has not completed the grinding process is re-ground.

[0096] S602, collect the thickness data output by the chip thickness detection device in the grinding area. If the thickness data indicates that the grinding thickness of the chip sample to be ground meets the preset grinding requirements, then it is determined that the chip sample to be ground has completed the grinding process; if the thickness data indicates that the grinding thickness of the chip sample to be ground does not meet the preset grinding requirements, then it is determined that the chip sample to be ground has not completed the grinding process.

[0097] In this embodiment, the control device can not only monitor the working status of the grinding fixture in the grinding area in real time, but also use an infrared meter to collect the thickness data output by the chip thickness detection device in the grinding area in real time. The operator can select the specific monitoring mode on the operation panel. If the mode is selected to determine whether the preset requirements are met based on the real-time output thickness data, then if the real-time collected thickness meets the preset grinding requirements, it is determined that the chip sample to be ground has completed the grinding process; if the real-time collected thickness does not meet the preset grinding requirements, it is determined that the chip sample to be ground has not completed the grinding process, and the chip sample that has not completed the grinding process will be ground again.

[0098] In one exemplary embodiment, Figure 2 The specific implementation of S203 in the embodiment, "controlling the transmission mechanism to convey the polished chip to the detection area for quality detection and obtaining the detection result," is as follows: Figure 7 As shown, it includes: if the test result indicates that the quality of the chip sample to be ground is unqualified, the transmission structure of the control detection area will transfer the chip sample to the feeding area for reprocessing; the processing includes grinding and polishing.

[0099] In this embodiment, the control device controls the transmission system to transport the chip sample to be ground to the detection area. The detection area uses an optical microscope, imaging and image analysis module to detect the chip sample to be ground, generate a detection report, and obtain the detection result. If the detection result indicates that the quality of the chip sample to be ground is unqualified, the transmission structure of the control detection area will transport the chip sample to be ground to the feeding area for reprocessing.

[0100] In summary, based on all the above embodiments, a chip grinding sample preparation method for grinding control is also provided, such as... Figure 8 As shown, the method includes:

[0101] S701 collects pressure data from the pressure sensor on the transmission mechanism in the feeding area, and determines whether there is a chip sample to be ground on the transmission mechanism in the feeding area based on the pressure data.

[0102] S702, detect the usage status of each grinding fixture in the grinding area, determine the position of the grinding fixture that is in an idle state according to the usage status of each grinding fixture, and determine the position of the grinding fixture as a specified position;

[0103] S703, determine the travel distance based on the current position and the specified position of the transmission mechanism;

[0104] S704, the control transmission mechanism will transport the chip sample to be polished to the first designated position in the polishing area for polishing according to the moving distance;

[0105] S705, If the grinding process is completed based on whether the grinding time has been reached, proceed to step S706; if the grinding process is completed based on whether the preset grinding thickness has been reached, proceed to step S707.

[0106] S706, if the grinding time reaches the grinding time limit, the chip sample to be ground is determined to have completed the grinding process; if the grinding time does not reach the grinding time limit, the chip sample to be ground is determined to have not completed the grinding process.

[0107] S707: Collect the thickness data output by the chip thickness detection device in the grinding area. If the thickness data indicates that the grinding thickness of the chip sample to be ground meets the preset grinding requirements, then it is determined that the chip sample to be ground has completed the grinding process; if the thickness data indicates that the grinding thickness of the chip sample to be ground does not meet the preset grinding requirements, then it is determined that the chip sample to be ground has not completed the grinding process.

[0108] S708, after detecting that the chip sample to be ground has completed the grinding process, the transmission mechanism will transport the ground chip to the second designated position in the polishing area for polishing.

[0109] S709, if the test result indicates that the quality of the chip sample to be ground is unqualified, the transmission structure of the control detection area will transfer the chip sample to the feeding area for reprocessing.

[0110] The methods described in each of the above steps have been described in the foregoing embodiments. For details, please refer to the foregoing descriptions. They will not be repeated here.

[0111] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages in other steps. It is understood that the steps in different embodiments can be freely combined as needed, and all non-contradictory solutions formed by such combinations are within the scope of protection of this application.

[0112] Based on the same inventive concept, this application also provides a chip polishing sample preparation polishing control system for implementing the above-mentioned chip polishing sample preparation polishing control method. The structural schematic diagram of this chip polishing sample preparation polishing control system is the same as described above. Figure 1 The schematic diagram of the chip grinding and sample preparation control system shown is basically the same as that of the previous diagram. For detailed structure, please refer to the above. Figure 1 The diagram shows the structure of the polishing control system for chip polishing sample preparation. For an explanation of the working principle of this polishing control system, please refer to the previous section. Figure 2-8 The grinding control method for chip grinding and sample preparation described in any embodiment is not elaborated here.

