Semiconductor supporting base and preparation method thereof

Abstract

The invention discloses a semiconductor supporting base and a preparation method thereof, and belongs to the technical field of semiconductor production. The semiconductor supporting base comprises a base body, the base body comprises an upper installation base, a lower supporting base and a heat dissipation unit, an installation groove used for storing a circuit board is formed in the upper installation base, and a semiconductor is installed on the circuit board. According to the semiconductor supporting base and the preparation method thereof, the four supporting rods are arranged at the four corners of the lower supporting base, the upper mounting base is supported through the supporting rods, the height of the upper mounting base and the height of a circuit board in the upper mounting base are increased, the heat dissipation unit is added within the increased height, and the heat dissipation unit comprises the multiple heat dissipation plates distributed at intervals, so that the heat dissipation efficiency of the semiconductor supporting base is improved. The heat dissipation plates are inserted into the heat dissipation holes, heat exchange can be carried out through air circulation, the multiple heat dissipation plates transfer heat generated when the circuit board nearby the heat dissipation holes works away, the heat dissipation speed of the circuit board is increased, and the situation that the temperature of the circuit board is too high when the circuit board works for a long time is avoided.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing technology, specifically relating to a semiconductor support base and its preparation method. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. The conductivity of semiconductor materials can be altered by doping; the concentration and polarity of impurities incorporated into a semiconductor significantly affect its conductivity.

[0003] Semiconductor support bases are used to support semiconductors. Existing support bases have relatively compact structures, with limited space inside for heat dissipation, which is not conducive to heat dissipation and can easily lead to heat buildup during semiconductor operation, causing the semiconductor to malfunction. Therefore, this application proposes a semiconductor support base and its fabrication method. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor support base and its preparation method, so as to solve the problem that the existing semiconductor support base is used to support semiconductors. The existing support base has a relatively compact structure and a small space inside the support base for heat dissipation of semiconductors, which is not conducive to heat dissipation of semiconductors and easily leads to heat accumulation during semiconductor operation, which in turn causes the semiconductor to fail to operate normally.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor support base, comprising a base, the base including an upper mounting base, a lower support base, and a heat dissipation unit, wherein the upper mounting base is provided with a mounting slot for storing a circuit board, and the semiconductor is mounted on the circuit board; The upper mounting base is provided with a heat dissipation hole that communicates with the mounting groove, and the heat dissipation hole is aligned with the circuit board inside the mounting groove. The lower support base is provided with a number of support rods, and the upper mounting base is provided with a number of connection holes that are inserted and mated with the support rods. The top and bottom of the support rod are respectively provided with an upper riveting part and a lower riveting part; The heat dissipation unit is located between the upper mounting base and the lower support base. The heat dissipation unit includes several heat dissipation plates, which are inserted into heat dissipation holes.

[0006] Preferably, the mounting groove is provided with multiple mounting posts, the circuit board rests against the mounting posts, and the circuit board and the mounting posts are fixedly connected by bolts.

[0007] Preferably, four mounting posts are provided, and the four mounting posts are respectively located at the four corners of the mounting groove.

[0008] Preferably, four support rods are provided, and the four support rods are respectively located at the four corners of the lower support base.

[0009] Preferably, the heat dissipation unit is detachably connected to the lower support base. The heat dissipation unit includes a heat dissipation base plate, a heat dissipation plate is mounted on the heat dissipation base plate, a plurality of positioning rods are inserted into the heat dissipation base plate, and the upper mounting base is provided with positioning holes that cooperate with the upper positioning rods.

[0010] Preferably, the heat dissipation base plate is provided with an elongated hole, into which the positioning rod is inserted.

[0011] Preferably, the lower support base is provided with a slot, and a guide frame is provided on the side of the slot near the upper mounting base. An insert plate is inserted into the slot. The guide frame is a square frame with a notch on one side. A baffle is provided on the insert plate. When the positioning rod is inserted into the positioning hole in the upper mounting base, the insert plate abuts against the lower end face of the heat dissipation base plate, and the baffle abuts against the heat dissipation base plate. The three sides of the heat dissipation base plate, except for the side that abuts against the baffle, abut against the guide frame.

[0012] Preferably, the insert plate is provided with a connecting part, there are two connecting parts, and the two connecting parts are respectively located on both sides of the insert plate. The slot is slidably engaged with the connecting part. The insert plate is provided with a handle, and the handle is provided with anti-slip texture to increase friction.

