Bluetooth sound equipment with heat dissipation function

Abstract

The utility model relates to the technical field of Bluetooth sound equipment, and discloses a Bluetooth sound with a heat dissipation function, which comprises a shell, a control assembly and a heat dissipation assembly, a detachably connected shell cover is arranged at the top end of the shell, and a first filter screen is arranged on the shell cover; a heat dissipation cavity and a sound playing cavity are formed between the shell and the shell cover; the control assembly comprises a circuit board, a power supply module and a sound module; the circuit board is arranged in the sound playing cavity; the power supply module is arranged in the sound playing cavity, is positioned below the circuit board and is used for normal use of the circuit board and the sound module; the sound modules are arranged on the circuit board and located on the two sides of the power supply module. The power supply module is electrically connected with the circuit board and the sound module respectively; the heat dissipation assembly comprises a first heat dissipation unit and a second heat dissipation unit; the first heat dissipation unit is arranged between the circuit board and the heat dissipation cavity and is used for transferring heat of the circuit board into the heat dissipation cavity; the second heat dissipation unit is arranged in the heat dissipation cavity, located above the first heat dissipation unit and used for rapidly discharging heat in the heat dissipation cavity.

Description

Technical Field

[0001] This utility model relates to the field of Bluetooth speaker technology, specifically a Bluetooth speaker with heat dissipation function. Background Technology

[0002] Bluetooth speakers are audio devices with built-in Bluetooth chips that use Bluetooth connections instead of traditional wired connections. They connect to Bluetooth playback devices such as mobile phones, tablets, and laptops for convenience and speed, and are frequently used outdoors.

[0003] To ensure the normal operation of the audio system and prevent damage to internal components due to overheating, a heat dissipation mechanism is usually installed on the audio system to dissipate the heat generated during operation.

[0004] However, existing heat dissipation mechanisms are usually simple vents that dissipate internal heat to the outside through natural convection. However, under long-term high-load operation, simple vents often cannot quickly and effectively dissipate the heat inside the speaker, causing the speaker to overheat, damaging the electronic components inside the speaker, and thus affecting the sound performance.

[0005] Therefore, there is an urgent need for a Bluetooth speaker with heat dissipation capabilities to solve the above problems. Utility Model Content

[0006] Based on the above, the purpose of this utility model is to provide a Bluetooth speaker with heat dissipation function to solve the problem that the heat dissipation mechanism of existing speakers will overheat after long-term use, resulting in damage to its internal electronic components.

[0007] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0008] A Bluetooth speaker with heat dissipation function includes a housing, a control component, and a heat dissipation component. The housing has a detachable cover at its top, and the cover has a first filter. A heat dissipation cavity and a sound playback cavity are formed between the housing and the cover. The control component includes a circuit board, a power supply module, and a speaker module. The circuit board is located within the sound playback cavity. The power supply module is located within the sound playback cavity and below the circuit board, providing power to the circuit board and the speaker module. The speaker module is located on the circuit board and on both sides of the power supply module, used for audio playback. The power supply module is electrically connected to both the circuit board and the speaker module. The heat dissipation component includes a first heat dissipation unit and a second heat dissipation unit. The first heat dissipation unit is located between the circuit board and the heat dissipation cavity, transferring heat from the circuit board to the heat dissipation cavity. The second heat dissipation unit is located within the heat dissipation cavity and above the first heat dissipation unit, rapidly dissipating heat from the heat dissipation cavity.

[0009] As a preferred embodiment of a Bluetooth speaker with heat dissipation function, a heat-conducting layer for rapid heat conduction is provided between the sound playback cavity and the heat dissipation cavity.

[0010] As a preferred embodiment of a Bluetooth speaker with heat dissipation function, the first heat dissipation unit includes multiple sets of first heat sinks and multiple sets of second heat sinks; one end of the first heat sink is connected to the circuit board, and the other end extends from bottom to top through the heat-conducting layer and into the second heat dissipation unit; the second heat sink is disposed between the first heat sinks; one end of the second heat sink is connected to the circuit board, and the other end extends from bottom to top through the heat-conducting layer and into the heat dissipation cavity; the height of the first heat sink is lower than the height of the second heat sink.

