Multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment

Abstract

The invention is applicable to the field of additive manufacturing, and provides a multi-laser intelligent thermal management and wavelength stabilization system for forging and printing equipment, which comprises a central thermal management unit, a graded temperature control cooling loop, a thermally induced deformation real-time compensation system and a wavelength locking and monitoring system, the central heat management unit is electrically connected with all the systems and communicates with a forging and printing equipment upper computer. The graded temperature control cooling loop comprises a first-stage water cooling machine and a second-stage precise temperature control module which are connected in series, so that + / -0.1 DEG C precise temperature control is realized; the thermally induced deformation real-time compensation system monitors light beam parameters through a spectroscope and a light beam quality analyzer, and compensates a thermal lens effect in cooperation with a beam expander; the wavelength locking and monitoring system monitors the wavelength by using a spectroscope and a micro spectrometer, and realizes the stability of the wavelength within + / -0.5 nm in combination with secondary temperature control; the problems of multi-laser thermal runaway, light beam quality degradation and wavelength drift are solved, the forging printing precision is improved, the service life of equipment is prolonged, and the method is suitable for machining of metal components such as titanium alloy and copper materials.

Description

Technical Field

[0001] This invention belongs to the field of additive manufacturing, and in particular relates to a multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment. Background Technology

[0002] In metal powder forging printing equipment applications, the long-term high-load operation of multiple lasers (continuous lasers for melting and pulsed lasers for forging) presents the following technical problems, which correspond one by one to the subsequent beneficial effects: Laser performance fluctuations: Traditional air-cooled or single-path water-cooled systems have a temperature control accuracy of only ±1~2℃, which cannot suppress laser chip temperature fluctuations, resulting in output power drift (affecting the stability of the molten pool and the consistency of forging energy), wavelength shift (reducing material absorption rate), and high temperature accelerates the aging of internal components, shortening the equipment life. Beam quality degradation: High-power operation of multiple lasers can easily cause thermal lensing effect. Existing technologies lack real-time beam monitoring and compensation mechanisms, resulting in beam distortion and increased divergence angle, which directly reduces the accuracy of forging printing. Poor material compatibility: Semiconductor laser wavelengths are sensitive to temperature, and existing systems lack wavelength locking mechanisms. In particular, for wavelength-sensitive materials such as copper and gold, the absorption rate can easily decrease, leading to low processing efficiency and insufficient component density. High production risk: The lack of real-time monitoring and graded protection mechanisms for cooling system flow and device temperature means that abnormal parameters cannot be responded to in a timely manner, which can easily lead to laser burnout and the production of batches of defective products. Therefore, a multi-laser intelligent thermal management and wavelength stabilization system is needed for forging printing equipment to solve the above problems. Summary of the Invention

[0003] The purpose of this invention is to provide a multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment, in order to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: The multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment includes a central thermal management unit, a graded temperature control cooling circuit, a real-time thermal deformation compensation system, and a wavelength locking and monitoring system. The central thermal management unit is electrically connected to the graded temperature control cooling circuit, the real-time thermal deformation compensation system, and the wavelength locking and monitoring system, and communicates bidirectionally with the host computer of the forging printing equipment. The graded temperature control cooling circuit includes a first-stage water chiller and a second-stage precision temperature control module connected in series. The second-stage precision temperature control module includes a semiconductor cooling chip, a high-precision temperature sensor, and a PID controller. The high-precision temperature sensor is set close to the laser and is electrically connected to the PID controller. The PID controller is electrically connected to the semiconductor cooling chip. The real-time thermal deformation compensation system includes a beam splitter integrated into the optical path, a beam quality analyzer optically connected to the beam splitter, and a beam expander electrically connected to the central thermal management unit. The beam quality analyzer is electrically connected to the central thermal management unit. The wavelength locking and monitoring system includes a beam splitter located at the laser's output end and a miniature spectrometer optically connected to the beam splitter. The miniature spectrometer is electrically connected to the central thermal management unit. By centrally managing the tiered temperature-controlled cooling loops, the real-time thermal deformation compensation system, and the wavelength locking and monitoring system, an integrated architecture of "heat dissipation-temperature control-compensation-locking" is constructed. The primary water chiller rapidly dissipates the laser's basic heat, preventing heat accumulation. The secondary precision temperature control module achieves precise temperature control by using a closed-loop system of "high-precision temperature sensor monitoring - PID controller calculation - semiconductor cooling chip execution," closely positioned to the laser. The real-time thermal deformation compensation system uses a beam splitter for beam splitting and a beam quality analyzer for monitoring, while a beam expander dynamically corrects the beam. The wavelength locking and monitoring system, combined with spectrometer monitoring and temperature control adjustment, ensures wavelength stability. This structure overcomes the limitations of traditional cooling systems that only "dissipate heat" without "controlling laser performance," ensuring that multiple lasers operate at their optimal state throughout the entire process.

