Electronic device

Abstract

The invention provides an electronic device. The electronic device includes a carrier, a waveguide structure, and an antenna structure. The waveguide structure is supported by the carrier. The rigidity of the waveguide structure is greater than that of the carrier. The antenna structure is supported by the waveguide structure. The antenna structure includes an electromagnetic radiation circuit and a control circuit configured to control a radiation direction of electromagnetic waves radiated from the electromagnetic radiation circuit.

Description

Technical Field

[0001] This disclosure generally relates to electronic devices, and more particularly to electronic devices comprising a waveguide structure separate from a carrier. Background Technology

[0002] To reduce the size of electronic device packages and achieve higher integration density, several packaging solutions have been developed and implemented, including antenna in package (AiP), antenna on package (AoP), and substrate integrated waveguide (SIW) antennas.

[0003] However, in order to support the industry’s demand for increased functionality, the size of electronic device packages will inevitably increase, which may limit some applications (e.g., in portable devices). Summary of the Invention

[0004] In some arrangements, an electronic device includes a carrier, a waveguide structure, and an antenna structure. The waveguide structure is supported by the carrier. The rigidity of the waveguide structure is greater than the rigidity of the carrier. The antenna structure is supported by the waveguide structure. The antenna structure includes an electromagnetic radiation circuit and a control circuit configured to control the radiation direction of electromagnetic waves radiated from the electromagnetic radiation circuit.

[0005] In some arrangements, an electronic device includes a carrier, a waveguide structure, an antenna structure, and a direction modifier. The carrier has a first dielectric constant. The waveguide structure has a second dielectric constant different from the first dielectric constant. The antenna structure is coupled to the carrier through the waveguide structure. The direction modifier is configured to adjust the coverage angle of electromagnetic waves radiated from the antenna structure.

[0006] In some arrangements, an electronic device includes a radio frequency (RF) circuit module and an antenna module. The antenna module is attached to the RF circuit module. The antenna module includes an antenna array and a plurality of components above the antenna array. The plurality of components are adjustable to control the radiation direction of electromagnetic waves radiated from the antenna array. Attached Figure Description

[0007] Some aspects of the arrangements of this disclosure can be best understood by reading in conjunction with the accompanying drawings and the following detailed description. It should be noted that the various structures may not be drawn to scale, and the dimensions of the various structures may be arbitrarily increased or decreased for clarity of explanation.

[0008] Figure 1A This is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0009] Figure 1B The arrangement according to this disclosure is shown as follows Figure 1A A partial magnified view of the electronic device shown.

[0010] Figure 1C The arrangement according to this disclosure is shown as follows Figure 1A A partial magnified view of the electronic device shown.

[0011] Figure 1D The arrangement according to this disclosure is shown as follows Figure 1A A partial magnified view of the electronic device shown.

[0012] Figure 2 This is a schematic diagram of the waveguide structure and slot layout of an electronic device arranged according to the present disclosure.

[0013] Figure 3 This is a schematic diagram of the waveguide structure and slot layout of an electronic device arranged according to the present disclosure.

[0014] Figure 4 It is a partial layout of an electronic device arranged according to this disclosure.

[0015] Figure 5 This is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0016] Figure 6 This is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0017] Figure 7 This is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0018] Figure 8 It is a partial layout of an electronic device arranged according to this disclosure.

[0019] Figure 9 This is a schematic diagram illustrating the electromagnetic waves of an electronic device according to the arrangement of this disclosure.

[0020] Common reference numerals are used throughout the drawings and detailed description to indicate the same or similar components. This disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. Detailed Implementation

[0021] The following disclosure provides numerous different arrangements or examples of implementing various features of the provided subject matter. Specific examples of components and arrangements are described below. These components and arrangements are, of course, merely examples and are not intended to be limiting. In this disclosure, references to arrangements in which a first feature is formed or disposed on or on a second feature may include arrangements in which the first and second features are formed or disposed in direct contact, and may also include arrangements in which one or more additional features may be formed or disposed between the first and second features such that the first and second features may not be in direct contact. Furthermore, reference numerals and / or letters may be repeated in various instances of this disclosure. Identical reference numerals and / or letters refer to identical or similar parts. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various arrangements and / or configurations.

[0022] The arrangements of this disclosure are described in detail below. However, it should be understood that this disclosure provides many applicable concepts that can be implemented in a wide variety of specific situations. The specific arrangements discussed are merely illustrative and do not limit the scope of this disclosure.

