Method and apparatus for improving heat dissipation and mechanical loading of integrated circuit packages

Abstract

Systems, apparatus, articles, and methods for improving heat dissipation and mechanical loading of integrated circuit packages are disclosed. An example apparatus includes a socket to receive an integrated circuit package; and a board for applying a load on the integrated circuit package toward the socket. The plate includes internal channels for carrying coolant through the plate. The liquid coolant is used to facilitate cooling of the integrated circuit package.

Description

Background Technology

[0001] The demand for greater computing power and faster computation times continues to grow. This has led to higher-density connectors on computer hardware components for faster signal transmission. Some processor chips (e.g., land grid array (LGA) processor chips, ball grid array (BGA) processor chips, pin grid array (PGA) processor chips, etc.) are communicatively coupled to a printed circuit board (PCB) via a socket configured to receive and electrically couple to contacts on the processor chip. Typically, a heatsink or other heat dissipation device is mechanically and thermally coupled to the processor chip on the side opposite the socket to facilitate the dissipation of heat generated by the processor chip. Attached Figure Description

[0002] Figures 1-4 The diagram illustrates example circuit systems at different stages of assembly.

[0003] Figure 5 It can be used to implement Figures 1-4 A simplified cross-sectional view of an example integrated loading mechanism.

[0004] Figure 6 It can be used to implement Figures 1-4 Another example of an integrated loading mechanism is shown in a simplified cross-sectional view.

[0005] Figure 7 It can be used to implement Figures 1-4 Another example of an integrated loading mechanism is shown in a simplified cross-sectional view.

[0006] Figure 8 It can be used to implement Figures 1-4 Another example of an integrated loading mechanism is shown in a simplified cross-sectional view.

[0007] Figure 9 It can be used to implement Figures 1-4 Another example of an integrated loading mechanism is shown in a simplified cross-sectional view.

[0008] Figure 10 It can be used to implement Figures 1-4 Another example of an integrated loading mechanism is shown in a simplified cross-sectional view.

[0009] Figure 11 It can be used to implement Figures 1-4 Another example of an integrated loading mechanism is shown in a simplified cross-sectional view.

[0010] Figure 12 It can be used to implement Figures 1-4 Another example of an integrated loading mechanism is shown in a simplified cross-sectional view.

[0011] Figure 13 This is an exploded view of an example direct impact cooling system constructed based on the teachings disclosed in this article.

[0012] Figure 14 The diagram shows a partially assembled state. Figure 13 The example is a top perspective view of a direct impact cooling system, where the example heat sink is spaced apart from the rest of the assembly to show the underside of the plate.

[0013] Figure 15 The diagram shows that it can be used in the following ways. Figure 13 An example nozzle plate assembly implemented in an example direct impact cooling system.

[0014] Figure 16 This is a flowchart illustrating example methods for implementing an example system, which includes... Figures 1-15 The example integrated loading mechanism and / or the example cooling system.

[0015] Generally, the same reference numerals will be used throughout the accompanying drawings and written description to refer to the same or similar parts. The drawings are not necessarily drawn to scale. Instead, the thickness of layers or regions may be enlarged in the drawings. While the drawings show layers and regions with clearly defined lines and boundaries, some or all of these lines and / or boundaries may be idealized. In reality, boundaries and / or lines may be unobservable, mixed, and / or irregular. Detailed Implementation

[0016] Integrated circuit (IC) packages are typically coupled to printed circuit boards (PCBs) via surface mount systems such as Land Grid Arrays (LGAs). LGA connections are formed between multiple pins in the sockets of the PCB and multiple pads on the IC package. To facilitate electrical connections between the PCB pins and the IC package pads, some known IC packages are press-fitted against the PCB. In recent years, with the increasing processing density of IC packages, the density of connections between the IC package and its socket has increased accordingly. This increased density of connections correspondingly increases the compressive load required to mount the IC package. For example, approximately 0.022 pounds of force (e.g., approximately 10 grams) is applied to each pin in the associated socket on the package to ensure consistent and reliable electrical contact between components (e.g., socket pins and LGA pads). Thus, an IC package with 5000 contacts (e.g., LGA pads) for connecting to 5000 pins requires a force greater than 1000 pounds.

