Data center integrated thermoelectric circulation heat dissipation system and control method thereof

Abstract

The invention provides a data center integrated thermoelectric circulation heat dissipation system and a control method thereof. The system comprises a cooling tower, a circulating pump, a pressure transmitter, a flow meter, a control module, a cooling liquid circulating pipeline, a throttling valve, a thermocouple and a thermoelectric circulation module. The cooling tower, the circulating pump and the thermoelectric circulation module are sequentially connected through a cooling liquid circulating pipeline, and the energy storage and heat dissipation integrated vapor chamber is electrically connected with a double-control switch, a single-control switch, an axial flow fan and a storage battery of the thermoelectric circulation module to form a thermoelectric circulation module electric control loop. The energy storage and heat dissipation integrated vapor chamber and the micro-channel heat exchanger are connected through a plurality of heat pipes to form a thermoelectric circulation module heat dissipation loop, and thermoelectric circulation modules are connected in parallel through cooling liquid circulation pipelines. According to the invention, through the thermoelectric circulation module, the high heat dissipation uniform temperature performance of the heat dissipation system is ensured, the recycling of electric energy is realized, and the energy consumption of the data center is effectively reduced in combination with a step-by-step air cooling-liquid cooling heat dissipation mode.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of data center liquid cooling, in particular to a data center integrated thermoelectric cycle cooling system and a control method thereof. BACKGROUND

[0002] With the rise of information technology such as big data, artificial intelligence, and autonomous driving, the computing power and power consumption of data centers are becoming higher and higher, and high energy consumption and heat dissipation have become problems that need to be solved for the development of data centers. According to statistics from the International Energy Agency (IEA), the annual electricity consumption of data centers has accounted for about 1.5% of the total global electricity consumption, of which the cooling energy consumption accounts for 30%-40%. In order to reduce the cooling energy consumption of data centers, the cooling system of data centers has gradually changed from air cooling to liquid cooling. At present, the mainstream liquid cooling technology mainly includes immersion liquid cooling and cold plate liquid cooling. Immersion liquid cooling directly cools by immersing servers in a special case filled with non-conductive liquid, which has high cooling efficiency and good temperature uniformity, but the cooling liquid has high cost, complex system, and difficult maintenance. Cold plate liquid cooling can directly modularize and package the cooling system by making the cooling medium flow through the heat sink in contact with the chip to exchange heat and carry away a large amount of heat. The operation and maintenance are simple, and the cost is low. Especially with the help of heat pipe technology and new joint technology, the cooling liquid can not enter the server, and the risk of leakage is low, which has attracted much attention in recent years.

[0003] However, the PUE value (energy utilization efficiency, PUE = total energy consumption of data center, IT equipment energy consumption) of the existing data center cold plate liquid cooling technology is generally about 1.2, and how to further save energy and reduce consumption is the focus of attention of the data center liquid cooling system. For this reason, Chinese patent CN111556692B proposes a server liquid cooling system using thermoelectric cooling and a control method thereof, which brings the heat carried away by the heat plate to the thermoelectric water tank through a secondary circulation loop for electric energy recovery, without the need for additional cooling devices, and the cooling system has higher cooling efficiency. However, the thermoelectric efficiency of the above-mentioned server liquid cooling system and control method is low, usually only 4%-8%, and requires a large temperature difference, which is high in cost and not suitable for the actual needs of the data center cooling system. SUMMARY

[0004] Therefore, in order to solve the energy consumption problem of the data center cooling system, the present application provides a data center integrated thermoelectric cycle cooling system and a control method thereof, which recycles waste heat through turbine generator technology, changes the traditional cooling process from "purely consumptive" to "value creation", effectively improves energy utilization efficiency, and combines the control method of step-by-step air cooling and liquid cooling to realize self-adaptive energy saving of the cooling system. The specific technical solutions are as follows: The application discloses a data center integrated heat and electricity circulation heat dissipation system, which is characterized by comprising a cooling tower, a circulating pump, a pressure transmitter, a flow meter, a control module, a cooling liquid circulation pipeline, a throttle valve, a thermocouple and a heat and electricity circulation module; the cooling tower, the circulating pump and the heat and electricity circulation module are sequentially connected in series through the cooling liquid circulation pipeline; the pressure transmitter, the flow meter and the throttle valve are arranged on the cooling liquid circulation pipeline between the circulating pump and the heat and electricity circulation module; the pressure transmitter is arranged between the heat and electricity circulation module and the cooling tower; the heat and electricity circulation module comprises an energy storage and heat dissipation integrated heat plate, a double-control switch, a single-control switch, an axial flow fan, a storage battery, a heat pipe and a micro-channel heat exchanger; the energy storage and heat dissipation integrated heat plate is electrically connected with the double-control switch, the single-control switch, the axial flow fan and the storage battery to form a heat and electricity circulation module electric control loop; the thermocouple is arranged on the energy storage and heat dissipation integrated heat plate; the energy storage and heat dissipation integrated heat plate and the micro-channel heat exchanger are connected with each other through a plurality of heat pipes to form a heat and electricity circulation module heat dissipation loop; the heat and electricity circulation module comprises a plurality of heat and electricity circulation modules which are connected in parallel through the cooling liquid circulation pipeline; and the control module is electrically connected with the circulating pump, the pressure transmitter, the flow meter, the throttle valve, the thermocouple, the double-control switch and the single-control switch.

