Heat sink for releasably securing to cooling unit, and cooling unit having releasably fixable heat sink

Abstract

The invention relates to a heat sink for cooling a unit to be cooled, in particular an electronic unit, preferably a semiconductor component. The heat sink has a cooling channel and a first cooling wall arranged on a cooling channel surface facing the unit to be cooled. The radiator additionally comprises a coolant supply and a coolant discharge, both of which are in fluid connection with the cooling channel for supplying and discharging a coolant, in particular a coolant, preferably cooling water. The heat sink is designed such that the unit to be cooled can be mechanically and thermally connected to the cooling wall. Additionally, the heat sink is designed such that the heat sink may be releasably secured to a cooling unit comprising a first fluid port and a second fluid port, and when the heat sink is secured to the cooling unit, a first fluid connection may be created between a coolant supply of the heat sink and the first fluid port of the cooling unit, and a second fluid connection may be created between the coolant supply of the heat sink and the second fluid port of the cooling unit. And creating a second fluid connection between the coolant discharge of the heat sink and the second fluid port of the cooling unit. The heat sink is designed such that when the heat sink is secured to the cooling unit, a fluid tight seal of the first fluid connection and a fluid tight seal of the second fluid connection are produced simultaneously.

Description

TECHNICAL FIELD

[0001] The present invention relates to a heat sink for dissipating heat from a unit to be cooled, in particular an electronic unit, preferably a semiconductor assembly. The present invention further relates to an electronic assembly, a cooling unit and a cooling device for supplying a coolant to the heat sink. Furthermore, the present invention relates to a method for assembling a cooling device starting from a heat sink and a cooling unit. The present invention also relates to a power converter for an industrial process assembly, preferably a plasma process assembly or a heating assembly. BACKGROUND

[0002] The present invention belongs to the field of power conversion for special power-intensive and unstable industrial processes, such as plasma excitation, plasma coating processes, gas laser excitation, particle accelerators, charging and discharging systems for large batteries, such as flow batteries, solid melting, heating of liquids and / or vaporization of liquids by, for example, microwave energy or induction heating. A common feature of all these processes is that they are designed to generate and accelerate charged atomic particles in a gas and / or plasma environment or in a liquid. Another common feature of all these processes is that they have a high power consumption in the range of 1 kW or more, in particular 10 kW or more, preferably 100 kW or more. Many of these processes also have very high requirements for the stability of the power supply, since these processes are highly complex, such as semiconductor manufacturing using plasma processes and / or heating by electromagnetic fields. Usually, the power is converted from mains frequencies in the range of about 50 Hz to 60 Hz to different frequencies, which can be in the range of 1 kHz to 200 MHz. Conversion to direct current power, also called DC power, is also conceivable. Converting the power to other frequencies requires a plurality of electronic components and assemblies, in particular power semiconductor devices, such as transistors or diodes, which are designed for currents > 10 A and voltages > 400 V. These electronic components and assemblies generate waste heat during operation. The waste heat usually occurs in very limited areas of only a few mm 2 . Dissipating this waste heat to protect the components and / or assemblies from damage due to overheating is a particular challenge. Usually, very large and material-intensive heat sinks are used for this purpose, which are very expensive to produce.

[0003] In the prior art, heat is dissipated by cooling using cooling plates. When cooling with such conventional cooling plates, heat transfer from the electronic components, which can have a copper layer, to the cooling medium is achieved by applying a material such as a thermal paste to the thermal interface, thereby dissipating the generated heat. Such thermal interface material is disadvantageous. Firstly, it constitutes a further heat transfer with thermal resistance; and secondly, it is susceptible to wear, which degrades its effectiveness during operation. The surface area of the cooling plates is also increased, or the number of components is reduced and the performance of the components is reduced, in order to dissipate a large amount of heat or to generate a smaller amount of heat. Both options are insufficient. Since the installation space in the housing of such a power supply device is limited, the cooling surface cannot be expanded indefinitely. Reducing the performance of the individual components is also not a viable solution. Overall, insufficient cooling of the electronic components can lead to cost problems.

[0004] In many technical applications, in particular in the field of power electronics, it is necessary to decouple the unit to be cooled, for example a semiconductor element or a semiconductor assembly, from the rest of the assembly, if necessary. In order to enable the unit to be cooled to be releasably attached to a heat sink, the unit to be cooled is usually releasably attached to the associated heat sink, for example using a thermally conductive paste. This leads to the disadvantage of a relatively poor thermal coupling between the unit to be cooled and the heat sink.

[0005] Object of the invention It is an object of the present invention to provide a heat sink, an electronic assembly, a cooling device and a cooling unit which improve the thermal coupling between the heat sink and the unit to be cooled and which improve the ease of maintenance. Summary of the invention

[0006] This object can be achieved by using a heat sink for dissipating heat from a unit to be cooled, in particular an electronic unit, preferably a semiconductor assembly. The heat sink comprises a cooling channel and a first cooling wall arranged at a side of the cooling channel facing the unit to be cooled. Furthermore, the heat sink comprises a coolant supply and a coolant discharge, both fluidically connected with the cooling channel for supplying and discharging a coolant, in particular a cooling liquid, preferably cooling water. The heat sink is configured such that the unit to be cooled can be mechanically and thermally connected with the first cooling wall. Furthermore, the heat sink is configured such that the heat sink can be releasably fixed to the cooling unit comprising a first fluid port and a second fluid port and that, when the heat sink is fixed to the cooling unit, a first fluid connection between the coolant supply of the heat sink and the first fluid port of the cooling unit and a second fluid connection between the coolant discharge of the heat sink and the second fluid port of the cooling unit can be established. The heat sink is configured such that, when the heat sink is fixed to the cooling unit, a fluid tight seal is established in both the first fluid connection and the second fluid connection simultaneously. The heat sink is further configured such that it can be mechanically connected with the unit to be cooled which is connected with a circuit board, in particular with a plurality of connections. In this way, the unit to be cooled can be cooled very effectively by the heat sink. Thus, when the circuit board together with the unit to be cooled is removed from the cooling unit and, for example, separated from the cooling unit, the heat sink can stay on the unit to be cooled. This allows a very effective and reliable configuration of the heat transfer between the unit to be cooled and the heat sink.

