Heat dissipation device

Abstract

The invention relates to the technical field of heat dissipation, and provides a heat dissipation device which comprises a bearing assembly, a first heating device and a rigid cooling pipe, and the first heating device is fixed to the bearing assembly and protrudes out of the surface of the bearing assembly; the cooling pipe is located on the side, opposite to the bearing assembly, of the first heating device. The cooling pipe comprises two first pipe sections and a second pipe section connected between the two first pipe sections, and the ends, away from the second pipe section, of the two first pipe sections are both fixed to the bearing assembly. The surface, facing the first heating device, of the second pipe section is a first plane which makes contact with the first heating device and is in heat conduction connection with the first heating device. Compared with a device adopting a liquid cooling plate for heat dissipation, the heat dissipation device can enable a chip or a corresponding device to achieve a better heat dissipation effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a heat dissipation device. BACKGROUND

[0002] In recent years, with the increasing of the intelligent degree of electric vehicles, the development of artificial intelligence large models and the development of various intelligent electronic devices, the power consumption and power density of chips and electronic devices continue to increase. In order to ensure the normal operation of chips and electronic devices, improving the heat dissipation of chips and electronic devices in the equipment becomes an important issue. SUMMARY

[0003] The embodiment of the present application provides a heat dissipation device, which can make the chip or the corresponding device achieve better heat dissipation effect compared with the device adopting the liquid cooling plate heat dissipation.

[0004] The present application provides a heat dissipation device, which comprises a bearing assembly, a first heat generating device and a rigid cold pipe, the first heat generating device is fixed to the bearing assembly and protrudes from the surface of the bearing assembly; the cold pipe is located on the side opposite to the bearing assembly of the first heat generating device; the cold pipe comprises two first pipe segments and a second pipe segment connected between the two first pipe segments, and the ends of the two first pipe segments away from the second pipe segment are both fixed to the bearing assembly; the surface of the second pipe segment facing the first heat generating device is a first plane, and the first plane is in contact and heat-conducting connection with the first heat generating device. In this scheme, on the one hand, the cold pipe is in contact with the first heat generating device through the first plane, that is, the cold pipe and the first heat generating device are still in surface contact. The surface contact between the cold pipe and the first heat generating device ensures the heat dissipation area of the first heat generating device. Moreover, based on the surface contact between the cold pipe and the first heat generating device, the cold pipe is thinner in wall thickness than the liquid cooling plate, which can make the thermal resistance on the heat dissipation link of the first heat generating device smaller, so that the heat dissipation device provided by the present application is more conducive to improving the heat dissipation efficiency of the first heat generating device; on the other hand, the ratio of the length to the diameter of the cold pipe is large, so that the second pipe segment with a certain distance from both ends of the cold pipe can produce a certain floating, which can make the position of the second pipe segment more adaptive to the first heat generating device, which is conducive to ensuring the reliable connection between the second pipe segment and the first heat generating device, thereby reducing the contact thermal resistance and further improving the heat dissipation efficiency of the first heat generating device. At the same time, the processing technology of the cold pipe in the heat dissipation device provided by the embodiment of the present application is simplified, which is conducive to improving the reliability of the structure of the heat dissipation device and reducing the cost. When the first heat generating device is a chip or a corresponding device, the heat dissipation effect of the chip or the corresponding device is better than that of the liquid cooling plate heat dissipation mode, and when the first heat generating device is a chip, the problem of chip junction temperature overtemperature can be effectively solved.

[0005] In a possible embodiment, the two first pipe sections are cantilever structures; one end of the first pipe section connected with the bearing assembly is a connecting end, and the other end of the first pipe section is a suspended end; the second pipe section is connected between the suspended ends of the two first pipe sections, so that the second pipe section has a larger floating amount relative to the first heat generating device and has a stronger adaptability to the tolerance of the first heat generating device.

[0006] There are various ways to make the two first pipe sections of the cold pipe into cantilever structures, for example: in a possible embodiment, the axes of the two first pipe sections are collinear; the heat dissipation device further includes two first connecting pipe sections, the axes of the two first connecting pipe sections are not collinear with the axes of the first pipe sections, and the second pipe section is connected with the two first pipe sections through the two first connecting pipe sections. In a possible embodiment, the two first pipe sections are arranged at a second included angle greater than 0°, and the axis of the second pipe section is collinear with the axis of one of the first pipe sections. In a possible embodiment, the two first pipe sections each include a first part, and the two first pipe sections are connected with the bearing assembly through the corresponding first parts respectively; the two first parts are parallel to each other, and the second pipe section is arranged at a first included angle greater than 0° with the first parts.

[0007] In a possible embodiment, the surface of the second pipe section opposite to the first heat generating device is a second plane, and the second plane is parallel to the first plane. In this way, components can be arranged on the surface of the cold pipe opposite to the first heat generating device. Exemplarily, the cold pipe is a seamless integrated structure, so that the risk of leakage of the cold pipe can be reduced.

[0008] In a possible embodiment, the inner contour and the outer contour of the cross section perpendicular to the axis of each of the two first pipe sections are circular. That is, the two first pipe sections are circular pipes. Pipe joints are usually adapted to circular pipes, and therefore, when the two first pipe sections are circular pipes, the connection between the cold pipe and the external circulating pipeline is more convenient.

[0009] In a possible embodiment, the orthographic projection of the first surface on the first heat generating device covers the surface of the first heat generating device facing the cold pipe, so as to increase the heat transfer area between the first heat generating component and the cold pipe as much as possible and improve the heat dissipation efficiency of the first heat generating device.

