Drying equipment with wafer clamping assembly

Abstract

The invention relates to the field of semiconductor device manufacturing equipment, in particular to drying equipment with a wafer clamping assembly. The device comprises an operation table, a clamping assembly, a feeding piece and a processing assembly. The clamping assembly is arranged on the operation table, and a through hole for wafer positioning is formed in the center; a clamping piece capable of rotating along the circumference is arranged on the periphery of the through hole. The feeding pieces are arranged in the upper operation cover and the lower operation cover respectively, the multiple sets of treatment assemblies are arranged in the upper operation cover and the lower operation cover in pairs respectively, and hemispherical treatment cavities are formed in the opposite ends of each pair of treatment assemblies. According to the invention, the clamping assembly is arranged, so that the problems of lossless clamping and dead-corner-free exposure of the semiconductor wafer in the processing process are solved; and the treatment assembly ensures ultra-high cleanliness, excellent uniformity and lossless precision in the treatment process through a hemispherical cavity, ultrafiltration and precise pressure control of the treatment assembly. Through the synergistic effect of the two core components, the equipment becomes process equipment for coping with advanced semiconductor device manufacturing challenges.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing equipment, and more particularly to a drying process with a wafer clamping assembly. Background Technology

[0002] In the field of advanced semiconductor device manufacturing, the cleanliness and non-destructive state of a wafer's surface, after undergoing hundreds of processes, directly determines the yield and performance of the final chip. Especially today, with patterned structures reaching the nanoscale, cleaning and drying, as key auxiliary processes throughout the entire manufacturing process, have evolved from simple decontamination functions to requiring "zero-damage" clamping and "no dead angles" processing of the wafer. This has created an urgent need for specialized drying equipment.

[0003] Existing wafer drying equipment and its clamping components often exhibit several shortcomings when facing advanced processes. Firstly, in terms of clamping methods, most equipment still uses simple mechanical clamps or vacuum chucks, resulting in significant processing dead zones. Fixed-point clamping can obscure local areas of the wafer, preventing the underlying pattern from being effectively cleaned and dried, while vacuum chucks cannot handle the back side of the wafer. Secondly, existing clamping structures are generally too rigid and lack effective stress buffering, easily causing imperceptible "micro-damage" to the wafer edges during high-speed rotation or processing. This damage can become crack sources in subsequent processes, leading to decreased wafer strength or even breakage. Finally, from a system coordination perspective, the movement of the processing chamber (such as simple spray pipes or static chambers) and the clamping components in existing equipment is often decoupled, failing to achieve dynamic coordination. This results in uneven dielectric flow field coverage, especially when processing complex structures such as three-dimensional fin field-effect transistors, easily forming "watermark" defects due to residual local liquid surface tension, severely affecting device performance. These shortcomings collectively limit the application of existing equipment in high-end semiconductor manufacturing. Summary of the Invention

[0004] To address the problems existing in the background technology, a drying device with a wafer clamping assembly is proposed. The clamping assembly, through its flexible, dynamic, and multi-degree-of-freedom design, solves the challenges of non-destructive clamping and exposure without dead angles of semiconductor wafers during processing. Meanwhile, the processing assembly, through its hemispherical cavity, ultrafiltration, and precise pressure control, ensures ultra-high cleanliness, excellent uniformity, and non-destructive precision during the processing. The synergistic effect of these two core components makes this equipment a process tool for meeting the challenges of advanced semiconductor device manufacturing.

[0005] This invention proposes a drying device with a wafer clamping assembly, including an operating table, a clamping assembly, a feeding component, and a processing component. A lifting drive is provided on one side of the operating table, and an upper operating cover and a lower operating cover are respectively positioned opposite each other at the upper and lower ends of the operating table; the upper operating cover is raised and lowered by the lifting drive. The clamping assembly is mounted on the operating table and is a multi-directional rotatable annular structure with a through-hole at its center for wafer positioning; clamping components that can rotate circumferentially are provided around the through-hole. The feeding components are respectively located inside the upper and lower operating covers for introducing cleaning and drying media. Multiple sets of processing components are arranged in pairs inside the upper and lower operating covers. Each pair of processing components is connected to the corresponding feeding component on one side and mirror-connected to the corresponding through-hole on the other. Each pair of processing components has a hemispherical processing cavity at its opposite end, which covers the wafer positioned in the through-hole, allowing for multi-directional rotation of the wafer for cleaning and drying.

