Bendable circuit board
By using stretchable insulating and conductive materials in the circuit board, combined with a buffer cavity design, the electrical connection problem of the circuit board under high stress conditions is solved, and stable electrical connection is achieved under various conditions.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2026-03-27
AI Technical Summary
In the process of miniaturization, weight reduction and multifunctionalization, existing circuit boards are difficult to meet the high stress requirements of wearable devices, resulting in electrical connections being easily damaged or interrupted.
By employing multiple stretchable insulating and conductive materials, combined with a buffer cavity design, the circuit board has stretchable deformation areas and electrical network areas in different directions, ensuring that electrical connections are maintained when subjected to stress deformation.
It improves the bending and tensile strength of the circuit board, maintains electrical connection under various conditions, and is suitable for a variety of electronic fields.
Smart Images
Figure CN121751469A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a bendable circuit board. Background Technology
[0002] With the rapid development of electronic products, printed circuit boards (PCBs), which support components and transmit electrical signals, should gradually become miniaturized, lightweight, high-density, and multifunctional. However, with the popularization of wearable devices, there are higher requirements for the stress resistance of PCB circuits. Summary of the Invention
[0003] This disclosure provides a bendable circuit board in some embodiments. The circuit board may employ multiple stretchable insulating materials, giving it multiple stretchable deformation regions in different directions, allowing it to deform accordingly under stress. The circuit board may also employ multiple conductive materials and multiple stretchable metal materials connecting the conductive materials, giving it multiple electrical network regions in different directions, ensuring that different structures of the circuit board maintain electrical connection under stress and deformation. Furthermore, a buffer cavity is provided between the upper and lower structures of the circuit board. This cavity design provides deformation space and stress relief space for the circuit board when subjected to forces in different directions. In summary, the design of the stretchable metal materials, stretchable materials, and the cavity gives the circuit board advantages such as bend resistance and arbitrary deformation. This design improves the circuit board's resistance to bending and stretching, enabling its use in various situations and its application in various electronic fields.
[0004] This disclosure provides a bendable circuit board in some embodiments. The circuit board includes a first structure and a second structure. The first structure includes a first insulating layer, a first insulating elongated material, a first conductive layer, and a first conductive elongated feature. The first insulating elongated material surrounds the first insulating layer, wherein the elongation of the first insulating elongated material is greater than the elongation of the first insulating layer. The first conductive layer includes a first conductive feature and a second conductive feature, wherein the first conductive feature is located in the first insulating layer, and the second conductive feature is located in the first insulating elongated material. The first conductive elongated feature extends horizontally and connects the first conductive feature to the second conductive feature, wherein the elongation of the first conductive elongated feature is greater than the elongation of the first conductive layer. The second structure is joined to the first structure vertically, wherein the first structure and the second structure have cavities therein, wherein the second structure includes a second insulating elongated material, a second conductive layer, and a second conductive elongated feature. The second insulating elongated material surrounds the second insulating layer, wherein the elongation of the first insulating elongated material is greater than the elongation of the second insulating layer. The second conductive layer includes a third conductive feature and a fourth conductive feature, wherein the third conductive feature is located in the second insulating layer, and the fourth conductive feature is located in the second insulating elongated material. The second conductive extension feature extends horizontally and connects the third conductive feature to the fourth conductive feature, wherein the stretching ratio of the second conductive extension feature is greater than the stretching ratio of the second conductive layer.
[0005] According to some embodiments disclosed herein, the first conductive layer includes a fifth conductive feature located in the first insulating layer, the fifth conductive feature being separated from the first conductive feature, and the fifth conductive feature not being electrically connected to the second conductive feature.
[0006] According to some embodiments disclosed herein, the circuit board further includes a third conductive extension feature. The third conductive extension feature extends in a vertical direction and connects the second conductive feature to the fourth conductive feature, wherein the stretching ratio of the third conductive extension feature is greater than the stretching ratio of the first conductive layer or the stretching ratio of the second conductive layer.
[0007] According to some embodiments disclosed herein, the first conductive feature of the first conductive layer and the third conductive feature of the second conductive layer are not aligned in the vertical direction.
[0008] According to some embodiments disclosed herein, the first conductive feature extends in a vertical direction beyond the surface of the first insulating layer facing the cavity.
[0009] According to some embodiments disclosed herein, the first insulating layer extends in a vertical direction beyond the surface of the first insulating extension material facing the cavity.
[0010] According to some embodiments disclosed herein, the first insulating layer extends in a vertical direction beyond the surface of the first insulating extension material facing away from the cavity.
