Printed circuit board with inductor in mounting hole

Abstract

A printed circuit board having an inductor in a mounting hole is disclosed. Systems, apparatus, articles of manufacture, and methods are disclosed that build an inductor of a voltage regulator into and / or around a mounting hole of a printed circuit board. An example apparatus includes a printed circuit board including a plurality of layers and a mounting hole extending through the plurality of layers, and an inductor at least partially in the mounting hole between two or more of the plurality of layers.

Description

Background Technology

[0001] Electronic devices such as laptops include voltage regulators. Voltage regulators maintain the voltage of the power supply within a range acceptable to the electrical components using that voltage. Attached Figure Description

[0002] Figure 1 This is a cross-sectional view of a portion of an example electronic device according to the teachings of this disclosure, showing an example inductor in an example mounting hole on an example printed circuit board.

[0003] Figure 2 It is merged Figure 1 A separate view of an example inductor in a printed circuit board.

[0004] Figure 3 It has Figure 1 An exploded view of an example layer of a printed circuit board for an inductor.

[0005] Figure 4 yes Figures 1 to 3 A diagram of an inductor winding.

[0006] Figure 5 This is a cross-sectional view of a portion of an example electronic device according to the teachings of this disclosure, showing another example inductor in an example mounting hole on an example printed circuit board.

[0007] Figure 6A It is possible Figure 5 A separate view of the example metal coil used in the mounting hole.

[0008] Figure 6B It is possible Figure 5 A separate view of another example metal coil used in the mounting hole.

[0009] Figure 7 yes Figure 5 A cross-sectional view of a portion of an electronic device, in which an example magnetic resin is adjacent to an inductor.

[0010] Figure 8 It indicates that it is used to form Figure 7 A flowchart illustrating an example process for printed circuit boards and inductors.

[0011] Generally, the same reference numerals will be used to refer to the same or similar parts throughout the accompanying drawings and written description. The drawings are not necessarily drawn to scale. Instead, the thickness of layers or regions may be enlarged in the drawings. Detailed Implementation

[0012] Electronic devices such as computers include a central processing unit (CPU) and other power-consuming electrical components. Voltage regulators are used to regulate or maintain the voltage of a power source (such as a battery) within acceptable limits or ranges for the power-consuming electrical components using that voltage. A voltage regulator is a circuit that generates and maintains a fixed output voltage regardless of fluctuations in the input voltage. Voltage regulators include multiple components such as field-effect transistors (FETs), capacitors, and inductors. The size of a voltage regulator is proportional to the maximum current and thermal design current characteristics of the components that maintain power. As the power and current demands of electronic devices increase, the physical size and / or number of phases of the voltage regulator also increase to meet those demands. The chassis size, number of fans, and / or fan size of electronic devices limit the available space for voltage regulators, thus limiting their physical size.

[0013] In addition, the CPU, voltage regulator, and other components are mounted on a printed circuit board (PCB), such as a motherboard. The PCB includes apertures or holes for receiving mechanical fasteners to couple components to the PCB. Fasteners include, for example, screws, rivets, thermomechanical load mount screws, etc. For load-bearing purposes, some fasteners are positioned adjacent to the fastener-mounted components. For example, thermomechanical load mount screws are positioned near a system-on-chip (SOC) die or package to provide sufficient load to the die. However, the location of the mounting holes for fastener coupling can coincide with the location where the voltage regulator should be positioned to efficiently deliver power to the SOC at low load lines.

[0014] The examples disclosed herein include inductors for voltage regulators built into mounting holes in printed circuit boards. An inductor includes a core and a winding or coil (e.g., copper wire wound into a coil) around the core. In some examples, the inductor's winding or coil is built into a layer of the printed circuit board. In some examples, a mechanically loaded screw or other fastener may form the core. Placing the inductor of a voltage regulator in mounting holes allows the voltage regulator to be close to components that maintain power for the voltage regulator (e.g., a state-of-the-art device, SOC).

[0015] Figure 1 This is a cross-sectional view of a portion of an example electronic device 100, including an example printed circuit board 102. The printed circuit board 102 includes multiple substrates or layers. In some examples, ten layers are present. In some examples, eleven layers are present. In some examples, twelve layers are present. In other examples, other numbers of layers are present. The printed circuit board 102 includes example mounting holes 104 extending through the multiple layers of the printed circuit board 102. The mounting holes 104 are used to mount components to the printed circuit board 102.

