Printed circuit board and printed circuit board assembly sheet

Abstract

Electrical components are mounted on the wiring circuit board. The wired circuit board has a support body. The support body has an upper surface and a lower surface. A first through-hole extending in the thickness direction is formed in the support body. In addition, the wired circuit board has an insulating layer that covers the outer surface of the support body. A portion of the insulating layer covering the inner peripheral surface of the first through hole forms a second through hole extending in the thickness direction inside the first through hole. The second through-hole is formed so as to be able to accommodate at least a portion of the electrical component. A first conductor layer and a second conductor layer are formed in a predetermined pattern so as to extend from the inner circumferential surface of the second through hole to the upper surface and the lower surface of the insulating layer.

Description

TECHNICAL FIELD

[0001] The present application relates to a wiring circuit substrate capable of mounting an electrical component and a wiring circuit substrate assembly sheet including a plurality of wiring circuit substrates. BACKGROUND

[0002] For example, a wiring circuit substrate is used for transmitting / receiving an electric signal or supplying electric power between a plurality of electronic components. The wiring circuit substrate has two surfaces facing in opposite directions. In the wiring circuit substrate, an electrical component is mounted on at least one of the two surfaces, for example.

[0003] In the printed wiring board (wiring circuit substrate) described in Patent Document 1, wiring patterns (wiring of a given pattern) are formed on both surfaces of a plate-shaped insulating substrate. The wiring patterns formed on one of the two surfaces include a plurality of pads. A plurality of terminals of an electrolytic capacitor (electrical component) are soldered to the plurality of pads. Thus, the electrolytic capacitor is mounted on the printed wiring board.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2013-45919 SUMMARY

[0005] PROBLEMS TO BE SOLVED BY THE INVENTION

[0006] As described above, an electrical component is mounted on a wiring circuit substrate. Therefore, the wiring circuit substrate and the electrical component mounted on the wiring circuit substrate are integrally handled as an electrical component mounting substrate. The electrical component mounting substrate is used for various products such as mobile terminals or in-vehicle devices. Therefore, the electrical component mounting substrate is required to be thinned in accordance with the miniaturization of the products to be used. In addition, even if the electrical component mounting substrate is thinned, if the mechanical strength of the electrical component mounting substrate is reduced with the thinning, the reliability of the electrical component mounting substrate is reduced.

[0007] An object of the present application is to provide a wiring circuit substrate and a wiring circuit substrate assembly sheet including a plurality of wiring circuit substrates, which can achieve thinning of a structure including an electrical component at the time of mounting the electrical component and can achieve high reliability in terms of mechanical strength.

[0008] TECHNICAL SOLUTION FOR SOLVING THE PROBLEMS

[0009] The wiring circuit substrate according to one aspect of the present application is a wiring circuit substrate on which an electrical component is mounted, and includes: a support layer having a first surface and a second surface facing in opposite directions, and having a first through-hole extending in a thickness direction intersecting the first surface and the second surface; an insulating layer covering at least a portion of the first surface, at least a portion of the second surface, and an inner peripheral surface of the first through-hole; and a conductor layer formed in a predetermined pattern on the insulating layer, the support layer having higher rigidity than the insulating layer and the conductor layer, a portion of the insulating layer covering the inner peripheral surface of the first through-hole forming a second through-hole extending in the thickness direction inside the first through-hole, the second through-hole being formed so as to be able to house at least a portion of the electrical component inside the second through-hole, the inner peripheral surface of the second through-hole including a conductor layer formation region in which the conductor layer is formed, and a conductor layer non-formation region in which the conductor layer is not formed.

[0010] The wiring circuit substrate according to another aspect of the present application is a wiring circuit substrate on which an electrical component is mounted, and includes: a support layer formed of an insulating material, having a first surface and a second surface facing in opposite directions, and having a through-hole extending from the first surface toward the second surface; and a conductor layer formed in a predetermined pattern on the support layer, the support layer having higher rigidity than the conductor layer, the through-hole being formed so as to be able to house at least a portion of the electrical component inside the through-hole, an inner peripheral surface of the through-hole including a conductor layer formation region in which the conductor layer is formed, and a conductor layer non-formation region in which the conductor layer is not formed.

[0011] The wiring circuit substrate assembly sheet according to still another aspect of the present application includes a plurality of the above-described wiring circuit substrates, and has a structure in which the plurality of wiring circuit substrates are integrally provided.

[0012] Effects of the Invention

[0013] According to the present application, thinning of a structure including an electrical component and high reliability in terms of mechanical strength can be achieved at the time of mounting of the electrical component. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a plan view of a wiring circuit substrate according to an embodiment of the present application.

[0015] Figure 2 is Figure 1 is a bottom view of the wiring circuit substrate of

[0016] Figure 3 is Figure 1A-A line sectional view of the wiring circuit substrate.

[0017] Figure 4 is Figure 1 B-B line sectional view of the wiring circuit substrate.

[0018] Figure 5 is a diagram for explaining a mounting method of the mounting object to Figure 1 the wiring circuit substrate.

[0019] Figure 6 is Figure 5 top view of the mounting substrate.

[0020] Figure 7 is a schematic side view showing an example of a roll-to-roll device used in a manufacturing process of the wiring circuit substrate.

[0021] Figure 8 is a perspective view showing an example of the assembly sheet according to an embodiment of the present application.

[0022] Figure 9 is Figure 8 partial enlarged top view of the assembly sheet.

[0023] Figure 10 is a process diagram for explaining an example of a manufacturing method of the assembly sheet. Figure 8

[0024] is a process diagram for explaining an example of a manufacturing method of the assembly sheet. Figure 11 Figure 8 is a process diagram for explaining an example of a manufacturing method of the assembly sheet.

[0025] Figure 12 Figure 8 is a process diagram for explaining an example of a manufacturing method of the assembly sheet.

[0026] Figure 13 is a process diagram for explaining an example of a manufacturing method of the assembly sheet. Figure 8

[0027] is a process diagram for explaining an example of a manufacturing method of the assembly sheet. Figure 14 Figure 8 is a partial enlarged top view showing a state in which a plurality of mounting objects are respectively mounted to a plurality of wiring circuit substrates of the assembly sheet.

[0028] Figure 15 is a partial enlarged top view of the assembly sheet according to another embodiment of the present application.

[0029] Figure 16

[0030] Figure 17 ​​​​is a plan view and a sectional view of a wiring circuit substrate according to another other embodiment of the present application.

[0031] Figure 18 is a plan view and a sectional view of a wiring circuit substrate according to another other embodiment of the present application. DETAILED DESCRIPTION

[0032] Hereinafter, a wiring circuit substrate and a wiring circuit substrate assembly sheet according to an embodiment of the present application will be described with reference to the drawings.

