Circuit board double-heat-source circuit laying device for intelligent temperature control blanket

Abstract

The invention discloses a circuit board double-heat-source circuit laying device for an intelligent temperature control blanket, and relates to the technical field of circuit board manufacturing equipment.The circuit board double-heat-source circuit laying device comprises a base, a device body is fixedly installed on the base, a floating platform plate is installed in the device body in a sliding mode, and an upper pressing plate is arranged above the floating platform plate; a floating unit and an auxiliary positioning unit are arranged in the floating platform plate, and a waste heat recovery unit is arranged on the side face of the upper pressing plate. The device has the advantages that pipeline switching is achieved through combination of the material supporting platform and the floating frame, different functions of adsorption and press fit are achieved, meanwhile, the double-heat-source machining mode is adopted, the attaching quality is guaranteed, and cold joint and loose joint are reduced; the waste heat recovery unit extracts dissipated hot air for preheating heat conduction oil, cost and pollution are reduced, the auxiliary positioning unit is matched with circuit boards of different thicknesses, precision and efficiency are improved, and the laying requirement of the intelligent temperature control blanket circuit board is met.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing equipment technology, and more particularly to a circuit board dual heat source circuit laying device for intelligent temperature-controlled blankets. Background Technology

[0002] With the popularization of smart homes, smart temperature-controlled blankets are favored for their precise temperature control and ease of use. The quality of the circuit laying of its core circuit board directly affects the product's performance and lifespan. Such circuit boards need to achieve complex layouts in a small space and need to be closely attached to heating and sensing elements. The requirements for positioning accuracy, heating uniformity and adhesion during the laying process are extremely high.

[0003] Currently, the laying of circuit boards for smart temperature control blankets mostly adopts traditional single-heat-source pressing equipment, which uses cylinder-driven pressing to achieve bonding between the circuit and the substrate. It relies on manual positioning and simple heating devices to complete the laying operation. Although some equipment has attempted to introduce dual-heat-source designs, they are mostly independent heating modules, lacking a collaborative and complementary mechanism. Furthermore, they have not been adapted and optimized for the thin and high-density characteristics of temperature control blanket circuit boards, making it difficult to balance positioning stability and heating uniformity in actual production.

[0004] The above-mentioned device has the following problems: First, mechanical limiting can easily cause the circuit board to shift, affecting the product quality of the circuit board after lamination. Second, using a single heat source can easily cause excessive temperature difference between the upper and lower surfaces and edges of the circuit board and the center area, resulting in poor soldering, desoldering or substrate deformation at the bonding point, reducing the product qualification rate. Therefore, there is an urgent need to provide a circuit board dual heat source laying device for intelligent temperature control blankets to solve the above problems. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a circuit board dual-heat source circuit laying device for intelligent temperature-controlled blankets, which solves the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A circuit board dual-heat source laying device for intelligent temperature-controlled blankets includes a base on which a device body is fixedly mounted. A control knob is located at the front end of the device body. Two slide rails are located on the base inside the device body, and a floating platform plate is slidably mounted on the slide rails. A cylinder is fixedly mounted on the top inside the device body, and an upper pressing plate is fixedly mounted on the output end of the cylinder. Guide members are provided around the upper pressing plate, and these guide members are movably mounted on guide rods located inside the device body. A floating unit and an auxiliary positioning unit are provided inside the floating platform plate, and a waste heat recovery unit is provided on the side of the upper pressing plate.

[0007] The floating unit is used to switch working states, enabling the floating platform plate to perform different functions in different working states. The auxiliary positioning unit is used to hold the circuit board to be processed, so that the circuit board is always attached to the lower surface of the upper pressing plate. The waste heat recovery unit recovers and reuses the hot air that escapes from the device, avoiding resource waste.

[0008] The floating unit also includes a material support platform, a floating frame, and an infrared sensor. The material support platform and the floating frame are combined to form a floating platform plate. The upper edge of the material support platform is provided with a limiting edge. The floating frame is fitted onto the material support platform. The front of the material support platform is provided with multiple air holes evenly. The side of the floating frame is provided with a vacuum tube. A hot air inlet pipe is provided below the vacuum tube.