[0005] Preferably, the energy storage and heat dissipation integrated heat plate comprises an evaporation plate and a condensation plate; the evaporation plate is in contact with a server chip through silicon grease; the condensation plate is provided with a heat pipe hole and a fin structure; and the condensation plate is connected with the heat pipe through the heat pipe hole and the heat pipe.

[0006] Preferably, the energy storage and heat dissipation integrated heat plate comprises a support frame and a micro turbine generator; the micro turbine generator is installed on a heat plate steam passage of the support frame and driven by high-temperature and high-pressure steam to generate electricity; the micro turbine generator is electrically connected with the single-control switch, the double-control switch, the axial flow fan and the storage battery to form an electric control loop; and the axial flow fan and the storage battery are in parallel.

[0007] Preferably, the thermocouple is arranged on a contact surface between the evaporation plate and a heat source and used for transmitting a collected temperature signal to a control unit; and the control unit controls opening and closing of the single-control switch and the double-control switch according to the temperature signal.

[0008] Preferably, the micro-channel heat exchanger is provided with an inlet and an outlet.

[0009] Preferably, the cooling liquid circulation pipeline comprises a liquid supply pipeline, a liquid supply hose, a liquid return hose, a liquid return pipeline, and a connecting pipeline; one end of the liquid supply pipeline is connected with the circulating pump, the other end of the liquid supply pipeline is connected with the liquid inlet of the micro-channel heat exchanger through the liquid supply hose, one end of the liquid return hose is connected with the liquid outlet of the micro-channel heat exchanger, the other end of the liquid return hose is communicated with the one end of the liquid return hose, the other end of the liquid return hose is communicated with the cooling tower, and the two ends of the connecting pipeline are respectively communicated with the cooling tower and the circulating pump.

[0010] Preferably, the cooling tower comprises a water tank body, a liquid inlet, a liquid outlet, a temperature sensor, and a liquid level sensor; the liquid outlet is connected with the circulating pump through the connecting pipeline; and the temperature sensor and the liquid level sensor are used for measuring the temperature and the liquid level of the cooling liquid in the cooling tower and transmitting the measurement data to the control module.

[0011] A control method of an integrated thermoelectric cycle cooling system of a data center, applied to the thermoelectric cycle cooling system, comprising the following steps of: S1, according to the received working signal, detecting and reporting the cooling tower temperature and liquid level information, starting the liquid cooling system, turning on the circulating pump and setting it to a preset power, sending cooling liquid to the data center cooling liquid circulation pipeline, flowing through the thermoelectric cycle module, and returning to the cooling tower to complete the cooling liquid circulation of the data center liquid cooling system, and monitoring the flow, pressure and chip temperature of the liquid cooling system in real time, comparing the preset flow, pressure and chip temperature signals to adjust the circulating pump power and control the working medium flow of the liquid cooling system; S2, when the temperature measured by the thermocouple is lower than the critical temperature T1 of air cooling, the control module controls the lower double control switch to be closed, the throttle valve to be closed, and the micro turbine generator in the energy storage and cooling integrated heating plate to be electrically connected with the double control switch and the axial flow fan in sequence to realize the chip adaptive air cooling through the thermoelectric cycle module; S3, when the temperature measured by the thermocouple is higher than the critical temperature T1 of air cooling and lower than the critical temperature T2 of liquid cooling, the control module controls the upper double control switch to be closed, the throttle valve to be opened, and the micro turbine generator in the energy storage and cooling integrated heating plate to be electrically connected with the double control switch and the storage battery in sequence to store the electric energy generated by the micro turbine generator in the storage battery, complete the energy storage circulation loop, and complete the heat dissipation liquid cooling circulation loop through the thermoelectric cycle module, the circulating pump and the cooling tower; S4, when the temperature measured by the thermocouple is higher than the critical temperature T2 of liquid cooling, the control module controls the lower double control switch to be closed, the single control switch to be closed, and the throttle valve to be opened, the micro turbine generator and the storage battery supply power to the axial flow fan at the same time to perform air cooling, and the heat dissipation liquid cooling circulation loop is normally operated to realize air cooling and liquid cooling double cooling.