[0010] In a possible embodiment, the cold pipe is a seamless integrated structure, so as to reduce the leakage point and avoid leakage of the refrigerant in the cold pipe.

[0011] In a possible embodiment, the inner wall of the second pipe section is provided with a turbulence structure, which increases the resistance of the refrigerant flowing in the second pipe section, reduces the flow rate of the refrigerant in the second pipe section, enhances the heat dissipation capacity of the second pipe section, and enables the refrigerant to exchange heat with the first heat generating device more fully. Exemplarily, the cold pipe is a metal pipe; and the turbulence structure includes at least one of a helical wire, a helical protrusion, a plurality of metal fins, and a plurality of protrusions protruding towards the axis direction of the second pipe section.

[0012] In a possible embodiment, the heat dissipation device includes a plurality of first heat generating devices, each of which is in contact with and in thermal conduction connection with a second pipe section; and the second pipe sections are connected in series through second connecting pipe sections, or each second pipe section is connected with two first pipe sections, and the second pipe sections are connected in parallel. In this scheme, when the plurality of first heat generating devices have differences in height due to tolerances and other factors, the cold pipe can be adapted to the first heat generating devices of different heights. Compared with the case where the liquid cooling plate is adapted to the first heat generating devices through different height bosses, on the one hand, the distance between the refrigerant and the first heat generating device is closer, so that the heat dissipation effect of the first heat generating device is better; on the other hand, the cost of this scheme is also significantly lower.

[0013] In a possible embodiment, the second connecting pipe section includes at least one curved section, and the curved section can increase the overhanging length of the cold pipe, enhance the flexibility of the cold pipe, and thus improve the floatability of the second pipe section, so that the second pipe section can better contact the first heat generating device.

[0014] In a possible embodiment, the heat dissipation device includes a plurality of first heat generating devices, each of which is in contact with and in thermal conduction connection with at least two second pipe sections, and the second pipe sections are connected in series through third connecting pipe sections. In this way, the flow rate of the refrigerant in each second pipe section can be appropriately increased, so that the refrigerant can more quickly take away the heat of the corresponding first heat generating device.

[0015] In a possible embodiment, the third connecting pipe section includes at least one curved section, and the curved section can increase the overhanging length of the cold pipe, enhance the flexibility of the cold pipe, and thus improve the floatability of the second pipe section, so that the second pipe section can better contact the first heat generating device.

[0016] In a possible embodiment, the heat dissipation device includes a plurality of first heat generating devices, each of which is in contact with and in thermal conduction connection with at least two second pipe sections, and the second pipe sections are connected in series through third connecting pipe sections. In this way, the flow rate of the refrigerant in each second pipe section can be appropriately increased, so that the refrigerant can more quickly take away the heat of the corresponding first heat generating device.

[0017] In a possible embodiment, the heat dissipation device comprises at least one second heat generating component, each of the second heat generating components is arranged on the bearing assembly, and each of the second heat generating components protrudes from the same surface of the bearing assembly as the first heat generating component; the compression component is a heat conducting component and is in heat conducting connection with the corresponding second pipe segment; each of the second heat generating components is in mutual contact and heat conducting connection with the corresponding compression component, so that the heat of the second heat generating component can be conducted to the second pipe segment through the compression component, and then carried away by the refrigerant in the cold pipe.

[0018] In a possible embodiment, the bearing assembly comprises a shell and a circuit board, the shell comprises a bottom plate and a plurality of side plates fixed to the bottom plate, and the plurality of side plates and the bottom plate jointly enclose a containing space; the circuit board is fixed in the containing space, and the first heat generating component is fixed to the circuit board; the two first pipe segments are both fixed to the side plates. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 A top view of a heat dissipation device provided by an embodiment of the present application;

[0020] Figure 2 A sectional view of the heat dissipation device shown in FIG. 2; Figure 1

[0021] Figure 3 A sectional view of another heat dissipation device provided by an embodiment of the present application;

[0022] Figure 4 A structural schematic diagram of a cold pipe in a heat dissipation device provided by an embodiment of the present application;

[0023] Figure 5 A structural schematic diagram of a cold pipe in another heat dissipation device provided by an embodiment of the present application;

[0024] Figure 6 A structural schematic diagram of a cold pipe in another heat dissipation device provided by an embodiment of the present application;

[0025] Figure 7 A structural schematic diagram of a cold pipe in another heat dissipation device provided by an embodiment of the present application;

[0026] Figure 8 A structural schematic diagram of a cold pipe provided by an embodiment of the present application;

[0027] Figure 9 A partial schematic diagram of a B-B sectional view of the heat dissipation device shown in FIG. 6; Figure 8

[0028] Figure 10 A schematic diagram of a cold pipe forming step in a heat dissipation device provided by an embodiment of the present application;

[0029] Figure 11 ​​A cross-sectional view of a cooling tube in another heat dissipation device provided by an embodiment of the present application;

[0030] Figure 12 A cross-sectional view of a cooling tube in another heat dissipation device provided by an embodiment of the present application; Figure 11 A partial view of a cross-sectional view of the cooling tube from another angle;

[0031] Figure 13 A partial view of a cross-sectional view of a cooling tube in another heat dissipation device provided by an embodiment of the present application;

[0032] Figure 14 A partial view of a cross-sectional view of a cooling tube in another heat dissipation device provided by an embodiment of the present application;

