Anti-condensation structure and semiconductor device test equipment

Abstract

The invention provides an anti-condensation structure and semiconductor device testing equipment, and relates to the technical field of semiconductor device testing. The anti-condensation structure comprises a base, a through hole is formed in the base, the through hole is matched with the wall penetrating plate and used for allowing the wall penetrating plate to penetrate through, a cavity and a connecting pipeline are arranged in the base, the cavity surrounds the through hole and is communicated with the through hole, and an air inlet connector and an air outlet connector are further formed in the base. The gas inlet interface is communicated with the cavity through a connecting pipeline and is communicated with a gas source through a gas inlet pipeline, the gas outlet interface is communicated with the cavity through a connecting pipeline and is communicated with the gas source through a gas outlet pipeline, and a heating module is arranged on the gas inlet pipeline and is used for heating gas in the gas inlet pipeline. The anti-condensation structure can effectively prevent condensed water from being generated on the wall penetrating plate during low-temperature testing.

Description

Technical Field

[0001] This application relates to the field of semiconductor device testing technology, and more specifically, to an anti-condensation structure and semiconductor device testing equipment. Background Technology

[0002] The dynamic bias high temperature and high humidity reliability test equipment is a test equipment specifically designed for silicon carbide power semiconductor devices. This test equipment typically operates under extreme high temperature (up to +150°C) or extreme low temperature (down to -50°C), high humidity and dynamic bias conditions, and is designed to evaluate the performance and stability of devices under extreme conditions.

[0003] When testing devices, some hardware and the device under test (DUT) need to be placed inside a high and low temperature humidity test chamber. Since most hardware systems cannot operate in environments ranging from -50℃ to +150℃, these systems need to be placed in the natural environment outside the test chamber. Furthermore, because the test system requires the shortest possible connection paths and the fewest possible transfers, existing technology incorporates through-wall plates on the test chamber. Part of the through-wall plate connects to the internal hardware systems inside the test chamber, while another part connects to external hardware systems outside the test chamber.

[0004] However, during low-temperature testing, cold air inevitably flows outward along the through-wall panel, causing the temperature of the part of the through-wall panel in contact with the outside air to be significantly lower than the ambient temperature. At this time, water vapor in the environment will condense into water on the through-wall panel when it encounters the cold air. The through-wall panel integrates multiple wiring harnesses and several electronic components. Once condensation forms, it can easily cause serious malfunctions such as short circuits.

[0005] To prevent condensation, existing technologies incorporate heating circuits on the outer wall of the test chamber to raise its temperature and thus prevent condensation. However, this approach only guarantees reliability under low humidity conditions and still poses a significant risk in high-humidity environments, such as the rainy season common in southern China. Summary of the Invention

[0006] The purpose of this application is to address the shortcomings of the prior art by providing an anti-condensation structure and a semiconductor device testing device to solve the problems.

[0007] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows: In one aspect of this application, an anti-condensation structure is provided, which is embedded in an opening in the side wall of a test chamber. The anti-condensation structure includes a base with a through hole adapted to a wall plate and for the wall plate to pass through. The base has a cavity and a connecting pipe. The cavity surrounds the through hole and communicates with it. The base also has an air inlet and an air outlet. The air inlet is connected to the cavity and a gas source through the connecting pipe. The air outlet is connected to the cavity and a gas source through the air inlet pipe. A heating module is provided on the air inlet pipe for heating the gas in the air inlet pipe.

[0008] Optionally, the anti-condensation structure also includes a temperature and humidity sensor, which is configured inside the test chamber to detect the temperature and humidity inside the test chamber. The temperature and humidity sensor is electrically connected to the controller of the gas source. Alternatively, the anti-condensation structure also includes a temperature sensor and a humidity sensor, both of which are configured inside the test chamber. The temperature sensor is used to detect the temperature inside the test chamber, and the humidity sensor is used to detect the humidity inside the test chamber. The temperature sensor and the humidity sensor are electrically connected to the controller of the gas source.

[0009] Optionally, there are multiple through holes and cavities, and they correspond one-to-one. The multiple cavities are interconnected through connecting pipes.