[0013] A method for fabricating a semiconductor support base includes the following steps: Step 1: Forming of the upper mounting base, lower support base, and support rod; Using three sets of molds, the upper mounting base, lower support base, and support rod are formed through plastic casting molding process. The upper mounting base, lower support base, and support rod formed by the mold casting process are then polished and trimmed. Holes in the upper mounting base and lower support base are drilled and polished. Step 2: Assemble the upper mounting base and lower support base; insert one end of the support rod into the lower support base and the other end of the support rod into the upper mounting base, and fix the support rod to the upper mounting base and lower support base; Step 3: Install the heat dissipation unit; The lower support base is provided with an inwardly recessed slot. The heat dissipation unit is moved to the bottom of the heat dissipation hole through the slot. The height of the heat dissipation unit is raised, and the heat dissipation unit is inserted into the heat dissipation hole. The positioning rod in the heat dissipation unit is inserted into the positioning hole in the upper mounting base. The insert plate is inserted into the slot. The insert plate moves along the slot to the innermost side to support the heat dissipation unit.

[0014] Preferably, the method for fixing the support rod to the upper mounting base and the lower support base mentioned in step two is to insert the heated rivet head into the top and bottom of the support rod, and form the upper rivet head and the lower rivet head at the top and bottom of the support rod through a hot riveting process.

[0015] Beneficial effects: I. The present invention provides a semiconductor support base and its preparation method. By setting mounting posts on the mounting groove, the mounting posts can increase the strength of the four corners of the mounting groove. After the mounting groove with increased strength is connected to the circuit board, the position is more stable. The mounting posts are used to store the circuit board, which can raise the height of the circuit board and create a gap between the circuit board and the inner wall of the mounting groove for gas to enter and exit, which is beneficial to the heat dissipation of the circuit board.

[0016] II. The present invention provides a semiconductor support base and its preparation method. Four support rods are set at the four corners of the lower support base to support the upper mounting base, thereby raising the height of the upper mounting base and its internal circuit board. A heat dissipation unit is added within the raised height. The heat dissipation unit includes multiple spaced heat dissipation plates. The heat dissipation plates are inserted into the heat dissipation holes. The air circulation enables heat exchange. The multiple heat dissipation plates transfer the heat generated by the circuit board near the heat dissipation holes during operation, thereby accelerating the heat dissipation speed of the circuit board and preventing the circuit board from overheating during long-term operation.

[0017] III. The present invention provides a semiconductor support base and its preparation method. The guide frame and baffle in the lower support base surround the four sides of the heat dissipation unit, which can lock the position of the heat dissipation unit. The bottom of the heat dissipation unit is supported by the insert plate, and the top is restricted by the positioning rod and positioning hole. The position is locked by the upper mounting base and the lower support base. The insert plate and the lower support base can be detachably connected by bolts. In this way, when disassembling the heat dissipation unit, the insert plate can be removed, and the heat dissipation unit can be pulled out from between the upper mounting base and the lower support base. The assembly and disassembly of the heat dissipation unit are relatively convenient. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the semiconductor support base in this invention; Figure 2 This is a rear view of the semiconductor support base in this invention; Figure 3 This is a schematic diagram of the internal structure of the semiconductor support base in this invention; Figure 4 This is one of the exploded views of the semiconductor support base in this invention; Figure 5 This is a second exploded view of the semiconductor support base in this invention; Figure 6 This is the third exploded view of the semiconductor support base in this invention.

[0019] Explanation of reference numerals in the attached figures: 1. Base; 101. Upper mounting base; 1011. Mounting slot; 1012. Mounting post; 1013. Heat dissipation hole; 102. Lower support base; 1021. Support rod; 1022. Slot; 1023. Guide frame; 103. Heat dissipation unit; 1031. Heat dissipation base plate; 1032. Heat dissipation plate; 1033. Positioning rod; 104. Insert plate; 1041. Connecting part; 1042. Baffle; 1043. Handle; 2. Circuit board; 3. Rivet connector. Detailed Implementation

[0020] The specific embodiments of the present invention will be described in detail below, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0021] like Figures 1-6 As shown, an embodiment of the present invention provides a semiconductor support base, including a base 1. The base 1 includes an upper mounting base 101, a lower support base 102, and a heat dissipation unit 103. The upper mounting base 101 is provided with a mounting groove 1011 for storing a circuit board 2, and the semiconductor is mounted on the circuit board 2.

[0022] To avoid direct contact between the circuit board 2 and the base 1 and to increase the contact area between the air and the circuit board 2, multiple mounting posts 1012 are provided in the mounting groove 1011. The circuit board 2 rests against the mounting posts 1012 and the circuit board 2 and the mounting posts 1012 are fixedly connected by bolts. There are four mounting posts 1012, and the four mounting posts 1012 are located at the four corners of the mounting groove 1011.