[0033] Figure 15 A partial view of a cross-sectional view of a cooling tube in another heat dissipation device provided by an embodiment of the present application;

[0034] Figure 16 A structural schematic view of another heat dissipation device provided by an embodiment of the present application;

[0035] Figure 17 A structural schematic view of another heat dissipation device provided by an embodiment of the present application;

[0036] Figure 18 A structural schematic view of another heat dissipation device provided by an embodiment of the present application;

[0037] Figure 19 A structural schematic view of another heat dissipation device provided by an embodiment of the present application;

[0038] Figure 20 A structural schematic view of another heat dissipation device provided by an embodiment of the present application;

[0039] Figure 21 A structural schematic view of another heat dissipation device provided by an embodiment of the present application;

[0040] Figure 22 A structural schematic view of another heat dissipation device provided by an embodiment of the present application;

[0041] Figure 23 A structural schematic view of a cooling tube and a press-fit member in a heat dissipation device provided by an embodiment of the present application;

[0042] Reference signs: 1 - bearing assembly; 11 - housing; 111 - bottom plate; 112 - side plate; 113 - cover plate; 12 - circuit board; 2 - first heat generating device; 3 - cold pipe; 31 - first pipe segment; 311 - first part; 312 - second part; 32 - second pipe segment; 4 - first connecting pipe segment; 51 - helical metal wire; 52 - helical protrusion; 53 - metal fin; 54 - protruding part; 6 - second connecting pipe segment; 61 - curved segment; 7 - third connecting pipe segment; 8 - crimping piece; 9 - second heat generating device; 100 - floating connection assembly; 101 - screw; 102 - elastic piece; 103 - nut. DETAILED DESCRIPTION

[0043] In electronic devices, as the hardware integration improves, the power consumption of various chips is also increasing. At the same time, as technology develops, the number of chips in electronic devices is also increasing, and the heat flux density of the circuit board is significantly increased. In order to achieve better heat dissipation effect, liquid cooling plates are often used to liquid cool and dissipate heat for chips and other devices. However, due to the wall thickness and other factors of the liquid cooling plate, the thermal resistance is large, which increases the thermal resistance in the heat dissipation link of the corresponding chip or device, which is not conducive to ensuring the effective heat dissipation of the corresponding chip or device. In addition, due to the size tolerance and other factors of the corresponding chip or device, after the liquid cooling plate is installed at the predetermined position, it may not be reliably connected with the corresponding chip or device, which is also not conducive to ensuring the effective heat dissipation of the corresponding chip or device.

[0044] Based on this, the embodiment of the present application provides a heat dissipation device to improve the heat dissipation of chips or devices. In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be described in further detail below with reference to the drawings.

[0045] The terms used in the following embodiments are only for the purpose of describing the specific embodiments and are not intended to be limiting on the present application. As used in the specification and the appended claims of the present application, the singular forms "a," "an," and "the" are intended to include the plural forms as well, such as "one or more," unless the context clearly indicates otherwise.

[0046] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0047] Figure 1 This is a top view of a heat dissipation device provided in an embodiment of this application. Figure 2 for Figure 1 A cross-sectional view (AA) of the heat dissipation device shown. Figure 1 and Figure 2 As shown, the heat dissipation device includes a support assembly 1, a first heating element 2, and a rigid cooling pipe 3. The first heating element 2 is fixedly mounted on the support assembly 1 and protrudes from the surface of the support assembly 1. The cooling pipe 3 is located on the side opposite to the first heating element 2 and the support assembly 1. Specifically, the cooling pipe 3 can be a metal pipe and may include a first pipe segment 31 and a second pipe segment 32. There are two first pipe segments 31, and the second pipe segment 32 is connected between the two first pipe segments 31. The ends of the two first pipe segments 31 away from the second pipe segment 32 are fixedly connected to the support assembly 1, thereby mounting the cooling pipe 3 on the support assembly 1. It should be understood that the second pipe segment 32 can be directly connected to the two first pipe segments 31, or it can be indirectly connected through other pipe segments. Further, the surface of the second pipe segment 32 facing the first heating element 2 is a first plane a (not marked in the figure), and the first plane a is in contact with and thermally connected to the first heating element 2. Exemplarily, the first plane a and the first heating device 2 can be directly or indirectly disconnected. In this application, the indirect contact between the two through a thermal interface material layer T is used as an example. The first plane a is in contact with the first heating device 2 through the thermal interface material (TIM) layer T and is thermally connected, which can reduce the contact thermal resistance between the cold pipe 3 and the first heating device 2. In specific implementation, the ends of the two first pipe sections 31 away from the second pipe section 32 are connected to a circulation pipeline equipped with a circulation pump and a radiator, so that the refrigerant flows in from one end of the cold pipe 3 and flows out from the other end of the cold pipe 3, circulating in the circulation pipeline and carrying away the heat of the first heating device 2.