[0011] As a preferred embodiment of a Bluetooth speaker with heat dissipation function, the second heat dissipation unit includes two sets of heat dissipation mounting bases distributed on the left and right sides and a heat dissipation fan disposed in the heat dissipation mounting base; multiple sets of heat dissipation holes are provided between the heat dissipation mounting base and the first heat sink.

[0012] As a preferred embodiment of a Bluetooth speaker with heat dissipation function, a sound insulation layer for sound insulation is provided between the heat dissipation mounting base and the heat dissipation cavity, and the sound insulation layer is located between the heat dissipation mounting base and the heat conduction layer.

[0013] As a preferred embodiment of a Bluetooth speaker with heat dissipation function, the second heat dissipation unit further includes a temperature sensor; the temperature sensor is electrically connected to the circuit board and is also electrically connected to the cooling fan.

[0014] As a preferred solution for a Bluetooth speaker with heat dissipation function, the outer shell has a second filter screen on both sides corresponding to the speaker module, and the second filter screen is detachably connected to the outer shell.

[0015] As a preferred solution for a Bluetooth speaker with heat dissipation function, the power supply module includes a power supply box and a battery; the power supply box is fixedly disposed inside the sound playback cavity and located below the circuit board; the battery is disposed inside the power supply box.

[0016] As a preferred solution for a Bluetooth speaker with heat dissipation function, the outer casing has multiple control buttons on one side that are electrically connected to the circuit board.

[0017] The beneficial effects of this utility model are as follows:

[0018] By setting up a first heat dissipation unit and a second heat dissipation unit, the first heat dissipation unit directly contacts the circuit board through multiple sets of first and second heat dissipation fins, efficiently transferring heat to the heat dissipation cavity. Then, the second heat dissipation unit uses its internal cooling fan to quickly dissipate the heat from the heat dissipation cavity, ensuring that the internal temperature of the speaker is always kept within a safe range. This reduces the risk of component aging and damage caused by overheating and significantly extends the service life of the speaker. Attached Figure Description

[0019] Figure 1 A schematic diagram of the overall structure of a Bluetooth speaker with heat dissipation function provided by this utility model;

[0020] Figure 2 A schematic diagram of the internal structure of a Bluetooth speaker with heat dissipation function provided by this utility model;

[0021] Figure 3 for Figure 2 Enlarged diagram of A in the middle;

[0022] Figure 4 This is a side view of a Bluetooth speaker with heat dissipation function provided by this utility model.

[0023] The following are the labeling elements in the figure:

[0024] 10. Outer casing; 11. Cover; 12. First filter; 13. Second filter; 20. Circuit board; 21. Power supply module; 22. Audio module; 24. Control button; 31. First heat dissipation unit; 311. First heat sink; 312. Second heat sink; 32. Second heat dissipation unit; 321. Heat dissipation mounting base; 322. Cooling fan; 33. Thermal conductive layer; 34. Sound insulation layer; 35. Temperature sensor. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0026] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0028] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0029] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no specific meaning.

[0030] In one embodiment of this utility model, such as Figure 1-4As shown, a Bluetooth speaker with heat dissipation function is provided, including a housing 10, a control component, and a heat dissipation component. The housing 10 has a detachably connected cover 11 at its top, and a first filter 12 is provided on the cover 11. A heat dissipation cavity and a sound emission cavity are formed between the housing 10 and the cover 11. The control component includes a circuit board 20, a power supply module 21, and a speaker module 22. The circuit board 20 is disposed within the sound emission cavity. The power supply module 21 is disposed within the sound emission cavity and located below the circuit board 20, for powering the circuit board 20 and the speaker module 22. The speaker module 22 is disposed on the circuit board 20 and located on both sides of the power supply module 21, for audio playback. The power supply module 21 is electrically connected to both the circuit board 20 and the speaker module 22. The heat dissipation component includes a first heat dissipation unit 31 and a second heat dissipation unit 32. The first heat dissipation unit 31 is disposed between the circuit board 20 and the heat dissipation cavity, for transferring heat from the circuit board 20 to the heat dissipation cavity. The second heat dissipation unit 32 is located inside the heat dissipation cavity and above the first heat dissipation unit 31, and is used to quickly dissipate the heat in the heat dissipation cavity.

