Corner guard protection for surface mount devices

Abstract

In some examples, a corner guard is provided for protecting a surface mount device (SMD) on a printed circuit board (PCB). An example corner shield includes a rigid structure configured to conform to a corner region of an SMD; and one or more mounting surfaces configured to mount the rigid structure to one or more pads on the PCB adjacent to the SMD.

Description

CLAIM OF PRIORITY

[0001] This application claims the benefit of priority of U.S. Provisional Application Serial No. 63 / 535,675, filed August 31, 2023, which is incorporated by reference herein in its entirety. BACKGROUND

[0002] Surface Mount Technology (SMT) is a method of mounting electrical components directly onto the surface of a Printed Circuit Board (PCB). Electrical components mounted in this manner can be referred to as Surface Mount Devices (SMD). Generally, SMDs are fragile components and usually require careful handling. However, in a few cases, despite their fragility, they are placed in locations that are more susceptible to mechanical stress due to design limitations. For example, SMDs can be placed at the edge of a PCB that is also used for holding during the assembly process, or near mounting holes that a screwdriver can accidentally hit the SMDs. Some SMDs can be located in areas that require tight fit assembly.

[0003] In such cases, mechanical impact and stress can cause permanent or potential damage to the SMD components. Among SMD components, ceramic capacitors and silicon body components such as diodes and Wafer Level Chip Scale Package (WCSP) Integrated Circuits (ICs) are typically the most susceptible to mechanical impact and suffer damage due to the inherent brittleness and fragility of their manufacturing materials.

[0004] Conventional efforts to address this issue in the electronics industry have included packaging methods. Encapsulating SMDs with epoxy or acrylate materials is a common practice to provide additional mechanical protection to the components, but this comes at the cost of occupying additional volume on the final product assembly. As user devices become smaller and smaller, the need to occupy additional volume can be undesirable. Current technology is trending towards miniaturization.

[0005] Other drawbacks of conventional encapsulation can include undesirable effects on thermal mitigation, thermal conduction, and thermal management. For example, in the case of radio frequency (RF) components or sensors, the functionality of the components can also be affected. Component reliability can also be affected, for example, when experiencing thermal cycling, the mismatch of the coefficient of thermal expansion (CTE) between the component and the encapsulation material can stress the device. The cyclic stress causes cracking, leading to SMD failure or complete loss of its functionality. The encapsulation process can also be expensive as it involves additional processes in assembly and requires expensive equipment to dispense and cure the encapsulation material, occupying a large amount of board real estate. BRIEF DESCRIPTION OF DRAWINGS

[0006] In the drawings, which are not necessarily drawn to scale, like numerals can describe similar components in different views. Some non-limiting examples are illustrated in the drawings, in which:

[0007] Figure 1 is a perspective view of a wearable device according to some example implementations.

[0008] Figure 2A is a schematic diagram of prior art and including an example SMD package.

[0009] Figure 2B is a top view of prior art and including an example SMD package.

[0010] Figure 2C is a side view of prior art and including an example SMD package.

[0011] Figure 3 shows an example corner guard.

[0012] Figure 4 and Figure 5 shows an example deployment of a corner guard.

[0013] Figure 6A is a top view of an example corner guard adjacent to a protected SMD.

[0014] Figure 6B is a top view of an example corner guard adjacent to a protected SMD. DETAILED DESCRIPTION

[0015] In some examples, a corner guard is provided that can be selectively placed at or adjacent to a corner of a device during an SMT process. The device can be an SMD device that is identified as being susceptible to additional mechanical or thermal stress during manufacture of a PCB or in use thereafter. If additional protection of the SMD protected by the corner guard is required by the manufacturing or working conditions, the corner guard can be constructed of a typical electromagnetic interference (EMI) shielding material (e.g., a nickel plated copper or aluminum alloy sheet) and / or include stainless steel.