[0048] In the scheme, on one hand, the cold pipe 3 is in contact with the first heat generating device 2 through the first plane a, that is, the cold pipe 3 and the first heat generating device 2 are still in surface contact. The surface contact between the cold pipe 3 and the first heat generating device 2 ensures the heat dissipation area of the first heat generating device 2. Moreover, on the basis of the surface contact between the cold pipe 3 and the first heat generating device 2, the cold pipe 3 is thinner in thickness relative to the liquid cooling plate, which can make the thermal resistance on the heat dissipation link of the first heat generating device 2 smaller, and thus the heat dissipation device provided by the application is more conducive to improving the heat dissipation efficiency of the first heat generating device 2. On the other hand, the length-to-diameter ratio of the cold pipe 3 is large, so that the second pipe segment 32 at a certain distance from both ends of the cold pipe 3 can produce a certain floating, which can make the position of the second pipe segment 32 more adaptable to the first heat generating device 2, which is conducive to ensuring the reliable connection between the second pipe segment 32 and the first heat generating device 2, thereby reducing the contact thermal resistance and further improving the heat dissipation efficiency of the first heat generating device 2. At the same time, in the heat dissipation device provided by the application, the processing technology of the cold pipe 3 is simplified, which is conducive to improving the reliability of the structure of the heat dissipation device and reducing the cost.

[0049] It should be understood that the heat dissipation device mentioned in the embodiments of the application includes but is not limited to electronic devices, and the application fields thereof include but are not limited to computing centers, base stations, servers, and vehicle-mounted devices, etc. Taking the computing center as an example, the heat dissipation device can be used for the server of the computing center, at this time, the first heat generating device 2 can be a central processing unit (CPU) or a graphics processing unit (GPU) of the server, etc. Taking the vehicle-mounted device as an example, at this time, the first heat generating device 2 can be a vehicle-mounted mobile data center (MDC). It should be understood that the first heat generating device 2 includes but is not limited to a chip. When the first heat generating device 2 is a chip or a corresponding device, the heat dissipation effect of the chip or the corresponding device is better than that of the liquid cooling plate heat dissipation mode, and when the first heat generating device 2 is a chip, the problem of chip junction temperature over-temperature can be effectively solved.

[0050] Please continue to refer to Figure 1 and Figure 2In a specific implementation, the bearing assembly 1 can include a housing 11 and a circuit board 12, the housing 11 includes a bottom plate 111 and a plurality of side plates 112 fixed to the bottom plate 111, the plurality of side plates 112 and the bottom plate 111 collectively enclose a receiving space O, the circuit board 12 is fixed in the receiving space O, and the first heat generating device 2 is fixed on the circuit board 12. Exemplarily, the first heat generating device 2 is a chip, for example, a system on a chip (SOC), and the chip can be fixed on a surface of the circuit board 12 facing the bottom plate 111 or a surface of the circuit board 12 facing away from the bottom plate 111. In this embodiment, the first heat generating device 2 is fixed on the surface of the circuit board 12 facing away from the bottom plate 111. Next, the structure of the cold pipe 3 is introduced, as shown in Figure 1 and Figure 2 The two first pipe sections 31 of the cold pipe 3 are fixed on the side plates 112. In a specific implementation, the two first pipe sections 31 of the cold pipe 3 can be fixed on the same side plate 112 or different side plates 112, which can be specifically set according to actual needs. In a specific implementation, the bottom plate 111 and the side plates 112 enclose a cuboid-shaped receiving space, that is, the housing includes four side plates 112 opposite to each other. The inner walls of a pair of side plates 112 are each provided with a connecting arm, the circuit board 12 is located on the side of the connecting arm facing the bottom plate 111, and the circuit board 12 is fixedly connected to the connecting arms by screws 101.

[0051] Figure 3 Another cross-sectional view of the heat dissipation device provided in the embodiments of the present application is shown in Figure 3 In some embodiments, the heat dissipation device can further include a cover plate 113 fixed to the surface of each side plate 112 away from the bottom plate 111, and the cover plate 113 and each side plate 112 and the bottom plate 111 are sealed therebetween to achieve the effects of dustproofing, waterproofing, etc., and better protect the circuit board 12 and the first heat generating device 2, etc.

[0052] Please continue to refer to Figure 1 The two first pipe sections 31 of the cold pipe 3 are both cantilever structures, that is, the two first pipe sections 31 are only connected at one end to the bearing assembly 1. The end of the first pipe section 31 connected to the bearing assembly 1 is the connecting end L1, and the other end of the first pipe section 31 is the suspended end L2. The second pipe section 32 is connected between the suspended ends L2 of the two first pipe sections 31, so that the second pipe section 32 has a larger floating amount relative to the first heat generating device 2 and has a stronger adaptability to the tolerance of the first heat generating device.

[0053] There are various implementation manners for making the two first pipe sections 31 of the cold pipe 3 be cantilever structures, for example, as shown in Figure 1 and Figure 2As shown, the two first pipe sections 31 are fixed on the same side plate 112, and the portions of the two first pipe sections 31 away from the second pipe section 32 are parallel to each other, the distances between the axes of the two first pipe sections 31 and the bottom plate 111 are the same, the second pipe section 32 is connected to the suspended end L2 of the two first pipe sections 31, and the portions of the two first pipe sections 31 parallel to each other are perpendicular to the second pipe section 31. Of course, in other embodiments, the distances between the axes of the two first pipe sections 31 and the bottom plate 111 can also be different, and in specific implementation, they can be set according to actual needs. Please refer to Figure 4 As shown, the two first pipe sections 31 of the cold pipe 3 each include a first part 311, and the two first pipe sections 31 are fixedly connected to the bearing assembly 1 through the corresponding first parts 311. The two first parts 311 are parallel to each other, and the second pipe section 32 is arranged at a first included angle greater than 0° with the first part 311. Exemplarily, the second pipe section can also include two second parts 312, and the second pipe section is connected to each first part 311 through one second part 312. It is not difficult to understand that each first part 311 and the corresponding second part 312 can be a seamless integrated structure, so as to reduce the leakage points of the cold pipe 3 and reduce the possibility of refrigerant leakage of the cold pipe 3. Of course, in other embodiments, the first part 311 and the corresponding second part 312 can also be separate components and are fixedly connected, which is not limited in the present application.