[0023] Figure 1A This is a cross-sectional view of an electronic device 1a according to the arrangement of this disclosure. In some arrangements, the electronic device 1a may be adapted to, for example, a wireless device, such as user equipment (UE), a mobile station, a mobile device, a device communicating with the Internet of Things (IoT), etc. In some arrangements, the electronic device 1a may be or include a portable device. In some arrangements, the electronic device 1a may support fifth-generation (5G) communication, such as sub-6 GHz bands and / or millimeter (mm) wave bands. For example, the electronic device 1a may incorporate both sub-6 GHz devices and millimeter wave devices. In some arrangements, the electronic device 1a may support communication beyond 5G or 6G, such as terahertz (THz) frequencies. The electronic device 1a may be configured to radiate and / or receive electromagnetic signals, such as radio frequency (RF) signals. For example, electronic device 1a may be configured to operate at frequencies between about 10 GHz and about 10 THz (e.g., 10 GHz, 20 GHz, 30 GHz, 40 GHz, 50 GHz, 100 GHz, 300 GHz, 1 THz, 5 THz or 10 THz).

[0024] In some arrangements, the electronic device 1a may include a carrier 10, electronic components 20, a waveguide structure 30, an antenna structure 40, and switch elements 50a and 50b.

[0025] In some arrangements, the carrier 10 may include, for example, a printed circuit board (PCB), such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate. The carrier 10 may have a surface 10s1 (or a lower surface) and a surface 10s2 (or an upper surface) opposite to surface 10s1. In some arrangements, the carrier 10 may include a dielectric structure 11 and a redistribution structure 12. The carrier 10 may additionally include one or more transmission lines (e.g., communication cables) and one or more ground lines and / or ground planes that are adjacent to, near, or embedded in and exposed on surfaces 10s1 and / or 10s2 of the carrier 10.

[0026] In some arrangements, the dielectric structure 11 may comprise multiple dielectric layers. In some arrangements, the material of the dielectric structure 11 may comprise, for example, polypropylene (PP), polyimide (PI), or other suitable materials. In some arrangements, the lower surface of the dielectric structure 11 may be defined as surface 10s1 of the dielectric structure 11. In some arrangements, the upper surface of the dielectric structure 11 may be defined as surface 10s2 of the dielectric structure 11.

[0027] In some arrangements, electronic device 1a may include a redistribution structure 12. The redistribution structure 12 may include conductive pads, traces, vias, layers, or other interconnects embedded within the dielectric structure 11. In some arrangements, the redistribution structure 12 may be configured to provide a feed signal to waveguide structure 30. In some arrangements, the redistribution structure 12 may be configured to provide a feed signal to antenna structure 40. In some arrangements, the redistribution structure 12 may be configured to provide a feed signal to antenna structure 40 through waveguide structure 30. In some arrangements, the redistribution structure 12 may be configured to provide a control signal to antenna structure 40, the control signal being configured to turn switching elements 50a and 50b on or off. In some arrangements, a portion of the redistribution structure 12 may be electrically connected to ground.

[0028] In some arrangements, the carrier 10 may be electrically coupled to the waveguide structure 30 via the electrical connector 16. In some arrangements, the electrical connector 16 may comprise, for example, a solder material, such as an alloy of gold and tin solder or an alloy of silver and tin solder. In some arrangements, the electrical connector 16 may be replaced by a hybrid bonding structure. In some arrangements, the electrical connector 16 may be exposed to air. In some arrangements, the electrical connector 16 may be encapsulated or covered by a dielectric layer, underfill, or other suitable material.

[0029] In some arrangements, electronic component 20 may be disposed above or below surface 10s1 of carrier 10. Electronic component 20 may be adjacent to or disposed above surface 10s1 of carrier 10. Electronic component 20 may be electrically connected to one or more other electrical components (if present) and electrically connected to carrier 10 (e.g., to interconnects), and the electrical connection may be achieved by means of flip-chip, wire bonding, metal-to-metal bonding (e.g., Cu-to-Cu bonding), or hybrid bonding. Electronic component 20 may be a chip or die containing a semiconductor substrate, one or more integrated circuit (IC) devices, and one or more overlaid interconnect structures. IC devices may include active devices such as transistors and / or passive devices such as resistors, capacitors, inductors, or combinations thereof. For example, electronic component 20 may include a system-on-chip (SoC). For example, electronic component 20 may include a radio frequency integrated circuit (RFIC), an application-specific IC (ASIC), a central processing unit (CPU), a microprocessor unit (MPU), a graphics processing unit (GPU), a microcontroller unit (MCU), a field-programmable gate array (FPGA), or another type of IC. In some arrangements, electronic component 20 may be configured to provide a signal (e.g., a feed signal) to waveguide structure 30. In some arrangements, electronic component 20 may be configured to drive the slots of antenna structure 40 to operate in on or off modes.

[0030] In some arrangements, electronic component 20 may be electrically coupled to carrier 10 via electrical connector 22. In some arrangements, electrical connector 22 may comprise, for example, solder material, such as an alloy of gold and tin solder or an alloy of silver and tin solder.