[0033] 1. Basic structure of wiring circuit substrate

[0034] The wiring circuit substrate according to an embodiment of the present application is an FPC (flexible wiring circuit) substrate configured to be able to mount electrical components, and is manufactured by, for example, a roll-to-roll method. Therefore, the wiring circuit substrate according to the present embodiment has flexibility to the extent that it can be wound around a roll used in the roll-to-roll method. In addition, the wiring circuit substrate according to the present embodiment has two surfaces facing in opposite directions. In the following description, one of the two surfaces of the wiring circuit substrate will be referred to as the upper surface of the wiring circuit substrate, and the other of the two surfaces of the wiring circuit substrate will be referred to as the lower surface of the wiring circuit substrate. Also, in the following description, an electrical component that is intended to be mounted to one wiring circuit substrate, and an electrical component that has been mounted to one wiring circuit substrate will be referred to as a mounting target corresponding to the one wiring circuit substrate. The mounting target can be, for example, a semiconductor chip, or a chip capacitor, a chip resistor, or the like, which is a variety of electronic component that has been chipped.

[0035] Figure 1 is a plan view of a wiring circuit substrate according to an embodiment of the present application, Figure 2 is Figure 1 is a bottom view of the wiring circuit substrate of Figure 3 is Figure 1 is an A-A line sectional view of the wiring circuit substrate 100 of Figure 4 is Figure 1 is a B-B line sectional view of the wiring circuit substrate 100 of

[0036] The wiring circuit substrate 100 according to the present embodiment has substantially the following structure: the insulating layer 20 is formed so as to cover the outer surface of the sheet-shaped support body 10, and the first conductor layer 30 and the second conductor layer 40 are respectively formed in a given pattern on the insulating layer 20. In the wiring circuit substrate 100 according to the present embodiment, the first conductor layer 30 and the second conductor layer 40 are formed so as to be arranged in a given pattern on the insulating layer 20. Figure 1 and Figure 2 In the plan view and the sectional view of the wiring circuit substrate 100 according to the present embodiment, the outer shape of the support body 10 covered by the insulating layer 20 is indicated by a single-dot chain line.

[0037] As Figure 3 and Figure 4As shown, the support body 10 has a support body upper surface 11 and a support body lower surface 12 that face in opposite directions in the thickness direction of the wiring circuit substrate 100. In the central portion of the support body 10, a first through-hole 19 is formed from the support body upper surface 11 to the support body lower surface 12. As shown in Figure 1 The first through-hole 19 has a rectangular shape in plan view. The thickness of the support body 10 is, for example, 10 μm or more and 500 μm or less.

[0038] In the wiring circuit substrate 100, the support body 10 has higher rigidity than the insulating layer 20, the first conductor layer 30, and the second conductor layer 40, and is formed of a metal material, for example. As the metal material that forms the support body 10, stainless steel, copper, copper alloy, aluminum, titanium, or an alloy including iron and nickel, or the like can be given.

[0039] Note that the support body 10 can be formed of a resin or a material including a resin instead of a metal material as long as it has higher rigidity than the insulating layer 20, the first conductor layer 30, and the second conductor layer 40. In this case, as the resin, polyimide resin, epoxy resin, or acrylic resin, or the like can be used. In addition, as the material including a resin, a material composed of epoxy resin and silica filler, or a material composed of epoxy resin and glass fiber, or the like can be used.

[0040] As shown in Figure 3 and Figure 4 The insulating layer 20 is formed so as to cover the support body upper surface 11 and the support body lower surface 12 and cover the inner peripheral surface of the first through-hole 19, and extends over the entire outer surface of the support body 10. The portion of the insulating layer 20 that is located inside the first through-hole 19 forms a second through-hole 29 inside the first through-hole 19, which extends in the thickness direction of the wiring circuit substrate 100. The first through-hole 19 and the second through-hole 29 of the support body 10 are formed so as to be able to house at least a portion of a mounting target product corresponding to the wiring circuit substrate 100 inside the second through-hole 29.

[0041] As shown in Figure 1 The second through-hole 29 has a rectangular shape in plan view. On the inner peripheral surface 28 of the second through-hole 29, a step that extends over the entire circumference of the inner peripheral surface 28 is formed in the substantially central portion in the thickness direction of the wiring circuit substrate 100. Due to the step, the opening area of the upper portion of the second through-hole 29 is larger than the opening area of the lower portion of the second through-hole 29.

[0042] The thickness of the portion of the insulating layer 20 on the upper surface 11 of the support body and the portion of the insulating layer 20 on the lower surface 12 of the support body is, for example, 2 μm or more and 30 μm or less. In addition, the thickness (thickness in a direction orthogonal to the thickness direction of the wiring circuit substrate 100) of the portion of the insulating layer 20 in which the second through-hole 29 is formed inside the first through-hole 19 is, for example, 2 μm or more and 30 μm or less.

[0043] The insulating layer 20 is formed of, for example, a photosensitive material. As the photosensitive material forming the insulating layer 20, a photosensitive polyimide can be used. Note that the insulating layer 20 can also be formed of another photosensitive resin instead of the photosensitive polyimide. In this case, as the other photosensitive resin, for example, a photosensitive resin such as an acrylic resin, an epoxy resin, a polyamide resin, a polybenzoxazole resin, or a polyvinyl chloride resin can be cited. Alternatively, the insulating layer 20 can also be formed of an inorganic insulating material or an organic insulating material other than the photosensitive material. Specifically, as the material of the insulating layer 20, silicon carbide, silicon dioxide, aluminum nitride, or aluminum oxide, or the like can be used.

[0044] The first conductor layer 30 and the second conductor layer 40 are formed on the upper surface 11 of the support body and on the lower surface 12 of the support body in a predetermined pattern with the insulating layer 20 interposed therebetween. In addition, as shown in Figs. 1 and 2, the first conductor layer 30 and the second conductor layer 40 are formed on the inner circumferential surface 28 of the second through-hole 29 in a predetermined pattern. Figure 3 Figure 4

[0045] Here, in the inner circumferential surface 28 of the second through-hole 29, the two conductor layers (30, 40) are formed only on a part of the inner circumferential surface 28 and are not formed on the other part of the inner circumferential surface 28. Thus, the two conductor layers (30, 40) do not cover the entire inner circumferential surface 28. In the following description, the region of the inner circumferential surface 28 of the second through-hole 29 in which the two conductor layers (30, 40) are formed will be referred to as an object region 28a, and the region in which the two conductor layers (30, 40) are not formed will be referred to as a non-object region 28b.