[0012] Preferably, the control method of the thermoelectric cycle cooling system further comprises the following steps of: The standard critical temperature of the chip under a rated load, current chip real-time power consumption, a maximum temperature interval of an allowed temperature threshold fluctuation, and a maximum design power consumption of the chip are acquired. A dynamic temperature threshold function model is constructed according to the standard critical temperature, the current chip real-time power consumption, the maximum temperature interval, and the maximum design power consumption of the chip. A heat dissipation mode switching critical temperature for dynamic adjustment according to a real-time load is acquired according to the dynamic temperature threshold function model.

[0013] Preferably, the dynamic temperature threshold function model is expressed as ; Wherein, The standard critical temperature, the current chip real-time power consumption, the maximum temperature interval, and the maximum design power consumption of the chip are respectively represented by k, and k represents a load sensitive coefficient. The heat dissipation mode switching critical temperature is represented by T.

[0014] The present application has the following advantages: (1) The present application combines the heat spreading plate technology and the micro turbine power generation technology, retains the high heat transfer and high temperature uniformity performance of the heat spreading plate, converts the large amount of energy carried by the high temperature and high pressure steam in the traditional heat spreading plate into electric energy for recycling by means of the micro turbine generator, changes the "purely consumptive" process of the traditional data center heat dissipation system into a "value creation" process, effectively improves the energy utilization efficiency, and has the characteristics of high heat dissipation efficiency and high energy efficiency.

[0015] (2) The present application adopts a distributed air cooling and liquid cooling control method, when the server is running at a low power consumption, the air cooling heat dissipation is realized by driving the axial flow fan in a non-consumption mode through electric energy recovery, and the power consumption will affect the power generation efficiency, and then affect the air volume of the axial flow fan, realizing self-adaptive adjustment; when the server is running at a rated power consumption, the chip temperature is higher than the air cooling heat dissipation critical temperature, the heat dissipation system is changed to liquid cooling heat dissipation, and the micro turbine generator generates electricity which is stored in the battery, realizing electric energy recovery; when the server is running at an overload, the chip temperature exceeds the liquid cooling critical temperature, the air cooling heat dissipation system and the liquid cooling heat dissipation system run simultaneously, and the air cooling heat dissipation system is in a mode of simultaneous power supply of the micro turbine generator and the battery, with large air volume and high heat dissipation efficiency.

[0016] (3) The present application directly completes the recycling of heat energy on the chip side, has high recycling efficiency, and the micro turbine generator and the heat spreading plate are designed in an integrated manner, having compact structure and good sealing performance; the liquid cooling is mainly completed by heat pipe technology to conduct heat to the outside of the server, effectively reducing the risk of cooling liquid leakage.

[0017] (4) The present application has simple structure and control system, can be designed in a modularized manner, does not need to change the traditional chip architecture, has strong adaptability, and is suitable for large-scale upgrading and replacement of the data center heat dissipation system. BRIEF DESCRIPTION OF DRAWINGS

[0018] The present application can be further understood from the following description in conjunction with the drawings. The components in the drawings are not necessarily drawn to scale, emphasis instead being placed upon illustrating the principles of the embodiments. In different views, identical reference numerals designate corresponding parts.

[0019] Figure 1 is a structural schematic diagram of a data center integrated thermoelectric cycle heat dissipation system according to an embodiment of the present application; Figure 2 is a structural schematic diagram of a thermoelectric cycle heat dissipation module according to an embodiment of the present application; Figure 3 is an exploded view of an energy storage and heat dissipation integrated heat plate according to an embodiment of the present application; Figure 4 is a sectional view of an energy storage and heat dissipation integrated heat plate according to an embodiment of the present application; Figure 5 is a control flow chart of a data center integrated thermoelectric cycle heat dissipation system according to an embodiment of the present application.

