Radiating device and display device

Abstract

The invention provides a heat dissipation device and a display device, and relates to the technical field of heat dissipation. The microcavity structure is arranged on one side of the first vibration substrate, a microcavity is defined by the first vibration substrate and the microcavity structure, and at least one opening is formed in the surface of at least one side of the microcavity structure; the first piezoelectric structure is arranged on the side, away from the micro-cavity structure, of the first vibration substrate and comprises a plurality of piezoelectric layers which are sequentially arranged in a stacked mode in the first direction, and the first direction is the arrangement direction of the first vibration substrate and the micro-cavity structure; the piezoelectric layer comprises a piezoelectric substrate, a first electrode layer and a second electrode layer, the first electrode layer and the second electrode layer are arranged on the two opposite sides of the piezoelectric substrate in the first direction, the first electrode layers of the adjacent piezoelectric layers are electrically connected with each other, and the second electrode layers of the adjacent piezoelectric layers are electrically connected with each other.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more specifically, to a heat dissipation device and a display device. Background Technology

[0002] As the performance of consumer electronics products gradually improves, so does their power consumption. This leads to the problem of heat dissipation, as most of the energy is ultimately dissipated as heat. Currently, many consumer electronics products rely primarily on natural convection for heat dissipation; however, natural convection has very low heat transfer efficiency, removing only a limited amount of heat.

[0003] Piezoelectric jet fans can achieve good heat dissipation with a relatively small thickness. However, piezoelectric materials themselves are insulators, so driving them requires a high voltage, far exceeding the driving voltage limit inside consumer electronics, which puts significant pressure on circuit design and space constraints. Therefore, how to reduce the driving voltage of heat dissipation devices has become an urgent problem to be solved in this field. Summary of the Invention

[0004] The present application provides a heat dissipation device and a display device, aiming to solve the problem of how to reduce the driving voltage of the heat dissipation device.

[0005] A first aspect of this application provides a heat dissipation device, the heat dissipation device comprising:

[0006] First vibrating substrate;

[0007] A microcavity structure is disposed on one side of the first vibrating substrate, the first vibrating substrate and the microcavity structure enclose the microcavity to form a microcavity, and at least one opening is formed on at least one side surface of the microcavity structure.

[0008] A first piezoelectric structure is disposed on the side of the first vibrating substrate away from the microcavity structure, and includes a plurality of piezoelectric layers stacked sequentially along a first direction, wherein the first direction is the arrangement direction of the first vibrating substrate and the microcavity structure.

[0009] The piezoelectric layer includes a piezoelectric substrate, a first electrode layer, and a second electrode layer. The first electrode layer and the second electrode layer are disposed on opposite sides of the piezoelectric substrate along the first direction. The first electrode layers of adjacent piezoelectric layers are electrically connected to each other, and the second electrode layers of adjacent piezoelectric layers are electrically connected to each other.

[0010] In one alternative embodiment, the first piezoelectric structure further includes an insulating layer disposed between adjacent piezoelectric layers, wherein the orthographic projection of the insulating layer on the first vibrating substrate coincides with the orthographic projection of the piezoelectric layer on the first vibrating substrate.

[0011] In one alternative embodiment, the first piezoelectric structure is centrally disposed on the side of the first vibrating substrate opposite to the microcavity structure.

[0012] In one alternative embodiment, the first piezoelectric structure further includes a first connection portion and a second connection portion that are insulated from each other, the first connection portion and the second connection portion at least covering a portion of the sidewalls of the plurality of piezoelectric layers;

[0013] The plurality of first electrode layers are electrically connected through the first connection portion and are insulated from each other from the second connection portion; the plurality of second electrode layers are electrically connected through the second connection portion and are insulated from each other from the first connection portion.

[0014] In one optional embodiment, the first piezoelectric structure further includes a first extension and a second extension, the first extension and the second extension being disposed on the side of the first vibrating substrate opposite to the microcavity structure;

[0015] The first extension is electrically connected to the first connecting portion, and the second extension is electrically connected to the second connecting portion. The first extension and the second extension extend in opposite directions relative to the piezoelectric layer.