[0016] Example corner guards exhibit a compact, rigid shape such that the corner guard can be manufactured, placed, and / or soldered to a pad that is located adjacent to one or more corners of a component (e.g., an SMD) for which additional protection is desired. In some examples, the corner guard can be picked up and placed by existing SMT equipment already used to assemble the PCB. This convenience can avoid additional investment in equipment.

[0017] For example, applying a protective corner guard to a given SMD can mitigate (if not avoid) an increase in reliability risk because, unlike the encapsulation material, the walls of the protected SMD component and the protective corner guard do not come into contact with each other. Unwanted or unexpected interactions that can arise from contact between the SMD and the corner guard can be reduced or avoided.

[0018] In some examples, even though the corner guard can occupy some "space," a relatively significant space saving can be achieved overall while still providing device protection. In some examples, the volume occupied by the corner guard is only about 25% of the volume occupied by the encapsulant.

[0019] To save costs, some examples can judiciously select one or more corners for protection while leaving other corners in their original (or unprotected) dimensions. Because the thermal cycling risks that arise from the overmold encapsulation material can escalate exponentially, conventional encapsulation processes do not necessarily allow for this selective placement.

[0020] These and other aspects and potential benefits are described more fully below.

[0021] As noted above, some examples of the present corner guard can be used to protect SMDs mounted on PCBs in user devices where available space is very limited. For example, one such device can be a head wearable device for viewing augmented reality. The present examples are possible for use in other space-limited devices. Although illustrative examples are described below in the context of a head wearable device such as eyeglasses, this should not be considered as limiting application. In other examples and applications, the corner guard can be used in any electronic device having PCB components therein.

[0022] For example, Figure 1 A perspective view of a head wearable device (e.g., eyeglasses 100) is shown in accordance with some example implementations. The form factor of the eyeglasses 100 is very compact, and the space available for internal components is very tight. In this case, the eyeglasses 100 can be worn to view augmented content displayed in a content interaction system. As a brief background, augmented reality technology aims to bridge the gap between virtual and real-world environments by providing an augmented real-world environment that is enhanced by electronic information. As a result, the electronic information appears to be part of the real-world environment as perceived by the user. In examples, augmented reality technology also provides a user interface to interact with the electronic information overlaid in this augmented real-world environment. To enhance the user experience in the augmented environment, it can be important for the augmented viewing device (e.g., eyeglasses 100) to be unobtrusive, compact, and lightweight.

[0023] Figure 1The example eyeglasses 100 can include a small frame 112 made of any suitable material, such as plastic or metal (including any suitable shape memory alloy). In one or more implementations, the frame 112 includes a front piece 138 that includes a first optical element holder or left optical element holder 122 (e.g., a display or lens holder) and a second optical element holder or right optical element holder 124 connected by a nose piece or bridge 130. The front piece 138 additionally includes a left end portion 116 and a right end portion 118. A first optical element or left optical element 126 and a second optical element or right optical element 128 can be disposed within the respective left optical element holder 122 and right optical element holder 124. Each of the right optical element 128 and the left optical element 126 can be a lens, a display, a display assembly, or a combination of the foregoing. Any of the display assemblies disclosed herein can be disposed in the eyeglasses 100.

[0024] The frame 112 additionally includes a left arm or temple piece 104 and a right arm or temple piece 106 that are coupled to the respective left end portion 116 and right end portion 118 of the front piece 138 by any suitable means, such as a hinge (not shown), so as to be coupled to or rigidly or otherwise fixed to or integral with or fixed to the front piece 138. In one or more implementations, each of the temple pieces 104 and 106 includes a first portion 114 that is coupled to the respective left end portion 116 or right end portion 118 of the front piece 138, and any suitable second portion 136 for coupling to an ear of a user. In one implementation, the front piece 138 can be formed of a single piece of material so as to have a unitary or integral structure. In one implementation, for example Figure 1 As shown, the entire frame 112 can be formed of a single piece of material so as to have a unitary or integral structure.