[0007] A "fluid connection" is a connection designed to allow a fluid to flow through.

[0008] A "fluid port" is an opening designed to allow a fluid to pass through and to allow components with similar openings to be connected therewith, such that the fluid can be guided through the openings.

[0009] The heat sink enables the heat sink to be releasably fixed in the cooling unit. The cooling unit is configured to supply coolant to the heat sink and to discharge coolant. The heat sink can be configured, for example, such that, when the heat sink is fixed to the cooling unit, a fluid-tight fluid connection between the heat sink and the cooling unit can be established. If necessary, the heat sink together with the unit to be cooled attached to the heat sink can be removed from the cooling unit. This is particularly advantageous from the perspective of maintenance and repair. According to embodiments of the present application, the unit to be cooled can be removed from the cooling unit together with the heat sink.

[0010] The improvement makes it possible, for example, to mechanically fixedly connect the unit to be cooled to the heat sink. The result of the improvement is preferably to make the connection between the unit to be cooled and the heat sink as thin as possible and to use as little additional material as possible. In the course of the considerations, simulations and experiments for the improvement, it became clear that this is particularly possible when the heat sink through which the fluid flows is fixedly connected to the unit to be cooled, in particular by a material bond. This can be achieved, for example, by brazing, sintering, crimping or direct copper bonding (DCB). The term "fixedly" can mean here: "only able to be disassembled destructively", i.e. using a connection device that cannot be disassembled without damaging the unit to be cooled 10 or the heat sink 5 or both components, even with a tool. Also in this case, the unit to be cooled can be removed from the cooling unit together with the heat sink, for example for maintenance purposes. The mechanical fixed attachment of the unit to be cooled to the heat sink can achieve an improved thermal coupling between the unit to be cooled and the heat sink and a better heat transfer from the unit to be cooled to the heat sink.

[0011] Furthermore, the improvement relates to an electronic assembly comprising a heat sink as described above and a unit to be cooled mechanically fixedly connected to the heat sink.

[0012] During the improvement, the electronic assembly comprising the heat sink and the unit to be cooled mechanically fixedly connected to the heat sink can be inserted into and removed from the cooling unit, for example as a whole. This makes it possible to access the unit to be cooled.

[0013] The improvement also relates to a cooling unit for supplying a coolant to a heat sink, said coolant being in particular a coolant liquid, preferably a coolant water, and said heat sink having a coolant supply and a coolant discharge. The cooling unit has a first flow channel and a second flow channel. Furthermore, the cooling unit comprises a first fluid port in fluid connection with the first flow channel and a second fluid port in fluid connection with the second flow channel. The cooling unit is configured such that the heat sink can be releasably fixed to the cooling unit and such that, when the heat sink is fixed to the cooling unit, a first fluid connection between the coolant supply of the heat sink and the first fluid port of the cooling unit and a second fluid connection between the coolant discharge of the heat sink and the second fluid port of the cooling unit can be established. Furthermore, the heat sink is configured such that, when the heat sink is fixed to the cooling unit, a fluid-tight seal is established simultaneously in the first fluid connection and in the second fluid connection. The heat sink is also configured such that it can be mechanically connected to a unit to be cooled, which is connected to the circuit board by means of one connection, in particular a plurality of connections. In this way, the unit to be cooled can be cooled very effectively by means of the heat sink. Thus, when the circuit board together with the unit to be cooled is removed from the cooling unit and, for example, separated from the cooling unit, the heat sink can remain on the unit to be cooled. This allows a very effective and reliable configuration of the heat transfer between the unit to be cooled and the heat sink.

[0014] The cooling unit can be designed, for example, to supply a single heat sink with coolant, but the cooling unit can also be designed, for example, to supply a plurality of heat sinks with coolant and to discharge the coolant after it has flowed through the heat sinks. In this way, a cooling system is formed which can be accessed if necessary.

[0015] Furthermore, the improvement relates to a cooling device comprising a cooling unit as described above and a heat sink as described above, which is releasably connected to the cooling unit.

[0016] Furthermore, the improvement relates to an electrical power converter for an industrial process assembly, preferably a plasma process assembly or a heating assembly, having - a heat sink as described above and as described below, - a circuit board, - a unit to be cooled, in particular an electronic unit, preferably a semiconductor assembly, preferably having a power semiconductor component, - a further electronic component, wherein the further electronic component and the unit to be cooled are arranged on or at the circuit board and are connected to the electrical contact, wherein the unit to be cooled is fixedly connected, in particular materially bonded, to the heat sink, and the unit to be cooled is fixedly connected to the circuit board by means of a plurality of connections, in particular by means of soldering.

[0017] In one aspect, the power converter has a cooling unit as described herein.

[0018] In one aspect, the power converter has a cooling device as described herein.

[0019] In one aspect, the power converter has one or more of the heat sinks described herein as further heat sinks.