[0046] The detailed structure of the first conductor layer 30 will be described. The first conductor layer 30 has a mounting terminal portion 31 (31a, 31b), an upper wiring portion 32a (32a1, 32a2), a lower wiring portion 32b (32b1, 32b2), an upper pad portion 33a (33a1, 33a2), and a lower pad portion 33b (33b1, 33b2). The mounting terminal portion 31 is formed inside the second through-hole 29 of the insulating layer 20 on the object region 28a (28a1, 28a2) of the inner circumferential surface 28 of the second through-hole 29, as shown in Figs. 1 and 2. Figure 1 Figure 2 Figure 1 Figure 2 Figure 1 Figure 2 Figure 3 Figure 4 Figure 1 ​​​​​​​​​​overlaps with one of the short sides of the rectangle forming the inner edge of the second through-hole 29 when viewed from above. At the time of mounting of the mounting target product 200 (described later) Figure 5 ) to the mounting terminal portion 31. Figure 5

[0047] As shown in Figure 1 , the upper wiring portion 32a is formed to extend from the mounting terminal portion 31 to one side of the second through-hole 29 by a given distance on the upper surface side of the wiring circuit substrate 100. The upper pad portion 33a is formed in a substantially circular shape at the front end portion of the upper wiring portion 32a. The upper pad portion 33a is formed so as to be able to join a terminal portion of an electrical element other than the mounting target product 200 described later.

[0048] As shown in Figure 2 , the mounting terminal portion 31 overlaps with one of the short sides of the rectangle forming the inner edge of the second through-hole 29 when viewed from above. The lower wiring portion 32b is formed to extend from the mounting terminal portion 31 to one side of the second through-hole 29 by a given distance on the lower surface side of the wiring circuit substrate 100. The lower pad portion 33b is formed in a substantially circular shape at the front end portion of the lower wiring portion 32b. The lower pad portion 33b is formed so as to be able to join a terminal portion of an electrical element other than the mounting target product 200 described later.

[0049] The specific structure of the second conductor layer 40 will be described. The second conductor layer 40 has a mounting terminal portion 41 Figure 1 and Figure 2 , an upper wiring portion 42a Figure 1 , a lower wiring portion 42b Figure 2 , an upper pad portion 43a Figure 1 , and a lower pad portion 43b Figure 2 . The mounting terminal portion 41 is formed on the target region 28a inside the second through-hole 29 of the insulating layer 20, overlaps with the other of the short sides of the rectangle forming the inner edge of the second through-hole 29 when viewed from above, as shown in Figure 1 . Thus, the mounting terminal portion 41 of the second conductor layer 40 opposes the mounting terminal portion 31 of the first conductor layer 30 with the inner space of the second through-hole 29 interposed therebetween. At the time of mounting of the mounting target product 200 (described later) Figure 5 ) to the mounting terminal portion 41. Figure 5

[0050] As shown in Figure 1 ​​As shown, the upper wiring portion 42a is formed on the upper surface of the wiring circuit board 100, extending a given distance from the mounting terminal portion 41 to the other side of the second through hole 29. The upper pad portion 43a is formed in a generally circular shape at the front end of the upper wiring portion 42a. The upper pad portion 43a is formed to be able to engage terminals of electrical components other than the mounting object 200 described later.

[0051] like Figure 2 As shown, when viewed from below, the mounting terminal portion 41 overlaps with another short side of the rectangle forming the inner edge of the second through hole 29. The lower wiring portion 42b is formed on the lower surface of the wiring circuit board 100, extending a given distance from the mounting terminal portion 41 to the other side of the second through hole 29. The lower pad portion 43b is formed in a generally circular shape at the front end of the lower wiring portion 42b. The lower pad portion 43b is configured to engage terminals of electrical components other than the mounting object 200, as described later.

[0052] The thickness of each portion of the first conductor layer 30 and the second conductor layer 40 is, for example, 2 μm or more and 50 μm or less. In addition, the width of each of the upper wiring portions 32a, 42a and the lower wiring portions 32b, 42b of the first conductor layer 30 and the second conductor layer 40 (the width of the wiring orthogonal to the direction in which the wiring extends) is, for example, 3 μm or more and 100 μm or less.

[0053] The first conductor layer 30 and the second conductor layer 40 are each formed, for example, by forming a resist layer with a given pattern on a seed layer and then electroplating it. The seed layer forming the conductor layer is, for example, composed of a chromium thin film and a copper thin film. Alternatively, the seed layer is composed of a copper thin film. Alternatively, the seed layer may also include any of nickel and palladium. On the other hand, the plating layer is formed of one or more metals or alloys including copper, gold, silver, platinum, lead, tin, nickel, cobalt, indium, rhodium, chromium, tungsten, and ruthenium. In this embodiment, the plating layer is copper.

[0054] On the upper surface of the wiring circuit board 100, such as Figure 3 and Figure 4 As shown by the dashed line, in addition to the second through-hole 29 and the forming portions of the upper pads 33a and 43a, a covering insulating layer 50 is also formed. The covering insulating layer 50 protects the upper wiring portions 32a and 42a located on the upper surface of the wiring circuit board 100 by covering them. Furthermore, on the lower surface of the wiring circuit board 100, as shown by the dashed line... Figure 3 and Figure 4 As shown by the dashed line, a covering insulating layer 60 is formed in addition to the portion forming the second through hole 29 and the portions forming the lower pads 33b and 43b. The covering insulating layer 60 protects the lower wiring portions 32b and 42b by covering the lower surface of the wiring circuit board 100.

[0055] The cover insulating layers 50, 60 can be formed of the same material as the insulating layer 20, or can be formed of an insulating material different from the insulating layer 20. Specifically, in the case where the insulating layer 20 is formed of a photosensitive polyimide, the cover insulating layers 50, 60 can also be formed of a photosensitive polyimide. Alternatively, the cover insulating layers 50, 60 are not dependent on the material of the insulating layer 20, and can be formed of, for example, a photosensitive resin such as a polyimide resin, an acrylic resin, an epoxy resin, a polyamide resin, a polybenzoxazole resin, or a polyvinyl chloride resin.

[0056] Note that, in the following drawings, Figure 1 and Figure 2 as well as Figure 5 in the following drawings, the illustration of the cover insulating layers 50, 60 is omitted in order to easily understand the structure of the support 10, the insulating layer 20, the first conductor layer 30, and the second conductor layer 40. Figure 3 and Figure 4 in the following drawings, the illustration of the cover insulating layers 50, 60 is omitted in order to easily understand the structure of the support 10, the insulating layer 20, the first conductor layer 30, and the second conductor layer 40.

[0057] 2. Mounting of the mounting object to the wiring circuit substrate Figure 1

[0058] The mounting object is mounted to the wiring circuit substrate 100 having the above structure. Figure 5 is a drawing for explaining a mounting method of the mounting object to the wiring circuit substrate Figure 1 . In Figure 5 , the mounting method of the mounting object 200 to the wiring circuit substrate 100 is represented in time series using two perspective views arranged in the up-and-down direction.