[0017] The increased density of IC packaging also increases the heat output of such packages, necessitating more efficient thermal management systems to dissipate the generated heat. Typically, the heat generated by an LGA package is dissipated by a heatsink thermally coupled to the package. In such scenarios, the heat generated by an LGA package initially originates from one or more semiconductor dies (also referred to herein as semiconductor chips) within the package. Before the heat generated by the die is carried away by the heatsink, it must typically pass through the package cover (e.g., an integrated heat spreader (IHS)). Additionally, a first thermal interface material (TIM) is typically positioned between the die and the cover, and a second TIM is typically positioned between the cover and the heatsink. Thus, there are three layers of material through which heat must be transferred from the die to the heatsink, resulting in low thermal efficiency.

[0018] Simulations have demonstrated improved thermal performance when bare die packages are used. As used herein, a bare die package is an IC package without a cap, leaving the semiconductor die uncovered and / or exposed to the external environment (e.g., the die is bare). In this scenario, only one layer of TIM (without a cap) is positioned between the heatsink and the bare die. Based on the simulated boundary conditions, the maximum junction temperature (T0) is achieved when cooled by a high-end air-cooled heatsink. j最大 When thermal throttling limits are reached (e.g., 100°C), the hot spot power density of the capped package is approximately 15 watts per square millimeter (W / mm²). 2 In contrast, when thermal throttling limits are reached, the hot spot power density of a bare die package cooled by a similar heatsink is approximately 20 W / mm².2 Therefore, the heatsink thermally coupled to the bare die achieves an additional approximately 5W / mm² before thermal throttling. 2 The power density.

[0019] Simulation tests have further demonstrated that significantly higher thermal efficiency can be achieved when air-cooled heatsinks are replaced by liquid-cooled heatsinks (e.g., microchannel cold plates) thermally coupled to the bare die. Specifically, the hot spot power density of the bare die package cooled by the liquid-cooled heatsink is well greater than 30 W / mm² when thermal throttling limits are reached. 2 It is anticipated that the same or even higher thermal efficiency can be achieved to cool bare dies using direct fluid impingement cooling systems (e.g., systems that direct one or more jets of liquid coolant directly onto the surface of the bare die), since there is no material (TIM or other) between the die and the coolant.

[0020] While heat dissipation is significantly improved when a heatsink is thermally coupled to one or more dies in a package (e.g., a bare die package) without a cover, and even more significantly when liquid cooling and / or direct impact cooling are employed, implementing such a heatsink presents several challenges. As discussed above, LGA packages require substantial load forces to ensure reliable contact between the package and the pins in the underlying socket. In bare die packages, there is no cover to protect the semiconductor die and distribute the load forces across the package. Instead, the exposed semiconductor die (e.g., a bare die) is subjected to the full force of the load, posing a significant risk of damage. Furthermore, for end users, it is currently not possible to reliably couple a liquid-cooled microchannel cold plate or direct fluid impact cooling system to a bare die LGA package in a manner that is suitable for chip testing and utilizes liquid-cooled microchannel cold plates or direct fluid impact cooling systems where necessary. Moreover, for chip developers and / or manufacturers, there is currently no infrastructure available for testing bare dies using liquid-cooled microchannel cold plates or direct fluid impact cooling systems.

[0021] The examples disclosed herein help overcome the aforementioned challenges by implementing heat dissipation systems based on liquid-cooled cold plates or direct fluid impingement. More specifically, the example heat dissipation systems are integrated into a loading mechanism designed to distribute loading forces across the IC package by transferring at least some of the loading forces to the surface of the package substrate at locations spaced apart from the die (e.g., around the die). The examples disclosed herein enable end users to use custom (e.g., high-performance, niche, aftermarket) TIMs, such liquid metals, to improve thermal performance. Furthermore, the examples disclosed herein enable chip developers and / or manufacturers to perform high-volume testing of chips with bare die configurations, avoiding the cost and complexity of interfacing with integrated liquid thermal solutions.

[0022] Additionally, in some examples, the direct impact cooling system disclosed herein includes a nozzle plate that is movable relative to the rest of the heat dissipation system to adjust the distance between the nozzle and the surface of the bare die to be cooled. As disclosed herein, such adjustment of the nozzle height can be used to control temperature conditions during testing while maintaining other boundary conditions constant. Therefore, the examples disclosed herein reduce complexity and provide enhanced control when testing dies. While the examples disclosed herein are described with reference to a bare die LGA package, the teachings disclosed herein can be applied to any type of package, whether covered or bare, and whether inserted into a socket (LGA or otherwise) or soldered directly to a printed circuit board.