[0020] BRIEF DESCRIPTION OF DRAWINGS 1, cooling tower; 2, circulating pump; 3, pressure transmitter; 4, flow meter; 5, control module; 6, cooling liquid circulating pipeline; 61, liquid supply pipeline; 62, liquid supply hose; 63, liquid return hose; 64, liquid return pipeline; 65, connecting pipeline; 7, throttle valve; 8, thermocouple; 9, thermoelectric cycle module; 91, energy storage and heat dissipation integrated heat plate; 911, evaporative plate; 912, evaporative plate wick; 913, support frame; 914, micro turbine generator; 915, capillary wick; 916, condensing wick; 917, condensing plate; 9171, heat pipe hole; 9172, fin; 918, liquid injection pipe; 919, gasket; 92, double control switch; 93, single control switch; 94, axial flow fan; 95, battery; 96, heat pipe; 97, micro-channel heat exchanger; 971, water inlet; 972, water outlet. DETAILED DESCRIPTION

[0021] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application is further described in detail below in conjunction with embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the protection scope of the present application.

[0022] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. As used herein, the terms "upper", "lower", "left", "right" and the like refer to the orientation of the figure as illustrated and are not intended to be limiting.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0024] As shown in Figure 1 A data center integrated thermoelectric cycle heat dissipation system, characterized in that it comprises a cooling tower 1, a circulating pump 2, a pressure transmitter 3, a flow meter 4, a control module 5, a cooling liquid circulation pipeline 6, a throttle valve 7, a thermocouple 8 and a thermoelectric cycle module 9, the cooling tower 1, the circulating pump 2 and the thermoelectric cycle module 9 are connected in series through the cooling liquid circulation pipeline 6, the pressure transmitter 3, the flow meter 4 and the throttle valve 7 are arranged on the cooling liquid circulation pipeline 6 between the circulating pump 2 and the thermoelectric cycle module 9, and the pressure transmitter 3 is arranged between the thermoelectric cycle module 9 and the cooling tower 1.

[0025] As shown in Figure 2 The thermoelectric cycle module 9 comprises an energy storage and heat dissipation integrated heat plate 91, a double-control switch 92, a single-control switch 93, an axial flow fan 94, a storage battery 95, a heat pipe 96 and a micro-channel heat exchanger 97, the energy storage and heat dissipation integrated heat plate 91, the double-control switch 92, the single-control switch 93, the axial flow fan 94 and the storage battery 95 are electrically connected to form an electric control loop of the thermoelectric cycle module 9, the thermocouple 8 is arranged on the energy storage and heat dissipation integrated heat plate 91, and the energy storage and heat dissipation integrated heat plate 91 and the micro-channel heat exchanger 97 are connected through a plurality of heat pipes 96 to form a heat dissipation loop of the thermoelectric cycle module 9, the thermoelectric cycle module 9 comprises a plurality of thermoelectric cycle modules 9, the plurality of thermoelectric cycle modules 9 are connected in parallel through the cooling liquid circulation pipeline 6, and the control module 5 is electrically connected with the circulating pump 2, the pressure transmitter 3, the flow meter 4, the throttle valve 7, the thermocouple 8, the double-control switch 92 and the single-control switch 93.

[0026] The application realizes the recycling of electric energy while ensuring the high heat dissipation uniformity of the heat dissipation system, and effectively reduces the energy consumption of the data center by combining the step-by-step air cooling-liquid cooling heat dissipation mode.

[0027] In one embodiment, the integrated heat dissipation and energy storage heat dissipation plate 91 includes an evaporator plate 911 and a condenser plate. The evaporator plate 911 is in contact with the server chip through silicone grease. The condenser plate is processed with heat pipe holes 9171 and fins 9172. The condenser plate is connected to the heat pipe 96 through the heat pipe holes 9171 and the heat pipe 96.

[0028] In one embodiment, the integrated heat dissipation and energy storage heat exchange plate 91 includes a support frame 913 and a micro turbine generator 914. The micro turbine generator 914 is installed on the steam channel of the heat exchange plate of the support frame 913. The micro turbine generator 914 generates electricity by being driven by high temperature and high pressure steam. The micro turbine generator 914 is electrically connected to a single-control switch 93, a double-control switch 92, an axial flow fan 94, and a battery 95 to form an electrical control circuit. The axial flow fan 94 and the battery 95 are arranged in parallel.

[0029] Specifically, such as Figure 3 and 4 As shown, the integrated heat dissipation and energy storage plate 91 further includes an evaporation plate 911 with a liquid absorption core, a capillary liquid absorption core 915, and a condensation liquid absorption core 916. The evaporation liquid absorption core is connected to the evaporation plate 911, and the condensation liquid absorption core 916 is connected to the condensation plate. The connecting frame is provided with a high-temperature steam channel and a condensation reflux channel. The capillary liquid absorption core 915 is installed in the condensation reflux channel of the connecting frame. The evaporation plate 911, the support frame 913, and the condensation plate form a sealed working cavity.