[0009] Furthermore, the infrared sensor is located inside the main body of the device, and the material support platform is provided with multiple sets of pipes. The air hole is connected to the first pipe, and the first pipe is connected to the vacuum pipe in the unpressed state. Below the first pipe is a second pipe, and the second pipe is connected to the hot air inlet pipe in the pressed state.

[0010] Furthermore, the material support platform is equipped with multiple sets of recycling troughs, and each recycling trough is movably installed with a stop block. The two ends of the stop block are fixedly installed on the inner side of the floating frame by connecting rods.

[0011] Furthermore, the material support platform is provided with a slot for the connecting rod to move up and down, and the stop block is provided with multiple sets of through holes. When the device is in an unpressed state, the through holes form a complete pipeline one with the pipeline inside the material support platform, and when it is in a pressed state, it connects with pipeline two.

[0012] Furthermore, the material support platform and the floating frame are provided with three sets of mounting holes on both sides. A limiting rod is provided in the mounting hole, and a return spring is sleeved on the outside of the limiting rod. The two ends of the return spring are fixedly connected to the material support platform and the floating frame, respectively.

[0013] Furthermore, the auxiliary positioning unit includes an adjustment knob located on both sides of the floating frame and at the end of the screw. The inner side of the floating frame is provided with an adjustment groove, in which a top block is slidably installed. The side of the material support platform is provided with a pallet recycling groove, in which an auxiliary pallet is provided.

[0014] Furthermore, a rotating rod is rotatably installed inside the tray recycling trough via a rotating shaft, the top block contacts the outer side of the rotating rod, and the auxiliary tray contacts the inner side of the rotating rod.

[0015] Furthermore, the waste heat recovery unit includes a protrusion and a lower pressing block. The protrusion is located on the front and rear sides of the floating frame, and the lower pressing block is located on the front and rear sides of the lower end of the upper pressing plate. When the floating platform plate and the upper pressing plate are in a pressing state, a pressing cavity is formed between the two plates. The side of the lower pressing block inside the upper pressing plate is provided with an air extraction pipe. One end of the air extraction pipe is connected to the pressing cavity, and the other end is fixedly connected to the air extraction port of the air pump.

[0016] Furthermore, the bottom of the floating platform plate is provided with a mounting base, and the side of the upper pressing plate is provided with an oil outlet pipe, which is connected to the heat-conducting oil circulation pipeline inside the upper pressing plate. The air extraction pipe is spirally wrapped around the oil outlet pipe, and the wrapped part is located inside the protective shell. The protective shell is located on the side of the upper pressing plate. The other end of the oil outlet pipe is fixedly connected to the inside of the oil storage tank. The side of the oil outlet pipe is provided with an oil inlet pipe. The oil inlet pipe passes through the heater and is fixedly connected to the circulation pump. The heater is provided with a second hot air branch pipe. The other end of the second hot air branch pipe is located on the electronic valve. The other side of the electronic valve is provided with a first hot air branch pipe. The air inlet of the electronic valve is fixedly connected to the air outlet of the hot air blower. The oil extraction port of the circulation pump is fixedly connected to the oil storage tank through a connecting pipe.

[0017] Furthermore, the bottom of the floating platform plate is provided with a mounting base, which is fixedly connected to the output end of the second cylinder, and the second cylinder is located on the base inside the main body of the device.

[0018] Compared with existing technologies, the advantages of this invention are: 1. The combined design of the material support platform and the floating frame can automatically switch the internal pipelines. When not pressed, pipeline one is connected to the vacuum tube, and the circuit board is fixed by negative pressure adsorption through the air pores to avoid displacement. When pressing, the floating frame moves down and drives the baffle to switch to pipeline two and connect to the hot air inlet pipe. The hot air escapes evenly to assist the pressing process. At the same time, dual heat sources are used for complementary heating. The upper pressing plate provides stable heat on the upper surface through heat transfer oil, and the floating platform plate delivers hot air to achieve heating of the lower surface, avoiding local temperature differences and reducing problems such as poor soldering, desoldering and substrate deformation. It is suitable for the high-precision laying requirements of temperature control blanket circuit boards.