[0023] Figures 1-4 The illustration shows an example circuit system 100 at different stages of assembly. The example circuit system 100 includes an example printed circuit board 102, an example integrated loading mechanism (ILM) 104, an example socket 106, an example IC package 108, and an example gasket 110 (e.g., a sealant gasket). Figure 1 The circuit system 100 in disassembled form is shown before the IC package 108 is installed into the socket 106. Figure 2 The circuit system 100 is shown after the IC package 108 is mounted into the socket 106 and the pad 110 is positioned on top of the IC package 108. Figure 3 The circuit system 100 after the application of thermal interface material 302 is shown. Figure 4 A circuit system 100 is shown in which an integrated loading mechanism 104 closes on top of an IC package 108.

[0024] like Figure 1 As shown in the illustrated example, socket 106 is mounted to printed circuit board 102 and is configured to receive IC package 108 (in Figure 1 (Seen as being spaced apart from socket 106). In this example, IC package 108 is an LGA package, which includes connection pads or solder pads for contacting corresponding pins in socket 106 (in the IC package 108 and...). Figure 1 (The opposing sides are shown). More specifically, in this example, IC package 108 is a bare die package. Thus, as shown, IC package 108 includes a bare die 112 mounted to and supported by package substrate 114. As shown in the illustrated example, package substrate 114 is larger than die 112, such that the upper surface 116 of package substrate 114 is exposed, adjacent to and / or surrounding die 112.

[0025] While the example IC package 108 is shown as comprising a single die 112, in other examples, the IC package 108 comprises two or more dies. Additionally or alternatively, in some examples, the IC package 108 includes a cover (e.g., an integrated heatsink (IHS)) covering the die 112 (or multiple dies). Further, although the IC package 108 is described as an LGA package, in other examples, the IC package 108 may be a different type of package (e.g., a BGA package, a PGA package, etc.) to be received into a corresponding different type of socket. In some examples, the IC package 108 is directly surface-mounted onto the printed circuit board 102 (e.g., via solder joints), and the socket 106 is omitted.

[0026] As illustrated in the example, the integrated loading mechanism 104 is coupled to the printed circuit board 102, adjacent to the socket 106. More specifically, in this example, the integrated loading mechanism 104 includes an example frame 117 that is rotatably coupled to the printed circuit board 102 via an example hinge 118. In some examples, the hinge 118 is omitted, and the frame 117 may be coupled to the printed circuit board in other ways (e.g., threaded fasteners, etc.). As shown, the frame 117 includes and / or supports a heat sink 120 (e.g., a heat dissipation system, heatsink, load block, etc.). As the name suggests, the heat sink 120 is a plate that facilitates heat dissipation from the IC package 108. In this example, the plate 120 is a liquid-cooled heatsink (e.g., a microchannel cold plate). In other examples, the plate 120 includes a nozzle plate for direct impact cooling. Heat sink 120 is also referred to herein as a load block because, as discussed further below, the plate 120 (e.g., load block) is a block that applies a load to IC package 108 to push IC package 108 toward socket 106, thereby ensuring a reliable connection between the contacts (e.g., connection pads or solder pads) of IC package 108 and the pins in socket 106.

[0027] The hinge 118 illustrated allows the frame 117 to be in an open position away from the socket 106 (e.g., Figures 1-3 (As shown) and plate 120 are positioned in a closed position above the top of socket 106 (as shown) Figure 4 Rotation between (as shown in the diagram). In some examples, the frame 117 is held in place in the closed position by rotation of the arm 122 of the integrated loading mechanism 104. The arm 122 is configured to rotate in the released position (as shown in the diagram). Figures 1-3 (as shown) and loading location (as shown) Figure 4Rotation between (as shown in the diagram). When arm 122 is rotated to the loading position, the bent portion 124 of the associated rod 126 is rotated to press downward against frame 117. Specifically, in this example, the bent portion 124 of rod 126 presses downward against one or more tabs 128 on frame 117 away from hinge 118. The associated bent portion 124 of arm 122 and rod 126 acts as a spring (e.g., a torsion spring) to push frame 117 toward printed circuit board 102, and thereby push heat sink 120 toward IC package 108 disposed within socket 106. In other examples, integrated loading mechanism 104 may include any other suitable type of spring(s) (e.g., compression spring, tension spring, coil spring, leaf spring, disc washer, etc.) that can be loaded (e.g., compressed, stretched, torsionped, rotated, etc.) to push frame 117 and associated plate 120 toward IC package 108. In other examples, different mechanisms other than springs may be additionally or alternatively used to push the frame 117 and plate 120 toward the IC package 108. For example, in some examples, threaded fasteners may be used to generate a loading force acting on the IC package 108. In some examples, it is precisely pushing the frame 117 and plate 120 toward the IC package 108 that provides the loading on the IC package 108 to ensure reliable contact with the underpinning leads in the socket 106.