[0016] In one alternative embodiment, the plurality of piezoelectric layers have the same thickness, and the sum of the thicknesses of the plurality of piezoelectric layers is greater than or equal to 100 μm and less than or equal to 200 μm.

[0017] In an optional embodiment, the heat dissipation device further includes a second piezoelectric structure located within the microcavity. The second piezoelectric structure is disposed on the side of the first vibrating substrate away from the first piezoelectric structure and is attached to the first vibrating substrate. The orthographic projection of the second piezoelectric structure on the first vibrating substrate coincides with the orthographic projection of the first piezoelectric structure on the first vibrating substrate.

[0018] In one optional embodiment, the second piezoelectric structure includes at least one of the piezoelectric layers, the first electrode layer of the piezoelectric layer of the second piezoelectric structure is electrically connected to the first electrode layer of the piezoelectric layer of the first piezoelectric structure, and the second electrode layer of the piezoelectric layer of the second piezoelectric structure is electrically connected to the second electrode layer of the piezoelectric layer of the first piezoelectric structure.

[0019] In an optional embodiment, the piezoelectric layer further includes a substrate disposed on the side of the piezoelectric substrate close to the first vibrating substrate, wherein the deformation capability of the substrate is less than or equal to the deformation capability of the first vibrating substrate.

[0020] In one alternative embodiment, the second electrode layer is disposed close to the first vibrating substrate;

[0021] The substrate is made of an insulating material and is disposed on the side of the second electrode layer away from the piezoelectric substrate, or...

[0022] The substrate is made of a conductive material and is disposed between the second electrode layer and the piezoelectric substrate.

[0023] In one optional embodiment, the microcavity structure includes a base plate and a side plate, the base plate being disposed opposite to the first vibration substrate, the side plate being disposed between the base plate and the first vibration substrate, and the at least one opening being disposed on the base plate or the side plate.

[0024] In one alternative embodiment, there are multiple openings, which are symmetrically arranged about the center of the first vibrating substrate.

[0025] In one optional embodiment, the heat dissipation device further includes a second vibration substrate, wherein the base plate is reused as the second vibration substrate;

[0026] The heat dissipation device further includes a third piezoelectric structure, which is disposed on the side of the second vibrating substrate away from the first vibrating substrate and is attached to the second vibrating substrate. The orthographic projection of the third piezoelectric structure on the first vibrating substrate coincides with the orthographic projection of the first piezoelectric structure on the first vibrating substrate.

[0027] A second aspect of this application provides a display device, the display device including a display panel and a heat dissipation device as described in any one of the first aspects of this application, wherein the opening of the heat dissipation device is disposed corresponding to the heat source of the display panel.

[0028] Beneficial effects:

[0029] This application provides a heat dissipation device and a display device. The heat dissipation device includes: a first vibrating substrate; a microcavity structure disposed on one side of the first vibrating substrate, wherein the first vibrating substrate and the microcavity structure enclose a microcavity, and at least one opening is formed on at least one side surface of the microcavity structure; a first piezoelectric structure disposed on the side of the first vibrating substrate away from the microcavity structure, comprising a plurality of piezoelectric layers sequentially stacked along a first direction, wherein the first direction is the arrangement direction of the first vibrating substrate and the microcavity structure; each piezoelectric layer includes a piezoelectric substrate, a first electrode layer, and a second electrode layer, wherein the first electrode layer and the second electrode layer are disposed on opposite sides of the piezoelectric substrate along the first direction, and the first electrode layers of adjacent piezoelectric layers are electrically connected to each other, and the second electrode layers of adjacent piezoelectric layers are electrically connected to each other. This application, by stacking a plurality of piezoelectric layers on a first vibrating substrate, and electrically connecting the first electrode layers and the second electrode layers of the plurality of piezoelectric layers, enables the plurality of piezoelectric layers to be connected in parallel, thereby effectively reducing the driving voltage required to achieve the same deformation and reducing the circuit design pressure in the display panel. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of a heat dissipation device according to an embodiment of this application;