[0031] In some arrangements, the electronic device 1a may include a passive component 24. In some arrangements, the passive component 24 may be disposed above or below the surface 10s1 of the carrier 10. In some arrangements, the passive component 24 may include a capacitor, a resistor, an inductor, or a combination thereof.

[0032] In some arrangements, the electronic device 1a may include an encapsulant 26. In some arrangements, the encapsulant 26 may be disposed above or below the surface 10s1 of the carrier 10. The encapsulant 26 may encapsulate the electronic component 20. The encapsulant 26 may encapsulate the passive component 24. The encapsulant 26 may encapsulate the electrical connector 22. The encapsulant 26 may contain an insulating or dielectric material. In some arrangements, the encapsulant 26 may be made of a molding material, which may contain, for example, a phenolic resin, an epoxy resin, a silicone resin, or another suitable encapsulant. It may also contain a suitable filler, such as powdered SiO2.

[0033] In some arrangements, the waveguide structure 30 may be disposed on or above the surface 10s2 of the carrier 10. In some arrangements, the waveguide structure 30 may be configured to provide a feed signal to the antenna structure 40. In some arrangements, the waveguide structure 30 may include a substrate 31 and a waveguide 32.

[0034] In some arrangements, substrate 31 has a larger modulus (or rigidity) than dielectric structure 11. In some arrangements, substrate 31 has a larger dielectric constant than dielectric structure 11. In some arrangements, the dielectric constant of substrate 31 may be in the range of about 4 F / m to 7 F / m, for example, 4, 5, 6, or 7 F / m. In some arrangements, the dielectric constant of dielectric structure 11 may be in the range of about 2 F / m to 4 F / m, for example, 2, 3, or 4 F / m. The larger dielectric constant of substrate 31 can help reduce the surface area (or volume) of waveguide 32. In some arrangements, waveguide structure 30 may comprise glass, ceramic, sapphire, or other suitable materials. In some arrangements, the material of substrate 31 may be different from the material of dielectric structure 11. In some arrangements, substrate 31 may be spaced apart from dielectric structure 11 by electrical connector 16. In some arrangements, substrate 31 may be formed on carrier 10 by solder bonding technology, which may include reflow soldering technology and other suitable technologies. In some arrangements, substrate 31 may have a surface 31s1 (or a lower surface) and a surface 31s2 (or an upper surface) opposite to surface 31s1. In some arrangements, a portion of surface 31s1 may be exposed to air. In some arrangements, the lower surface of substrate 31 may be defined as surface 31s1 of waveguide structure 30. In some arrangements, the upper surface of substrate 31 may be defined as surface 31s2 of waveguide structure 30.

[0035] In some arrangements, waveguide 32 may be defined by a plurality of conductive vias 33. In some arrangements, the conductive vias 33 may be embedded within a substrate 31. In some arrangements, waveguide structure 30 may be configured to radiate electromagnetic waves, such as RF signals. In some arrangements, waveguide structure 30 may define an electromagnetic resonator as... Figure 1AThe framed area is shown in the figure. In some arrangements, waveguide structure 30 may include or be made of conductive structures, such as copper (Cu), tungsten (W), ruthenium (Ru), iridium (Ir), nickel (Ni), osmium (Os), ruthenium (Rh), aluminum (Al), molybdenum (Mo), cobalt (Co), their alloys, combinations thereof, or any metallic material.

[0036] Electronic device 1a may include a conductive via 34. In some arrangements, the conductive via 34 may be embedded within a substrate 31. In some arrangements, the conductive via 34 may be located outside the waveguide region (or electromagnetic resonator) of the waveguide structure 30. In some arrangements, the conductive via 34 may be located in a peripheral region of the substrate 31. In some arrangements, the conductive via 34 may be electrically coupled to switching elements 50a and 50b. In some arrangements, the conductive via 34 may be configured to turn on and / or off the switching elements 50a and 50b.

[0037] In some arrangements, the antenna structure 40 may be positioned on or above the surface 31s2 of the waveguide structure 30. In some arrangements, the antenna structure 40 may be in contact with the surface 31s2 of the waveguide structure 30. In some arrangements, the antenna structure 40 may include a dielectric layer 41, conductive traces 42t1 and 42t2.

[0038] A dielectric layer 41 may be disposed on or above a substrate 31. In some arrangements, the material of the dielectric layer 41 may be different from the material of the substrate 31. In some arrangements, the material of the dielectric layer 41 may comprise, for example, polypropylene (PP), polyimide (PI), or other suitable materials. In some arrangements, the thickness H2 of the dielectric layer 41 may be less than the thickness H1 of the substrate 31. In some arrangements, the ratio of thickness H2 to thickness H1 may be in the range of about 0.3 to about 0.7, for example, 0.3, 0.4, 0.5, 0.6, or 0.7. In some arrangements, the dielectric constant of the dielectric layer 41 may be in the range of about 2 to 4, for example, 2, 3, or 4.