[0011] According to some embodiments disclosed herein, the first conductive extension feature directly contacts the first insulating layer and the first insulating extension material.
[0012] According to some embodiments disclosed herein, a first insulating layer separates a first insulating extension material from a first conductive feature.
[0013] According to some embodiments disclosed herein, the thickness of the first conductive layer in the vertical direction is greater than the thickness of the first conductive extension feature in the vertical direction. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of a bendable circuit board according to a partial embodiment of this disclosure.
[0015] Figure 2A for Figure 1 A schematic diagram of a bendable circuit board being compressed in the vertical direction.
[0016] Figure 2B for Figure 1 A schematic diagram of a bendable circuit board subjected to horizontal stretching.
[0017] Figure 2C for Figure 1 A schematic diagram of a bendable circuit board subjected to vertical stretching.
[0018] Figure 3 This is a flowchart of a method for manufacturing a bendable circuit board according to a partial embodiment of this disclosure.
[0019] Figures 4A to 4K This is a cross-sectional view of a circuit board with a switch according to an embodiment of the present disclosure at various stages of the manufacturing process. Detailed Implementation
[0020] The embodiments of this disclosure are discussed in detail below. However, it should be understood that the embodiments provide many applicable concepts that can be implemented in a wide variety of specific situations. The discussed and disclosed embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. The terms "first," "second," etc., used herein do not specifically refer to any order or sequence, but are merely used to distinguish elements or operations described using the same technical terms.
[0021] In addition, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” “upper,” and similar terms are used herein to describe the relationship between one element or feature and another illustrated in the figures. Besides the orientation depicted in the figures, spatial relative terms are also intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein shall be interpreted accordingly. As used herein, “approximately,” “about,” “approximately,” or “substantially” generally refers to within 20%, 10%, or 5% of a given value or range. The numerical quantities given herein are approximate, meaning that the terms “approximately,” “about,” “approximately,” or “substantially” may be conjectured unless explicitly specified.
[0022] Figure 1 This is a schematic diagram of a bendable circuit board 100 according to a partial embodiment of this disclosure. Please refer to... Figure 1 The bendable circuit board 100 includes structures 110 and 120, a conductive elongation feature 140, and a stretchable adhesive layer 130, wherein structures 110 and 120 have cavities CV therein. The design of the cavities CV helps the bendable circuit board 100 to have deformation space and stress relief space when subjected to forces in the X, Y, or Z directions, so that the bendable circuit board 100 can undergo deformations such as stretching, compression, rotation, and torsion.
[0023] In some embodiments, structure 110 includes an insulating layer 112, an insulating extension material 114, a conductive layer 116, and a conductive extension feature 118.
[0024] In some embodiments, the insulating layer 112 may be formed of organic or inorganic insulating materials to provide the mechanical support required for the bendable circuit board 100 or electrical isolation between the conductive paths, thereby preventing short circuits and maintaining signal integrity. For example, in some embodiments, the insulating layer 112 may be formed of phenolic resins (PF), epoxy resin, FR-4, CEM-3, polyimide (PI), ink, similar materials, or combinations thereof.
[0025] In some embodiments, the insulating elongation material 114 may be a material with high mechanical ductility that maintains good electrical insulation properties when deformed under external force (e.g., stretching, bending, etc.), so that the bendable circuit board 100 is not affected by short circuits or other faults during deformation. For example, in some embodiments, the insulating elongation material 114 may be silicone rubber, polydimethylsiloxane (PDMS), thermoplastic polyurethane (TPU), elastomer blends and composites, similar or combined materials, wherein the elastomer blends and composites may be composed of insulating polymers (e.g., polyurethane (PU) or vinyl polymers, or similar or combined materials) and conductive fillers (e.g., carbon nanotubes or silver nanowires, or similar or combined materials). In this way, the elongation of the insulating elongation material 114 may be greater than the elongation of the insulating layer 112, wherein the elongation is the degree of deformation of the object during the stress process. For example, in some embodiments, the elongation of the insulating elongation material 114 may be between 100% and 600%, while the elongation of the insulating layer 112 is less than or equal to 2%.
[0026] In some embodiments, the insulating stretch material 114 may surround the insulating layer 112. For example, in this embodiment, a portion 114A of the insulating stretch material 114 is located between the insulating layers 112 and directly contacts the opposing surfaces 112A and 112B of the insulating layers 112. A portion 114B of the insulating stretch material 114 is located on surface 112A or surface 112B of the insulating layer 112 and contacts the stretchable adhesive layer 130. In direction X, the centerline of the insulating stretch material 114 is aligned with the insulating layer 112, giving the bendable circuit board 100 a configuration similar to a bump-and-recess structure.
