Printed circuit board (PCB), processing method of PCB and vehicle-mounted camera module

Abstract

The invention provides a PCB (Printed Circuit Board), a processing method of the PCB and a vehicle-mounted camera module. The PCB is used for the vehicle-mounted camera module, the PCB is provided with at least one light-transmitting blind hole extending in the thickness direction of the PCB, a metal layer is arranged on the side wall of the light-transmitting blind hole, and the bottom face of the light-transmitting blind hole is provided with a light-transmitting area. According to the invention, the problem that the PCB in the prior art cannot transmit light is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vehicle-mounted camera equipment, in particular to a PCB board, a processing method of the PCB board and a vehicle-mounted camera module. BACKGROUND

[0002] In the field of manufacturing vehicle-mounted camera modules, traditional designs generally focus on electrical performance and mechanical strength, and lack effective solutions for specific optical requirements. Especially when the PCB board needs to have both circuit connection and infrared light transmission functions, the existing technology cannot meet both requirements at the same time. Usually, the manufacturing of a PCB board involves the stacking of multiple materials, including a copper foil layer for transmitting circuit signals and an ink layer for protection and identification. However, the presence of copper foil and other metal layers greatly limits the transmission of light, especially infrared light, which is crucial for certain camera applications.

[0003] That is, the PCB board in the prior art has the problem of not being able to transmit light. SUMMARY

[0004] The main purpose of the present application is to provide a PCB board, a processing method of the PCB board and a vehicle-mounted camera module to solve the problem that the PCB board in the prior art cannot transmit light.

[0005] In order to achieve the above-mentioned purpose, according to one aspect of the present application, a PCB board is provided, the PCB board is used in a vehicle-mounted camera module, and the PCB board has at least one light-transmitting blind hole extending in the thickness direction of the PCB board, a metal layer is arranged on the side wall of the light-transmitting blind hole, and the bottom surface of the light-transmitting blind hole has a light-transmitting area.

[0006] Further, the PCB board includes a first side surface and a second side surface arranged oppositely, the opening of the light-transmitting blind hole is located on the first side surface, the bottom surface of the light-transmitting blind hole is arranged spaced apart from the second side surface, and the structure between the bottom surface of the light-transmitting blind hole and the second side surface is formed by a light-transmitting material, wherein the light-transmitting material at least transmits infrared light.

[0007] Further, the distance between the bottom surface of the light-transmitting blind hole and the second side surface is less than or equal to 1 millimeter.

[0008] Further, the smaller the distance between the bottom surface of the light-transmitting blind hole and the second side surface, the greater the light transmission rate of the light-transmitting area.

[0009] Further, the light transmission rate of the light-transmitting area to light with a wavelength in the range of 900 nm to 1000 nm is greater than 10%.

[0010] Further, the PCB board includes a plurality of layer structures, the plurality of layer structures are all light-transmitting layers, and the light-transmitting layers at least transmit infrared light.

[0011] According to another aspect of the present application, there is provided a PCB processing method for processing the above-mentioned PCB, the PCB processing method comprising:

[0012] obtaining a PCB body;

[0013] performing a first drilling at a preset position of the PCB body to form a first blind hole;

[0014] forming a metal layer on a sidewall surface and a hole bottom surface of the first blind hole;

[0015] performing a second drilling at the hole bottom surface of the first blind hole to remove the metal layer on the hole bottom surface of the first blind hole to form a light-transmitting blind hole.

[0016] Further, the step of performing a first drilling at a preset position of the PCB body comprises:

[0017] cutting the first blind hole at the preset position of the PCB body by using a tool.

[0018] Further, the step of performing a second drilling at the hole bottom surface of the first blind hole to remove the metal layer on the hole bottom surface of the first blind hole comprises:

[0019] cutting the second drilling at the hole bottom surface of the first blind hole by using a tool to remove the metal layer on the hole bottom surface of the first blind hole to form the light-transmitting blind hole.

[0020] According to another aspect of the present application, there is provided a vehicle-mounted camera module comprising the above-mentioned PCB.

[0021] The technical scheme of the present application is applied to a PCB used in a vehicle-mounted camera module, the PCB has at least one light-transmitting blind hole extending along the thickness direction of the PCB, a metal layer is arranged on the sidewall of the light-transmitting blind hole, and the hole bottom surface of the light-transmitting blind hole has a light-transmitting area.