[0039] In some arrangements, conductive trace 42t2 may be electrically coupled to conductive via 34. In some arrangements, conductive trace 42t2 may contact surface 31s2 of waveguide structure 30. In some arrangements, conductive trace 42t1 may define a SIW (substrate-integrated waveguide) antenna. Conductive trace 42t1 may be configured to define a slot waveguide antenna. In some arrangements, conductive trace 42t1 may include a conductive pattern comprising slots 45a and 45b. Conductive trace 42t1 may act as an electromagnetic radiation circuit configured to transmit or receive RF signals. Slots 45a and 45b may act as part of an electromagnetic resonator that generates, defines, or influences an equivalent surface magnetic current along or across slots 45a and 45b. In some arrangements, a portion of waveguide 32, slots 45a and 45b may form an electromagnetic resonator. In some arrangements, slot 45a may vertically overlap with switching element 50a. In some arrangements, slot 45b may vertically overlap with switching element 50b.

[0040] Conductive trace 42t2 (or control circuitry) may be embedded within dielectric layer 41. In some arrangements, conductive via 34 may be configured to connect and / or disconnect switching elements 50a and 50b. In some arrangements, conductive trace 42t1 and conductive trace 42t2 may be referred to as a metal layer (M1) or a first metal layer.

[0041] In some arrangements, antenna structure 40 may include conductive traces 44t1 and 44t2. Conductive traces 44t1 and 44t2 may be disposed above or on the surface 41s1 (or upper surface) of dielectric layer 41. Conductive trace 44t1 may be electrically coupled to conductive trace 42t1. In some arrangements, conductive trace 44t1 may be electrically coupled to a first terminal of switching element 50a (or 50b), and conductive trace 44t2 may be electrically coupled to a second terminal of switching element 50a (or 50b). In some arrangements, conductive traces 44t1 and 44t2 may define slots above slots 45a and 45b, respectively. In some arrangements, conductive traces 44t1 and 44t2 may be referred to as a metal double layer (M2) or a second metal layer.

[0042] In some arrangements, waveguide structure 30 and antenna structure 40 can be collectively referred to as waveguide antenna structure.

[0043] In some arrangements, switching elements 50a and 50b may be positioned above or above antenna structure 40. In some arrangements, switching elements 50a and 50b may span across a corresponding slot 45a and 45b. In some arrangements, switching elements 50a and 50b may cover a corresponding slot 45a and 45b. For example, a first terminal (not labeled) of switching elements 50a and 50b may be positioned on a first side of one of slots 45a and 45b, and a second terminal (not labeled) of switching elements 50a and 50b may be positioned on a second side of said slot 45a and 45b opposite to the first side. In some arrangements, switching elements 50a and 50b may be configured to control, modify, and / or adjust electromagnetic waves radiated from carrier 10, including radiation pattern, field type, and / or frequency. In some arrangements, switching elements 50a and 50b may be configured to enable and / or disable slot 45a (or 45b) to act as part of an electromagnetic resonator. In some arrangements, switching elements 50a and 50b may comprise varactor diodes, such as diodes, transistors, or other suitable switches. In some arrangements, switching elements 50a and 50b may act as frequency modifiers. In some arrangements, switching elements 50a and 50b may act as direction modifiers (or electromagnetic wave direction modifiers) to control or adjust the coverage angle of electromagnetic waves radiated from antenna structure 40. In this arrangement, the radiation direction of the electromagnetic waves can be controlled by turning switching elements 50a and 50b on or off. For example, the coverage angle of the electromagnetic waves can be controlled, thereby controlling the range or area of ​​received or transmitted electromagnetic waves. In some arrangements, when two or more switching elements are positioned above a slot, the frequency of the electromagnetic waves can be modified by turning each switching element on or off.

[0044] Figure 1B , 1C And 1D shows the arrangement according to this disclosure as follows Figure 1A A partial magnified view of the electronic device shown.

[0045] like Figure 1B As shown, the surface 31s2 of the substrate 31 can be relatively flat. For example... Figure 1C As shown, the surface 10s2 of the carrier 10 can be relatively rough. For example... Figure 1DAs shown, the surface 41s1 of the dielectric layer 41 may be relatively rough. In some arrangements, the surface roughness of the surface 31s2 of the substrate 31 may be less than the surface roughness of the surface 10s2 of the carrier 10. In some arrangements, the surface roughness of the surface 31s2 of the substrate 31 may be less than the surface roughness of the surface 41s1 of the dielectric layer 41. Similarly, the surface roughness of the surface 31s1 of the substrate 31 may be less than the surface roughness of the surface 10s2 of the carrier 10. The surface roughness of the surface 31s1 of the substrate 31 may be less than the surface roughness of the surface 41s1 of the dielectric layer 41.