[0027] Furthermore, the thickness TH1 of the insulating extension material 114 can be varied according to the function. For example, in some embodiments, the thickness TH1 of the insulating extension material 114 is less than or equal to twice the thickness TH2 of the insulating layer 112. This allows the insulating layer 112 to extend in the vertical direction (i.e., direction Y) beyond the surface 114C of the insulating extension material 114 facing the cavity CV (i.e., the surface 112C of the insulating layer 112 is higher than the surface 114C of the insulating extension material 114 in the direction Y), and the insulating layer 112 to extend in the vertical direction (i.e., direction Y) beyond the surface 114D of the insulating extension material 114 facing away from the cavity CV (i.e., the surface 112D of the insulating layer 112 is lower than the surface 114D of the insulating extension material 114 in the direction Y).
[0028] In some embodiments, conductive layer 116 includes conductive features 116A and 116B, wherein conductive features 116A and 116B are substantially identical. Conductive layer 116 may be made of copper, tin, silver, nickel, similar conductive materials, or combinations thereof. Conductive feature 116A is located in insulating layer 112, wherein insulating layer 112 separates insulating stretch material 114 from conductive feature 116A. Conductive feature 116B is located in a portion 114B of insulating stretch material 114 and stretchable adhesive layer 130, and conductive feature 116B is separated from 116A. A portion of conductive feature 116A is located in insulating layer 112. Another portion of conductive feature 116A extends in a vertical direction (i.e., direction Y) beyond the surface 112C of insulating layer 112 facing cavity CV (i.e., a portion of conductive feature 116A protrudes in direction Y towards cavity CV). The length of the protruding portion of conductive feature 116A is less than one-third of the length of conductive feature 116A, so that the flexible circuit board 100 is continuously conductive and the voltage of the flexible circuit board 100 is kept stable. In addition, a portion of conductive feature 116A is not electrically connected to conductive feature 116B.
[0029] In some embodiments, the conductive stretch feature 118 may be a material with good conductivity, adhesion, and stretchability, so that the bendable circuit board 100 maintains electrical connection during deformation. For example, in this embodiment, the conductive stretch feature 118 may be a conductive silver paste, similar materials, or combinations thereof, wherein the stretchability of the conductive silver paste is between 100% and 500%. In this way, the stretchability of the conductive stretch feature 118 can be greater than the stretchability of the conductive layer 116.
[0030] In some embodiments, the conductive extension feature 118 may be disposed in a portion 114B of the insulating layer 112 and the insulating extension material 114. For example, in this embodiment, the conductive extension feature 118 may be disposed between conductive features 116A and 116B. The conductive extension feature 118 may extend in the horizontal direction (i.e., direction X) and connect the lower end of conductive feature 116A to the lower end of conductive feature 116B, wherein the conductive extension feature 118 directly contacts the portion 114B of the insulating layer 112 and the insulating extension material 114. Furthermore, the thickness of the conductive extension feature 118 may be varied according to functional requirements. For example, in this embodiment, the thickness TH3 of the conductive extension feature 118 in the vertical direction (i.e., direction Y) is less than the thickness TH4 of the conductive feature 116A in the vertical direction (i.e., direction Y).
[0031] In some embodiments, structure 120 is joined to structure 110 in a vertical direction (i.e., direction Y). Structure 120 includes an insulating layer 122, an insulating extension material 124, a conductive layer 126, and a conductive extension feature 128.
[0032] In some embodiments, the insulating layer 122 may be formed of organic or inorganic insulating materials to provide the mechanical support required for the bendable circuit board 100 or electrical isolation between the conductive paths, thereby preventing short circuits and maintaining signal integrity. For example, in some embodiments, the insulating layer 122 may be formed of phenolic resins (PF), epoxy resin, FR-4, CEM-3, polyimide (PI), ink, similar materials, or combinations thereof. Furthermore, the insulating layer 122 is not aligned with the insulating layer 112 of structure 110 in the vertical direction (i.e., direction Y).