[0054] Figure 5 A structure schematic view of the cold pipe 3 in a heat dissipation device provided in an embodiment of the present application is shown in FIG. 4. As shown in FIG. 4, Figure 5 Exemplarily, the two first connecting pipe sections 4 are located on the same side of the first pipe section 31, and the two first connecting pipe sections 4 are perpendicular to the first pipe section 31. Exemplarily, each first pipe section 31 and the corresponding first connecting pipe section 4 can be a seamless integrated structure, so as to reduce the leakage points of the cold pipe 3 and reduce the possibility of refrigerant leakage of the cold pipe 3. Of course, in other embodiments, the first pipe section 31 and the corresponding first connecting pipe section 4 can also be separate components and are fixedly connected, which is not limited in the present application.

[0055] Figure 6 A structure schematic view of the cold pipe 3 in another heat dissipation device provided in an embodiment of the present application is shown in FIG. 5. As shown in FIG. 5, Figure 6As shown, the two first pipe segments 31 can also be arranged at a second included angle greater than 0° with respect to each other, and the axis of the second pipe segment 32 can be collinear with the axis of one of the first pipe segments 31. This arrangement can also connect the second pipe segment 32 to the free end L2 of the two first pipe segments 31. As an example, as shown in Figure 7 As shown, the second included angle can be 90°.

[0056] Figure 8 A structure of the cold pipe 3 is provided in some embodiments. As shown, Figure 8 As shown, the inner and outer contours of the cross section perpendicular to the axis of the two first pipe segments 31 are both circular, that is, the two first pipe segments 31 are both circular pipes. The pipe joint is generally adapted to circular pipes, and thus, when the two first pipe segments 31 are both circular pipes, the connection between the cold pipe 3 and the external circulation pipeline is more convenient. Please continue to refer to Figure 8 As shown, the surface of the second pipe segment 32 opposite to the first heat generating device 2 can be a second plane b, and the second plane b is parallel to the first plane a, so as to facilitate the arrangement of components on the surface of the cold pipe 3 opposite to the first heat generating device 2. As an example, the cold pipe 3 is a seamless integrated structure, and thus, the risk of leakage of the cold pipe 3 can be reduced by avoiding the welding seam. In this case, the forming method of the cold pipe 3 can be as follows: a metal circular pipe with a certain diameter is selected according to specific needs, and a certain length of the metal circular pipe is cut according to needs; a predetermined pipe segment of the cut metal circular pipe is flattened according to design requirements, and the flattened pipe segment serves as the above-mentioned second pipe segment 32; then, the pipe material is bent into the required shape. Of course, the cold pipe 3 can also be prepared by using other forming methods, such as: a blow molding process, machining, or a combination of die casting and welding.

[0057] In order to maximize the heat transfer area between the first heat generating component and the cold pipe 3, in one possible implementation, the orthographic projection of the first surface on the first heat generating device 2 covers the surface of the first heat generating device 2 facing the cold pipe 3. As an example, the contour of the orthographic projection of the first plane a on the first heat generating device 2 can coincide with the contour of the surface of the first heat generating device 2 facing the cold pipe 3, or the contour of the orthographic projection of the first plane a on the first heat generating device 2 can exceed the range of the contour of the surface of the first heat generating device 2 facing the cold pipe 3. Of course, in other implementations, the contour of the orthographic projection of the first surface on the first heat generating device 2 can also be located within the contour of the surface of the first heat generating device 2 facing the cold pipe 3.

[0058] In some embodiments, the inner wall of the second pipe segment 32 is provided with a turbulence structure to increase the resistance of the refrigerant flowing in the second pipe segment 32, reduce the flow rate of the refrigerant in the second pipe segment 32, and enhance the heat dissipation capacity of the second pipe segment 32, so that the refrigerant can be more fully heat exchanged with the first heat generating device 2. The turbulence structure can have various forms, and several possible forms of the turbulence structure will be introduced below in conjunction with the drawings.

[0059] Figure 9 for Figure 8 A partial schematic diagram of the BB cross-sectional view. For example... Figure 9 As shown, the flow-disrupting structure includes a spiral metal wire 51. Obviously, the spiral metal wire 51 mentioned in this embodiment should be interpreted broadly; the orthographic projection of the spiral metal wire 51 on a plane perpendicular to its own axis is not limited to a circle, but can also be rectangular or approximately rectangular. For example, the orthographic projection of the spiral metal wire 51 on a plane perpendicular to its own axis is approximately rectangular. Using the spiral metal wire 51 as the flow-disrupting structure makes its installation in the second pipe section 32 more convenient. Specifically, the forming method of the cold pipe 3 using the spiral metal wire 51 as the flow-disrupting structure can be as follows: select a metal circular pipe of a certain diameter according to specific needs, and cut the metal circular pipe to a certain length as needed; such as... Figure 10 As shown, a spiral metal wire 51 is inserted into a predetermined position in the aforementioned metal tube, and the spiral metal wire 51 is welded to the metal tube by processes such as brazing; then, according to design requirements, a predetermined section of the cut metal tube is flattened, and the flattened section is used as the aforementioned second section 32; then, the tube is bent into the required shape.