[0046] In some cases, the operating frequency of an antenna is sensitive to the pattern or profile of the trace, leading to potential deviations in operating frequency and gain when the antenna pattern is uneven. However, in this arrangement, the antenna pattern is formed on a relatively smooth surface (e.g., surface 31s2), resulting in improved antenna performance. Additionally, in a comparative example, the waveguide structure and feed trace are formed by stacking multiple dielectric layers (e.g., PI or PP), causing the process window to be affected by the previously formed layers and resulting in low yield. In contrast, in this arrangement, the substrate (e.g., substrate 31) and carrier of the waveguide structure are two separate parts, effectively addressing the aforementioned problems.

[0047] Figure 2 This is a schematic diagram of the layout of the waveguide 32a and slot 45 of the electronic device arranged according to this disclosure. Figure 2 The waveguide 32a and slot 45 shown are applicable to electronic device 1a.

[0048] In some arrangements, the conductive via 33 may include a region 33R1 (or a grounding via structure) and a region 33R2 (or a grounding via structure) separate from region 33R1. Regions 33R1 and 33R2 may be areas where grounding vias are housed. The conductive via 33 may have different densities at different locations. In some arrangements, the conductive via 33 may define an impedance matching element 36. In some arrangements, the arrangement of the conductive via 33 may have a tapered profile 36r to define the impedance matching element 36. In some arrangements, the length of the tapered profile of the impedance matching element 36 may be in the range of about 0.25 to about 0.5 times the wavelength of the signal radiated from the waveguide. In some arrangements, the impedance matching element 36 may not vertically overlap with the slot 45. In some arrangements, the density of the conductive via 33 adjacent to the impedance matching element 36 may be greater than the density of the conductive vias distant from the impedance matching element 36. In some arrangements, the density of conductive vias 33 adjacent to impedance matching element 36 may be greater than the density of conductive vias in region 33R2.

[0049] In some arrangements, the conductive trace 42t1 may have an opening to define a slot 45. In some arrangements, the slot 45 may have an array 45r1 and an array 45r2 spaced apart from the array 45r1 by a region 33R2 when viewed from a top view. In this arrangement, the region 33R2 is configured to define or separate two waveguides (e.g., a first waveguide defined by the array 45r1 and a second waveguide defined by the array 45r2).

[0050] Figure 3 This is a schematic diagram of the layout of the waveguide 32b and slot 45 of the antenna of the electronic device arranged according to the present disclosure. Figure 3 The waveguide 32b and slot 45 shown are applicable to electronic device 1a.

[0051] In some arrangements, waveguide 32b may further include region 33R3 (or grounding via structure) and region 33R4 (or grounding via structure). Regions 33R3 and 33R4 may be areas where grounding vias are disposed. Region 33R3, viewed from a top view, may be spaced apart from region 33R2 by array 45r2. Region 33R4, viewed from a top view, may be spaced apart from region 33R3 by array 45r3. Region 33R4, viewed from a top view, may be spaced apart from region 33R1 by array 45r4. In some arrangements, the length of region 33R3 along the arrangement direction of the slot 45 of array 45r1 may differ from the lengths of region 33R2 or region 33R4. In this arrangement, zones 33R2, 33R3, and 33R4 are configured to define four waveguides (e.g., a first waveguide defined by array 45r1, a second waveguide defined by array 45r2, a third waveguide defined by array 45r3, and a fourth waveguide defined by array 45r4).

[0052] Figure 4 It is a partial layout of M2 of electronic device 1a arranged according to this disclosure.

[0053] Conductive trace 44t1 can enclose conductive trace 44t2. Although Figure 4Not shown, but it should be noted that the internal connections of conductive trace 44t2 can be coupled through M1 and the through-hole between M1 and M2. The gap between conductive trace 44t1 and conductive trace 44t2 defines slots 45a and 45b. In some arrangements, switching elements 50a or 50b may include terminals 50e1 and 50e2. Terminal 50e1 may be electrically coupled to conductive trace 44t1. Terminal 50e2 may be electrically coupled to conductive trace 44t2. Therefore, conductive trace 44t2 can be configured to turn switching elements 50a and 50b on or off to determine whether slots 45a and 45b are in an on or off mode. In some arrangements, conductive trace 44t2 may be configured to control or modify the radiation direction of electromagnetic waves radiated from conductive trace 42t1. Conductive trace 44t2 may include portions 42p21 and 42p22. Part 44p22 may extend between two adjacent parts 44p21. In some arrangements, the ratio of the width W1 of part 44p22 to the distance D1 between conductive trace 44t1 and part 44p22 may be in the range of about 2 to about 5, for example 2, 3, 4 or 5.