[0033] In some embodiments, the insulating elongation material 124 may be a material with high mechanical ductility that maintains good electrical insulation properties when deformed under external forces (e.g., stretching, bending, etc.), so that the bendable circuit board 100 is not affected by short circuits or other faults during deformation. For example, in some embodiments, the insulating elongation material 124 may be silicone rubber, polydimethylsiloxane (PDMS), thermoplastic polyurethane (TPU), elastomer blends and composites, or similar or combined materials, wherein the elastomer blends and composites may be composed of insulating polymers (e.g., polyurethane (PU) or vinyl polymers, or similar or combined materials) and conductive fillers (e.g., carbon nanotubes or silver nanowires, or similar or combined materials). In this way, the elongation of the insulating elongation material 124 may be greater than the elongation of the insulating layer 122. For example, in some embodiments, the elongation of the insulating elongation material 124 may be between 100% and 600%, while the elongation of the insulating layer 112 is less than or equal to 2%.
[0034] In some embodiments, the insulating stretch material 124 may surround the insulating layer 122. For example, in this embodiment, a portion 124A of the insulating stretch material 124 is located between the insulating layers 112 and directly contacts the opposing surfaces 122A and 122B of the insulating layer 122. A portion 124B of the insulating stretch material 124 is located on surface 122A or surface 122B of the insulating layer 122 and contacts the stretchable adhesive layer 130. In direction X, the centerline of the insulating stretch material 124 is aligned with the insulating layer 122, giving the bendable circuit board 100 a configuration similar to a bump-and-recess structure.
[0035] Furthermore, the thickness TH5 of the insulating extension material 124 can be varied according to the function. For example, in some embodiments, the thickness TH5 of the insulating extension material 124 is less than or equal to twice the thickness TH6 of the insulating layer 122. This allows the insulating layer 122 to extend in the vertical direction (i.e., direction Y) beyond the surface 124C of the insulating extension material 124 facing the cavity CV (i.e., the surface 122C of the insulating layer 122 is higher than the surface 124C of the insulating extension material 124 in the direction Y), and the insulating layer 122 to extend in the vertical direction (i.e., direction Y) beyond the surface 124D of the insulating extension material 124 facing away from the cavity CV (i.e., the surface 122D of the insulating layer 122 is lower than the surface 124D of the insulating extension material 124 in the direction Y).
[0036] In some embodiments, conductive layer 126 includes conductive features 126A and 126B, wherein conductive features 126A and 126B are substantially identical. Conductive layer 126 may be made of copper, tin, silver, nickel, similar conductive materials, or combinations thereof. Conductive feature 126A is located in insulating layer 122, wherein insulating layer 122 separates insulating stretch material 124 from conductive feature 126A. Conductive feature 126B is located in a portion 124B of insulating stretch material 124 and stretchable adhesive layer 130, and conductive feature 126B is separated from 126A. A portion of conductive feature 126A is located in insulating layer 122. Another portion of conductive feature 126A extends in a vertical direction (i.e., direction Y) beyond the surface 122C of insulating layer 122 facing cavity CV (i.e., a portion of conductive feature 126A protrudes in direction Y towards cavity CV). The length of the protruding portion of conductive feature 126A is less than one-third of the length of conductive feature 126A, so that the flexible circuit board 100 is continuously conductive and the voltage of the flexible circuit board 100 is stable. Furthermore, conductive features 126A of conductive layer 126 and conductive features 116A of conductive layer 116 are not aligned in the vertical direction (i.e., direction Y). Conductive features 126B of conductive layer 126 and conductive features 116B of conductive layer 116 are aligned in the vertical direction (i.e., direction Y).
[0037] In some embodiments, the conductive stretch feature 128 may be a material with good conductivity, adhesion, and stretchability, so that the bendable circuit board 100 maintains electrical connection during deformation. For example, in this embodiment, the conductive stretch feature 128 may be a conductive silver paste, similar materials, or combinations thereof, wherein the stretchability of the conductive silver paste is between 100% and 500%. In this way, the stretchability of the conductive stretch feature 128 can be greater than the stretchability of the conductive layer 126.
[0038] In some embodiments, the conductive extension feature 128 may be disposed in a portion 124B of the insulating layer 122 and the insulating extension material 124. For example, in this embodiment, the conductive extension feature 128 may be disposed between conductive features 126A and conductive features 126B. The conductive extension feature 128 may extend in the horizontal direction (i.e., direction X) and connect the upper end of conductive feature 126A to the upper end of conductive feature 126B, wherein the conductive extension feature 128 directly contacts the portion 124B of the insulating layer 122 and the insulating extension material 124. Furthermore, the thickness of the conductive extension feature 128 may be varied according to functional requirements. For example, in this embodiment, the thickness TH7 of the conductive extension feature 128 in the vertical direction (i.e., direction Y) is less than the thickness TH8 of the conductive feature 126A in the vertical direction (i.e., direction Y).