[0005] A further technical solution is that the secondary precision temperature control module can stably control the surface and internal temperature of the laser within a set value of ±0.1℃; avoid the decrease in laser energy conversion efficiency caused by temperature changes, thereby stabilizing the output power (fluctuation ≤1.5%), while providing a stable temperature basis for wavelength locking, preventing wavelength drift, ensuring stable absorption of laser energy by the material, and improving the repeatability of the forging printing process.

[0006] A further technical solution involves a beam quality analyzer that can monitor the laser spot morphology, divergence angle, and M2 factor in real time, and transmit the monitoring data to the central thermal management unit. The beam quality analyzer monitors the spot morphology, divergence angle, and M2 factor, which are core parameters for evaluating beam quality. Real-time monitoring data allows the central thermal management unit to accurately determine the degree of influence of the thermal lensing effect, providing a basis for beam expander adjustment, ensuring that the M2 factor is stable within 1.2 and the spot distortion is <5%, avoiding the decrease in forging printing accuracy due to beam degradation, and meeting the requirements for high-precision metal component processing.

[0007] A further technical solution involves the micro spectrometer monitoring the center wavelength of the laser. If the wavelength drifts, the central thermal management unit adjusts the laser temperature by controlling the secondary precision temperature control module to lock the wavelength within ±0.5nm of the target value. The micro spectrometer captures changes in the center wavelength of the laser in real time, and the central thermal management unit fine-tunes the laser temperature through the secondary precision temperature control module to lock the wavelength within ±0.5nm of the target value, ensuring that the laser wavelength matches the optimal absorption wavelength of the material. For example, the absorption rate of copper to laser can be increased from 35% under traditional cooling to 48%, solving the problem of low processing efficiency of wavelength-sensitive materials and improving the density of components (up to 99.5%).

[0008] A further technical solution involves a built-in material-temperature database in the central thermal management unit, which can automatically recommend or set the optimal operating temperature of the laser based on the process parameters (material type, forging and printing precision) of the forging and printing equipment. The built-in material-temperature database (storing the optimal absorption wavelength and corresponding recommended operating temperature for materials such as titanium alloys, aluminum alloys, copper, and gold) can automatically adapt the temperature according to the process parameters transmitted from the host computer of the forging and printing equipment, eliminating the need for repeated manual adjustments. For example, when processing titanium alloys, it can automatically retrieve the 25°C operating temperature corresponding to the 1064nm wavelength, improving operational convenience and expanding the equipment's adaptability to different materials.

[0009] A further technical solution involves a central thermal management unit that monitors the temperature of the semiconductor cooler (threshold 80℃), the laser temperature (threshold ± 0.5℃ of the recommended temperature), and the flow rate of the primary water chiller (threshold 80L / min). When these parameters are abnormal, an alert is sent to the host computer, triggering a reduction in laser power (30%-50%) or a halt to the forging printing equipment. The real-time monitoring and tiered response (alert-power reduction-shutdown) of key parameters by the central thermal management unit can prevent laser damage caused by insufficient water cooling flow or overheating of the semiconductor cooler, reducing unplanned downtime and lowering the rate of defective products. For example, when the flow rate of the primary water chiller is below 80L / min, the system can send an alert and reduce power within 5 seconds, ensuring production continuity.