[0006] Preferably, the clamping assembly includes a flipping ring that flips within a through hole; a rotating ring that rotates along the inner wall of the flipping ring; and multiple sets of clamping members arranged along the rotating ring.

[0007] Preferably, the rotating ring is provided with an annular track; the clamping component includes a movable frame; the front end of the movable frame is provided with a movable structure that cooperates with the annular track, and the rear end is provided with a mounting frame; the mounting frame is provided with a positioning structure for multi-point clamping of the upper end, lower end and side end of the wafer.

[0008] Preferably, the mounting bracket is configured as a U-shaped structure with an opening facing the center of the through hole; the positioning structures at the upper and lower ends include airbags located at opposite ends of the upper and lower horizontal sections of the mounting bracket; the airbags are inflated and deflated by an air pump.

[0009] Preferably, the side-end positioning structure includes two sets of positioning clamps located on the vertical section of the mounting bracket; a bidirectional rack that moves back and forth is provided between the positioning clamps; a clamping wheel is provided at the front end of the bidirectional rack, and half gears are provided on both sides; the half gears are driven to rotate by a rotating head and mesh with the bidirectional rack; the positioning clamps are rotatably connected to the rotating head through a connecting rod.

[0010] Preferably, the inner wall of the positioning clamp is provided with protective protrusions.

[0011] Preferably, the feeding component includes a feeding pipe; the feeding pipe is connected to an external raw material storage device through a feeding valve on one side, and to a corresponding processing component through a pipeline on the other side, and a support base that contacts the operating table is provided on the opposite ends of the two sets of feeding pipes.

[0012] Preferably, the processing assembly includes a mounting sleeve surrounding the feed pipe; a processing sleeve is provided at the upper end of the mounting sleeve, and a partition is provided between the mounting sleeve and the processing sleeve; a pressure regulating seat is provided at the upper end of the partition, and a pressure regulating device connected to the pressure regulating seat is provided at the lower end; the processing sleeve has an opening at its end, and a processing box with a feed hole forming a hemispherical processing chamber is provided on the opening; a lifting plug that slides up and down with air pressure adjustment is provided between the processing box and the partition; the processing box and the lifting plug are configured as matching hemispheres; a piston ring is provided on the hemispherical opening of the lifting plug; multiple sets of feed holes are distributed along the box wall of the processing box, and a filter membrane is provided on each set of feed holes; a pipe connected to the feed pipe is provided on the lifting plug.

[0013] Preferably, the bottom of the hemispherical part of the lifting plug is provided with an installation ring; a rotatable discharge ring is provided inside the installation ring; a discharge port of the connecting pipe is provided on the discharge ring; the middle part of the rotating rod slides through the discharge ring, and the end is connected to the bottom of the hemispherical part of the processing box. The rotating rod drives the processing box and the discharge ring to rotate synchronously by rotating.

[0014] Preferably, the shape and size of the flip ring match the hemispherical processing cavity, and a cleaning ring is provided on the outer wall of the flip ring.