[0019] 2: The auxiliary positioning unit drives the screw through the adjustment knob, which causes the top block in the adjustment groove to slide. The top block pushes the rotating rod to rotate, which in turn causes the auxiliary tray in the tray recovery groove to flip and extend, pressing against the circuit board to be processed from the side. This design can flexibly adapt to circuit boards of different thicknesses, ensuring that the circuit board is always tightly attached to the lower surface of the upper pressing plate during the pressing process, avoiding the impact of positioning deviation on the laying accuracy, eliminating the need for manual auxiliary positioning, and improving processing stability and efficiency.

[0020] 3: By using the protrusion and lower pressure block in conjunction with the air extraction pipe, the hot air escaping from the pressing chamber is extracted. The air extraction pipe spirals around the oil outlet pipe, transferring the residual heat to the heat transfer oil inside the protective shell to achieve preheating. This design reduces the energy consumption of the heater, avoids heat waste, and reduces the environmental impact of hot air emissions.

[0021] In summary, the combination of the material support platform and the floating frame enables pipeline switching, satisfying different functions of adsorption and pressing. At the same time, the dual heat source processing method ensures bonding quality and reduces poor soldering and desoldering. The waste heat recovery unit extracts the escaping heat dissipation air to preheat the heat transfer oil, reducing costs and pollution. The auxiliary positioning unit adapts to circuit boards of different thicknesses, improving accuracy and efficiency, and meeting the circuit board laying requirements of intelligent temperature control blankets. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the circuit board dual heat source circuit laying device for intelligent temperature control blankets proposed in this invention. Figure 2 This is a schematic diagram of the internal structure of the present invention; Figure 3 This is a rear view of the present invention; Figure 4 This is a bottom view of the present invention; Figure 5 This is a partial cross-sectional view of the floating platform plate of the present invention; Figure 6 This is a half-sectional view of the floating platform plate of the present invention in an unpressed state; Figure 7 This is a half-sectional view of the floating platform plate of the present invention in a pressed state; Figure 8 This is an exploded view of the floating platform plate of the present invention; Figure 9 This is a partial cross-sectional view of the floating platform plate of the present invention; Figure 10 This is a schematic diagram of the installation of the auxiliary positioning unit of the present invention; Figure 11 This is a schematic diagram of the installation of the waste heat recovery unit of the present invention.

[0023] In the diagram: 1. Base; 2. Main body of the device; 3. Control knob; 4. Slide rail; 5. Floating platform plate; 501. Material support platform; 502. Floating frame; 503. Vacuum pipe; 504. Hot air inlet pipe; 505. Air hole; 506. Pipeline 1; 507. Pipeline 2; 508. Recovery tank; 509. Slot opening; 510. Stop block; 511. Connecting rod; 512. Through hole; 513. Protrusion; 514. Mounting hole; 515. Limiting rod; 516. Return spring; 517. Adjusting knob; 518. Adjusting slot; 519. Top block, 520 auxiliary support plate, 521 screw, 522 support plate recovery trough, 523 rotating rod, 6 cylinder one, 7 upper pressing plate, 8 guide component, 9 guide rod, 10 oil storage tank, 11 circulating pump, 12 heater, 13 air pump, 14 mounting base, 15 cylinder two, 16 pressing chamber, 17 lower pressing block, 18 air extraction pipe, 19 protective shell, 20 oil outlet pipe, 21 oil inlet pipe, 22 infrared sensor, 23 hot air blower, 24 electronic valve, 25 hot air branch pipe one, 26 hot air branch pipe two. Detailed Implementation

[0024] Reference Figures 1-11 A circuit board dual-heat source circuit laying device for intelligent temperature-controlled blankets includes a base 1, a device body 2 fixedly mounted on the base 1, a control knob 3 at the front end of the device body 2, two slide rails 4 on the base inside the device body 2, a floating platform plate 5 slidably mounted on the slide rails 4, a cylinder 6 (SMC MDBB80-100Z model) fixedly mounted on the top inside the device body 2, an upper pressing plate 7 fixedly mounted on the output end of the cylinder 6, guide members 8 around the upper pressing plate 7, guide members 8 movably mounted on guide rods 9 inside the device body 2, a floating unit and an auxiliary positioning unit inside the floating platform plate 5, and a waste heat recovery unit on the side of the upper pressing plate 7.

[0025] The floating unit is used to switch working states, enabling the floating platform plate 5 to perform different functions in different working states. The auxiliary positioning unit is used to hold the circuit board to be processed, so that the circuit board is always attached to the lower surface of the upper pressing plate 7. The waste heat recovery unit recovers and reuses the hot air that escapes from the device, avoiding resource waste.