[0010] A further technical solution is that the water temperature of the primary water chiller is set to 5-8°C below the recommended operating temperature of the laser, which can provide a stable heat dissipation environment for the secondary precision temperature control module and prevent the semiconductor cooling chip from losing efficiency due to insufficient heat dissipation. For example, when the recommended temperature is 25°C, the water temperature of the primary water chiller is set to 20°C to ensure that the semiconductor cooling chip is always in the high-efficiency cooling range and extend its service life.

[0011] A further technical solution involves the real-time thermal deformation compensation system and the wavelength locking and monitoring system sharing a beam splitter with a beam splitting ratio of 1:9 (10% of the beam is used for monitoring, and 90% of the beam is used for processing). The 1:9 beam splitting ratio design of the beam splitter can maximize the retention of the main beam energy (90% for processing) while meeting the beam monitoring requirements, avoiding excessive energy loss caused by multiple beam splitters, and ensuring sufficient forging energy. For example, when the peak power of the pulsed laser is 8000W, the main beam energy can still reach 7200W, meeting the requirements of high-power forging.

[0012] Compared with the prior art, the beneficial effects of the present invention are: This invention improves stability and lifespan through precise temperature control: A transmission structure consisting of a primary water chiller and a secondary precision temperature control module (semiconductor cooling chip + high-precision temperature sensor + PID controller) upgrades the process from basic heat dissipation to precise temperature control of ±0.1℃, solving the problem of coarse temperature control in traditional cooling systems. The stable temperature environment not only suppresses laser power fluctuations (≤1.5%), ensuring consistency between the molten pool and forging energy, but also slows down the aging of internal laser components. Compared to traditional cooling systems, the laser's lifespan is expected to be extended by 2-3 times, reducing overall operating costs. This invention ensures machining accuracy through collaborative compensation and locking: A thermal deformation compensation structure consisting of a beam splitter, beam quality analyzer, and beam expander corrects the thermal lensing effect in real time, ensuring a more than 15% improvement in focused spot accuracy and maintaining the M² factor within 1.2. Combined with a wavelength locking structure of a beam splitter, miniature spectrometer, and secondary precision temperature control module, the wavelength is stabilized within ±0.5 nm of the target value, increasing material absorption by 20%. This solves the problems of beam quality degradation and wavelength drift in traditional technologies, ensuring the dimensional accuracy and mechanical properties of the forged parts. This invention achieves reliable production through intelligent coordination: by constructing a transmission structure of "central thermal management unit + fault graded response" to build a multi-parameter collaborative control logic of "temperature-wavelength-beam quality-power", it upgrades from traditional "passive heat dissipation" to "active thermal management"; fault early warning and protection can avoid the risk of damage to core components in a timely manner, improving the reliability of equipment operation by 30%; at the same time, the central thermal management unit automatically adapts to process parameters, shortens the preheating time, and increases the pass rate of processed parts from 82% to 98%, ensuring the continuity and economy of the forging printing process.

[0013] To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0014] Figure 1 This is a block diagram showing the module connections of the present invention; Figure 2 This is a schematic diagram of the working principle of the precision control module of the present invention; Figure 3 This is a schematic diagram illustrating the principle of real-time compensation, wavelength locking, and monitoring control for thermally induced deformation in this invention. Figure 4 This is a schematic diagram of the process of the present invention. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0016] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.

