Stirrer assembly

Abstract

An agitator assembly, the agitator assembly comprising: an inner member comprising a bearing oriented along a central axis; an outer member including a housing disposed at least partially outside the inner member and concentric with the inner member; and at least one snap ring disposed radially between the inner member and the outer member, the at least one snap ring comprising: a snap ring body comprising an open annular body defining an aperture oriented along the central axis, where the snap ring body comprises a substrate and a polymer layer covering the substrate.

Description

Technical Field

[0001] This disclosure relates in general to retaining rings, and more specifically to retaining rings for improving noise and vibration within components. Background Technology

[0002] Typically, retaining rings constrain relative movement to the desired motion and reduce friction between adjacent parts. One type of retaining ring may be located in the gap between the outer surface of an internal component and the inner surface of a bore in an external component within an assembly. Exemplary assemblies may include stirrers, mixers, food processors, or other components known in food preparation applications. Sometimes, there is a need for lower noise, acoustic roughness, and vibration across components such as internal components (such as shafts or bearings) and external components (such as housings) within such assemblies. Therefore, there is a ongoing need for improved retaining rings that provide improved noise, acoustic roughness, and vibration characteristics while maintaining a longer lifespan for the assembly. Summary of the Invention

[0003] Many different aspects and embodiments are possible. Some of these aspects and embodiments are described below. After reading this specification, those skilled in the art will recognize that those aspects and embodiments are merely illustrative and do not limit the scope of the invention. Embodiments can be based on any one or more of the embodiments listed below.

[0004] Implementation Scheme 1: A stirrer assembly comprising: an inner member including a bearing oriented along a central axis; an outer member including a housing at least partially disposed outside the inner member and concentric with the inner member; and at least one retaining ring radially disposed between the inner member and the outer member, the at least one retaining ring comprising: a retaining ring body including an open annular body defining an orifice oriented along the central axis, wherein the retaining ring body includes a substrate and a polymer layer covering the substrate.

[0005] Implementation Scheme 2: The stirrer assembly according to Implementation Scheme 1, wherein the base of the retaining ring body comprises metal.

[0006] Implementation Scheme 3: The agitator assembly according to Implementation Scheme 2, wherein the metal includes stainless steel, spring steel or carbon steel.

[0007] Implementation Scheme 4: The stirrer assembly according to any one of the preceding embodiments, wherein the polymer layer comprises a polymer.

[0008] Implementation Scheme 5: The stirrer assembly according to Implementation Scheme 4, wherein the polymer layer comprises polyketone, polyaramid, thermoplastic polyimide, polyetherimide, polyphenylene sulfide, polyethersulfone, polysulfone, polyphenylene sulfone, polyamide imide, ultra-high molecular weight polyethylene, thermoplastic fluoropolymer, polyamide, polybenzimidazole, elastomer, or any combination thereof.

[0009] Implementation Scheme 6: The stirrer assembly according to Implementation Scheme 4, wherein the polymer layer comprises a fluoropolymer.

[0010] Implementation Scheme 7: The stirrer assembly according to Implementation Scheme 6, wherein the polymer layer comprises polytetrafluoroethylene.

[0011] Implementation Scheme 8: The stirrer assembly according to any one of the preceding embodiments, wherein the retaining ring further comprises an adhesive layer disposed between the substrate and the polymer layer.

[0012] Implementation Scheme 9: The stirrer assembly according to Implementation Scheme 8, wherein the adhesive layer comprises at least one of a fluoropolymer, epoxy resin, polyimide resin, polyether / polyamide copolymer, ethylene vinyl acetate, ethylene tetrafluoroethylene (ETFE), ETFE copolymer, perfluoroalkoxy (PFA), or any combination thereof.

[0013] Implementation Scheme 10: The stirrer assembly according to any one of the preceding embodiments, wherein the polymer layer has a thickness between 50 micrometers and 1000 micrometers.

[0014] Implementation Scheme 11: The stirrer assembly according to any one of the preceding embodiments, wherein the annular body includes a first main surface and a second main surface, the first main surface and the second main surface having a thickness disposed therebetween along the central axis.

[0015] Implementation Scheme 12: The stirrer assembly according to Implementation Scheme 11, wherein the annular body has a thickness in the range of 0.5 mm to 1 mm.

[0016] Implementation Scheme 13: The stirrer assembly according to any one of the preceding embodiments, wherein the annular body includes a first circumferential end and a second circumferential end defining an opening in the annular body.

[0017] Implementation Scheme 14: The stirrer assembly according to Implementation Scheme 13, wherein at least one of the first circumferential end or the second circumferential end includes a protrusion that defines a protrusion orifice oriented along the central axis.

[0018] Implementation Scheme 15: The stirrer assembly according to Implementation Scheme 14, wherein the protruding portion protrudes inward in the radial direction.

[0019] Implementation Scheme 16: The stirrer assembly according to Implementation Scheme 14, wherein the protrusion is at least partially arc-shaped.

[0020] Implementation Scheme 17: The stirrer assembly according to any one of the preceding embodiments, wherein the annular body has an inner diameter in the range of 5 mm to 10 mm.

[0021] Implementation Scheme 18: The stirrer assembly according to any one of the preceding embodiments, wherein the annular body has an outer diameter in the range of 8 mm to 15 mm.

[0022] Implementation Scheme 19: A stirrer assembly according to any one of the preceding embodiments, wherein at least one of the housing or the bearing is operatively connected to a plurality of blades.

[0023] Implementation Scheme 20: The stirrer assembly according to any one of the preceding embodiments, wherein the at least one retaining ring comprises a plurality of retaining rings. Attached Figure Description

[0024] This disclosure can be better understood by referring to the accompanying drawings, and many features and advantages of this disclosure will become apparent to those skilled in the art.