[0016] Electronic device 100 also includes an example backplate 106. Backplate 106 performs a reinforcing function to support printed circuit board 102. The backplate has an extension or support 108. Support 108 extends through mounting holes 104. Support 108 receives an example fastener 110. Fastener 110 secures a component 112, such as a thermal module, CPU, etc., to printed circuit board 102. Support 108 includes internal threads 114 that mate with external threads 116 of fastener 110. In the illustrated example, support 108 and fastener 110 support component 112 at a distance above or away from printed circuit board 102. In some examples, fastener 110 is a load screw. In other examples, other types of fasteners, such as rivets, may be used.

[0017] Electronic device 100 includes an example coil 118 formed in, around, and / or adjacent to mounting hole 104. In this example, coil 118 is a coil structure formed by copper traces within and between layers of printed circuit board 102. In the illustrated example, coil 118 is formed in two or more layers of printed circuit board 102.

[0018] In some examples, backplate 106 comprises metal. In some examples, backplate 106 comprises silicon steel. In some examples, fastener 110 comprises metal. In some examples, fastener 110 comprises silicon steel. In some examples, coil 118 comprises metal. In some examples, coil 118 comprises copper. In some examples, backplate 106 and / or fastener 110 comprise other materials or combinations of materials, including ferritic, iron, other steel-based materials, etc.

[0019] The coil 118 surrounds at least a portion of the fastener 110. In the illustrated example, the support 108 is located between the coil 118 and the fastener 110. Figure 1 In this example, bracket 108, fastener 110, and coil 118 form the inductor of the voltage regulator. Fastener 110 and / or bracket 108 act as the magnetic core of the inductor. Coil 118 includes an example trace or input A communicatively coupled to a power source. For example, input A may be coupled to a MOSFET of the power source. Coil 118 also includes an example trace or output B communicatively coupled to a power dissipation component. For example, output B may be coupled to a power rail of a SOC. Bracket 108, fastener 110, and coil 118 (i.e., the inductor) work together with other components of the voltage regulator to regulate the voltage and power distribution from the power source to the power dissipation component.

[0020] Figure 2 yes Figure 1 A separate view of coil 118. Figure 3 It has Figure 1An exploded view of an example layer of the printed circuit board 102 for coil 118. The windings, coils, or turns of coil 118 are stacked across the layers of printed circuit board 102. A corresponding winding of coil 118 is connected to an adjacent winding on another layer via vias in printed circuit board 102. Each loop surrounding mounting hole 104 is considered a winding. In some examples, coil 118 includes two windings. In some examples, coil 118 includes two fewer windings than the number of layers in printed circuit board 102. For example, if printed circuit board 102 has twelve layers, coil 118 may have ten windings. In some examples, coil 118 is embedded within printed circuit board 102 such that coil 118 is in an inner layer. For example, if printed circuit board 102 has ten layers, coil 118 may be formed in layers two through nine (the penultimate layer). In some examples, printed circuit board 102 includes twelve layers and is 1 mm thick, and coil 118 is formed from 30 micrometer-thick metal (e.g., copper) traces.

[0021] Figure 4 This is a diagram of the windings of coil 118 in different layers of printed circuit board 102. Figure 4 The arrows in the diagram illustrate an example current flowing through coil 118. The number of windings in coil 118 affects the inductance and saturation current of the voltage regulator.

[0022] Figure 5 This is a cross-sectional view of a portion of an example electronic device 100, including alternative inductors and voltage regulators. Figure 5 In some examples, the electronic device includes an example coil 500 of an inductor that is inserted into or embedded in a mounting hole 104. In some examples, the coil 500 includes a metal insert. In some examples, the coil 500 includes a metal coil. In some examples, the coil 500 includes copper. In some examples, the coil 500 is held in the mounting hole 104 via a friction fit. In some examples, the coil 500 is held in the mounting hole 104 via epoxy resin or other adhesives.

[0023] In the illustrated example, the mounting hole 104 of the printed circuit board 102 does not have internal threads for securing the fastener 110. Additionally, in this example, the coil 500 also does not have internal threads for securing the fastener 110. Instead, the back plate 106 includes an example boss 502, which has internal threads for engaging the external threads 116 of the fastener 110. In some examples, an example nut 504 is also present for securing the fastener 110. Figure 5 In the example, fastener 110 and coil 118 form the inductor of the voltage regulator. In some examples, nut 504, together with fastener 110, may form part of the inductor's core. Figure 5 In the example, the backplate 106 may include other materials, including, for example, non-metallic materials.

