A vacuum system control method and system

Abstract

The present application relates to the technical field of device control, and particularly relates to a vacuum system control method and system; a first gas valve opening state is generated according to an OLED substrate printing time, a vacuum baking time, a production line required production capacity, a real-time production condition and a preset pre-evacuation pressure; in the first gas valve opening state, a cavity pressure is acquired to obtain a first cavity pressure; when the first cavity pressure is greater than or equal to a first pressure threshold, a high vacuum valve is controlled to be closed; a pipeline pressure between a molecular pump and a front-stage valve is acquired to obtain a first pipeline pressure; the high vacuum valve is controlled to be opened according to the first pipeline pressure and a preset high vacuum valve starting pressure; by collecting process and production capacity parameters, the gas valve is accurately regulated and controlled in combination with the pre-evacuation pressure, and the production line rhythm is adapted; the high vacuum valve is controlled by using a hierarchical pressure, vacuum fluctuation is avoided, the OLED substrate is protected, process stability and yield are improved, pump valve loss is reduced, and system reliability and production efficiency are improved.

Description

Technical Field

[0001] This invention relates to the field of equipment control technology, and in particular to a vacuum system control method and system. Background Technology

[0002] In the mass production of OLED display panels, vacuum baking is a key process to ensure the cleanliness of the OLED substrate surface, the adhesion of the film layer, and the performance of the device. The control logic, pressure stability, and process adaptability of the vacuum system directly affect the product yield and production line capacity.

[0003] Existing vacuum baking equipment generally suffers from significant drawbacks in its vacuum control systems: most employ fixed programs or simple pressure threshold control, leading to a severe disconnect between vacuum control and actual process cycles. Furthermore, the high-vacuum valves lack graded pressure verification and smooth switching mechanisms, making them prone to sudden pressure changes and gas path fluctuations. This can easily damage the OLED substrate film, affecting baking quality, and exacerbate wear and tear on core components such as pumps and valves. In addition, traditional control methods cannot dynamically adapt to production conditions, exhibiting low levels of automation and flexibility, making it difficult to meet the demands of modern OLED production lines for efficient, stable, and high-precision large-scale production. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of this invention is to provide a vacuum system control method and system.

[0005] The first aspect of this invention provides a vacuum system control method applied to a vacuum system, the vacuum system including a vacuum device, an OLED substrate, a high vacuum valve, a molecular pump, and a pre-vacuum valve; the vacuum device has a vacuum chamber; the OLED substrate, the high vacuum valve, the molecular pump, and the pre-vacuum valve are all disposed on the vacuum chamber; the vacuum system control method includes: acquiring the OLED substrate printing time, vacuum baking time, required production line capacity, and real-time production status; generating a first valve open state based on the OLED substrate printing time, vacuum baking time, required production line capacity, real-time production status, and a preset pre-evacuation pressure; acquiring the chamber pressure in the first valve open state to obtain a first chamber pressure; determining whether the first chamber pressure is greater than or equal to a preset first pressure threshold; controlling the high vacuum valve to close when the first chamber pressure is greater than or equal to the first pressure threshold; acquiring the pipeline pressure between the molecular pump and the pre-vacuum valve to obtain a first pipeline pressure; and controlling the high vacuum valve to open based on the first pipeline pressure and a preset high vacuum valve start-up pressure.

[0006] Furthermore, the step of generating the first gas valve open state based on the OLED substrate printing time, vacuum baking time, production line required capacity, real-time production status, and preset pre-evacuation pressure includes: generating an activation command based on the OLED substrate printing time, vacuum baking time, production line required capacity, and real-time production status; entering the vacuum chamber activation state based on the activation command; and generating the first gas valve open state based on the vacuum chamber activation state and pre-evacuation pressure.

[0007] Furthermore, the vacuum system also includes a heating component disposed on the vacuum chamber; the step of generating a first valve open state based on the vacuum chamber activation state and the pre-evacuation pressure includes: acquiring a command signal in the vacuum chamber activation state; controlling the heating component to heat the vacuum chamber according to the command signal to obtain a vacuum chamber heating state; generating a second valve open state based on the vacuum chamber heating state and the pre-evacuation pressure; and generating a first valve open state based on the second valve open state and a preset second pressure threshold.

[0008] Furthermore, the vacuum system also includes a temperature control relay module and a temperature sensor. The temperature sensor is mounted on the temperature control relay module, and the temperature control relay module is mounted on the vacuum cavity. The step of controlling the heating assembly to heat the vacuum cavity according to a command signal to obtain the vacuum cavity heating state includes: analyzing the command signal according to a preset adaptive algorithm to obtain a current signal; controlling the temperature control relay module to output current to the heating assembly according to the current signal; detecting the measured temperature value of the temperature control relay module using the temperature sensor; and controlling the heating assembly to heat the vacuum cavity according to the measured temperature value to obtain the vacuum cavity heating state.

[0009] Further, the step of controlling the heating component to heat the vacuum cavity based on the measured temperature value to obtain the vacuum cavity heating state includes: calculating the difference between the measured temperature value and the preset target temperature value to obtain a first temperature deviation value; obtaining the previous two temperature deviation values ​​based on the first temperature deviation value to obtain a second temperature deviation value and a third temperature deviation value; calculating the first temperature deviation value, the second temperature deviation value, and the third temperature deviation value according to a preset incremental algorithm to obtain the current control increment; obtaining the previous control increment based on the current control increment to obtain the original output value; superimposing the current control increment and the original output value to obtain a superimposed temperature value; and heating the vacuum cavity based on the superimposed temperature value to obtain the vacuum cavity heating state.

[0010] Furthermore, the vacuum system also includes a pre-evacuation valve, a manual valve, a small angle valve, and a large angle valve, all of which are located on the vacuum chamber. The step of generating the second valve opening state based on the vacuum chamber heating state and the pre-evacuation pressure includes: analyzing the vacuum chamber heating state; if the vacuum chamber heating state is complete, then entering the vacuum evacuation state; in the vacuum evacuation state, controlling the pre-evacuation valve and the manual valve to open to obtain the third valve opening state; in the third valve opening state, acquiring the chamber pressure again to obtain the second chamber pressure; determining whether the second chamber pressure is greater than or equal to the pre-evacuation pressure; when the second chamber pressure is greater than or equal to the pre-evacuation pressure, controlling the small angle valve and the large angle valve to open to obtain the second valve opening state.

[0011] Furthermore, the vacuum system also includes a pre-valve, which is disposed on the vacuum chamber; the step of generating the first valve opening state based on the second valve opening state and a preset second pressure threshold includes: in the second valve opening state, acquiring the chamber pressure again to obtain the third chamber pressure; determining whether the third chamber pressure is greater than or equal to the second pressure threshold; when the third chamber pressure is greater than or equal to the second pressure threshold, controlling the pre-evacuation valve, the small angle valve, and the large angle valve to close; and controlling the pre-valve to open to obtain the first valve opening state.