[0026] The floating unit also includes a material support platform 501, a floating frame 502, and an infrared sensor 22 (which can be an Omron E3Z-LS61 model). The material support platform 501 and the floating frame 502 are combined to form a floating platform plate 5. The upper edge of the material support platform 501 is provided with a limiting edge. The floating frame 502 is fitted onto the material support platform 501. The front of the material support platform 501 is provided with a plurality of air holes 505 evenly distributed. The side of the floating frame 502 is provided with a vacuum tube 503. A hot air inlet pipe 504 is provided below the vacuum tube 503.

[0027] Infrared sensor 22 is located inside the main body 2 of the device. Multiple sets of pipes 506 are provided inside the material support platform 501. Air vent 505 is connected to pipe 506. Pipe 506 is connected to vacuum pipe 503 in the unpressed state. Pipe 507 is provided below pipe 506. Pipe 507 is connected to hot air inlet pipe 504 in the pressed state.

[0028] The vacuum tube 503 is connected to an external vacuum pump 503 (which can be a Taiguan ZX-16B model) via an air pipe, and the hot air inlet pipe 504 is connected to an external hot air branch pipe 26 via a flexible hose.

[0029] In the initial unpressed state, the floating platform plate 5 is connected to the cylinder 15 through the bottom mounting base 14 and is in the initial working position on the slide rail 4. At this time, the floating frame 502 is located above the material support platform under the elastic support of the return springs 516 on both sides.

[0030] The stop block 510 is positioned at the upper end along with the floating frame 502. The through hole 512 connects with the pipeline inside the material support platform 501 to form a complete pipeline 506. The upper end of the pipeline 506 is connected to the air holes 505 evenly distributed on the surface of the material support platform 501, and the lower end is connected to the vacuum tube 503 on the side of the floating frame 502.

[0031] The material handling platform 501 is equipped with multiple sets of recycling troughs 508. A stop block 510 is movably installed in the recycling trough 508. The two ends of the stop block 510 are fixedly installed on the inner side of the floating frame 502 through connecting rods 511.

[0032] The material support platform 501 is provided with a slot 509 for the connecting rod 511 to move up and down. The stop block 510 is provided with multiple sets of through holes 512. When the device is in an unpressed state, the through holes 512 form a complete pipeline 1 506 with the pipeline inside the material support platform 501. When it is in a pressed state, it is connected to the pipeline 2 507.

[0033] The material support platform 501 and the floating frame 502 are provided with three sets of mounting holes 514 on both sides. A limiting rod 515 is provided in the mounting hole 514. A return spring 516 is sleeved on the outside of the limiting rod 515. The two ends of the return spring 516 are fixedly connected to the material support platform 501 and the floating frame 502 respectively.

[0034] The auxiliary positioning unit includes an adjustment knob 517, which is located on both sides of the floating frame 502 and at the end of the screw 521. An adjustment groove 518 is provided on the inner side of the floating frame 502, and a top block 519 is slidably installed in the adjustment groove 518. A pallet recovery groove 522 is provided on the side of the material support platform 501, and an auxiliary pallet 520 is provided in the pallet recovery groove 522.

[0035] A rotating rod 523 is rotatably installed inside the tray recycling trough 522 via a rotating shaft. The top block 519 is in contact with one end of the rotating rod 523, and the auxiliary tray 520 is in contact with the other end of the rotating rod 523.

[0036] The operator places the circuit board of the intelligent temperature control blanket on the material support platform 501 and starts the vacuum system by controlling the knob 3. The vacuum tube 503 generates negative pressure, which is conducted to the air hole 505 through the first pipeline 506 to achieve the adsorption and fixation of the circuit board. At the same time, the second cylinder 15 drives the mounting base 14 to move along the slide rail 4, which drives the floating platform plate 5 and the fixed circuit board to move into the pressing station inside the main body 2 of the device.