[0010] Optionally, the through holes are distributed in a rectangular array on the base.

[0011] Optionally, the base includes a duct cover plate and a duct flow channel plate, which are interlocked with each other along the penetration direction of the wall plate, and together they enclose a cavity and connecting pipes.

[0012] Optionally, the duct cover plate is provided with a first groove, the bottom of the first groove is provided with a first through hole, the duct flow channel plate is provided with a second groove corresponding to the first groove, the second groove is provided with a second through hole corresponding to the first through hole, the first groove and the second groove are joined together to form a cavity, and the first through hole and the second through hole are respectively adapted to the through wall plate.

[0013] Optionally, the surface of the air duct flow plate is provided with a connecting groove, which is connected to the second groove, the air inlet and the air outlet respectively. The air duct cover plate closes the opening of the connecting groove to form a connecting pipeline.

[0014] Optionally, the duct cover is used for the wall penetration plate to pass through, the duct flow channel plate is used for the wall penetration plate to pass through, and both the air inlet and air outlet are located on the duct cover.

[0015] Optionally, it also includes a gas source; the controller of the gas source is used to receive temperature and humidity signals from the temperature and humidity sensor, and control the gas temperature and / or ventilation rate according to the temperature and humidity signals, or the controller of the gas source is used to receive temperature signals from the temperature sensor and humidity signals from the humidity sensor, and control the gas temperature and / or ventilation rate according to the temperature signals and humidity signals.

[0016] In another aspect of the embodiments of this application, a semiconductor device testing device is provided, including a test chamber, an internal control board, an external control board, a through-wall plate, and an anti-condensation structure as described above. The base of the anti-condensation structure is embedded in an opening in the side wall of the test chamber. The internal control board is located inside the test chamber, the external control board is located outside the test chamber, and the through-wall plate is connected to the internal control board and the external control board respectively.

[0017] The beneficial effects of this application include: This application provides an anti-condensation structure, embedded in an opening in the side wall of a test chamber. The anti-condensation structure includes a base with a through hole adapted to a wall-penetrating plate for the plate to pass through. The base contains a cavity and connecting pipes, the cavity surrounding and communicating with the through hole. The base also has an air inlet and an air outlet. The air inlet is connected to the cavity and a gas source via the connecting pipe, and the air outlet is connected to the cavity and a gas source via the air outlet. A heating module is installed on the air inlet to heat the gas within it. This anti-condensation structure is embedded in the opening in the side wall of the test chamber via the base, and the wall-penetrating plate is inserted into the through hole of the base for fixation to the test chamber. The base also contains a cavity surrounding and communicating with the through hole, which is connected to the gas source. During low-temperature testing, gas is introduced into the cavity by a gas source, causing the through-wall plate to be enveloped by gas at a temperature higher than the internal ambient temperature of the test chamber. This prevents the cold air inside the test chamber from leaking out and coming into contact with the ambient air, thus preventing condensation from forming on the through-wall plate. Simultaneously, a heating module is installed on the air inlet pipe connected to the gas source. This heating module preheats the gas before it enters the cavity, allowing for temperature adjustment based on different low-temperature test conditions to ensure effective anti-condensation. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the semiconductor device testing equipment provided in the embodiments of this application; Figure 2 This is a cross-sectional view of the semiconductor device testing equipment provided in the embodiments of this application; Figure 3 This is a schematic diagram of the internal structure of the base in the anti-condensation structure provided in the embodiments of this application; Figure 4 One of the cross-sectional views of the base in the anti-condensation structure provided in the embodiments of this application; Figure 5 This is a second cross-sectional view of the base in the anti-condensation structure provided in the embodiments of this application.