[0028] In some examples, to reduce (e.g., prevent) damage to the bare die 112 on the IC package 108, a spacer 110 may be positioned between the upper surface 116 of the substrate 114 of the IC package and the plate 120 to absorb (e.g., via deformation) at least some of the forces from the frame 117 when the frame 117 is closed and loaded by the arm 122. Thus, in some examples, the spacer 110 comprises an elastic material (e.g., an elastic polymer). Further, in some examples, at least some of the forces acting on the spacer 110 are transferred to the substrate 114, thereby distributing at least some of the load from the plate 120 away from the die 112. In some examples, a separate portion of the load from the plate 120 is applied directly to the die 112. In some examples, the proportion of load directly applied to the die 112 can be adjusted by modifying the thickness (e.g., height) and / or stiffness or rigidity of the pad 110 relative to the proportion of load absorbed by the pad 110 and / or reaching the substrate 114 through the pad 110. In some examples, the design of these characteristics of the pad 110 depends on the application and involves a trade-off between reduced pressure on the die (to protect the die from damage) and achieving sufficient load on the die (for efficient heat dissipation).

[0029] In some examples, the spacer 110 is sized such that the plate 120 contacts the spacer 110 before contacting the die 112, to reduce the risk of damaging the die 112. Thus, in some examples, the thickness (e.g., height) of the spacer 110 is greater than the thickness of the die 112. In other examples, the thickness of the spacer 110 is equal to or less than the thickness of the die 112. However, in some such examples, the plate 120 still contacts the spacer 110 before contacting the die 112, based on a lip 130 (e.g., a protruding ridge) extending toward and contacting the spacer 110 on the plate 120. That is, as shown in the illustrated example, the lip 130 is located near the periphery or outer edge of the plate 120 and extends (e.g., protrudes) from a concave surface 132 of the plate 120 located in the central region of the plate 120. When the plate 120 is closed on top of the IC package 108, the lip 130 aligns with the gasket 110, and the concave surface 132 aligns with the die 112. In some examples, the gasket 110 and the lip 130 together span a first distance from the concave surface greater than the thickness of the die 112 (e.g., having a combined thickness corresponding to this first distance). In some examples, the remaining gap between the die 112 and the concave surface 132 corresponds to a second distance, which is sized to allow the application of a thermal interface material 302 between the die 112 and the concave surface 132 of the plate 120. In some examples, such as Figure 3 As shown, thermal interface material 302 is added to the die 112 and the concave surface 132. In this type of example, once the integrated loading mechanism 104 is closed, the different portions of the thermal interface material 302 are combined, as... Figure 4 As shown in the diagram. In other cases, the thermal interface material 302 may be exclusively added to the die 112 or exclusively added to the concave surface 132 before the assembly is closed.

[0030] like Figure 1 As shown in the illustrated example, gasket 110 is removed and separated from other components of the circuit system 100. Thus, as... Figure 2 As shown, after the IC package 108 is inserted into the socket 106, the gasket 110 is manually installed in place by resting on top of the IC package 108. In other examples, the gasket 110 is secured in place (e.g., with adhesive) to the substrate 114 of the IC package 108. In some examples, the gasket 110 is directly secured to the surface 116 of the substrate 114. In some examples, the gasket 110 may be secured to a reinforcement that is itself secured to the surface of the substrate 114. In some examples, the gasket 110 is secured to a plate 120 (e.g., along a lip 130). Figure 2As most clearly shown, the spacer 110 is sized to surround the die 112 and is closer to the periphery 134 (e.g., outer edge) of the IC package 108 (e.g., the periphery of the substrate 114) than the die 112.