[0037] The heat transfer oil circulation system and hot air blower 23 are started simultaneously. The circulation pump 11 draws heat transfer oil from the oil storage tank 10 and delivers it to the heater 12 through the oil inlet pipe 21. The heater 12 receives the hot air delivered by the hot air blower 23 (distributed by the electronic valve 24) through the second hot air branch pipe 26 for auxiliary heating. The heated heat transfer oil flows into the circulation pipeline inside the upper pressing plate 7 to provide a stable heat source for the upper surface of the upper pressing plate 7. The hot air generated by the hot air blower 23 is distributed to the first hot air branch pipe 25 and the second hot air branch pipe 26 through the electronic valve 24. The first hot air branch pipe 25 is connected to the hot air inlet pipe 504 of the floating platform plate 5. The conveying is started when pressing.

[0038] Cylinder 6 is activated, pushing the upper pressing plate 7 downward along the guide rod 9 to ensure a smooth pressing process. As the upper pressing plate 7 continues to move downward, the pressing blocks 17 on the front and rear sides of its lower end contact the protrusions 513 on the front and rear sides of the floating frame 502 and apply downward pressure. The floating frame 502 compresses the reset spring 516 and moves downward along the limit rod 515. The floating frame 502 drives the stop block 510 to slide downward in the recovery tank 508 through the connecting rod 511 until the through hole 512 on the surface of the stop block 510 disconnects from the first pipeline 506 and connects with the second pipeline 507. At this time, the infrared sensor 22 detects that the upper pressing plate 7 has reached the pressing position and issues a command to control the vacuum pipe 503 to stop vacuuming. The hot air inlet pipe 504 begins to deliver hot air to the second pipeline 507, which escapes evenly from the lower surface of the circuit board through the through hole 512 and the air hole 505.

[0039] During the pressing stage, the pipeline switches to hot air delivery mode, the negative pressure system is completely shut down, and the circuit board loses its bottom adsorption and fixing force. At this time, if there is no effective positioning structure, problems such as edge offset, center floating or even slight warping may occur. The auxiliary positioning unit forms multi-point support from the side through the auxiliary support plate 520 to resist the displacement path caused by the hot air impact, ensuring that the solder pads and lines are accurately aligned when the circuit is laid, and avoiding cold solder joints and desoldering caused by displacement.

[0040] According to the thickness of the circuit board, the adjustment knobs 517 on both sides of the floating frame 502 are rotated, which drives the screw 521 to rotate and pushes the top block 519 in the adjustment groove 518 to slide laterally. The top block 519 contacts the outer end of the rotating rod 523 and applies a pushing force, causing the rotating rod 523 to rotate around the rotating shaft in the tray recovery groove 522, which in turn drives the auxiliary tray 520 connected to the inner end of the rotating rod 523 to extend out and abut against the workpiece from the side of the circuit board, ensuring that the circuit board is always tightly attached to the lower surface of the upper pressing plate 7 during the pressing process, without the need for manual positioning.

[0041] The waste heat recovery unit includes a protrusion 513 and a lower pressure block 17. The protrusion 513 is located on the front and rear sides of the floating frame 502, and the lower pressure block 17 is located on the front and rear sides of the lower end of the upper pressing plate 7. When the floating platform plate 5 and the upper pressing plate 7 are in a pressing state, a pressing cavity 16 is formed between the two plates. The side of the lower pressure block 17 inside the upper pressing plate 7 is provided with an air extraction pipe 18. One end of the air extraction pipe 18 is connected to the pressing cavity 16, and the other end is fixedly connected to the air extraction port of the air pump 13 (which can be a Jaguar EAS-100 model).

[0042] An oil outlet pipe 20 is provided on the side of the upper pressure plate 7, which is connected to the heat transfer oil circulation pipeline inside the upper pressure plate 7. The suction pipe 18 is spirally wrapped around the oil outlet pipe 20, and the wrapped part is located inside the protective shell 19. The protective shell 19 is located on the side of the upper pressure plate 7. The other end of the oil outlet pipe 20 is fixedly connected to the inside of the oil storage tank 10. An oil inlet pipe 21 is provided on the side of the oil outlet pipe 20. The oil inlet pipe 21 passes through the heater 12 and is fixedly connected to the circulation pump 11 (which can be the ZILMET-15 model from Southern Pump Industry). A second hot air branch pipe 26 is provided inside the heater 12. The other end of the second hot air branch pipe 26 is located at the electronic valve 24 (which can be an SMC model). On the VQZ115-5L1-C6 model, a hot air branch pipe 25 is provided on the other side of the electronic valve 24. The air inlet of the electronic valve 24 is fixedly connected to the air outlet of the hot air blower 23 (which can be the KH-3000 model). The oil inlet of the circulating pump 11 is fixedly connected to the oil storage tank 10 through a connecting pipe.