[0020] Icons: 10-Semiconductor device testing equipment; 11-Test chamber; 12-Internal control board; 13-External control board; 14-Wall penetration plate; 100-Anti-condensation structure; 110-Base; 110a-Air duct cover; 110b-Air duct flow channel plate; 111-Through hole; 112-Cavity; 113-Connecting pipe; 1131-Main branch; 1132-Branch; 114-Air inlet; 115-Air outlet; 116-First groove; 117-First through hole; 118-Second groove; 119-Second through hole; X-Interpenetration direction. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. It should be noted that, unless otherwise specified, the various features in the embodiments of this application can be combined with each other, and the combined embodiments are still within the protection scope of this application.

[0023] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0024] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] When testing semiconductor devices, some hardware and the device under test (DUT) need to be placed inside the test chamber, while the rest of the hardware is placed outside. The internal control board of the hardware inside the test chamber and the external control board of the hardware outside the test chamber are electrically connected through a through-wall plate. However, during low-temperature testing, cold air inevitably flows outward along the through-wall plate, causing the temperature of the part of the through-wall plate in contact with the outside air to be significantly lower than the ambient temperature. At this time, water vapor in the environment will condense into water on the through-wall plate. Since the through-wall plate integrates multiple circuit bundles and several electronic components, the formation of condensate can easily cause serious malfunctions such as short circuits.

[0027] To prevent condensation, existing technologies incorporate heating circuits on the outer wall of the test chamber to raise its temperature and thus prevent condensation. However, this approach only guarantees reliability under low humidity conditions and still poses a significant risk in high-humidity environments, such as the rainy season common in southern China.

[0028] To address the aforementioned technical problems, one aspect of the embodiments of this application is described below. Figure 1 and Figure 2 An anti-condensation structure 100 is provided, which is embedded in an opening in the side wall of the test chamber 11. A through-wall plate 14 is inserted into the anti-condensation structure 100 to connect the internal control plate 12 and the external control plate 13.

[0029] Specifically, the anti-condensation structure 100 includes a base 110, which is embedded in the opening of the test chamber 11. The base 110 has a through hole 111, which connects the interior of the test chamber 11 to the outside. The through hole 111 is adapted to the through wall plate 14 and is used for the through wall plate 14 to pass through.

[0030] It should be noted that the through hole 111 and the through wall plate 14 are compatible, meaning that the through hole 111 can be inserted into or removed from the through wall plate 14. After the through wall plate 14 is inserted into the through hole 111, there is no gap or only a tiny gap between the through hole 111 and the through wall plate 14. The tiny gap can be sealed by a sealing structure.

[0031] Please refer to the reference. Figure 3 The base 110 has a cavity 112 and a connecting pipe 113 inside. The cavity 112 surrounds the through hole 111 along the circumferential direction and communicates with the through hole 111. Optionally, the cavity 112 surrounds the through hole 111 once along the circumferential direction.

[0032] The base 110 is also equipped with an air inlet 114 and an air outlet 115. The air inlet 114 is connected to the cavity 112 via a connecting pipe 113 and to a gas source via an air inlet pipe. The air outlet 115 is connected to the cavity 112 via a connecting pipe 113 and to a gas source via an air outlet pipe. In this way, the gas output from the gas source can enter the cavity 112 via the air inlet pipe, air inlet 114, and connecting pipe 113, ensuring that the area of ​​the wall-penetrating plate 14 located within the cavity 112 is enveloped by gas at a temperature higher than the internal ambient temperature of the test chamber 11. This prevents the cold air inside the test chamber 11 from being transferred to the outside and coming into contact with the ambient air, thus preventing condensation on the wall-penetrating plate 14. The gas entering the cavity 112 can also return to the gas source via the connecting pipe 113, air outlet 115, and air outlet pipe, thereby achieving gas circulation. The gas introduced into the cavity 112 can be compressed air, inert gas, etc.

[0033] It is understandable that in order to improve the anti-condensation effect, the transition area of ​​the through-wall panel 14 should be enclosed by gas as much as possible. Therefore, the thickness of the cavity 112 is preferably close to the thickness of the base 110.

[0034] Meanwhile, in order to cope with low-temperature tests at different temperatures and ensure the anti-condensation effect, a heating module is installed on the air intake pipe. The heating module is used to heat the gas in the air intake pipe, thereby adjusting the temperature of the gas surrounding the wall-penetrating plate 14.