[0032] Figure 2 This is a schematic diagram of the structure of the first piezoelectric structure in a heat dissipation device according to an embodiment of this application;

[0033] Figure 3 This is a schematic diagram of a first piezoelectric structure for setting a substrate according to an embodiment of this application;

[0034] Figure 4 This is a schematic diagram of a heat dissipation device structure with multiple openings on the base plate according to an embodiment of this application;

[0035] Figure 5 This is a schematic diagram of a heat dissipation device structure with an opening in the side plate according to an embodiment of this application;

[0036] Figure 6 This is a schematic diagram of a heat dissipation device structure with multiple openings on the side plate according to an embodiment of this application;

[0037] Figure 7This is a schematic diagram of a heat dissipation device with a second piezoelectric structure according to an embodiment of this application;

[0038] Figure 8 This is a schematic diagram of a heat dissipation device structure comprising a second vibrating substrate and a third piezoelectric structure according to an embodiment of this application;

[0039] Figure 9 This is a top view schematic diagram of the extension direction of the first extension and the second extension in a heat dissipation device according to an embodiment of this application;

[0040] Figures 10a-10f This is a top view schematic diagram of different shape combinations of the various layers of a heat dissipation device according to an embodiment of this application;

[0041] Figure 11 This is a schematic diagram showing the corresponding arrangement of heat dissipation devices and heat sources of the display panel in a display device according to an embodiment of this application.

[0042] Explanation of reference numerals in the attached drawings: 11, first vibrating substrate; 12, second vibrating substrate; 21, first piezoelectric structure; 211, piezoelectric layer; 212, insulating layer; 22, second piezoelectric structure; 23, third piezoelectric structure; 311, base plate; 312, side plate; 313, opening; 41, first electrode layer; 42, second electrode layer; 43, piezoelectric substrate; 44, substrate; 51, first connecting portion; 52, second connecting portion; 61, first extension portion; 62, second extension portion. Detailed Implementation

[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0044] In the accompanying drawings, the size of constituent elements, the thickness of layers, or areas may sometimes be exaggerated for clarity. Therefore, any implementation of this disclosure is not necessarily limited to the dimensions shown in the drawings, and the shapes and sizes of the components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and any implementation of this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0045] As the performance of consumer electronics products gradually improves, so does their power consumption, which involves increases in computing power and display quality. A related issue is heat dissipation, as most energy consumption is ultimately dissipated as heat. However, since the size of consumer electronics products cannot be increased, with a fixed heat dissipation area, removing more heat can only be achieved by improving the heat transfer coefficient and increasing the temperature difference. Increasing the temperature difference, however, leads to an increase in the product's own temperature, which will severely impact its lifespan. Therefore, improving the heat transfer coefficient has become the primary convection cooling solution.

[0046] Currently, the mainstream solution to improve convective heat transfer efficiency is air cooling, which involves adding fans to dissipate heat. However, in many cases, such as mobile phones and televisions, noise and size constraints prevent the use of fans. Many consumer electronics products still rely primarily on natural convection for heat dissipation, but natural convection has very low efficiency, removing only a limited amount of heat. Piezoelectric jet fans can achieve good heat dissipation with a relatively small thickness, but the piezoelectric material itself is an insulator, requiring a high voltage to drive it, typically tens of volts, far exceeding the driving voltage limit inside consumer electronics, thus placing significant demands on circuit design and space constraints.

[0047] In view of this, embodiments of this application propose a heat dissipation device. Figure 1 A schematic diagram of a heat dissipation device according to an embodiment of this application is shown, as follows: Figure 1 As shown, the heat dissipation device includes: a first vibrating substrate 11, which has deformation capability and is configured to vibrate under voltage; a microcavity structure, which is disposed on one side of the first vibrating substrate 11, and the first vibrating substrate 11 and the microcavity structure enclose to form a microcavity, wherein at least one opening 313 is formed on at least one side surface of the microcavity structure, the opening 313 is used to form a high-speed jet to carry away heat and introduce surrounding fluid into the microcavity through the entrainment effect to form a secondary flow, thereby enhancing the heat dissipation effect; and a first piezoelectric structure 21, which is disposed on the side of the first vibrating substrate 11 away from the microcavity structure, the first piezoelectric structure 21 is used to provide a driving voltage to the first vibrating substrate 11 to drive the first vibrating substrate 11 to vibrate, so that the microcavity structure forms a jet at the opening 313.