[0025] The eyeglasses 100 can include a computing device, such as a computer 132, which can be of any suitable type so as to be carried by the frame 112 and, in one or more implementations, have a suitable size and shape so as to be disposed at least partially in one of the temple pieces 104 and 106. In one or more implementations, as Figure 1As shown, the computer 132 is similar in size and shape to one of the temple pieces 106 (e.g., or the temple piece 104), and thus the computer 132 is disposed almost entirely (if not entirely) within the structure and confines of such a temple piece 106. In one or more embodiments, the computer 132 is disposed in both the temple piece 104 and the temple piece 106. The computer 132 can include one or more printed circuit boards (PCBs) and one or more hardware processors with memory, wireless communication circuitry, and a power source. In some examples, the computer 132 includes low-power circuitry, high-speed circuitry, and a display processor. Various other embodiments can include these elements in different configurations or integrated together in different ways.

[0026] The computer 132 additionally includes the battery 110 or other suitable portable power source. In one embodiment, the battery 110 is disposed in one of the temple pieces 104 or 106. In Figure 1 In the shown eyeglasses 100, the battery 110 is shown disposed in the left temple piece 104 and electrically coupled to the remainder of the computer 132 disposed in the right temple piece 106 using the connection 134. The eyeglasses 100 can include a connector or port (not shown) suitable for charging the battery 110 and contactable from the exterior of the frame 112, a wireless receiver, transmitter, or transceiver (not shown), or a combination of such devices.

[0027] In one or more implementations, eyeglasses 100 include a camera 102. Although two cameras are depicted, other implementations contemplate the use of a single or additional (i.e., more than two) cameras. In one or more implementations, eyeglasses 100 include any number of input sensors or peripherals in addition to camera 102. Front piece 138 is provided with an outward-facing, forward-facing, or front surface or outer surface 120 that faces forward or away from the user when eyeglasses 100 are mounted on the user’s face, and an opposite inward-facing, rear-facing, or rear surface or inner surface 108 that faces toward the user’s face when eyeglasses 100 are mounted on the user’s face. Such sensors can include inward-facing video sensors or digital imaging modules (such as a camera) that can be mounted on or disposed within inner surface 108 of front piece 138, or elsewhere on frame 112 so as to face the user, and outward-facing video sensors or digital imaging modules (such as camera 102) that can be mounted on or disposed within outer surface 120 of front piece 138, or elsewhere on frame 112 so as to face away from the user. Such sensors, peripherals, or peripherals can additionally include biometric sensors, location sensors, or any other such sensors. In one or more implementations, eyeglasses 100 include a track pad 140 or other touch or sensory input device to receive navigation commands from the user. One or more track pads 140 can be provided at convenient locations for user interaction on one or both of temple pieces 104 and 106.

[0028] As noted above, computer 132 of eyeglasses 100 can include one or more printed circuit boards (PCBs) and one or more hardware processors with memory, wireless communication circuitry, and a power source. The PCBs and components can include one or more SMDs. In some cases, due to design constraints, these SMDs are placed in locations that are more susceptible to mechanical stress and require enhanced protection. To this end, and with reference to Figure 2A , Figure 2B and Figure 2C Conventional attempts in the electronics industry have included encapsulating components with epoxy or acrylate materials to provide additional mechanical protection to the components. The cost of protection by encapsulation is a substantial additional volume that is taken up on final product assembly. In these views, SMD 202 is surface mounted on PCB 204 and enclosed in conventional encapsulation 206. Of note in Figure 2B In some conventional examples, the side thickness 226 or width of encapsulation 206 can be as much as about 1 millimeter (mm). In Figure 2CIn particular embodiments, the top thickness 236 of the package 206 can be as much as 0.3 mm.

[0029] In another aspect, referring to Figure 3 , example corner guards 302 of the present disclosure are provided for protecting SMDs 202 on a PCB 204. For example, in Figure 4 and Figure 5 example deployments of corner guards 302 for protecting SMDs 202 can be seen. Other deployments and / or configurations of corner guards 302 are possible.