[0030] A liquid injection pipe 918, communicating with the liquid absorption core of the evaporator plate 911, can be installed on the support frame 913. The evaporator plate 911 and the support frame 913, as well as the support plate and the condenser plate, are connected together by threads using a sealing gasket 919. The support frame 913 has a "G"-shaped structure, with the steam channel and the condensate return channel distributed vertically. Specifically, the support frame 913 includes a left side plate and a right side plate, which are connected by a connecting plate, and the left and right side plates and the connecting plate are integrally formed. Both the left and right side plates are concave frame structures, each with a corresponding concave cavity, and the concave cavities of the left and right side plates are connected.

[0031] In one embodiment, the thermocouple 8 is disposed on the contact surface between the evaporator plate 911 and the heat source and is used to transmit the collected temperature signal to the control unit. The control unit controls the opening and closing of the single-control switch 93 and the double-control switch 92 according to the temperature signal.

[0032] In one embodiment, the microchannel heat exchanger 97 is provided with an inlet and an outlet. The microchannel heat exchanger 97 can be a serpentine, manifold, or biomimetic fractal microchannel structure, and is connected to a heat spreader plate via heat pipes 96. In one embodiment, the coolant circulation pipeline 6 includes a supply pipeline 61, a supply hose 62, a return hose 63, a return pipeline 64, and a connecting pipeline 65. One end of the supply pipeline 61 is connected to the circulation pump 2, and the other end of the supply pipeline 61 is connected to the inlet of the microchannel heat exchanger 97 through the supply hose 62. One end of the return hose 63 is connected to the outlet of the microchannel heat exchanger 97, and the other end of the return hose 63 is connected to one end of the return hose 63 and the other end of the return hose 63 is connected to the cooling tower 1. The two ends of the connecting pipeline 65 are respectively connected to the cooling tower 1 and the circulation pump 2.

[0033] In one embodiment, the cooling tower 1 includes a water tank, an inlet, an outlet, a temperature sensor, and a level sensor. The outlet is connected to the circulating pump 2 via a connecting pipe 65. The temperature sensor and the level sensor are used to measure the temperature and level of the coolant in the cooling tower 1 and transmit the measurement data to the control module 5.

[0034] An embodiment of the present invention also provides a control method for an integrated thermoelectric cooling system for data centers, applied to the aforementioned thermoelectric cooling system, such as... Figure 5 As shown, it includes the following steps: S1, based on the received working signal, detects and reports the temperature and liquid level information of cooling tower 1, starts the liquid cooling system, turns on the circulation pump 2 and adjusts it to the preset power, sends coolant to the data center coolant circulation pipeline 6, flows through the thermoelectric circulation module 9, and returns to the cooling tower 1, completing the coolant circulation of the data center liquid cooling system, and monitors the flow rate, pressure and chip temperature of the liquid cooling system in real time, and adjusts the power of the circulation pump 2 by comparing the preset flow rate, pressure and chip temperature signals, and controls the flow rate of the working medium of the liquid cooling system.

[0035] S2, when the temperature measured by thermocouple 8 is lower than the air-cooling set critical temperature T1, control module 5 controls the double-control switch 92 to close, the throttle valve 7 to close, and the micro turbine generator 914 in the integrated heat dissipation and energy storage plate 91 is electrically connected to the double-control switch 92 and the axial fan 94 in sequence, and the chip adaptive air cooling is realized through thermoelectric cycle module 9.

[0036] Specifically, the heat from the chip affects the evaporation rate of the heat spreader, which in turn affects the voltage generated by the micro turbine generator 914, and consequently the airflow of the axial fan 94, thus enabling the chip to achieve adaptive air cooling.

[0037] S3, when the temperature measured by thermocouple 8 is higher than the air-cooled set critical temperature T1 and lower than the liquid-cooled set critical temperature T2, control module 5 controls the double-control switch 92 to close and the throttle valve 7 to open. The micro turbine generator 914 in the integrated heat dissipation and energy storage plate 91 is electrically connected to the double-control switch 92 and the battery 95 in sequence, and the electrical energy generated by the micro turbine generator 914 is stored in the battery 95 to complete the energy storage cycle. The heat dissipation and liquid cooling cycle is completed through thermoelectric cycle module 9, circulation pump 2 and cooling tower 1.

