Automatic threading mechanism of semiconductor packaging wire welding machine

Abstract

The invention relates to the technical field of semiconductor packaging equipment, and discloses an automatic threading mechanism of a semiconductor packaging wire bonder, which comprises an operation table, a coiling assembly driven by a motor is arranged on one side of the top of the operation table, a wire bonding head is movably arranged on one side of the operation table, and one side of the wire bonding head is fixedly connected with a chopper through a connecting seat. The top of the chopper fixedly penetrates through the middle of the connecting seat, the top of the connecting seat is fixedly connected with a connecting cylinder, and the top of the connecting cylinder is provided with a wire clamping assembly. By arranging the wire clamping assembly, the cleaning mechanism and the wire inlet cylinder, surface cleaning is completed while a gold wire automatically and straightly penetrates into the chopper, and the wire welding precision, reliability and packaging efficiency are effectively improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging equipment technology, specifically to an automatic wire threading mechanism for a semiconductor packaging wire bonding machine. Background Technology

[0002] Patent application CN107160050A includes a loading mechanism, a worktable, and an unloading mechanism arranged sequentially along the transverse side of a frame. Microscopes and wire bonding heads for bonding are respectively located on the longitudinal sides of the worktable, with the microscopes positioned outside the worktable. The bonding head has a temperature controller for controlling the worktable temperature and also includes a wire feeder located on the bonding head for feeding the bonding wire. The advantages are: simplified labor intensity and convenient wire bonding processing.

[0003] Wire bonding machines (also known as lead bonding machines) are key equipment in the back-end processes of semiconductor packaging, mainly used to realize the electrical connection between the chip and external pins. Its core function is to establish an electrical interconnection path between the chip pads and the corresponding solder joints of the lead frame (or substrate) using fine gold or copper wires, thus completing the signal transmission. Existing wire bonding machines use a wire feeding system that coordinates spool feeding, tension control, guide wheel group and clamping mechanism to achieve micron-level wire feeding through intermittent "one clamp, one feed" precise stepping.

[0004] In most of the prior art, including the aforementioned patents, some threading mechanisms require manual precision alignment and repeated adjustments, or have complex structures and are inconvenient to maintain, making it difficult to achieve fast and stable threading operations in a high-efficiency production environment. In particular, when threading through a micron-sized cleaver, the gold wire is prone to deviation and bending, leading to threading failure or inaccurate solder joint positioning, affecting packaging accuracy and reliability. Gold wires are easily exposed to air and absorb dust, grease, and other contaminants during transportation. Existing equipment usually lacks a synchronous cleaning mechanism, and contaminants enter the cleaver or solder joint area with the gold wire, easily causing poor soldering, desoldering, or decreased bonding strength, reducing packaging yield. Summary of the Invention

[0005] The problems that this invention aims to solve are: difficulty in ensuring threading accuracy and straightness, insufficient cleanliness, and low threading efficiency.

[0006] To solve the above technical problems, the technical solution of the present invention is: an automatic wire threading mechanism for a semiconductor packaging wire bonding machine, including an operating table, a motor-driven wire winding assembly installed on one side of the top of the operating table, a wire bonding head movably disposed on one side of the operating table, a chopping blade fixedly connected to one side of the wire bonding head via a connecting seat, the top of the chopping blade fixedly penetrating the middle of the connecting seat, a connecting cylinder fixedly connected to the top of the connecting seat, and a wire clamping assembly disposed on the top of the connecting cylinder; The wire clamping assembly includes an annular seat, with connecting blocks fixedly connected to both ends of the annular seat and slidably connected to two vertical grooves on the inner wall of the connecting cylinder. Multiple insert blocks are inserted into the middle of the annular seat along the center direction, and springs are sleeved on the outside of the multiple insert blocks. The top two sides of the connector are provided with miniature cylinders, and the top of the miniature cylinders is provided with a cleaning mechanism. The cleaning mechanism includes a support ring. The bottom of the support ring is fixedly connected to the telescopic ends of the two miniature cylinders. Rotatable cleaning rod assemblies are installed in the four slots at the top of the support ring. The top of the chopping knife is fixedly connected to a support cylinder with an external heating plate, and an inlet cylinder is slidably connected inside the support cylinder.