[0025] Figure 1 Including a method for producing retaining rings according to the implementation plan;

[0026] Figure 2A Including a cross-sectional view of the composite material capable of forming retaining rings according to the embodiment;

[0027] Figure 2B Including a cross-sectional view of the composite material capable of forming retaining rings according to the embodiment;

[0028] Figure 2C Including a cross-sectional view of the composite material capable of forming retaining rings according to the embodiment;

[0029] Figure 3A Includes a top perspective view of the retaining ring according to the embodiment described herein;

[0030] Figure 3B Includes a top perspective view of the retaining ring according to the embodiment described herein;

[0031] Figure 3C Includes a top perspective view of the retaining ring according to the embodiment described herein.

[0032] Figure 3DIncludes a top perspective view of the retaining ring according to the embodiment described herein.

[0033] Figure 4 Including a top perspective view of the retaining ring within the component according to the embodiment described herein;

[0034] Figure 5A Includes a side view of the stirrer assembly according to the embodiments described herein;

[0035] Figure 5B Including a top unassembled view of the retaining ring in the stirrer assembly according to the embodiments described herein;

[0036] Figure 6 The graph includes a noise reduction [dB] of the stirrer assembly according to the embodiments herein compared to stirrer assemblies known in the art.

[0037] Those skilled in the art will recognize that the elements in the accompanying drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the dimensions of some elements in the drawings may be enlarged relative to other elements to aid in understanding embodiments of the invention. The same reference numerals are used in different drawings to indicate similar or identical items. Detailed Implementation

[0038] The following description, taken in conjunction with the accompanying drawings, is provided to aid in understanding the teachings disclosed herein. The following discussion will focus on specific implementations and schemes of these teachings. This focused discussion is provided to aid in the description of the teachings and should not be construed as a limitation on the scope or applicability of the teachings. However, other schemes may be used based on the teachings disclosed in this application.

[0039] The terms “comprising,” “including,” “having,” or any other variations thereof are intended to cover non-exclusive inclusion. For example, a method, article, or apparatus that includes a list of features is not necessarily limited to those features, but may include other features not expressly listed or inherent to such a method, article, or apparatus. Furthermore, unless expressly stated to the contrary, “or” means inclusive or, not exclusive or. For example, conditions A or B are satisfied by either: A is true (or exists) and B is false (or does not exist); A is false (or does not exist) and B is true (or exists); and both A and B are true (or exist).

[0040] Furthermore, the terms "a" or "an" are used to describe the elements and components described herein. This is done merely for convenience and to give a general meaning to the scope of the invention. This description should be understood to include one, at least one, or the singular includes the plural and vice versa, unless explicitly stated otherwise. For example, when a single embodiment is described herein, more than one embodiment may be used instead of a single embodiment. Similarly, when more than one embodiment is described herein, a single embodiment may be used instead of the more than one embodiment.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Materials, methods, and examples are illustrative only and not limiting. To the extent not described herein, many details regarding specific materials and processing behaviors are conventional and can be found in textbooks and other sources within the field of clasps and clasp assemblies.

[0042] The embodiments described herein generally relate to retaining rings and methods of forming retaining rings and using retaining rings within components. In a particular embodiment, the retaining ring may have an annular retaining ring body comprising a substrate and a polymer layer covering the substrate.

[0043] Embodiments of the present invention may include: a stirrer assembly comprising: an inner member including a bearing oriented along a central axis; an outer member including a housing at least partially disposed outside the inner member and concentric with the inner member; and at least one retaining ring radially disposed between the inner member and the outer member, the at least one retaining ring comprising:

[0044] For illustrative purposes, Figure 1 The method includes a method for producing a retaining ring according to the above embodiments. The forming process 10 may include a first step 12 of providing a base material, a second step 14 of coating the base material with a low-friction coating to form a composite material, and a third step 16 of forming the composite material into a retaining ring.

[0045] Referring to step 12, the substrate material may be a base material. In one embodiment, the base material may at least partially comprise a metal. According to certain embodiments, the metal may include iron, copper, titanium, tin, aluminum, alloys thereof, or may be another type of material. More specifically, the base material may at least partially comprise steel, such as stainless steel, carbon steel, or spring steel. For example, the base material may at least partially comprise 301 stainless steel. 301 stainless steel may be annealed, 1 / 4 hard, 1 / 2 hard, 3 / 4 hard, or fully hardened. Furthermore, the steel may include stainless steel containing chromium, nickel, or a combination thereof. A specific stainless steel is 301 stainless steel. The base material may include a woven mesh or expanded metal mesh. Alternatively, the woven mesh may be a woven polymer mesh. In another embodiment, the base material may not include a mesh or grid. The base material may include a conductive material.

[0046] In several embodiments, the substrate may be spring steel. The spring steel substrate may be annealed, 1 / 4 hardened, 1 / 2 hardened, 3 / 4 hardened, or fully hardened. The spring steel substrate may have a tensile strength of not less than 600 MPa, such as not less than 700 MPa, such as not less than 750 MPa, such as not less than 800 MPa, such as not less than 900 MPa, or such as not less than 1000 MPa. The spring steel substrate may have a tensile strength of not more than 1500 MPa or such as not more than 1250 MPa.

[0047] Figure 2A This includes an example of a composite material 1000 that can be formed according to the first step 12 and the second step 14 of the forming process 10 for the production of a retaining ring according to the above embodiment. For illustrative purposes, Figure 2A The layer-by-layer configuration of composite material 1000 after the second step 14 is shown. In several embodiments, composite material 1000 may include a substrate 1119 (i.e., the matrix material provided in the first step 12) and a polymer layer 1104 (i.e., a low-friction coating applied in the second step 14). Figure 2A As shown, polymer layer 1104 may be bonded to at least a portion of substrate 1119. In one embodiment, polymer layer 1104 may be bonded to a surface of substrate 1119 to form a low-friction interface with another surface of another component. Polymer layer 1104 may be bonded to a radially inner surface of substrate 1119 to form a low-friction interface with another surface of another component. Polymer layer 1104 may be bonded to a radially outer surface of substrate 1119 to form a low-friction interface with another surface of another component.

