Method for processing a musical instrument plate

Abstract

The application provides a musical instrument plate processing method and belongs to the technical field of musical instrument processing. The musical instrument plate processing method comprises the following operation steps: placing a plate on a processing position with the first surface upward; transporting the plate through a polishing part by a transport assembly; taking down the plate; placing a processing mold on the processing position; turning the plate upside down and placing it in a placing groove of the processing mold; limiting the plate in the placing groove by a limiting part to make the plate have a corresponding arc; transporting the plate through the polishing part by the transport assembly; and taking down the plate after polishing. The musical instrument plate processing method has the advantages that the plate is placed on the processing position, the first surface of the plate is polished, the plate is turned upside down and placed in the placing groove after being taken down, the first surface of the plate has an arc consistent with the placing groove, the second surface of the plate is polished, the operation is simple, the surface arc consistency of the plate is high under the limitation of the placing groove, the accuracy is high, the error is small, and batch production is facilitated.

Description

Technical Field

[0001] This invention belongs to the field of musical instrument processing technology, and specifically relates to a method for processing musical instrument plates. Background Technology

[0002] The soundboard is the core component of stringed instruments (such as the pipa, guzheng, ruan, violin, and guitar), generally including the top and back plates. Some instruments also include side plates connecting the top and back plates. The top and back plates of a stringed instrument directly determine the instrument's resonance, tonal quality, and sound stability, and their manufacturing precision plays a decisive role in the overall quality of the instrument. The top and back plates of stringed instruments are mostly made of high-quality dried wood. To meet acoustic conduction requirements, the surface is usually designed with a complex curved structure, and the thickness follows a distribution pattern of being thicker in the middle and gradually thinning towards the edges. This special structure can resist the pressure transmitted during string vibration and also enhance the sound through its own vibration, making the tone fuller and more beautiful.

[0003] In the processing of musical instrument soundboards and backboards, the polishing of curved surfaces is a crucial step, mainly divided into manual polishing and mechanical polishing. Manual polishing is prone to uneven stress on different areas of the soundboard and backboard, resulting in curvature deviations. It is inefficient, labor-intensive, and the polishing effect is highly dependent on the operator's experience and skills, leading to poor product consistency and failing to meet the demands of large-scale standardized production. Mechanical polishing relies on polishing equipment, but soundboards and backboards do not follow a spherical shape, making it difficult to adjust the parameters of the polishing equipment. The resulting curved surface may not perfectly match the required curvature, easily leading to over-polishing or under-polishing in certain areas. This compromises curvature accuracy and surface flatness, affecting the instrument's acoustic performance. Furthermore, processing curved surfaces involves high intensity and difficulty, resulting in low processing efficiency and hindering mass production. Summary of the Invention

[0004] The purpose of this invention is to provide a method for processing musical instrument panels, which aims to solve the problem that it is difficult to control the grinding precision of the curved surface during the processing of the instrument's soundboard and backboard, thus affecting the acoustic performance of the instrument.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is: to provide a method for processing musical instrument plates, comprising the following steps:

[0006] S1. The plate is placed with its first surface facing upward on the processing position of the loading component, and the plate is limited on the processing position by the limiting component;

[0007] S2. The loading member containing the plate is transported by the transport component to pass under the grinding member, so that the grinding member grinds the first surface of the plate.

[0008] S3. After polishing, the limiting component is released from its position on the plate, and the plate is removed.

[0009] S4. Place the processing mold with the placement groove on the processing position of the loading component and fix it; the bottom surface of the placement groove is an arc surface;

[0010] S5. Flip the plate over so that the second surface of the plate is facing upwards, and place the plate in the placement groove on the upper surface of the processing mold; limit the plate in the placement groove by the limiting member so that the first surface of the plate is in close contact with the bottom of the placement groove and the plate has a corresponding curvature.

[0011] S6. The transport component transports the plate under the grinding component, so that the grinding component grinds the second surface of the plate.

[0012] S7. After grinding, the limiting member releases its restriction on the plate, and the plate is removed. The second surface of the obtained plate is a plane, and the first surface is an arc surface.

[0013] In one possible implementation, the limiting member includes:

[0014] Negative pressure air pump; and

[0015] The negative pressure pipeline is connected at one end to the negative pressure air pump and at the other end to the processing position.

[0016] The negative pressure air pump is adapted to extract the gas in the negative pressure pipeline and limit the plate to the processing position.

[0017] In one possible implementation, the loading component has an internal air extraction cavity, and the processing position is provided with a first air extraction hole, which communicates with the air extraction cavity; the end of the negative pressure pipeline away from the negative pressure air pump is connected to the air extraction cavity.