[0017] Example 1: Application of high-precision forging printing for titanium alloy components; like Figures 1-4 As shown, this embodiment of the invention provides a multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment, including a central thermal management unit, a graded temperature control cooling circuit, a real-time thermal deformation compensation system, and a wavelength locking and monitoring system; The central thermal management unit is electrically connected to the graded temperature control cooling circuit, the real-time thermal deformation compensation system, and the wavelength locking and monitoring system, and communicates bidirectionally with the host computer of the forging printing equipment. The graded temperature control cooling circuit includes a first-stage water chiller and a second-stage precision temperature control module (including a semiconductor cooling chip, a high-precision temperature sensor, and a PID controller) connected in series. The high-precision temperature sensor is set close to the laser (6 continuous lasers, 3000W power; 7 pulsed lasers, 5000W peak power) and electrically connected to the PID controller. The PID controller is electrically connected to the semiconductor cooling chip. The real-time thermal deformation compensation system includes a beam splitter integrated into the optical path, a beam quality analyzer (model BLC1313) optically connected to the beam splitter, and a beam expander (model BXZ-1064-1-4X-D8). The beam quality analyzer and the beam expander are both electrically connected to the central thermal management unit. The wavelength locking and monitoring system includes a beam splitter located at the laser's output end and a miniature spectrometer (model OceanOpticsUSB2000+) optically connected to the beam splitter. The miniature spectrometer is electrically connected to the central thermal management unit. Furthermore, the real-time thermal deformation compensation system and the wavelength locking and monitoring system share a beam splitter with a beam splitting ratio of 1:9 (10% of the beam is used for monitoring and 90% of the beam is used for processing), and the central thermal management unit has a built-in material-temperature database.

[0018] In this embodiment, the graded temperature-controlled cooling circuit undertakes both basic heat dissipation and precise temperature control functions, and its operation process is as follows: First, the operator inputs the process parameters "titanium alloy component, forging printing accuracy ±0.05mm" into the host computer. The host computer then transmits the parameters to the central thermal management unit. The central thermal management unit retrieves the optimal absorption wavelength of 1064nm and the recommended operating temperature of 25℃ for the titanium alloy from the built-in material-temperature database. Then, the primary water chiller (model CW-7800EN) is started, and the water temperature is set to 5-8℃ below the recommended operating temperature (i.e., 20℃), providing a stable heat dissipation basis for the secondary precision temperature control module and preventing the semiconductor cooling chip from losing efficiency due to insufficient heat dissipation. After the primary water chiller has been running stably (about 3 minutes), the secondary precision temperature control module starts. The high-precision temperature sensor (model HC-27) is attached to the side wall of the laser to collect temperature data in real time and transmits the data to the PID controller. The PID controller compares the actual temperature with 25℃ and outputs a pulse signal to adjust the cooling power of the semiconductor cooling chip (model TEC1-12708), forming a closed-loop control of "monitoring-calculation-execution". Within 10 minutes, the surface and internal temperature of the laser are stabilized within 25±0.1℃, which not only suppresses laser power fluctuations (fluctuation ≤1.5%) and ensures the stability of the molten pool and the consistency of forging energy, but also provides a stable temperature environment for subsequent wavelength locking. At the same time, it slows down the aging of internal components of the laser. Compared with traditional cooling systems, the continuous fault-free working time of the laser is extended to 2.5 times.

[0019] Specifically, the wavelength locking and monitoring system is responsible for ensuring the matching between the laser wavelength and the absorption wavelength of the titanium alloy. The operation process is as follows: After the laser outputs laser light, it is split into beams at a ratio of 1:9 using a common beam splitter. 10% of the beam is transmitted to a miniature spectrometer, which collects the laser center wavelength data every 0.5 seconds and feeds the data back to the central thermal management unit in real time. When the ambient temperature rises, causing the laser temperature to rise to 25.2℃ and the wavelength to drift to 1060.6nm, the central thermal management unit detects that the wavelength drift exceeds the stable range of ±0.5nm. It immediately sends an adjustment command to the secondary precision temperature control module according to the "wavelength-temperature sensitivity curve" (for every 0.1nm wavelength drift, the temperature needs to be adjusted by 0.05-0.1℃). After receiving the command, the PID controller reduces the power of the semiconductor cooling chip, lowering the laser temperature to 24.9℃. Within 10 seconds, the wavelength is adjusted back to 1064±0.3nm to ensure that the laser wavelength is precisely matched with the optimal absorption wavelength of the titanium alloy, avoiding a decrease in material absorption rate due to wavelength deviation, thus laying the foundation for high-precision machining of titanium alloy components.