[0023] By setting mounting posts 1012 on the mounting groove 1011, the mounting posts 1012 can increase the strength of the four corners of the mounting groove 1011. After the mounting groove 1011 is strengthened, the position is more stable after it is connected to the circuit board 2. The mounting posts 1012 are used to store the circuit board 2, which can raise the height of the circuit board 2 and create a gap between the circuit board 2 and the inner wall of the mounting groove 1011 for gas to enter and exit, which is beneficial to the heat dissipation of the circuit board 2.

[0024] Specifically, the upper mounting base 101 is provided with a heat dissipation hole 1013 that communicates with the mounting groove 1011, and the heat dissipation hole 1013 is aligned with the circuit board 2 inside the mounting groove 1011.

[0025] Specifically, the lower support base 102 is provided with a number of support rods 1021, and the upper mounting base 101 is provided with a number of connecting holes that are inserted and matched with the support rods 1021. There are four support rods 1021, and the four support rods 1021 are respectively located at the four corners of the lower support base 102.

[0026] It should be noted that the top and bottom of the support rod 1021 are respectively provided with an upper riveting part and a lower riveting part. The top and bottom of the support rod 1021 are respectively inserted into the upper mounting base 101 and the lower support base 102. The fixing work between the upper mounting base 101 and the lower support base 102 is completed through the riveting process.

[0027] Specifically, the heat dissipation unit 103 is located between the upper mounting base 101 and the lower support base 102. The heat dissipation unit 103 includes several heat dissipation plates 1032, which are inserted into the heat dissipation holes 1013.

[0028] Four support rods 1021 are set at the four corners of the lower support base 102. The support rods 1021 support the upper mounting base 101, raising the height of the upper mounting base 101 and its internal circuit board 2. A heat dissipation unit 103 is added within the raised height. The heat dissipation unit 103 includes multiple spaced heat dissipation plates 1032. The heat dissipation plates 1032 are inserted into the heat dissipation holes 1013. The air circulation can exchange heat. The multiple heat dissipation plates 1032 transfer away the heat generated by the circuit board 2 near the heat dissipation holes 1013 when it is working, accelerating the heat dissipation speed of the circuit board 2 and preventing the circuit board 2 from getting too hot when it works for a long time.

[0029] Specifically, the heat dissipation unit 103 is detachably connected to the lower support base 102. The heat dissipation unit 103 includes a heat dissipation base plate 1031, a heat dissipation plate 1032 is mounted on the heat dissipation base plate 1031, and a number of positioning rods 1033 are inserted into the heat dissipation base plate 1031. The upper mounting base 101 is provided with positioning holes that cooperate with the upper positioning rods 1033. The heat dissipation base plate 1031 is provided with elongated holes, and the positioning rods 1033 are inserted into the elongated holes. This allows the position of the heat dissipation base plate 1031 to be finely adjusted as needed.

[0030] To lock the position of the heat sink base plate 1031, a slot 1022 is provided in the lower support 102. A guide frame 1023 is provided on the side of the slot 1022 near the upper mounting base 101. An insert plate 104 is inserted into the slot 1022. The guide frame 1023 is a square frame with a notch on one side. The insert plate 104 enters the slot 1022 through the notch in the guide frame 1023. A baffle 1042 is provided on the insert plate 104. When the positioning rod 1033 is inserted into the positioning hole in the upper mounting base 101, the insert plate 104 abuts against the lower end face of the heat sink base plate 1031, and the baffle 1042 abuts against the heat sink base plate 1031. The three sides of the heat sink base plate 1031, except for the side abutting against the baffle 1042, abut against the guide frame 1023.

[0031] Specifically, the insert plate 104 is provided with a connecting part 1041. There are two connecting parts 1041, and the two connecting parts 1041 are located on both sides of the insert plate 104 respectively. The slot 1022 is slidably engaged with the connecting part 1041.

[0032] More specifically, the insert plate 104 is provided with a handle 1043, and the handle 1043 is provided with anti-slip texture to increase friction.

[0033] A method for fabricating a semiconductor support base includes the following steps: Step 1: Forming of the upper mounting base 101, lower support base 102, and support rod 1021; using three sets of molds, the upper mounting base 101, lower support base 102, and support rod 1021 are formed through a plastic casting process. The upper mounting base 101, lower support base 102, and support rod 1021 formed by the mold casting process are then polished and trimmed. Holes in the upper mounting base 101 and lower support base 102 are drilled and polished (finishing).