[0060] Figure 11 A cross-sectional view of the cooling pipe 3 in another heat dissipation device provided in an embodiment of this application. Figure 12 for Figure 11 A cross-sectional view of the cold pipe 3 from another angle is shown, as follows: Figure 11 and Figure 12 As shown, the turbulence-disrupting structure includes a spiral protrusion 52. Using the spiral protrusion 52 as the turbulence-disrupting structure simplifies the processing of the spiral protrusion 52 on the second pipe section 32. For example, the spiral protrusion 52 can be an internal thread formed on the inner wall of the second pipe section 32. When the spiral protrusion 52 is an internal thread formed on the inner wall of the second pipe section 32, the forming method of the cold pipe 3 can be as follows: Select a metal round pipe with a certain outer diameter and a certain length with internal threads according to design requirements; flatten the internally threaded metal round pipe at a predetermined position to obtain the second pipe section; and then bend the pipe into the desired shape.

[0061] Figure 13 A cross-sectional view of the cold pipe 3 in another heat dissipation device provided in an embodiment of this application. (See attached image.) Figure 13As shown, the turbulence structure includes multiple protrusions 54 disposed on the inner wall of the second pipe section 32, the protrusions 54 rising towards the axial direction of the second pipe section 32. It is easy to understand that the size of the protrusions 54 protruding from the inner wall of the second pipe section 32 is smaller than the inner diameter of the second pipe section 32. The forming method of this cold pipe 3 can be as follows: select a metal round pipe of a certain diameter according to specific needs, and cut a certain length of the metal round pipe as needed; process the protrusions 54 in a predetermined section of the metal round pipe; then, flatten the predetermined section to form the second pipe section 32; and then, bend the pipe into the desired shape. For example, the protrusions 54 can be strip-shaped protrusions extending parallel to the axial direction of the second pipe section 32, or they can be strip-shaped protrusions extending perpendicular to the axial direction of the second pipe section 32. For example, as... Figure 13 As shown, the inner cavity of the second pipe segment 32 is approximately cuboid in shape. The arrangement direction of the first plane a and the second plane b represents the height direction of the second pipe segment 32, the axial direction of the second pipe segment 32 represents its length direction, and the direction perpendicular to both the length and height directions represents its width direction. The protrusion 54 is a strip-shaped protrusion extending along the width direction of the second pipe segment 32. Of course, the shape of the protrusion 54 is not limited to this; for example, the surface of the protrusion 54 can be curved. In this case, the outer wall of the metal circular tube can be stamped towards the axial direction of the metal circular tube in a predetermined pipe segment, causing the wall of the predetermined pipe segment to partially indent inward, forming the protrusion 54.

[0062] Figure 14 This is a schematic diagram of another cold pipe 3 provided in an embodiment of this application. Figure 14 As shown, the turbulence structure includes metal fins 53. Exemplarily, the metal fins 53 can be straight fins, such as... Figure 14 As shown, metal fin 53 can also be a windowed fin, such as... Figure 15 As shown.

[0063] Of course, the turbulence structure can also be a combination of at least two of the following: helical metal wire 51, helical protrusion 52, metal fins 53, and multiple protrusions 54. For example: the turbulence structure includes helical metal wire 51 and helical protrusion 52 arranged along the axial direction of the second pipe section 32; or, the turbulence structure includes helical metal wire 51 and metal fins 53 arranged along the axial direction of the second pipe section 32; or, the turbulence structure includes helical metal wire 51 and multiple protrusions 54, with the pipe sections containing the multiple protrusions 54 and the pipe sections containing the helical metal wire 51 arranged along the axial direction of the second pipe section 32; or, the turbulence structure includes helical metal wire 51, helical protrusion 52, and metal fins 53 arranged along the axial direction of the second pipe section 32, and so on. These will not be listed individually here.

[0064] Figure 16This is a schematic diagram of another heat dissipation device provided in an embodiment of this application. Figure 16 As shown, in some embodiments, the heat dissipation device includes multiple first heating elements 2, each of which is in contact with and thermally connected to a second pipe segment 32. The second pipe segments 32 are connected in series via a second connecting pipe segment 6, allowing refrigerant to flow sequentially through each second pipe segment 32 and carry away the heat from the corresponding first heating element 2. In this solution, when multiple first heating elements 2 differ in height due to tolerances or other factors, the floatability of the cold pipe 3 is used to accommodate the different heights of the first heating elements 2. Compared to the case where a liquid cooling plate uses bosses of different heights to accommodate the first heating elements 2, this solution allows for a closer distance between the refrigerant and the first heating elements 2, resulting in better heat dissipation. Furthermore, this solution is significantly less expensive. For example, the second connecting pipe segment 6 includes at least one bent section 61. The bent section 61 increases the suspension length of the cold pipe 3, enhancing its flexibility and thus improving the floatability of the second pipe segment 32, allowing for better contact between the second pipe segment 32 and the first heating element 2. For example, the second connecting pipe section 6 has a serpentine structure.

[0065] Figure 17 This is a schematic diagram of another heat dissipation device provided in an embodiment of this application. Figure 17 The heat dissipation device shown is Figure 16 The difference in the heat dissipation device shown is that each second pipe segment 32 is connected to two first pipe segments 31, and the second pipe segments 32 are connected in parallel. That is, each first heat-generating device 2 is in contact with and thermally connected to a second pipe segment 32 of a cold pipe 3, and the cold pipes 3 are connected in parallel in the refrigeration circuit. In this scheme, there is no upstream or downstream relationship between the second pipe segments 32, and each second pipe segment 32 can be directly connected to the refrigeration circuit, so each first heat-generating device 2 can obtain more effective heat dissipation.