[0020] In this embodiment, the real-time thermal deformation compensation system addresses the beam quality degradation problem caused by the thermal lensing effect, and its operation process is as follows: 10% of the beam split by the shared beam splitter is synchronously transmitted to the beam quality analyzer. The beam quality analyzer monitors the laser spot morphology, divergence angle and M2 factor every second and transmits the monitoring data to the central thermal management unit. When the power of the continuous laser is increased from 3000W to 3500W, the high power induces a thermal lensing effect, causing the M2 factor to rise to 1.3 and the beam distortion to reach 7%. The central thermal management unit calculates the optimal magnification adjustment of the beam expander based on the monitoring data and sends a control signal to the beam expander. The beam expander adjusts the magnification from 2x to 2.05x through the electric adjustment mechanism. The beam shape is quickly corrected, restoring the M2 factor to a stable range of 1.1-1.2, with beam distortion <5%, and focusing beam accuracy improved by more than 15%. This avoids dimensional deviations in titanium alloy components caused by beam degradation, ultimately achieving a dimensional accuracy of ±0.04mm for the titanium alloy components, which is better than the design requirement of ±0.05mm.

[0021] Specifically, the central thermal management unit also undertakes multi-parameter monitoring and graded protection functions, and the operation process is as follows: The central thermal management unit collects real-time data on the temperature of the semiconductor cooling chip (threshold 80℃), the laser temperature (threshold 25±0.5℃), and the flow rate of the primary water chiller (threshold 80L / min); When the flow rate of the first-stage water chiller is reduced to 78L / min due to human error, the central thermal management unit will detect the abnormal flow parameter within 5 seconds and immediately send a warning signal of "insufficient water cooling flow" (including the abnormal parameter value of 78L / min) to the host computer. At the same time, it will automatically trigger the laser power reduction protection, reducing the power of the continuous laser from 3500W to 2500W. This avoids laser overheating and burnout due to insufficient water cooling flow, reduces unplanned downtime, lowers the risk of batch production of defective products, and increases the pass rate of processed parts from 82% in traditional cooling systems to 98%.

[0022] In this embodiment, for scenarios involving dynamic adjustment of laser power, the central thermal management unit implements coordinated control of "prediction-adjustment," and the action process is as follows: When the forging printing process requires increasing the power of the continuous laser from 3000W to 3500W, the host computer sends a power adjustment command to the central thermal management unit. Based on the built-in "power-heat generation" correlation model (for every 1000W increase in power, the heat generation increases by about 150W), the central thermal management unit predicts that the heat generation of the laser will increase by 75W and sends a command to the secondary precision temperature control module 0.5 seconds in advance to increase the power of the semiconductor cooling chip from 65W to 72W. During power adjustment, the laser temperature overshoot is only 0.2℃, and it is always maintained within a stable range of 25±0.1℃, ensuring that the laser performance is stable and guaranteeing the continuity and stability of the forging printing process.

[0023] Example 2: Application of high-absorption forging printing on copper components; The difference between this embodiment and Embodiment 1 is that only one pulsed laser (peak power 8000W) is used to process copper. The central thermal management unit retrieves the optimal absorption wavelength of 1060nm and the recommended operating temperature of 22℃ for copper from the built-in material-temperature database. The water temperature of the first-stage water chiller is set to 17℃ (5℃ below the recommended operating temperature of 22℃). The micro spectrometer monitors the target wavelength of 1060nm, and the beam quality analyzer focuses on monitoring the spot diameter of the pulsed laser (requiring stability within 0.1mm±5%). The temperature of the second-stage precision temperature control module is set to 22℃. The remaining structural connections of the system are the same as in Embodiment 1 (the central thermal management unit is electrically connected to each system, and the high-precision temperature sensor is electrically connected to the PID controller, etc.).