[0031] By setting up a first heat dissipation unit 31 and a second heat dissipation unit 32, the first heat dissipation unit 31 directly contacts the circuit board 20 through multiple sets of first heat sinks 311 and second heat sinks 312, efficiently conducting heat to the heat dissipation cavity. Then, the second heat dissipation unit 32 uses its internal cooling fan 322 to quickly dissipate the heat from the heat dissipation cavity, ensuring that the internal temperature of the speaker is always kept within a safe range, thereby reducing the risk of component aging and damage caused by overheating and significantly extending the service life of the speaker.

[0032] Preferably, a heat-conducting layer 33 for rapid heat conduction is provided between the sound cavity and the heat dissipation cavity. In this embodiment, the heat-conducting layer 33 is made of thermally conductive silicone. The heat in the sound cavity is rapidly conducted to the first heat dissipation unit 31 through the heat-conducting layer 33, and then the heat is transferred to the heat dissipation cavity through the first heat dissipation unit 31. Under the action of the heat dissipation cavity and the second heat dissipation unit 32, the heat is rapidly transferred to the outside, which significantly improves the heat transfer efficiency and effectively prevents overheating inside the speaker.

[0033] Specifically, the first heat dissipation unit 31 includes multiple sets of first heat sinks 311 and multiple sets of second heat sinks 312. One end of the first heat sink 311 is connected to the circuit board 20, and the other end extends from bottom to top through the thermally conductive layer 33 and into the second heat dissipation unit 32. The second heat sinks 312 are disposed between the first heat sinks 311. One end of the second heat sink 312 is connected to the circuit board 20, and the other end extends from bottom to top through the thermally conductive layer 33 and into the heat dissipation cavity. The height of the first heat sinks 311 is lower than the height of the second heat sinks 312. By setting the first heat sinks 311 and the second heat sinks 312, the heat on the circuit board 20 can be dissipated into the heat dissipation cavity more quickly, effectively avoiding overheating problems under long-term high-load operation and protecting the internal electronic components of the audio system.

[0034] Specifically, the second heat dissipation unit 32 includes two sets of left and right distributed heat dissipation mounting bases 321 and a cooling fan 322 disposed within the heat dissipation mounting bases 321. Multiple sets of heat dissipation holes are provided between the heat dissipation mounting bases 321 and the first heat sink 311. During prolonged high-load operation, the cooling fan 322 can quickly dissipate heat from the heat dissipation cavity, preventing excessively high internal temperatures of the speaker, thereby ensuring stable operation and sound performance.

[0035] Furthermore, a sound-insulating layer 34 for sound insulation is provided between the heat dissipation mounting base 321 and the heat dissipation cavity, and the sound-insulating layer 34 is located between the heat dissipation mounting base 321 and the heat-conducting layer 33. In this embodiment, the sound-insulating layer 34 is made of sound-insulating cotton or sound-insulating felt. By setting the sound-insulating layer 34, the additional noise generated by the operation of the cooling fan 322 is avoided from interfering with the sound effect performance, thereby improving the sound effect of the Bluetooth speaker.

[0036] Furthermore, the second heat dissipation unit 32 also includes a temperature sensor 35. The temperature sensor 35 is electrically connected to the circuit board 20 and to the cooling fan 322. In this embodiment, a microcontroller, such as an STC89C52, is also provided between the temperature sensor 35 and the cooling fan 322. The microcontroller adjusts the power of the cooling fan 322 according to the information feedback from the temperature sensor 35. By setting the temperature sensor 35 to monitor the temperature inside the sound chamber and providing feedback based on the temperature, the power of the cooling fan 322 is adjusted accordingly to prevent overheating, thereby protecting the internal electronic components of the speaker and ensuring that the sound effect is not affected.