[0020] In one aspect, the power converter has one or more of the electronic components described herein as further electronic components.

[0021] A preferred result of this improvement is to make the connection between the unit to be cooled and the heat sink as thin as possible and to use as little additional material as possible. In the course of the considerations, simulations and experiments made for this improvement, it became clear that this is particularly possible when the heat sink through which the fluid flows is fixedly connected, in particular by means of a material bond, to the unit to be cooled. This can be achieved, for example, by soldering, sintering, crimping or direct copper bonding (DCB). The term "fixedly" can mean here: "only able to be dismantled destructively", i.e. using a connection device that cannot be disassembled without damaging the unit to be cooled or the heat sink or both components, even with a tool.

[0022] Furthermore, the improvement relates to a method for assembling a cooling device starting from a heat sink for dissipating heat from a unit to be cooled, in particular an electronic unit, preferably a semiconductor component, and a cooling unit. The heat sink has cooling channels, a coolant supply connected fluidically to the cooling channels and a coolant discharge connected fluidically to the cooling channels. The cooling unit comprises a first fluid port and a second fluid port. The method comprises the following steps: releasably fixing the heat sink to the cooling unit, wherein, when the heat sink is fixed to the cooling unit, a first fluid connection is produced between the coolant supply of the heat sink and the first fluid port of the cooling unit and a second fluid connection is produced between the coolant discharge of the heat sink and the second fluid port of the cooling unit. Simultaneously, a fluid-tight seal is produced in the first fluid connection and the second fluid connection when the heat sink is fixed to the cooling unit.

[0023] Advantageous embodiments and improvements, which can be used individually or in combination, are the dependent claims and the subject matter described below.

[0024] The coolant supply and the coolant discharge of the heat sink are preferably arranged at the side of the heat sink facing away from the unit to be cooled. This makes it possible, for example, to bring the heat sink into fluid contact on the side of the heat sink facing away from the unit to be cooled.

[0025] In one aspect, the heat sink can be releasably fixed to the cooling unit by at least one fixing device, preferably at least one screw. The at least one fixing device can preferably be configured to create a fluid connection between the heat sink and the cooling unit, such that a fluid-tight seal is achieved. The fixing device can preferably be a fixing device that can be easily disassembled with or without tools.

[0026] The connection between the heat sink and the cooling unit can in particular be more easily disassembled than the connection between the heat sink and the unit to be cooled.

[0027] The connection between the heat sink and the cooling unit can in particular be carried out in a single step by sealing the fluid ports.

[0028] It is advantageous if the fluid-tight seal of the first fluid connection and the second fluid connection can be created with at least one fixing device that is accessible from the side of the first cooling wall. The fact that the at least one fixing device is accessible from the side of the first cooling wall makes it easier to handle the insertion of the heat sink into the cooling unit and the removal from the cooling unit.

[0029] In one aspect, the heat sink can be pressed against the cooling unit by at least one fixing device, such that a fluid-tight fluid connection can be created between the first fluid port of the cooling unit and the coolant supply of the heat sink and between the second fluid port of the cooling unit and the coolant discharge of the heat sink. For example, the at least one fixing device can be configured such that, when the heat sink is fixed to the cooling unit, a contact force can be created that presses the first fluid port and the second fluid port of the cooling unit against the coolant supply and the coolant discharge of the heat sink.

[0030] It is advantageous if the cooling device comprises a first sealing element designed to create a liquid-tight first fluid connection when the heat sink is fixed to the cooling unit. By means of the first sealing element, a fluid-tight first fluid connection can be created, for example when the heat sink is fixed to the cooling unit. For example, when the heat sink is pressed onto the cooling unit, the first sealing element can be deformed, such that the connection between the first cooling port and the coolant supply is sealed. The first sealing element is preferably a first sealing ring that surrounds the first fluid port.

[0031] In one aspect, the cooling device comprises a second sealing element which is designed to produce a liquid-tight second fluid connection when the heat sink is fixed to the cooling unit. By means of the second sealing element, a fluid-tight second fluid connection can be produced, for example when the heat sink is fixed to the cooling unit. The second sealing element is preferably a second sealing ring which surrounds the second fluid port.

[0032] In one aspect, the heat sink is configured in such a way that, when the heat sink is fixed to the cooling unit, a cooling flow can be produced from the first fluid port to the coolant supply, via the cooling channel and the coolant discharge, to the second fluid port. In this way, the heat sink can be supplied with coolant from the cooling unit, for example.

[0033] In one aspect, the heat sink consists of metal, preferably of copper. The high thermal conductivity of copper enables efficient heat dissipation from the unit to be cooled.

[0034] In one aspect, the unit to be cooled is mechanically and thermally connected to the heat sink. An electronic assembly configured in this way has a heat sink which has one or more of the features described here. The unit to be cooled, which is fixedly connected to the heat sink, is designed to be fixedly connected, in particular by means of a solder connection, in particular by means of a plurality of connections, to the circuit board.

[0035] In one aspect, the unit to be cooled is connected to the heat sink by at least one of the following: by at least one solder connection, by at least one welding connection, by sintering. If, for example, the heat sink is fixedly soldered to the unit to be cooled, the soldering enables an improved thermal coupling. An improved thermal coupling between the heat sink and the unit to be cooled can also be achieved, for example, by a welding connection or by sintering.

[0036] In one aspect, the unit to be cooled is connected to the heat sink by means of a layer of thermally conductive paste. In this case too, it can be advantageous to be able to remove the heat sink from the cooling unit if necessary.