[0030] In the illustrated example, the corner guard 302 includes a rigid structure 304 that is configured to conform to a corner region of the SMD 202. In Figure 4 , a single corner guard 302 is deployed to protect a single corner of a selected SMD 202. For example, the single corner of the SMD 202 can have been selected based on its increased exposure to, or risk of increased exposure to, high mechanical stresses. Other corner selection factors are also possible. In Figure 5 , for example, based on the selection of a single corner similar to Figure 4 , two diagonally opposite corners are selected for protection. It should be appreciated that the deployment of the corner guard 302 is highly configurable. Many other corner protection deployment configurations and / or corner selections for a given SMD 202 location are possible.

[0031] As shown, the rigid structure 304 of the corner guard 302 includes a first protective wall 306, a second protective wall 308 disposed or extending substantially orthogonal to the first protective wall 306, and a protective overhang structure 310. The orthogonal or lateral extending arrangement of the second protective wall 308 relative to the first protective wall 306 provides a degree of lateral or face support to the rigid structure 304 and enables a solid, stable, and secure footing on the PCB 204. The rigid structure 304 of the corner guard 302 is configured to absorb mechanical impacts and shocks to protect the SMD 202 from damage.

[0032] In some examples, the protective overhang structure 310 is shaped and arranged to define vents 312 or other channels or structures to help dissipate heat generated by the SMD 202. The vents 312 or channels can be defined or disposed between edges of the protective overhang structure 310 and edges of the first protective wall 306 and / or edges of the second protective wall 308. Other heat dissipation arrangements and / or vents are possible. In some examples, the open-sided configuration of the corner guard 302 can help release heat generated by the SMD 202. The first protective wall 306 and the laterally aligned second protective wall 308 do not define a fully enclosed structure that can trap heat like, for example, a conventional package. The open construction of the corner guard 302 also enables the selective application of heat-conductive gel into the open space, for example, under the protective overhang structure 310 or along either of the first protective wall 306 and / or the second protective wall 308. The heat-conductive gel can be applied to extend along the full length or a portion of the first protective wall 306 and / or the second protective wall 308.

[0033] The flat upper surface of the protective overhang structure 310 can also be used as a vacuum pick-up area or zone. For example, in a pick-and-place SMT process, a vacuum suction nozzle can be applied against the protective overhang structure 310 to apply vacuum pressure, lift and hold the corner guard 302 to move (or reposition) it to a desired location on a PCB for soldering. To this end, a formula can be used to determine the pick-up area of the protective overhang structure 310:

[0034] P = F / A, where P = pressure, F = force, A = area.

[0035] In an example, a typical SMT pick-and-place machine applies a negative pressure or vacuum pressure of 53.33 kPa or . Here, . For this example, assume a brass corner guard 302 is selected (ignoring the Ni finish), and assume the density of brass is approximately 8.5 g / cm 3 . For an example corner guard 302 made from a metal sheet of 2.5 mm x 2.5 mm x 0.2 mm, then the V (volume) of the corner guard 302 = 1.25 mm 3 or V = 0.00125 cm 3 . Using the formula m (mass) = d.V, then m = 0.01 g, or m = 0.00001 kg.

[0036] In considering the interaction between the above example corner guard 302 and an appropriate vacuum pick-up nozzle for picking up and placing the corner guard 302, let A = the area of the pick-up nozzle corresponding to the pick-up area of the protective overhang structure 310 available for pick-up. From the above equation, A = F / P, and by applying this equation, we arrive at A = 1.88e-6 m 2 or A = 1.88 mm 2 . Based on these calculation results, it can be determined that the size of the protective overhang structure 310 should be set to present a flat surface to present a pick-up area of > 1.88 mm 2 . To select an appropriately sized pick-up nozzle for this pick-up area, let a circular pick-up nozzle A = π.r2, where r > 0.77 mm. Accordingly, the protective overhang structure 310 and the vacuum pick-up nozzle can be constructed and selected to work together.