[0015] Compared with the prior art, the present invention has the following beneficial technical effects: The core innovation of this technical solution lies in the collaborative design and precise control of the clamping and processing components, achieving non-destructive, dynamic, and omnidirectional cleaning and drying of wafers. First, the clamping components move along the annular track of the rotating ring via their front-end moving structure, creating space for the wafer to enter. After the wafer is fed into the through-hole, the clamping wheels at the front of each clamping component gently abut against the wafer edge for centering. Upper and lower airbags clamp the upper and lower surfaces of the wafer, while two sets of positioning clamps securely hold the wafer edge from the side, achieving precise positioning. Then, the upper and lower operating covers close to form a sealed processing chamber. At this time, the flip ring flips, and the rotating ring rotates, achieving omnidirectional dynamic adjustment of the wafer's spatial orientation. During wafer cleaning and drying, the medium enters the lifting plug through the feed pipe. The lifting plug moves upward, pressing the medium into the processing box and forming a uniform high-pressure jet at the feed hole to cover the wafer surface. Simultaneously, the processing box and the discharge ring rotate to change the jet trajectory, and the flip ring can also scrape the feed hole to prevent clogging. The clamping assembly achieves multi-degree-of-freedom movement of the wafer through a double-ring structure of a flipping ring and a rotating ring. Combined with the flexible clamping of the airbag and the protective design of the positioning clamp, it not only meets the requirement of non-destructive wafer clamping but also solves the "shadowing effect" problem in the cleaning of advanced nanodevices through full-angle spatial adjustment. The hemispherical processing box structure of the processing assembly ensures jet uniformity, and the integrated ultra-fine filter membrane and the precision pressure control system driven by piezoelectric ceramic actuators guarantee the ultra-cleanliness of the medium and the non-destructive control of the processing process. The perfect synergy of these two systems makes this equipment a process tool for meeting the challenges of advanced semiconductor device manufacturing. Attached Figure Description

[0016] Figure 1 This is a structural diagram of a drying device with wafer clamping components. Figure 2 An exploded view of a drying equipment with wafer clamping components (view 1); Figure 3 An exploded view of a drying equipment with wafer clamping components (view 2); Figure 4 This is a structural diagram of the control panel; Figure 5 This is a structural diagram of the flip ring; Figure 6 Here is a structural diagram of the clamping component; Figure 7 This is a sectional view of the clamping component; Figure 8 for Figure 6 Enlarged view of point A in the middle; Figure 9 This is a top view of the lower operating cover; Figure 10 A cross-sectional view of the component being processed; Figure 11 This is a cross-sectional view of the lifting piston; Reference numerals: 1. Lower operating cover; 2. Operating platform; 3. Upper operating cover; 4. Lifting drive component; 5. Processing assembly; 502. Mounting sleeve; 503. Pressure regulating seat; 504. Motor 4; 505. Pressure regulating device; 506. Rotating rod; 507. Pipe; 508. Lifting plug; 509. Piston ring; 510. Processing sleeve; 511. Processing box; 512. Feed hole; 513. Mounting ring; 514. Discharge ring; 515. Partition plate; 6. Clamping assembly; 601. Tilting ring; 602. Rotating ring; 603. Clamping component; 604. Moving frame; 605. Moving structure; 606. Mounting frame; 607. Air pump; 608. Airbag; 609. Protective protrusion; 610. Connecting rod; 611. Rotating head; 612. Half gear; 613. Double rack; 614. Clamping wheel; 615. Cleaning ring; 616. Positioning clamp; 7. Feed valve; 8. Feeding component; 801. Feed pipe; 802. Support base; 9. Through hole. Detailed Implementation

[0017] Example 1: This invention proposes a drying device with a wafer clamping assembly, such as... Figures 1-3As shown, the system includes an operating table 2, a clamping assembly 6, a feeding component 8, and a processing assembly 5. A lifting drive 4 is provided on one side of the operating table 2. An upper operating cover 3 and a lower operating cover 1, positioned opposite each other, are respectively located at the upper and lower ends of the operating table 2. The upper operating cover 3 is lifted and lowered by the lifting drive 4. The clamping assembly 6, mounted on the operating table 2, is a multi-directional rotatable annular structure with a through-hole 9 at its center for wafer positioning. A clamping component 603, rotatable around the circumference of the through-hole 9, is provided around the outer periphery of the through-hole 9. The feeding components 8 are respectively located inside the upper operating cover 3 and the lower operating cover 1, used to introduce cleaning and drying media. Multiple sets of processing assemblies 5 are arranged in pairs inside the upper operating cover 3 and the lower operating cover 1. Each pair of processing assemblies 5 connects to the corresponding feeding component 8 on one side and is mirror-connected to the corresponding through-hole 9 on the other. Each pair of processing assemblies 5 has a hemispherical processing cavity at its opposite end, which covers the wafer positioned within the through-hole 9, allowing for multi-directional wafer rotation, cleaning, and drying.