[0037] In one aspect, the electronic assembly described above has a circuit board to which the unit to be cooled is fixedly mechanically connected. This fixed mechanical connection can be achieved, for example, by soldering electrical terminals of the unit to be cooled to the circuit board. In this embodiment, the circuit board, the unit to be cooled and the heat sink form a structural unit which can be inserted as a whole, for example, into the cooling unit.

[0038] In one aspect, the electronic assembly comprises a plurality of units to be cooled having a fixed mechanical connection with the circuit board, and a plurality of heat sinks. The electronic assembly and its plurality of heat sinks can be inserted as a whole into the cooling unit. The fact that the electronic assembly can be removed from the cooling unit, for example, facilitates maintenance.

[0039] In one aspect, the cooling unit has at least one receiving device for at least one fixing device.

[0040] In one aspect, the heat sinks can be fixed by at least one fixing device which is accessible from the side of the first cooling wall, which engages in at least one receiving device. If the at least one fixing device engages in the at least one receiving device on the side of the cooling unit, the heat sinks can be fixed to the cooling unit, for example.

[0041] In one aspect, the fluid-tight sealing of the first fluid connection and the second fluid connection can be achieved with at least one fixing device which is accessible from the side of the unit to be cooled. If the at least one fixing device is accessible from the side of the unit to be cooled, it can facilitate the insertion or removal of the heat sinks into or from the cooling unit.

[0042] It is advantageous if the cooling unit has a receiving portion into which the heat sinks can be inserted. This, for example, enables the heat sinks to be fixed to the cooling unit precisely fitting.

[0043] In one aspect, the cooling unit is configured to supply coolant to the plurality of heat sinks and to remove coolant from the plurality of heat sinks.

[0044] In one aspect, the cooling unit has a plurality of receiving portions into which the plurality of heat sinks can be inserted. Thus, the electronic assembly with the plurality of heat sinks can be inserted as a whole into the receiving portions of the cooling unit.

[0045] In one aspect, the cooling unit is wholly or partially composed of metal, or wholly or partially composed of a plastic material.

[0046] In one aspect, recesses are provided in the cooling unit into which the ducts can be pressed. The ducts may, for example, comprise a first flow channel for supplying coolant and a second flow channel for discharging coolant.

[0047] In one aspect, the duct wall is wholly or predominantly composed of a material having a higher thermal conductivity compared to other regions of the cooling unit, preferably of copper. The high thermal conductivity of the duct wall may, for example, further improve the heat dissipation of the units to be cooled.

[0048] In one aspect, the cooling unit comprises a distribution unit having a first fluid port and a second fluid port. The distribution unit is preferably configured to supply coolant to at least one heat sink and to drain the returned coolant.

[0049] It is advantageous if the distribution unit is configured as a cooling insert which is composed of a material having a higher thermal conductivity compared to other areas of the cooling unit, preferably of copper. For example, the cooling insert can be in thermal contact with the heat sink, so that the heat dissipation of the heat sink is improved by the thermal contact with the cooling insert. This saves costs and weight, since the entire carrier unit does not have to be made of a more expensive and usually heavier material, for example copper.

[0050] In one aspect, the cooling unit comprises a carrier unit. The distribution unit can be inserted into the carrier unit.

[0051] In one aspect, the carrier unit is wholly or partially composed of metal, preferably of aluminum.

[0052] In one aspect, within the cooling device, a cooling flow can be generated from the first fluid port to the coolant supply, via the cooling channel and the coolant drain, to the second fluid port. This cooling flow can be used, for example, to remove the heat generated by the unit to be cooled.

[0053] In one aspect, the cooling unit is designed to supply coolant, in particular cooling liquid, preferably cooling water, to the heat sink via the first fluid port and to drain the coolant from the heat sink via the second fluid port.

[0054] Further advantageous configurations are described in more detail below with reference to a plurality of exemplary embodiments shown in the drawings, however, the improvement is not limited to these exemplary embodiments. In the drawings, in each case schematically. BRIEF DESCRIPTION OF DRAWINGS

[0055] Figure 1 A longitudinal section through a unit to be cooled, a heat sink and a cooling unit supplying coolant to the heat sink is shown; Figure 2 A circuit board on which two units to be cooled are arranged is shown, wherein the circuit board can be releasably attached to the cooling unit; Figure 3 An industrial process component, preferably a plasma process component or a heating component with a heat sink is shown; Figure 4a A sectional view of a circuit board on which a unit to be cooled is arranged together with a carrier unit is shown; Figure 4b A view of the entire carrier unit on which a circuit board is arranged is shown; Figure 5Another view of the carrier unit is shown in a longitudinal section; Figure 6 A section view of the carrier unit from an oblique angle from the bottom side is shown, in which the cooling insert and the tubing for the fluid supply of the cooling insert can be seen; Figure 7 A section view of the entire carrier unit from an oblique angle from the bottom side is shown, in which the cooling insert, the tubing and the coolant connection can be seen. DETAILED DESCRIPTION

[0056] In the following description of preferred embodiments of the present improvement, the same reference signs designate the same or similar parts.

[0057] Figure 1 The cooling device is shown in a longitudinal section. The cooling device comprises a heat sink 5, which is configured to cool a unit 10 to be cooled attached to the heat sink 5. The unit 10 to be cooled can in particular be an electronic unit, preferably a semiconductor assembly.