[0037] In some examples, the rigid structure 304 occupies a relatively small board footprint on the PCB 204 compared to a conventional package surrounding the SMD 202. For example, referring to Figure 6A , the wall thickness 602 of the example corner guard 302 can be less than 0.3 mm, and in some examples can include a wall thickness in the range of 0.05 mm to 0.30 mm. These relatively small dimensions can provide a significant board footprint reduction when compared to the 1 mm side thickness 226 of the conventional package 206, for example. The length of the first protective wall 306 can be in the range of 0.1 mm to 10 mm. The length of the second protective wall 308 can be in the range of 0.1 mm to 10 mm. In some examples, the length of the first protective wall 306 and the length of the second protective wall 308 can be the same or can be different. The height of the first protective wall 306 above the upper surface of the PCB can be in the range of 0.1 mm to 3 mm. The height of the second protective wall 308 above the upper surface of the PCB can be in the range of 0.1 mm to 3 mm. In some examples, the height of the first protective wall 306 and the height of the second protective wall 308 can be the same or can be different.

[0038] Further, in some examples, referring to Figure 6BThe overhang thickness 616 of the protective overhang 310 of the example corner guard 302 can be less than 0.15 mm, and in some examples can include an overhang thickness 616 in the range of 0.1 mm to 0.3 mm. These relatively small dimensions can also provide a significant volume reduction, alone or together with the reduced wall thickness, when compared to the 0.3 mm top thickness 236 of, for example, a conventional package 206. The length, height, or thickness of the corner guard 302 can be judiciously determined to minimize the volume it occupies over the corresponding or respective dimensions of the SMD 202 for which the corner guard 302 is selected to protect.

[0039] Each of the first and / or second protective walls 306, 308 has a lower side or lower mounting surface 314 configured to support the rigid structure 304 on the PCB 204. The mounting surface 314 can be attached or fixed to one or more pads 406 located on the PCB 204 and adjacent to the SMD 202. In some examples, the pads 406 can have been pre-installed on the PCB 204 based on their dimensions being configured to accommodate the corner guard 302. In some examples, the mounting surface 314 can be defined by a separate or integral mounting element or leg provided on the corner guard 302.

[0040] For example, applying a protective corner guard 302 to a given SMD can mitigate, if not avoid, an increase in reliability risks because, unlike the package material, in some examples, the protected SMD and the protective walls of the protective corner guard do not contact each other. In some examples, the protective corner guard 302 can also provide a protective barrier between the SMD 202 and the PCB 204, which can help to prevent or reduce the risk of damage to the SMD 202 and / or the PCB 204 from, for example, soldering or reflow processes. Figures 6A-6B In the example shown, a gap or spacing distance is visible between the protected SMD 202 and the first protective wall 306, and also between the SMD 202 and the second protective wall 308. The protective overhang 310 can also be located at a gap or spacing distance from the upper surface or point of the protected SMD 202, but in some examples (e.g., as shown in FIG. 3B) can contact or abut the upper surface or point of the protected SMD 202 to help secure the SMD 202 to the PCB 204 and / or provide increased stability under impact or shock. Figures 6A-6B In some examples, the protective overhang 310 of the corner guard 302 can be configured to contact or abut the upper surface or point of the SMD 202 to help secure the SMD 202 to the PCB 204 and / or provide increased stability under impact or shock.

[0041] In some examples, the rigid structure 304 is configured to be mounted to the PCB 204 using a standard surface mount technology (SMT) soldering process. In some examples, one or more mounting surfaces 314 (or mounting elements or legs) include a solderable surface that aligns with a pad on the PCB 204.

[0042] In some examples, the corner guard 302 can be mounted to the PCB using mechanical fasteners or adhesives or using a through-hole technique, but in some examples, soldering can be more convenient because additional fasteners and adhesives can negatively or unexpectedly interact with the SMD and / or take up available volume that would otherwise be available for components. Additionally, the convenience of being able to use existing SMT soldering processes avoids adding a completely new process to the assembly flow. Furthermore, because the corner guard 302 is typically made of metal or a metal material (e.g., stainless steel, copper, or aluminum or alloys thereof), the corner guard 302 can need to be electrically grounded. Soldering conveniently grounds the corner guard 302, whereas other protection methods such as potting do not give or provide this convenience.