[0066] Figure 18 This is a schematic diagram of another heat dissipation device provided in an embodiment of this application. Figure 18As shown, in the scheme, the heat dissipation device comprises a plurality of first heat generating devices 2, each first heat generating device 2 is in contact and heat-conducting connection with at least two second pipe sections 32, and each second pipe section 32 is connected in series through a third connecting pipe section 7. In this way, the flow rate of the refrigerant in each second pipe section 32 can be appropriately increased, so that the refrigerant can take away the heat of the corresponding first heat generating device 2 more quickly. Exemplarily, the third connecting pipe section 7 comprises at least one bending section 61. The provision of the bending section 61 can increase the suspension length of the cold pipe 3, enhance the flexibility of the cold pipe 3, and thus improve the floatability of the second pipe section 32, so that the second pipe section 32 can be in better contact with the first heat generating device 2. Exemplarily, the bending section 61 is an arc-shaped section, each first heat generating device 2 is in contact and heat-conducting connection with two second pipe sections 32, and each third connecting pipe section 7 comprises an arc-shaped section.

[0067] Of course, when the heat dissipation device comprises one first heat generating device, the first heat generating device 2 can also be in contact and heat-conducting connection with at least two second pipe sections 32, and each second pipe section 32 is connected in series through a third connecting pipe section 7.

[0068] Figure 19 Another structure schematic diagram of a heat dissipation device provided by the embodiment of the present application is shown in the figure. Figure 19 As shown, the heat dissipation device further comprises a pressure contact piece 8 corresponding to each first heat generating device 2, the pressure contact piece 8 is in abutment with the surface of the cold pipe 3 away from the first heat generating device 2, and the pressure contact piece 8 can float relative to the bearing assembly 1. In the scheme, the pressure contact piece 8 which can float relative to the bearing assembly 1 acts on the surface of the cold pipe 3 away from the first heat generating device 2, which can not only ensure the reliable contact between the cold pipe 3 and the first heat generating device 2, reduce the contact thermal resistance and the thermal resistance of the thermal interface material layer, but also avoid the damage of the hard connection to the first heat generating device 2. Exemplarily, in specific implementation, the cold pipe 3 can be welded to the pressure contact piece 8.

[0069] When the floating connection between the pressure contact piece 8 and the bearing assembly 1 is implemented, there are various implementation manners. For example, the heat dissipation device comprises a floating connection assembly 100, the pressure contact piece 8 is in floating connection with the bearing assembly 1 through at least two groups of floating connection assemblies 100, or the pressure contact piece 8 is in floating connection with the cover plate 113 through at least two groups of floating connection assemblies 100. The specific description is as follows in combination with the drawings.

[0070] Please continue to refer to Figure 19The bearing assembly 1 comprises a shell 11 and a circuit board 12 fixed in the shell 11, and the first heat generating device 2 is fixed to one side of the circuit board 12 away from the bottom plate 111 of the shell. The heat dissipation device comprises two groups of floating connection assemblies 100 connected, and each group of floating connection assemblies 100 is located on one side of the second pipe segment 32. The floating connection assembly 100 comprises an elastic member 102, a screw 101 and a nut 103, the nut 103 is fixed to one side of the circuit board 12 facing the bottom plate 111 of the shell, the compression member 8 is provided with a through hole through which the rod portion of the screw 101 passes, the screw 101 passes through the through hole and is connected with the corresponding nut 103, and the elastic member 102 is sleeved on the rod portion of the screw 101 and located between the nut 103 of the screw 101 and the compression member 8.

[0071] Figure 20 Another structure schematic view of the heat dissipation device provided by the embodiment of the present application. Figure 20 Different from Figure 19 , the heat dissipation device further comprises a cover plate 113 covering the open end of Figure 19 and fixedly connected with Figure 19 . The cover plate 113 is provided with a through hole through which the rod portion of the screw 101 passes, the compression member 8 is provided with a threaded hole for connecting with the screw 101, the screw 101 passes through the through hole on the cover plate 113 and is connected with the corresponding threaded hole on the compression member 8, and the elastic member 102 is sleeved on the rod portion of the screw 101 and located between the cover plate 113 and the compression member 8. Exemplarily, the above-mentioned elastic member 102 can be a spring, a metal spring piece (such as shown in Figure 21 ) or a spring washer.

[0072] Figure 22 Another structure schematic view of the heat dissipation device provided by the embodiment of the present application, Figure 23 A structure schematic view of the compression member and the cold pipe in the heat dissipation device provided by the embodiment of the present application. As shown in Figures 21 to 23As shown, in the specific implementation, the heat dissipation device can also include other heat generating components, for example: the heat dissipation device further includes at least one second heat generating component 9. Each second heat generating component 9 is arranged on the bearing assembly 1, and each second heat generating component 9 protrudes from the same surface of the bearing assembly 1 as the first heat generating component 2. In this case, the pressure connecting piece 8 can be a heat conducting component, and each second heat generating component 9 is in contact and heat conducting connection with the corresponding pressure connecting piece 8. Thus, the heat of the second heat generating component 9 can be conducted to the second pipe section 32 through the pressure connecting piece 8, and then carried away by the refrigerant in the cold pipe 3. It is not difficult to understand that the second heat generating component 9 shares a pressure connecting piece 8 with the first heat generating component 2 adjacent and close to it. Exemplarily, the pressure connecting piece 8 can be a metal plate, when the first heat generating component 2 and the second heat generating component 9 sharing the pressure connecting piece 8 with it exceed the height of the bearing assembly 1, the pressure connecting piece 8 can be bent to adapt to the first heat generating component 2 and the second heat generating component 9; a layer of thermal interface material T can be arranged between the second heat generating component 9 and the pressure connecting piece 8. Exemplarily, each of the opposite sides of one of the first heat generating components 2 is provided with one of the second heat generating components 9, and each of the second heat generating components 9 is lower than the first heat generating component 2, and the pressure connecting piece 8 is bent to form three plane sections, and the three plane sections are respectively connected with one of the heat generating components through the layer of thermal interface material.