[0048] In several embodiments, polymer layer 1104 may comprise a low-friction material. The low-friction material may include, for example, polymers such as polyketone, polyaramid, polyimide, polyetherimide, polyphenylene sulfide, polyethersulfone, polysulfone, polyphenylene sulfone, polyamide-imide, ultra-high molecular weight polyethylene, fluoropolymers, polyamides, polybenzimidazoles, or any combination thereof. In one example, polymer layer 1104 comprises polyketone, polyaramid, polyimide, polyetherimide, polyamide-imide, polyphenylene sulfide, polyphenylene sulfone, fluoropolymers, polybenzimidazoles, derivatives thereof, or combinations thereof. In a specific example, the low-friction / wear-resistant layer comprises polymers such as polyketone, thermoplastic polyimide, polyetherimide, polyphenylene sulfide, polyethersulfone, polysulfone, polyamide-imide, derivatives thereof, or combinations thereof. In another example, the low-friction / abrasion-resistant layer comprises polyketides, such as polyetheretherketone (PEEK), polyetherketone, polyetherketoneketone, polyetherketoneetherketone, derivatives thereof, or combinations thereof. In an additional example, the low-friction / abrasion-resistant layer may be ultra-high molecular weight polyethylene. Example fluoropolymers include fluorinated ethylene propylene (FEP), polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), perfluoroalkoxy (PFA), terpolymers of tetrafluoroethylene, hexafluoropropylene, and vinylidene fluoride (THV), polychlorotrifluoroethylene (PCTFE), ethylene tetrafluoroethylene copolymer (ETFE), ethylene chlorotrifluoroethylene copolymer (ECTFE), polyacetal, polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyimide (PI), polyetherimide, polyetheretherketone (PEEK), polyethylene (PE), polysulfone, polyamide (PA), polyphenylene ether, polyphenylene sulfide (PPS), polyurethane, polyester, liquid crystal polymer (LCP), elastomers, or any combination thereof.Exemplary fluoropolymers include polytetrafluoroethylene (PTFE), modified PTFE (TFM), fluorinated ethylene propylene (FEP), polyvinylidene fluoride (PVDF), perfluoroalkoxy (PFA), terpolymers of tetrafluoroethylene, hexafluoropropylene, and vinylidene fluoride (THV), polyvinyl chloride trifluoroethylene (PCTFE), ethylene tetrafluoroethylene copolymer (ETFE), ethylene chloride trifluoroethylene copolymer (ECTFE), EVA, silicone, polyolefins, polycarbonate, HDPE, POE, COC, COP, PMP, etc. FEP, PTFE, FEP (fluorinated ethylene propylene), TFE (tetrafluoroethylene), PFA (perfluoroalkoxy), PVF (polyvinylidene fluoride), PVDF (polyvinylidene fluoride), PTFE (polytetrafluoroethylene), PCTFE (polychlorotrifluoroethylene), ETFE (polyethylene tetrafluoroethylene), ECTFE (ethylene chloride trifluoroethylene copolymer), FFPM / FFKM (perfluoroelastomer), FPM / FKM (chlorotrifluoroethylene vinylidene fluoride), PFPE (perfluoropolyether), MFA (tetrafluoroethylene and perfluoroethylene...) Fluoromethyl vinyl ether copolymer), CTFE / VDF (trifluorochloroethylene-vinylidene fluoride copolymer) and TFE / HFP (tetrafluoroethylene-hexafluoropropylene copolymer), natural polyisoprene rubber (NR), synthetic polyisoprene rubber (IR), polybutadiene rubber (BR), chloroprene rubber (CR), butyl rubber (IIR), halogenated butyl rubber (CIIR, BIIR), styrene-butadiene rubber (SBR), nitrile rubber (NBR) and hydrogenated nitrile rubber (HNBR), ethylene propylene diene monomer (EPM), ethylene... Acrylic rubber (EPDM), epichlorohydrin rubber (ECO), polyacrylic rubber (ACM, ABR), silicone rubber (SI, Q, VMQ), fluorosilicone rubber (FSR, FVMQ), fluoroelastomers (FKM, FEPM), perfluoroelastomers (FFKM), polyether block amide (PEBA), chlorosulfonated polyethylene (CSM), ethylene-vinyl acetate (EVA), cyclic olefin copolymers, polyolefin elastomers, polypropylene elastomers (PE), elastomers PET, or mixtures thereof, or any combination thereof. Other fluoropolymers, polymers, and blends may be included in the components of device 100 or any of its components listed herein. In another specific embodiment, polymer layer 1104 may comprise at least partially polyethylene (PE), or even consist substantially of polyethylene (PE), such as ultra-high molecular weight polyethylene (UHMWPE). In another specific embodiment, polymer layer 1104 may comprise a thermoplastic elastomer hydrocarbon block copolymer, a polyether-ester block copolymer, a thermoplastic polyamide elastomer, a thermoplastic polyurethane elastomer, a thermoplastic polyolefin elastomer, a thermoplastic vulcanized rubber, an olefin-based copolymer, an olefin-based terpolymer, a polyolefin plastide, or a combination thereof.In one embodiment, polymer layer 1104 may comprise styrene-based block copolymers, such as styrene-butadiene, styrene-isoprene, blends or mixtures thereof. Exemplary styrene-based thermoplastic elastomers include triblock styrene-based block copolymers (SBCs), such as styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS), styrene-ethylene-butene-styrene (SEBS), styrene-ethylene-propylene-styrene (SEPS), styrene-ethylene-ethylene-butadiene-styrene (SEEBS), styrene-ethylene-ethylene-propylene-styrene (SEEPS), styrene-isoprene-butadiene-styrene (SIBS), or combinations thereof. Commercial examples include certain grades of Kraton™ and Hybra™ resins. In one embodiment, device 100 or any of its components listed herein may comprise an elastomer comprising acrylonitrile-butadiene (NBR) carboxylated nitrile (XNBR) ethylene acrylate (AEM). ), Ethylene propylene rubber (EPR, EPDM), Butyl rubber (IIR), Chloroprene rubber (CR), Fluorocarbons (FKM, FPM), Fluorosiloxanes (FVMQ), Hydrogenated nitrile rubber (HNBR), Perfluoroelastomers (FFKM), Polyacrylates (ACM), Polyurethanes (AU, EU), Silicone rubbers (Q, MQ, VMQ, PVMQ), Tetrafluoroethylene-propylene At least one of (FEPM). The polymer layer 1104 may comprise a solid-based material, including lithium soap, graphite, boron nitride, molybdenum disulfide, tungsten disulfide, polytetrafluoroethylene, carbon nitride, tungsten carbide or diamond-like carbon, metals (such as aluminum, zinc, copper, magnesium, tin, platinum, titanium, tungsten, lead, iron, bronze, steel, spring steel, stainless steel), metal alloys (containing the listed metals), anodized metals (containing the listed metals), or any combination thereof. Depending on the specific embodiment, a fluoropolymer may be used.