[0058] The heat sink 5 is releasably connected to the cooling unit 22. In the example shown in the figures, the cooling unit 22 comprises a distribution unit 20 designed to supply coolant to the heat sink 5. Furthermore, the cooling unit 22 comprises a carrier unit 21 into which the distribution unit 20 is inserted. The cooling unit 22 has a receptacle 23 into which the heat sink 5 can be releasably inserted. The heat sink 5 is then secured to the cooling unit 22 by at least one securing means 15, preferably by one or more screws. The cooling unit 22 has at least one receiving means 16 for the at least one securing means 15. In order to separate the heat sink 5 from the cooling unit 22, the at least one securing means 15 is first disassembled. The heat sink 5 can then be removed together with the unit 10 to be cooled attached thereto from the receptacle 23 of the cooling unit 22.

[0059] The unit to be cooled 10 is preferably mechanically and thermally connected to the heat sink 5. The unit to be cooled 10 can be connected to the heat sink 5, for example, by one or more solder connections. Another possibility is to connect the unit to be cooled 10 to the heat sink 5, for example, by sintering. Alternatively, the unit to be cooled 10 can be welded to the heat sink 5. As a further, albeit less advantageous alternative, the unit to be cooled 10 can also be connected to the heat sink 5 by means of a thermally conductive paste layer. However, the result of this refinement is to make the connection between the unit to be cooled 10 and the heat sink 5 as thin as possible and to use as little additional material as possible. In the course of the considerations, simulations and experiments made for this refinement, it became apparent that this is particularly possible when the heat sink through which the fluid flows is fixedly connected to the unit to be cooled 10, in particular by a material bond. This can be achieved, for example, by soldering, sintering, crimping or direct copper bonding (DCB). The term "fixedly" can mean here: "only able to be dismantled destructively", i.e. using a connection device that cannot be disassembled without damaging the unit to be cooled 10 or the heat sink 5 or both components, even with a tool. It was also recognized that such a solution would only be feasible if new solutions for the interchangeability of the component circuit board 75 with electronic components, in particular with the cooling unit 10 fixed to the component circuit board, could be found. This is achieved with the proposed heat sink 5.

[0060] The heat sink 5 and the unit to be cooled 10, which is fixedly connected mechanically to the heat sink 5, together form an electronic assembly 24. This electronic assembly 24 can be inserted into the accommodation 23 of the cooling unit 22 and removed from the accommodation 23.

[0061] The cooling unit 22 is designed to supply coolant to the heat sink 5 attached to the cooling unit 22 and to discharge the coolant again after it has flowed through the heat sink 5. Inside the cooling unit 22 a first flow channel 25 can be seen through which the coolant can be supplied to the heat sink 5. Inside the cooling unit 22 a second flow channel 30 can be seen through which the coolant can be discharged. The heat sink 5 has a cooling channel 35 through which the coolant can flow. At a first end of the cooling channel 35 a coolant supply 40 is provided and at a second end of the cooling channel 35, opposite the first end, a coolant discharge 45 is provided. The coolant supply 40 and the coolant discharge 45 are fluidically connected to the cooling channel 35.

[0062] The cooling unit 22 comprises a first fluid port 41 fluidly connected to the first flow channel 25 and a second fluid port 46 fluidly connected to the second flow channel 30. When the heat sink 5 is inserted and subsequently fixed in the accommodation 23, a first fluid connection between the first fluid port 41 and the coolant supply 40 is created and a second fluid connection between the second fluid port 46 and the coolant drain 45 is created.

[0063] To seal the first fluid connection, a first sealing ring 42 is arranged in the recess 43 between the cooling unit 22 and the heat sink 5, wherein the sealing ring 42 completely surrounds the first fluid port 41. Likewise, a second sealing ring 44 is provided at the second fluid port 46, which completely surrounds the second fluid port 46, and which is arranged in the recess 43 between the cooling unit 22 and the heat sink 5. When the at least one fixing device 15 is fixed, for example when the at least one screw is tightened, the heat sink 5 is pressed against the first fluid port 41 and the first sealing ring 42 and against the second fluid port 46 and the second sealing ring 44. The application of this pressure creates a liquid-tight first fluid connection and a liquid-tight second fluid connection between the cooling unit 22 and the heat sink 5.

[0064] As shown in Figure 1 , a cooling flow 36 can be created within the cooling device. Coolant flows from the first flow channel 25 via the first fluid port 41 and the coolant supply 40 into the cooling channel 35. The coolant flows through the cooling channel 35 and is drained again via the coolant drain 45, the second fluid port 46 and the second flow channel 30.

[0065] The heat sink 5 has a first cooling wall 50 on the side facing the unit 10 to be cooled. On the side of the heat sink 5 facing away from the unit 10 to be cooled, the cooling channel 35 is bounded by a second cooling wall 55 opposite the first cooling wall 50. Preferably, the second cooling wall 55 is configured parallel to the first cooling wall 50.

[0066] In the example shown in Figure 1 , the unit 10 to be cooled comprises an arrangement of transistors 60. Heat generated during the operation of the transistors 60 is dissipated via the coolant flowing in the cooling channel 35.

[0067] To improve the heat exchange between the coolant flowing through the cooling channel 35 and the heat sink 5, a plurality of cooling pins 65 can be arranged inside the cooling channel 35, which extend from the first cooling wall 50 and / or from the second cooling wall 55 into the cooling channel 35. The cooling pins 65 have coolant flowing around them and ensure an improved thermal coupling between the heat sink 5 and the coolant.

[0068] In the example shown in Figure 1It can also be seen that the unit to be cooled 10 is arranged together with the heat sink 5 arranged thereunder in the first recess 70 of the circuit board 75.