[0059] At this mounting, the mounting object 200 corresponding to the wiring circuit substrate 100 is prepared. As shown in the upper paragraph of Figure 1 , the mounting object 200 of this example has a cuboid shape. In addition, a first terminal portion 201 and a second terminal portion 202 are formed at both end portions in the long direction of the mounting object 200. In Figure 5 , in order to easily understand the positions and shapes of the first terminal portion 201 and the second terminal portion 202 of the mounting object 200, dot patterns are added to portions of the first terminal portion 201 and the second terminal portion 202. In Figure 5 , in order to easily understand the positions and shapes of the first conductor layer 30 and the second conductor layer 40 of the wiring circuit substrate 100, shading is added to portions of the first conductor layer 30 and the second conductor layer 40. Figure 5

[0060] ​​As described above, the second through-hole 29 of the wiring circuit substrate 100 is formed so as to be able to house at least a part of the mounting object 200 inside the second through-hole 29. In the present example, the second through-hole 29 is provided so as to be able to house the entire mounting object 200. In other words, in the present example, the size of the area surrounded by the inner edge of the second through-hole 29 when viewed from above is larger than the mounting object 200.

[0061] As Figure 5 indicated by the thick solid arrow, the mounting object 200 is inserted into the second through-hole 29 in such a manner that the first terminal portion 201 approaches the mounting terminal portion 31 of the first conductor layer 30 and the second terminal portion 202 approaches the mounting terminal portion 41 of the second conductor layer 40. In this state, the first terminal portion 201 and the first conductor layer 30 that are arranged opposite to each other are joined using solder, and the second terminal portion 202 and the second conductor layer 40 that are arranged opposite to each other are joined using solder. Thus, as indicated by the lower segment of Figure 5 , the mounting object 200 is mounted to the wiring circuit substrate 100 in a state of being housed inside the second through-hole 29 of the wiring circuit substrate 100. In this way, the mounting substrate 120 in which the mounting object 200 and the wiring circuit substrate 100 are integrated is completed.

[0062] In the mounting substrate 120, the mounting object 200 is housed inside the second through-hole 29 of the wiring circuit substrate 100. Therefore, compared to the case where the mounting object 200 is mounted on the upper surface or the lower surface of the wiring circuit substrate 100, thinning of the mounting substrate 120 is achieved.

[0063] Figure 6 is Figure 5 a plan view of the mounting substrate 120. As Figure 6 indicated, in the mounting substrate 120, the first terminal portion 201 located at one end portion of the mounting object 200 is joined to the first conductor layer 30 of the wiring circuit substrate 100 via the solder 210. In addition, the second terminal portion 202 located at the other end portion of the mounting object 200 is joined to the second conductor layer 40 of the wiring circuit substrate 100 via the solder 210.

[0064] On the other hand, when viewed from above, the both side portions of the mounting target product 200 are separated from the inner peripheral surface 28 (non-target region 28b of the inner peripheral surface 28) of the second through-hole 29 of the wiring circuit substrate 100. That is, in a state where the mounting target product 200 is mounted to the wiring circuit substrate 100, two gaps 29G are formed between a portion of the mounting target product 200 and the wiring circuit substrate 100. These gaps 29G can be used as a work space when the mounting target product 200 is mounted to the wiring circuit substrate 100. In addition, for reasons such as replacing an old mounting target product 200 assembled to the mounting substrate 120 with a new mounting target product 200, the above-described gaps 29G can also be used as a work space when the mounting target product 200 is detached from the wiring circuit substrate 100. In this way, the case where one or more gaps 29G are formed between the mounting target product 200 and the wiring circuit substrate 100 makes it easy to mount and detach the mounting target product 200 with respect to the wiring circuit substrate 100. Note that, as a case where the mounting target product 200 is detached from the wiring circuit substrate 100, in addition to the above-described example, there can be cited a case where a defective mounting target product 200 is to be replaced, a case where a mounting target product 200 that has been mounted in a posture different from a predetermined posture is to be mounted again, and the like.

[0065] 3. Assembly sheet of wiring circuit substrates and method for manufacturing the same

[0066] As described above, the wiring circuit substrate 100 according to the present embodiment is manufactured by, for example, a roll-to-roll method. In the roll-to-roll method, an assembly sheet of wiring circuit substrates (hereinafter simply referred to as an assembly sheet) including a plurality of wiring circuit substrates 100 is produced. In order to produce the assembly sheet, a roll-to-roll device is used.

[0067] Figure 7 is a schematic side view that shows an example of a roll-to-roll device used in a manufacturing process of the wiring circuit substrate 100. As shown in Figure 7 , the roll-to-roll device 900 includes an unwinding section 901, a winding section 902, and a plurality of processing sections 910, 920,.... First, a roll (feed roll) R1 in which a long strip-shaped base member BM is wound is prepared, and is disposed at the unwinding section 901 of the roll-to-roll device 900.

[0068] The base member BM is fed from the prepared feed roll R1. As shown by the dotted arrows in Figure 7 , the fed base member BM is wound to another roll (winding roll) R2 disposed at the winding section 902.

[0069] In the roll-to-roll device 900, a plurality of processing sections 910, 920,... are provided between the two rollers (R1, R2) in a manner arranged along the moving direction of the base member BM. The plurality of processing sections 910, 920,... perform various processes on each region of the long strip-shaped base member BM moving between the two rollers (R1, R2). Thereby, each region of the base member BM passes through the plurality of processing sections 910, 920,..., and thereby, the aggregate sheet 500 is produced, and the produced aggregate sheet 500 is wound on the winding roller R2.

[0070] Figure 8 is a perspective view showing an example of the aggregate sheet 500 according to an embodiment of the present application. In Figure 8 , the aggregate sheet 500 is shown in a state wound on Figure 7 the winding roller R2. In this aggregate sheet 500, a plurality of wiring circuit substrates 100 are regularly arranged.

[0071] Figure 9 is a partial enlarged plan view of the aggregate sheet 500 of Figure 8 . As shown in Figure 9 , the aggregate sheet 500 unwound from the winding roller R2 has a long strip shape. In the following description, the direction parallel to a pair of short sides of the aggregate sheet 500 (the short side direction of the aggregate sheet 500) is referred to as the X direction. In addition, the direction parallel to the other pair of long sides of the aggregate sheet 500 (the long side direction of the aggregate sheet 500) is referred to as the Y direction. Furthermore, the direction orthogonal to the aggregate sheet 500 is referred to as the Z direction. In Figure 8 and Figure 9 , the X direction, the Y direction, and the Z direction are respectively shown by arrows X, Y, Z.

[0072] The aggregate sheet 500 includes a plurality of wiring circuit substrates 100, a frame 510, and an insulating layer 600. In addition, the aggregate sheet 500 includes a not-shown cover insulating layer. The frame 510 is formed of the same material as the support 10 of the wiring circuit substrate 100, and includes an outer frame 511 and a plurality of inner frames 512. The outer frame 511 is a rectangular frame composed of a pair of short sides extending in the X direction and a pair of long sides extending in the Y direction. The plurality of inner frames 512 are formed in a mesh shape in a manner that divides the inner region of the outer frame 511 with a plurality of squares corresponding to the respective sizes of the plurality of wiring circuit substrates 100.