[0049] In several embodiments, the polymer layer 1104 may also comprise fillers, including glass fibers, carbon fibers, silicon, PEEK, aromatic polyesters, carbon particles, bronze, fluoropolymers, thermoplastic fillers, alumina, polyamide-imide (PAI), PPS, polyphenylene sulfone (PPSO2), LCP, aromatic polyesters, molybdenum disulfide, tungsten disulfide, graphite, graphene, expanded graphite, boron nitride, talc, calcium fluoride, or any combination thereof. Additionally, fillers may include alumina, silicon dioxide, titanium dioxide, calcium fluoride, boron nitride, mica, wollastonite, silicon carbide, silicon nitride, zirconium oxide, carbon black, pigments, or any combination thereof. The filler may be in the form of beads, fibers, powder, mesh, or any combination thereof. The filler may be at least 1% by weight based on the total weight of the polymer layer, such as at least 5% by weight based on the total weight of the polymer layer, or even 10% by weight.

[0050] The substrate 1119 may have a thickness Ts between about 10 micrometers and about 1500 micrometers (e.g., between about 50 micrometers and about 1000 micrometers, between about 100 micrometers and about 750 micrometers, between about 150 micrometers and about 650 micrometers). In several embodiments, the substrate 1119 may have a thickness Ts between about 200 micrometers and 600 micrometers. It should also be understood that the thickness Ts of the substrate 1119 can be any value between any of the aforementioned minimum and maximum values. The thickness of the substrate 1119 may be uniform, i.e., the thickness at a first location of the substrate 1119 may be equal to the thickness at a second location thereafter. The thickness of the substrate 1119 may be non-uniform, i.e., the thickness at a first location of the substrate 1119 may differ from the thickness at a second location thereafter.

[0051] In one embodiment, the polymer layer 1104 may have a thickness T between about 1 micrometer and about 500 micrometers (e.g., between about 10 micrometers and about 400 micrometers, between about 50 micrometers and about 350 micrometers, between about 100 micrometers and about 300 micrometers). SL In several embodiments, the polymer layer 1104 may have a thickness T between approximately 50 micrometers and 250 micrometers. SL It should also be understood that the thickness T of polymer layer 1104 SLThis can be any value between any of the aforementioned minimum and maximum values. The thickness of polymer layer 1104 can be uniform, i.e., the thickness of polymer layer 1104 at a first location can be equal to the thickness at a second location thereafter. The thickness of polymer layer 1104 can be non-uniform, i.e., the thickness of polymer layer 1104 at a first location can be different from the thickness at a second location thereafter. It is understood that different polymer layers 1104 can have different thicknesses. Polymer layer 1104 can cover one main surface of the illustrated substrate 1119, or cover two main surfaces. Substrate 1119 can be at least partially encapsulated by polymer layer 1104. That is, polymer layer 1104 can cover at least a portion of substrate 1119. The axial surface of substrate 1119 can be exposed from polymer layer 1104.

[0052] Figure 2B Examples include alternative embodiments of composite materials that can be formed according to the first step 12 and the second step 14 of forming process 10 for producing the retaining ring according to the above embodiment. For illustrative purposes, Figure 2B The layer-by-layer configuration of composite material 1002 after the second step 14 is shown. According to this specific embodiment, composite material 1002 can be similar to... Figure 2A The composite material 1000 differs from the composite material 1002 in that it may also include at least one adhesive layer 1121 and a polymer layer 1104 (i.e., the low-friction coating applied in the second step 14), the adhesive layer being able to bond the polymer layer 1104 to the substrate 1119 (i.e., the matrix material provided in the first step 12).

[0053] Adhesive layer 1121 may comprise any known adhesive material commonly used in the field of snap rings, including but not limited to fluoropolymers, epoxy resins, polyimide resins, polyether / polyamide copolymers, ethylene vinyl acetate, ethylene tetrafluoroethylene (ETFE), ETFE copolymers, perfluoroalkoxy (PFA), or any combination thereof. Additionally, the adhesive may comprise at least one functional group selected from -C=O, -COR, -COH, -COOH, -COOR, -CF2=CF-OR, or any combination thereof, wherein R is a cyclic or linear organic group containing 1 to 20 carbon atoms. Additionally, the adhesive may comprise a copolymer. In one embodiment, the hot melt adhesive may have a melting temperature not exceeding 250°C, such as not exceeding 220°C. In another embodiment, the adhesive may decompose at temperatures above 200°C, such as above 220°C. In yet another embodiment, the hot melt adhesive may have a melting temperature above 250°C or even above 300°C. Adhesive layer 1121 may have a thickness of about 1 micrometer to 50 micrometers, such as about 10 micrometers to 30 micrometers. In one embodiment, the hot melt adhesive may have a melting temperature not exceeding 250°C, such as not exceeding 220°C. In another embodiment, the adhesive may decompose at temperatures above 200°C, such as above 220°C. In yet another embodiment, the melting temperature of the hot melt adhesive may be above 250°C or even above 300°C.