[0007] Preferably, the cleaning stick assembly includes a U-shaped rod, a rotating shaft, and a cleaning ball. The U-shaped rod is rotatably connected to a slot of a supporting ring via the rotating shaft. One end of the U-shaped rod is provided with a circular baffle, and the other end of the U-shaped rod is fixedly connected to the cleaning ball.

[0008] Preferably, the connecting block is inserted into the supporting ring, and an elastic rope is arranged in a ring shape in the cavity at the top of the slot of the supporting ring. The elastic rope is divided into two sections, and the two ends of each section are fixedly connected to the side wall of the cavity.

[0009] Preferably, the inner end of the insert is arc-shaped and the surface is covered with a wear-resistant and friction-reducing coating.

[0010] Preferably, the upper and lower edges of the inserts are inclined towards the center line of the inserts along the vertical direction, so that the inner ends of multiple inserts together form a guide opening that is wider at the top, narrower in the middle, and wider at the bottom.

[0011] Preferably, the top of the inlet tube is provided with a gyroscope-shaped locking structure that protrudes in the middle and retracts at both ends, and the inclined surfaces of the upper and lower parts of the locking structure are adapted to the bottom and top surfaces of the insert block, respectively.

[0012] Preferably, the inner diameter of the feed tube is equal to the diameter of the cleaver's hole and remains consistent in the vertical direction.

[0013] Preferably, the heating plate has an embedded heating wire and a temperature sensor, and its inner wall is tightly fitted to the outer wall of the support cylinder.

[0014] Preferably, a support shaft is fixedly connected to one side of the operating table, and a protective shell is provided on the outside of the winding assembly and the support shaft, with one end of the protective shell fixedly connected to the side wall of the operating table.

[0015] Preferably, the inner wall of the connecting cylinder is provided with a position sensor, and the operating platform is provided with a control module, which is electrically connected to the motor, the miniature cylinder, the heating plate and the position sensor.

[0016] Compared with the prior art, the technical solution of the present invention has the following advantages: (1) By setting up a wire clamping assembly, a cleaning mechanism, and a wire inlet tube, the surface is cleaned while the gold wire is automatically and straightly inserted into the cleaver, which effectively improves the wire bonding accuracy, reliability, and packaging efficiency. The manually removable wire clamping assembly allows operators to easily insert the front end of the gold wire into the insert block. Under the action of the spring, the insert block automatically clamps the gold wire and achieves initial centering and straightening. During the wire threading process, the wire clamping assembly descends under the drive of a micro cylinder, and the locking structure at the top of the wire inlet tube radially expands the insert block, allowing the gold wire to fall accurately into the wire inlet tube. The inner diameter of the wire inlet tube is consistent with and vertically aligned with the diameter of the cleaver hole. With the help of the heating plate, the gold wire is subjected to thermal stress relief and auxiliary straightening, so that the gold wire remains straight throughout the threading process, which significantly improves the threading accuracy and wire bonding quality. (2) During the descent of the wire clamping assembly, the elastic rope pulls the U-shaped rod to bring the cleaning ball together towards the center and clean the surface of the gold wire. This effectively removes dust, oil and other impurities from the gold wire surface. The cleaning action is carried out simultaneously with the wire threading process, without the need for additional cleaning steps. This ensures the cleanliness of the wire bonding environment and avoids problems such as poor soldering and desoldering caused by gold wire contamination, thereby improving the reliability of the packaging and the yield rate. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall front structure of the present invention; Figure 3 This is a schematic diagram of the structure of the chopping blade and connecting cylinder of the present invention; Figure 4 This is a schematic diagram of the structure of the miniature cylinder of the present invention; Figure 5 For the present invention Figure 4 Enlarged structural diagram at point A; Figure 6 This is a schematic diagram of the structure of the support cylinder and the inlet cylinder of the present invention; Figure 7 This is a schematic diagram of the structure of the top of the annular seat of the present invention; Figure 8 This is a schematic diagram of the cleaning rod assembly of the present invention; Figure 9 This is a schematic diagram of the telescopic end of the miniature cylinder of the present invention; Figure 10 This is an exploded view of the wire clamping assembly of the present invention; Figure 11 This is a schematic diagram of the structure of the insert block of the present invention; Figure 12 This is a schematic diagram of the structure of the cleaning ball of the present invention.