[0012] Furthermore, the step of generating activation instructions based on OLED substrate printing time, vacuum baking time, production line required capacity, and real-time production status includes: calculating the required number of layers based on OLED substrate printing time and vacuum baking time; determining multiple specific layer numbers based on production line required capacity; and adjusting the required number of layers and multiple specific layer numbers based on real-time production status to obtain the number of activated layers and multiple activated layer numbers.

[0013] Activation instructions are generated based on the number of activation layers and multiple activation layer numbers.

[0014] Furthermore, the step of controlling the high vacuum valve to open based on the first pipeline pressure and the preset high vacuum valve start pressure includes: determining whether the first pipeline pressure is greater than or equal to the preset molecular pump start pressure;

[0015] When the pressure in the first pipeline is greater than or equal to the starting pressure of the molecular pump, the molecular pump is controlled to open; the pipeline pressure between the high vacuum valve and the molecular pump is obtained to obtain the pressure in the second pipeline; it is determined whether the pressure in the second pipeline is greater than or equal to the starting pressure of the high vacuum valve; when the pressure in the second pipeline is greater than or equal to the starting pressure of the high vacuum valve, the high vacuum valve is controlled to open.

[0016] Furthermore, a vacuum system executes a vacuum system control method as described above. The vacuum system includes a host computer, a vacuum device electrically connected to the host computer, an OLED substrate, a high vacuum valve, a molecular pump, a pre-vacuum valve, a temperature control relay module, a temperature sensor, a pre-evacuation valve, a manual valve, a small angle valve, and a large angle valve. A vacuum chamber is provided on the vacuum device. The OLED substrate, the high vacuum valve, the molecular pump, and the pre-vacuum valve are all located on the vacuum chamber. The temperature sensor is located on the temperature control relay module. The temperature control relay module, the pre-evacuation valve, the manual valve, the small angle valve, the pre-vacuum valve, and the large angle valve are all located on the vacuum chamber.

[0017] In the technical solution of this invention, by collecting data on OLED substrate printing time, vacuum baking time, required production line capacity, and real-time production status, core data for vacuum control is provided. Combined with pre-evacuation pressure to generate the opening state of the first gas valve, vacuum control is precisely adapted to the process rhythm and production line capacity, dynamically responding to production conditions, avoiding resource redundancy or waste, reducing human intervention errors, and ensuring smooth system startup. The high-vacuum valve is controlled to close by comparing the first chamber pressure with a preset first pressure threshold, effectively avoiding vacuum fluctuations caused by abnormal chamber pressure. Furthermore, conditional opening is achieved by detecting pipeline pressure and combining it with the high-vacuum valve's start-up pressure, forming a hierarchical control logic. This solution avoids sudden vacuum changes and gas path fluctuations, protects the OLED substrate film layer, improves the stability of the baking process and product yield, while reducing pump and valve hardware wear, improving vacuum control accuracy and system reliability, adapting to flexible production needs, efficiently matching production line capacity targets, and improving overall production efficiency. Attached Figure Description

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0019] Figure 1 This is a first flowchart of a vacuum system control method provided in an embodiment of the present invention;

[0020] Figure 2 This is a second flowchart of a vacuum system control method provided in an embodiment of the present invention;

[0021] Figure 3 A third flowchart of a vacuum system control method provided in an embodiment of the present invention;

[0022] Figure 4 A fourth flowchart of a vacuum system control method provided in an embodiment of the present invention;

[0023] Figure 5 A fifth flowchart of a vacuum system control method provided in an embodiment of the present invention;

[0024] Figure 6 A sixth flowchart of a vacuum system control method provided in an embodiment of the present invention;

[0025] Figure 7 A seventh flowchart of a vacuum system control method provided in an embodiment of the present invention;

[0026] Figure 8 An eighth flowchart of a vacuum system control method provided in an embodiment of the present invention;

[0027] Figure 9 A ninth flowchart of a vacuum system control method provided in an embodiment of the present invention;

[0028] Figure 10 This is a schematic diagram of a vacuum system provided in an embodiment of the present invention.

[0029] Figure Labels

[0030] 1-Vacuum equipment; 2-OLED substrate; 3-High vacuum valve; 4-Molecular pump; 5-Fore-stage valve; 6-Temperature control relay module; 7-Temperature sensor; 8-Pre-evacuation valve; 9-Manual valve; 10-Small angle valve; 11-Large angle valve; 12-Host computer; Detailed Implementation

[0031] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" or "having" and any variations thereof are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0032] A vacuum system control method is applied to a vacuum system including a vacuum device, an OLED substrate, a high-vacuum valve, a molecular pump, and a pre-vacuum valve. The vacuum device has a vacuum cavity. The OLED substrate, the high-vacuum valve, the molecular pump, and the pre-vacuum valve are all located within the vacuum cavity. For ease of understanding, the specific flow of an embodiment of the invention is described below. Please refer to [link to relevant documentation]. Figure 1 One embodiment of a vacuum system control method according to the present invention includes:

[0033] 101. Obtain OLED substrate printing time, vacuum baking time, required production line capacity, and real-time production status;

[0034] In this embodiment, by acquiring the OLED substrate printing time, vacuum baking time, production line required capacity, and real-time production status, core foundational data for vacuum system control is provided. This enables precise matching of vacuum control with OLED process rhythm and production line capacity, dynamic response to production conditions, effective avoidance of resource waste and process disconnection, reduction of human intervention errors, and ensuring smooth and orderly subsequent vacuum control, thereby helping to improve product yield, production line efficiency, and system operational reliability.

[0035] 102. Based on the OLED substrate printing time, vacuum baking time, production line required capacity, real-time production status, and preset pre-extraction pressure, generate the first air valve opening state;

[0036] In this embodiment, the first valve opening state is generated by combining the OLED substrate printing time, vacuum baking time, production line required capacity, real-time production status and preset pre-evacuation pressure. This enables precise adaptation of the initial state of the valve, making vacuum control deeply compatible with the OLED process rhythm and production line capacity. At the same time, it lays a solid foundation for subsequent vacuum pressure regulation, effectively avoids resource redundancy or insufficiency, ensures the smooth start-up of the vacuum system, helps improve production line efficiency, product yield and system operation stability, and adapts to flexible production needs.

[0037] 103. With the first air valve open, obtain the chamber pressure to obtain the first chamber pressure;

[0038] 104. Determine whether the pressure in the first chamber is greater than or equal to the preset first pressure threshold;

[0039] 105. When the pressure in the first chamber is greater than or equal to the first pressure threshold, the high vacuum valve is closed.