[0043] In some examples, the rigid structure 304 is formed as a unitary one-piece structure. In other examples, the rigid structure 304 is formed from separate components. For example, the protective overhanging structure 310 can be attached to the first protective wall 306 or the second protective wall 308 as a separate part. In some examples, the rigid structure 304 is formed from a material selected from the group consisting of copper, aluminum, stainless steel, and alloys thereof.

[0044] Some examples of the present disclosure also include methods. To this end, a method for protecting an SMD on a PCB can include aligning a corner guard adjacent to a corner of the SMD, the corner guard including a rigid structure, the method further including soldering one or more mounting surfaces of the corner guard to pads on the PCB to mount the corner guard. The method can also include picking and placing the corner guard using standard SMT equipment. One advantage of using the corner guard 302 in such a method over standard potting is that the deployment of the corner guard 302 does not impact the "reworkability" of the PCB. In other words, the SMD protected by the corner guard 302 can still be de-soldered for replacement or repositioning elsewhere on the PCB. With potting, once the SMD is potted, it is not impossible, but it is very difficult to implement any repairs or rework to the PCB if desired in this case.

[0045] Examples

[0046] Example 1. A corner guard for protecting a surface mount device (SMD) on a printed circuit board (PCB), the corner guard comprising: a rigid structure configured to conform to a corner region of the SMD; and one or more mounting surfaces configured to mount the rigid structure to one or more pads on the PCB adjacent to the SMD.

[0047] Example 2. The corner guard of example 1, wherein the one or more mounting surfaces comprise solderable surfaces aligned with the one or more pads on the PCB.

[0048] Example 3. The corner guard of any one of examples 1 or 2, wherein the rigid structure comprises a first protective wall, a second protective wall, and a protective overhang structure.

[0049] Example 4. The corner guard of example 3, wherein the second protective wall is disposed substantially orthogonal to the first protective wall to extend laterally from the first protective wall.

[0050] Example 5. The corner guard of example 3, wherein the protective overhang structure is shaped and arranged to define a vent opening of the corner guard.

[0051] Example 6. The corner guard of example 5, wherein the vent opening is defined or disposed between an edge of the protective overhang structure and an edge of the first protective wall and / or an edge of the second protective wall.

[0052] Example 7. The corner guard of example 3, wherein a planar upper surface of the protective overhang structure defines or provides a vacuum pick-up area.

[0053] Example 8. The corner guard of example 3, wherein a length of the first protective wall is in a range of 0.1 mm to 10 mm.

[0054] Example 9. The corner guard of example 3, wherein a length of the second protective wall is in a range of 0.1 mm to 10 mm.

[0055] Example 10. The corner guard of example 3, wherein a height of the first protective wall above an upper surface of the PCB is in a range of 0.1 mm to 3 mm.

[0056] Example 11. The corner guard of example 3, wherein a height of the second protective wall above an upper surface of the PCB is in a range of 0.1 mm to 3 mm.

[0057] Example 12. The corner guard of example 3, wherein an overhang structure thickness of the protective overhang structure is in a range of 0.1 mm to 0.3 mm.

[0058] Example 13. The corner guard of any one of examples 1 to 12, wherein the rigid structure is formed of a material selected from a group comprising copper, aluminum, stainless steel, and alloys thereof.

[0059] Example 14. The corner guard of any one of examples 1 to 13, wherein the rigid structure is configured to be mounted to the PCB using a surface mount technology (SMT) soldering process.

[0060] Example 15. The corner guard of any one of examples 1-14, wherein the rigid structure is configured to absorb mechanical impacts and shocks to protect the SMD from damage.

[0061] Example 16. The corner guard of any one of examples 1-15, wherein the rigid structure is a unitary one-piece structure.