[0024] Figure 6A It can be used as Figure 5 A separate view of an example metal coil 600, coil 500. Figure 6B It can be used as Figure 5 A separate view of another example of coil 500, metal coil 650. Both metal coils 600 and 650 include ends forming input A and output B of coil 500. As described above, input A is coupled to a power source, and output B provides a regulated voltage to power dissipation components. Metal coil 600 includes more windings than metal coil 650. The number of windings in coil 118 affects the inductance and saturation current of the voltage regulator.

[0025] Figure 7 It has Figure 5 A cross-sectional view of a portion of an electronic device 100 with coil 500. Figure 7 In some examples, example resin 700 is included in mounting holes 104 surrounding coil 500. Coil 500 is embedded in and / or surrounded by resin 700. Resin 700 is magnetic. In some examples, resin 700 enters printed circuit board 102 and extends between layers of printed circuit board 102. In some examples, resin 700 forms a magnetic core. Figure 7 In the example, fastener 110, coil 118 and resin 700 form the inductor of the voltage regulator. Figure 5 The magnetic field generated by fastener 110 and coil 500 in the example is Figure 7 The example uses resin 700 reinforcement. Resin 700 produces a wider cross-sectional diameter for the magnetic core. Therefore, the magnetic field with resin 700 has a larger area than the magnetic field without resin 700. The larger magnetic field enhances the inductive characteristics of the voltage regulator.

[0026] In some examples, resin 700 includes a magnetic material within a neutral (e.g., non-magnetic, non-conductive) matrix. In some examples, the matrix is ​​a thermoplastic or thermosetting organic polymer, including epoxy resins, polyamide resins, polyimide resins, and polysulfones. Inorganic materials, such as silica fillers and / or silicates, may also be included.

[0027] In some examples, the magnetic material includes, but is not limited to, one or more of iron, nickel, and nickel-iron alloys (such as Mu metal and / or permalloys). In some examples, the magnetic material includes lanthanides and / or actinides. In some examples, the magnetic material includes cobalt-zirconium-tantalum alloys (e.g., CZT). In some examples, the magnetic material includes ferrite materials, which include barium cations and / or strontium cations. In some examples, the magnetic material includes ferrite materials, which, in addition to iron, include any one of nickel, manganese, zinc, and / or cobalt cations. In some examples, the magnetic material includes semiconductor or half-metallic Heusler compounds and non-conductive (ceramic) ferrites. Heusler compounds may include any one of manganese, iron, cobalt, molybdenum, nickel, copper, vanadium, indium, aluminum, gallium, silicon, germanium, tin, and / or antimony. In some examples, the magnetic materials include Pt, Pd, W, Ce, Al, Li, Mg, Na, Cr2O3, CoO, Dy, Dy2O, Er, Er2O3, Eu, Eu2O3, Gd, Gd2O3, FeO, Fe2O3, Nd, Nd2O3, KO2, Pr, Sm, Sm2O3, Tb, Tb2O3, Tm, Tm2O3, V, V2O3, or epoxy resin materials containing magnetic alloy particles. The magnetic alloy can be an alloy formed from one or more of the following: Pt, Pd, W, Ce, Al, Li, Mg, Na, Cr, Co, Dy, Er, Eu, Gd, Fe, Nd, K, Pr, Sm, Tb, Tm, or V. While some magnetic materials are conductors, Resin 700 is non-conductive to avoid short-circuiting the printed circuit board 1025.

[0028] Figure 8 It means to use Figure 7 A flowchart of an example process 800 for forming a printed circuit board 102 and a coil 500 using resin 700. At block 802, the substrate to which the printed circuit board 102 will be formed is laminated to form, for example, a copper-clad laminate. At block 804, mounting holes 104 are mechanically formed via, for example, a mechanical drill bit. At block 806, the substrate is electroplated.

[0029] At block 808, strip 809 is added to the bottom of the substrate, coil 500 is inserted into mounting hole 104, and resin 700 is added. At block 810, after resin 700 has solidified or cured, strip 809 is removed. A mechanical drill removes resin 700 from the center of coil 500. At block 812, further electroplating and etching of printed circuit board 102 takes place. At block 814, insulating ink such as solder resist and surface treatment are added to printed circuit board 102. At block 816, fastener 110, backplate 106, and assembly 112 are assembled.