[0018] It should be further explained that the lifting drive component 4 is the core component driving the overall movement of the upper operating cover 3, and needs to provide smooth and precise linear motion. The preferred solution is a servo electric cylinder, as it can achieve precise position and speed control, is clean and pollution-free, and meets the high standards of semiconductor equipment. Other options include ball screw modules (driven by a motor) or precision cylinders (used in conjunction with a guide shaft).

[0019] like Figures 4-5 As shown, the clamping assembly 6 includes a flipping ring 601 that flips within the through hole 9 via a motor and a rotating shaft; a rotating ring 602 that rotates along the inner wall of the flipping ring 601 via a motor and a gear; and multiple clamping members 603 arranged along the rotating ring 602. The double-ring structure of the flipping ring 601 and the rotating ring 602 enables 360-degree adjustment of the wafer angle to achieve comprehensive cleaning and drying.

[0020] It should be further noted that a circular track is provided on the rotating ring 602.

[0021] like Figure 6 As shown, the clamping member 603 includes a movable frame 604; the front end of the movable frame 604 is provided with a movable structure 605 that cooperates with the annular track, and the rear end is provided with a mounting frame 606; the mounting frame 606 is provided with a positioning structure for multi-point clamping of the upper end, lower end and side end of the wafer.

[0022] It should be further explained that the moving structure 605 can be a set of small gears driven by a servo motor or stepper motor, meshing with the annular track (designed as a rack) on the rotating ring 602, thereby achieving precise positioning and movement of the clamping member 603 on the ring. It can also be a roller assembly with a built-in motor, directly transmitting power through friction on the track, resulting in a more compact structure.

[0023] Driven by the movable frame 604, multiple sets of clamping components 603 can be controlled to move along the circular track, thereby adjusting the position of the wafer clamping, avoiding incomplete cleaning and drying caused by fixed clamping, and facilitating the placement and removal of the wafer.

[0024] It should be further explained that the mounting bracket 606 is configured as a U-shaped structure with an opening facing the center of the through hole 9; the positioning structure at the upper and lower ends includes air bladders 608 located at the opposite ends of the upper and lower horizontal sections of the mounting bracket 606; the air bladders 608 are inflated and deflated by the air pump 607; during positioning, the edge of the wafer extends into the mounting bracket 606, and the air bladders 608 are inflated to clamp the wafer from above and below. By setting a flexible clamping surface, wear on the wafer is reduced. At the same time, by adjusting the inflation amount at multiple points, the angle of the wafer can also be adjusted, making it more flexible and dynamic during cleaning and drying.

[0025] It needs to be further explained that, such as Figure 7 As shown, the side-end positioning structure includes two sets of positioning clamps 616 located on the vertical section of the mounting bracket 606; a bidirectional rack 613 is provided between the positioning clamps 616, which moves back and forth through the cooperation of a motor and a lead screw; a clamping wheel 614 is provided at the front end of the bidirectional rack 613, and half gears 612 are provided on both sides; the half gears 612 are driven to rotate by a rotating head 611 and mesh with the bidirectional rack 613; the positioning clamps 616 are rotatably connected to the rotating head 611 through a connecting rod 610.

[0026] When the edge of the wafer extends into the mounting bracket 606, the bidirectional rack 613 moves forward, and the clamping wheel 614 abuts against the wafer edge, positioning it at the center of the through-hole 9. Then, after the upper and lower ends of the wafer are positioned by the inflated airbags 608, the bidirectional rack 613 drives the clamping wheel 614 to move backward, and the two sets of positioning clamps 616 clamp and position the wafer close to its edge. During the cleaning and drying process, the positioning clamps 616 and airbags 608 release their clamping, allowing the clamping wheel 614 to rotate the wafer, adjust its position, and then clamp and position it again to avoid dead zones during cleaning and drying.

[0027] It needs to be further explained that, such as Figure 8 As shown, a protective protrusion 609 is provided on the inner wall of the positioning clamp 616. The protective protrusion 609 can increase the clamping stability and protection of the wafer by the positioning clamp 616.