[0062] Example 17. The corner guard of any one of examples 1-16, wherein the rigid structure occupies a relatively small board footprint on the PCB compared to a package surrounding the SMD.

[0063] Example 18. A method for protecting a surface mount device (SMD) on a printed circuit board (PCB), the method comprising: aligning a corner guard adjacent to a corner of the SMD, the corner guard comprising a rigid structure; and soldering one or more mounting surfaces of the corner guard to corresponding pads on the PCB to mount the corner guard on the PCB.

[0064] Example 19. The method of example 18, further comprising using a surface mount technology (SMT) device to pick and place the corner guard.

[0065] Example 20. The method of example 18 or example 19, wherein the corner guard is configured to absorb mechanical impacts and shocks to protect the SMD from damage.

[0066] While the above is a detailed description of some embodiments of the inventive subject matter, various alternatives, modifications, and equivalents can be used. Therefore, the above description should not be taken as limiting the scope of the inventive subject matter as defined by the appended claims.

Claims

1. A corner protector for protecting surface mount devices (SMDs) on a printed circuit board (PCB), the corner protector comprising: A rigid structure, which is configured to conform to the corner region of the SMD; as well as One or more mounting surfaces are configured to mount the rigid structure to one or more pads on the PCB adjacent to the SMD.

2. The corner protector according to claim 1, wherein, The one or more mounting surfaces include solderable surfaces aligned with the one or more pads on the PCB.

3. The corner protector according to claim 1, wherein, The rigid structure includes a first protective wall, a second protective wall, and a protective overhang structure.

4. The corner protector according to claim 3, wherein, The second protective wall is substantially orthogonal to the first protective wall and extends laterally from the first protective wall.

5. The corner protector according to claim 3, wherein, The protective overhang structure is shaped and arranged to define the ventilation openings of the corner protector.

6. The corner protector according to claim 5, wherein, The vent is defined or located between the edge of the protective overhang structure and the edge of the first protective wall and / or the edge of the second protective wall.

7. The corner protector according to claim 3, wherein, The flat upper surface of the protective overhang structure defines or provides a vacuum pickup area.

8. The corner protector according to claim 3, wherein, The length of the first protective wall is in the range of 0.1 mm to 10 mm.

9. The corner protector according to claim 3, wherein, The length of the second protective wall is in the range of 0.1 mm to 10 mm.

10. The corner protector according to claim 3, wherein, The height of the first protective wall above the upper surface of the PCB is in the range of 0.1 mm to 3 mm.

11. The corner protector according to claim 3, wherein, The height of the second protective wall above the upper surface of the PCB is in the range of 0.1 mm to 3 mm.

12. The corner protector according to claim 3, wherein, The thickness of the protective overhang structure is in the range of 0.1 mm to 0.3 mm.

13. The corner protector according to claim 1, wherein, The rigid structure is formed of a material selected from the group consisting of copper, aluminum, stainless steel and their alloys.

14. The corner protector according to claim 1, wherein, The rigid structure is configured to be mounted to the PCB using surface mount technology (SMT) soldering.

15. The corner protector according to claim 1, wherein, The rigid structure is configured to absorb mechanical shocks and impacts to protect the SMD from damage.

16. The corner protector according to claim 1, wherein, The rigid structure is a single, integrated structure.

17. The corner protector according to claim 1, wherein, Compared to the package surrounding the SMD, the rigid structure occupies a relatively small footprint on the PCB.

18. A method for protecting surface mount devices (SMDs) on a printed circuit board (PCB), the method comprising: Align the corner guard with the corner of the SMD adjacent to it, the corner guard comprising a rigid structure; as well as One or more mounting surfaces of the corner protector are soldered to corresponding pads on the PCB to mount the corner protector on the PCB.

19. The method of claim 18, further comprising using surface mount technology (SMT) devices to pick up and place the corner protector.

20. The method according to claim 18, wherein, The corner protector is configured to absorb mechanical shocks and impacts to protect the SMD from damage.

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