[0054] Adhesive layer 1121 may have a thickness T between about 1 micrometer and about 80 micrometers (such as between about 5 micrometers and about 50 micrometers, such as between about 15 micrometers and about 40 micrometers). AL In several embodiments, the adhesive layer 1121 may have a thickness T between approximately 3 micrometers and 20 micrometers. AL In several embodiments, the adhesive layer 1121 may have a thickness T between approximately 10 micrometers and 60 micrometers. AL It should also be understood that the thickness T of adhesive layer 1121 AL It can be any value between any of the minimum and maximum values ​​mentioned above. The thickness of the adhesive layer 1121 can be uniform, that is, the thickness of the adhesive layer 1121 at the first location can be equal to the thickness at the second location along it. The thickness of the adhesive layer 1121 can be non-uniform, that is, the thickness of the adhesive layer 1121 at the first location can be different from the thickness at the second location along it.

[0055] Figure 2C Examples include alternative embodiments of composite materials that can be formed according to the first step 12 and the second step 14 of forming process 10 for producing the retaining ring according to the above embodiment. For illustrative purposes, Figure 2CThe layer-by-layer configuration of composite material 1003 after the second step 14 is shown. According to this specific embodiment, composite material 1003 can be similar to... Figure 2B The composite material 1002 is different from the composite material 1003, which may also include at least one anti-corrosion layer 1704 and 1705 and a damping coating 1125. The damping coating may include an tackifier layer 1127 and an elastomer layer 1129, which may be bonded to a substrate 1119 (i.e., the matrix material provided in the first step 12) and a polymer layer 1104 (i.e., a low-friction coating applied in the second step 14).

[0056] The substrate 1119 may be coated with anti-corrosion layers 1704 and 1705 to prevent the composite material 1003 from being corroded prior to processing. Each of layers 1704 and 1705 may have a thickness of about 1 micrometer to 50 micrometers, such as about 7 micrometers to 15 micrometers. Layers 1704 and 1705 may comprise phosphates of zinc, iron, manganese, or any combination thereof, or nano-ceramic layers. Furthermore, layers 1704 and 1705 may comprise functionalized silanes, nanoscale silane primers, hydrolyzed silanes, organosilane tackifiers, solvent / water-based silane primers, chlorinated polyolefins, passivated surfaces, commercially available zinc (mechanical / electroplated) or zinc-nickel coatings, or any combination thereof. Anti-corrosion layers 1704 and 1705 may be removed or retained during processing.

[0057] Composite material 1003 may also include a damping coating 1125. The damping coating 1125 may have a thickness of about 1 micrometer to 500 micrometers (e.g., about 50 micrometers to 400 micrometers, and such as about 100 micrometers to 300 micrometers). The damping coating 1125 may include a tackifier layer 1127 and an elastomer layer 1129. The tackifier layer 1127 may include a phosphate of zinc, iron, manganese, tin, or any combination thereof, or a nano-ceramic layer. The tackifier layer 1127 may include functionalized silanes, nanoscale silane underlayers, hydrolyzed silanes, organosilane tackifiers, solvent / water-based silane primers, chlorinated polyolefins, passivated surfaces, commercially available zinc (mechanical / electroplated) or zinc-nickel coatings, or any combination thereof. The elastomer layer 1129 may be any elastomeric material known in the art, including any elastomer listed herein. Furthermore, the elastomer layer 1129 may include rubber, NVR, etc., or any combination thereof. The elastomer layer 1129 may also include a hardener.

[0058] In one implementation scheme, in Figure 1In step 14, any layer of the composite materials 1000, 1002, and 1003 as described above may be respectively disposed in and peeled from a roller to be bonded together under pressure, at elevated temperatures (hot or cold pressing or roll pressing), by an adhesive, or by any combination thereof. Any layer of the composite material 1000 as described above may be laminated together such that they at least partially overlap each other. Any layer of the composite materials 1000, 1002, and 1003 as described above may be applied together using coating techniques (such as, for example, physical or vapor deposition, spraying, electroplating, powder coating) or by other chemical or electrochemical techniques. In one specific embodiment, polymer layer 1104 may be applied by a roll-to-roll coating process including, for example, extrusion coating. Polymer layer 1104 may be heated to a molten or semi-molten state and extruded through a slot die onto the main surface of substrate 1119. In another embodiment, polymer layer 1104 may be cast or molded.

[0059] In one embodiment, a polymer layer 1104 or any layer may be bonded to a substrate 1119 using a melt adhesive layer 1121 to form a laminate. In one embodiment, any intervening or protruding layer on the material or composite material 1000, 1002, 1003 may form the laminate. The laminate may then be cut using a mold, press, stamping, hydraulic cutting, sawing, laser cutting, or may be machined in various ways to form retaining rings. Cutting the laminate may produce a cut edge that includes the exposed portion of the substrate 1119.

[0060] In other implementations, Figure 1 In step 14, any layer on the composite materials 1000, 1002, and 1003 as described above can be applied by coating techniques (such as physical or vapor deposition, spraying, electroplating, powder coating) or by other chemical or electrochemical techniques. In one specific embodiment, polymer layer 1104 can be applied by a roll-to-roll coating process, including, for example, extrusion coating. Polymer layer 1104 can be heated to a molten or semi-molten state and extruded through a slot die onto the main surface of substrate 1119. In another embodiment, polymer layer 1104 can be cast or molded.

[0061] Now refer to the example Figure 1 The third step 16 of the forming process 10 shown, in certain embodiments, of forming composite materials 1000, 1002, and 1003 into retaining rings, may include the cutting operation described above. In several embodiments, the cutting operation may form an outer peripheral surface on the retaining ring. The cutting operation may define a cutting direction from a first primary surface to a second primary surface opposite to the first primary surface to form an outer peripheral surface or edge. Alternatively, the cutting operation may define a cutting direction from the second primary surface to the first primary surface to form an outer peripheral surface or edge.

[0062] After the retaining ring is formed, it can be cleaned to remove any lubricants and oils used during forming and molding. Additionally, cleaning prepares the exposed surfaces of the substrate for coating application. Cleaning can include chemical cleaning using solvents and / or mechanical cleaning, such as ultrasonic cleaning.