[0028] like Figure 9 As shown, the feeding component 8 includes a feeding pipe 801; the feeding pipe 801 is connected to the external raw material storage equipment through the feeding valve 7 on one side, and to the corresponding processing component 5 through the pipeline on the other side. Support seats 802 that contact the operating table 2 are provided on the opposite ends of the two sets of feeding pipes 801.

[0029] like Figures 9-11As shown, the processing component 5 includes a mounting sleeve 502 surrounding the feed pipe 801; a processing sleeve 510 is provided at the upper end of the mounting sleeve 502, and a partition 515 is provided between the mounting sleeve 502 and the processing sleeve 510; a pressure regulating seat 503 is provided at the upper end of the partition 515, and a pressure regulating device 505 communicating with the pressure regulating seat 503 is provided at the lower end; the processing sleeve 510 has an opening at its end, and a processing box 511 with a feed hole 512 forming a hemispherical processing cavity is provided on the opening; a lifting plug 508 that slides up and down with the air pressure is provided between the processing box 511 and the partition 515.

[0030] It should be further explained that the processing box 511 and the lifting plug 508 are configured as matching hemispheres; a piston ring 509 is provided on the hemispherical opening of the lifting plug 508.

[0031] It should be further explained that multiple sets of feed holes 512 are distributed along the wall of the processing box 511, and a filter membrane is installed on each set of feed holes 512. The filter membrane should be an ultra-high purity PTFE (polytetrafluoroethylene) membrane or nylon membrane specifically designed for semiconductor processes, with a pore size typically between 0.05 micrometers and 0.2 micrometers. Its main filtering targets are tiny particulate contaminants, colloidal particles, and metal ions generated during transport that may be present in the cleaning and drying media. If these contaminants remain on the wafer surface, they can cause fatal defects such as short circuits and open circuits. The filter membrane is a key component ensuring that the media achieves the ultra-high purity required for semiconductor processes.

[0032] It should be further explained that the lifting plug 508 is provided with a pipe 507 that connects to the feed pipe 801.

[0033] It should be further explained that the core function of the pressure regulating device 505 is to provide a controllable driving force for the lifting piston 508. One specific implementation of this is a piezoelectric ceramic actuator. The piezoelectric ceramic actuator can generate extremely small and precise displacements based on the input electrical signal, thereby applying precise pressure to the pressure regulating seat 503, achieving nanometer-level control of the cleaning / drying media spray pressure. This is crucial for cleaning effectiveness and preventing wafer damage.

[0034] The cleaning and drying medium is introduced above the lifting plug 508 through the through pipe 507. The pressure regulating device 505 and the pressure regulating seat 503 work together to push the lifting plug 508 up and down, thereby driving the cleaning and drying medium from the feed hole 512 into the processing box 511. The feed hole 512 pressurizes, disperses and filters the output material. The wafer rotates to complete the cleaning and drying process.

[0035] It should be further explained that an installation ring 513 is provided at the hemispherical bottom of the lifting plug 508; a rotatable discharge ring 514 is provided inside the installation ring 513; a discharge port of the connecting pipe 507 is provided on the discharge ring 514; the middle part of the rotating rod 506 slides through the discharge ring 514, and the end is connected to the hemispherical bottom of the treatment box 511. The rotating rod 506 is driven to rotate by the motor 504, which drives the treatment box 511 and the discharge ring 514 to rotate synchronously; when the lifting plug 508 is full of material and moves upward, the rotating rod 506 rotates, and the discharge ring 514 and the installation ring 513 rise and fall synchronously along the rotating rod 506, further enriching the movement trajectory of the cleaning and drying medium and enhancing the cleaning and drying effect.

[0036] It should be further explained that the shape and size of the flip ring 601 match the hemispherical processing cavity, and a cleaning ring 615 is provided on the outer wall of the flip ring 601. As the flip ring 601 flips, it pushes and turbulents the cleaning and drying medium to enhance the cleaning and drying effect. At the same time, it can also clean and unclog the feed hole 512.