[0073] Obviously, various modifications and changes can be made to the present application by those skilled in the art without departing from the spirit and scope of the present application. Therefore, if these modifications and changes belong to the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these modifications and changes.

Claims

1. A heat dissipation device, characterized in that, The device includes a support assembly, a first heating element, and a rigid cooling pipe. The first heating element is fixed to the support assembly and protrudes from the surface of the support assembly. The cooling pipe is located on the side opposite to the first heating element and the support assembly. The cooling pipe includes two first pipe sections and a second pipe section connected between the two first pipe sections, with the ends of the two first pipe sections away from the second pipe section fixed to the load-bearing component; The surface of the second tube segment facing the first heating device is a first plane, and the first plane is in contact with the first heating device and is thermally connected.

2. The heat dissipation device as described in claim 1, characterized in that, Both of the first pipe segments are cantilever structures; one end of the first pipe segment connected to the load-bearing component is the connection end, and the other end of the first pipe segment is the suspension end. The second pipe segment is connected between the suspension ends of the two first pipe segments.

3. The heat dissipation device as described in claim 2, characterized in that, The axes of the two first pipe sections are collinear; the heat dissipation device further includes two first connecting pipe sections, the axes of the two first connecting pipe sections are not collinear with the axes of the first pipe sections, and the second pipe section is connected to the two first pipe sections through the two first connecting pipe sections.

4. The heat dissipation device as described in claim 2, characterized in that, The two first pipe segments are arranged at a second included angle greater than 0°, and the axis of the second pipe segment is collinear with the axis of one of the first pipe segments.

5. The heat dissipation device as described in claim 2, characterized in that, Both first pipe segments include a first part, and the two first pipe segments are respectively connected to the bearing assembly through the corresponding first part; the two first parts are parallel to each other, and the second pipe segment is set at a first angle greater than 0° with the first part.

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that, The surface of the second tube segment opposite to the first heating device is a second plane, and the second plane is parallel to the first plane.

7. The heat dissipation device according to any one of claims 1 to 6, characterized in that, The inner and outer contours of the cross sections of the two first pipe segments perpendicular to their own axes are both circular.

8. The heat dissipation device according to any one of claims 1 to 7, characterized in that, The orthographic projection of the first surface onto the first heating element covers the surface of the first heating element facing the cold pipe.

9. The heat dissipation device according to any one of claims 1 to 8, characterized in that, The cold pipe has a seamless, one-piece molded structure.

10. The heat dissipation device according to any one of claims 1 to 9, characterized in that, The inner wall of the second pipe section is equipped with a flow-disrupting structure.

11. The heat dissipation device as described in claim 10, characterized in that, The cooling pipe is a metal pipe; the turbulence structure includes at least one of the following: a spiral metal wire, a spiral protrusion, multiple metal fins, and multiple protrusions that bulge towards the axis of the second pipe section.

12. The heat dissipation device according to any one of claims 1 to 11, characterized in that, It includes multiple first heating elements, each of which is in contact with and thermally connected to a second pipe segment; each second pipe segment is connected in series through a second connecting pipe segment, or each second pipe segment is connected to two first pipe segments, and each second pipe segment is connected in parallel.

13. The heat dissipation device as described in claim 12, characterized in that, The second connecting pipe section includes at least one curved section.

14. The heat dissipation device according to any one of claims 1 to 11, characterized in that, It includes multiple first heating elements, each of which is in contact with and thermally connected to at least two second pipe segments, and each second pipe segment is connected in series through a third connecting pipe segment.

15. The heat dissipation device as described in claim 14, characterized in that, The third connecting pipe section includes at least one curved section.

16. The heat dissipation device according to any one of claims 1 to 15, characterized in that, It includes a crimping member corresponding to each of the first heating element, the crimping member abutting against the surface of the cold pipe away from the first heating element, and the crimping member being able to float relative to the supporting component.

17. The heat dissipation device as described in claim 16, characterized in that, It includes at least one second heating element, each of the second heating elements is disposed on the support component, and each of the second heating elements and the first heating element protrude from the same surface of the support component; the pressing member is a heat-conducting component and is heat-conductingly connected to the corresponding second pipe segment, and each of the second heating elements is in contact with and heat-conductingly connected to the corresponding pressing member.

18. The heat dissipation device according to any one of claims 1 to 16, characterized in that, The supporting component includes a housing and a circuit board. The housing includes a base plate and multiple side plates fixed to the base plate. The multiple side plates and the base plate together form an accommodating space. The circuit board is fixed in the accommodating space, and the first heating device is fixed to the circuit board. Both first pipe segments are fixed to the side plates.

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