[0024] This invention provides a multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment. The system addresses the problems of low absorption rate and unstable spot diameter of copper as a wavelength-sensitive material through the coordinated operation of a graded temperature control cooling circuit, a wavelength locking and monitoring system, and a real-time thermal deformation compensation system.

[0025] In this embodiment, the graded temperature-controlled cooling circuit optimizes parameters to meet the temperature requirements of copper processing, and the operation process is as follows: After receiving the process parameters "copper components, density ≥99.3%" from the host computer, the central thermal management unit retrieves the recommended working temperature of 22℃ for the copper material, controls the primary water chiller to start and maintain a water temperature of 17℃; after the secondary precision temperature control module starts, the high-precision temperature sensor is placed close to the pulse laser to collect temperature data, and the PID controller adjusts the power of the semiconductor cooling chip according to the set temperature of 22℃. Within 8 minutes, the pulsed laser temperature is stabilized at 22±0.1℃. Compared with the titanium alloy processing in Example 1, this method is more suitable for the temperature sensitivity of copper, providing a precise temperature basis for wavelength stability and avoiding a significant decrease in the absorption rate of copper due to temperature fluctuations.

[0026] In this embodiment, the wavelength locking and monitoring system optimizes the monitoring and adjustment logic based on the wavelength sensitivity characteristics of copper. The operation process is as follows: The miniature spectrometer monitors the target wavelength of 1060nm in real time. When the ambient temperature rises by 2℃, causing the laser temperature to rise to 22.2℃ and the wavelength to drift to 1061nm, the central thermal management unit detects that the wavelength drift exceeds the ±0.5nm range and immediately controls the secondary precision temperature control module to reduce the laser temperature to 21.8℃. Within 10 seconds, the wavelength is adjusted back to 1060±0.2nm, increasing the absorption rate of copper to laser from 35% in the traditional cooling system to 48%, solving the problem of low copper processing efficiency, and improving the uniformity of melting depth in the forging area by 22%.

[0027] In this embodiment, the real-time thermal deformation compensation system focuses on optimizing the monitoring of the high-power characteristics of the pulsed laser, and the operation process is as follows: The beam quality analyzer monitors the spot diameter of the pulsed laser every second. When the pulsed laser operates continuously and causes the thermal lensing effect, resulting in the spot diameter increasing from 0.1mm to 0.102mm (exceeding the ±5% requirement range), the central thermal management unit controls the beam expander to adjust the magnification from 2.5x to 2.55x based on the monitoring data. The spot diameter quickly recovers to 0.1mm±3%, ensuring concentrated forging energy of the copper material, and the final density of the copper component reaches 99.5%, meeting the requirements for the use of high thermal conductivity copper components.

[0028] In this embodiment, the central thermal management unit optimizes the protection logic for the monitoring needs of the single-pulse laser, and the operation process is as follows: The key monitoring components are the pulsed laser temperature (threshold 22±0.5℃), the thermoelectric cooler temperature (threshold 80℃), and the primary water chiller flow rate (threshold 80L / min). When a sudden power surge in the pulsed laser causes the thermoelectric cooler temperature to rise to 78℃, the central thermal management unit immediately sends an early warning to the host computer and reduces the pulsed laser power from 8000W to 6000W. To avoid damage to the pulsed laser due to instantaneous high temperature, ensure the safety of high-power copper processing, and maintain processing efficiency, the copper processing efficiency is increased by 12% compared to traditional cooling systems.