[0018] In the diagram: 1. Operating table; 101. Welding wire end; 2. Wire winding assembly; 201. Support shaft; 202. Protective shell; 3. Cleaver; 301. Connecting seat; 302. Connecting cylinder; 303. Support cylinder; 304. Wire inlet cylinder; 4. Heating plate; 5. Miniature cylinder; 501. Support ring; 502. U-shaped rod; 503. Rotating shaft; 504. Elastic rope; 505. Cleaning ball; 6. Ring seat; 601. Connecting block; 602. Insertion block; 603. Spring. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0020] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "comprising" or "including," and similar terms used in this disclosure, mean that an element or object preceding the term encompasses the elements or objects listed following the term and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but may also include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0021] like Figures 1 to 12 As shown, the present invention provides an automatic wire threading mechanism for a semiconductor packaging wire bonding machine, including an operating table 1. A motor-driven wire winding assembly 2 is installed on one side of the top of the operating table 1 for storing and releasing the gold wire to be threaded. The motor can drive the rotating shaft for winding the gold wire to rotate, thereby steadily releasing the gold wire. A wire bonding head 101 is movably arranged on one side of the operating table 1. A chopping blade 3 is fixedly connected to one side of the wire bonding head 101 through a connecting seat 301. The top of the chopping blade 3 is fixedly inserted through the middle of the connecting seat 301. A connecting cylinder 302 is fixedly connected to the top of the connecting seat 301. A wire clamping assembly is provided on the top of the connecting cylinder 302. The clamping assembly is used to clamp and guide the gold wire. The wire clamping assembly includes an annular seat 6. Connecting blocks 601 are fixedly connected to both ends of the annular seat 6 and slidably connected to two vertical grooves on the inner wall of the connecting cylinder 302, so that the entire wire clamping assembly can be raised and lowered along the axial direction of the connecting cylinder 302. Multiple inserts 602 are inserted into the middle of the annular seat 6 along the center direction. Springs 603 are sleeved on the outside of the multiple inserts 602. Under the pre-tightening force of the springs 603, the inner ends of all inserts 602 (i.e. the end facing the center) are pulled inward to form a clamping channel with a variable aperture, which is used to adaptively clamp the gold wire to be inserted. Miniature cylinders 5 are provided on both sides of the top of the connecting seat 301. A cleaning mechanism is provided on the top of the miniature cylinders 5. The cleaning mechanism includes a support ring 501. The bottom of the support ring 501 is fixedly connected to the telescopic ends of the two miniature cylinders 5. A rotatable cleaning rod assembly is installed in the four slots on the top of the support ring 501. The top of the splitting blade 3 is fixedly connected to a support cylinder 303 with an external heating plate 4, which is used to locally heat the gold wire passing through it to eliminate stress and assist in straightening. The support cylinder 303 is slidably connected to an inlet cylinder 304, which serves as the final guide channel for the gold wire before it enters the splitting blade 3.

[0022] In one embodiment of the present invention, the cleaning stick assembly includes a U-shaped rod 502, a rotating shaft 503, and a cleaning ball 505. The cleaning ball 505 is made of a porous elastic material (such as porous sponge or polymer elastomer), and its outer surface is soft and has adsorption properties, used to adhere to and wipe the surface of the gold wire. The U-shaped rod 502 is rotatably connected to the slot of the supporting ring 501 through the rotating shaft 503, so that the U-shaped rod 502 can swing around the rotating shaft 503 within a certain angle. One end of the U-shaped rod 502 is provided with a circular baffle, and the other end of the U-shaped rod 502 is fixedly connected to the cleaning ball 505. The connecting block 601 is inserted into the supporting ring 501. An elastic rope 504 is arranged in a ring shape in the cavity at the top of the slot of the supporting ring 501. The elastic rope 504 is divided into two sections, and the two ends of each section of the elastic rope 504 are... Each component is fixedly connected to the side wall of the cavity. When the miniature cylinder 5 drives the support ring 501 to descend, it will drive the entire wire clamping assembly to descend synchronously through the connecting block 601. At the same time, the elastic rope 504 applies a radial inward pulling force to the circular baffle at one end of the U-shaped rod 502, causing the four cleaning balls 505 to tend to converge towards the center in their natural state. As the elastic rope 504 extends, when the gold wire passes through the center, the cleaning balls 505 gently adhere to the surface of the gold wire under the action of the elastic rope 504. Conversely, when the support ring 501 rises, the wire clamping assembly rises accordingly, the elastic rope 504 retracts, and the support ring 501 pushes one end of the U-shaped rod 502 upward, causing the four cleaning balls 505 to spread outward, making it easier to clean the dust on the four cleaning balls 505 and also easier to put into the wire clamping assembly.