[0038] Specifically, the heat generated by the chip is conducted to the microchannel heat exchanger 97 through the heat spreader and heat pipe 96 structure, and then carried away by the coolant pumped by the circulating pump 2 and returned to the cooling tower 1, completing the heat dissipation liquid cooling circulation loop. S4, when the temperature measured by thermocouple 8 is higher than the liquid cooling set critical temperature T2, control module 5 controls the double control switch 92 to close, the single control switch 93 to close, the throttle valve 7 to open, and the micro turbine generator 914 and the battery 95 simultaneously supply power to the axial fan 94 for air cooling. At the same time, the liquid cooling circulation loop operates normally, realizing dual cooling of air and liquid.

[0039] In summary, the present invention can achieve the following beneficial effects: (1) This invention combines heat exchange plate technology and micro turbine power generation technology. While retaining the high heat transfer and high temperature uniformity performance of heat exchange plate, it uses micro turbine generator to convert the large amount of energy carried by the high temperature and high pressure steam in traditional heat exchange plate into electrical energy for recycling. This transforms the "purely consumable" process of traditional data center heat dissipation system into a "value creation" process, effectively improving energy utilization efficiency. It has the characteristics of high heat dissipation efficiency and high energy efficiency.

[0040] (2) The present invention adopts a distributed air cooling and liquid cooling control method. When the server is running at low power consumption, it achieves energy-free air cooling by driving the axial flow fan through energy recovery. The amount of power consumption will affect the power generation efficiency, which in turn will affect the air volume of the axial flow fan, thus achieving adaptive adjustment. When the server is running at rated power consumption, the chip temperature is higher than the critical temperature of air cooling, and the cooling system is switched to liquid cooling. The electricity generated by the micro turbine generator is stored in the battery to achieve energy recovery. When the server is running under overload, the chip temperature exceeds the critical temperature of liquid cooling. The air cooling system and the liquid cooling system run simultaneously. The air cooling system is powered by the micro turbine generator and the battery at the same time, with a large air volume and high heat dissipation efficiency.

[0041] (3) The thermal energy recovery and utilization of the present invention is completed directly on the chip side, with high recovery efficiency. Furthermore, the micro turbine generator and heat spreader are integrated into a compact structure with good sealing performance. Liquid cooling is mainly completed by heat pipe technology to conduct heat to the outside of the server, effectively reducing the risk of coolant leakage.

[0042] (4) The structure and control system of the present invention are simple, can be modularly designed, do not need to change the traditional chip architecture, are highly adaptable, and are suitable for large-scale upgrades of data center heat dissipation systems.

[0043] Because actual server load fluctuates greatly, if a fixed critical temperature T1 for air cooling and a critical temperature T2 for liquid cooling are used, starting liquid cooling too early under low load may result in waste, while under high load may lead to response lag.

[0044] To address the above issues and improve energy efficiency and response speed, in one embodiment, the thermoelectric cycle heat dissipation system control method further includes the following steps: S5 obtains the chip's standard critical temperature under rated load, the current real-time power consumption of the chip, the maximum temperature range within which temperature threshold fluctuations are allowed, and the chip's maximum design power consumption.

[0045] S6. Construct a dynamic temperature threshold function model based on the standard critical temperature, the current real-time power consumption of the chip, the maximum temperature range, and the maximum design power consumption of the chip.

[0046] The standard critical temperature can be set to 60℃ in air-cooled mode and 80℃ in liquid-cooled mode. The chip's real-time power consumption is collected by the corresponding sensors, and the chip's maximum design power consumption is the maximum power it can withstand during long-term stable operation.

[0047] S7. Obtain the critical temperature for switching the heat dissipation mode dynamically according to the real-time load based on the dynamic temperature threshold function model.

[0048] For example, the dynamic temperature threshold function model is expressed as follows: ;in, These represent the standard critical temperature, the current real-time power consumption of the chip, the chip's maximum design power consumption, and the maximum temperature range, respectively. k represents the load sensitivity coefficient, typically between 0.8 and 1.2. This indicates the critical temperature for switching heat dissipation modes, such as the critical temperature T1 for air cooling and the critical temperature T2 for liquid cooling.

[0049] In this dynamic temperature threshold function, the critical temperature for switching heat dissipation modes varies with the load ratio. Dynamically boost the threshold to reduce liquid cooling startup under low load and lower the threshold to enhance heat dissipation in advance under high load.

[0050] When the chip temperature fluctuates drastically (such as during sudden loads in AI computing), the load sensitivity coefficient k can be increased to 1.2 by the fuzzy controller to expand the threshold adjustment range and improve system sensitivity; when the load is stable, the load sensitivity coefficient k can be decreased to 0.8 to reduce the frequency of mode switching.