[0018] In one possible implementation, the bottom of the placement groove is provided with a second air extraction hole, which corresponds one-to-one with the first air extraction hole. The negative pressure air pump is adapted to extract the gas in the air extraction cavity and limit the plate in the placement groove.

[0019] In one possible implementation, multiple sets of the first air extraction holes are distributed around the circumference and center of the processing position.

[0020] In one possible implementation, the loading component is provided with a positioning component for positioning the processing mold.

[0021] In one possible implementation, the processing station is provided with a placement frame suitable for defining the placement orientation of the workpiece.

[0022] In one possible implementation, the transport component includes:

[0023] Guide rail, the loading component is slidably mounted on the guide rail; and

[0024] The pusher pushes the loading component to reciprocate on the guide rail.

[0025] In one possible implementation, the transport component further includes:

[0026] Support frame, the guide rail is mounted on the support frame; and

[0027] A lifting component has a lifting end, and the support frame is mounted on the lifting end.

[0028] In one possible implementation, the grinding component is disposed within a housing, and the housing contains a grinding space; the grinding component includes:

[0029] The first drive motor is mounted on the side wall of the housing, with its drive end horizontally positioned and located inside the housing.

[0030] The active roller is connected at one end to the drive end of the first drive motor;

[0031] The driven roller is disposed below the driving roller; and

[0032] A grinding belt is wound around the outside of the driving roller and the driven roller;

[0033] The transport assembly transports the sheet metal to the area below the polishing belt for polishing.

[0034] The beneficial effects of the musical instrument plate processing method provided by this invention are as follows:

[0035] Compared with the existing technology, when processing sheet metal, the first surface of the sheet metal is placed upwards, and the first surface of the sheet metal is processed first. The limiting component fixes the sheet metal in the processing position to prevent displacement of the sheet metal during grinding.

[0036] The transport component moves the loading component and plate to the underside of the grinding component. The transport component then moves the plate gradually past the underside of the grinding component. The grinding component starts grinding the first surface of the plate, which is then processed into a flat surface.

[0037] After the first side of the panel is sanded, the limiting device is released from the panel, and the operator removes the panel.

[0038] Place the processing mold on the processing position, flip the plate so that the second side of the plate is facing up, and put it into the placement slot of the processing mold. At this time, due to the thickness of the processing mold itself, after the plate is placed in the placement slot, the second side of the plate is higher than the upper surface of the processing mold.

[0039] The limiting component is activated again, limiting the plate to the placement groove. The first side of the plate will fit into the groove under the constraint of the bottom curvature of the placement groove to form the corresponding curvature. That is, the plate will deform under the action of the limiting component and produce a curved curvature. The second side of the plate is still higher than the upper surface of the processing mold.

[0040] The transport component moves the plate to the bottom of the grinding component, and the grinding component grinds the second surface of the plate to make it flat.

[0041] The resulting plate has a curved surface on the first side and a flat surface on the second side. Subsequent hot pressing and other processing techniques can be applied to further enhance the deformation resistance of the plate.

[0042] The placement groove of the processing mold provides a uniform and standard curvature reference. The first surface of the plate is tightly fitted to the bottom of the groove under the fixation of the limiting part, which ensures the consistency of the curvature forming, solves the problem of large curvature deviation in traditional processing, and significantly improves the processing accuracy of the curvature surface of the plate.

[0043] In addition, limiting components can prevent the sheet metal from shifting during processing, thus improving processing accuracy;

[0044] The grinding components operate continuously and stably, significantly reducing manual intervention and effectively improving processing efficiency;

[0045] It can be used to produce plates for various musical instruments. By changing the processing mold according to actual needs, the type of plates produced can be changed. It has a wide range of applications, is easy to operate, requires low operator proficiency, and facilitates the improvement of production accuracy and efficiency. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0047] Figure 1 This is a top view of the instrument panel processing equipment provided in an embodiment of the present invention;

[0048] Figure 2 This is a top view of the structure of a plate with its first surface facing upwards when placed on a processing station and not yet polished, according to an embodiment of the present invention.

[0049] Figure 3 A top view of the structure of a plate with its first surface facing upwards placed on a processing station, after the first surface of the plate has been polished, according to an embodiment of the present invention.

[0050] Figure 4 This is a top view of the processing mold placed on the processing position according to an embodiment of the present invention;

[0051] Figure 5 This is a top view of the structure of a plate with its second surface facing upwards when placed on a processing mold and not polished, according to an embodiment of the present invention.

[0052] Figure 6 A top view of the structure of a plate with its second surface facing upwards placed on a processing mold, after the second surface of the plate has been polished, according to an embodiment of the present invention.