[0043] During the pressing process, hot air will be generated in the pressing cavity 16. At this time, the air pump 13 is started and the hot air in the pressing cavity 16 is extracted through the air extraction pipe 18 on the side of the lower pressing block 17 inside the upper pressing plate 7.

[0044] The exhaust pipe 18 is spirally wrapped around the oil outlet pipe 20 on the side of the upper press plate 7, and the wrapped part is wrapped by the protective shell 19. When the hot air flows in the exhaust pipe 18, it transfers the residual heat to the heat transfer oil in the oil outlet pipe 20.

[0045] The preheated heat transfer oil flows back to the oil storage tank 10 and is then transported to the heater 12 again by the circulation pump 11, which reduces the heating power and energy consumption, while avoiding the waste of heat caused by the direct discharge of hot air.

[0046] The bottom of the floating platform plate 5 is provided with a mounting base 14, which is fixedly connected to the output end of cylinder 2 15 (which can be an SMC MDBB63-300Z model). Cylinder 2 15 is located on the base inside the main body 2 of the device.

[0047] After the preset pressing time is reached, cylinder 6 drives the upper pressing plate 7 to reset upwards, separating the upper pressing plate 7 from the floating platform plate 5, and the lower pressing block 17 disengages from the protrusion 513; the floating frame 502 moves upwards under the elastic action of the reset spring 516, driving the stop block 510 to reset, the through hole 512 reconnects with the pipeline 506, the vacuum pump starts working, the hot air inlet pipe 504 stops blowing air, cylinder 15 drives the floating platform plate 5 to move along the slide rail 4 to the initial work position, and stops after reaching the part removal position; the vacuum system is turned off, and the auxiliary tray 520 resets to the tray recovery slot 522 under the gravity of the rotating rod 523, and the operator directly takes out the pressed circuit board, completing a single laying operation.

[0048] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A circuit board dual-heat source circuit laying device for intelligent temperature-controlled blankets, comprising a base (1), characterized in that, The device body (2) is fixedly installed on the base (1). The front end of the device body (2) is provided with a control knob (3). The base inside the device body (2) is provided with two slide rails (4). A floating platform plate (5) is slidably installed on the slide rails (4). A cylinder (6) is fixedly installed on the top inside the device body (2). An upper pressing plate (7) is fixedly installed on the output end of the cylinder (6). Guide members (8) are provided around the upper pressing plate (7). The guide members (8) are movably installed on the guide rod (9). The guide rod (9) is located inside the device body (2). A floating unit and an auxiliary positioning unit are provided inside the floating platform plate (5). A waste heat recovery unit is provided on the side of the upper pressing plate (7). The floating unit is used to switch working states so that the floating platform plate (5) can perform different functions in different working states. The auxiliary positioning unit is used to hold the circuit board to be processed so that the circuit board is always attached to the lower surface of the upper pressing plate (7). The waste heat recovery unit recovers and reuses the hot air that escapes from the device to avoid waste of resources. The floating unit also includes a material support platform (501), a floating frame (502), and an infrared sensor (22). The material support platform (501) and the floating frame (502) are combined to form a floating platform plate (5). The upper edge of the material support platform (501) is provided with a limiting edge. The floating frame (502) is sleeved on the material support platform (501). The front of the material support platform (501) is evenly provided with multiple air holes (505). The side of the floating frame (502) is provided with a vacuum tube (503). The bottom of the vacuum tube (503) is provided with a hot air inlet pipe (504).

2. The circuit board dual heat source circuit laying device for intelligent temperature-controlled blankets according to claim 1, characterized in that, The infrared sensor (22) is located inside the main body (2) of the device. The material support platform (501) is provided with multiple sets of pipes (506). The air hole (505) is connected to the pipes (506). The pipes (506) are connected to the vacuum pipe (503) in the unpressed state. The pipes (506) are provided with pipes (507) below the pipes (506). The pipes (507) are connected to the hot air inlet pipe (504) in the pressed state.