[0051] It should be noted that when the air-cooled set critical temperature T1 and the liquid-cooled set critical temperature T2 are set according to the dynamic temperature threshold function model, the parameters in the function, such as the standard critical temperature, the maximum temperature range, and the load sensitivity coefficient, can be set independently, and the two correspond to different function parameters.

[0052] In summary, based on the dynamic temperature threshold function model, the liquid cooling operation time can be reduced by increasing the threshold at low loads in terms of energy saving; enhanced heat dissipation can be started earlier at high loads in terms of safety; and the risk of control oscillation can be reduced at the system level.

[0053] To prevent sudden changes in the high load threshold, a nonlinear adjustment index is introduced in one embodiment. The dynamic temperature threshold function model is optimized, and the optimized dynamic temperature threshold function model is expressed as follows: .

[0054] Air-cooled set critical temperature T1= Liquid cooling set critical temperature T2= .in, These are the standard critical temperatures in air-cooled mode and liquid-cooled mode, respectively. These are the load sensitivity coefficients in air-cooled mode and the load sensitivity coefficients in liquid-cooled mode, respectively. These are the nonlinear adjustment indexes for air-cooled mode and liquid-cooled mode, respectively, used to adjust the degree of nonlinearity (>1, the curve changes gently at low load and steeply at high load; <1, the opposite is true). These are the maximum temperature ranges in air-cooled mode and liquid-cooled mode, respectively.

[0055] Thus, by using a nonlinear adjustment index to achieve nonlinear adjustment, it is possible to adapt to different load variation characteristics.

[0056] When the current real-time power consumption of the chip exceeds a preset power consumption threshold, such as during a load ratio event... If the value is greater than 0.7 or 0.8, the chip is determined to be operating under high load, and the duration of continuous high-load operation is calculated. Based on this duration, a threshold decay mechanism is introduced. .in, These represent the chip's continuous high-load operating time and the time decay constant (recommended value 300 seconds), respectively.

[0057] The dynamic temperature threshold function model after introducing the threshold decay mechanism is expressed as follows: Specifically, the critical temperature for air cooling is set. Liquid cooling set critical temperature .

[0058] In this way, when the chip is under continuous high load, the critical temperature for switching the heat dissipation mode gradually returns to the standard critical temperature, avoiding heat accumulation caused by long-term high-pressure operation.

[0059] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. An integrated thermoelectric cooling system for data centers, characterized in that, The system includes a cooling tower, a circulating pump, a pressure transmitter, a flow meter, a control module, a coolant circulation pipeline, a throttle valve, a thermocouple, and a thermoelectric circulation module. The cooling tower, circulating pump, and thermoelectric circulation module are connected in series via the coolant circulation pipeline. The pressure transmitter, flow meter, and throttle valve are located on the coolant circulation pipeline between the circulating pump and the thermoelectric circulation module. The pressure transmitter is located between the thermoelectric circulation module and the cooling tower. The thermoelectric circulation module includes an integrated energy storage and heat dissipation heat spreader, a dual-control switch, a single-control switch, an axial fan, a battery, heat pipes, and a microchannel heat exchanger. The integrated heat dissipation and energy storage plate, along with the dual-control switch, single-control switch, axial fan, and battery, are electrically connected to form the electrical control circuit of the thermoelectric circulation module. The thermocouples are arranged on the integrated heat dissipation and energy storage plate. The integrated heat dissipation and energy storage plate and the microchannel heat exchanger are interconnected through multiple heat pipes to form the heat dissipation circuit of the thermoelectric circulation module. The thermoelectric circulation module includes multiple modules, which are connected in parallel through coolant circulation pipes. The control module is electrically connected to the circulation pump, pressure transmitter, flow meter, throttle valve, thermocouples, dual-control switch, and single-control switch.

2. The thermoelectric cycle heat dissipation system according to claim 1, characterized in that, The integrated heat dissipation and energy storage plate includes an evaporator plate and a condenser plate. The evaporator plate is in contact with the server chip through silicone grease. The condenser plate is processed with heat pipe holes and fin structures and is connected to heat pipes through heat pipe holes.

3. The thermoelectric cycle heat dissipation system according to claim 2, characterized in that, The integrated heat dissipation and energy storage heat dissipation heat exchange plate includes a support frame and a micro turbine generator. The micro turbine generator is installed on the steam channel of the heat exchange plate on the support frame. The micro turbine generator generates electricity through high temperature and high pressure steam. The micro turbine generator is electrically connected to a single-control switch, a double-control switch, an axial flow fan, and a battery to form an electrical control circuit. The axial flow fan and the battery are arranged in parallel.