[0063] Now we turn to the retaining ring formed according to the embodiment described herein, for illustrative purposes. Figure 3A This includes a top view of a retaining ring 100 formed from blanks of materials or composites 1000, 1001, 1002, 1003 as described herein using the forming process described above for producing retaining rings according to the embodiments described herein. For illustrative purposes, Figure 3B A side view is shown of a retaining ring 100 formed from a blank of material or composite material 1000, 1001, 1002, 1003 as described herein using the forming process described above for producing a retaining ring according to the embodiments described herein. The retaining ring may include a retaining ring body 102 oriented about a central axis A. The retaining ring body 102 may be formed from the blank as described above and includes a base 1119 (e.g., spring steel) that may be bent into an annular (substantially ring-shaped) shape about the central axis A, thereby forming an aperture 180. The retaining ring body 102 may also include a polymer layer 1104 conforming to the shape of an annular base 104, such as a polymer layer 1104 formed from a blank of composite material 1000, 1001, 1002, 1003 as described above. The retaining ring body 102 may also include an annular base 104. The ends of the annular base 104 may not be joined (e.g., the annular base may be formed as an open ring), thereby leaving a circumferential axial gap 111 between the first circumferential end 102A and the second circumferential end 102B. In several embodiments, at least one of the first circumferential end 102A or the second circumferential end 102B includes protrusions 115A, 115B. In a specific embodiment, at least one of the protrusions 115A, 115B may define protrusions 117A, 117B oriented along a central axis. In several embodiments, at least one of the protrusions 115A, 115B protrudes inward in a radial direction. In several embodiments, at least one of the protrusions 115A, 115B protrudes outward in a radial direction. In several embodiments, at least one of the protrusions 115A, 115B may be at least partially arcuate. In several embodiments, at least one of the protrusions 115A and 115B may be at least partially straight.

[0064] In several embodiments, the retaining ring body 102 may include an inner radial edge 103 and an outer radial edge 105. The inner or outer radial edge may define an outer peripheral surface of the retaining ring 100. The inner radial edge 103 may at least partially define an aperture 180 in the retaining ring 100. In some embodiments, the retaining ring 100 may further include at least one radially tapered portion 110 disposed along at least one of the inner radial edge 103 or the outer radial edge 105 of the annular base 104.

[0065] In several implementation schemes, such as Figure 3A As shown, the retaining ring 100 may have an overall outer radius OR F For the purposes of the embodiments described herein, the outer radius OR of the retaining ring 100 is... W It is the distance from the central axis A to the outer radial edge 105. According to some embodiments, the outer radius OR of the retaining ring 100 is... W It can be at least about 1 mm, such as at least about 10 mm, or at least about 20 mm, or at least about 30 mm, or at least about 40 mm, or even at least about 50 mm. According to other embodiments, the outer radius OR of the retaining ring 100... W It can be no greater than approximately 100mm, such as no greater than approximately 50mm or even no greater than approximately 25mm. It should be understood that the outer radius of the circlip is 100. W It can be within any of the minimum and maximum values ​​mentioned above. It should also be understood that the outer radius OR of the circlip 100... W It can be any value between any of the minimum and maximum values ​​mentioned above. For example, the outer radius OR of a 100mm circlip. W It can be 7.5mm.

[0066] In several implementation schemes, such as Figure 3A As shown, the retaining ring 100 may have an overall inner radius IR. w For the purposes of the embodiments described herein, the inner radius IR of the retaining ring 100 is... W It is the distance from the central axis A to the inner radial edge 103. According to some embodiments, the inner radius IR of the retaining ring 100... W It can be at least about 1 mm, such as at least about 10 mm, about 20 mm, at least about 30 mm, at least about 40 mm, or even at least about 50 mm. According to other embodiments, the inner radius IR of the retaining ring 100... W It may not exceed approximately 100 mm, such as not exceeding approximately 50 mm or even not exceeding approximately 25 mm. It should be understood that the inner radius IR of the retaining ring 100... W It can be within any of the minimum and maximum values ​​mentioned above. It should also be understood that the inner radius IR of the retaining ring 100... W It can be any value between any of the minimum and maximum values ​​mentioned above. For example, the inner radius IR of the circlip 100.W It can be 4mm. Inner radius IR W It can be the same as the radius of the 180mm orifice.

[0067] like Figure 3A As shown, the annular substrate 104 may include a first axial surface 106 and a second axial surface 107 opposite to the first axial surface 106, the first axial surface and the second axial surface being oriented along a central axis A and spaced apart by an axial height. At least one of the first axial surface 106 or the second axial surface 107 may form the main surface of the retaining ring 100. The first axial surface 106 may have a polymer layer 1104 conforming to the shape of the annular substrate 104 having a substrate 1119, formed from composite materials 1000, 1001, 1002, 1003 as described above. Alternatively or additionally, the second axial surface 107 may have a polymer layer 1104 conforming to the shape of the annular substrate 104, formed from composite materials 1000, 1001, 1002, 1003 as described above. In other embodiments, the polymer layer 1104 may be laminated to both surfaces of the annular substrate 104. When viewed in a plane perpendicular to the central axis A, the annular base 104 may have a polygonal, elliptical, circular, semi-circular, or substantially circular cross-section.

[0068] In several embodiments, the retaining ring 100 may have a specific axial height or thickness T. W For the purposes of the embodiments described herein and as such Figure 3B As shown, the axial height T of the retaining ring 100 W It is the distance from the first axial surface 106 to the second axial surface 107. According to some embodiments, the axial height T of the retaining ring 100... W It can be at least about 0.1 mm, or at least about 0.2 mm, or at least about 0.3 mm, or at least about 0.4 mm, or even at least about 0.5 mm. According to other embodiments, the axial height T of the retaining ring 100... w It may not exceed approximately 10 mm, such as not exceeding approximately 5 mm or even not exceeding approximately 1 mm. It should be understood that the axial height T of the retaining ring 100... w It can be within any of the minimum and maximum values ​​mentioned above. It should also be understood that the axial height T of the retaining ring 100... w It can be any value between any of the minimum and maximum values ​​mentioned above. For example, the axial height T of the retaining ring 100. W It can be 1.3mm.