[0030] The examples disclosed herein include inductors for voltage regulators built into and / or around mounting holes on a printed circuit board. In some examples, inductors are also built into layers of the printed circuit board, at, near, adjacent to, and / or around mounting holes. These examples reduce the number of inductors in voltage regulators coupled to the area outside the mounting holes on the printed circuit board. Therefore, the area on the printed circuit board traditionally dedicated to inductors for voltage regulators can be freely used to support other components, and / or the size of the printed circuit board can be reduced, thus providing more space for other components such as fans, and / or reducing the overall size of the electronic device. For example, a traditional inductor for a voltage regulator might require 1 mm of space on the printed circuit board. 2 The space required is reduced. In the example disclosed herein, the inductor is fitted into mounting holes that are already part of the printed circuit board. Therefore, in this example, 1 mm is saved without the need for a conventional inductor. 2 The space.

[0031] The inductor saturation current values ​​disclosed in this document can vary depending on the number of inductor windings, the material of the fasteners, the material of the resin, the diameter of the fasteners, and / or the resin itself. For example, different silicon steels with different relative permeabilities result in voltage regulators with different inductance values. For instance, silicon steels with relative permeabilities of 50, 70, and 100 achieve inductance values ​​of 1.6 microhenries (μH), 2.2 μH, and 3.3 μH, respectively, and saturation currents of 11.2 amperes (A), 8 A, and 5.6 A, respectively. These values ​​are sufficient to regulate the VddQ rail (CPU voltage) and / or any other rail with similar specifications in current and / or future platforms. Therefore, these values ​​are also sufficient to remove conventional inductors from other parts of the printed circuit board.

[0032] "Comprising" and "including" (and all their forms and tenses) are used herein as open-ended terms. Therefore, whenever a claim uses any form of "comprising" or "including" (e.g., including, comprising, including, containing, having, etc.) as a preamble or in the content of any kind of claim, it should be understood that additional elements, terms, etc., may be present and not fall outside the scope of the corresponding claim or statement. As used herein, when the phrase "at least" is used as a transitional term, for example, in the preamble of a claim, it is open-ended in the same way that the terms "comprising" and "including" are open-ended. When used, for example, in forms such as A, B, and / or C, the term "and / or" refers to any combination or subset of A, B, C, such as (1) A alone, (2) B alone, (3) C alone, (4) A and B, (5) A and C, (6) B and C, and (7) A and B and C. As used herein in the context of describing structures, components, items, objects, and / or things, the phrase “at least one of A and B” is intended to refer to an implementation that includes any one of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. Similarly, as used herein in the context of describing structures, components, items, objects, and / or things, the phrase “at least one of A or B” is intended to refer to an implementation that includes any one of the following: (1) at least one A, (2) at least one B, and (3) at least one A and at least one B. As used herein in the context of describing the conduct or execution of processes, instructions, actions, activities, etc., the phrase “at least one of A and B” is intended to refer to an implementation that includes any one of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. Similarly, as used in this document in the context of describing the conduct or execution of processes, instructions, actions, activities, etc., the phrase “at least one of A or B” is intended to refer to an implementation that includes any of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B.

[0033] As used herein, singular references (e.g., "a (a, an)", "first", "second", etc.) do not exclude plurals. The term "a ("a" or "an")" as used herein refers to one or more of those objects. The terms "a" ("a" or "an"), "one or more", and "at least one" are used interchangeably herein. Furthermore, although listed separately, multiple means, elements, or actions may be implemented by, for example, the same entity or object. Additionally, although individual features may be included in different examples or claims, these features may be combined, and inclusion in different examples or claims does not imply that the combination of features is not feasible and / or not advantageous.

[0034] Unless otherwise specified, descriptors such as “first,” “second,” “third,” etc., are used herein without imposing or otherwise indicating any meaning of priority, physical order, arrangement in a list, and / or any sorting, but merely as labels and / or arbitrary names to distinguish elements for ease of understanding of the disclosed examples. In some examples, the descriptor “first” may be used to refer to an element in a particular embodiment, while different descriptors such as “second” or “third” may be used in the claims to refer to the same element. In such instances, it should be understood that such descriptors are used only to distinguish those elements in the context of this discussion (e.g., in the claims), where elements might otherwise share the same name, for example.