[0035] The aforementioned anti-condensation structure 100 is embedded in the opening of the side wall of the test chamber 11 via a base 110. The through-wall plate 14 is inserted into the through hole 111 of the base 110 to fix it to the test chamber 11. A cavity 112 is also provided inside the base 110, surrounding and communicating with the through hole 111. The cavity 112 is connected to a gas source. During low-temperature testing, the gas source introduces gas into the cavity 112, causing the through-wall plate 14 to be enveloped by gas at a temperature higher than the internal ambient temperature of the test chamber 11. This prevents the cold air inside the test chamber 11 from being transferred to the outside and coming into contact with the ambient air, thus preventing condensation from forming on the through-wall plate 14. Simultaneously, a heating module is installed on the air inlet pipe connected to the gas source. The heating module can heat the gas before it enters the cavity 112, thereby adjusting the gas temperature according to different low-temperature tests to ensure the anti-condensation effect.

[0036] It should be noted that the aforementioned air source, air inlet pipe, and air outlet pipe may or may not be part of the anti-condensation structure 100. The connecting pipe 113 within the base 110 may include a main branch 1131 and multiple branch pipes 1132 connected to the main branch 1131, thereby simultaneously achieving connection with the cavity 112, the air inlet 114, and the air outlet 115 through the main branch 1131 and the multiple branch pipes 1132.

[0037] Optionally, the anti-condensation structure 100 also includes a temperature and humidity sensor, which is disposed inside the test chamber 11 and is used to detect the temperature and humidity inside the test chamber 11. The temperature and humidity sensor is electrically connected to the controller of the air source.

[0038] The temperature and humidity sensor detects the temperature and humidity inside the test chamber 11 in real time and sends the temperature and humidity information to the controller of the air source. The controller controls the heating module to adjust the temperature of the gas in the air inlet pipe according to the received temperature and humidity information.

[0039] Alternatively, the anti-condensation structure 100 may also include a temperature sensor and a humidity sensor, both of which are located inside the test chamber 11. The temperature sensor is used to detect the temperature inside the test chamber 11, and the humidity sensor is used to detect the humidity inside the test chamber 11. The temperature sensor and the humidity sensor are electrically connected to the controller of the gas source, respectively.

[0040] The temperature sensor detects the temperature inside the test chamber 11 in real time and sends the temperature information to the gas source controller. The humidity sensor detects the humidity inside the test chamber 11 in real time and sends the humidity information to the controller. The controller controls the heating module to adjust the temperature of the gas in the air intake pipe according to the received temperature and humidity information.

[0041] The formula for calculating dew point temperature under specific air temperature and relative humidity is as follows: T dp=T-((100-RH) / 5) Wherein: T dp T is the dew point temperature in degrees Celsius; T is the air temperature in degrees Celsius; RH is the relative humidity, ranging from 0 to 100%.

[0042] Therefore, as long as the gas is heated to ensure that the contact area between the through-wall panel 14 and the outside is not lower than T, dp This can reliably prevent condensation from forming.

[0043] Optionally, the anti-condensation structure 100 also includes a gas source; the controller of the gas source is used to receive temperature and humidity signals from the temperature and humidity sensor, and control the gas temperature and / or ventilation volume according to the temperature and humidity signals, or the controller of the gas source is used to receive temperature signals from the temperature sensor and humidity signals from the humidity sensor, and control the gas temperature and / or ventilation volume according to the temperature signals and humidity signals.

[0044] Typically, a test chamber 11 requires multiple through-wall plates 14 to pass through. Therefore, optionally, there are multiple through holes 111 and cavities 112, each corresponding to a single through hole 111. Each through hole 111 is used for one through-wall plate 14 to pass through, and each through hole 111 is surrounded by and connected to a cavity 112. The multiple cavities 112 are interconnected through connecting pipes 113, so that gas from the gas source can simultaneously fill multiple cavities 112, ensuring that all through-wall plates 14 are enveloped by gas.