[0053] Figure 7 This is a schematic diagram of the internal right-side view of the box structure used in an embodiment of the present invention;

[0054] Figure 8 This is a top view of the processing mold used in an embodiment of the present invention;

[0055] Figure 9 This is a cross-sectional view of the processing mold used in the embodiment of the present invention, taken along the axis of its length.

[0056] In the diagram: 1. Grinding part; 2. Loading part; 3. Machining position; 4. Machining mold; 5. Placement slot; 6. First air extraction hole; 7. Negative pressure air pump; 8. Negative pressure pipeline; 9. Second air extraction hole; 10. Positioning block; 11. Placement frame; 12. Guide rail; 13. Second drive motor; 14. Lead screw; 15. Support frame; 16. Lifting part; 17. Box body; 18. First drive motor; 19. Drive roller; 20. Driven roller; 21. Grinding belt; 22. Solenoid valve; 23. Mounting base; 24. First side of the plate; 25. Second side of the plate. Detailed Implementation

[0057] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0058] Please refer to Figures 1 to 9 The following is a specific embodiment of a method for processing musical instrument plates provided by the present invention, which includes the following operation steps:

[0059] S1. The first surface 24 of the plate is placed upward on the processing position 3 of the loading part 2, and the plate is limited on the processing position 3 by the limiting part;

[0060] S2. The loading component 2, which holds the plate, is transported by the transport component to pass under the grinding component 1, so that the grinding component 1 grinds the first surface 24 of the plate.

[0061] S3. After polishing, release the limiting parts from the plate and remove the plate.

[0062] S4. Place the processing mold 4 with the placement groove 5 on the processing position 3 of the loading part 2 and fix it; the bottom surface of the placement groove 5 is an arc surface;

[0063] S5. Flip the plate over so that the second side 25 of the plate faces upward and place the plate in the placement groove 5 on the upper end of the processing mold 4; limit the plate in the placement groove 5 by the limiting member so that the first side 24 of the plate is in close contact with the bottom of the placement groove 5 and the plate has a corresponding curvature.

[0064] S6. The transport component transports the plate under the grinding component 1, so that the grinding component 1 grinds the second surface 25 of the plate.

[0065] S7. After grinding, the limiting parts are released from the limiting parts, and the parts are removed. The second side of the obtained parts is flat, and the first side is curved.

[0066] For details, please refer to Figures 1 to 9 Grinding component 1 is a grinding actuator used to perform grinding operations on both sides of the plate, providing basic grinding functions for plate surface processing.

[0067] The transport component is located below the grinding part 1 to realize the reciprocating transport of the plate, ensuring that the plate can accurately reach the working area of ​​the grinding part 1, drive the plate to move within the working area of ​​the grinding part 1 to complete the plate processing, and at the same time drive the plate away from the working area of ​​the grinding part 1 to perform operations such as picking up, placing, and flipping the plate.

[0068] The transport components enable automated reciprocating transport of panels, eliminating the need for frequent manual handling and polishing of panels.

[0069] The loading component 2 is installed on the transport component, and the machining position 3 on its upper end face is used to place the plate or machining mold 4, providing a stable mounting reference for the plate or machining mold 4. The loading component 2 has the freedom to slide on the transport component, and the transport component can easily drive the loading component 2 to slide.

[0070] The processing mold 4 can be adapted to be placed on the processing position 3. The placement groove 5 on the upper surface of the processing mold 4 is used to accommodate the flipped plate. The bottom of the placement groove 5 has a curvature. The curvature of the placement groove 5 meets the specific curvature required for the processing of the plate. This curvature is the reference standard for the forming of the curved surface of the plate.

[0071] The processing mold 4 can be available in various models and specifications. The placement groove 5 is matched to plates with different curvature requirements. The processing mold 4 can be selected according to the actual situation.

[0072] The limiting component can perform a dual limiting function, which can fix the plate on the processing position 3 and limit the flipped plate in the placement groove 5, so that the plate fits the bottom of the placement groove 5. The surface of the plate that fits the placement groove 5 has an arc that is consistent with the bottom of the placement groove 5. The grinding component 1 grinds the other side of the plate into a flat surface, so that one side of the plate has the required arc.

[0073] As an optional embodiment, in step S1, the initial position of the loading member 2 is at the first end of the transport assembly, and the first surface 24 of the plate is placed upwards on the processing position 3 of the loading member 2. In step S2, the transport assembly transports the plate from the first side of the grinding member 1 to the second side for grinding, at which time the loading member 2 is located at the second end of the transport assembly. In step S3, the loading member 2 is located at the second end of the transport assembly, and the plate is released from its limiting position. In step S4, the processing mold 4 is placed on the loading member 2. In step S5, the plate is flipped up and down and limited within the placement groove 5. In step S6, the loading member 2 moves from the second end of the transport assembly to the first end of the transport assembly, transporting the plate from the second side of the grinding member 1 to the first side. In step S7, the ground plate is removed.