[0069] For illustrative purposes, Figure 3BA top view of a retaining ring 100 formed from blanks of materials or composites 1000, 1001, 1002, 1003 as described herein using the forming process described above for producing retaining rings according to the embodiments described herein. Figure 3A The icon numbers are combined with Figure 3B In, and is envisioned to perform in a similar manner, have similar functions, or have a similar structure, unless otherwise indicated. For example... Figure 3B As shown, the ends of the annular base 104 may not be joined (e.g., the annular base may be formed as an open ring), thereby leaving an axial gap 111 circumferentially between the first circumferential end 102A and the second circumferential end 102B. In several embodiments, at least one of the first circumferential end 102A or the second circumferential end 102B includes protrusions 115A, 115B. In a specific embodiment, at least one of the protrusions 115A, 115B may define protrusion orifices 117A, 117B oriented along a central axis. In several embodiments, such as Figure 3B As shown, at least one of the protruding portions 115A and 115B protrudes inward in the radial direction. Figure 3B As shown, in several embodiments, at least one of the protrusions 115A and 115B may be at least partially straight.

[0070] For illustrative purposes, Figure 3C A top view of a retaining ring 100 formed from blanks of materials or composites 1000, 1001, 1002, 1003 as described herein using the forming process described above for producing retaining rings according to the embodiments described herein. Figure 3C The icon numbers are combined with Figure 3B In, and is envisioned to perform in a similar manner, have similar functions, or have a similar structure, unless otherwise indicated. For example... Figure 3C As shown, the ends of the annular base 104 may not be joined (e.g., the annular base may be formed as an open ring), thereby leaving an axial gap 111 circumferentially between the first circumferential end 102A and the second circumferential end 102B. In several embodiments, at least one of the first circumferential end 102A or the second circumferential end 102B includes protrusions 115A, 115B. In a specific embodiment, at least one of the protrusions 115A, 115B may define protrusion orifices 117A, 117B oriented along a central axis. In several embodiments, such as Figure 3C As shown, at least one of the protruding portions 115A and 115B protrudes outward in the radial direction. Figure 3C As shown, in several embodiments, at least one of the protrusions 115A and 115B may be at least partially arcuate. Figure 3CAs shown, in several embodiments, at least one of the protrusions 115A and 115B may be at least partially straight.

[0071] For illustrative purposes, Figure 3D A top view of a retaining ring 100 formed from blanks of materials or composites 1000, 1001, 1002, 1003 as described herein using the forming process described above for producing retaining rings according to the embodiments described herein. Figure 3D The icon numbers are combined with Figure 3B In, and is envisioned to perform in a similar manner, have similar functions, or have a similar structure, unless otherwise indicated. For example... Figure 3D As shown, the ends of the annular base 104 may not be joined (e.g., the annular base may be formed as an open ring), thereby leaving an axial gap 111 circumferentially between the first circumferential end 102A and the second circumferential end 102B. In several embodiments, at least one of the first circumferential end 102A or the second circumferential end 102B includes protrusions 115A, 115B. In several embodiments, such as Figure 3D As shown, at least one of the protruding portions 115A and 115B protrudes inward in the radial direction. Figure 3D As shown, in several embodiments, at least one of the protrusions 115A and 115B may be at least partially arcuate. Figure 3D As shown, in several embodiments, at least one of the protrusions 115A and 115B may be at least partially straight. In several embodiments, the annular base 104 may include a base protrusion 119. In a specific embodiment, the base protrusion 119 may protrude outward in the radial direction. In a specific embodiment, as... Figure 3D As shown, the protruding portion 119 of the substrate can protrude inward in the radial direction. Figure 3D As shown, in several embodiments, the substrate protrusion 119 may be at least partially arcuate. For example... Figure 3D As shown, in several embodiments, the substrate protrusion 119 may be at least partially straight.

[0072] For illustrative purposes, Figure 4 This includes a top perspective view of the retaining ring within the component according to the embodiment described herein. It should be understood that... Figure 4Corresponding components (i.e., components with the same reference numerals) may be described as having any of the characteristics or features described in any of the other accompanying drawings disclosed herein. In several embodiments, the retaining ring 100 may be disposed adjacent to or in contact with an internal component 452 (such as a bearing, shaft, side member, tolerance ring, other structural member, or combination thereof) in assembly 450. In several embodiments, the internal component 452 may be a shaft or bearing (e.g., a ball bearing or roller bearing) of a stirrer assembly as discussed in more detail below. Assembly 400 may also include an external component 454 (e.g., a bearing, housing, side member, other structural member, or combination thereof) radially disposed outside the internal component 452. In several embodiments, the external component 454 may be a housing of a stirrer assembly as discussed in more detail below. In operation, the retaining ring 400 may be located in an axial clearance 416 between two opposing (mating) components 452, 454. In one embodiment, the external component 454 may be adapted to rotate relative to the internal component 452. The retaining ring 400 can act as a spring and deform to fit components 452, 454 together, so that there is zero gap between the two components. In another embodiment, the inner component 452 may be adapted to rotate relative to the outer component 454. The retaining ring 100 may be disposed adjacent to or in contact with the inner component 452 in the assembly 450. In several embodiments, the retaining ring 400 may be mounted on the inner component 452 in the assembly 450. The retaining ring 400 may be disposed adjacent to or in contact with the outer component 454 in the assembly 450. In several embodiments, the retaining ring 400 may be mounted on the outer component 454 in the assembly 450. In several embodiments, the assembly 450 may include a plurality of retaining rings 400, 400'.

[0073] For illustrative purposes, Figure 5A Includes a side view of the stirrer assembly according to the embodiment described herein. Figure 5B This includes an unassembled top view of the retaining ring in the stirrer assembly according to the embodiments described herein. Figures 5A to 5B As shown, the stirrer assembly 550 may include a retaining ring 500 located within the stirrer assembly 550 between the housing 554 and the bushing / bearing 552. The stirrer assembly 550 may also include a plurality of blades 560 operatively connected to the retaining ring 500.