[0113] Based on the same inventive concept, this application also provides a chip grinding sample preparation grinding control device for implementing the above-mentioned chip grinding sample preparation grinding control method. The solution provided by this device is similar to the solution described in the above method. Therefore, the specific limitations of one or more chip grinding sample preparation grinding control device embodiments provided below can be found in the limitations of the chip grinding sample preparation grinding control method above, and will not be repeated here.

[0114] In one exemplary embodiment, such as Figure 9 As shown, a chip grinding sample preparation control device is provided, including: a grinding module 11, a polishing module 12, and a detection module 13, wherein:

[0115] The grinding module 11 is used to control the transmission mechanism to transfer the chip sample to the grinding area for grinding when it detects that there is a chip sample to be ground on the transmission mechanism in the feeding area.

[0116] The polishing module 12 is used to control the transmission mechanism to transfer the polished chip to the polishing area for polishing after detecting that the chip sample to be polished has completed the polishing process.

[0117] The detection module 13 is used to control the transmission mechanism to transport the polished chip to the detection area for quality detection after the chip sample to be polished has been detected. The detection result is obtained.

[0118] In one embodiment, the grinding module 11 includes:

[0119] The acquisition unit is used to acquire pressure data from the pressure sensor on the transmission mechanism in the feeding area, and to determine whether there is a chip sample to be ground on the transmission mechanism in the feeding area based on the pressure data.

[0120] The conveying unit is used to control the transmission mechanism to convey the chip sample to be polished to a designated position in the polishing area for polishing when a chip sample to be polished is detected on the transmission mechanism in the feeding area.

[0121] In one embodiment, the aforementioned transmission unit includes:

[0122] The first transmission subunit is used to detect the usage status of each grinding fixture in the grinding area, determine the position of the grinding fixture in the idle state according to the usage status of each grinding fixture, and determine the position of the grinding fixture as a specified position.

[0123] The second transmission subunit is used to determine the travel distance based on the current position and the specified position of the transmission mechanism;

[0124] The third transmission subunit is used to control the transmission mechanism to transport the chip sample to be ground to the first designated position in the grinding area for grinding according to the moving distance.

[0125] In one embodiment, the polishing module 12 includes:

[0126] The determining unit is used to determine whether the chip sample to be ground has completed the grinding process based on the preset grinding time or preset grinding requirements.

[0127] The processing unit is used to transmit the ground chip sample to a second designated position in the polishing area for polishing after the transmission mechanism detects that the grinding process has been completed.

[0128] In one embodiment, the above-mentioned processing unit includes:

[0129] The first processing subunit is used to determine that the chip sample to be ground has completed the grinding process if the grinding process time reaches the grinding time limit; and to determine that the chip sample to be ground has not completed the grinding process if the grinding process time does not reach the grinding time limit.

[0130] The second processing subunit is used to collect the thickness data output by the chip thickness detection device in the grinding area. If the thickness data indicates that the grinding thickness of the chip sample to be ground meets the preset grinding requirements, then the chip sample to be ground is determined to have completed the grinding process; if the thickness data indicates that the grinding thickness of the chip sample to be ground does not meet the preset grinding requirements, then the chip sample to be ground is determined to have not completed the grinding process.

[0131] In one embodiment, the detection module 13 is specifically used to: if the detection result indicates that the quality of the chip sample to be ground is unqualified, control the transmission structure of the detection area to transfer the chip sample to the feeding area for reprocessing; the processing includes grinding and polishing.

[0132] Each module in the aforementioned chip grinding and sample preparation control device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0133] In one exemplary embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 10 As shown.

[0134] The computer device includes a processor, memory, input / output interfaces, a communication interface, a display unit, and an input device. The processor, memory, and input / output interfaces are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interfaces. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The input / output interfaces are used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, Near Field Communication (NFC), or other technologies. When the computer program is executed by the processor, it implements a chip grinding sample preparation grinding control method. The display unit is used to form a visually visible image and can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0135] In one exemplary embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0136] When a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transfer the chip sample to the grinding area for grinding.

[0137] After the grinding process of the chip sample is detected, the transmission mechanism is controlled to transfer the ground chip to the polishing area for polishing.

[0138] After the polishing process of the chip sample to be polished is detected, the transmission mechanism is controlled to transport the polished chip to the detection area for quality inspection and obtain the detection results.

[0139] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0140] The pressure data from the pressure sensor on the transmission mechanism in the feeding area is collected, and the presence of a chip sample to be ground is determined based on the pressure data.

[0141] When a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transport the chip sample to a designated position in the grinding area for grinding.