[0031] like Figure 4 As illustrated in the example, the back side (e.g., outer side) of the heat sink 120 includes a first opening (e.g., orifice, port, port) corresponding to the fluid inlet 402 and a second opening (e.g., orifice, port, port) corresponding to the fluid outlet 404. In some examples, there is more than one inlet 402 and / or more than one outlet 404. In some examples, the inlet 402 is fluidly coupled to the outlet 404 via one or more internal channels (e.g., fluid channels) within the plate 120 for carrying liquid coolant through the plate (e.g., from inlet 402 to outlet 404). In this way, the coolant can remove heat from the wick 112 to which the plate 120 is thermally coupled.

[0032] Figure 5 It can be used to implement Figures 1-4 A simplified cross-sectional view of the example integrated loading mechanism 104 and the example integrated loading mechanism 500. For illustrative purposes, Figure 5 The shown with Figures 1-4 Corresponding or similar features are identified by the same reference numerals. Furthermore, the above, in conjunction with... Figures 1-4 The description of this type of feature is about Figure 5 The corresponding features in [the original text] apply similarly, with differences as otherwise stated or otherwise clarified from the context. However, in some examples, Figure 5 Any of the features shown can be used in conjunction with Figures 1-4 Modify and / or implement in any suitable manner different from those shown.

[0033] like Figure 5As shown in the illustrated example, the integrated loading mechanism 500 includes a heat sink 120 coupled to and supported by a frame 117, to which a loading force 502 (e.g., via one or more springs, one or more threaded fasteners, etc.) is applied. In this example, the loading force 502 is transferred from the frame 117 and the associated plate 120 to the IC package 108. More specifically, as shown in the illustrated example, the loading force 502 is distributed across the IC package 108, with a first portion 504 applied to the upper surface 116 of the substrate 114 of the IC package 108, adjacent to the periphery 134 of the IC package 108. In this example, the first portion 504 of the loading force 502 is passed through a gasket 110 fixed to a lip 130 of the plate 120. A second portion 506 of the loading force 502 is applied to the die 112 of the IC package 108. More specifically, in this example, the concave surface 132 is in contact with the top surface of the die 112 through a layer of thermal interface material 302. Figure 5 The illustrated example shows two separate portions of the thermal interface material 302, one portion on the core 112 and the other portion on the concave surface 132 (similar to...). Figure 3 (As shown in the diagram). However, as discussed above, once the plate 120 presses against the IC package 108, the individual portions will combine into a single layer of thermal interface material 302. In some examples, the final thickness of the thermal interface material 302 corresponds to the size of the gap between the top surface of the die 112 and the concave surface 132 of the heat sink 120. That is, in some examples, the distance of this gap corresponds to the difference between: (i) a distance 508 corresponding to the combined thickness (e.g., height) of the pad 110 and the lip 130 and (ii) the thickness 510 of the die 112.

[0034] In this example, the heat sink 120 is a cold plate that includes an array of internal channels 512 (e.g., microchannels, fluid channels) between inlet 402 and outlet 404. Liquid coolant is supplied to inlet 402 and passes through microchannels 512 before being removed via outlet 404. As the coolant passes through microchannels 512, it carries away (e.g., helps dissipate) the heat generated by die 112.

[0035] Figure 6 It can be used to implement Figures 1-4 A simplified cross-sectional view of another example integrated loading mechanism 600, such as the example integrated loading mechanism 104. Figure 6 Example integrated loading mechanism 600 and Figure 5 The example integrated loading mechanism 500 is essentially the same, with differences as described below and / or otherwise specified from the context. Accordingly, Figure 6 The shown with Figure 5Corresponding or similar features are identified by the same reference numerals. Furthermore, the above, in conjunction with... Figure 5 (and extends to) Figures 1-4 The description of this type of feature is about Figure 6 The corresponding features in the text are similarly applicable. Figure 6 Examples and Figure 5 The difference in the example is that the pad 110 (either directly or via a reinforcement disposed between the pad 110 and the substrate 114 of the IC package 108) is fixed to the substrate 114 of the IC package 108, rather than to the heat sink 120.

[0036] Figure 7 It can be used to implement Figures 1-4 A simplified cross-sectional view of another example integrated loading mechanism 700, such as the example integrated loading mechanism 104. Figure 7 Example integrated loading mechanism 700 and Figure 5 The example integrated loading mechanism 500 is essentially the same, with differences as described below and / or otherwise specified from the context. Accordingly, Figure 7 The shown with Figure 5 Corresponding or similar features are identified by the same reference numerals. Furthermore, the above, in conjunction with... Figure 5 (and extends to) Figures 1-4 The description of this type of feature is about Figure 7 The corresponding features in the text are similarly applicable.