[0029] Working principle and usage process of this invention: This system achieves intelligent thermal management of multiple lasers through a closed-loop control process encompassing "start-up-monitoring-adjustment-protection-maintenance." The specific working principle is as follows: During the system startup and preheating phase, after the forging and printing equipment is powered on, the operator inputs process parameters (material type, forging and printing accuracy, laser power range) into the host computer. The host computer then transmits these parameters to the central thermal management unit. The central thermal management unit performs a self-test on each module (primary water chiller, secondary precision temperature control module, beam quality analyzer, and miniature spectrometer), retrieving the optimal absorption wavelength, recommended operating temperature, and initial power of the semiconductor cooler from its built-in database. Subsequently, the primary water chiller is started, and the water temperature is set to 5-8°C below the recommended operating temperature. After the water chiller has stabilized (approximately 3 minutes), the secondary precision temperature control module is activated: a high-precision temperature sensor is placed against the side wall of the laser to collect temperature data, which is then transmitted to the PID controller. The PID controller compares the actual temperature with the recommended temperature and outputs a pulse signal to adjust the cooling power of the semiconductor cooler. Within 5-15 minutes, the laser temperature is stabilized to ±0.1°C of the recommended temperature, completing the preheating process. During the online monitoring and control phase of the forging and printing process, after preheating, the laser outputs laser light, and the system enters a real-time monitoring and control state, which is divided into three parallel sub-processes: (1) Wavelength monitoring and locking: The beam splitter at the laser output end splits 10% of the beam to the micro spectrometer. The micro spectrometer transmits the center wavelength data to the central thermal management unit every 0.5 seconds. If the wavelength drift is >0.5nm, the central thermal management unit sends a command to the secondary precision temperature control module according to the wavelength-temperature sensitivity curve (the temperature needs to be adjusted by 0.05-0.1℃ for every 0.1nm wavelength drift). The PID controller adjusts the power of the semiconductor cooling chip to change the laser temperature and pull the wavelength back to within ±0.3nm of the target value. (2) Beam quality monitoring and compensation: The beam splitter in the optical path splits another 10% beam to the beam quality analyzer. The analyzer transmits the spot morphology, divergence angle and M2 factor data every 1 second. If the M2 factor is >1.3 or the spot distortion is >8%, the central thermal management unit calculates the optimal magnification adjustment of the beam expander, sends a command to the beam expander, and changes the magnification through the electric adjustment mechanism to correct the beam shape and restore the M2 factor to within 1.2. (3) Continuous temperature monitoring: The high-precision temperature sensor transmits temperature data to the PID controller and the central thermal management unit every 0.1 seconds. The PID controller fine-tunes the power of the semiconductor cooling chip in real time to maintain temperature stability. The central thermal management unit simultaneously monitors the water temperature and flow rate of the primary water chiller to ensure stable heat dissipation for the semiconductor cooling chip. Laser power variation collaborative management stage: When the forging printing process requires adjustment of laser power, the host computer sends a power adjustment command to the central thermal management unit. The central thermal management unit, based on the "power-heat generation" correlation model (for every 1000W increase in power, heat generation increases by approximately 150W), predicts the change in laser heat generation. If the power is increased, a command is sent to the secondary precision temperature control module 0.5-1 seconds in advance to increase the cooling power of the semiconductor cooling chip; if the power is decreased, the cooling power is decreased in advance. Through this "prediction-adjustment" process, the temperature overshoot during power changes is controlled within ±0.3℃, ensuring laser power fluctuations are ≤2%. Abnormal Fault Warning and Protection Phase: The central thermal management unit monitors the following key parameters in real time: ① Laser temperature exceeds the recommended temperature ±0.5℃ and cannot be adjusted back; ② Semiconductor cooler temperature exceeds 80℃; ③ Primary water chiller flow rate is lower than 80L / min or water temperature exceeds the set value ±2℃; ④ Wavelength drift > 1nm and cannot be locked; ⑤ M2 factor > 1.5 and cannot be compensated. When any parameter is abnormal, the central thermal management unit immediately sends a fault warning signal to the host computer (including fault type and abnormal parameter value), and triggers the protection mechanism according to the severity of the fault: minor abnormalities only issue a warning; moderate abnormalities automatically reduce laser power by 30%-50%; severe abnormalities trigger the forging and printing equipment to stop, cut off laser output, and protect core components. Forging Printing Completion and Maintenance Phase: After the forging printing task is completed, the operator issues a shutdown command on the host computer; the central thermal management unit controls: ① the laser stops outputting; ② the power of the thermoelectric cooler is reduced by 20% every 2 minutes to avoid damage to the laser components from a sudden temperature drop; ③ the primary water chiller continues to run for 10-20 minutes, and is shut down after the laser temperature drops to within room temperature +5℃; at the same time, the central thermal management unit stores the temperature control data of the entire forging printing process, and judges the health status of the device through a trend analysis algorithm (linear regression of thermoelectric cooler power decay rate). If it finds that the thermoelectric cooler power decay rate is accelerating or the water chiller flow rate stability is decreasing, it pushes maintenance suggestions to the host computer (such as "it is recommended to clean the thermoelectric cooler heat sink within 100 hours") to achieve predictive maintenance.