[0069] In Figure 2 It can be clearly seen in that the arrangement of the unit to be cooled 10 in the first recess 70 of the circuit board 75. Figure 2 A circuit board 75 arranged on the cooling unit 22 is shown. The unit to be cooled 10 together with the associated heat sink 5 is shown in longitudinal section in the first recess 70 of the circuit board 75. The heat sink 5 is inserted into the accommodation 23 of the cooling unit 22.

[0070] In addition to the unit to be cooled 10, Figure 2 It can be seen in that a further unit to be cooled 80, and a further heat sink 85 arranged thereunder. The further unit to be cooled 80 is arranged in a further recess 90 provided in the circuit board 75, and the associated further heat sink 85 is inserted into a further accommodation 92 of the cooling unit 22. The further heat sink 85 has a further cooling channel 95 through which a coolant flows. It can also be seen on the further unit to be cooled 80 that electrical connection terminals 105 are provided for producing an electrical connection between the further unit to be cooled 80 and the circuit board 75. The unit to be cooled 10 also has electrical connection terminals for connecting to the circuit board 75, but these are not shown in Figure 2 .

[0071] Figure 2 The cooling unit 22 shown is designed to supply coolant to a plurality of heat sinks, and to discharge the coolant again after it has flowed through the heat sinks. In Figure 2 the example shown, the cooling unit 22 is designed to supply coolant to both the heat sink 5 and the further heat sink 85, and to discharge the coolant again subsequently from both the heat sink 5 and the further heat sink 85. The cooling unit 22 is in particular designed to distribute the coolant evenly between the individual heat sinks.

[0072] When the further heat sink 85 is fixed to the further accommodation 92, it is also fluidically connected to the cooling unit 22. In Figure 2 It can be seen in the sectional view that the further cooling channel 95 is connected to the second flow channel 30 via the further coolant outlet 100 and the further second fluid port 102, through which the coolant is discharged.

[0073] Figure 1 It is shown that the plurality of cooling pins 65 extending from the first cooling wall 50 into the cooling channel 35 can be arranged in the cooling channel 35 or in a portion of the cooling channel 35.

[0074] Figure 1It is further shown that the plurality of cooling pins 65 can comprise at least one cooling pin of a first category, which is oriented in a first oblique direction, which is obliquely inclined with respect to the perpendicular of the first cooling wall 50.

[0075] Figure 1 It is further shown that the cooling pins of the plurality of cooling pins 65 can be arranged such that one cooling pin of the plurality of cooling pins 65 does not intersect another cooling pin of the plurality of cooling pins 65.

[0076] Figure 1 It is further shown that the plurality of cooling pins 65 can comprise at least one cooling pin of a second category, which is oriented in a second oblique direction, which is obliquely inclined with respect to the perpendicular of the first cooling wall, wherein the second oblique direction is different from the first oblique direction. In this embodiment, the plurality of cooling pins 65 comprises cooling pins of a first category, which are oriented in the first oblique direction, and cooling pins of a second category, which are oriented in the second oblique direction. The different orientations of the cooling pins create a flow pattern in the cooling channel 35, which has proven to be advantageous for an efficient heat dissipation.

[0077] Figure 1 It is further shown that the plurality of cooling pins 65 can be arranged such that the cooling pins of the first category overlap the cooling pins of the second category in a viewing angle parallel to the cooling wall, in particular in a viewing angle of the coolant flow direction. “Overlap” here means that at least one cooling pin of the first category at least partially covers another cooling pin of the second category in the given viewing direction. Such an arrangement can improve the turbulence of the coolant at the cooling pins and thus the heat transfer from the cooling pins to the coolant.

[0078] Figure 1 It is further shown that the plurality of cooling pins 65 can be arranged such that the cooling pins of the first category interweave the two cooling pins of the second category in a viewing angle parallel to the cooling wall, in particular in a viewing angle of the coolant flow direction. The term “interweave” here means that at least one first cooling pin of the first category at least partially covers a second cooling pin of the second category in the given viewing direction, and that the first cooling pin itself is at least partially covered by a further cooling pin of the second category in the given viewing direction. Such an arrangement can further improve the turbulence of the coolant at the cooling pins and thus the heat transfer from the cooling pins to the coolant.

[0079] Figure 2The illustrated circuit board 75 forms a structural unit together with the to-be-cooled units 10 and 80 fixed to the circuit board 75 and the heat sinks 5 and 85, which structural unit can be placed as a whole on the cooling unit 22 and removed from the cooling unit and which structural unit is therefore releasably connected to the cooling unit 22. When the structural unit is placed on the cooling unit 22, the heat sinks 5, 85 attached to the to-be-cooled units 10, 80 are inserted into the corresponding receptacles 23, 92 of the cooling unit 22. Subsequently, the heat sinks 5, 85 are fixed to the cooling unit 22 by means of at least one fixing device 15, wherein, when the heat sinks 5, 85 are fixed to the cooling unit 22, fluid connections for the supply and discharge of coolant between the respective heat sinks 5, 85 and the cooling unit 22 are produced. The cooling unit 22 is designed to supply coolant uniformly to all heat sinks 5, 85 of the structural unit and to discharge the coolant after it has flowed through the heat sinks 5, 85.

[0080] Figure 3 An industrial process component 1, preferably a plasma process component or a heating component, is shown.

[0081] The industrial process component 1 has: - a power converter 4, - a load 2, preferably a plasma treatment or a heating treatment, for example an inductive or microwave heating treatment, wherein the load 2 is electrically connected to the power converter 4 so that the power converter 4 can supply the required electrical power to the load 2, - optionally, an additional adaptation unit 3 connected between the power converter 4 and the load 2.