[0037] In this embodiment, the cleaning medium is high-purity deionized water or SC1 or SC2 cleaning solutions mixed with trace amounts of ammonia, hydrogen peroxide, and other chemicals, used to remove particulate and metallic contaminants from the wafer surface. The drying medium is high-purity isopropanol vapor or heated high-purity nitrogen. Its working principle is based on the "Marangoni effect" or physical displacement; when the low-surface-tension IPA vapor contacts the wafer surface, it causes the deionized water to rapidly contract and detach from the wafer surface, thus achieving traceless drying. The medium is introduced through the feed pipe 801 and enters the lifting plug 508 through the pipe 507. Under the precise push of the pressure regulating device 505, the lifting plug 508 moves upward, pressing the medium into the processing box 511. The medium passes through the feed holes 512, which are covered with filter membranes and distributed throughout the walls of the processing box 511, forming numerous fine, uniform, and filtered high-pressure jets that are sprayed onto the wafer surface, which is clamped and rotating in a multi-axis state. The dynamic rotation of the wafer combined with the all-round coverage of the medium ensures thorough cleaning and drying without any blind spots.

[0038] The hemispherical inner wall guides the jet of media to the center of the cavity (i.e., the wafer position), forming a uniform flow field with low turbulence. This avoids eddies or dead zones generated at the corners of square or cylindrical cavities, ensuring full and uniform contact between the media and the entire wafer surface. The distance from any feed hole 512 on the processing chamber wall to the center point of the wafer surface is essentially equal, guaranteeing consistency in media jet pressure and coverage uniformity. Its shape perfectly matches the movement trajectory of the flipping ring 601, forming a compact and efficient sealed processing space when closed, while reserving sufficient and reasonable space for wafer flipping and rotation, avoiding interference with the cavity wall.