[0040] 106. Obtain the pipeline pressure between the molecular pump and the fore-stage valve to obtain the first pipeline pressure;

[0041] In this embodiment, the high vacuum valve is closed when the pressure in the first chamber reaches the target, thus avoiding vacuum fluctuations caused by abnormal chamber pressure. Then, the pipeline pressure between the molecular pump and the fore-stage valve is detected, and the pipeline pressure reaches the target as a hard condition for the high vacuum valve to open, thereby realizing conditional and graded opening and closing of the high vacuum valve and ensuring smooth vacuum switching throughout the process.

[0042] 107. Control the high vacuum valve to open based on the first pipeline pressure and the preset high vacuum valve start pressure;

[0043] In this embodiment, the high vacuum valve is controlled to open based on the first pipeline pressure and the preset high vacuum valve start pressure. Conditional opening and closing logic is adopted to ensure that the high vacuum valve is activated only when the pipeline vacuum meets the standard, effectively avoiding sudden changes in vacuum and gas path fluctuations, protecting the OLED substrate film layer, while reducing pump and valve hardware wear, and improving vacuum control accuracy and system operation stability.

[0044] In this embodiment, by collecting data on OLED substrate printing time, vacuum baking time, required production line capacity, and real-time production status, core data for vacuum control is provided. Combined with pre-evacuation pressure to generate the opening state of the first gas valve, vacuum control is precisely adapted to the process rhythm and production line capacity, dynamically responding to production conditions, avoiding resource redundancy or waste, reducing human intervention errors, and ensuring smooth system startup. The high-vacuum valve is closed by comparing the first chamber pressure with a preset first pressure threshold, effectively avoiding vacuum fluctuations caused by abnormal chamber pressure. Conditional opening is achieved by detecting pipeline pressure and combining it with the high-vacuum valve's start-up pressure, forming a hierarchical control logic. This solution avoids sudden vacuum changes and gas path fluctuations, protects the OLED substrate film layer, improves baking process stability and product yield, while reducing pump and valve hardware wear, improving vacuum control accuracy and system reliability, adapting to flexible production needs, efficiently matching production line capacity targets, and improving overall production efficiency.

[0045] Please see Figure 2 In a second embodiment of a vacuum system control method according to the present invention, step 102 specifically includes:

[0046] 201. Generate activation instructions based on OLED substrate printing time, vacuum baking time, production line required capacity, and real-time production status;

[0047] In this embodiment, activation commands are generated by combining OLED substrate printing time, vacuum baking time, production line capacity requirements, and real-time production status. The number of cavity layers can be quantitatively calculated and the activation cavities can be dynamically allocated. This avoids insufficient or redundant cavity resources and achieves seamless connection between heating and vacuuming processes. With precise temperature control and graded vacuum control logic, the substrate can be effectively protected from damage caused by temperature and vacuum fluctuations, improving process stability and product yield. At the same time, it is compatible with multi-layer cavity synchronous control, maximizing equipment utilization, efficiently matching production line capacity, and improving production line flexibility and production efficiency.

[0048] 202. Enter the vacuum chamber activation state according to the activation command;

[0049] 203. Based on the activation state of the vacuum chamber and the pre-evacuation pressure, the first gas valve is opened;

[0050] In this embodiment, the opening state of the first gas valve is generated based on the activation state of the vacuum chamber and the pre-evacuation pressure. With normal chamber activation as the control premise, the gas valve state is accurately determined by combining the pre-evacuation pressure, which can ensure the orderly connection between the heating and vacuuming processes. The logic of opening and closing valves in stages according to pressure standards can smoothly establish a vacuum environment, avoid damage to the OLED substrate film layer by sudden changes in chamber pressure, and ensure the quality of the baking process. At the same time, it can achieve smooth switching of gas paths, reduce pump and valve losses, improve the reliability and control accuracy of system operation, adapt to multi-layer chamber synchronous control, efficiently connect the production process, and meet the production line capacity and stable production needs.

[0051] In this embodiment, by combining the OLED substrate printing time, vacuum baking time, production line required capacity, and real-time production status to generate activation commands, and entering the cavity activation state according to the activation commands, the first gas valve opening state is generated based on the cavity activation state and pre-evacuation pressure, thus achieving precise control of the vacuum system. This solution can quantitatively calculate the number of vacuum cavity layers and dynamically allocate activation cavities, effectively avoiding insufficient or redundant cavity resources and achieving seamless and orderly connection between heating and vacuuming processes. At the same time, with normal cavity activation as the control premise, the opening and closing status of the gas valves is accurately determined by combining the pre-evacuation pressure. The logic of opening and closing valves in stages according to pressure standards is adopted to smoothly establish a vacuum environment, avoid damage to the substrate film layer by sudden changes in cavity pressure, and ensure the quality of the baking process and product yield. In addition, the solution can achieve smooth switching of gas paths, reduce pump and valve hardware wear, improve system operation reliability and control accuracy, adapt to multi-layer cavity synchronous control, maximize equipment utilization, efficiently match production line capacity requirements, and enhance production line flexibility and overall production efficiency.

[0052] The vacuum system also includes a heating assembly disposed on the vacuum chamber; see also Figure 3 In a third embodiment of a vacuum system control method of the present invention, step 203 specifically includes:

[0053] 301. Acquire command signals while the vacuum chamber is in an activated state;

[0054] 302. Control the heating components to heat the vacuum chamber according to the command signal to obtain the heating state of the vacuum chamber;

[0055] In this embodiment, the command signal typically includes core parameters such as the target heating temperature of the vacuum chamber, which is the core basis for subsequent heating control. This ensures that all control actions are based on the premise that "the chamber can work normally," avoids ineffective control or misoperation, and guarantees the safety of system operation.

[0056] 303. Based on the heating state of the vacuum chamber and the pre-evacuation pressure, the second gas valve is opened;

[0057] In this embodiment, by combining the vacuum chamber heating state with the pre-evacuation pressure to generate the second gas valve opening state, and taking the completion of heating as the premise for vacuuming initiation, the completion and temperature uniformity of the OLED substrate baking process can be guaranteed. The control logic of valve staged opening and pressure standard determination can achieve a smooth increase in pre-evacuation, avoiding damage to the substrate film layer from sudden pressure drop in the chamber. At the same time, the manual valve safety redundancy design improves the reliability of gas path operation, realizes seamless connection between heating and vacuuming processes, and is compatible with multi-layer chamber synchronous control, which protects product quality and efficiently matches the production line capacity requirements.