[0142] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0143] The system detects the usage status of each grinding fixture in the grinding area, determines the position of the grinding fixture that is idle based on the usage status of each grinding fixture, and sets the position of the grinding fixture as a specified position.

[0144] Determine the travel distance based on the current position and the specified position of the transmission mechanism;

[0145] The control transmission mechanism transports the chip sample to be ground to the first designated position in the grinding area according to the travel distance for grinding.

[0146] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0147] Determine whether the chip sample to be ground has completed the grinding process based on the preset grinding time or preset grinding requirements;

[0148] After the grinding process is completed, the transmission mechanism will transport the ground chip to the second designated position in the polishing area for polishing.

[0149] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0150] If the grinding process takes the required time, the chip sample is considered to have completed the grinding process; if the grinding process takes less than the required time, the chip sample is considered to have not completed the grinding process.

[0151] The thickness data output by the chip thickness detection device in the grinding area is collected. If the thickness data indicates that the grinding thickness of the chip sample to be ground meets the preset grinding requirements, it is determined that the grinding process of the chip sample to be ground is completed; if the thickness data indicates that the grinding thickness of the chip sample to be ground does not meet the preset grinding requirements, it is determined that the grinding process of the chip sample to be ground is not completed.

[0152] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0153] If the test results indicate that the quality of the chip sample to be ground is unqualified, the transmission structure controlling the test area will transfer the chip sample to the feeding area for reprocessing; the processing includes grinding and polishing.

[0154] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0155] When a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transfer the chip sample to the grinding area for grinding.

[0156] After the grinding process of the chip sample is detected, the transmission mechanism is controlled to transfer the ground chip to the polishing area for polishing.

[0157] After the polishing process of the chip sample to be polished is detected, the transmission mechanism is controlled to transport the polished chip to the detection area for quality inspection and obtain the detection results.

[0158] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0159] The pressure data from the pressure sensor on the transmission mechanism in the feeding area is collected, and the presence of a chip sample to be ground is determined based on the pressure data.

[0160] When a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transport the chip sample to a designated position in the grinding area for grinding.

[0161] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0162] The system detects the usage status of each grinding fixture in the grinding area, determines the position of the grinding fixture that is idle based on the usage status of each grinding fixture, and sets the position of the grinding fixture as a specified position.

[0163] Determine the travel distance based on the current position and the specified position of the transmission mechanism;

[0164] The control transmission mechanism transports the chip sample to be ground to the first designated position in the grinding area according to the travel distance for grinding.

[0165] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0166] Determine whether the chip sample to be ground has completed the grinding process based on the preset grinding time or preset grinding requirements;

[0167] After the grinding process is completed, the transmission mechanism will transport the ground chip to the second designated position in the polishing area for polishing.

[0168] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0169] If the grinding process takes the required time, the chip sample is considered to have completed the grinding process; if the grinding process takes less than the required time, the chip sample is considered to have not completed the grinding process.

[0170] The thickness data output by the chip thickness detection device in the grinding area is collected. If the thickness data indicates that the grinding thickness of the chip sample to be ground meets the preset grinding requirements, it is determined that the grinding process of the chip sample to be ground is completed; if the thickness data indicates that the grinding thickness of the chip sample to be ground does not meet the preset grinding requirements, it is determined that the grinding process of the chip sample to be ground is not completed.

[0171] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0172] If the test results indicate that the quality of the chip sample to be ground is unqualified, the transmission structure controlling the test area will transfer the chip sample to the feeding area for reprocessing; the processing includes grinding and polishing.

[0173] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, performs the following steps:

[0174] When a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transfer the chip sample to the grinding area for grinding.

[0175] After the grinding process of the chip sample is detected, the transmission mechanism is controlled to transfer the ground chip to the polishing area for polishing.

[0176] After the polishing process of the chip sample to be polished is detected, the transmission mechanism is controlled to transport the polished chip to the detection area for quality inspection and obtain the detection results.

[0177] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0178] The pressure data from the pressure sensor on the transmission mechanism in the feeding area is collected, and the presence of a chip sample to be ground is determined based on the pressure data.

[0179] When a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transport the chip sample to a designated position in the grinding area for grinding.

[0180] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0181] The system detects the usage status of each grinding fixture in the grinding area, determines the position of the grinding fixture that is idle based on the usage status of each grinding fixture, and sets the position of the grinding fixture as a specified position.

[0182] Determine the travel distance based on the current position and the specified position of the transmission mechanism;

[0183] The control transmission mechanism transports the chip sample to be ground to the first designated position in the grinding area according to the travel distance for grinding.

[0184] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0185] Determine whether the chip sample to be ground has completed the grinding process based on the preset grinding time or preset grinding requirements;

[0186] After the grinding process is completed, the transmission mechanism will transport the ground chip to the second designated position in the polishing area for polishing.