[0039] Example 2: Based on the drying equipment with wafer clamping components in the above examples, this example proposes a wafer drying method, the steps of which are as follows: Step 1: Wafer Loading and Precise Positioning: The lifting drive 4 is activated, driving the upper operating cover 3 to rise, separating the upper and lower hemispherical processing cavities. At this time, the clamping assembly 6 is in the open state: all clamping components 603 move to the outer periphery along the annular track of the rotating ring 602 via their moving structure 605, leaving space for wafer placement; simultaneously, the upper and lower airbags 608 on each clamping component 603 are in the deflated and contracted state, and the side positioning clamps 616 are in the open state. The wafer to be processed is horizontally fed into the central area of ​​the through-hole 9 by an external automated robotic arm; The precise positioning process then proceeds. Each clamping element 603's bidirectional rack 613 moves forward under the drive of a three-wheeled motor, causing its front clamping wheel 614 to gently press against the wafer edge, completing initial alignment. Next, the air pump 607 inflates the airbags 608 in the upper and lower horizontal sections, causing them to flexibly inflate and gently clamp the wafer from its upper and lower surfaces. Then, the bidirectional rack 613 retracts, and through the transmission of the meshing half-gear 612 and the rotating head 611, drives the two sets of positioning clamps 616 to synchronously move towards the center, using the protective protrusions 609 on their inner walls to firmly clamp the wafer edge from the side, completing the final positioning. Step 2: Formation of the Sealed Cavity and Preparation for Multi-Axis Rotation: The lifting drive 4 drives the upper operating cover 3 to descend smoothly until the upper and lower processing boxes 511 close, forming a sealed hemispherical processing cavity that completely encloses the wafer. To ensure that the wafer can be cleaned and dried without dead angles in subsequent processing, the airbag 608 and positioning clamp 616 can be switched to a state of maintaining slight contact but not being tightly secured, or periodically released according to a preset program. When motor 1 starts, it drives the flipping ring 601 to flip; at the same time, motor 2 starts, it drives the rotating ring 602 to rotate all the clamping parts 603 and the clamped wafer together along the circular track. Through the combined motion of flipping and rotation, the all-round dynamic adjustment of the wafer's spatial orientation is achieved. Step 3, Wafer Cleaning Process: The cleaning medium, such as high-purity deionized water or SC1 / SC2 cleaning solution, is introduced through the feed valve 7 and feed pipe 801, and transported to the lifting plug 508 through pipe 507. The pressure regulating device 505, such as a piezoelectric ceramic actuator, receives the control signal and applies precise pressure to the pressure regulating seat 503, pushing the lifting plug 508 to slide upward, uniformly pressing the cleaning medium in the cavity into the processing box 511. Under pressure, the cleaning medium is forced through the feed holes 512, which are covered with 0.05 to 0.2 micron ultra-high purity filter membranes, distributed throughout the hemispherical wall of the processing box 511, forming countless fine, uniform, and pure high-pressure jets that cover the wafer surface from both top and bottom directions. During this process, the wafer continuously undergoes multi-axis composite rotation driven by the clamping assembly, constantly changing the relative angle between its surface and the jet. Simultaneously, the motor-driven rotating rod 506 rotates, causing the processing box 511 and the discharge ring 514 to rotate slowly, further altering the angle and trajectory of the jet. The cleaning ring 615 on the outer wall of the flipping ring 601 scrapes the processing box wall during movement, preventing blockage of the feed hole 512. This combination of "dynamic wafer" and "dynamic jet" ensures that the cleaning fluid impacts every microstructure on the wafer surface, efficiently removing contaminants such as particles, organic matter, and metal ions. Step 4: Rinsing and Media Switching: After chemical cleaning, the system switches media. First, high-purity deionized water is introduced for rinsing to remove residual chemicals. The rinsing process works similarly to the cleaning stage, using jetting and wafer rotation to ensure thorough rinsing. Subsequently, high-purity, heated nitrogen gas is introduced for preliminary purging to remove most of the residual liquid water film and prepare for the subsequent drying step. Step 5, Wafer Drying Process: The drying medium, such as high-purity isopropanol vapor or high-temperature nitrogen, is introduced through the feeding system. The pressure regulating device 505 operates precisely again, pushing the lifting plug 508. The repeated raising and lowering of the lifting plug 508 allows for repeated steam entry and exit, ensuring the drying medium passes through the filter membrane in a uniform, controllable, and repetitive jet form, filling the processing chamber and acting on the wafer surface. When using isopropanol vapor, the Marangoni effect is primarily utilized; the low surface tension of the IPA vapor causes the residual water film on the wafer surface to rapidly shrink, curl, and detach, achieving high-quality drying without traces or spots. The wafer continues to rotate along multiple axes throughout the drying process to ensure drying uniformity. All process parameters, such as pressure, temperature, and time, are precisely managed by the control system. Step 6: Cavity Opening and Wafer Unloading: After the drying process is completed, the pressure regulating device 505 is depressurized, and the lifting plug 508 is reset. The lifting drive 4 drives the upper operating cover 3 to rise, separating the upper and lower processing cavities. The clamping assembly 6 repeats the precise positioning action from Step 1, firmly clamping the wafer in the center position. Finally, the automated robotic arm extends and removes the cleaned and dried wafer from the through-hole 9, and the entire equipment is ready to execute the next wafer processing cycle.

[0040] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited thereto. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention.

Claims

1. A drying apparatus with a wafer clamping assembly, characterized in that, include: The operating platform (2) is provided with a lifting drive (4) on one side. The upper operating cover (3) and the lower operating cover (1) are respectively provided at the upper and lower ends of the operating platform (2). The upper operating cover (3) is lifted by the lifting drive (4). The clamping assembly (6) is set on the operating table (2) and is a ring structure that can rotate in multiple directions. A through hole (9) for wafer positioning is set in the center; a clamping member (603) that can rotate around the circumference is set on the outer periphery of the through hole (9). Feeding components (8) are respectively installed in the upper operating cover (3) and the lower operating cover (1) for introducing cleaning and drying media; And processing components (5), multiple sets of processing components (5) are respectively arranged in pairs in the upper operating cover (3) and the lower operating cover (1). Each pair of processing components (5) is connected to the feed component (8) on the corresponding side on one hand, and is mirror-connected to the corresponding through hole (9) on the other hand. Each pair of processing components (5) is provided with a hemispherical processing cavity on the opposite end. The processing cavity covers the wafer positioned in the through hole (9) on the upper and lower sides, and the wafer is cleaned and dried in conjunction with the multi-directional rotation of the wafer.