[0034] Step 2: Assemble the upper mounting base 101 and the lower support base 102; insert one end of the support rod 1021 into the lower support base 102 and the other end of the support rod 1021 into the upper mounting base 101, and fix the support rod 1021 to the upper mounting base 101 and the lower support base 102. Specifically, the method for fixing the support rod 1021 to the upper mounting base 101 and the lower support base 102 is as follows: the heated riveting head 3 is inserted into the top and bottom of the support rod 1021, and the upper riveting part and the lower riveting part are formed at the top and bottom of the support rod 1021 through the hot riveting process. The fixing work between the support rod 1021 and the upper mounting base 101 and the lower support base 102 is completed through the upper riveting part and the lower riveting part.

[0035] Step 3: Install the heat dissipation unit 103; insert the heat dissipation unit 103 between the upper mounting base 101 and the lower support base 102.

[0036] To improve the heat dissipation effect of the heat dissipation unit 103, it is necessary to insert the heat dissipation unit 103 into the heat dissipation hole 1013. Therefore, a recessed slot 1022 is provided in the lower support 102. The heat dissipation unit 103 moves to the bottom of the heat dissipation hole 1013 through the slot 1022. The height of the heat dissipation unit 103 is raised, and the heat dissipation unit 103 is inserted into the heat dissipation hole 1013. The positioning rod 1033 in the heat dissipation unit 103 is inserted into the positioning hole in the upper mounting base 101. The insert plate 104 is inserted into the slot 1022. The insert plate 104 moves along the slot 1022 to the innermost side to support the heat dissipation unit 103.

[0037] The guide frame 1023 and baffle 1042 in the lower support 102 surround the four sides of the heat dissipation unit 103, which can lock the position of the heat dissipation unit 103. The bottom of the heat dissipation unit 103 is supported by the insert plate 104, and the top is restricted by the positioning rod 1033 and the positioning hole. The position is locked by the upper mounting base 101 and the lower support 102. The insert plate 104 and the lower support 102 can be detachably connected by bolts. In this way, when disassembling the heat dissipation unit 103, the insert plate 104 can be removed, and the heat dissipation unit 103 can be pulled out from between the upper mounting base 101 and the lower support 102. The assembly and disassembly of the heat dissipation unit 103 is relatively convenient.

[0038] In summary, this invention provides a semiconductor support base and its manufacturing method. By setting mounting posts 1012 on the mounting groove 1011, the mounting posts 1012 can increase the strength of the four corners of the mounting groove 1011. After the mounting groove 1011 is strengthened, the position of the mounting groove 1011 after being connected to the circuit board 2 is more stable. In addition, the mounting posts 1012 are used to store the circuit board 2, which can raise the height of the circuit board 2 and create a gap between the circuit board 2 and the inner wall of the mounting groove 1011 for gas to enter and exit, which is beneficial to the heat dissipation of the circuit board 2.

[0039] Four support rods 1021 are set at the four corners of the lower support base 102. The support rods 1021 support the upper mounting base 101, raising the height of the upper mounting base 101 and its internal circuit board 2. A heat dissipation unit 103 is added within the raised height. The heat dissipation unit 103 includes multiple spaced heat dissipation plates 1032. The heat dissipation plates 1032 are inserted into the heat dissipation holes 1013. The air circulation can exchange heat. The multiple heat dissipation plates 1032 transfer away the heat generated by the circuit board 2 near the heat dissipation holes 1013 when it is working, accelerating the heat dissipation speed of the circuit board 2 and preventing the circuit board 2 from getting too hot when it works for a long time.

[0040] The guide frame 1023 and baffle 1042 in the lower support 102 surround the four sides of the heat dissipation unit 103, which can lock the position of the heat dissipation unit 103. The bottom of the heat dissipation unit 103 is supported by the insert plate 104, and the top is restricted by the positioning rod 1033 and the positioning hole. The position is locked by the upper mounting base 101 and the lower support 102. The insert plate 104 and the lower support 102 can be detachably connected by bolts. In this way, when disassembling the heat dissipation unit 103, the insert plate 104 can be removed, and the heat dissipation unit 103 can be pulled out from between the upper mounting base 101 and the lower support 102. The assembly and disassembly of the heat dissipation unit 103 is relatively convenient.