[0082] The power converter 4 has: - a heat sink 5 as described above and as described below, - a cooling unit 22 as described above and as described below, which cooling unit has one or more distribution units 20 and a carrier unit 21, - a circuit board 75, - a to-be-cooled unit 10, in particular an electronic unit, preferably a semiconductor component, preferably with power semiconductor components, - further electronic components 8a, 8b, 8c, wherein the further electronic components 8a, 8b, 8c and the to-be-cooled unit 10 are arranged on or at the circuit board 75 and are connected to electrical contacts, wherein the to-be-cooled unit 10 is fixedly connected to, in particular by material bonding to, the heat sink 5.

[0083] Figure 4aA further view from above and at an oblique angle of the circuit board 75 is shown, in which a portion of the carrier unit 21 can be seen. Furthermore, in the sectional view Figure 4a In the sectional view, the ducts 110 can be seen, which are fitted in recesses 115 provided for this purpose on the bottom side of the carrier unit 21.

[0084] The heat sink 5, 85 is preferably made of metal, more preferably of copper. Alternatively, the heat sink 5, 85 can be made of, for example, stainless steel, nickel or molybdenum. The carrier unit 21 can be composed of metal, for example, in whole or in part, but the carrier unit can also be composed of a plastic material, in whole or in part. The carrier unit 21 is preferably composed of aluminum, in whole or in part. The walls of the ducts 110 are preferably composed of copper.

[0085] Figure 4b and Figure 5 A view of the carrier unit 21 as a whole is shown, in which the circuit board 75 and the units 10 and 80 to be cooled can be seen. The carrier unit 21 is provided with a first coolant connection 120 for the supply of coolant and a second coolant connection 122 for the discharge of coolant. Figure 5 The longitudinal section shown through the unit 10 to be cooled also shows the heat sink 5, the first flow channel 25 and the second flow channel 30. Furthermore, in the sectional view Figure 5 In the sectional view, some of the ducts 110 arranged in the bottom side of the carrier unit 21 can be seen.

[0086] Figure 6 and Figure 7 Two oblique views from below of the carrier unit 21 are shown. Figure 6 The units 10 and 80 to be cooled and the heat sinks 5 and 85 are shown. Figure 6 and Figure 7 It is shown that the distribution unit is in the form of a cooling insert 132, wherein the cooling insert 132 is preferably composed of a metal having a high thermal conductivity, preferably of copper. The cooling insert 132 is inserted into the carrier unit 21.

[0087] The receptacle 23 for the heat sink 5 and the further receptacle 92 for the further heat sink 85 are part of the cooling insert 132. The heat sink 5 is fixed to the cooling insert 132 by means of at least one fixing device 15. The heat sink 5 is preferably screwed tightly to the cooling insert 132. The use of a copper cooling insert 132 in those regions in which the heat sinks 5 and 85 are arranged makes it possible to improve the heat dissipation of the heat sinks 5 and 85.

[0088] When a copper cooling insert 132 is used, the structural arrangement provided for fluid contact with the heat sink 5 and 85 is arranged within the cooling insert 132. In this respect, a first flow channel 25, a first fluid port 41, a second flow channel 30, a second fluid port 46 and a further second fluid port 102 are formed within the cooling insert 132. In Figure 6 and Figure 7 The pipe 110 can also be seen in Fig. 10, which is pressed into a recess 115 provided for this purpose on the bottom side of the carrier unit 21. The pipe wall of the pipe 110 is preferably composed of a metal with a high thermal conductivity, preferably of copper. Furthermore, the pipe 110 is preferably connected to the cooling insert 132 and designed to supply cold coolant to the cooling insert 132 and to discharge the heated coolant.

[0089] Figure 7 The entire carrier unit 21 from the bottom side is shown in Fig. 11. In addition to the cooling insert 132 and the pipe 110 pressed into the recess 115, Figure 7 Additionally, coolant connections 120 and 122 for supplying and discharging coolant are shown.

[0090] The features disclosed in the foregoing description, the claims and the accompanying drawings, whether individually or in any combination, may be important for realizing the improved solution.

Claims

1. A heat sink (5) for dissipating heat from a unit (10) to be cooled, particularly an electronic unit, preferably a semiconductor component, wherein, The radiator (5) has: - Cooling channel (35) - A first cooling wall (50) is arranged on the side of the cooling channel (35) facing the unit (10) to be cooled. - A coolant supply section (40) and a coolant discharge section (45), both of which are fluidly connected to the cooling channel (35), for supplying and discharging coolant, particularly coolant liquid, preferably cooling water. The radiator (5) is designed to make - The unit to be cooled (10) can be mechanically and thermally connected to the first cooling wall (50). - The radiator (5) can be releasably fixed to the cooling unit (22), which includes a first fluid port (41) and a second fluid port (46). - When the radiator (5) is fixed to the cooling unit (22), a first fluid connection can be formed between the coolant supply section (40) of the radiator (5) and the first fluid port (41) of the cooling unit (22), and a second fluid connection can be formed between the coolant discharge section (45) of the radiator (5) and the second fluid port (46) of the cooling unit (22). - When the radiator (5) is fixed to the cooling unit (22), a fluid tight seal is simultaneously generated in the first fluid connection and the second fluid connection. - The heat sink (5) can be mechanically fixedly connected to the unit to be cooled (10), which is fixedly connected to the circuit board (75) via a connection.

2. The radiator (5) according to claim 1, characterized in that, The radiator (5) can be releasably fixed to the cooling unit (22) by means of at least one fixing device (15), preferably at least one screw.

