Matrix type simplified control 64-channel instruction driving microsystem

Abstract

The invention discloses a matrix type simplified control 64-channel instruction driving microsystem, which belongs to the technical field of multi-channel electromechanical action component control, is based on a ceramic double-cavity three-dimensional stacked packaging technology, and comprises a 16-channel bus driving and level conversion chip bare chip and four 16-channel dual-redundancy OE instruction driving bare chips. One 16-channel bus driving and level conversion chip bare core is used for generating two groups of 8-channel control signals, and 16 control signals are used for controlling 64-channel OE driving instructions in an 8 * 8 matrix type control mode; according to the four 16-channel dual-redundancy OE instruction driving bare cores, single-channel control signals are jointly determined by A and B dual-redundancy control signals, when the A and B control signals are effective signals at the same time, OE driving instruction output is achieved, and a matrix type simplified control mode is supported. According to the invention, high-integration matrix type simplified instruction control can be realized for electromechanical action parts such as a multi-channel electromagnetic valve and an electromagnetic switch.

Description

Technical Field

[0001] This invention relates to the field of multi-channel electromechanical actuator control technology, and in particular to a matrix-type simplified control 64-channel instruction-driven microsystem. Background Technology

[0002] The drive and control of multifunctional and complex electromechanical moving parts requires multi-channel OE instructions for driving and control. Some application scenarios even require hundreds of OE instructions. Such a large number of control signals and OE instruction drive channels will occupy a lot of processor GPIO ports and board area. The traditional implementation solution is to expand the processor's GPIO ports through FPGA. This solution not only increases the cost of the control system, but also further increases the area of ​​the control board, which seriously restricts the high-density and miniaturization development of multi-channel electromechanical moving part control application systems. Summary of the Invention

[0003] The purpose of this invention is to provide a matrix-style simplified control 64-channel instruction-driven microsystem to solve the problems of traditional multi-channel electromechanical actuator OE instruction driving requiring a large number of processor GPIO ports, resulting in a large board area and the inability to achieve simplified control and high-density integration.

[0004] To address the aforementioned technical problems, this invention provides a matrix-based simplified control 64-channel instruction-driven microsystem based on ceramic dual-cavity three-dimensional stacked packaging technology. The microsystem includes:

[0005] One 16-channel bus driver and level conversion chip is used to generate two sets of 8-channel control signals. Through an 8×8 matrix control method, 16 control signals control 64-channel OE drive commands.

[0006] Four 16-channel dual-redundant OE instruction drive bare chips are used. The control signal of a single channel is determined by the dual-redundant control signals A and B. When both control signals A and B are valid, the OE drive instruction is output, and matrix-style simplified control mode is supported.

[0007] In one embodiment, the microsystem further includes a ceramic dual-cavity shell and a three-dimensional stacked package;

[0008] The ceramic dual-cavity shell is CPGA packaged and consists of two cavities, a front and a back. The back cavity has pins arranged around its perimeter and houses one 16-channel bus driver and level conversion chip. The front cavity houses four 16-channel dual-redundant OE instruction driver chips.

[0009] The three-dimensional stacked package consists of four 16-channel dual-redundant OE instruction-driven bare dies in the front cavity, which are stacked in a three-dimensional manner. Adjacent bare dies are raised by silicon pads, and the bonding wire arc height is reserved.

[0010] In one embodiment, the 16-channel bus driver and level conversion chip die is adapted to a wide voltage input signal of 1.8V to 5V, and is compatible with processors of three common voltage levels: 1.8V, 3.3V, and 5V. Through the enable pin of the die, the hot backup function of the 64-channel OE instruction driver die is realized.

[0011] The matrix-based simplified control 64-channel instruction-driven microsystem provided by this invention has the following beneficial effects:

[0012] (1) The number of control instructions in this invention is reduced to one-quarter of the original; it can realize the hot backup function of 64-channel OE instruction driving bare die and supports matrix simplified control mode;

[0013] (3) The present invention uses a ceramic double-cavity shell, the two cavities on the front and back sides of the shell can be stacked in three dimensions to improve the integration of the microsystem;

[0014] (4) The present invention adopts three-dimensional stacked packaging. Compared with the traditional flat solution of 56mm×46mm, the microsystem area of ​​the three-dimensional stacked packaging solution is 18mm×18mm. The microsystem area is reduced to one-sixth of the original finished board area, which greatly improves the integration of the board. Attached Figure Description

[0015] Figure 1 This is a schematic diagram showing the area occupied by a bare core of a board-level finished product with the same function as the microsystem of this invention.

[0016] Figure 2 This is a schematic diagram of a matrix-style simplified control 64-channel instruction-driven microsystem based on ceramic dual-cavity three-dimensional stacked packaging technology provided by the present invention.

[0017] Figure 3 This is a functional schematic diagram of the bare die driven by the 16-channel dual-redundant OE instruction provided by the present invention.