[0023] In one embodiment of the present invention, the inner end of the insert 602 is arc-shaped and the surface is covered with a wear-resistant and friction-reducing coating to reduce wear on the surface of the gold wire.

[0024] In one embodiment of the present invention, the upper and lower edges of the insert 602 are inclined towards the center line of the insert 602 along the vertical direction, so that the inner ends of multiple inserts 602 together form a guide opening that is wide at the top, narrow in the middle, and wide at the bottom. The top of the wire inlet tube 304 is provided with a gyro-shaped locking structure that protrudes in the middle and is recessed at both ends. The inclined surfaces of the upper and lower parts of the locking structure are adapted to the bottom and top surfaces of the insert 602, respectively. The wide upper opening facilitates the introduction of gold wire, the narrow middle diameter area achieves stable clamping and initial straightening, and the wide lower opening facilitates the output. The wire clamping assembly descends. The bottom surface of the insert 602 slides along the upper slope of the locking structure and is gradually expanded radially. When the platform passes through the narrowest point, the gold wire is completely released and falls into the inlet cylinder 304. When the clamping assembly rises, the top surface of the insert 602 slides along the lower slope of the locking structure and remains expanded to ensure that the gold wire passes freely. After the clamping assembly reaches the highest point, the locking structure at the top of the inlet cylinder 304 expands the insert 602 and falls freely into the support cylinder 303. The insert 602 retracts under the action of the spring 603 to further clamp the gold wire, which is convenient for the next step of moving the gold wire downward.

[0025] In one embodiment of the present invention, the inner diameter of the inlet tube 304 is equal to the aperture of the cleaver 3 and remains consistent in the vertical direction to ensure the straightness of the gold wire passing through.

[0026] As one embodiment of the present invention, the heating plate 4 is embedded with an electric heating wire and a temperature sensor. Its inner wall is closely attached to the outer wall of the support cylinder 303 to form a highly efficient heat conduction structure, which can heat the gold wire flowing through the support cylinder 303 to a set temperature (usually 150-250°C) in a short time, thereby realizing online stress relief and thermally assisted straightening of the gold wire.

[0027] In one embodiment of the present invention, a support shaft 201 is fixedly connected to one side of the operating table 1. The gold wire is manually pulled out and wound half a turn around the support shaft 201 before being clamped in the wire clamping assembly. The gold wire, having been wound and stored on the spool for a long time, has residual bending stress inside. Wrapping it half a turn around the support shaft 201 is equivalent to applying a gentle reverse bend. This process effectively releases some of the winding stress, making the gold wire straighter before entering the precision threading process. A protective shell 202 is provided on the outside of the winding assembly 2 and the support shaft 201. One end of the protective shell 202 is fixedly connected to the side wall of the operating table 1 for dust prevention and safety protection.

[0028] As one embodiment of the present invention, the inner wall of the connecting cylinder 302 is provided with a position sensor. The position sensor monitors the position of the wire clamping assembly in real time to ensure that key actions such as descent cleaning, trigger release, and upward reset are accurately performed. The operating table 1 is provided with a control module, which is electrically connected to the motor, micro cylinder 5, heating plate 4 and position sensor. Based on the position feedback, the control module automatically coordinates the sequence and duration of actions such as cylinder lifting, heating start and stop, and wire feeding to form a complete wire threading process.