[0073] The insulating layer 600 is formed of the same material as the insulating layer 20 of the wiring circuit substrate 100, and is provided in a manner of covering the frame 510. In the assembly sheet 500, a plurality of the wiring circuit substrates 100 are respectively arranged in a plurality of rectangular regions (partition regions) divided by the outer frame 511 and the inner frames 512 of the frame 510. An unillustrated cover insulating layer is formed in a manner of covering partial regions of the upper surface and the lower surface of the wiring circuit substrate 100.

[0074] In each of the partition regions, both ends in the Y direction of the wiring circuit substrate 100 are respectively supported by a pair of the bridges 513 to either the short side of the outer frame 511 or any of the plurality of inner frames 512. After the assembly sheet 500 is manufactured, the wiring circuit substrates 100 in each of the partition regions are pulled out by cutting the bridges 513, whereby each of the wiring circuit substrates 100 can be separated from the frame 510.

[0075] Figures 10-14 is a process diagram for explaining an example of a manufacturing method of the assembly sheet 500 of Figure 8 . In Figures 10-14 , a partial enlarged plan view of the assembly sheet 500 is shown in the left part of the upper stage, a C-C line cross-sectional view of the assembly sheet 500 is shown in the central part of the upper stage, and a D-D line cross-sectional view of the assembly sheet 500 is shown in the right part of the upper stage. Also, an E-E line cross-sectional view of the assembly sheet 500 is shown in the left part of the lower stage.

[0076] First, as shown in Figure 10 , a pair of substrates of a support layer LA1 and a lower insulating layer LA2 are prepared as the base member BM. The support layer LA1 is composed of the same material as the support body 10 of the wiring circuit substrate 100. Also, the lower insulating layer LA2 is composed of the same material as the insulating layer 20 of the wiring circuit substrate 100.

[0077] Next, as shown in Figure 11 , the unnecessary part of the support layer LA1 of Figure 10 is removed, whereby the frame 510, the plurality of bridges 513, and the plurality of support bodies 10 (the support body 10 of the wiring circuit substrate 100) are formed. In the case where the support layer LA1 is formed of a metal material, the unnecessary part of the support layer LA1 can be removed by etching using a resist, for example. Note that in the case where the support layer LA1 is formed of a photosensitive resin or the like, the formation of the frame 510, the plurality of bridges 513, and the plurality of support bodies 10 can also be performed using a photolithography technique. In Figure 11 , in order to easily understand the shapes of the frame 510, the plurality of bridges 513, and the plurality of support bodies 10, hatching is added to these parts.

[0078] Next, as shown in Figure 12As shown, the upper insulating layer LA3 is formed on the upper surface of the lower insulating layer LA2 in a manner to cover the frame 510, the plurality of bridges 513, and the plurality of support bodies 10 (support bodies 10 of the wiring circuit substrate 100). The upper insulating layer LA3 can be formed, for example, by applying a precursor of a photosensitive resin to the upper surface of the lower insulating layer LA2 and performing exposure and development on the photosensitive resin precursor.

[0079] Thus, the lower insulating layer LA2 and the upper insulating layer LA3 located inside the division region constitute the insulating layer 20 of the plurality of wiring circuit substrates 100. In addition, the lower insulating layer LA2 and the upper insulating layer LA3 located outside the division region constitute the insulating layer 600 of the Figure 9 In Figure 12 , Figure 13 and Figure 14 , the outer edge of the portion in which the wiring circuit substrate 100 is formed in each division region, that is, the boundary between the portion from which each wiring circuit substrate 100 should be pulled out of the assembly sheet 500 and the other portion is shown by a double-dot chain line.

[0080] The plurality of support bodies 10 constituting the plurality of wiring circuit substrates 100 have the first through-hole 19 in the central portion. Therefore, as shown in the C-C line cross section of Figure 12 , the upper insulating layer LA3 is formed in a concave shape inside the first through-hole 19 of the support body 10 when the upper insulating layer LA3 is formed. In other words, a recess of the upper insulating layer LA3 (insulating layer 20) is formed inside the first through-hole 19.

[0081] After the upper insulating layer LA3 is formed in the process of Figure 12 , as shown in Figure 13 , the second through-hole 29 is formed in the insulating layer 20 in a manner to pass through the inside of the first through-hole 19 of each support body 10. The second through-hole 29 is formed, for example, by laser processing. Note that the second through-hole 29 can also be formed by mechanical processing such as cutting or punching. At this time, the second through-hole 29 is formed, for example, in a size slightly smaller than the recess inside the first through-hole 19 of the upper insulating layer LA3 (insulating layer 20) of Figure 12 .

[0082] Next, as shown in Figure 14 , the conductor layer is formed on the surface of the insulating layer 20 in each division region in a predetermined pattern, whereby the first conductor layer 30 and the second conductor layer 40 of each wiring circuit substrate 100 are formed. The formation of these first conductor layer 30 and second conductor layer 40 is performed, for example, by a semi-additive method using the seed layer described above. Note that the first conductor layer 30 and the second conductor layer 40 can be formed by an additive method or a semi-additive method.

[0083] After that, the covering insulating layers 50, 60 are formed on the upper and lower surfaces of the insulating layer 20 in each of the division regions except for the portions where the second through-hole 29 and the plurality of pad portions (33a, 33b, 43a, 43b) are formed. Thus, the plurality of wiring circuit substrates 100 are completed in a state of being integrally supported by the insulating layer 600 and the frame 510. That is, the assembly sheet 500 of Figure 1 According to the assembly sheet 500, the plurality of wiring circuit substrates 100 can be integrally processed.

[0084] In each of the plurality of wiring circuit substrates 100 integrated by the assembly sheet 500, the mounting target product 200 can be mounted before being separated from the assembly sheet 500. In this case, the mounting of the mounting target product 200 to each of the wiring circuit substrates 100 is also performed in a roll-to-roll manner, and thus the manufacturing efficiency of the plurality of mounting substrates 120 Figure 5 is improved.

[0085] Figure 15 is a partial enlarged plan view showing a state in which the plurality of mounting target products 200 are respectively mounted to the plurality of wiring circuit substrates 100 of the assembly sheet 500. Figure 15 The plan view of Figure 9 corresponds to the plan view of Figure 15 As shown in Figure 15 , according to the assembly sheet 500 of the present example, the plurality of mounting substrates 120 can be integrally processed. As shown by the double-dot chain line of , by cutting the outer edge of the mounting substrate 120 in each of the division regions, the plurality of mounting substrates 120 can be respectively separated from the assembly sheet 500.