4. The thermoelectric cycle heat dissipation system according to claim 2, characterized in that, The thermocouple is installed on the contact surface between the evaporator plate and the heat source and is used to transmit the collected temperature signal to the control unit. The control unit controls the opening and closing of the single-control switch and the double-control switch according to the temperature signal.

5. The thermoelectric cycle heat dissipation system according to claim 1, characterized in that, The microchannel heat exchanger is equipped with an inlet and an outlet.

6. The thermoelectric cycle heat dissipation system according to claim 1, characterized in that, The coolant circulation pipeline includes a supply pipeline, a supply hose, a return hose, a return pipeline, and a connecting pipeline. One end of the supply pipeline is connected to the circulation pump, and the other end of the supply pipeline is connected to the inlet of the microchannel heat exchanger via the supply hose. One end of the return hose is connected to the outlet of the microchannel heat exchanger, and the other end of the return hose is connected to one end of the return hose and the other end of the return hose is connected to the cooling tower. The two ends of the connecting pipeline are connected to the cooling tower and the circulation pump, respectively.

7. The thermoelectric cycle heat dissipation system according to claim 1, characterized in that, The cooling tower includes a water tank, an inlet, an outlet, a temperature sensor, and a level sensor. The outlet is connected to a circulating pump via a connecting pipe. The temperature sensor and the level sensor are used to measure the temperature and level of the coolant in the cooling tower and transmit the measurement data to the control module.

8. A control method for an integrated thermoelectric cooling system for data centers, applied to the thermoelectric cooling system as described in any one of claims 1-7, characterized in that, include: S1, based on the received working signal, detects and reports the cooling tower temperature and liquid level information, starts the liquid cooling system, turns on the circulation pump and adjusts it to the preset power, sends coolant to the data center coolant circulation pipeline, flows through the thermoelectric circulation module, and flows back to the cooling tower, completing the coolant circulation of the data center liquid cooling system, and monitors the flow rate, pressure and chip temperature of the liquid cooling system in real time, compares the preset flow rate, pressure and chip temperature signals to adjust the power of the circulation pump, and controls the flow rate of the working medium of the liquid cooling system; S2, when the temperature measured by the thermocouple is lower than the set critical temperature T1 for air cooling, the control module controls the double-control switch to close, the throttle valve to close, and the micro turbine generator in the integrated heat dissipation and energy storage heat dissipation heat dissipation plate to be electrically connected to the double-control switch and the axial fan in sequence, and realizes the chip's adaptive air cooling heat dissipation through the thermoelectric cycle module. S3, when the temperature measured by the thermocouple is higher than the air-cooled set critical temperature T1 and lower than the liquid-cooled set critical temperature T2, the control module controls the double-control switch to close and the throttle valve to open. The micro turbine generator in the integrated heat dissipation and energy storage heat dissipation heat dissipation plate is electrically connected to the double-control switch and the battery in sequence, and the electrical energy generated by the micro turbine generator is stored in the battery to complete the energy storage cycle. The heat dissipation liquid cooling cycle is completed through the thermoelectric cycle module, the circulation pump and the cooling tower. S4, when the temperature measured by the thermocouple is higher than the liquid cooling set critical temperature T2, the control module controls the double-control switch to close, the single-control switch to close, the throttle valve to open, and the micro turbine generator and the battery to simultaneously power the axial fan for air cooling. At the same time, the liquid cooling circulation loop operates normally, realizing dual cooling of air and liquid.

9. The control method for a thermoelectric cycle heat dissipation system according to claim 8, characterized in that, The control method for the thermoelectric cycle heat dissipation system further includes: Obtain the chip's standard critical temperature under rated load, the chip's current real-time power consumption, the maximum temperature range where temperature threshold fluctuations are allowed, and the chip's maximum design power consumption. A dynamic temperature threshold function model is constructed based on the standard critical temperature, the current real-time power consumption of the chip, the maximum temperature range, and the maximum design power consumption of the chip. The critical temperature for switching heat dissipation modes is obtained based on the dynamic temperature threshold function model and dynamically adjusted according to the real-time load.

10. The control method for a thermoelectric cycle heat dissipation system according to claim 8, characterized in that, The dynamic temperature threshold function model is expressed as follows: ; in, These represent the standard critical temperature, the current real-time power consumption of the chip, the maximum temperature range, and the chip's maximum designed power consumption, respectively, with k representing the load sensitivity coefficient. This indicates the critical temperature for switching heat dissipation modes.

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