[0018] Figure 4(a) is a top view of the microsystem.

[0019] Figure 4(b) is a bottom view of the microsystem.

[0020] Figure 4(c) is a side view of the microsystem. Detailed Implementation

[0021] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, provides a more detailed explanation of the matrix-based simplified control 64-channel instruction-driven microsystem proposed in this invention. The advantages and features of this invention will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise scales, and are only used to facilitate and clarify the illustration of the embodiments of this invention.

[0022] This invention provides a matrix-based simplified control 64-channel instruction-driven microsystem based on ceramic dual-cavity three-dimensional stacked packaging technology, and its principle block diagram is shown below. Figure 2 As shown, the microsystem consists of one 16-channel bus driver and level conversion chip die, four 16-channel dual-redundant OE instruction driver dies, a ceramic dual-cavity shell, and a three-dimensional stacked package for the microsystem.

[0023] The 16-channel bus driver and level conversion bare die is used to generate two sets of 8-channel control signals. Through an 8×8 matrix control method, 16 control signals control 64 channels of OE drive instructions, reducing the number of control instructions to one-quarter of the original. This 16-channel bus driver and level conversion chip bare die can adapt to external wide voltage input signals of 1.8V to 5V, and is compatible with processors of three common voltage levels: 1.8V, 3.3V, and 5V. Through the enable pin of this 16-channel bus driver and level conversion chip bare die, the hot backup function of the 64-channel OE instruction drive bare die can be realized.

[0024] The four 16-channel dual-redundant OE instruction driver bare chips have their single-channel control signals determined by the dual-redundant control signals A and B. OE drive instruction output can only be achieved when both control signals A and B are valid simultaneously. It supports a matrix-style simplified control mode. Its internal functional block diagram is shown below. Figure 3 As shown.

[0025] The ceramic dual-cavity shell uses a CPGA package, consisting of two cavities, a front and a back. The back cavity is smaller, with pins arranged around its perimeter, housing one 16-channel bus driver and level conversion chip die. The front cavity houses four 16-channel dual-redundant OE instruction driver dies. The microsystem is a three-dimensional stacked package. The four 16-channel dual-redundant OE instruction driver dies in the front cavity are stacked in a three-dimensional manner, with adjacent dies raised by silicon pads and pre-reserved for bonding wire arc height. The resulting three-view diagram of the microsystem is shown below. Figures 4(a) to 4(c) As shown, compared to Figure 1 The traditional flat-panel solution shown is 56mm×46mm, while the microsystem area using the three-dimensional stacked packaging solution is 18mm×18mm. The microsystem area is reduced to one-sixth of the original finished board area, which greatly improves the integration of the board.

[0026] Table 1 shows the truth table of the single-channel output control signals for the matrix-based simplified control of the 64-channel OE command-driven microsystem. When a channel among the 64 OE drive commands needs to operate, the corresponding two matrix control commands for that channel can be found according to the truth table. When both signals are valid simultaneously, any one of the 64 channels can be controlled to achieve OE command-driven output as needed. If multiple channels need to output simultaneously, the truth tables in Table 1 can be combined to achieve simultaneous output of multiple channels of OE drive commands.

[0027] Table 1 Truth Table of Control Signals for Single-Channel OE Command Drive Output

[0028]

[0029] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A matrix-based simplified control 64-channel instruction-driven microsystem, characterized in that, Based on ceramic dual-cavity three-dimensional stacked packaging technology, the microsystem includes: One 16-channel bus driver and level conversion chip is used to generate two sets of 8-channel control signals. Through an 8×8 matrix control method, 16 control signals control 64-channel OE drive commands. Four 16-channel dual-redundant OE instruction drive bare chips are used. The control signal of a single channel is determined by the dual-redundant control signals A and B. When both control signals A and B are valid, the OE drive instruction is output, and matrix-style simplified control mode is supported.

2. The matrix-based simplified control 64-channel instruction-driven microsystem as described in claim 1, characterized in that, The microsystem also includes a ceramic dual-cavity shell and a three-dimensional stacked package; The ceramic dual-cavity shell is CPGA packaged and consists of two cavities, a front and a back. The back cavity has pins arranged around its perimeter and houses one 16-channel bus driver and level conversion chip. The front cavity houses four 16-channel dual-redundant OE instruction driver chips. The three-dimensional stacked package consists of four 16-channel dual-redundant OE instruction-driven bare dies in the front cavity, which are stacked in a three-dimensional manner. Adjacent bare dies are raised by silicon pads, and the bonding wire arc height is reserved.

3. The matrix-based simplified control 64-channel instruction-driven microsystem as described in claim 1, characterized in that, The single 16-channel bus driver and level conversion chip is adapted to a wide voltage input signal of 1.8V to 5V and is compatible with processors of three common voltage levels: 1.8V, 3.3V, and 5V. Through the enable pin of this chip, the hot backup function of the 64-channel OE instruction driver chip is realized.

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