[0074] As another optional embodiment, in step S1, the initial position of the loading member 2 is at the first end of the transport assembly, and the first surface 24 of the plate is placed upwards on the processing position 3 of the loading member 2. In step S2, the transport assembly transports the plate from the first side of the grinding member 1 to the second side for grinding, at which time the loading member 2 is located at the second end of the transport assembly. In step S3, the loading member 2 moves from the second end of the transport assembly to the first end of the transport assembly, at which time the grinding member 1 can further process the first surface 24 of the plate. The loading member 2 reaches the first end of the transport assembly, at which point the plate is released from its limiting position. In step S4, the processing mold 4 is placed on the loading member 2. In step S5, the plate is flipped up and down and limited within the placement groove 5. In step S6, the loading member 2 moves from the first end of the transport assembly to the second end of the transport assembly, transporting the plate from the first side of the grinding member 1 to the second side. In step S7, the loading member 2 moves back to the first end of the transport assembly, the loading member 2 returns to its initial position, and the ground plate is removed.

[0075] As a specific embodiment of the musical instrument plate processing method provided by the present invention, please refer to Figures 1 to 6 The limiting component includes a negative pressure air pump 7 and a negative pressure pipeline 8. One end of the negative pressure pipeline 8 is connected to the negative pressure air pump 7, and the other end is set at the processing position 3. The negative pressure air pump 7 is adapted to extract the gas in the negative pressure pipeline 8 and limit the plate at the processing position 3.

[0076] For details, please refer to Figures 1 to 6The negative pressure air pump 7 can be installed on the ground, next to the transport component. The air pump 7 is connected to one end of the negative pressure pipeline 8 to extract gas.

[0077] The other end of the negative pressure pipeline 8 is located at processing position 3. The sheet metal / processing mold 4 is placed on processing position 3. The gas between the sheet metal / processing mold 4 and processing position 3 can be extracted to form a negative pressure state. A pressure difference is formed on the upper and lower surfaces of the sheet metal / processing mold 4. Under the action of atmospheric pressure, the sheet metal / processing mold 4 is attracted to processing position 3, thus limiting the sheet metal / processing mold 4 on processing position 3. When it is necessary to release the limitation, the negative pressure air pump 7 is turned off. The air pressure between the sheet metal / processing mold 4 and processing position 3 gradually returns to atmospheric pressure, the pressure difference between the upper and lower surfaces of the sheet metal / processing mold 4 disappears, and the sheet metal / processing mold 4 can be removed.

[0078] As a specific embodiment of the musical instrument plate processing method provided by the present invention, please refer to Figures 1 to 6 The loading component 2 has an internal air extraction cavity, and the processing position 3 is provided with a first air extraction hole 6, which is connected to the air extraction cavity; the end of the negative pressure pipeline 8 away from the negative pressure air pump 7 is connected to the air extraction cavity.

[0079] For details, please refer to Figures 1 to 6 The loading component 2 has an air extraction cavity inside, which is located between the upper and lower end faces of the loading component 2. The air extraction cavity is provided with a connection port, which is connected to the negative pressure pipeline 8.

[0080] The first air extraction hole 6 is provided on the upper end surface of the loading component 2. The lower end of the first air extraction hole 6 is connected to the air extraction cavity, and the upper end of the first air extraction hole 6 has an upper opening provided on the processing position 3.

[0081] When the sheet / mold 4 is placed on the processing position 3, the negative pressure vacuum pump 7 is started. The negative pressure vacuum pump 7 extracts the gas in the vacuum cavity through the negative pressure pipeline 8, so that the vacuum cavity is in a negative pressure state. The first vacuum hole 6 connects the vacuum cavity with the surface of the processing position 3. The gas between the surface of the processing position 3 and the sheet / mold 4 is also sucked into the vacuum cavity through the first vacuum hole 6, thereby forming a pressure difference between the upper and lower surfaces of the sheet / mold 4. Under the action of atmospheric pressure, the sheet / mold 4 is firmly adsorbed on the processing position 3, achieving limiting and fixing.

[0082] The negative pressure vacuum pump 7 is easy to start and stop. Operators only need to control the start and stop of the negative pressure vacuum pump 7 to complete the limiting and releasing of the plate / processing mold 4. The operation steps are simple and easy to understand, without the need for cumbersome mechanical adjustment steps, which reduces the difficulty of operation and reduces the time for fixing and disassembling the plate / processing mold 4. Combined with the automated transportation of the transport components, the overall processing flow is more continuous and the processing efficiency is effectively improved.