[0048] When the heat dissipation device is working, an airflow of more than 10 m / s is continuously generated at the opening 313. After the airflow flows out, it entrains the surrounding fluid, forming a highly efficient heat dissipation effect. While the jet is continuously output, external fluid is continuously replenished into the microcavity from the side of the opening.

[0049] Optionally, the first piezoelectric structure 21 provides a driving voltage with a driving frequency greater than or equal to 20kHz to reduce the noise of the heat dissipation device, so that the heat dissipation device can be better integrated into electronic products and improve the user experience.

[0050] In the embodiments of this application, Figure 2 This paper shows a schematic diagram of the structure of the first piezoelectric structure in a heat dissipation device according to an embodiment of this application, as shown below. Figure 2 As shown, the first piezoelectric structure 21 includes a plurality of piezoelectric layers 211 stacked sequentially along a first direction, which is the arrangement direction of the first vibrating substrate 11 and the microcavity structure. Each piezoelectric layer 211 includes a piezoelectric substrate 43, a first electrode layer 41, and a second electrode layer 42. The first electrode layer 41 and the second electrode layer 42 are disposed on opposite sides of the piezoelectric substrate 43 along the first direction. The first electrode layers 41 of adjacent piezoelectric layers 211 are electrically connected to each other, and the second electrode layers 42 of adjacent piezoelectric layers 211 are electrically connected to each other. This embodiment of the application provides a first piezoelectric structure 21 including a plurality of stacked piezoelectric layers 211 on the first vibrating substrate 11. The first electrode layers 41 and second electrode layers 42 of the plurality of piezoelectric layers 211 are electrically connected, forming a parallel connection between the plurality of piezoelectric layers 211. This allows the required peak driving voltage to be shared by the plurality of parallel-connected piezoelectric layers 211, thereby effectively reducing the driving voltage value required to achieve the same deformation and reducing the circuit design pressure in the display panel. For example, the first piezoelectric structure 21 includes two stacked piezoelectric layers 211. Each piezoelectric layer 211 is given a peak driving voltage of 10V, which can achieve the same electric field strength as a single piezoelectric layer given a peak driving voltage of 20V, thereby achieving the same deformation and airflow effect as the vibrating substrate 11.

[0051] Optionally, the material of the piezoelectric substrate 43 includes PZT, BT, AlN or other materials that can achieve the same piezoelectric effect, and the thickness of the piezoelectric substrate 43 is greater than or equal to 20 μm and less than or equal to 500 μm.

[0052] In some alternative implementations, such as Figure 2 As shown, since the plurality of piezoelectric layers 211 are stacked, and electrode layers are provided on opposite sides of the piezoelectric substrate 43 of each piezoelectric layer 211, in order to avoid short circuits between adjacent piezoelectric layers 211, the first piezoelectric structure 21 further includes an insulating layer 212. The insulating layer 212 is disposed between adjacent piezoelectric layers 211, and the orthographic projection of the insulating layer 212 on the first vibrating substrate 11 coincides with the orthographic projection of the piezoelectric layer 211 on the first vibrating substrate 11.

[0053] In some alternative embodiments, to ensure uniform vibration distribution of the vibrating substrate 11 and reduce irregular vibration modes (such as torsional vibration) of the vibrating substrate 11, the first piezoelectric structure 21 is centrally disposed on the side of the first vibrating substrate 11 away from the microcavity structure. Furthermore, by centrally distributing the first piezoelectric structure 21, the energy transfer efficiency of the first piezoelectric structure 21 can be improved.