3. The radiator (5) according to claim 1 or claim 2, characterized in that, The fluid tight seal between the first fluid connection and the second fluid connection can be achieved using at least one fixing device (15) accessible from the side of the first cooling wall (50).

4. The radiator (5) according to any one of the preceding claims, characterized in that, The radiator (5) is configured such that when the radiator (5) is fixed to the cooling unit (22), a cooling flow (36) can be generated from the first fluid port (41) to the coolant supply section (40) via the cooling channel (35) and the coolant discharge section (45) to the second fluid port (46).

5. The radiator (5) according to any one of the preceding claims, characterized in that, The radiator (5) is made of metal, preferably copper.

6. An electronic component (24) having a heat sink (5) according to any one of claims 1 to 5 and a cooling unit (10) mechanically fixedly connected to the heat sink (5) and designed to be fixedly connected to a circuit board (75) by connection, particularly by brazing.

7. The electronic component (24) according to claim 6, characterized in that, The unit to be cooled (10) is connected to the radiator (5) by at least one of the following: by at least one brazing connection, by at least one welding connection, or by sintering.

8. The electronic component (24) according to claim 6 or claim 7 further comprises a circuit board (75), wherein the unit to be cooled (10) is mechanically fixedly connected to the circuit board.

9. A cooling unit (22) for supplying coolant to a radiator (5), the radiator having a coolant supply section (40) and a coolant discharge section (45), wherein the coolant is particularly a coolant liquid, preferably cooling water, wherein, The cooling unit (22) has: - First flow channel (25) and second flow channel (30); - First fluid port (41), which is fluidly connected to the first flow channel (25) - Second fluid port (46), which is fluidly connected to the second flow channel (30). The cooling unit (22) is designed to make such that - The radiator (5) can be releasably fixed to the cooling unit (22). - When the radiator (5) is fixed to the cooling unit (22), a first fluid connection can be formed between the coolant supply section (40) of the radiator (5) and the first fluid port (41) of the cooling unit (22), and a second fluid connection can be formed between the coolant discharge section (45) of the radiator (5) and the second fluid port (46) of the cooling unit (22). - When the radiator (5) is fixed to the cooling unit (22), a fluid tight seal is simultaneously generated in the first fluid connection and the second fluid connection. - The heat sink (5) can be mechanically fixedly connected to the unit to be cooled (10), which is fixedly connected to the circuit board (75) via a connection.

10. The cooling unit (22) according to claim 9, characterized in that, The cooling unit (22) is configured to supply coolant to a plurality of radiators (5) and discharge coolant from the plurality of radiators (5).

11. The cooling unit (22) according to claim 9 or claim 10, comprising: - A distribution unit (20) having a first fluid port (41) and a second fluid port (46).

12. The cooling unit (22) according to claim 11, characterized in that, The distribution unit (20) is configured as a cooling insert (132) made of a material, preferably copper, having a higher thermal conductivity than other areas of the cooling unit (22).

13. The cooling unit (22) according to any one of claims 9 to 12, comprising: - Bearing unit (21).

14. A cooling device, the cooling device having - Cooling unit (22) according to any one of claims 9 to 13. - A radiator (5) releasably fixed to the cooling unit (22) according to any one of claims 1 to 5.

15. A power converter (4) for an industrial process assembly (1), preferably a plasma process assembly or a heating assembly, the power converter having: - Radiator (5) according to any one of claims 1 to 5. - Circuit board (75) - The unit to be cooled (10), particularly an electronic unit, preferably a semiconductor component, and preferably having power semiconductor components, - Other electronic components (8a, 8b, 8c). in, The additional electronic components (8a, 8b, 8c) and the cooling unit (10) are arranged on or at the circuit board (75) and connected to electrical contacts. The unit to be cooled (10) is fixedly connected to the heat sink (5), particularly by material bonding, and the unit to be cooled (10) is also fixedly connected to the circuit board (75) by a variety of connections, particularly by brazing.

16. The power converter (4) according to claim 15, having a cooling unit (22) according to any one of claims 9 to 13.

17. The power converter (4) according to claim 16, having the cooling device according to claim 14.

18. The power converter (4) according to any one of claims 15 to 17, having an additional heat sink (85), wherein, The other radiator (85) It has the features of a radiator (5) according to any one of claims 1 to 5.

19. The power converter (4) according to any one of claims 15 to 18, having additional electronic components, wherein, The additional electronic component has the features of the electronic component (24) according to any one of claims 6 to 8.

20. A method for assembling a cooling device, the assembly beginning with the following components: - A heat sink (5, 85) for dissipating heat from the unit to be cooled (10, 80), particularly the electronic unit, preferably the semiconductor component, wherein, The radiator (5, 85) includes cooling channels (35, 95), a coolant supply section (40) fluidly connected to the cooling channels (35, 95), and a coolant discharge section (45) fluidly connected to the cooling channels (35, 95). - Cooling unit (22), the cooling unit includes a first fluid port (41) and a second fluid port (46). The method includes: - The radiator (5, 85) is releasably fixed to the cooling unit (22), wherein when the radiator (5, 85) is fixed to the cooling unit (22), a first fluid connection is formed between the coolant supply section (40) of the radiator (5, 85) and the first fluid port (41) of the cooling unit (22), and a second fluid connection is formed between the coolant discharge section (45) of the radiator (5, 85) and the second fluid port (46) of the cooling unit (22), wherein when the radiator (5, 85) is fixed to the cooling unit (22), a fluid tight seal is simultaneously formed in the first fluid connection and the second fluid connection.

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