[0083] The negative pressure adsorption method does not damage the surface of the plate / processing mold 4, avoiding scratches or indentations that may be caused by mechanical clamping. It not only ensures the processing quality, but also further improves the convenience of operation, making the whole processing process more efficient, stable and easy to control.

[0084] Furthermore, multiple sets of first air extraction holes 6 can be provided and distributed on the processing position 3. During the negative pressure adsorption process, the plate / processing mold 4 is subjected to uniform force and the limiting effect on the plate / processing mold 4 can be enhanced.

[0085] Optionally, a protective valve is installed on the negative pressure pipeline 8 to control the opening and closing of the negative pressure pipeline 8.

[0086] The side wall of the loading component 2 is provided with a mounting seat 23, which has a mounting cavity. The protective valve is located in the mounting cavity, and the mounting cavity has a side opening for easy operation of the protective valve.

[0087] The protective valve can be a solenoid valve 22. Before the negative pressure vacuum pump 7 is powered on and started, the protective valve is in the closed state, isolating the vacuum chamber from the negative pressure vacuum pump 7 to prevent the negative pressure vacuum pump 7 from being accidentally powered on, causing the first vacuum port 6 to attract other objects. After ensuring that the plate / processing mold 4 is in place, manually open the protective valve to open the negative pressure pipeline 8 and perform the vacuuming operation, limiting the plate / processing mold 4. When the equipment is powered off or stopped, the protective valve will automatically close instantly, cutting off the negative pressure pipeline 8.

[0088] As a specific embodiment of the musical instrument plate processing method provided by the present invention, please refer to Figure 1 , Figure 4 , Figure 8 as well as Figure 9 The bottom of the placement groove 5 is provided with a second air extraction hole 9, which corresponds one-to-one with the first air extraction hole 6. The negative pressure air pump 7 is suitable for extracting the gas in the air extraction cavity and limiting the plate in the placement groove 5.

[0089] For details, please refer to Figure 1 , Figure 4 , Figure 8 as well as Figure 9 The bottom of the placement groove 5 is provided with a second air extraction hole 9 that corresponds one-to-one with the first air extraction hole 6, and the second air extraction hole 9 penetrates the bottom of the placement groove 5.

[0090] When placing the processing mold 4, the processing mold 4 is placed according to the position of the first air extraction hole 6, so that the second air extraction hole 9 is connected to the first air extraction hole 6.

[0091] When the processing mold 4 is placed on the processing position 3, the plate is placed in the placement groove 5. The negative pressure suction pump 7 is started. The negative pressure suction pump 7 extracts the gas in the suction cavity through the negative pressure pipeline 8, so that the suction cavity is in a negative pressure state. The first suction hole 6 and the second suction hole 9 connect the suction cavity to the bottom of the placement groove 5. The gas under the plate is also sucked into the suction cavity through the second suction hole 9 and the first suction hole 6, thereby forming a pressure difference on the upper surface of the plate and the lower surface of the processing mold 4. Under the action of atmospheric pressure, the plate and the processing mold 4 are firmly adsorbed on the processing position 3, realizing the limiting and fixing.

[0092] Under the action of negative pressure adsorption, the plate is confined to the bottom of the placement groove 5. The bottom of the placement groove 5 is arc-shaped, and the height of the center position of the placement groove 5 is greater than the height of its edge position. That is, the height of the placement groove 5 gradually decreases as it moves away from its center position.

[0093] The first surface 24 of the plate has an arc that is consistent with the bottom of the placement groove 5. Correspondingly, the second surface 25 of the plate will also have an arc. The plate deforms, and under the action of the thickness of the processing mold 4, the overall height of the plate increases. The lowest point of the height of the second surface 25 of the plate is still higher than the upper surface of the processing mold 4.

[0094] The plate placed on the processing mold 4 is processed by the grinding part 1. The grinding part 1 can process the second surface 25 of the deformed plate into a flat surface. At this time, the first surface 24 of the plate is an arc surface and the second surface 25 of the plate is a flat surface.

[0095] The first surface 24 of the plate fits the curvature of the bottom of the placement groove 5. The negative pressure adsorption avoids gaps or displacement between the plate and the bottom of the groove, ensuring that the first surface 24 of the plate can produce the curvature of the bottom of the placement groove 5, effectively reducing curvature deviation and greatly improving the processing accuracy of the curvature surface of the plate.

[0096] Compared to existing technologies that involve grinding the surface of a board to obtain an arc-shaped surface, the instrument board processing method provided by this invention reduces grinding time, lowers grinding difficulty, eliminates the need for complex equipment parameter adjustments, and improves grinding efficiency.