[0187] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0188] If the grinding process takes the required time, the chip sample is considered to have completed the grinding process; if the grinding process takes less than the required time, the chip sample is considered to have not completed the grinding process.

[0189] The thickness data output by the chip thickness detection device in the grinding area is collected. If the thickness data indicates that the grinding thickness of the chip sample to be ground meets the preset grinding requirements, it is determined that the grinding process of the chip sample to be ground is completed; if the thickness data indicates that the grinding thickness of the chip sample to be ground does not meet the preset grinding requirements, it is determined that the grinding process of the chip sample to be ground is not completed.

[0190] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0191] If the test results indicate that the quality of the chip sample to be ground is unqualified, the transmission structure controlling the test area will transfer the chip sample to the feeding area for reprocessing; the processing includes grinding and polishing.

[0192] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0193] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited to these.

[0194] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0195] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for controlling the grinding of chip samples, characterized in that, The method, which is applied to a control device in a grinding control system, includes: When a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transport the chip sample to the grinding area for grinding. After detecting that the chip sample to be ground has completed the grinding process, the transmission mechanism is controlled to transport the ground chip to the polishing area for polishing. After the polishing process is completed, the transmission mechanism is controlled to transport the polished chip to the detection area for quality inspection, and the detection result is obtained.

2. The method according to claim 1, characterized in that, When a chip sample to be ground is detected on the transmission mechanism in the feeding area, controlling the transmission mechanism to convey the chip sample to the grinding area for grinding includes: The pressure data from the pressure sensor on the transmission mechanism of the feeding area is collected, and the presence of the chip sample to be ground is determined on the transmission mechanism of the feeding area based on the pressure data. When a chip sample to be ground is detected on the transmission mechanism in the feeding area, the transmission mechanism is controlled to transport the chip sample to a designated position in the grinding area for grinding.

3. The method according to claim 2, characterized in that, The control of the transmission mechanism to transport the chip sample to be ground to a designated position in the grinding area for grinding includes: The usage status of each grinding fixture in the grinding area is detected, and the position of the grinding fixture in the idle state is determined according to the usage status of each grinding fixture, and the position of the grinding fixture is determined as the specified position; The travel distance is determined based on the current position of the transmission mechanism and the specified position; The transmission mechanism is controlled to transport the chip sample to be ground to a first designated position in the grinding area for grinding according to the moving distance.

4. The method according to claim 1, characterized in that, After detecting that the chip sample to be ground has completed the grinding process, the step of controlling the transmission mechanism to convey the ground chip to the polishing area for polishing includes: Based on the preset grinding time or preset grinding requirements, determine whether the chip sample to be ground has completed the grinding process; After the grinding process is completed, the transmission mechanism will transport the ground chip to a second designated position in the polishing area for polishing.

5. The method according to claim 4, characterized in that, The step of determining whether the chip sample to be ground has completed the grinding process according to a preset grinding time or preset grinding requirements includes: If the grinding process takes the required time, the chip sample to be ground is determined to have completed the grinding process; if the grinding process takes less than the required time, the chip sample to be ground is determined to have not completed the grinding process. Alternatively, the thickness data output by the chip thickness detection device in the grinding area can be collected. If the thickness data indicates that the grinding thickness of the chip sample to be ground meets the preset grinding requirements, then the chip sample to be ground is determined to have completed the grinding process; if the thickness data indicates that the grinding thickness of the chip sample to be ground does not meet the preset grinding requirements, then the chip sample to be ground is determined to have not completed the grinding process.

6. The method according to claim 1, characterized in that, The method further includes: If the test result indicates that the quality of the chip sample to be ground is unqualified, the transmission structure of the detection area is controlled to transfer the chip sample to the feeding area for reprocessing; the processing includes the grinding process and the polishing process.

7. A grinding control system for chip grinding and sample preparation, characterized in that, The chip grinding and sample preparation system includes: a transmission mechanism, a grinding fixture, a polishing tool, a detection device, a sensor, and a control device; the control device is connected to the transmission mechanism, the grinding fixture, the polishing tool, the detection device, and the sensor. The control device is used to perform the steps of the method according to any one of claims 1 to 6.

8. A grinding control device for chip grinding and sample preparation, characterized in that, The device includes: The grinding module is used to control the transmission mechanism to transport the chip sample to the grinding area for grinding when it detects that there is a chip sample to be ground on the transmission mechanism in the feeding area. The polishing module is used to control the transmission mechanism to transport the polished chip to the polishing area for polishing after detecting that the chip sample to be polished has completed the polishing process. The detection module, after detecting that the chip sample to be polished has completed the polishing process, controls the transmission mechanism to transport the polished chip to the detection area for quality detection and obtain the detection result.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

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