[0041] The above-disclosed embodiments are merely a few specific examples of the present invention. However, the embodiments of the present invention are not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A semiconductor support base, comprising a base (1), characterized in that, The base (1) includes an upper mounting base (101), a lower support base (102), and a heat dissipation unit (103). The upper mounting base (101) is provided with a mounting slot (1011) for storing the circuit board (2), and the semiconductor is mounted on the circuit board (2). The upper mounting base (101) is provided with a heat dissipation hole (1013) communicating with the mounting groove (1011), and the heat dissipation hole (1013) is aligned with the circuit board (2) in the mounting groove (1011). The lower support base (102) is provided with a plurality of support rods (1021), and the upper mounting base (101) is provided with a plurality of connecting holes that are inserted and engaged with the support rods (1021); The support rod (1021) is provided with an upper riveting part and a lower riveting part at its top and bottom, respectively; The heat dissipation unit (103) is located between the upper mounting base (101) and the lower support base (102). The heat dissipation unit (103) includes a plurality of heat dissipation plates (1032), which are inserted into the heat dissipation holes (1013).

2. A semiconductor support base as described in claim 1, characterized in that, Multiple mounting posts (1012) are provided at the mounting groove (1011). The circuit board (2) rests against the mounting posts (1012). The circuit board (2) and the mounting posts (1012) are fixedly connected by bolts.

3. A semiconductor support base as described in claim 2, characterized in that, There are four mounting posts (1012), and the four mounting posts (1012) are located at the four corners of the mounting groove (1011).

4. A semiconductor support base as described in claim 1, characterized in that, There are four support rods (1021), and the four support rods (1021) are located at the four corners of the lower support base (102).

5. A semiconductor support base as described in claim 1, characterized in that, The heat dissipation unit (103) is detachably connected to the lower support base (102). The heat dissipation unit (103) includes a heat dissipation base plate (1031), a heat dissipation plate (1032) is installed on the heat dissipation base plate (1031), a plurality of positioning rods (1033) are inserted in the heat dissipation base plate (1031), and a positioning hole that cooperates with the upper positioning rod (1033) is provided in the upper mounting base (101).

6. A semiconductor support base as described in claim 5, characterized in that, The heat dissipation base plate (1031) has an elongated hole, and the positioning rod (1033) is inserted into the elongated hole.

7. A semiconductor support base as described in claim 6, characterized in that, The lower support base (102) is provided with a slot (1022). A guide frame (1023) is provided on the side of the slot (1022) near the upper mounting base (101). A plug plate (104) is inserted into the slot (1022). The guide frame (1023) is a square frame with a notch on one side. A baffle (1042) is provided on the plug plate (104). When the positioning rod (1033) is inserted into the positioning hole in the upper mounting base (101), the plug plate (104) abuts against the lower end face of the heat dissipation base plate (1031), and the baffle (1042) abuts against the heat dissipation base plate (1031). The heat dissipation base plate (1031) abuts against the guide frame (1023) on three sides except the side that abuts against the baffle (1042).

8. A semiconductor support base as described in claim 7, characterized in that, The insert plate (104) is provided with a connecting part (1041), and there are two connecting parts (1041), which are located on both sides of the insert plate (104). The slot (1022) is slidably engaged with the connecting part (1041). The insert plate (104) is provided with a handle (1043), and the handle (1043) is provided with anti-slip texture to increase friction.

9. A method for fabricating a semiconductor support base, characterized in that, The semiconductor support base as described in any one of claims 1-8 is prepared by comprising the following steps: Step 1: Forming of the upper mounting base (101), lower support base (102), and support rod (1021); Using three sets of molds, the upper mounting base (101), lower support base (102), and support rod (1021) are formed by plastic casting process. The upper mounting base (101), lower support base (102), and support rod (1021) formed by mold casting are polished and trimmed. The holes in the upper mounting base (101) and lower support base (102) are drilled and polished. Step 2: Assemble the upper mounting base (101) and the lower support base (102); insert one end of the support rod (1021) into the lower support base (102), insert the other end of the support rod (1021) into the upper mounting base (101), and fix the support rod (1021) to the upper mounting base (101) and the lower support base (102); Step 3: Install the heat dissipation unit (103); The lower support base (102) is provided with an inwardly recessed slot (1022). The heat dissipation unit (103) is moved to the lower part of the heat dissipation hole (1013) through the slot (1022). The height of the heat dissipation unit (103) is raised, and the heat dissipation unit (103) is inserted into the heat dissipation hole (1013). The positioning rod (1033) in the heat dissipation unit (103) is inserted into the positioning hole in the upper mounting base (101). The insert plate (104) is inserted into the slot (1022). The insert plate (104) moves along the slot (1022) to the innermost side to support the heat dissipation unit (103).

10. The method for fabricating a semiconductor support base as described in claim 9, characterized in that, The method for fixing the support rod (1021) to the upper mounting base (101) and the lower support base (102) mentioned in step two is to insert the heated rivet head (3) into the top and bottom of the support rod (1021) and form the upper rivet part and the lower rivet part at the top and bottom of the support rod (1021) through the hot riveting process.

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