[0054] Figure 5 This is a cross-sectional view of the electronic device 1b arranged according to the present disclosure. The electronic device 1b is similar to... Figure 1A The electronic device 1a shown is described below, and the differences therebetween are described below.

[0055] In some arrangements, electronic device 1b may include an adhesive layer 60 and a conductive structure 62 embedded within the adhesive layer 60. In some arrangements, the adhesive layer 60 may be disposed between the waveguide structure 30 and the carrier 10. The adhesive layer 60 may be configured to attach the waveguide structure 30 to the carrier 10. The adhesive layer 60 may act as a protective layer configured to protect traces therein. The adhesive layer 60 may comprise an epoxide, polyurethane, cyanoacrylate, acrylic polymer, or other suitable material. The conductive structure 62 may be configured to electrically couple the carrier 10 to the waveguide structure 30. In some arrangements, the conductive structure 62 may taper toward the carrier 10. In some arrangements, the adhesive layer 60 may lose its viscosity in the final product and act as a bonding layer.

[0056] The carrier 10 may include traces and / or pads 13 above surface 10s2. The waveguide structure 30 may include traces and / or pads 35 below surface 31s1. The conductive structure 62 may extend and couple between the traces and / or pads 13 and the traces and / or pads 35. In some arrangements, an adhesive layer 60 may be formed on the carrier 10. The adhesive layer 60 may define openings to receive conductive paste (e.g., copper paste). The traces and / or pads 35 may then be pressed into the adhesive layer 60 and connected to the conductive paste. Subsequently, a curing technique may be performed to cure the adhesive layer 60 and the conductive paste, thereby forming the conductive structure 62.

[0057] Figure 6 This is a cross-sectional view of the electronic device 1c arranged according to the present disclosure. The electronic device 1c is similar to... Figure 1A The electronic device 1a shown is described below, and the differences therebetween are described below.

[0058] In some arrangements, the electronic device 1c may include a circuit layer 70. The circuit layer 70 may be disposed above or below the surface 31s1 of the substrate 31. The circuit layer 70 may be electrically coupled to the electrical connector 16. The circuit layer 70 may include a dielectric layer 71 and a redistribution structure 72. In some arrangements, the material of the dielectric layer 71 may include, for example, polypropylene (PP), polyimide (PI), or other suitable materials. In some arrangements, the surface (or lower surface) 71s1 of the dielectric layer 71 may be exposed to air.

[0059] Figure 7 This is a cross-sectional view of an electronic device 1d arranged according to the present disclosure. The electronic device 1d is similar to... Figure 1A The electronic device 1a shown is described below, and the differences therebetween are described below.

[0060] In some arrangements, the width W1 of the carrier 10 may differ from the width W2 of the waveguide structure 30. In some arrangements, the width W2 of the waveguide structure 30 may be greater than the width W1 of the carrier 10. In this arrangement, the electronic device 1d has control circuitry (e.g., conductive vias 34, conductive traces 42t2, and conductive traces 44t2), and the larger surface area of ​​surface 31s2 is advantageous for antenna pattern design.

[0061] In some arrangements, the surface 41s2 (or lateral surface) of the dielectric layer 41 of the antenna structure 40 may be substantially aligned with the surface 31s3 (or lateral surface) of the substrate 31 of the waveguide structure 30. In some arrangements, the surface 11s3 (or lateral surface) of the dielectric structure 11 of the carrier 10 may not be aligned with the surface 31s3 of the substrate 31 of the waveguide structure 30.

[0062] Figure 8 It is a partial layout of the electronic device 1e arranged according to this disclosure.

[0063] In some arrangements, electronic device 1e may include a waveguide 81 and circuitry 82. Waveguide 81 and circuitry 82 may define a slot 83. Electronic device 1e may include a switch element 84 above the slot 83. In some arrangements, switch element 84 may include switch elements 841a, 841b, 841c, 842a, 842b, and 842c. Slot 83 may include slots 83a, 83b, 83c, and 83d arranged horizontally. In some arrangements, switch elements 841a, 841b, and 841c may be positioned across slot 83a. In some arrangements, switch elements 842a, 842b, and 842c may be positioned across slot 83b. Electronic device 1e may include control circuitry (not shown) configured to turn each switch element 84 on or off. In some arrangements, Figure 8 The layout shown can be applied to M1 of electronic device 1a.