[0035] As used herein, “approximately” and “about” modify their subject / value to identify the potential presence of variations that occur in real-world applications. For example, “approximately” and “about” may modify dimensions that may be imprecise due to manufacturing tolerances and / or other real-world defects as would be understood by one of ordinary skill in the art. For example, “approximately” and “about” may indicate that such dimensions are within a tolerance of + / - 10%, unless otherwise specified herein.

[0036] As used in this article, "substantially real-time" means that it occurs in a near-instantaneous manner, acknowledging that there may be real-world delays in computation time, transmission, etc. Therefore, unless otherwise specified, "substantially real-time" means real-time plus 1 second.

[0037] As used herein, a “programmable circuit system” is defined as including (i) one or more dedicated electrical circuits (e.g., application-specific circuits, ASICs) configured to perform one or more specific operations and including one or more semiconductor-based logic devices (e.g., electrical hardware implemented by one or more transistors), and / or (ii) one or more semiconductor-based general-purpose electrical circuits programmable by instructions to perform one or more specific functions and / or one or more operations and including one or more semiconductor-based logic devices (e.g., electrical hardware implemented by one or more transistors). Examples of programmable circuit systems include: programmable microprocessors (such as central processing unit (CPU)) that can execute first instructions to perform one or more operations and / or functions; field programmable gate arrays (FPGAs) that can be programmed with second instructions to cause the configuration and / or construction of the FPGA to instantiate one or more operations and / or functions corresponding to the first instructions; graphics processing units (GPUs) that can execute first instructions to perform one or more operations and / or functions; digital signal processors (DSPs) that can execute first instructions to perform one or more operations and / or functions; XPUs; network processing units (NPUs); one or more microcontrollers that can execute first instructions to perform one or more operations and / or functions; and / or integrated circuits (such as application-specific integrated circuits (ASICs)). For example, an XPU can be implemented by a heterogeneous computing system that includes various types of programmable circuit systems (e.g., one or more FPGAs, one or more CPUs, one or more GPUs, one or more NPUs, one or more DSPs, etc., and / or any combination thereof) and orchestration techniques (e.g., one or more application programming interfaces (APIs)) that can assign one or more computing tasks to any one or more of the various types of programmable circuit systems that are suitable for and can be used to perform one or more computing tasks.

[0038] As used herein, an integrated circuit / circuit system is defined as one or more semiconductor packages containing one or more circuit elements, such as transistors, capacitors, inductors, resistors, current paths, diodes, etc. For example, an integrated circuit can be implemented as one or more of an ASIC, FPGA, chip, microchip, programmable circuit system, semiconductor substrate coupling multiple circuit elements, system-on-a-chip (SoC), etc.

[0039] Example systems, apparatuses, articles of manufacture, and methods for inductors incorporated into and / or around mounting holes of a voltage regulator on a printed circuit board are disclosed. Example 1 includes an apparatus comprising a printed circuit board including a plurality of layers and mounting holes extending through the layers, and an inductor in the mounting holes at least partially between two or more of the layers.

[0040] Example 2 includes the device of Example 1, comprising: a back plate including a support, the support being inserted into a mounting hole; and fasteners coupled to the support.

[0041] Example 3 includes the apparatus of Example 2, wherein the fasteners and supports are made of silicon steel.

[0042] Example 4 includes an apparatus of any one of Examples 1-3, wherein the inductor is formed in two or more layers of a plurality of layers.

[0043] Example 5 includes a device from any of Examples 1-4, wherein the inductor includes multiple windings, the number of windings being two fewer than the number of layers.

[0044] Example 6 includes a device of any one of Examples 1-5, wherein the inductor includes an input communicatively coupled to a power source and an output communicatively coupled to a power dissipation component.

[0045] Example 7 includes an apparatus of any of Examples 1-6, wherein the inductor is a metal coil.

[0046] Example 8 includes the device of Example 7, wherein at least a portion of the inductor is inserted into a mounting hole.

[0047] Example 9 includes the device of Example 8, wherein the inductor comprises a magnetic resin between multiple layers and around a metal coil.

[0048] Example 10 includes an apparatus of any one of Examples 1-9, wherein the inductor comprises a magnetic resin between multiple layers.

[0049] Example 11 includes the apparatus of any one of Examples 1-10, further including a fastener in a mounting hole, the fastener forming the core of an inductor, and the inductor forming part of a voltage regulator.