[0097] After the sheet is removed, some springback may occur due to deformation. The sheet can be shaped in subsequent processes, and hot pressing can be used for shaping.

[0098] As a specific embodiment of the musical instrument plate processing method provided by the present invention, please refer to Figure 1 Multiple sets of first air extraction holes 6 are distributed around the circumference and center of the processing position 3.

[0099] For details, please refer to Figure 1 Multiple sets of first air extraction holes 6 are provided, and the first air extraction holes 6 are distributed on both the circumferential edge and the center of the processing position 3.

[0100] The first air extraction hole 6 on the circumferential edge of the processing position 3 is evenly distributed along the circumference of the processing position 3.

[0101] The first suction hole 6 at the circumferential edge of processing position 3 acts on the edge area of ​​the sheet metal, while the first suction hole 6 at the center of processing position 3 acts on the center area of ​​the sheet metal. The center area and circumferential edge area of ​​the sheet metal are simultaneously subjected to negative pressure adsorption, ensuring uniform force distribution and tight adhesion to processing position 3, preventing localized weak adsorption or uneven force distribution. This helps to stably position the sheet metal at the bottom of the placement groove 5, causing stable deformation of the first surface 24 of the sheet metal, ensuring precise alignment of the sheet metal with the curvature of the groove bottom within the placement groove 5, thereby guaranteeing the accuracy of the final curved surface processing and reducing curvature deviations from the outset.

[0102] Multiple sets of first suction holes 6 allow the plate to be stably fixed with a single adsorption, eliminating the need for repeated adjustments to the plate position or supplementary adsorption. This avoids grinding interruptions or rework caused by weak adsorption, ensuring the continuity of the grinding process. It enables the grinding part 1 to operate continuously and efficiently without worrying about plate displacement affecting the grinding effect, further improving the overall processing efficiency. It also avoids deformation or damage to the plate caused by excessive local stress, eliminating the need for subsequent repairs, simplifying the processing flow, making operation more convenient and efficient, and reducing reliance on the operator's experience and skills, facilitating standardized operation.

[0103] As a specific embodiment of the musical instrument plate processing method provided by the present invention, please refer to Figures 1 to 7 The loading component 2 is equipped with a positioning component for positioning the processing mold 4.

[0104] For details, please refer to Figures 1 to 7 The positioning element is set on the upper end face of the loading element 2 and is used to position the processing mold 4.

[0105] The positioning component can be a positioning block 10, a positioning pin, or other positioning structure. Its setting position is adapted to the corresponding position of the processing mold 4, which can limit the placement position of the processing mold 4 and ensure that the processing mold 4 is in the preset accurate position when placed on the processing position 3, so as to avoid offset or misalignment.

[0106] As an optional embodiment, the positioning element includes multiple sets of positioning blocks 10, which are distributed circumferentially along the processing position 3. The processing position 3 is located inside the space enclosed by the multiple sets of positioning blocks 10, and the processing mold 4 is adapted to be placed between the positioning blocks 10.

[0107] With the constraint of the positioning component, the processing mold 4 can be quickly and accurately placed in the preset position, ensuring that the placement groove 5 on the processing mold 4 corresponds to the position of the grinding part 1, and at the same time ensuring that the second air extraction hole 9 at the bottom of the placement groove 5 is precisely aligned with the first air extraction hole 6 on the processing position 3, which helps to perform negative pressure adsorption.

[0108] As a specific embodiment of the musical instrument plate processing method provided by the present invention, please refer to Figures 1 to 3 The processing station 3 is provided with a placement frame 11 that is suitable for limiting the placement orientation of the plate.

[0109] For details, please refer to Figures 1 to 3 The shape of the placement frame 11 matches the edge shape of the sheet metal, allowing the sheet metal to be completely placed within the placement frame 11. The placement frame 11 limits the placement orientation of the sheet metal, clearly defining its correct placement orientation on the processing station 3, preventing problems such as misalignment or positional deviation. This helps improve the efficiency of sheet metal placement, shortens placement time, reduces labor intensity, and makes the entire processing process more convenient and efficient. It also reduces processing errors caused by human error, facilitating standardized and large-scale production.

[0110] As a specific embodiment of the musical instrument plate processing method provided by the present invention, please refer to Figures 1 to 7 The transport component includes a guide rail 12 and a pusher, and the loading component 2 is slidably disposed on the guide rail 12; the pusher pushes the loading component 2 to reciprocate on the guide rail 12.

[0111] For details, please refer to Figures 1 to 7 The transport component is used for reciprocating transport of the loading component 2, including a guide rail 12 and a pusher. The guide rail 12 is arranged along the transport direction. There can be two sets of guide rails 12, which are arranged in parallel relative to each other. The loading component 2 is mounted on the two sets of guide rails 12 and has the freedom to slide on the guide rails 12.