[0029] The working principle and usage process of this invention are as follows: After starting the equipment, the control module controls the motor of the winding assembly 2 to slowly release the gold wire. The operator pulls out an appropriate length of gold wire from the winding assembly 2, wraps it around the support shaft 201 half a turn for preliminary straightening and stress relief, and then removes the clamping assembly upwards, inserting the front end of the gold wire into the central area of ​​multiple inserts 602. When the gold wire is inserted, it pushes the multiple inserts 602 to move slightly outwards. Under the action of the spring 603, the inserts 602 clamp the front end of the gold wire inwards, achieving preliminary clamping and centering straightening. Subsequently, the clamping assembly with the gold wire clamped is inserted into the top of the support ring 501 and positioned. At the same time, the bottom limiting holes of the two connecting blocks 601 are inserted and fixed to the cylindrical inserts at the telescopic ends of the two micro cylinders 5. The position sensor detects that the wire clamping assembly is at the top and transmits a signal to the controller. The controller then activates the micro cylinder 5, which drives the support ring 501 to lower the entire wire clamping assembly. During the descent, the elastic rope 504 pulls the U-shaped rod 502, causing the four cleaning balls 505 to converge inward and adhere to the surface of the gold wire, thus achieving a cleaning effect. At the same time, it applies a slight constraint and initial straightening to the gold wire. The wire clamping assembly continues to descend to the top of the wire inlet cylinder 304. The bottom surface of the insert block 602 contacts the upper inclined surface of the locking structure at the top of the wire inlet cylinder 304, causing the insert block 602 to be gradually radially opened, releasing the gold wire. Under the action of gravity, the gold wire falls into the central hole of the wire inlet cylinder 304 until the locking structure moves to the top of the insert block 602, at which point the gold wire is completely released from the clamping of the insert block 602; When the position sensor detects that the wire clamping assembly is at the bottom, the controller activates the micro cylinder 5 to extend further, pushing the wire clamping assembly and the wire inlet cylinder 304 upwards. When the wire inlet cylinder 304 reaches its top position, the wire clamping assembly continues to move upwards. The lower inclined surface of the locking structure at the top of the wire inlet cylinder 304 continues to open the insert block 602 and slides down along the inner side of the insert block 602, eventually falling into the support cylinder 303. At the same time, the insert block 602 retracts inwards again under the action of the spring 603, clamping the gold wire. During this process, the heating plate 4 is activated to heat the support cylinder 303 and the wire inlet cylinder 304, so that the gold wire passing through them is relieved of stress by heat. After being heated inside the support cylinder 303, the wire inlet cylinder 304, along with the wire clamping assembly, plays a secondary straightening role on the gold wire during its up-and-down movement. Once the position sensor detects the wire clamping assembly at the top again, it activates the miniature cylinder 5 to retract, causing the wire clamping assembly and the clamped gold wire to move a predetermined distance, allowing the gold wire tip to enter the interior of the splitter 3, meeting the requirements of the wire bonding process. During each descent, the cleaning ball 505 gathers and cleans the gold wire; during ascent, the cleaning ball 505 moves outward, facilitating dust removal without interfering with wire threading.

[0030] The above process is repeated to enable the gold wire to be quickly and straightly inserted into the splitter 3, and cleaning and straightening are completed simultaneously during the wire insertion process, thereby improving the accuracy and efficiency of semiconductor packaging wire bonding.

[0031] The above embodiments are merely exemplary embodiments of the present invention and are not intended to limit the present invention. The scope of protection of the present invention is defined by the claims. Those skilled in the art can make various modifications or equivalent substitutions to the present invention within its spirit and scope of protection, and such modifications or equivalent substitutions should also be considered to fall within the scope of protection of the present invention.