[0022] By forming at least one light-transmitting blind hole extending along the thickness direction of the PCB, and arranging a metal layer on the sidewall of the light-transmitting blind hole, the hole bottom surface of the light-transmitting blind hole is kept as a light-transmitting area, thereby achieving the technical effect of ensuring electrical connection performance while allowing specific wavelength light to pass through. The key of this design lies in that the metal layer in the light-transmitting blind hole only covers the sidewall and does not extend to the hole bottom surface, which ensures that the light-transmitting property of the bottom of the light-transmitting blind hole is not affected. The present technical scheme effectively solves the problem that the demand for PCB light transmission in the field of vehicle-mounted camera modules cannot be considered together with electrical connection in the prior art. By controlling the different processing of the sidewall and the bottom of the blind hole, the present scheme provides a more flexible and efficient PCB design, which is conducive to improving the diversification of vehicle-mounted camera module design and improving the reliability of vehicle-mounted camera module function. BRIEF DESCRIPTION OF DRAWINGS

[0023] The accompanying drawings, which form a part of this specification, are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification. The embodiments of the application, and their

[0024] Figure 1 A structural schematic diagram of a PCB board of an optional embodiment of the application is shown;

[0025] Figure 2 A process schematic diagram of a tool of the application for once opening a hole in a PCB body is shown;

[0026] Figure 3 A process schematic diagram of depositing a metal layer in a first blind hole in the application is shown;

[0027] Figure 4 A process schematic diagram of a tool of the application for once opening a hole in a PCB body is shown;

[0028] Figure 5 A structural schematic diagram of a tool of an optional embodiment of the application is shown;

[0029] Figure 6 A structural schematic diagram of a tool of another optional embodiment of the application is shown;

[0030] Figure 7 A structural schematic diagram of a tool of another optional embodiment of the application is shown;

[0031] Among the above-mentioned drawings, the following reference signs are included:

[0032] 31, light-transmitting blind hole; 33, PCB board; 34, first side; 35, second side; 36, metal layer; 50, tool. DETAILED DESCRIPTION

[0033] It should be noted that the embodiments and features in the present application can be combined with each other without conflict, which will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0034] It should be noted that, unless otherwise specified, all the technical and scientific terms used in the present application have the same meaning as that generally understood by the ordinary skilled in the art to which the present application belongs.

[0035] In the present application, unless otherwise specified, the orientation words such as "upper", "lower", "top", "bottom" are generally directed to the directions shown in the drawings, or are directed to the vertical, perpendicular or gravity directions of the components themselves; similarly, for the convenience of understanding and description, "inner" and "outer" refer to the inner and outer relative to the contour of the components themselves, but the above-mentioned orientation words are not used to limit the present application.

[0036] In order to solve the problem that the PCB board cannot transmit light in the prior art, the application provides a PCB board, a processing method of the PCB board and a vehicle-mounted camera module.

[0037] As shown in Figures 1 to 7 , the PCB board 33 is used in the vehicle-mounted camera module, and the PCB board 33 has at least one light-transmitting blind hole 31 extending along the thickness direction of the PCB board 33, a metal layer 36 is arranged on the side wall of the light-transmitting blind hole 31, and the hole bottom surface of the light-transmitting blind hole 31 has a light-transmitting area.

[0038] By forming at least one light-transmitting blind hole 31 extending along the thickness direction of the PCB board 33, and arranging a metal layer 36 on the side wall of the light-transmitting blind hole 31, and keeping the hole bottom surface of the light-transmitting blind hole 31 as a light-transmitting area, the technical effect that the electrical connection performance is ensured while allowing specific wavelength light to pass through is realized. The key of this design is that the metal layer 36 in the light-transmitting blind hole 31 only covers the side wall and does not extend to the hole bottom surface, which ensures that the light-transmitting property of the bottom of the light-transmitting blind hole 31 is not affected. The technical solution effectively solves the problem that the electrical connection cannot be considered in the field of the vehicle-mounted camera module in the prior art. By controlling the different treatments of the side wall and the bottom of the blind hole, the present application provides a more flexible and efficient PCB board design, which is beneficial to improve the diversification of the design of the vehicle-mounted camera module and improve the reliability of the function of the vehicle-mounted camera module.