[0058] 304. Generate the first air valve opening state based on the second air valve opening state and the preset second pressure threshold;

[0059] In this embodiment, the opening state of the first gas valve is generated based on the opening state of the second gas valve and the preset second pressure threshold. Under the stable working condition of enhanced pre-evacuation, the cavity pressure is collected, which can accurately determine the completion state of pre-evacuation and avoid misjudgment caused by instantaneous pressure. After the pressure reaches the standard, the pre-evacuation valve group is closed, which can stably maintain the rough vacuum environment and lay a solid foundation for the high vacuum stage without interference. By opening the front valve separately, the pre-evacuation and high vacuum air path can be smoothly switched, avoiding gas path conflicts and sudden vacuum changes, reducing pump and valve losses and OLED substrate baking defects, improving system reliability and process connection efficiency, adapting to multi-layer cavity synchronous control, and helping the production line capacity to be realized.

[0060] In this embodiment, while the vacuum chamber is activated, command signals containing core parameters such as the target temperature are acquired. The system's operational safety is ensured by prioritizing the chamber's normal operation. By combining the vacuum chamber's heating state with the pre-evacuation pressure to generate the second valve's opening state, and using heating completion as the vacuuming start condition, the completion and temperature uniformity of the OLED substrate baking process are ensured. A control logic employing tiered valve opening and pressure threshold determination achieves a smooth increase in pre-evacuation vacuum, preventing sudden pressure drops from damaging the substrate film. Combined with a manual valve safety redundancy design, the reliability of the gas path operation is further enhanced. The first valve's opening state is generated based on the second valve's opening state and a preset second pressure threshold. Under stable enhanced pre-evacuation conditions, the chamber pressure is collected to accurately determine the pre-evacuation completion state, avoiding misjudgments caused by instantaneous pressure. Once the pressure threshold is reached, the pre-evacuation valve group is closed to stabilize the rough vacuum environment. The pre-valve is opened independently to achieve a smooth switch between pre-evacuation and high vacuum gas paths, preventing gas path conflicts and sudden vacuum changes. The overall solution reduces pump and valve hardware wear and OLED substrate baking defects, improves system reliability and process integration efficiency, adapts to multi-layer chamber synchronous control, and efficiently meets production line capacity requirements.

[0061] The vacuum system also includes a temperature control relay module and a temperature sensor. The temperature sensor is mounted on the temperature control relay module, which is located on the vacuum chamber. (See also...) Figure 4In the fourth embodiment of a vacuum system control method of the present invention, step 302 specifically includes:

[0062] 401. Analyze the command signal according to the preset adaptive algorithm to obtain the current signal;

[0063] In this embodiment, after receiving the command signal, the adaptive algorithm (such as PID) will analyze and calculate the command signal in real time, and combine it with the system's preset target parameters (such as the current threshold corresponding to the target temperature, the adjustment coefficient, etc.) to automatically adapt to signal fluctuations and output a "current signal" that precisely matches the command signal. The PID algorithm can offset steady-state errors through the integral stage and predict the signal change trend through the derivative stage, and adjust the calculation logic in advance to ensure that the output current signal is stable and accurate, providing a reliable signal basis for subsequent heating control.

[0064] 402. The temperature control relay module outputs current to the heating component based on the current signal;

[0065] In this embodiment, a temperature control relay module improves and optimizes the control process, making the actuators operate more accurately and promptly. The heating component heats the OLED substrate. After receiving the current signal output by the adaptive algorithm, the temperature control relay module amplifies, isolates, and stabilizes the current signal. Based on the processed current signal, it accurately outputs a current that matches the working requirements of the heating component, driving the heating component to start working and prioritizing the heating of the OLED substrate. The core function of the temperature control relay module here is not simply "signal transmission," but "improvement, optimization, and enhancement" of the control process. Directly inputting the current signal into the heating component can easily lead to problems such as "signal attenuation and severe interference," resulting in delayed start-up of the heating component and unstable current output, which in turn affects the heating uniformity of the OLED substrate. The temperature control relay module can effectively isolate interference signals, amplify weak current signals, and optimize the response speed of the current output, making the start-up, stop, and current adjustment of the heating component more accurate and timely. This ensures that the OLED substrate can quickly reach the preset temperature and that the temperature distribution is uniform, avoiding damage or performance abnormalities to the OLED substrate due to heating deviations.

[0066] 403. The actual temperature value of the temperature control relay module is detected by a temperature sensor;

[0067] 404. The heating components are controlled to heat the vacuum chamber according to the measured temperature value to obtain the heating state of the vacuum chamber;

[0068] In this embodiment, the temperature sensor is precisely connected to the temperature control relay module to detect the actual temperature value of the temperature control relay module in real time. The core advantage of choosing to detect the temperature of the temperature control relay module instead of directly detecting the temperature of the OLED substrate or vacuum cavity is "early prediction and rapid feedback": the temperature change of the temperature control relay module is directly related to the stability of its output current, and the output current directly determines the heating intensity of the heating component. Therefore, detecting the temperature of the relay module can indirectly reflect the working status of the heating component, and capture "temperature deviation caused by abnormal current" in advance. This avoids problems of untimely detection and delayed adjustment caused by the large volume of the OLED substrate or vacuum cavity and the lag in temperature conduction, thus buying time for subsequent feedback and adjustment.

[0069] In this embodiment, the PID adaptive algorithm can accurately analyze the command signal, cancel interference and parameter drift, and output a stable current signal, laying the foundation for temperature control. The temperature control relay module optimizes the control process, isolates interference, and amplifies the signal, making the heating component's action more precise and timely, ensuring uniform heating of the OLED substrate, and avoiding damage or performance abnormalities. The temperature sensor detects the temperature of the relay module, enabling early prediction and rapid feedback, effectively improving temperature control accuracy and system reliability, protecting core components, extending service life, adapting to different production needs, reducing energy consumption and maintenance costs, shortening preheating and rework time, improving production efficiency, providing a stable temperature environment for OLED production, and ensuring product quality.

[0070] Please see Figure 5 In the fifth embodiment of a vacuum system control method of the present invention, step 404 specifically includes:

[0071] 501. Calculate the difference between the measured temperature value and the preset target temperature value to obtain the first temperature deviation value;

[0072] In this embodiment, the first temperature deviation value is obtained by subtracting the measured temperature value from the preset target temperature value. This can accurately quantify the degree of deviation between the actual temperature of the cavity and the process requirements, providing core and real basic data for subsequent temperature control algorithm calculations. It intuitively reflects the current status of temperature control deviation and is a key preliminary step for realizing vacuum cavity temperature regulation, ensuring the pertinence and accuracy of subsequent temperature adjustments.