[0037] Figure 7 Examples and Figure 5 The difference in the examples is that different heatsinks 702 are used (e.g., cooling systems, heat sinks, load blocks, etc.). Although Figure 5 The heat sink 120 is shown and described as a microchannel cold plate, but Figure 7 The heat sink 702 includes and / or defines a nozzle plate for direct impact cooling of the die 112. That is, in Figure 7In some examples, plate 702 includes and / or supports an array of nozzles 704 distributed along a concave surface 132. In some examples, a first internal channel 706 (e.g., a fluid channel) within plate 702 carries coolant from inlet 402 to the nozzles, and then sprays the coolant onto the wick 112. As the coolant interacts with the wick 112, the coolant is heated by carrying away heat from the wick 112. Subsequently, in some examples, the heated coolant flows back through a second internal channel 708 (e.g., a fluid channel) of plate 702 and is removed via outlet 404 (e.g., for subsequent cooling and reuse). In this example, gasket 110 is designed to provide an hermetically tight seal around the wick 112 so that coolant does not leak out. In some examples, more than one gasket or seal may be used to reduce (e.g., prevent) coolant leakage.

[0038] In this example, there is no need for any thermal interface material because heat transfer away from the die 112 is achieved through the direct impact of the coolant on the die 112. In some examples, the array of nozzles 704 (e.g., and the associated concave surface 132) is spaced appropriately from the die 112 to ensure that the coolant jet from the nozzles 704 is adequately sprayed onto the die 112. In some examples, this distance may differ from that used in the above combination. Figure 5 The distance of the gap in the thermal interface material 302 is discussed. Therefore, in some examples, the dimensions of the gasket 110 and / or the lip 130 are... Figure 7 In the example, it may be relative to Figure 5 The examples differ. In some examples, as combined below Figures 13-15 In more detail, the array of nozzles 704 is movable relative to the mandrel 112, such that the distance between them can be adjusted and / or controlled.

[0039] In some examples, one or more supports 710 protrude toward the die 112 away from the concave surface 132. In some such examples, the supports are sized to span the gap between the concave surface 132 and the top surface of the die 112. Thus, in such examples, the supports 710 engage with the die 112 when the board 702 is pushed against the IC package 108. The supports 710 allow a second portion 506 of the load 502 to be applied to the die 112 while maintaining the distance between the die 112 and the nozzle 704 to spray coolant toward the die 112. In some examples, the supports 710 are omitted, such that no structural component extends across the gap between the concave surface 132 and the die 112. In such examples, the second portion 506 of the load applied to the IC package 108 becomes zero, and the first portion 504 corresponds to the full amount of the load.

[0040] Figure 8 It can be used to implement Figures 1-4 A simplified cross-sectional view of another example integrated loading mechanism 800, such as the example integrated loading mechanism 104. Figure 8 Example integrated loading mechanism 800 and Figure 7 The example integrated loader is essentially the same as 700, with differences as described below and / or otherwise specified from the context. Accordingly, Figure 8 The shown with Figure 7 Corresponding or similar features are identified by the same reference numerals. Furthermore, the above, in conjunction with... Figure 7 (and extends to) Figures 1-5 The description of this type of feature is about Figure 8 The corresponding features in the text are similarly applicable. Figure 8 Examples and Figure 7 The difference in the example is that the pad 110 (either directly or via a reinforcement disposed between the pad 110 and the substrate 114 of the IC package 108) is fixed to the substrate 114 of the IC package 108, rather than to the heat sink 702.

[0041] Figure 9 It can be used to implement Figures 1-4 A simplified cross-sectional view of another example integrated loading mechanism 900, such as the example integrated loading mechanism 104. Figure 9 The example integrated loading mechanism 900 implements a two-part loading system that provides two separate load sources for two separate loads acting on the IC package 108. In this example, the first load source corresponds to the central loading mechanism 902, which is connected to... Figure 5 The integrated loading mechanism 500 is the same as or similar to that in the previous version, differing from those described below and / or otherwise specified from the context. Accordingly, Figure 9 The shown with Figure 5 Corresponding or similar features are identified by the same reference numerals. Furthermore, the above, in conjunction with... Figure 5 (and extends to) Figures 1-4 The description of this type of feature is about Figure 9 The corresponding characteristics in [the text] apply similarly. Therefore, the load from the first load source (corresponding to the central loading mechanism 902) and [the text continues with further details about the load and load characteristics]. Figure 5 The load force 502 shown corresponds to that.