[0045] Optionally, please refer to the following: Figure 3 The through holes 111 are arranged in a rectangular array on the base 110 to make the through-wall panel 14 more neat and orderly after installation.

[0046] Alternatively, please refer to Figure 3 and Figure 4 The base 110 includes a duct cover plate 110a and a duct flow channel plate 110b. The duct cover plate 110a and the duct flow channel plate 110b are interlocked with each other along the insertion direction X of the through wall plate 14. The duct cover plate 110a and the duct flow channel plate 110b together enclose a cavity 112 and a connecting pipe 113.

[0047] The base 110 is formed by fastening the duct cover plate 110a and the duct flow channel plate 110b together, which facilitates the machining of the cavity 112 and the connecting pipe 113 within the base 110. Taking the cavity 112 as an example, half-cavities can be machined on the adjacent surfaces of the duct cover plate 110a and the duct flow channel plate 110b, and the two half-cavities can be fastened together to form a complete cavity 112. Alternatively, a complete cavity 112 can be machined on the surface of one of the duct cover plate 110a and the duct flow channel plate 110b, and then the surface of the other plate can be used to seal the cavity 112.

[0048] Optionally, the duct cover 110a is used for the wall penetration plate 14 to pass through, the duct flow channel plate 110b is used for the wall penetration plate 14 to pass through, and the air inlet 114 and the air outlet 115 are both provided on the duct cover 110a.

[0049] That is, after the anti-condensation structure 100 is embedded in the test chamber 11, the air duct cover 110a faces outward from the test chamber 11, and the air duct flow plate 110b faces inward from the test chamber 11. The air inlet 114 and the air outlet 115 are set on the air duct cover 110a, which facilitates the connection of the air inlet 114 and the air outlet 115 to the air source.

[0050] To facilitate communication between the air inlet 114 and the air outlet 115 and the connecting channel, optionally, both the air inlet 114 and the air outlet 115 penetrate the air duct cover 110a.

[0051] Optionally, the duct cover plate 110a is provided with a first groove 116, the bottom of the first groove 116 is provided with a first through hole 117, the duct flow plate 110b is provided with a second groove 118 corresponding to the first groove 116, the second groove 118 is provided with a second through hole 119 corresponding to the first through hole 117, the first groove 116 and the second groove 118 are matched to form a cavity 112, and the first through hole 117 and the second through hole 119 are respectively adapted to the through wall plate 14.

[0052] It should be noted that you should refer to the following: Figure 5 The outer edge of the first through hole 117, projected onto the bottom of the first groove 116, lies within the outer edge of the bottom of the first groove 116. Similarly, the outer edge of the second through hole 119, projected onto the bottom of the second groove 118, lies within the outer edge of the bottom of the second groove 118. The first through hole 117 and the second through hole 119 have the same cross-sectional dimensions and are positioned correspondingly. Thus, the first through hole 117, the second through hole 119, and the area between them form a through hole 111.

[0053] Optionally, the surface of the air duct flow plate 110b is provided with a connecting groove, which is connected to the second groove 118, the air inlet 114 and the air outlet 115 respectively. The air duct cover plate 110a closes the opening of the connecting groove to form a connecting pipe 113.

[0054] Since the connecting pipe 113 is only used for gas flow, the cross-sectional dimensions (the cross-section perpendicular to the pipe extension direction) of the connecting pipe 113 can be set to be relatively small. Therefore, during processing, a connecting groove can be machined on the surface of the air duct flow plate 110b facing the air duct cover plate 110a. The area of ​​the air duct cover plate 110a corresponding to the connecting groove is not machined. After the air duct cover plate 110a and the air duct flow plate 110b are fastened together, the surface of the air duct cover plate 110a will seal the groove opening of the connecting groove, thus forming a sealed connecting pipe 113. This processing method is more convenient and less difficult to process.

[0055] Please refer to Figure 1 and Figure 2 This embodiment also provides a semiconductor device testing device 10, including a test chamber 11, an internal control board 12, an external control board 13, a through-wall plate 14, and an anti-condensation structure 100 as described above. The base 110 of the anti-condensation structure 100 is embedded in the opening in the side wall of the test chamber 11. The internal control board 12 is located inside the test chamber 11, the external control board 13 is located outside the test chamber 11, and the through-wall plate 14 is connected to the internal control board 12 and the external control board 13 respectively.