[0054] In some alternative implementations, such as Figure 2 As shown, the first piezoelectric structure 21 further includes a first connecting portion 51 and a second connecting portion 52 that are insulated from each other. The first connecting portion 51 and the second connecting portion 52 at least cover a portion of the sidewalls of the plurality of piezoelectric layers 211. A portion of the edges of the plurality of first electrode layers 41 are electrically connected through the first connecting portion 51 and are insulated from each other by the second connecting portion 52. A portion of the edges of the plurality of second electrode layers 42 are electrically connected through the second connecting portion 52 and are insulated from each other by the first connecting portion 51.

[0055] In some alternative implementations, Figure 9 This illustration shows a top view of the extension directions of the first and second extensions in a heat dissipation device according to an embodiment of this application, as shown below. Figure 2 and Figure 9 As shown, the first piezoelectric structure 21 further includes a first extension 61 and a second extension 62. The first extension 61 and the second extension 62 are disposed on the side of the first vibrating substrate 11 opposite to the microcavity structure, and are used for connection to a power source. The first extension 61 is electrically connected to the first connecting portion 51, and the second extension 62 is electrically connected to the second connecting portion 52, so that the first electrode layer 41 of the plurality of piezoelectric layers 211 obtains the driving voltage of the power source through the first extension 61 and the first connecting portion 51. To minimize electrical interference between the first and second electrodes, the first extension 61 and the second extension 62 extend backward relative to the piezoelectric layer 211. Furthermore, this backward extension design increases the physical distance between the positive and negative electrodes, effectively simplifying circuit wiring and reducing the possibility of heat accumulation.

[0056] In some optional embodiments, in order to ensure that different piezoelectric layers 211 share the same driving voltage, the thickness of the plurality of piezoelectric layers 211 is the same. Optionally, the sum of the thicknesses of the plurality of piezoelectric layers 211 is greater than or equal to 100 μm and less than or equal to 200 μm. For example, the first piezoelectric structure 21 includes a first piezoelectric layer and a second piezoelectric layer stacked together, and the thickness of the first piezoelectric layer and the second piezoelectric layer is 75 μm.

[0057] In some alternative implementations, Figure 7 This application provides a schematic diagram of a heat dissipation device structure with a second piezoelectric structure according to an embodiment of the present application. Figure 7 As shown, the heat dissipation device further includes a second piezoelectric structure 22 located within the microcavity. The second piezoelectric structure 22 is disposed on the side of the first vibrating substrate 11 away from the first piezoelectric structure 21 and is attached to the first vibrating substrate 11. The orthographic projection of the second piezoelectric structure 22 on the first vibrating substrate 11 coincides with the orthographic projection of the first piezoelectric structure 21 on the first vibrating substrate 11. In this embodiment, by providing the second piezoelectric structure 21, piezoelectric structures are provided on both opposite sides of the first vibrating substrate 11, allowing the two piezoelectric structures to act together on the first vibrating substrate, effectively amplifying the diaphragm displacement of the first vibrating substrate 11 and improving the heat dissipation effect.

[0058] Optionally, the second piezoelectric structure 22 includes at least one piezoelectric layer 211. When the second piezoelectric structure 21 includes multiple piezoelectric layers 211, the multiple piezoelectric layers 211 are stacked along the first direction. The piezoelectric layers 211 of the second piezoelectric structure 22 have the same structure as the piezoelectric layers 211 of the first piezoelectric structure 21. For details, please refer to the above description of the piezoelectric layers 211 in the first piezoelectric structure 21; this will not be repeated here.

[0059] It should be noted that the first electrode layer 41 of the plurality of piezoelectric layers 211 of the second piezoelectric structure 22 is electrically connected to the first electrode layer 41 of the plurality of piezoelectric layers 211 of the first piezoelectric structure 21, and the second electrode layer 42 of the plurality of piezoelectric layers 211 of the second piezoelectric structure 22 is electrically connected to the second electrode layer 42 of the plurality of piezoelectric layers 211 of the first piezoelectric structure 21.