[0112] The lower end of the loading component 2 is provided with a slider, which is slidably mounted on the guide rail 12.

[0113] The pusher pushes the loading component 2 to reciprocate on the guide rail 12.

[0114] Optionally, the pushing component includes a lead screw 14 and a second drive motor 13. A first connecting beam and a second connecting beam are provided between the two sets of guide rails 12. The first connecting beam and the second connecting beam are respectively located at both ends of the guide rails 12 to connect the two sets of guide rails 12.

[0115] The second drive motor 13 is mounted on the first connecting crossbeam, and the drive end of the second drive motor 13 is positioned along the length of the guide rail 12.

[0116] The lead screw 14 is set between two sets of guide rails 12 and is set along the length of the guide rails 12. One end of the lead screw 14 is rotatably set on the first connecting crossbeam and the other end is rotatably set on the second connecting crossbeam. The drive end of the second drive motor 13 is connected to one end of the lead screw 14 and can drive the lead screw 14 to rotate.

[0117] The lower end of the loading component 2 is provided with a drive block, which is sleeved on the outside of the lead screw 14 and threadedly connected to the lead screw 14. That is, the second drive motor 13 drives the lead screw 14 to rotate, which can drive the loading component 2 to slide on the guide rail 12.

[0118] As a specific embodiment of the musical instrument plate processing method provided by the present invention, please refer to Figures 1 to 7 The transport component also includes a support frame 15 and a lifting component 16, with a guide rail 12 mounted on the support frame 15; the lifting component 16 has a lifting end, and the support frame 15 is mounted on the lifting end.

[0119] For details, please refer to Figures 1 to 7 The support frame 15 serves as the mounting carrier for the guide rail 12, providing stable support for the guide rail 12 and ensuring the installation accuracy and stability of the guide rail 12. The lifting component 16 serves as a height adjustment mechanism, which can drive the support frame 15, the guide rail 12 and the loading component 2 to lift as a whole, thereby adjusting the distance between the plate and the grinding component 1, adapting to the processing requirements of plates of different thicknesses or the adjustment of grinding depth.

[0120] The support frame 15 is frame-shaped and is set along the length of the guide rail 12, which is located at the upper end of the support frame 15.

[0121] The lifting component 16 can be a lifting cylinder, with the lifting end of the lifting cylinder facing upwards. The lifting component 16 is used to lift the support frame 15.

[0122] Optionally, the pusher can be mounted on the support frame 15, that is, the support frame 15 has a third connecting beam and a fourth connecting beam at both ends, and the pusher includes a lead screw 14 and a second drive motor 13.

[0123] The second drive motor 13 is mounted on the third connecting crossbeam, and the drive end of the second drive motor 13 is positioned along the length of the guide rail 12.

[0124] The lead screw 14 is mounted on the support frame 15 and is set along the length of the guide rail 12. One end of the lead screw 14 is rotatably mounted on the third connecting crossbeam, and the other end is rotatably mounted on the fourth connecting crossbeam. The drive end of the second drive motor 13 is connected to one end of the lead screw 14 and can drive the lead screw 14 to rotate.

[0125] The lower end of the loading component 2 is provided with a drive block, which is sleeved on the outside of the lead screw 14 and threadedly connected to the lead screw 14. That is, the second drive motor 13 drives the lead screw 14 to rotate, which can drive the loading component 2 to slide on the guide rail 12.

[0126] As a specific embodiment of the musical instrument plate processing method provided by the present invention, please refer to Figures 1 to 7 The grinding component 1 is disposed inside the housing 17, and the housing 17 has a grinding space inside. The grinding component 1 includes a first drive motor 18, a drive roller 19, a driven roller 20, and a grinding belt 21. The first drive motor 18 is disposed on the side wall of the housing 17, and its drive end is horizontally disposed and located inside the housing 17. One end of the drive roller 19 is connected to the drive end of the first drive motor 18. The driven roller 20 is disposed below the drive roller 19. The grinding belt 21 is wrapped around the outside of the drive roller 19 and the driven roller 20. The transport assembly transports the plate to the area below the grinding belt 21 for grinding.

[0127] For details, please refer to Figures 1 to 7 The housing 17 has a grinding space inside, and the grinding part 1 is placed in the grinding space of the housing 17. The side wall of the housing 17 has an opening, which is suitable for the transport components to pass through, so as to facilitate the transport of the panels.

[0128] The grinding part 1 is positioned above the transport assembly, and the first drive motor 18 is positioned on the side wall at the upper end of the housing 17. The drive end of the first drive motor 18 is positioned within the grinding space and is positioned perpendicular to the length direction of the guide rail 12.