[0074] Generally, a method of forming a retaining ring 100 may include: providing a blank comprising a substrate 1119 and a polymer layer 1104 coupled to the substrate 1119; and forming the blank into a retaining ring 100 comprising an open annular body 102 adapted to contact at least one of an internal component 552 or an external component 554 within a stirrer assembly.

[0075] Figure 6The graphs include noise reduction [dB] of the stirrer assembly according to the embodiments herein relative to stirrer assemblies known in the art. Sample 1 is the average noise reduction reading of multiple tracks of a stirrer assembly according to the embodiments herein, having internal components (multiple tolerance rings and bearings) and an external component (housing), with retaining rings fitted between the internal and external components. Sample 4 is the noise reduction reading of a stirrer assembly according to a conventional stirrer assembly, having internal components (bearings) and an external component (housing) without retaining rings fitted between the internal and external components. Figure 6 As shown, the retaining ring according to the embodiment of this article provides an optimized level of noise reduction [dB] in the mixer assembly that is not found in conventional mixer assemblies.

[0076] Applications of the implementation scheme include, for example, mixers, agitators, food preparation components, or other types of applications. According to the specific implementation scheme described herein, the retaining ring can provide reduced noise / vibration / acoustic roughness, reduce wear on the retaining ring surface and mating parts, and reduce complex parts and assembly time, thereby increasing the lifespan of the components, retaining ring, and other parts, improving visual appearance, and enhancing effectiveness and performance compared to conventional mixer assemblies.

[0077] Note that not all of the above features are required; specific feature areas may not be required; and one or more features may be provided in addition to those described. Furthermore, the order in which the features are described does not necessarily correspond to the order in which they are installed.

[0078] For clarity, certain features described herein in the context of individual embodiments may also be provided in combination in a single embodiment. Conversely, for brevity, the various features described in the context of a single embodiment may also be provided individually or in any sub-combination.

[0079] The benefits, other advantages, and solutions to problems have been described above with respect to specific embodiments. However, these benefits, advantages, solutions to problems, and any features that may cause any benefit, advantage, or solution to occur or become more significant should not be construed as key, necessary, or essential features of any or all claims.

[0080] The description and illustrations of the embodiments described herein are intended to provide a general understanding of the structure of various embodiments. The description and illustrations are not intended to be an exhaustive and comprehensive description of all elements and features of components and systems using the structures or methods described herein. Individual embodiments may also be provided in combination within a single embodiment, and conversely, for brevity, various features described in the context of a single embodiment may also be provided individually or in any sub-combination. Furthermore, references to values ​​stated in the scope include every value within that scope. Many other embodiments will become apparent to those skilled in the art only after reading this specification. Other embodiments may be used and other embodiments may be derived from this disclosure, such that structural substitutions, logical substitutions, or any changes may be made without departing from the scope of this disclosure. Therefore, this disclosure should be considered illustrative rather than restrictive.

Claims

1. A mixer assembly comprising: an inner member comprising a bearing oriented along a central axis; an outer member comprising a housing at least partially disposed outside of the inner member and concentric with the inner member; and at least one snap ring radially disposed between the inner member and the outer member, the at least one snap ring comprising: a snap ring body comprising an open annular body defining an aperture oriented along the central axis, wherein the snap ring body comprises a base and a polymer layer covering the base.

2. The mixer assembly of claim 1, wherein the base of the snap ring body comprises a metal.

3. The mixer assembly of claim 2, wherein the metal comprises stainless steel, spring steel, or carbon steel.

4. The mixer assembly of any one of claims 1-3, wherein the polymer layer comprises a polymer.

5. The mixer assembly of claim 4, wherein the polymer layer comprises a polyketone, a polyaramid, a thermoplastic polyimide, a polyetherimide, a polyphenylene sulfide, a polyether sulfone, a polysulfone, a polyphenyl sulfone, a polyamide-imide, an ultra-high molecular weight polyethylene, a thermoplastic fluoropolymer, a polyamide, a polybenzimidazole, an elastomer, or any combination thereof.

6. The mixer assembly of claim 4, wherein the polymer layer comprises a fluoropolymer.

7. The mixer assembly of claim 6, wherein the polymer layer comprises polytetrafluoroethylene.

8. The mixer assembly of any one of claims 1-3, wherein the snap ring further comprises an adhesive layer disposed between the base and the polymer layer.

9. The mixer assembly of claim 8, wherein the adhesive layer comprises at least one of a fluoropolymer, an epoxy resin, a polyimide resin, a polyether / polyamide copolymer, ethylene vinyl acetate, ethylene tetrafluoroethylene (ETFE), an ETFE copolymer, perfluoroalkoxy (PFA), or any combination thereof.

10. The mixer assembly of any one of claims 1-3, wherein the polymer layer has a thickness between 50 micrometers and 1000 micrometers.

11. The mixer assembly of any one of claims 1-3, wherein the annular body comprises a first major surface and a second major surface having a thickness disposed therebetween along the central axis.

12. The mixer assembly of claim 11, wherein the annular body has a thickness in a range between 0.5 mm and 1 mm.

13. The mixer assembly of any one of claims 1-3, wherein the annular body comprises a first circumferential end and a second circumferential end defining an opening in the annular body.

14. The mixer assembly of claim 13, wherein at least one of the first circumferential end or the second circumferential end comprises a protrusion portion defining a protrusion portion aperture oriented along the central axis. ​ 15. The beater assembly of claim 14, wherein the protruding portion protrudes inward in a radial direction.

16. The beater assembly of claim 14, wherein the protruding portion is at least partially arcuate.

17. The beater assembly of any one of claims 1-3, wherein the annular body has an inner diameter in a range between 5 mm and 10 mm.

18. The beater assembly of any one of claims 1-3, wherein the annular body has an outer diameter in a range between 8 mm and 15 mm.

19. The beater assembly of any one of claims 1-3, wherein at least one of the housing or the bearing is operatively connected to a plurality of blades.

20. The beater assembly of any one of claims 1-3, wherein the at least one snap ring comprises a plurality of snap rings.

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