[0060] In some alternative implementations, Figure 3 This invention provides a schematic diagram of a first piezoelectric structure for a substrate according to an embodiment of this application. Figure 3 As shown, the piezoelectric layer 211 further includes a substrate 44, which is disposed on the side of the piezoelectric substrate 43 close to the first vibrating substrate 11. The deformation capacity of the substrate 44 is less than or equal to that of the first vibrating substrate 11, and the rigidity of the substrate 44 is greater than or equal to that of the first vibrating substrate 11. By providing a substrate 44 with a greater rigidity than the first vibrating substrate 11, the structural strength of the first piezoelectric structure can be effectively improved, while the deformation of the first vibrating substrate 11 can be amplified.

[0061] Optionally, the substrate 44 can be a flexible material, such as PET, PI, etc., or a rigid material, such as 304 steel, AISI 4340 alloy steel, ceramics, etc., and the thickness of the substrate 44 is greater than or equal to 20 μm and less than or equal to 500 μm; the material of the first vibrating substrate 11 can be a flexible material, such as PET, PI, etc., or a rigid material, such as 304 steel, AISI 4340 alloy steel, ceramics, etc.

[0062] Optionally, the second electrode layer 42 is disposed close to the first vibrating substrate 11; when the substrate 44 is an insulating material, in order to avoid the substrate 44 blocking the electrical connection between the second electrode layer 42 and the piezoelectric substrate 43, the substrate 44 is disposed on the side of the second electrode layer 42 away from the piezoelectric substrate 43; when the substrate 44 is a conductive material, the substrate 44 may be disposed between the second electrode layer 42 and the piezoelectric substrate 43, or the substrate 44 may be disposed on the side of the second electrode layer 42 away from the piezoelectric substrate 43.

[0063] In some alternative implementations, such as Figure 1 As shown, the microcavity structure includes a base plate 311 and a side plate 312. The base plate 311 is disposed opposite to the first vibrating substrate 11, and the side plate 312 is disposed between the base plate 311 and the first vibrating substrate 11. At least one opening 313 is disposed on the base plate 311 or the side plate 312. Optionally, to ensure jet uniformity, when there are multiple openings 313, the multiple openings 313 are symmetrically arranged about the center of the first vibrating substrate 11.

[0064] Specifically, Figure 4 This illustration shows a schematic diagram of a heat dissipation device structure with multiple openings on the base plate according to an embodiment of this application. Figure 4 As shown, there are multiple openings 313, which are disposed on the base plate 311 and are symmetrically arranged about the center of the first vibration substrate 11. Figure 5 This illustration shows a schematic diagram of a heat dissipation device structure with an opening in the side plate according to an embodiment of this application. Figure 5 As shown, there is one opening 313, and the opening 313 is disposed on the side plate 312; Figure 6 This illustration shows a schematic diagram of a heat dissipation device structure with multiple openings on the side plate according to an embodiment of this application. Figure 6As shown, there are multiple openings 313, which are disposed on the side plate 312 and are symmetrically arranged about the center of the first vibration substrate 11.

[0065] In some alternative implementations, Figure 8 This illustration shows a schematic diagram of a heat dissipation device structure comprising a second vibrating substrate and a third piezoelectric structure according to an embodiment of this application. Figure 8 As shown, in order to improve the heat dissipation effect of the heat dissipation device, the heat dissipation device further includes a second vibrating substrate 12, and the base plate 311 is reused as the second vibrating substrate 12; the heat dissipation device further includes a third piezoelectric structure 23, the third piezoelectric structure 23 is disposed on the side of the second vibrating substrate 12 away from the first vibrating substrate 11 and is attached to the second vibrating substrate 12, and the orthographic projection of the third piezoelectric structure 23 on the first vibrating substrate 11 coincides with the orthographic projection of the first piezoelectric structure 21 on the first vibrating substrate 11.

[0066] In some alternative implementations, Figures 10a-10f This application provides a top view schematic diagram illustrating different shape combinations of various layers in a heat dissipation device according to an embodiment of the present application, as shown below. Figures 10a-10f As shown, the orthographic projection shapes of the first vibrating substrate 11, the side plate 312, the first piezoelectric structure 21, and the opening 313 in the heat dissipation device can all be combinations of circles, squares, or other regular or irregular closed shapes. It should be noted that... Figures 10a-10f This paper only shows some of the different combinations of heat dissipation devices described above, and does not exhaust all possible combinations. Specific combinations can be determined according to actual needs, and this application does not impose any limitations on them. Furthermore, since the final application of the heat dissipation devices will be combined with different electronic devices, considering practical considerations and space requirements, some structures in the heat dissipation devices can be combined with the internal space and components of electronic products to form special shapes to adapt to the structure of the electronic products.