[0064] In some arrangements, switching elements 841a, 841b, and 841c can be configured to control, adjust, and / or modify the equivalent length of slot 83a. In some arrangements, switching elements 842a, 842b, and 842c can be configured to control, adjust, and / or modify the equivalent length of slot 83b. In some arrangements, the equivalent length L of the slot along the vertical direction can depend on the operation of the switching elements. The frequency of electromagnetic waves can be reduced by turning on the switching elements.

[0065] In some arrangements, switching element 84 may be configured to define orifices A1 and A2. Orifices A1 and / or A2 may be considered as imaginary regions of effective slots. In some arrangements, the geometric profiles of orifices A1 and A2 may be adjusted, controlled, or modified by circuitry 82. The geometric profile of orifice A1 (or A2) may be the effective region of slot 83, including effective length and effective width. For example, when switching element 841a is in the ON condition, waveguide 81 may define orifice A1 with an equivalent length L1. When switching elements 842a and 842b are in the ON condition, waveguide 81 may define orifice A2 with an equivalent length L2. Orifice A1 may be aligned with orifice A2 in a horizontal direction. Orifices A1 and A2 may have an array arrangement in a horizontal direction. Orifices A1 and A2 may be arranged alternately, such that one of orifices A2 may be positioned between two adjacent orifices A1. Orifice A1 can be configured to radiate electromagnetic waves that form constructive interference with a first frequency. Orifice A2 can be configured to radiate electromagnetic waves that form constructive interference with a second frequency different from the first frequency. The slots 83 defining orifice A1 can be considered as one group, and the slots 83 defining orifice A2 can be considered as another group. When the frequency of the electromagnetic wave from waveguide 81 is determined, the state of switching element 84 can be determined such that the distribution of the equivalent length L of each slot 83 (or orifice) can be determined. Therefore, the distribution of orifices (e.g., A1 and A2) can be obtained, and information on the equivalent length, distribution, inter-group distance, or spacing of the orifices can be obtained. For example, when the specific frequency of the electromagnetic wave radiated from waveguide 81 is determined, the distribution of orifices A1 and A2 with different equivalent lengths L1 and L2 can be deduced from the frequency of the electromagnetic wave. Under this condition, the distance (or spacing) between two adjacent orifices A1 (or A2) can be calculated based on the frequency of the electromagnetic wave. Under other conditions, three or more different apertures (or groups) can be defined based on the frequency of electromagnetic waves. For example, three or more apertures (or groups) with different equivalent lengths.

[0066] Figure 9 This is a schematic diagram showing the electromagnetic waves of the electronic device 1F according to the arrangement of this disclosure.

[0067] In some arrangements, the slots 45 can be classified into different groups arranged in different directions. For example, the slots 45 can be classified into groups G1, G2, and G3. Each of groups G1, G2, and G3 can contain an array of slots arranged in different directions. The slots 45 in group G1 can be arranged along the X direction. The slots 45 in group G3 can be arranged along the Y direction. The slots 45 in group G2 can be arranged along a direction inclined relative to both the X and Y directions. The arrangement direction of the slots 45 determines the radiation direction of the signal (or electromagnetic wave) of the antenna structure 40. In this arrangement, the signals S1, S2, and S3 radiated from groups G1, G2, and G3 can define a relatively large solid angle. In this arrangement, the coverage angle of the electromagnetic wave can be adjusted.

[0068] Unless otherwise specified, spatial descriptions such as “above,” “below,” “up,” “left,” “right,” “lower,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “above,” “below,” “upper part,” “above,” and “below” are relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and embodiments of the structures described herein can be arranged in space in any orientation or manner, provided that the advantages of the arrangement of this disclosure are not compromised by such arrangement.

[0069] As used in this article, the term "vertical" refers to the upward and downward directions, while the term "horizontal" refers to the direction that is transverse to the vertical direction.

[0070] As used herein, the terms “approximately,” “generally,” “roughly,” “about,” and “approximately” are used to describe and explain minor variations. When used in conjunction with an event or situation, these terms may refer to examples where the event or situation occurred precisely or very approximately. For example, when used in conjunction with a numerical value, these terms may refer to a range of variation less than or equal to ±10% of the stated value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a first value is within a range of variation less than or equal to ±10% of a second value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the first value may be considered “generally” the same as or equal to the second value. For example, "roughly" vertical can refer to an angle variation of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0071] If the displacement between two surfaces does not exceed 5 μm, 2 μm, 1 μm, or 0.5 μm, then the two surfaces are considered to be coplanar or substantially coplanar. If the displacement between the highest and lowest points of a surface does not exceed 5 μm, 2 μm, 1 μm, or 0.5 μm, then the surface is considered to be substantially flat.

[0072] As used herein, unless the context clearly indicates otherwise, the singular forms “a / an” and “the” may contain a plural or multiple indicators.