Claims

1. An automatic wire threading mechanism for a semiconductor packaging wire bonding machine, comprising an operating table (1), characterized in that: A motor-driven winding assembly (2) is installed on one side of the top of the operating table (1). A wire welding head (101) is movably provided on one side of the operating table (1). A splitting blade (3) is fixedly connected to one side of the wire welding head (101) through a connecting seat (301). The top of the splitting blade (3) is fixedly inserted through the middle of the connecting seat (301). A connecting cylinder (302) is fixedly connected to the top of the connecting seat (301). A wire clamping assembly is provided on the top of the connecting cylinder (302). The clamping assembly includes an annular seat (6), and the two ends of the annular seat (6) are respectively fixedly connected to two vertical sliding grooves that are slidably connected to the inner wall of the connecting cylinder (302). Multiple inserts (602) are inserted into the middle of the annular seat (6) along the center direction, and springs (603) are sleeved on the outside of the multiple inserts (602). The top two sides of the connecting seat (301) are provided with miniature cylinders (5), and the top of the miniature cylinders (5) is provided with a cleaning mechanism. The cleaning mechanism includes a support ring (501). The bottom of the support ring (501) is fixedly connected to the telescopic ends of the two miniature cylinders (5). Rotatable cleaning rod assemblies are installed in the four slots at the top of the support ring (501). The top of the chopping knife (3) is fixedly connected to a support cylinder (303) with an externally sleeved heating plate (4), and the inside of the support cylinder (303) is slidably connected to an inlet cylinder (304).

2. The automatic wire threading mechanism for a semiconductor packaging wire bonding machine according to claim 1, characterized in that: The cleaning stick assembly includes a U-shaped rod (502), a rotating shaft (503), and a cleaning ball (505). The U-shaped rod (502) is rotatably connected to the slot of the supporting ring (501) through the rotating shaft (503). One end of the U-shaped rod (502) is provided with a circular baffle, and the other end of the U-shaped rod (502) is fixedly connected to the cleaning ball (505).

3. The automatic wire threading mechanism for a semiconductor packaging wire bonding machine according to claim 1, characterized in that: The connecting block (601) is inserted into the support ring (501). An elastic rope (504) is arranged in a ring shape in the cavity at the top of the slot of the support ring (501). The elastic rope (504) is divided into two sections, and the two ends of each elastic rope (504) are fixedly connected to the side wall of the cavity.

4. The automatic wire threading mechanism for a semiconductor packaging wire bonding machine according to claim 1, characterized in that: The inner end of the insert (602) is arc-shaped and the surface is covered with a wear-resistant and friction-reducing coating.

5. The automatic wire threading mechanism for a semiconductor packaging wire bonding machine according to claim 1, characterized in that: The upper and lower edges of the insert (602) in the vertical direction are inclined towards the center line of the insert (602), so that the inner ends of multiple inserts (602) together form a guide opening that is wide at the top, narrow in the middle and wide at the bottom.

6. The automatic wire threading mechanism for a semiconductor packaging wire bonding machine according to claim 1, characterized in that: The top of the inlet tube (304) is provided with a gyroscope-shaped locking structure that protrudes in the middle and retracts at both ends. The inclined surfaces of the upper and lower parts of the locking structure are respectively adapted to the bottom and top surfaces of the insert block (602).

7. The automatic wire threading mechanism for a semiconductor packaging wire bonding machine according to claim 1, characterized in that: The inner diameter of the inlet cylinder (304) is equal to the aperture of the cleaver (3) and they are consistent in the vertical direction.

8. The automatic wire threading mechanism for a semiconductor packaging wire bonding machine according to claim 1, characterized in that: The heating plate (4) is embedded with heating wires and temperature sensors, and its inner wall is tightly fitted with the outer wall of the support cylinder (303).

9. The automatic wire threading mechanism for a semiconductor packaging wire bonding machine according to claim 1, characterized in that: A support shaft (201) is fixedly connected to one side of the operating table (1). A protective shell (202) is provided on the outside of the winding assembly (2) and the support shaft (201). One end of the protective shell (202) is fixedly connected to the side wall of the operating table (1).

10. The automatic wire threading mechanism for a semiconductor packaging wire bonding machine according to claim 1, characterized in that: The inner wall of the connecting cylinder (302) is provided with a position sensor, and the operating table (1) is provided with a control module. The control module is electrically connected to the motor, the micro cylinder (5), the heating plate (4) and the position sensor.

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