[0039] In some embodiments, the stretchable adhesive layer 130 may be made of a material similar to the insulating elongated material 114 of structure 110 or the insulating elongated material 124 of structure 120. For example, in this embodiment, the conductive elongated feature 140 may be a material such as silicone, PDMS, TPU, elastomer blends and composites, or similar combinations thereof. The stretchable adhesive layer 130 may be disposed between a portion 114B of the insulating elongated material 114 of structure 110 and a portion 124B of the insulating elongated material 124 of structure 120 to connect structure 110 and structure 120.
[0040] In some embodiments, the conductive stretch feature 140 may be made of a material similar to the conductive stretch feature 118 of structure 110 or the conductive stretch feature 128 of structure 120, and the elongation of the conductive stretch feature 140 is greater than the elongation of the conductive layer 116 or the elongation of the conductive layer 126. For example, in this embodiment, the conductive stretch feature 140 may be a conductive silver paste, a similar material, or a combination thereof.
[0041] In some embodiments, the conductive extension feature 140 may be disposed in the stretchable adhesive layer 130. For example, in this embodiment, the conductive extension feature 140 may be disposed between the conductive feature 116B of structure 110 and the conductive feature 126B of structure 120. The conductive extension feature 140 may extend in the vertical direction (i.e., direction Y) and connect the conductive features 116B to the conductive feature 126B, thereby electrically connecting structure 110 and structure 120, wherein the conductive extension feature 140 directly contacts the stretchable adhesive layer 130, the conductive feature 116B, and the conductive feature 126B. Furthermore, the width of the conductive extension feature 128 may be varied according to functional requirements. For example, in this embodiment, the width W1 of the conductive extension feature 140 in the horizontal direction (i.e., direction X) is substantially the same as the width W2 of the conductive feature 116B in the horizontal direction (i.e., direction X), and substantially the same as the width W3 of the conductive feature 126B in the horizontal direction (i.e., direction X).
[0042] Furthermore, in some embodiments, conductive feature 116A and insulating layer 112 may be electrical network regions of structure 110 in the horizontal direction (i.e., direction X), and portion 114A of insulating extension material 114 may be a stretchable deformation region of structure 110 in the horizontal direction (i.e., direction X), so that structure 110 can deform accordingly and maintain electrical connection when subjected to force in the horizontal direction (i.e., direction X). Conductive feature 126A and insulating layer 122 may be electrical network regions of structure 120 in the horizontal direction (i.e., direction X), and portion 124A of insulating extension material 124 may be a stretchable deformation region of structure 120 in the horizontal direction (i.e., direction X), so that structure 120 can deform accordingly and maintain electrical connection when subjected to force in the horizontal direction (i.e., direction X). The conductive features 116B and 126B, portions 114B of the insulating elongated material 114 and 124B of the insulating elongated material 124, the stretchable adhesive layer 130, and the conductive elongated feature 140 can serve as stretchable deformation regions and electrical network regions in the vertical direction (i.e., direction Y) of the bendable circuit board 100, so that the bendable circuit board 100 can deform accordingly and maintain electrical connection when subjected to force in the vertical direction (i.e., direction Y). In this way, the bendable circuit board 100 can have stretchable deformation regions and electrical network regions in the horizontal direction (i.e., direction X) and the vertical direction (i.e., direction Y), and can produce corresponding deformations under various stress states (e.g., tension, compression, rotation, etc.) without affecting the function of the bendable circuit board 100. The stretchable deformation regions and electrical network regions in the vertical direction (i.e., direction Y) can serve as reinforcing plate structures.
[0043] Figure 2A for Figure 1 The diagram illustrates the bending circuit board 100 under vertical compression. Please refer to... Figure 2AIn some embodiments, after the flexible circuit board 100 is compressed in the vertical direction (i.e., direction Y), the stretchable adhesive layer 130 and the conductive elongation feature 140 are correspondingly compressed, reducing the thickness TH5 of the stretchable adhesive layer 130 and the thickness TH6 of the conductive elongation feature 140. Structures 110 and 120 are pressed into the cavity CV along the direction of force, reducing the width of the cavity CV, thereby causing deformation of the flexible circuit board 100, wherein the cavity CV can be a deformation space and a stress relief space.