[0039] In some optional embodiments, please refer to Figure 1 , the PCB board 33 includes a first side 34 and a second side 35 arranged oppositely, the opening of the light-transmitting blind hole 31 is located on the first side 34, the hole bottom surface of the light-transmitting blind hole 31 is arranged spaced apart from the second side 35, and the structure between the hole bottom surface of the light-transmitting blind hole 31 and the second side 35 is formed by a light-transmitting material, wherein the light-transmitting material at least transmits infrared light. In this embodiment, the PCB board 33 includes the first side 34 and the second side 35, the opening of the light-transmitting blind hole 31 is accurately positioned on the first side 34, and the hole bottom surface of the light-transmitting blind hole 31 is kept a certain interval distance from the second side 35, forming a unique structure layout. The area between the hole bottom surface of the light-transmitting blind hole 31 and the second side 35 is constructed by a specially selected light-transmitting material, which exhibits good transmittance to infrared light. In the processing process, the side wall of the light-transmitting blind hole 31 is subjected to copper plating treatment, and the hole bottom surface of the light-transmitting blind hole 31 retains the light-transmitting ability. This design allows to create a local light-transmitting area on the PCB board 33, which not only meets the demand for the transmission of light of specific wavelength in the PCB board 33, but also ensures the electrical connection performance of the hole side wall, providing convenience for subsequent welding operation.

[0040] In some optional embodiments, the distance between the bottom surface of the light-transmitting blind hole 31 and the second side surface 35 is less than or equal to 1 mm. In the present embodiment, the distance between the bottom surface of the light-transmitting blind hole 31 and the second side surface 35 is strictly controlled within a range of less than or equal to 1 mm. The implementation of this design element is mainly based on the precise control of the depth of the light-transmitting blind hole 31, which ensures the light-transmitting performance of the bottom surface of the light-transmitting blind hole 31, especially in the infrared light wave band, significantly improves the penetration rate of light by reducing the material thickness, and effectively meets the specific scenarios of the demand for infrared light transmission in the vehicle-mounted camera module. At the same time, the sidewall of the light-transmitting blind hole 31 is subjected to copper plating treatment to facilitate subsequent application in the process that requires solder as a connecting medium.

[0041] In some optional embodiments, the smaller the distance between the bottom surface of the light-transmitting blind hole 31 and the second side surface 35, the greater the light transmittance of the light-transmitting area. The distance between the bottom surface of the light-transmitting blind hole 31 and the second side surface 35 can be designed according to the relationship between the light transmittance and the distance between the bottom surface of the light-transmitting blind hole 31 and the second side surface 35, and the specific demand for light transmittance, which is not specifically limited here.

[0042] In some optional embodiments, the distance between the bottom surface of the light-transmitting blind hole 31 and the second side surface 35 is negatively linearly correlated with the light transmittance of the light-transmitting area.

[0043] In some optional embodiments, the light transmittance of the light-transmitting area for light with a wavelength in the range of 900 nm to 1000 nm is greater than 10%. In the present embodiment, the performance of the light-transmitting area is particularly optimized for the design of the blind hole on the PCB 33, ensuring that it has a light transmittance of more than 10% for light with a wavelength between 900 nm and 1000 nm. This adjustment of technical details makes full use of the light-transmitting property of the PCB substrate, while taking into account the complete blocking of light by metal, by precisely controlling the copper plating and other metal layer distribution on the sidewall of the blind hole, and the residual substrate thickness is not more than 1 mm, effectively realizing the compatibility of efficient infrared light transmission and electrical connection. Such a design not only meets the demand for infrared transmission of the PCB 33, but also ensures the stable installation and signal transmission of electronic components, improving the overall performance and reliability of the product.

[0044] In some optional embodiments, the PCB 33 includes a plurality of layer structures, and the plurality of layer structures are light-transmitting layers that at least transmit infrared light. In the present embodiment, the PCB 33 includes a plurality of layer structures, and the plurality of layer structures are light-transmitting layers that at least transmit infrared light. This design makes full use of the light-transmitting property of the PCB substrate, especially in the area without metal layers, so that the PCB can achieve good infrared light transmission capability in a specific area, meeting the demand for infrared light transmission in the PCB.