[0056] The semiconductor device testing equipment 10 includes the same structure and beneficial effects as the anti-condensation structure 100 in the foregoing embodiments. The structure and beneficial effects of the anti-condensation structure 100 have been described in detail in the foregoing embodiments and will not be repeated here.

[0057] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An anti-condensation structure, embedded in an opening in the side wall of a test chamber, characterized in that, The anti-condensation structure includes a base with a through hole adapted to a wall panel for the wall panel to pass through. The base contains a cavity and connecting pipes. The cavity surrounds and communicates with the through hole. The surface of the base also has an air inlet and an air outlet. The air inlet communicates with the cavity and a gas source via the connecting pipe. The air outlet communicates with the cavity and the gas source via the connecting pipe. A heating module is installed on the air inlet for heating the gas within the air inlet.

2. The anti-condensation structure as described in claim 1, characterized in that, The anti-condensation structure also includes a temperature and humidity sensor, which is disposed inside the test chamber and is used to detect the temperature and humidity inside the test chamber. The temperature and humidity sensor is electrically connected to the controller of the gas source. Alternatively, the anti-condensation structure may further include a temperature sensor and a humidity sensor, both of which are disposed inside the test chamber. The temperature sensor is used to detect the temperature inside the test chamber, and the humidity sensor is used to detect the humidity inside the test chamber. The temperature sensor and the humidity sensor are electrically connected to the controller of the gas source, respectively.

3. The anti-condensation structure as described in claim 1, characterized in that, The number of through holes and cavities are both multiple and correspond one-to-one, and the multiple cavities are interconnected through the connecting pipes.

4. The anti-condensation structure as described in claim 3, characterized in that, The through holes are arranged in a rectangular array on the base.

5. The anti-condensation structure as described in claim 1, characterized in that, The base includes a duct cover plate and a duct flow plate. The duct cover plate and the duct flow plate are interlocked with each other along the insertion direction of the through-wall plate. The duct cover plate and the duct flow plate together enclose the cavity and the connecting pipe.

6. The anti-condensation structure as described in claim 5, characterized in that, The duct cover plate is provided with a first groove, and the bottom of the first groove is provided with a first through hole. The duct flow channel plate is provided with a second groove corresponding to the first groove, and the second groove is provided with a second through hole corresponding to the first through hole. The first groove and the second groove are joined together to form the cavity. The first through hole and the second through hole are respectively adapted to the through wall plate.

7. The anti-condensation structure as described in claim 6, characterized in that, The surface of the air duct flow plate is provided with a connecting groove, which is connected to the second groove, the air inlet and the air outlet respectively. The air duct cover plate closes the opening of the connecting groove to form the connecting pipeline.

8. The anti-condensation structure as described in claim 5, characterized in that, The duct cover is used for the wall penetration plate to pass through, the duct flow channel plate is used for the wall penetration plate to pass through, and the air inlet and the air outlet are both provided on the duct cover.

9. The anti-condensation structure as described in claim 2, characterized in that, It also includes the gas source; the controller of the gas source is used to receive the temperature and humidity signal emitted by the temperature and humidity sensor, and control the temperature and / or ventilation rate of the gas according to the temperature and humidity signal, or the controller of the gas source is used to receive the temperature signal emitted by the temperature sensor and the humidity signal emitted by the humidity sensor, and control the temperature and / or ventilation rate of the gas according to the temperature signal and the humidity signal.

10. A semiconductor device testing device, characterized in that, The device includes a test chamber, an internal control panel, an external control panel, a through-wall panel, and an anti-condensation structure as described in any one of claims 1 to 9. The base of the anti-condensation structure is embedded in an opening in the side wall of the test chamber. The internal control panel is located inside the test chamber, and the external control panel is located outside the test chamber. The through-wall panel is connected to the internal control panel and the external control panel, respectively.

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