[0044] Figure 2B for Figure 1 The diagram illustrates the bending circuit board 100 subjected to horizontal tension. Please refer to... Figure 2B In some embodiments, after the bendable circuit board 100 is stretched in the horizontal direction (i.e., direction X), portions 114A and 114B of the insulating elongated material 114 and the conductive elongated feature 118 are stretched accordingly, increasing the length L1 of portion 114A, the length L2 of portion 114B, and the length L1 of conductive elongated feature 118. Similarly, portions 124A and 124B of the insulating elongated material 124 and the conductive elongated feature 128 are stretched accordingly, increasing the length L4 of portion 124A, the length L5 of portion 114B, and the length L6 of conductive elongated feature 118. The structures 110 and 120 are stretched along the direction of force, increasing the length of the cavity CV, thereby causing deformation of the bendable circuit board 100. The cavity CV can serve as both a deformation space and a stress relief space.
[0045] Figure 2C for Figure 1 The diagram illustrates the bending circuit board 100 subjected to vertical tension. Please refer to... Figure 2C In some embodiments, after the flexible circuit board 100 is stretched in the vertical direction (i.e., direction Y), the stretchable adhesive layer 130 and the conductive elongation feature 140 are stretched accordingly, increasing the thickness TH5 of the stretchable adhesive layer 130 and the thickness TH6 of the conductive elongation feature 140. The structures 110 and 120 are stretched along the direction of force, increasing the width of the cavity CV, thereby causing deformation of the flexible circuit board 100. The cavity CV can serve as both a deformation space and a stress relief space.
[0046] Figure 3 A flowchart of a method for manufacturing a bendable circuit board 100 according to a partial embodiment of this disclosure. This description is illustrative only and is not intended to further limit the scope of the following claims. Method 200 includes steps S210 to S310. It should be understood that additional steps may be added before, during, and after steps S210 to S310, and for another partial embodiment of the method, some of the steps mentioned below may be replaced or omitted. The order of steps / procedures may be changed.
[0047] First, refer to Figure 3 as well as Figure 4A Method 200 proceeds to step S210. An insulating layer 800' is formed on the conductor layer 900, wherein the conductor layer 900 comprises copper. For example, in this embodiment, the insulating layer 800' may have the same characteristics as the insulating layer 112 (see Figure 112). Figure 1 ) and insulating layer 122 (refer to) Figure 1 Similar materials. The insulating layer 800' can be formed on the surface 900A of the conductor layer 900 by a printing process.
[0048] Receiver, reference Figure 3 as well as Figure 4B Method 200 proceeds to step S220. An etching process is performed on the insulating layer 800'. For example, in this embodiment, the insulating layer 800' may be subjected to chemical etching, physical etching, composite etching, or similar or combined etching processes to form the insulating layer 800.
[0049] Receiver, reference Figure 3 as well as Figure 4C Method 200 proceeds to step S230. A sacrificial layer 700 is formed on the conductor layer 900. For example, in this embodiment, the sacrificial layer 700 may be formed on the surface 900A of the conductor layer 900 by a printing process, and the sacrificial layer 700 is located between the insulating layers 800. In some embodiments, the printing process may include spin coating, inkjet printing, flexographic printing, plate printing, or similar or combined printing processes.
[0050] Receiver, reference Figure 3 as well as Figure 4D Method 200 proceeds to step S240. An insulating extension material 600 is formed on the sacrificial layer 700. For example, in this embodiment, the insulating extension material 600 may have the same properties as the insulating extension material 114 (see reference 114). Figure 1 ) and insulating extension material 124 (refer to Figure 1 Similar materials. The insulating extension material 600 may be formed on the sacrificial layer 700 by a printing process, and the sacrificial layer 700 is located between the insulating layers 800. In some embodiments, the printing process may include screen printing, spraying, gravure printing, or similar or combined printing processes.
[0051] Receiver, reference Figure 3 as well as Figure 4EMethod 200 proceeds to step S250. A conductive layer 116 is formed on the insulating layer 800 and the insulating extension material 600, and a conductive extension feature 118 is formed between the conductive features 116A and 116B of the conductive layer 116. For example, in this embodiment, the conductive features 116A and 116B of the conductive layer 116 can be formed on the surface 800A of the insulating layer 800 and the surface 600A of the insulating extension material 600, respectively, by printing processes including spin coating, inkjet printing, flexographic printing, lithographic printing, or similar or combined printing processes. The conductive extension feature 118 can be formed between the conductive features 116A and 116B by printing processes including screen printing, spraying, gravure printing, or similar or combined printing processes, wherein the conductive extension feature 118 contacts and connects the conductive features 116A and 116B.