2. The drying apparatus with a wafer clamping assembly according to claim 1, characterized in that, The clamping assembly (6) includes a flipping ring (601) that flips within a through hole (9); a rotating ring (602) that rotates along the inner wall of the flipping ring (601) is provided on the flipping ring (601). Multiple sets of clamping members (603) are arranged along the rotating ring (602).

3. The drying apparatus with a wafer clamping assembly according to claim 2, characterized in that, A circular track is provided on the rotating ring (602); The clamping component (603) includes a movable frame (604); the front end of the movable frame (604) is provided with a movable structure (605) that cooperates with the annular track, and the rear end is provided with a mounting frame (606); the mounting frame (606) is provided with a positioning structure for multi-point clamping of the upper end, lower end and side end of the wafer.

4. The drying apparatus with a wafer clamping assembly according to claim 3, characterized in that, The mounting bracket (606) is configured as a U-shaped structure with an opening facing the center of the through hole (9); The positioning structure at the upper and lower ends includes an airbag (608) located at the opposite ends of the upper and lower horizontal sections of the mounting bracket (606); the airbag (608) is inflated and deflated by an air pump (607).

5. The drying apparatus with a wafer clamping assembly according to claim 4, characterized in that, The side positioning structure includes two sets of positioning clamps (616) located on the vertical section of the mounting bracket (606); a bidirectional rack (613) that moves back and forth is provided between the positioning clamps (616); a clamping wheel (614) is provided at the front end of the bidirectional rack (613), and half gears (612) are provided on both sides; the half gears (612) are driven to rotate by the rotating head (611) and mesh with the bidirectional rack (613); the positioning clamps (616) are rotatably connected to the rotating head (611) through the connecting rod (610).

6. The drying apparatus with a wafer clamping assembly according to claim 5, characterized in that, The inner wall of the positioning clip (616) is provided with a protective protrusion (609).

7. The drying apparatus with a wafer clamping assembly according to claim 2, characterized in that, The feeding component (8) includes a feeding pipe (801); the feeding pipe (801) is connected to the external raw material storage equipment through the feeding valve (7) on one hand, and to the corresponding processing component (5) through the pipeline on the other hand. Support seats (802) that contact the operating table (2) are provided on the opposite ends of the two sets of feeding pipes (801).

8. The drying apparatus with a wafer clamping assembly according to claim 7, characterized in that, The processing assembly (5) includes a mounting sleeve (502) surrounding the feed pipe (801); a processing sleeve (510) is provided at the upper end of the mounting sleeve (502), and a partition (515) is provided between the mounting sleeve (502) and the processing sleeve (510); a pressure regulating seat (503) is provided at the upper end of the partition (515), and a pressure regulating device (505) communicating with the pressure regulating seat (503) is provided at the lower end; the processing sleeve (510) has an opening at the end, and a processing box (511) with a feed hole (512) forming a hemispherical processing cavity is provided on the opening; a lifting plug (508) that slides up and down with the air pressure is provided between the processing box (511) and the partition (515). The processing box (511) and the lifting plug (508) are configured as matching hemispheres; a piston ring (509) is provided on the hemisphere opening of the lifting plug (508). Multiple sets of feed holes (512) are distributed along the wall of the processing box (511), and a filter membrane is provided on each set of feed holes (512); A pipe (507) connecting to the feed pipe (801) is provided on the lifting plug (508).

9. The drying apparatus with a wafer clamping assembly according to claim 8, characterized in that, An installation ring (513) is provided at the bottom of the hemispherical part of the lifting plug (508); a rotatable discharge ring (514) is provided inside the installation ring (513); a discharge port of the connecting pipe (507) is provided on the discharge ring (514); the middle part of the rotating rod (506) slides through the discharge ring (514), and the end is connected to the bottom of the hemispherical part of the processing box (511). The rotating rod (506) rotates to drive the processing box (511) and the discharge ring (514) to rotate synchronously.

10. The drying apparatus with a wafer clamping assembly according to claim 8, characterized in that, The shape and size of the flip ring (601) match the hemispherical processing cavity, and a cleaning ring (615) is provided on the outer wall of the flip ring (601).

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