[0073] 502. Obtain the first two temperature deviation values ​​based on the first temperature deviation value to obtain the second and third temperature deviation values;

[0074] In this embodiment, during the temperature control process, the system records the temperature deviation value calculated each time in real time and stores it in the historical data cache. When the current temperature deviation value (first temperature deviation value) is calculated, that is, when the current control increment is required, the system directly retrieves the temperature deviation values ​​of the previous two (i.e., the previous one and the one before that) from the cache, and uses them as the second temperature deviation value and the third temperature deviation value, respectively, for the differential operation of the incremental PID algorithm. This process is only a direct reading of the stored historical data and does not involve complex calculations or conversions.

[0075] 503. Calculate the first temperature deviation value, the second temperature deviation value, and the third temperature deviation value according to the preset incremental algorithm to obtain the current control increment;

[0076] In this embodiment, the incremental algorithm is an incremental PID algorithm. The temperature control logic of the incremental PID algorithm is as follows: the algorithm calculates the control increment (Δu(k)) based on the difference relationship between the first temperature deviation value (e(k)), the previous error (second temperature deviation value) (e(k-1)), and the previous error (third temperature deviation value) (e(k-2)). Its standard mathematical expression (this formula is the evolution and derivation result of the conventional PID formula and is the standard mathematical model of the incremental PID algorithm) is:

[0077] In this system, Kp is the proportional coefficient, which directly reflects the rate of change of temperature deviation, enabling rapid response to temperature change trends; Ki is the integral coefficient, which naturally reflects the accumulation of historical deviations without the need for additional historical error accumulation; and Kd is the derivative coefficient, which truly reflects the acceleration of temperature deviation changes, predicting temperature change trends in advance and achieving proactive adjustment. The incremental PID algorithm combines the current and the previous two sets of three temperature deviation values ​​for differential calculation to obtain the control increment. This fully utilizes the proportional, integral, and derivative coefficients, resulting in a stable output with minimal fluctuations. This method is well-suited to the high thermal inertia of the vacuum chamber, providing a reliable and precise adjustment basis for subsequent temperature control output, thus improving the accuracy and stability of the chamber temperature control.

[0078] 504. Obtain the previous control increment based on the current control increment to get the original output quantity;

[0079] 505. The current control increment and the original output are superimposed to calculate the superimposed temperature value;

[0080] In this embodiment, after each control cycle ends, the system stores the control increment calculated in this cycle as historical data. When the next control output is generated, the system directly retrieves the control increment of the previous cycle as the original output and superimposes it with the control increment calculated in the current cycle to obtain the final superimposed temperature value. This process is also a direct reading of historical data to achieve continuous and smooth control output.

[0081] 506. Heat the vacuum chamber according to the superimposed temperature values ​​to obtain the heating state of the vacuum chamber;

[0082] In this embodiment, the final output (superimposed temperature value) is obtained by superimposing the control increment with the original control output. The superimposed temperature value is obtained by obtaining the previous control increment as the original output and superimposing it with the currently calculated control increment. By adopting the incremental superposition output method, the temperature control output can be kept continuous and smooth, effectively adapting to the characteristics of large thermal inertia of the vacuum cavity, preventing temperature overshoot and oscillation, providing accurate and stable adjustment output for vacuum cavity heating, and further improving the stability and accuracy of temperature control.

[0083] In this embodiment, the temperature difference is first precisely quantified by calculating the first temperature deviation between the measured temperature value and the target temperature value, providing reliable core data for temperature control calculation. Then, combined with the temperature deviation values ​​calculated in the previous two calculations, an incremental PID algorithm is used to perform differential calculation to obtain the control increment. This fully utilizes the proportional coefficient, integral coefficient, and derivative coefficient, enabling rapid response to deviations, elimination of steady-state static error, prediction of temperature trends, and suppression of overshoot, thus adapting to the high thermal inertia of the vacuum cavity. Subsequently, the control increment is superimposed with the previous original output to obtain the superimposed temperature value, making the temperature control output continuous and smooth, avoiding drastic temperature fluctuations and oscillations. Finally, heating is adjusted based on the superimposed temperature value to achieve precise temperature regulation, improve the accuracy and stability of cavity temperature control, ensure the stability of the OLED substrate baking process, and simultaneously improve equipment operational reliability and production efficiency.

[0084] The vacuum system also includes a pre-evacuation valve, a manual valve, a small angle valve, and a large angle valve, all of which are located on the vacuum chamber; please refer to [link to relevant documentation]. Figure 6 In the sixth embodiment of a vacuum system control method of the present invention, step 303 specifically includes:

[0085] 601. Perform state analysis on the heating state of the vacuum chamber;

[0086] 602. If the vacuum chamber is in the heating completed state, then it enters the vacuuming state;

[0087] In this embodiment, after the heating is completed, the equipment officially enters the vacuuming state, completing the orderly switch from the heating process to the vacuuming process.

[0088] 603. Under vacuum conditions, control the pre-evacuation valve and manual valve to open, so as to obtain the third gas valve open state;

[0089] In this embodiment, after entering the vacuuming state, the pre-vacuuming valve and the manual valve are first opened to form the third gas valve open state. The pre-vacuuming valve is the core automatic valve in the vacuuming pre-vacuuming stage, while the manual valve exists as a safety redundancy valve. The two work together to open, which not only establishes the basic gas path channel for vacuuming the cavity and realizes the primary pre-vacuuming of the cavity, but also prevents the pre-vacuuming gas path from being blocked due to the failure of the automatic pre-vacuuming valve, thus improving the equipment operation reliability in the pre-vacuuming stage.

[0090] 604. With the third air valve open, obtain the chamber pressure again to obtain the second chamber pressure;

[0091] 605. Determine whether the pressure in the second chamber is greater than or equal to the pre-evacuation pressure;

[0092] 606. When the pressure in the second chamber is greater than or equal to the pre-evacuation pressure, the small angle valve and the large angle valve are opened to obtain the second air valve in the open state.

[0093] In this embodiment, the second air valve is open when the small angle valve and the large angle valve are open together. In the initial pre-evacuation state with the third air valve open, the chamber pressure is collected in real time to obtain the second chamber pressure, which is compared with the preset pre-evacuation pressure. Only when the second chamber pressure is greater than or equal to the pre-evacuation pressure is the small angle valve and the large angle valve opened to form the second air valve open state. The pre-evacuation pressure is the target threshold of the initial pre-evacuation, which indicates that the chamber has established a basic vacuum environment. At this time, opening the small angle valve and the large angle valve can gradually improve the chamber pumping capacity, avoiding the sudden drop in chamber pressure caused by directly opening all pumping valves, and achieving a smooth increase in pre-evacuation vacuum.