[0086] 4. Effects of the Embodiment

[0087] (a) In the above-described wiring circuit substrate 100, the mounting target product 200 can be disposed inside the second through-hole 29 of the insulating layer 20. In addition, the mounting terminal portion 31 of the first conductor layer 30 and the mounting terminal portion 41 of the second conductor layer 40 are formed on a part of the inner peripheral surface 28 of the second through-hole 29. Thus, the mounting target product 200 can be electrically connected to the first conductor layer 30 and the second conductor layer 40 inside the second through-hole 29. In this way, the mounting target product 200 is mounted inside the second through-hole 29. In this case, compared to the case where the mounting target product 200 is mounted on the upper surface or the lower surface of the wiring circuit substrate 100, the thinness of the mounting substrate 120 that is integrally connected by the wiring circuit substrate 100 and the mounting target product 200 is achieved.

[0088] In addition, the support body 10 of the wiring circuit substrate 100 described above has higher rigidity than the insulating layer 20, the first conductor layer 30, and the second conductor layer 40. Therefore, the wiring circuit substrate 100 has higher reliability in terms of mechanical strength than a wiring circuit substrate composed only of the insulating layer 20, the first conductor layer 30, and the second conductor layer 40.

[0089] As a result, according to the wiring circuit substrate 100, thinning of the mounting substrate 120 produced by mounting the mounting object 200 is achieved, and higher reliability in terms of mechanical strength can be obtained.

[0090] (b) As described above, the support body 10 can also be formed of a metal material. In the case where the support body 10 is formed of a metal material, the strength of the support body 10 is easily ensured compared to the case where the support body 10 is formed of a resin. Alternatively, the support body 10 can also be formed of a resin. In the case where the support body 10 is formed of a resin, by using an insulating resin as the resin, the first conductor layer 30 and the second conductor layer 40 can be formed directly on the support body 10.

[0091] (c) The mounting terminal portion 31 of the first conductor layer 30 and the mounting terminal portion 41 of the second conductor layer 40 are formed in a mutually opposing manner on the inner peripheral surface 28 of the second through-hole 29 of the wiring circuit substrate 100. In a state where the mounting object 200 is housed in the second through-hole 29, these mounting terminal portions 31, 41 are arranged so as to oppose the first terminal portion 201 and the second terminal portion 202 of the mounting object 200, respectively.

[0092] Thus, at the time of mounting of the mounting object 200 with respect to the wiring circuit substrate 100, connection between the first terminal portion 201 and the second terminal portion 202 of the mounting object 200 and the mounting terminal portions 31, 41 becomes easy.

[0093] (d) In the wiring circuit substrate 100 described above, two wiring portions (32a, 32b) are formed in a manner extending from the mounting terminal portion 31 in the second through-hole 29 toward the upper surface and the lower surface of the wiring circuit substrate 100. In addition, two wiring portions (42a, 42b) are formed in a manner extending from the mounting terminal portion 41 in the second through-hole 29 toward the upper surface and the lower surface of the wiring circuit substrate 100. Thus, a plurality of conduction paths are ensured with respect to the mounting object 200 mounted in the second through-hole 29. Therefore, the degree of freedom of the layout of the wiring with respect to the mounting object 200 is improved. In addition, according to the above-described structure, the mounting terminal portions 31, 41 are formed on a portion of the inner peripheral surface 28 of the second through-hole 29, and therefore, the area of the connection portion with respect to the mounting object 200 is ensured, and the reliability of the connection between the wiring circuit substrate 100 and the mounting object 200 is also improved.

[0094] 5. Other Embodiments

[0095] (a) In the assembly sheet 500 according to the above embodiment, the support 10 and the frame 510 of each wiring circuit substrate 100 are connected by two bridges 513, but the present application is not limited to this. The support 10 and the frame 510 of each wiring circuit substrate 100 are formed on a common lower insulating layer LA2 (see FIG. 2) and are covered by a common upper insulating layer LA3 (see FIG. 2). Therefore, as long as the lower insulating layer LA2 and the upper insulating layer LA3 have rigidity to the extent that the support 10 and the frame 510 can be supported in a roll-to-roll manufacturing process, the bridges 513 can not be provided. Figure 12 Figure 12

[0096] Figure 16 is a partial enlarged plan view of the assembly sheet 500 according to another embodiment of the present application. Figure 16 The plan view of Figure 9 corresponds to the plan view of Figure 16 As shown in , in the assembly sheet 500 of this example, there are no bridges 513 between each of the plurality of wiring circuit substrates 100 and the frame 510. Therefore, when each wiring circuit substrate 100 is pulled out from the assembly sheet 500, mechanical load or work load, or the like is reduced.

[0097]

[0098] Figure 17 is a plan view and a sectional view of the wiring circuit substrate 100 according to another embodiment of the present application. In Figure 17 , the plan view of the wiring circuit substrate 100 is shown in the upper section, and the F-F line sectional view of the wiring circuit substrate 100 of the upper section is shown in the lower section.

[0099] As shown in Figure 17 , in the inner peripheral surface 28 of the second through-hole 29 of this example, no step is formed. In this case, the surfaces (surfaces facing the inside of the second through-hole 29) of the mounting terminal portions 31 of the first conductor layer 30 and the mounting terminal portions 41 of the second conductor layer 40 formed in the inner peripheral surface 28 can be flattened over a wider range. Therefore, at the time of mounting of the mounting target product 200, engagement between the terminal portions becomes easy.

[0100] ​​(c) In the wiring circuit substrate 100 according to the above embodiment, the insulating layer 20 is provided so as to cover the outer surface of the support body 10, but the present application is not limited thereto. In the case where an insulating material is used as the material of the support body 10, the insulating layer 20 can not be provided in the wiring circuit substrate 100.

[0101] Figure 18 is a plan view and a sectional view of the wiring circuit substrate 100 according to another other embodiment of the present application. In Figure 18 , a plan view of the wiring circuit substrate 100 is shown in the upper stage, and a G-G line sectional view of the wiring circuit substrate 100 of the upper stage is shown in the lower stage.

[0102] In the wiring circuit substrate 100 of the present example, the support body 10 is composed of, for example, an insulating resin or an insulating material including a resin. In this case, as shown in Figure 18 , the first conductor layer 30 and the second conductor layer 40 can be directly formed on the surface of the support body 10. Therefore, the wiring circuit substrate 100 can be further thinned, and the number of manufacturing steps of the wiring circuit substrate 100 can be reduced.

[0103] (d) In the wiring circuit substrate 100 according to the above embodiment, the insulating layer 20 is formed so as to cover the entire outer surface of the support body 10, but the present application is not limited thereto. The insulating layer 20 is, for example, in the case where the support body 10 is formed of an electrically conductive material, only required to ensure the insulating property between the two conductor layers (30, 40) and the support body 10. Therefore, the insulating layer 20 can be formed only in the formation portion of at least two conductor layers (30, 40) in the outer surface of the support body 10. That is, the insulating layer 20 can be formed only in a part of the outer surface of the support body 10.