[0052] Receiver, reference Figure 3 as well as Figure 4F Method 200 proceeds to step S260. An insulating layer 500 is formed on the insulating layer 800. For example, in this embodiment, the insulating layer 500 may have the same characteristics as the insulating layer 112 (see reference 112). Figure 1 ) and insulating layer 122 (refer to) Figure 1 Similar materials. The insulating layer 500 can be formed on the surface 800A of the insulating layer 800 (refer to) by printing processes including spin coating, inkjet printing, flexographic printing, plate printing, or similar or combined printing processes. Figure 4E The insulating layer 500 surrounds the conductive feature 116A of the portion and covers the conductive extension feature 118 of the portion.
[0053] Receiver, reference Figure 3 as well as Figure 4G Method 200 proceeds to step S270. An insulating extended material 400 is formed on the insulating extended material 600. The insulating extended material 400 can be formed on the surface 600A (refer to) of the insulating extended material 600 by printing processes including screen printing, spraying, gravure printing, or similar or combined processes. Figure 4F On the surface, and the conductive extension feature 118 of the covered portion, wherein the insulating extension material 400 and the insulating extension material 600 can be collectively referred to as the insulating extension material 114.
[0054] Receiver, reference Figure 3 as well as Figure 4H Method 200 proceeds to step S280. A conductive extension feature 140 is formed on the conductive layer 116 to form structure 110. For example, in this embodiment, the conductive extension feature 140 may be formed on the surface 116C of the conductive feature 116B of the conductive layer 116 by a printing process including screen printing, spraying, gravure printing, or similar or combined printing processes. In this way, structure 110 can be formed.
[0055] Receiver, reference Figure 3 as well as Figure 4I Method 200 proceeds to step S290. Structure 120 is formed. For example, in some embodiments, structure 120 can be fabricated simultaneously by steps similar to those of structure 110 (i.e., steps S210 to S280 above). An insulating layer 112 is formed on the conductor layer 900. A sacrificial layer 700 is formed on the conductor layer 900. An insulating extension material 114 is formed on the sacrificial layer 700. A conductive feature 126A is formed in the insulating layer 112. A conductive feature 126B is formed in the insulating extension material 114. A conductive extension feature 118 is formed between conductive features 126A and 126B. A conductive extension feature 140 is formed on conductive feature 126B.
[0056] In another embodiment, structure 120 can be fabricated by steps similar to those of structure 110 (i.e., steps S210 to S280 described above). Since this embodiment is similar to the above embodiment, it will not be described in detail here.
[0057] Receiver, reference Figure 3 as well as Figure 4J Method 200 proceeds to step S300. A stretchable adhesive layer 130 is formed between insulating elongated materials 114 and 124 to bond structures 110 and 120. For example, in this embodiment, the stretchable adhesive layer 130 may be formed between a portion 114B of the insulating elongated material 114 of structure 110 and a portion 124B of the insulating elongated material 124 of structure 120 by a printing process including screen printing, spraying, gravure printing, or similar or combined printing processes to connect structures 110 and 120.
[0058] Receiver, reference Figure 3 as well as Figure 4K Method 200 leads to step S310. Remove conductor layer 900 (refer to...) Figure 4J ) and sacrificial layer 700 (refer to) Figure 4J For example, in this embodiment, the conductor layer 900 can be removed by chemical etching, physical etching, composite etching, or similar or combined etching processes. The sacrificial layer 700 can be removed using the same etching process as the conductor layer 900. In some embodiments, the sacrificial layer 700 can be removed using a different process than that used for the conductor layer 900, such as a laser process.
[0059] This disclosure provides a bendable circuit board in some embodiments. The circuit board may employ multiple stretchable insulating materials, giving it multiple stretchable deformation regions in different directions, allowing it to deform accordingly under stress. The circuit board may also employ multiple conductive materials and multiple stretchable metal materials connecting the conductive materials, giving it multiple electrical network regions in different directions, ensuring that different structures of the circuit board maintain electrical connection under stress and deformation. Furthermore, a buffer cavity is provided between the upper and lower structures of the circuit board. This cavity design provides deformation space and stress relief space for the circuit board when subjected to forces in different directions. In summary, the design of the stretchable metal materials, stretchable materials, and the cavity gives the circuit board advantages such as bend resistance and arbitrary deformation. This design improves the circuit board's resistance to bending and stretching, enabling its use in various situations and its application in various electronic fields.