[0094] In this embodiment, the orderly connection between the heating and vacuuming processes of the OLED multilayer vacuum baking equipment and the refined control of the pre-vacuuming stage are realized, ensuring process assurance. Heating completion is a prerequisite for vacuuming initiation, ensuring the completion and uniformity of the OLED substrate heating process and avoiding substrate baking defects. The pre-vacuuming stage employs a combination of pre-vacuuming valves and manual valves, forming a gas path design with automatic valves as the main component and manual valves as a safety redundancy. This establishes a stable basic gas extraction channel, effectively avoiding pre-vacuuming interruptions caused by automatic valve failure and improving equipment operational reliability. By determining whether the cavity pressure reaches the target, small and large angle valves are opened in stages to achieve a smooth increase in pre-vacuum, avoiding sudden pressure drops that could damage the substrate film layer and laying a stable foundation for subsequent high vacuum establishment, while also reducing the instantaneous load on the vacuum pump. The overall control logic has a high degree of automation, achieving seamless process switching, improving the processing efficiency of a single cavity, and is compatible with multi-cavity synchronous control, helping to efficiently achieve production line capacity targets.

[0095] The vacuum system also includes a pre-stage valve, which is located on the vacuum chamber; see also Figure 7 In the seventh embodiment of a vacuum system control method of the present invention, step 304 specifically includes:

[0096] 701. With the second air valve open, obtain the chamber pressure again to obtain the third chamber pressure;

[0097] In this embodiment, the pressure in the third chamber is obtained by acquiring the chamber pressure again under the continuous pre-evacuation state with the second air valve open. At this time, the chamber is in an enhanced pre-evacuation state with the pre-evacuation valve, small angle valve and large angle valve working together, and the vacuum degree has become stable. This detection method avoids misjudgment based on instantaneous pressure value and ensures that the collected pressure data can truly reflect the final vacuum effect of the pre-evacuation stage, providing reliable data support for the determination of pre-evacuation completion.

[0098] 702. Determine whether the pressure in the third chamber is greater than or equal to the second pressure threshold;

[0099] 703. When the pressure in the third chamber is greater than or equal to the second pressure threshold, the pre-extraction valve, small angle valve, and large angle valve shall be closed.

[0100] In this embodiment, once the pressure in the third chamber reaches the target, the pre-evacuation valve, small angle valve, and large angle valve are closed to ensure that the rough vacuum environment formed during the pre-evacuation stage is maintained stably, laying an undisturbed vacuum foundation for the subsequent high vacuum stage.

[0101] 704. Control the opening of the pre-stage valve to obtain the first air valve in the open state;

[0102] In this embodiment, the first gas valve is in the open state of the pre-vacuum valve. The pre-vacuum valve is a dedicated transition valve that connects the rough vacuum pre-evacuation and the molecular pump high vacuum evacuation. Its independent opening enables a smooth switch of the vacuum system's gas path from the "pre-evacuation gas path" to the "high vacuum gas path", avoiding gas path conflicts and sudden changes in the cavity vacuum caused by the simultaneous operation of multiple valves, and ensuring the continuity and stability of the vacuum establishment process.

[0103] In this embodiment, the core control logic for the pre-vacuum to high vacuum stage of the vacuum baking equipment achieves a smooth transition between the pre-vacuum completion and high vacuum startup, combining precise vacuum control, reliable equipment operation, and process assurance value. Under the stable state of enhanced pre-vacuum, the pressure of the third chamber is collected, providing reliable data support for pre-vacuum completion and ensuring the accuracy of stage switching judgment. After the pre-vacuum pressure reaches the target, the pre-vacuum valve, small angle valve, and large angle valve are closed, laying a solid, interference-free vacuum foundation for subsequent high vacuum. A dedicated transition valve and pre-valve are individually opened to achieve a smooth switch between the pre-vacuum and high vacuum air paths, avoiding air path conflicts and sudden changes in chamber vacuum caused by multiple valve linkages, ensuring the continuity and stability of the entire vacuum establishment process. Simultaneously, this logic reduces ineffective losses in pump and valve hardware, improves equipment operational reliability, reduces OLED substrate baking defects caused by vacuum fluctuations, optimizes the efficiency of the vacuum process connection, adapts to multi-layer chamber synchronous control, and helps achieve production line capacity targets.

[0104] Please see Figure 8 In the eighth embodiment of a vacuum system control method of the present invention, step 201 specifically includes:

[0105] 801. Calculate the required number of layers based on the OLED substrate printing time and vacuum baking time;

[0106] In this embodiment, let N be a non-negative integer. If the production capacity of Y OLED substrates needs to be completed within a time period of X, and the printing time of a single OLED substrate is Z1 and the vacuum baking time is Z2, then the vacuum chamber required by the equipment, and the number of layers required, N+1, must satisfy the formula: (N+1)>Y (Z1+Z2) / X≥N; For example, if the production of 10 OLED substrates is required to be completed within 6 hours (360 minutes), the total printing and baking time for a single OLED substrate is 50 minutes (20 minutes of printing plus 30 minutes of baking). Calculations show that 10×50 / 360≈1.39, which satisfies the condition 2>1.39≥1. Therefore, under this capacity requirement, 2 layers of vacuum chambers are needed (the required number of layers is N+1). The calculation method for the required number of layers is based on the substrate printing time and vacuum baking time. The required number of vacuum chamber layers is quantitatively calculated using a standardized formula to accurately match the production line capacity requirements. This avoids insufficient layers leading to unmet capacity and also prevents redundant layers from wasting chamber resources. It provides a clear and verifiable quantitative basis for the allocation of equipment chamber resources, ensuring the efficient achievement of capacity targets.

[0107] 802. Determine multiple specific layer numbers based on the production line's required capacity;

[0108] In this embodiment, based on the production line capacity requirements and with process adaptability as the core principle, multiple specific layer numbers are determined. First, the core conditions of the current OLED substrate vacuum baking process are accurately extracted, including key parameters such as cavity pressure, temperature, and atmosphere. Using these as screening criteria, all cavity layer numbers in the equipment are matched one by one to select layer numbers that fully meet the process parameter requirements as candidates. If multiple candidate layer numbers that meet the process conditions exist after screening, in order to optimize production flow efficiency and reduce substrate transfer time, the principle of proximity will be further followed to select the layer number that is closest to the current process step from the candidate layer numbers. Finally, multiple specific layer numbers that meet the capacity requirements, adapt to the process, and take into account production efficiency are determined.