[0129] The active roller 19 is rotatably disposed within the grinding space and is positioned near the upper end of the grinding space. The drive end of the first drive motor 18 is used to drive the active roller 19 to rotate.

[0130] The driven roller 20 is rotatably disposed within the grinding space, directly below the driving roller 19, and the driving end of the first drive motor 18 is used to drive the driving roller 19 to rotate.

[0131] The grinding belt 21 is wrapped around the outside of the drive roller 19 and the driven roller 20. The first drive motor 18 drives the drive roller 19 to rotate, which in turn drives the grinding belt 21 to rotate, and in turn drives the driven roller 20 to rotate.

[0132] The outer wall of the grinding belt 21 is provided with grinding particles for grinding the sheet metal.

[0133] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for processing musical instrument plates, characterized in that, The following steps are included: S1. The plate is placed with its first surface facing upward on the processing position of the loading component, and the plate is limited on the processing position by the limiting component; S2. The loading member containing the plate is transported by the transport component to pass under the grinding member, so that the grinding member grinds the first surface of the plate. S3. After polishing, the limiting component is released from its position on the plate, and the plate is removed. S4. Place the processing mold with the placement groove on the processing position of the loading part and fix it; the bottom surface of the placement groove is an arc surface that matches the requirements of the plate. S5. Flip the plate over so that the second surface of the plate is facing upwards, and place the plate in the placement groove on the upper surface of the processing mold; limit the plate in the placement groove by the limiting member, so that the first surface of the plate is in close contact with the bottom of the placement groove, and so that the plate flexibly fits the bottom of the groove to generate a preset curvature that matches the requirements of the plate. S6. The transport component transports the plate under the grinding component. The plate placed on the processing mold passes through the grinding component, so that the grinding component grinds the second surface of the plate. The grinding component can process the deformed second surface of the plate into a flat surface. S7. After grinding, the limiting component is released from the limiting component, and the plate is removed. The second surface of the obtained plate is a flat surface, and the first surface is an arc surface that matches the requirements of the plate. The limiting component includes a negative pressure pump and a negative pressure pipeline. One end of the negative pressure pipeline is connected to the negative pressure pump, and the other end is located at the processing position. The negative pressure pump is adapted to extract the gas in the negative pressure pipeline and limit the plate at the processing position. The loading component has an internal air extraction cavity, and the processing position is provided with a first air extraction hole, which is connected to the air extraction cavity; the end of the negative pressure pipeline away from the negative pressure air pump is connected to the air extraction cavity. The bottom of the placement groove is provided with a second air extraction hole, which corresponds one-to-one with the first air extraction hole. The negative pressure air pump is adapted to extract the gas in the air extraction cavity and limit the plate in the placement groove. In step S5, under the action of negative pressure adsorption, the plate is confined to the bottom of the placement groove. The bottom of the placement groove is arc-shaped, and the height of the center position of the placement groove is greater than the height of its edge position. That is, the height of the placement groove gradually decreases as it moves away from its center position. The first surface of the plate generates an arc consistent with the bottom of the placement groove. Correspondingly, the second surface of the plate also generates an arc. The plate deforms, and under the action of the thickness of the processing mold itself, the overall height of the plate increases. The lowest point of the height of the second surface of the plate is still higher than the upper surface of the processing mold.

2. The method for processing musical instrument plates as described in claim 1, characterized in that, Multiple sets of the first air extraction holes are distributed around the circumference and center of the processing position.

3. The method for processing musical instrument plates as described in claim 1, characterized in that, The loading component is provided with a positioning component for positioning the processing mold.

4. The method for processing musical instrument plates as described in claim 1, characterized in that, The processing station is provided with a placement frame suitable for defining the placement orientation of the workpiece.

5. The method for processing musical instrument plates as described in claim 1, characterized in that, The transport component includes: Guide rail, the loading component is slidably mounted on the guide rail; and The pusher pushes the loading component to reciprocate on the guide rail.

6. The method for processing musical instrument plates as described in claim 5, characterized in that, The transport component also includes: Support frame, the guide rail is mounted on the support frame; and A lifting component has a lifting end, and the support frame is mounted on the lifting end.

7. The method for processing musical instrument plates as described in claim 1, characterized in that, The grinding component is disposed inside the housing, and the housing has a grinding space inside; the grinding component includes: The first drive motor is mounted on the side wall of the housing, with its drive end horizontally positioned and located inside the housing. The active roller is connected at one end to the drive end of the first drive motor; The driven roller is disposed below the driving roller; and A grinding belt is wound around the outside of the driving roller and the driven roller; The transport assembly transports the sheet metal to the area below the polishing belt for polishing.

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