[0045] It should be noted that, for a better understanding of the present application, the following description of the preferred embodiments of the present application will be given with reference to the accompanying drawings: Figure 1In the PCB 33 described above, there is no metal layer in the region between the bottom surface of the light-transmitting blind hole 31 and the second side surface 35 and located directly below the light-transmitting blind hole 31, while there is a metal layer in other positions of the PCB 33 except the region where the light-transmitting blind hole 31 is located. Here, no specific limitation is made, and it is only required to ensure that there is no metal layer between the light-transmitting blind hole 31 and the second side surface 35 and located directly below the light-transmitting blind hole 31.

[0046] In some optional embodiments, the metal layer 36 includes at least one of copper, gold, and silver, and can also be other metal materials, as long as they can meet the dual requirements of heat conduction and laser transmission, and can achieve similar process effects, thereby providing more extensive material selection and process optimization possibilities for the structural design of the vehicle-mounted camera module.

[0047] According to another aspect of the present application, a processing method of a PCB is provided, which is used for processing the above-described PCB and includes steps S10 to S40, which are described below with reference to Figures 2 to 4 .

[0048] Step S10: obtaining a PCB body;

[0049] Step S20: performing one-time drilling at a preset position of the PCB body to form a first blind hole;

[0050] Step S30: forming a metal layer 36 on the side wall surface and the bottom surface of the first blind hole;

[0051] Step S40: performing secondary drilling on the bottom surface of the first blind hole to remove the metal layer 36 on the bottom surface of the first blind hole and form a light-transmitting blind hole 31.

[0052] The present application also provides a processing method of a PCB, which is applied to the manufacturing process of the PCB and aims to form a blind hole with a light-transmitting function and a metal layer 36 on the side wall. The method includes the steps of obtaining a PCB body, performing one-time drilling at a preset position to form a first blind hole, then depositing a metal layer on the side wall surface and the bottom surface, and finally performing secondary drilling on the bottom surface to remove the metal layer 36 in the region, thereby ensuring the transparent light property of the bottom of the blind hole. This method not only ensures the electrical connection performance of the PCB 33 and maintains the integrity of the metal layer 36 on the side wall, but also realizes the smooth transmission of specific wavelength light such as infrared light with a wavelength of 900nm-1000nm at the bottom of the hole.

[0053] In some alternative embodiments, the step of once drilling a hole in the preset position of the PCB board body includes cutting a first blind hole in the preset position of the PCB board body by using the cutter 50. The step of twice drilling a hole in the bottom surface of the first blind hole to remove the metal layer 36 in the bottom surface of the first blind hole includes cutting a second blind hole in the bottom surface of the first blind hole to remove the metal layer 36 in the bottom surface of the first blind hole by using the cutter 50, thereby forming the light-transmitting blind hole 31. The cutter 50 is used to drill a hole twice in the PCB board body. The hole is drilled by physically cutting the workpiece by the cutter 50 rotating at a high speed and the sharp part of the cutter contacting the workpiece. The metal layer 36 in the bottom surface of the first blind hole is removed by using the physical operation, without damaging the metal layer 36 on the side wall, thereby realizing the light transmission at the bottom of the light-transmitting blind hole 31, and the metal layer 36 still exists on the side wall.

[0054] In some alternative embodiments, different shapes or different types of cutters can be used when drilling a hole in the preset position of the PCB board body. Please refer to Figures 5 to 7 Here, no specific limitation is made, and the operation can be performed according to the actual use requirement.

[0055] Of course, different cutters 50 or the same cutter 50 can be used in the process of once drilling a hole and twice drilling a hole. Here, no specific limitation is made.

[0056] For example, a reverse buckle needs to be formed on the side wall of the light-transmitting blind hole 31. A specific cutter 50 can be used for cutting.