[0104] (e) In the wiring circuit substrate 100 according to the above embodiment, the covering insulating layers 50, 60 covering a part of the first conductor layer 30 and the second conductor layer 40 are formed on the upper surface and the lower surface of the insulating layer 20, but the present application is not limited thereto. In the case where a material having excellent corrosion resistance or the like is used as the first conductor layer 30 and the second conductor layer 40, the covering insulating layers 50, 60 can not be provided.

[0105] (f) In the wiring circuit substrate 100 before the mounting of the mounting target product 200, the surface of the mounting terminal portions 31, 41 facing the inside of the second through-hole 29 can be subjected to a treatment for imparting corrosion resistance. For example, plating treatment of gold or the like can be performed on the outer surface of the mounting terminal portions 31, 41.

[0106] (g) The wiring circuit substrate 100 according to the above embodiment is an FPC substrate, but the present application is not limited thereto. The wiring circuit substrate 100 can also be a rigid substrate that cannot be wound around a roll used in a roll-to-roll system.

[0107] (h) In the wiring circuit substrate 100 according to the above embodiment, the upper wiring portion 32a of the first conductor layer 30 and the upper wiring portion 42a of the second conductor layer 40 are formed on the upper surface. In addition, the lower wiring portion 32b of the first conductor layer 30 and the lower wiring portion 42b of the second conductor layer 40 are formed on the lower surface. However, the present application is not limited thereto. In the wiring circuit substrate 100, any one of the wiring portions of the first conductor layer 30 and the second conductor layer 40 can be formed on at least one of the upper surface and the lower surface thereof.

[0108] (i) In the wiring circuit substrate 100 according to the above embodiment, a gap 29G is formed between a portion of the inner peripheral surface 28 of the second through-hole 29 and the mounting target product 200 at the time of mounting the mounting target product 200, but the present application is not limited thereto. The second through-hole 29 of the wiring circuit substrate 100 can also be formed so as not to form a gap between the inner peripheral surface 28 and the mounting target product 200 at the time of mounting the mounting target product 200.

[0109] (j) In the wiring circuit substrate 100 according to the above embodiment, the first through-hole 19 and the second through-hole 29 have a rectangular shape in plan view, but the present application is not limited thereto. The first through-hole 19 and the second through-hole 29 can also have a shape other than a rectangular shape, such as a circular shape, an elliptical shape, or a triangular shape, in plan view.

[0110] (k) In the roll-to-roll device 900 used in the above embodiment, all the processes for producing the assembly sheet 500 are performed. That is, one roll-to-roll device 900 is provided with a plurality of devices corresponding to all the processes for producing the wiring circuit substrate 100, respectively. However, the present application is not limited thereto.

[0111] The plurality of processes for producing the assembly sheet 500 can also be performed by a plurality of roll-to-roll devices. For example, it can also be that the processes for the first half of the series of processes for producing the wiring circuit substrate 100 are performed by one roll-to-roll device, and the processes for the latter half are performed by another roll-to-roll device. In addition, the plurality of processes for producing the assembly sheet 500 can also be performed using three or more roll-to-roll devices. Furthermore, it can also be that only a part of the plurality of processes for producing the assembly sheet 500 are performed by a roll-to-roll device.

[0112] (l) In the above embodiment, the wiring circuit substrate 100 is manufactured by a roll-to-roll method, but the present application is not limited to this. The wiring circuit substrate 100 can also be manufactured by a method other than the roll-to-roll method. For example, it can also be manufactured by a single sheet method in which one sheet is sequentially processed.

[0113] 6. Correspondence between each component of the claims and each part of the embodiments

[0114] Hereinafter, an example of correspondence between each component of the claims and each element of the embodiments will be described, but the present application is not limited to the following example. As each component of the claims, other various elements having the structure or function described in the claims can also be used.

[0115] In the above embodiment, the mounting target product 200 is an example of an electrical element, the wiring circuit substrate 100 is an example of a wiring circuit substrate, the support body upper surface 11 of the support body 10 is an example of a first surface, the support body lower surface 12 of the support body 10 is an example of a second surface, the first through-hole 19 is an example of a first through-hole, and the support body 10 is an example of a support layer.

[0116] In addition, the insulating layer 20 is an example of an insulating layer, the first conductor layer 30 and the second conductor layer 40 are examples of conductor layers, the second through-hole 29 is an example of a second through-hole, the inner peripheral surface 28 of the second through-hole 29 is an example of an inner peripheral surface of a second through-hole, the target region 28a is an example of a conductor layer formation region, and the non-target region 28b is an example of a conductor layer non-formation region.

[0117] In addition, the first terminal portion 201 and the second terminal portion 202 of the mounting target product 200 are examples of terminal portions of an electrical element, the mounting terminal portions 31, 41 are examples of portions of the conductor layers formed in the conductor layer formation regions and the intermediate conductor layer, the upper wiring portions 32a, 42a are examples of first wiring portions, the lower wiring portions 32b, 42b are examples of second wiring portions, Figure 18 the first through-hole 19 is an example of a through-hole, and the assembly sheet 500 is an example of a wiring circuit substrate assembly sheet.

[0118] 7. Summary of the embodiments

[0119] (First item) The wiring circuit substrate according to the first item is a wiring circuit substrate on which an electrical element is mounted, and includes:

[0120] a support layer having a first surface and a second surface facing in opposite directions, and having a first through-hole extending in a thickness direction intersecting the first surface and the second surface;

[0121] an insulating layer covering at least a portion of the first face, at least a portion of the second face, and an inner peripheral surface of the first through-hole; and

[0122] a conductor layer formed in a predetermined pattern on the insulating layer,

[0123] the support layer has higher rigidity than the insulating layer and the conductor layer,

[0124] a portion of the insulating layer covering the inner peripheral surface of the first through-hole forms a second through-hole that extends in the thickness direction inside the first through-hole,

[0125] the second through-hole is formed so as to be able to house at least a portion of the electrical component inside the second through-hole,

[0126] the inner peripheral surface of the second through-hole includes a conductor layer formation region in which the conductor layer is formed, and a conductor layer non-formation region in which the conductor layer is not formed.

[0127] In this wiring circuit substrate, at least a portion of the electrical component can be disposed inside the second through-hole of the insulating layer. In addition, since the conductor layer is formed on a portion of the inner peripheral surface of the second through-hole, the electrical component can be electrically connected to the conductor layer inside the second through-hole. By mounting the electrical component inside the second through-hole like this, compared to the case where the electrical component is mounted on the first face or the second face, the structure (electrical component mounting substrate) in which the electrical component and the wiring circuit substrate are integrally connected is thinned.

[0128] In addition, with the above-described wiring circuit substrate, the support layer has higher rigidity than the insulating layer and the conductor layer, and thus has higher reliability in terms of mechanical strength compared to a wiring circuit substrate composed only of the insulating layer and the conductor layer.

[0129] As a result, thinning of the structure including the electrical component at the time of mounting the electrical component is possible and high reliability in terms of mechanical strength is obtained.