[0073] As used herein, the terms “conductive,” “electrically conductive,” and “conductivity” refer to the ability to conduct electric current. Conductive materials are those that offer little or no resistance to the flow of electric current. A unit of measurement for conductivity is Siemens per meter (S / m). Typically, conductive materials have a conductivity exceeding approximately 10. 4 S / m, for example, at least 10 5 S / m or at least 10 6 A material with S / m. The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0074] In addition, quantities, ratios, and other numerical values ​​are sometimes presented in range format in this document. It should be understood that such range format is used for convenience and brevity, and should be flexibly interpreted as including not only the numerical values ​​explicitly specified as the limits of the range, but also all individual numerical values ​​or subranges covered within the range, as if each numerical value and subrange were explicitly specified.

[0075] Although this disclosure has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not limiting. Those skilled in the art will understand that various changes and alternative equivalents may be made without departing from the true spirit and scope of this disclosure as defined by the appended claims. Illustrations may not be drawn to scale. Due to manufacturing processes and tolerances, the process reproduction in this disclosure may differ from actual equipment. Other arrangements may exist that are not specifically described in this disclosure. The description and drawings should be considered illustrative rather than limiting. Modifications may be made to suit particular circumstances, materials, compositions, methods, or processes to the objectives, spirit, and scope of this disclosure. All such modifications are considered to be included within the scope of the appended claims. While the disclosed methods have been described herein with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of this disclosure.

Claims

1. An electronic device comprising: carrier; A waveguide structure supported by the carrier, wherein the rigidity of the waveguide structure is greater than the rigidity of the carrier; as well as Antenna structure, supported by the waveguide structure and comprising: Electromagnetic radiation circuit; as well as A control circuit configured to control the radiation direction of electromagnetic waves radiated from the electromagnetic radiation circuit.

2. The electronic device of claim 1, wherein the waveguide structure comprises a substrate and a plurality of vias embedded in the substrate.

3. The electronic device of claim 2, wherein the substrate comprises glass.

4. The electronic device of claim 2, wherein the antenna structure includes a dielectric layer above the substrate of the waveguide structure, and the control circuit is disposed above the dielectric layer.

5. The electronic device according to claim 2, wherein the roughness of the upper surface of the substrate is less than the roughness of the upper surface of the carrier.

6. The electronic device according to claim 1, further comprising: A varactor diode is disposed above the antenna structure and coupled to the control circuit, wherein the electromagnetic radiation circuit defines a slot that vertically overlaps with the varactor diode.

7. The electronic device according to claim 1, wherein the width of the carrier is different from the width of the waveguide structure.

8. The electronic device of claim 1, wherein the lateral surface of the carrier is not aligned with the lateral surface of the waveguide structure.

9. The electronic device of claim 8, wherein the lateral surface of the antenna structure is substantially aligned with the lateral surface of the waveguide structure.

10. The electronic device according to claim 1, further comprising: A protective layer is disposed between the waveguide structure and the carrier.

11. An electronic device comprising: The carrier has a first dielectric constant; A waveguide structure having a second dielectric constant that is different from the first dielectric constant; An antenna structure that is coupled to the carrier via the waveguide structure; as well as A direction modifier configured to adjust the coverage angle of electromagnetic waves radiated from the antenna structure.

12. The electronic device of claim 11, wherein the antenna structure includes control circuitry coupled to the direction modifier.

13. The electronic device of claim 12, wherein the waveguide structure includes a first via defining the waveguide and a second via coupling the control circuit of the antenna structure to the carrier.

14. The electronic device of claim 13, wherein the antenna structure includes a first conductive layer coupled to a first terminal of the direction modifier and a second conductive layer coupled to a second terminal of the direction modifier.

15. The electronic device of claim 11, wherein the antenna structure comprises a slot array.

16. The electronic device of claim 15, wherein the slot array comprises a first group configured to radiate a first electromagnetic wave along a first direction and a second group configured to radiate a second electromagnetic wave along a second direction different from the first direction.

17. The electronic device of claim 16, wherein the first group of the slot array is not arranged parallel to the second group of the slot array.

18. An electronic device comprising: RF circuit module; as well as An antenna module, which is attached to the radio frequency circuit module and includes an antenna array and a plurality of components above the antenna array; The plurality of components are adjustable to control the radiation direction of electromagnetic waves radiated from the antenna array.

19. The electronic device of claim 18, wherein the antenna array includes a first slot having a first equivalent length and a second slot having a second equivalent length different from the first equivalent length, and wherein the frequency of the electromagnetic wave from the antenna array depends on the first equivalent length and the second equivalent length.

20. The electronic device of claim 19, wherein the plurality of components includes a first group above the first slot and a second group above the second slot.

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