[0067] This application provides a heat dissipation device and a display device. The heat dissipation device includes: a first vibrating substrate; a microcavity structure disposed on one side of the first vibrating substrate, wherein the first vibrating substrate and the microcavity structure enclose a microcavity, and at least one opening is formed on at least one side surface of the microcavity structure; a first piezoelectric structure disposed on the side of the first vibrating substrate away from the microcavity structure, comprising a plurality of piezoelectric layers stacked sequentially along a first direction, wherein the first direction is the arrangement direction of the first vibrating substrate and the microcavity structure; each piezoelectric layer includes a piezoelectric substrate, a first electrode layer, and a second electrode layer, wherein the first electrode layer and the second electrode layer are disposed on opposite sides of the piezoelectric substrate along the first direction, and the first electrode layers of adjacent piezoelectric layers are electrically connected to each other, and the second electrode layers of adjacent piezoelectric layers are electrically connected to each other. By providing a plurality of piezoelectric layers stacked on the first vibrating substrate, and the first electrode layers and second electrode layers of the plurality of piezoelectric layers being electrically connected, the plurality of piezoelectric layers are connected in parallel, thereby effectively reducing the driving voltage required to achieve the same deformation and reducing the circuit design pressure in the display panel.

[0068] Based on the same inventive concept, this application discloses a display device, which includes a display panel and a heat dissipation device as described in the embodiments of this application. The opening of the heat dissipation device is arranged corresponding to the heat source of the display panel. Figure 11 This illustration shows a schematic diagram of the corresponding arrangement of heat dissipation devices and heat sources in a display device according to an embodiment of this application, such as... Figure 11 As shown, the heat dissipation device is disposed on the heat dissipation device plate layer, and the heat dissipation device is disposed in a one-to-one correspondence with the chip heat source of the display panel module layer, so that the opening of the heat dissipation device is disposed in a corresponding manner with the chip heat source.

[0069] In some optional embodiments, the display device is a product with image display capabilities. Optionally, the display device can be used to display static images, such as pictures and photographs; the display device can also be used to display dynamic images, such as videos and game screens.

[0070] In some alternative implementations, the display device includes, but is not limited to, laptops, mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, car displays, navigators, cockpit controllers and / or displays, displays of camera views, electronic photographs, electronic billboards or signs, projectors, packaging and aesthetic structures, etc.

[0071] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0072] In the description of this specification, it should be understood that the terms "center", "thickness", "upper", "lower", "front", "rear", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0073] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0074] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0075] The foregoing application provides many different implementations or examples for carrying out different structures of this application. To simplify this application, the components and arrangements of specific examples are described above. Of course, these are merely examples and are not intended to limit this application. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0076] The terms "an embodiment," "embodiment," or "one or more embodiments" as used herein mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this application. Furthermore, please note that the examples of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0077] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this application may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0078] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0079] The above provides a detailed description of a heat dissipation device and a display device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A heat dissipation device, characterized in that, The heat dissipation device includes: First vibrating substrate; A microcavity structure is disposed on one side of the first vibrating substrate, the first vibrating substrate and the microcavity structure enclose the microcavity to form a microcavity, and at least one opening is formed on at least one side surface of the microcavity structure. A first piezoelectric structure is disposed on the side of the first vibrating substrate away from the microcavity structure, and includes a plurality of piezoelectric layers stacked sequentially along a first direction, wherein the first direction is the arrangement direction of the first vibrating substrate and the microcavity structure. The piezoelectric layer includes a piezoelectric substrate, a first electrode layer, and a second electrode layer. The first electrode layer and the second electrode layer are disposed on opposite sides of the piezoelectric substrate along the first direction. The first electrode layers of adjacent piezoelectric layers are electrically connected to each other, and the second electrode layers of adjacent piezoelectric layers are electrically connected to each other.