[0030] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment, comprising a central thermal management unit, a graded temperature control cooling circuit, a real-time thermal deformation compensation system, and a wavelength locking and monitoring system, characterized in that: The central thermal management unit is electrically connected to the graded temperature control cooling circuit, the real-time thermal deformation compensation system, and the wavelength locking and monitoring system, and communicates bidirectionally with the host computer of the forging printing equipment. The graded temperature control cooling circuit includes a first-stage water chiller and a second-stage precision temperature control module connected in series. The second-stage precision temperature control module includes a semiconductor cooling chip, a high-precision temperature sensor, and a PID controller. The high-precision temperature sensor is set close to the laser and is electrically connected to the PID controller. The PID controller is electrically connected to the semiconductor cooling chip. The real-time thermal deformation compensation system includes a beam splitter integrated into the optical path, a beam quality analyzer optically connected to the beam splitter, and a beam expander electrically connected to the central thermal management unit. The beam quality analyzer is electrically connected to the central thermal management unit. The wavelength locking and monitoring system includes a beam splitter located at the laser's output end and a miniature spectrometer optically connected to the beam splitter. The miniature spectrometer is electrically connected to the central thermal management unit.

2. The multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment according to claim 1, characterized in that: The secondary precision temperature control module can stably control the surface and internal temperature of the laser within a set value of ±0.1℃.

3. The multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment according to claim 1, characterized in that: The beam quality analyzer can monitor the laser spot morphology, divergence angle and M2 factor in real time, and transmit the monitoring data to the central thermal management unit.

4. The multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment according to claim 1, characterized in that: The micro spectrometer monitors the center wavelength of the laser. If the wavelength drifts, the central thermal management unit adjusts the laser temperature by controlling the secondary precision temperature control module to lock the wavelength within the target value of ±0.5nm.

5. The multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment according to claim 1, characterized in that: The central thermal management unit has a built-in material-temperature database that can automatically recommend or set the optimal operating temperature of the laser based on the process parameters of the forging printing equipment.

6. The multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment according to claim 1, characterized in that: The central thermal management unit can monitor the temperature of the semiconductor cooling chip, the laser temperature, and the flow rate of the primary water chiller. When the parameters are abnormal, it sends an early warning to the host computer and triggers the laser to reduce power or the forging printing equipment to stop.

7. The multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment according to claim 1, characterized in that: The water temperature of the primary water chiller is set to 5-8°C below the recommended operating temperature of the laser, providing a heat dissipation basis for the secondary precision temperature control module.

8. The multi-laser intelligent thermal management and wavelength stabilization system for forging printing equipment according to claim 1, characterized in that: The real-time thermal deformation compensation system and the wavelength locking and monitoring system share a beam splitter with a beam splitting ratio of 1:9.

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