[0060] The foregoing summary outlines features of several embodiments, enabling those skilled in the art to better understand the various aspects of this application. Those skilled in the art will understand that they can readily use this application as a basis for designing or modifying other processes and structures to achieve the same purposes and / or advantages of the embodiments introduced herein. Those skilled in the art will also recognize that such equivalent constructions do not depart from the spirit and scope of this application, and that various changes, substitutions, and modifications can be made herein without departing from the spirit and scope of this application.
[0061] [Symbol Explanation]
[0062] 100: Bendable circuit board
[0063] 110, 120: Structure
[0064] 112, 122, 500, 800, 800': Insulation layer
[0065] 114, 124, 400, 600: Insulating elongation materials
[0066] 114A, 114B, 124A, 124B: Partial
[0067] 112A, 112B, 112C, 112D, 114C, 114D, 116C, 122A, 122B, 122C, 122D, 124C, 124D, 600A, 800A, 900A: Surface
[0068] 116, 126: Conductive layer
[0069] 116A, 116B, 126A, 126B, 128B: Conductivity characteristics
[0070] 118, 128, 140: Conductivity and elongation characteristics
[0071] 130: Stretchable adhesive layer
[0072] 200: Method
[0073] S210, S211, S212, S213, S214, S215, S216, S217, S220, S230, S240: Step 700: Sacrificial Layer
[0074] 900: Conductor layer
[0075] CV: Cavity
[0076] TH1, TH2, TH3, TH4, TH5, TH6, TH7, TH8: Thickness
[0077] L1, L2, L3, L4, L5, L6: Length
[0078] W1, W2, W3: Width
[0079] X, Y, Z: Direction.
Claims
1. A bendable circuit board, characterized in that, include: The first structure includes: First insulating layer; A first insulating elongation material surrounds the first insulating layer, wherein the elongation of the first insulating elongation material is greater than the elongation of the first insulating layer; A first conductive layer includes a first conductive feature and a second conductive feature, wherein the first conductive feature is located in the first insulating layer, and the second conductive feature is located in the first insulating extension material; and A first conductive extension feature extends horizontally and connects the first conductive feature to the second conductive feature, wherein the elongation of the first conductive extension feature is greater than the elongation of the first conductive layer. A second structure is joined to the first structure in a vertical direction, wherein both the first and second structures have cavities therein, and the second structure includes: Second insulating layer; A second insulating elongation material surrounds the second insulating layer, wherein the elongation of the first insulating elongation material is greater than the elongation of the second insulating layer; A second conductive layer includes a third conductive feature and a fourth conductive feature, wherein the third conductive feature is located in the second insulating layer, and the fourth conductive feature is located in the second insulating extension material; and A second conductive extension feature extends along the horizontal direction and connects the third conductive feature to the fourth conductive feature, wherein the elongation of the second conductive extension feature is greater than the elongation of the second conductive layer.
2. The bendable circuit board according to claim 1, characterized in that, The first conductive layer includes a fifth conductive feature located within the first insulating layer. The fifth conductive feature is separated from the first conductive feature and is not electrically connected to the second conductive feature.
3. The bendable circuit board according to claim 1, characterized in that, Also includes: A third conductive extension feature extends along the vertical direction and connects the second conductive feature to the fourth conductive feature, wherein the elongation of the third conductive extension feature is greater than the elongation of the first conductive layer or the elongation of the second conductive layer.
4. The bendable circuit board according to claim 1, characterized in that, The first conductive feature of the first conductive layer and the third conductive feature of the second conductive layer are not aligned along the vertical direction.
5. The bendable circuit board according to claim 1, characterized in that, The first conductive feature extends along the vertical direction beyond the surface of the first insulating layer facing the cavity.
6. The bendable circuit board according to claim 1, characterized in that, The first insulating layer extends along the vertical direction beyond the surface of the first insulating extension material facing the cavity.
7. The bendable circuit board according to claim 1, characterized in that, The first insulating layer extends along the vertical direction beyond the surface of the first insulating extension material facing away from the cavity.
8. The bendable circuit board according to claim 1, characterized in that, The first conductive extension feature is in direct contact with the first insulating layer and the first insulating extension material.
9. The bendable circuit board according to claim 1, characterized in that, The first insulating layer separates the first insulating extension material from the first conductive feature.
10. The bendable circuit board according to claim 1, characterized in that, The thickness of the first conductive layer in the vertical direction is greater than the thickness of the first conductive extension feature in the vertical direction.