[0109] 803. Adjust the required number of layers and multiple specific layer numbers according to the real-time production situation to obtain the number of activated layers and multiple activated layer numbers;

[0110] In this embodiment, the required number of layers and specific layer numbers are dynamically adjusted according to the real-time production situation to determine the final number of activated layers and activated layer numbers. For example, when the corresponding cavity malfunctions at a certain stage of the product process, or when the cavity pressure, temperature, and other parameters cannot meet the process formula requirements within a specified time, the optimal adjustment and cavity replacement mechanism is activated: First, based on necessary conditions such as temperature, pressure, atmosphere, and operating status, it is determined whether other cavities meet the current substrate's process requirements. Cavities that meet the process parameters and can operate stably and continuously are considered candidate cavities. If there are multiple candidate cavities, they are selected first according to the principle of proximity. On this basis, the cavity with the longest idle time is further matched to complete the determination and replacement of the most suitable cavity, ensuring the continuous and stable execution of the next stage of the substrate process.

[0111] 804. Generate activation instructions based on the number of activated layers and multiple activated layer numbers;

[0112] In this embodiment, a full-process cavity scheduling logic is implemented, which calculates the required number of layers, determines specific layer numbers, dynamically adjusts layer positions, and generates activation commands. This logic enables the configuration and efficient utilization of cavity resources in multi-layer vacuum baking equipment, adapting to the capacity and process requirements of OLED inkjet printing production lines. The required number of layers is quantified using standardized formulas based on process time (OLED substrate printing time and vacuum baking time), accurately matching capacity targets and avoiding insufficient or redundant cavity resources. Layer number determination prioritizes process adaptability while considering proximity, balancing process requirements and production flow efficiency. Layer positions are dynamically adjusted based on real-time production conditions such as cavity malfunctions and parameter non-compliance, adhering to the principle of prioritizing necessary conditions and balancing proximity and idle time to ensure continuous process progress. Finally, commands are generated according to the activated layer position to achieve precise cavity control. This overall solution provides quantitative basis for cavity scheduling, clear standards for layer selection, and principles for adjustment, ensuring efficient production line capacity implementation, improving process adaptability and production flexibility, maximizing cavity resource utilization, reducing production losses, and providing core support for efficient and stable OLED substrate baking production.

[0113] Includes: Please refer to Figure 9 In the ninth embodiment of a vacuum system control method of the present invention, step 107 specifically includes:

[0114] 901. Determine whether the pressure in the first pipeline is greater than or equal to the preset molecular pump start-up pressure;

[0115] In this embodiment, the first pipeline pressure directly reflects the vacuum pumping capacity of the molecular pump and the pipeline vacuum level. By comparing the first pipeline pressure with the molecular pump start-up pressure in real time, it is ensured that the pipeline has a stable high vacuum output capability when the high vacuum valve is opened, thus avoiding a sudden drop in the cavity vacuum and process interruption due to insufficient pipeline vacuum.

[0116] 902. When the pressure in the first pipeline is greater than or equal to the starting pressure of the molecular pump, the molecular pump is controlled to open.

[0117] In this embodiment, the molecular pump start-up pressure is a threshold that balances safe operation of the equipment with vacuum efficiency, ensuring the hardware conditions for starting the molecular pump while avoiding energy waste caused by ineffective start-up.

[0118] 903. Obtain the pipeline pressure between the high vacuum valve and the molecular pump to obtain the second pipeline pressure;

[0119] In this embodiment, after the molecular pump is started, the high vacuum valve is not opened directly. Instead, the pressure in the second pipeline between the high vacuum valve and the molecular pump is collected. The pressure in the second pipeline directly reflects the vacuum establishment effect in the pipeline after the molecular pump is started. It is the most direct and accurate basis for determining whether the high vacuum valve has the conditions to be opened.

[0120] 904. Determine whether the pressure in the second pipeline is greater than or equal to the starting pressure of the high vacuum valve;

[0121] 905. When the pressure in the second pipeline is greater than or equal to the starting pressure of the high vacuum valve, the high vacuum valve is controlled to open.

[0122] In this embodiment, the high vacuum valve start-up pressure is a process-adaptive threshold. Only when the pressure in the second pipeline is greater than or equal to the high vacuum valve start-up pressure can the high vacuum valve be controlled to open, matching the cavity vacuum requirements of OLED inkjet printing and ensuring that a stable high vacuum environment has been established in the pipeline at this time.

[0123] In this embodiment, by implementing graded conditional start-up control for the molecular pump and high-vacuum valve, multiple benefits are achieved, including equipment safety protection, vacuum control optimization, process quality assurance, and improved production efficiency. Specifically, a start-up threshold is set for the molecular pump to prevent wear and malfunctions of the precision pump body caused by non-compliant starts, reducing energy consumption and hardware losses, extending the overall service life of the equipment, and lowering maintenance costs. Furthermore, by real-time detection and precise judgment of segmented pipeline pressure, the vacuum level is established smoothly and progressively, avoiding sudden drops in cavity vacuum and process interruptions caused by insufficient pipeline vacuum when the high-vacuum valve is activated, ensuring the accuracy and stability of the vacuum system control. In addition, the high-vacuum valve start-up pressure is matched to the requirements of the OLED inkjet printing process, ensuring that a stable high-vacuum environment has been formed in the pipeline upon activation, eliminating substrate baking defects caused by vacuum fluctuations, improving product yield, and the solution can be adapted to multi-layer cavity synchronous control, fully leveraging the high-capacity design advantages of the equipment while balancing production efficiency and process adaptability.

[0124] The above describes a vacuum system control method according to an embodiment of the present invention. The following describes a vacuum system according to an embodiment of the present invention. Please refer to [link / reference]. Figure 10 One embodiment of the vacuum system of the present invention includes:

[0125] A vacuum system executes a vacuum system control method as described above. The vacuum system includes a host computer 12, a vacuum device 1 electrically connected to the host computer, an OLED substrate 2, a high vacuum valve 3, a molecular pump 4, a pre-vacuum valve 5, a temperature control relay module 6, a temperature sensor 7, a pre-evacuation valve 8, a manual valve 9, a small angle valve 10, and a large angle valve 11. A vacuum chamber is provided on the vacuum device. The OLED substrate 2, the high vacuum valve 3, the molecular pump 4, and the pre-vacuum valve 5 are all located on the vacuum chamber. The temperature sensor 7 is located on the temperature control relay module 6. The temperature control relay module 6, the pre-evacuation valve 8, the manual valve 9, the small angle valve 10, the pre-vacuum valve 5, and the large angle valve 11 are all located on the vacuum chamber.