[0130] (Second) In the wiring circuit substrate according to the first item, it can also be that,

[0131] the support layer is formed of metal or resin.

[0132] In the case where the support layer is formed of metal, the strength of the support layer is easily ensured compared to the case where the support layer is formed of resin. On the other hand, in the case where the support layer is formed of resin, by using an insulating resin as the resin, the conductor layer can be formed directly on the support layer.

[0133] (Third item) In the wiring circuit substrate according to the first or second item, it can also be that

[0134] The electrical component has a terminal portion,

[0135] In a state where the at least a portion of the electrical component is housed in the second through-hole, a portion of the conductor layer formed in the conductor layer formation region opposes the terminal portion of the electrical component.

[0136] In this case, in a state where at least a portion of the electrical component is disposed inside the second through-hole of the insulating layer, the terminal portion of the electrical component and the portion of the conductor layer formed in the inner peripheral surface of the second through-hole can be easily connected.

[0137] (Fourth item) In the wiring circuit substrate according to any one of the first to third items, it can also be that

[0138] The conductor layer includes:

[0139] a first wiring portion formed on the first face via the insulating layer;

[0140] a second wiring portion formed on the second face via the insulating layer; and

[0141] an intermediate conductor portion formed inside the second through-hole,

[0142] The first wiring portion and the second wiring portion are electrically connected to the intermediate conductor portion.

[0143] In this case, in a state where the electrical component is mounted inside the second through-hole, an electrical conduction path with respect to the electrical component can be ensured on the first face and the second face of the support layer. Therefore, the degree of freedom of the layout of the wiring with respect to the electrical component to be mounted is increased.

[0144] (Fifth item) In the wiring circuit substrate according to any one of the first to fourth items, it can also be that

[0145] In a state where the at least a portion of the electrical component is housed in the second through-hole, the conductor layer non-formation region is separated from the electrical component.

[0146] In this case, at the time of mounting of the electrical component to the wiring circuit substrate, a gap is formed between the conductor layer non-formation region of the second through-hole and the electrical component. Thus, the gap can be used as a work space at the time of mounting of the electrical component to the wiring circuit substrate. In addition, at the time of detaching the electrical component from the wiring circuit substrate on which the electrical component is mounted, the above gap can also be used as a work space. Therefore, the mounting and detaching of the electrical component with respect to the wiring circuit substrate become easy.

[0147] Item 6) The wiring circuit substrate of item 6 is a wiring circuit substrate on which an electrical component is mounted, and includes:

[0148] a support layer formed of an insulating material, having a first surface and a second surface facing in opposite directions, and having a through-hole extending from the first surface to the second surface; and

[0149] a conductor layer formed in a predetermined pattern on the support layer,

[0150] the support layer has higher rigidity than the conductor layer,

[0151] the through-hole is formed so as to be able to house at least a portion of the electrical component inside the through-hole,

[0152] an inner peripheral surface of the through-hole includes a conductor layer formation region in which the conductor layer is formed, and a conductor layer non-formation region in which the conductor layer is not formed.

[0153] In this wiring circuit substrate, at least a portion of the electrical component can be disposed inside the through-hole of the support layer. In addition, since the conductor layer is formed on a portion of the inner peripheral surface of the through-hole, the electrical component can be electrically connected to the conductor layer inside the through-hole. By mounting the electrical component inside the through-hole in this way, compared to the case in which the electrical component is mounted on the first surface or the second surface, the structure (electrical component mounting substrate) in which the electrical component and the wiring circuit substrate are integrally connected is thinned.

[0154] In addition, the support layer of the above-described wiring circuit substrate has higher rigidity than the conductor layer, and thus has higher reliability in terms of mechanical strength, compared to a wiring circuit substrate composed only of an insulating layer having lower rigidity than the conductor layer and a conductor layer.

[0155] As a result, thinning of the structure including the electrical component at the time of mounting the electrical component is possible, and high reliability in terms of mechanical strength is obtained.

[0156] Item 7) The wiring circuit substrate assembly sheet of item 7 includes a plurality of the wiring circuit substrate of any one of items 1 to 6,

[0157] the wiring circuit substrate assembly sheet has a structure in which the plurality of wiring circuit substrates are integrally provided.

[0158] In this case, the plurality of wiring circuit substrates can be handled integrally.

Claims

1. A wiring circuit board, which is a wiring circuit board on which electrical components are mounted, the wiring circuit board comprising: A support layer having a first surface and a second surface facing opposite directions, and having a first through hole extending in a thickness direction intersecting the first surface and the second surface; An insulating layer that covers at least a portion of the first surface, at least a portion of the second surface, and the inner peripheral surface of the first through hole; as well as A conductor layer, which is formed in a predetermined pattern on the insulating layer. The support layer has higher rigidity than the insulating layer and the conductor layer. The portion of the insulating layer that covers the inner peripheral surface of the first through-hole forms a second through-hole, and the second through-hole extends along the thickness direction inside the first through-hole. The second through hole is formed to accommodate at least a portion of the electrical component inside the second through hole. The inner peripheral surface of the second through hole includes a conductor layer forming region where the conductor layer is formed, and a conductor layer non-forming region where the conductor layer is not formed.

2. The wiring circuit board according to claim 1, wherein, The support layer is formed of metal or resin.

3. The wiring circuit board according to claim 1 or 2, wherein, The electrical component has a terminal portion. With at least a portion of the electrical component housed within the second through hole, a portion of the conductor layer formed in the conductor layer forming region is opposite to the terminal portion of the electrical component.

4. The wiring circuit board according to any one of claims 1 to 3, wherein, The conductor layer includes: A first wiring portion is formed on the first surface through the insulating layer; A second wiring portion is formed on the second surface, with the insulating layer in between; and The intermediate conductor portion is formed inside the second through hole. The first wiring portion and the second wiring portion are electrically connected to the intermediate conductor portion.

5. The wiring circuit board according to any one of claims 1 to 4, wherein, With at least a portion of the electrical component housed in the second through-hole, the non-forming region of the conductor layer is separated from the electrical component.

6. A wiring circuit board, which is a wiring circuit board on which electrical components are mounted, said wiring circuit board comprising: A support layer, formed of an insulating material, has a first surface and a second surface facing opposite directions, and has through holes extending from the first surface to the second surface; and A conductor layer, which is formed in a predetermined pattern on the support layer, The support layer has higher rigidity than the conductor layer. The through hole is formed to accommodate at least a portion of the electrical component inside the through hole. The inner circumferential surface of the through hole includes a conductor layer forming region where the conductor layer is formed, and a conductor layer non-forming region where the conductor layer is not formed.

7. A wiring circuit board assembly, comprising a plurality of wiring circuit boards as described in any one of claims 1 to 6, The wiring circuit board assembly has a structure in which multiple wiring circuit boards are integrally disposed.

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