2. The heat dissipation device according to claim 1, characterized in that, The first piezoelectric structure further includes an insulating layer disposed between adjacent piezoelectric layers, wherein the orthographic projection of the insulating layer on the first vibrating substrate coincides with the orthographic projection of the piezoelectric layer on the first vibrating substrate.

3. The heat dissipation device according to claim 1, characterized in that, The first piezoelectric structure is centrally located on the side of the first vibrating substrate away from the microcavity structure.

4. The heat dissipation device according to claim 1, characterized in that, The first piezoelectric structure further includes a first connection portion and a second connection portion that are insulated from each other, the first connection portion and the second connection portion at least covering a portion of the sidewalls of the plurality of piezoelectric layers; The plurality of first electrode layers are electrically connected through the first connection portion and are insulated from each other from the second connection portion; the plurality of second electrode layers are electrically connected through the second connection portion and are insulated from each other from the first connection portion.

5. The heat dissipation device according to claim 4, characterized in that, The first piezoelectric structure further includes a first extension and a second extension, the first extension and the second extension being disposed on the side of the first vibrating substrate away from the microcavity structure; The first extension is electrically connected to the first connecting portion, and the second extension is electrically connected to the second connecting portion. The first extension and the second extension extend in opposite directions relative to the piezoelectric layer.

6. The heat dissipation device according to claim 1, characterized in that, The piezoelectric layers have the same thickness, and the sum of the thicknesses of the piezoelectric layers is greater than or equal to 100 μm and less than or equal to 200 μm.

7. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device further includes a second piezoelectric structure located within the microcavity. The second piezoelectric structure is disposed on the side of the first vibrating substrate away from the first piezoelectric structure and is attached to the first vibrating substrate. The orthographic projection of the second piezoelectric structure on the first vibrating substrate coincides with the orthographic projection of the first piezoelectric structure on the first vibrating substrate.

8. The heat dissipation device according to claim 7, characterized in that, The second piezoelectric structure includes at least one of the piezoelectric layers, wherein the first electrode layer of the piezoelectric layer of the second piezoelectric structure is electrically connected to the first electrode layer of the piezoelectric layer of the first piezoelectric structure, and the second electrode layer of the piezoelectric layer of the second piezoelectric structure is electrically connected to the second electrode layer of the piezoelectric layer of the first piezoelectric structure.

9. The heat dissipation device according to claim 1, characterized in that, The piezoelectric layer further includes a substrate, which is disposed on the side of the piezoelectric substrate close to the first vibrating substrate, and the deformation capacity of the substrate is less than or equal to that of the first vibrating substrate.

10. The heat dissipation device according to claim 9, characterized in that, The second electrode layer is disposed close to the first vibrating substrate; The substrate is made of an insulating material and is disposed on the side of the second electrode layer away from the piezoelectric substrate, or... The substrate is made of a conductive material and is disposed between the second electrode layer and the piezoelectric substrate.

11. The heat dissipation device according to claim 1, characterized in that, The microcavity structure includes a base plate and a side plate. The base plate is disposed opposite to the first vibration substrate, and the side plate is disposed between the base plate and the first vibration substrate. The at least one opening is disposed on the base plate or the side plate.

12. The heat dissipation device according to claim 11, characterized in that, The openings are multiple and are symmetrically arranged about the center of the first vibrating substrate.

13. The heat dissipation device according to claim 11, characterized in that, The heat dissipation device further includes a second vibration substrate, and the base plate is reused as the second vibration substrate; The heat dissipation device further includes a third piezoelectric structure, which is disposed on the side of the second vibrating substrate away from the first vibrating substrate and is attached to the second vibrating substrate. The orthographic projection of the third piezoelectric structure on the first vibrating substrate coincides with the orthographic projection of the first piezoelectric structure on the first vibrating substrate.

14. A display device, characterized in that, The display device includes a display panel and a heat dissipation device as described in any one of claims 1 to 13, wherein the opening of the heat dissipation device is disposed corresponding to the heat source of the display panel.

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