[0126] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working process of the system, device, or unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0127] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A vacuum system control method, characterized in that, An application is made in a vacuum system, the vacuum system comprising a vacuum device, an OLED substrate, a high-vacuum valve, a molecular pump, and a pre-stage valve; the vacuum device has a vacuum chamber; the OLED substrate, the high-vacuum valve, the molecular pump, and the pre-stage valve are all disposed on the vacuum chamber; the vacuum system control method includes: Obtain OLED substrate printing time, vacuum baking time, required production line capacity, and real-time production status; The first air valve opening state is generated based on the OLED substrate printing time, vacuum baking time, production line required capacity, real-time production status, and preset pre-extraction pressure. With the first air valve open, the chamber pressure is obtained to obtain the first chamber pressure; Determine whether the pressure in the first chamber is greater than or equal to a preset first pressure threshold. When the pressure in the first chamber is greater than or equal to the first pressure threshold, the high vacuum valve is closed. Obtain the pipeline pressure between the molecular pump and the fore-stage valve to obtain the first pipeline pressure; The high vacuum valve is opened based on the first pipeline pressure and the preset high vacuum valve start pressure.

2. The vacuum system control method as described in claim 1, characterized in that, The process of generating the first gas valve opening state based on the OLED substrate printing time, vacuum baking time, production line required capacity, real-time production status, and preset pre-extraction pressure includes: Activation instructions are generated based on OLED substrate printing time, vacuum baking time, production line capacity requirements, and real-time production status. Entering the vacuum chamber activation state according to the activation command; The first gas valve is opened based on the activation state of the vacuum chamber and the pre-evacuation pressure.

3. The vacuum system control method as described in claim 2, characterized in that, The vacuum system further includes a heating assembly disposed on the vacuum chamber; the step of generating the first gas valve opening state based on the vacuum chamber activation state and pre-evacuation pressure includes: Acquire command signals while the vacuum chamber is in an activated state; The heating components are controlled according to the command signal to heat the vacuum chamber in order to obtain the heating state of the vacuum chamber; The second gas valve is opened based on the heating state of the vacuum chamber and the pre-evacuation pressure. The first air valve opening state is generated based on the second air valve opening state and the preset second pressure threshold.

4. The vacuum system control method as described in claim 3, characterized in that, The vacuum system further includes a temperature control relay module and a temperature sensor, the temperature sensor being disposed on the temperature control relay module, and the temperature control relay module being disposed on the vacuum cavity; the step of controlling the heating assembly to heat the vacuum cavity according to the command signal to obtain the heating state of the vacuum cavity includes: The command signal is analyzed according to a preset adaptive algorithm to obtain the current signal; The temperature control relay module outputs current to the heating component based on the current signal; The actual temperature value of the temperature control relay module is detected by a temperature sensor. The heating components are controlled to heat the vacuum chamber based on the measured temperature value to obtain the heating state of the vacuum chamber.

5. The vacuum system control method as described in claim 4, characterized in that, The step of controlling the heating component to heat the vacuum cavity based on the measured temperature value to obtain the heating state of the vacuum cavity includes: The difference between the measured temperature value and the preset target temperature value is calculated to obtain the first temperature deviation value; The first two temperature deviation values ​​are obtained based on the first temperature deviation value, so as to obtain the second temperature deviation value and the third temperature deviation value; The first temperature deviation value, the second temperature deviation value, and the third temperature deviation value are calculated according to the preset incremental algorithm to obtain the current control increment; The previous control increment is obtained based on the current control increment to obtain the original output quantity; The current control increment and the original output are superimposed to calculate the superimposed temperature value; The vacuum chamber is heated based on the superimposed temperature values ​​to obtain the heating state of the vacuum chamber.

6. The vacuum system control method as described in claim 3, characterized in that, The vacuum system further includes a pre-evacuation valve, a manual valve, a small angle valve, and a large angle valve, all of which are located on the vacuum chamber. The step of generating the second gas valve's open state based on the vacuum chamber's heating state and the pre-evacuation pressure includes: Perform state analysis on the heating state of the vacuum chamber; If the vacuum chamber is in the heating completed state, it will enter the vacuuming state. In the vacuum state, control the pre-evacuation valve and manual valve to open, so as to obtain the third gas valve open state; With the third air valve open, the chamber pressure is obtained again to obtain the second chamber pressure; Determine whether the pressure in the second chamber is greater than or equal to the pre-evacuation pressure; When the pressure in the second chamber is greater than or equal to the pre-evacuation pressure, the small angle valve and the large angle valve are opened to achieve the open state of the second air valve.

7. The vacuum system control method as described in claim 3, characterized in that, The vacuum system further includes a pre-valve, which is disposed on the vacuum chamber; the step of generating the first gas valve opening state based on the second gas valve opening state and a preset second pressure threshold includes: With the second air valve open, the chamber pressure is obtained again to obtain the third chamber pressure; Determine whether the pressure in the third chamber is greater than or equal to the second pressure threshold; When the pressure in the third chamber is greater than or equal to the second pressure threshold, the pre-extraction valve, small angle valve, and large angle valve are closed. The pre-valve is opened to achieve the open state of the first air valve.

8. A vacuum system control method as described in claim 2, characterized in that, The process of generating activation instructions based on OLED substrate printing time, vacuum baking time, production line capacity requirements, and real-time production status includes: The required number of layers is calculated based on the OLED substrate printing time and vacuum baking time. Multiple specific layer numbers are determined based on the production line's required capacity. The required number of layers and multiple specific layer numbers are adjusted according to the real-time production situation to obtain the number of activated layers and multiple activated layer numbers; Activation instructions are generated based on the number of activation layers and multiple activation layer numbers.

9. A vacuum system control method as described in claim 1, characterized in that, The step of controlling the opening of the high vacuum valve based on the first pipeline pressure and the preset high vacuum valve start pressure includes: Determine whether the pressure in the first pipeline is greater than or equal to the preset molecular pump start-up pressure; When the pressure in the first pipeline is greater than or equal to the molecular pump start-up pressure, the molecular pump is controlled to open. Obtain the pipeline pressure between the high vacuum valve and the molecular pump to obtain the second pipeline pressure; Determine whether the pressure in the second pipeline is greater than or equal to the starting pressure of the high vacuum valve; When the pressure in the second pipeline is greater than or equal to the starting pressure of the high vacuum valve, the high vacuum valve is opened.

10. A vacuum system, characterized in that, The vacuum system control method according to any one of claims 1-9 is implemented, wherein the vacuum system includes a host computer, a vacuum device electrically connected to the host computer, an OLED substrate, a high vacuum valve, a molecular pump, a pre-vacuum valve, a temperature control relay module, a temperature sensor, a pre-evacuation valve, a manual valve, a small angle valve, and a large angle valve; a vacuum chamber is provided on the vacuum device; the OLED substrate, the high vacuum valve, the molecular pump, and the pre-vacuum valve are all located on the vacuum chamber; the temperature sensor is located on the temperature control relay module; and the temperature control relay module, the pre-evacuation valve, the manual valve, the small angle valve, the pre-vacuum valve, and the large angle valve are all located on the vacuum chamber.

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