3. The circuit board dual heat source circuit laying device for intelligent temperature-controlled blankets according to claim 2, characterized in that, The material support platform (501) is provided with multiple sets of recycling tanks (508). A stop block (510) is movably installed in the recycling tank (508). The two ends of the stop block (510) are fixedly installed on the inner side of the floating frame (502) by connecting rods (511).

4. The circuit board dual heat source circuit laying device for intelligent temperature-controlled blankets according to claim 3, characterized in that, The material support platform (501) is provided with a slot (509) for the connecting rod (511) to move up and down. The stop block (510) is provided with multiple sets of through holes (512). When the device is in an unpressed state, the through holes (512) form a complete pipeline one (506) with the pipeline inside the material support platform (501). When it is in a pressed state, it is connected to pipeline two (507).

5. The circuit board dual heat source circuit laying device for intelligent temperature-controlled blankets according to claim 4, characterized in that, The material support platform (501) and the floating frame (502) are provided with three sets of mounting holes (514) on both sides. A limiting rod (515) is provided in the mounting hole (514). A reset spring (516) is sleeved on the outside of the limiting rod (515). The two ends of the reset spring (516) are fixedly connected to the material support platform (501) and the floating frame (502) respectively.

6. The circuit board dual heat source circuit laying device for intelligent temperature-controlled blankets according to claim 1, characterized in that, The auxiliary positioning unit includes an adjustment knob (517), which is located on both sides of the floating frame (502). The adjustment knob (517) is located at the end of the screw (521). The inner side of the floating frame (502) is provided with an adjustment groove (518). A top block (519) is slidably installed in the adjustment groove (518). The side of the material support platform (501) is provided with a pallet recycling groove (522). An auxiliary pallet (520) is provided in the pallet recycling groove (522).

7. The circuit board dual heat source circuit laying device for intelligent temperature-controlled blankets according to claim 6, characterized in that, A rotating rod (523) is rotatably installed in the tray recycling trough (522) via a rotating shaft. The top block (519) is in contact with one end of the rotating rod (523), and the auxiliary tray (520) is in contact with the other end of the rotating rod (523).

8. The circuit board dual heat source circuit laying device for intelligent temperature-controlled blankets according to claim 1, characterized in that, The waste heat recovery unit includes a protrusion (513) and a lower pressure block (17). The protrusion (513) is located on the front and rear sides of the floating frame (502), and the lower pressure block (17) is located on the front and rear sides of the lower end of the upper pressing plate (7). When the floating platform plate (5) and the upper pressing plate (7) are in a pressing state, a pressing cavity (16) is formed between the two plates. The side of the lower pressure block (17) inside the upper pressing plate (7) is provided with an air extraction pipe (18). One end of the air extraction pipe (18) is connected to the pressing cavity (16), and the other end is fixedly connected to the air extraction port of the air pump (13).

9. The circuit board dual heat source circuit laying device for intelligent temperature-controlled blankets according to claim 8, characterized in that, The upper pressure plate (7) has an oil outlet pipe (20) on its side, which is connected to the heat transfer oil circulation pipeline inside the upper pressure plate (7). The suction pipe (18) is spirally wrapped around the oil outlet pipe (20), and the wrapped part is located inside the protective shell (19). The protective shell (19) is located on the side of the upper pressure plate (7). The other end of the oil outlet pipe (20) is fixedly connected to the inside of the oil storage tank (10). The side of the oil outlet pipe (20) is provided with an oil inlet pipe (21). (21) Passing through the heater (12) and fixedly connected to the circulating pump (11), the heater (12) is provided with a second hot air branch pipe (26), the other end of the second hot air branch pipe (26) is provided on the electronic valve (24), the other side of the electronic valve (24) is provided with a first hot air branch pipe (25), the air inlet of the electronic valve (24) is fixedly connected to the air outlet of the hot air blower (23), and the oil inlet of the circulating pump (11) is fixedly connected to the oil storage tank (10) through the connecting pipe.

10. The circuit board dual heat source circuit laying device for intelligent temperature-controlled blankets according to claim 1, characterized in that, The bottom of the floating platform plate (5) is provided with a mounting base (14), which is fixedly connected to the output end of the second cylinder (15). The second cylinder (15) is located on the base inside the main body (2) of the device.

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