[0050] Example 12 includes an inductor for a voltage regulator. The inductor of Example 12 includes: a coil in or around a mounting hole in a printed circuit board having multiple layers, the coil being between two or more layers of the printed circuit board; and a metal fastener in the mounting hole, the coil surrounding at least a portion of the fastener.

[0051] Example 13 includes the inductor of Example 12, including a backplate support, fasteners coupled to the support, and the support being located between the fasteners and the coil.

[0052] Example 14 includes the inductor of Example 13, wherein the fasteners and supports are made of silicon steel and the coil is made of copper.

[0053] Example 15 includes an inductor of any of Examples 12-14, wherein the multiple layers of the printed circuit board include a first number of layers, and the coil includes a second number of windings, the second number being less than the first number.

[0054] Example 16 includes an inductor of any of Examples 12-15, wherein the coil includes a first trace coupled to a power source and a second trace coupled to a power rail.

[0055] Example 17 includes an inductor of any of Examples 12-16, wherein the coil is formed within multiple layers of a printed circuit board.

[0056] Example 18 includes an inductor of any of Examples 12-17, wherein the coil includes a metal insert in a mounting hole.

[0057] Example 19 includes the inductor of Example 18, wherein the coil is embedded in magnetic resin.

[0058] Example 20 includes the inductor of Example 19, wherein a magnetic resin extends between two or more layers of a printed circuit board.

[0059] The appended claims are hereby incorporated herein by reference. While certain example systems, apparatuses, articles of manufacture, and methods have been disclosed herein, the scope of this patent is not limited thereto. Rather, this patent covers all systems, apparatuses, articles of manufacture, and methods that, fairly speaking, fall within the scope of the claims of this patent.

Claims

1. An apparatus comprising: a printed circuit board comprising: a plurality of layers; and a mounting hole extending through the plurality of layers; and an inductor at least partially in the mounting hole between two or more of the plurality of layers.

2. The apparatus of claim 1, comprising: a backplate comprising a standoff inserted into the mounting hole; and a fastener coupled to the standoff. The fastener and the standoff comprise silicon steel.

3. The apparatus of claim 2, wherein, The inductor is formed in the two or more of the plurality of layers.

4. The apparatus of claim 1, wherein, The inductor comprises a number of windings that is two less than a number of the plurality of layers.

5. The apparatus of claim 1, wherein, The inductor comprises an input communicatively coupled to a power supply and an output communicatively coupled to a power consuming component.

6. The apparatus of claim 1, wherein, The inductor is a metal coil.

7. The apparatus of claim 1, wherein, At least a portion of the inductor is inserted in the mounting hole.

8. The apparatus of claim 7, wherein, The inductor comprises a magnetic resin between the plurality of layers and around the metal coil.

9. The apparatus of claim 8, wherein, The inductor comprises a magnetic resin between the plurality of layers.

10. The apparatus of claim 1, wherein, 11. The apparatus of any of claims 1-10, further comprising a fastener in the mounting hole, the fastener forming a core of the inductor, and the inductor forming a portion of a voltage regulator.

12. An inductor of a voltage regulator comprising: a coil in or around a mounting hole of a printed circuit board having a plurality of layers, the coil between two or more of the plurality of layers of the printed circuit board; and a fastener of metal in the mounting hole, the coil surrounding at least a portion of the fastener.

13. The inductor of claim 12, comprising a standoff of a backplate, the fastener coupled to the standoff, the standoff interposed between the fastener and the coil. The fastener and the standoff comprise silicon steel, and the coil comprises copper. The plurality of layers of the printed circuit board comprises a first number of layers, and the coil comprises a second number of windings, the second number less than the first number.

14. The inductor of claim 13, wherein, The coil comprises a first trace coupled to a power supply and a second trace coupled to a power rail.

15. The inductor of claim 12, wherein, The coil is formed within the plurality of layers of the printed circuit board.

16. The inductor of claim 12, wherein, The coil comprises a metal insert in the mounting hole.

17. The inductor of claim 12, wherein, The coil is embedded in a magnetic resin.

18. The inductor of claim 12, wherein, The magnetic resin extends between two or more of the plurality of layers of the printed circuit board.

19. The inductor of any one of claims 12-18, wherein, ​ 20. The inductor of claim 19, wherein, ​

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