[0057] According to another aspect of the present application, a vehicle-mounted camera module is provided, which includes the above-mentioned PCB board 33. The present application also provides a vehicle-mounted camera module, which includes the PCB board 33. The PCB board 33 has at least one light-transmitting blind hole 31 extending along the thickness direction thereof. The side wall of the light-transmitting blind hole 31 is provided with the metal layer 36, and the bottom surface of the hole is reserved as a light-transmitting area. By using this specific design of the PCB board 33, the PCB board 33 can ensure the electrical connection performance of the circuit board while meeting the requirement of high light transmission rate for specific wavelength light, especially improving the light transmission efficiency in the infrared wavelength band. This design overcomes the limitation that the traditional PCB board 33 cannot realize light transmission in the copper sinking area, and provides a new way for optimizing the vehicle-mounted camera module.

[0058] Obviously, the above-described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without making creative efforts should belong to the protection scope of the present application.

[0059] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting, as the scope of the exemplary embodiments of this application is limited only by the appended claims. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Also, unless otherwise indicated herein, the materials described herein can be used in a variety of applications.

[0060] It should be noted that the terms "first", "second", and the like, as used herein, are intended to modify any one of the identified objects, but do not imply a specific order or sequence, unless otherwise specifically indicated. It is to be understood that the use of the term "about" in describing the embodiments of this application is intended to convey that the description is an approximation, and that the embodiments of this application are not limited to the precise values, ranges, or parameters described, unless otherwise specifically indicated.

[0061] The preferred embodiments of the application are described above in detail. The application is not limited to the embodiments described above, but can vary and be modified, as can occur to those skilled in the art. Any equivalent realizations, modifications, and improvements made without departing from the spirit and principles of the application shall fall within the scope of protection of the application.

Claims

1. A PCB board characterized by, A PCB board (33) for a vehicle-mounted camera module, the PCB board (33) having at least one light-transmissive blind hole (31) extending along a thickness direction of the PCB board (33), a side wall of the light-transmissive blind hole (31) being provided with a metal layer (36), and a bottom surface of the light-transmissive blind hole (31) having a light-transmissive region.

2. The PCB board of claim 1, wherein, The PCB board (33) includes a first side (34) and a second side (35) arranged oppositely, an opening of the light-transmissive blind hole (31) is located on the first side (34), the bottom surface of the light-transmissive blind hole (31) is spaced apart from the second side (35), and a structure between the bottom surface of the light-transmissive blind hole (31) and the second side (35) is formed by a light-transmissive material, wherein the light-transmissive material at least transmits infrared light.

3. The PCB board of claim 2, wherein, The distance between the bottom surface of the light-transmissive blind hole (31) and the second side (35) is less than or equal to 1 mm.

4. The PCB board of claim 2, wherein, The smaller the distance between the bottom surface of the light-transmissive blind hole (31) and the second side (35), the greater the light transmittance of the light-transmissive region.

5. The PCB board of any one of claims 1 to 4, wherein, The light transmittance of the light-transmissive region to light with a wavelength in a range of 900 nm to 1000 nm is greater than 10%.

6. The PCB board of any one of claims 1 to 4, wherein, The PCB board (33) includes a plurality of layer structures, and each of the plurality of layer structures is a light-transmissive layer that at least transmits infrared light.

7. A method of processing a PCB board, characterized by, A processing method of the PCB board is used to process the PCB board according to any one of claims 1 to 6, and the processing method of the PCB board includes: obtaining a PCB board body; performing a first drilling at a predetermined position of the PCB board body to form a first blind hole; forming a metal layer (36) on a side wall surface and a bottom surface of the first blind hole; performing a second drilling on the bottom surface of the first blind hole to remove the metal layer (36) on the bottom surface of the first blind hole, thereby forming a light-transmissive blind hole (31).

8. The method of processing a PCB board according to claim 7, wherein, The step of performing the first drilling at the predetermined position of the PCB board body includes: cutting the first blind hole at the predetermined position of the PCB board body by using a cutter (50).

9. The method of processing a PCB board of claim 7, wherein, The step of performing the second drilling on the bottom surface of the first blind hole to remove the metal layer (36) on the bottom surface of the first blind hole includes: cutting the second drilling on the bottom surface of the first blind hole by using the cutter (50) to remove the metal layer (36) on the bottom surface of the first blind hole, thereby forming the light-transmissive blind hole (31).

10. A vehicle camera module, comprising: The PCB board according to any one of claims 1 to 6.

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