[0037] Preferably, a second filter 13 is provided on both sides of the outer casing 10 corresponding to the speaker module 22, and the second filter 13 is detachably connected to the outer casing 10. By providing a detachable second filter 13, it is convenient for the user to clean the second filter 13 and avoid excessive dust accumulation.

[0038] Preferably, the power supply module 21 includes a power supply box and a battery. The power supply box is fixedly disposed inside the sound cavity and located below the circuit board 20. The battery is disposed inside the power supply box. By setting up the power supply box and the battery, a power guarantee is provided for the normal operation of the Bluetooth speaker, thereby ensuring the normal operation of the Bluetooth speaker.

[0039] Preferably, one side of the outer casing 10 is provided with multiple sets of control buttons 24 electrically connected to the circuit board 20. In this embodiment, the control buttons 24 include a power button, a Bluetooth button, a pause / start button, a volume down button, a volume up button, and a mode button. The user controls the buttons according to their needs to achieve the corresponding functions.

[0040] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.

Claims

1. A Bluetooth speaker with heat dissipation function, characterized in that, include: The outer casing has a detachable cover at its top, and a first filter screen is provided on the cover; a heat dissipation cavity and a sound emission cavity are formed between the outer casing and the cover. A control component includes a circuit board, a power supply module, and an audio module. The circuit board is disposed within the sound emission cavity. The power supply module is disposed within the sound emission cavity and located below the circuit board, for powering the circuit board and the audio module. The audio module is disposed on the circuit board and located on both sides of the power supply module, for audio playback. The power supply module is electrically connected to both the circuit board and the audio module. A heat dissipation assembly includes a first heat dissipation unit and a second heat dissipation unit; the first heat dissipation unit is disposed between the circuit board and the heat dissipation cavity, and is used to transfer the heat of the circuit board to the heat dissipation cavity; the second heat dissipation unit is disposed in the heat dissipation cavity and located above the first heat dissipation unit, and is used to quickly dissipate the heat in the heat dissipation cavity.

2. The Bluetooth speaker with heat dissipation function according to claim 1, characterized in that, A heat-conducting layer for rapid heat conduction is provided between the sound-emitting cavity and the heat dissipation cavity.

3. The Bluetooth speaker with heat dissipation function according to claim 2, characterized in that, The first heat dissipation unit includes multiple sets of first heat sinks and multiple sets of second heat sinks; one end of the first heat sink is connected to the circuit board, and the other end passes through the heat-conducting layer from bottom to top and extends into the second heat dissipation unit; The second heat sink is disposed between the first heat sinks; one end of the second heat sink is connected to the circuit board, and the other end passes through the thermally conductive layer from bottom to top and extends into the heat dissipation cavity; the height of the first heat sink is lower than the height of the second heat sink.

4. The Bluetooth speaker with heat dissipation function according to claim 3, characterized in that, The second heat dissipation unit includes two sets of heat dissipation mounting bases distributed on the left and right sides and a heat dissipation fan disposed in the heat dissipation mounting base; multiple sets of heat dissipation holes are provided between the heat dissipation mounting base and the first heat sink.

5. The Bluetooth speaker with heat dissipation function according to claim 4, characterized in that, A sound insulation layer for sound insulation is provided between the heat dissipation mounting base and the heat dissipation cavity, and the sound insulation layer is located between the heat dissipation mounting base and the heat conduction layer.

6. The Bluetooth speaker with heat dissipation function according to claim 5, characterized in that, The second heat dissipation unit further includes a temperature sensor; the temperature sensor is electrically connected to the circuit board and is also electrically connected to the cooling fan.

7. The Bluetooth speaker with heat dissipation function according to claim 1, characterized in that, The outer casing has a second filter screen on each side corresponding to the audio module, and the second filter screen is detachably connected to the outer casing.

8. The Bluetooth speaker with heat dissipation function according to claim 1, characterized in that, The power supply module includes a power supply box and a battery; the power supply box is fixedly disposed inside the sound cavity and located below the circuit board; the battery is disposed inside the power supply box.

9. The Bluetooth speaker with heat dissipation function according to any one of claims 1-8, characterized in that, The outer casing has multiple control buttons on one side that are electrically connected to the circuit board.

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