[0042] Figure 9 Example Central Loading Mechanism 902 and Figure 5The difference in the example integrated loading mechanism 500 is that the lip 130 of the heat sink 120 (to which the pad 110 is attached) is closer to the bare die 112 than the outer periphery 134 of the substrate 114 of the IC package 108. Therefore, a larger portion of the substrate 114 is exposed outside the heat sink 120. This relatively large portion of the substrate 114 exposed outside the heat sink 120 provides space for the second load source to interact with the substrate 114 of the IC package 108. More specifically, in this example, the second load source corresponds to the example peripheral loading mechanism 904. The example peripheral loading mechanism 904 includes a clamp 908 that supports or carries a frame 910 (e.g., a reinforcement, a picture frame reinforcement). In some examples, another pad 912 (similar or different from pad 110) is attached to the frame 910 to directly engage with the substrate 114 of the IC package 108 (or a reinforcement on the substrate 114).

[0043] In the illustrated example, the frame 910 is sized to surround the bare die 112, adjacent to the periphery 134 of the substrate 114 of the IC package 108 (e.g., along the periphery of the substrate 114 of the IC package 108). More specifically, in this example, the frame 910 is sized large enough to also surround the heat sink 120 of the example central loading mechanism 902. That is, in Figure 9 In the illustrated example, the heat sink 120 contacts the IC package 108 by extending through the frame 910 of the peripheral loading mechanism 904.

[0044] Example peripheral loading mechanism 904 includes a backplate 914 positioned on the back side of circuit board 102 (e.g., the opposite side where socket 106 is mounted). In some examples, clamp 908 (and associated frame 910) and backplate 914 are pushed against each other by one or more fasteners 916 (e.g., threaded fasteners) extending between them to generate a compressive loading force 918. This compressive loading force 918 corresponds to a second load on IC package 108, which is separate from and independent of the first loading force 502 from central loading mechanism 902.

[0045] In some examples, fastener 916 is spring-loaded. That is, as... Figure 9As shown, the compressive loading force 918 is generated from the compression of the associated spring 920 (e.g., a coil spring) based on the tightening of the fastener 916. In some examples, the spring 920 reduces the stiffness of the compressive loading force 918 applied to the IC package 108 to account for some tolerance errors, for more consistent application of the loading force and / or vibration absorption. Thus, in some examples, the integrated loading mechanism 900 includes a first spring (e.g., arm 122) and an associated bent portion 124 of the rod 126, as described above. Figures 1-4 The discussion revolves around a first load (e.g., load force 502) applied to the IC package 108 by the heat sink 120 and a second load (e.g., compressive load force 918) applied to the IC package 108. In some such examples, the second load is applied closer to the outer periphery 134 of the IC package 108 than the first load is applied. In some examples, the second load (e.g., compressive load force 918) is greater than the first load (e.g., load force 502) to reduce the risk of damage to the bare die 112 while still ensuring sufficient load is provided to the IC package 108 for a reliable connection between the IC package 108 and the socket 106. In other examples, the second load is less than or equal to the first load. In some examples, spring 920 is omitted, such that the compressive load force 918 is directly based on the degree to which the fastener 916 is tightened.

[0046] Figure 10 It can be used to implement Figures 1-4 A simplified cross-sectional view of another example integrated loading mechanism 1000, such as the example integrated loading mechanism 104. Figure 10 Example integrated loading mechanism 1000 and Figure 9 The example integrated loading mechanism is essentially the same as 900, with differences as described below and / or otherwise specified from the context. Accordingly, Figure 10 The shown with Figure 9 Corresponding or similar features are identified by the same reference numerals. Furthermore, the above, in conjunction with... Figure 9 (and extends to) Figures 1-5 The description of this type of feature is about Figure 10 The corresponding features in the text are similarly applicable. Figure 10 Examples and Figure 9 The difference in the example is that the pad 110 (either directly or via a reinforcement disposed between the pad 110 and the substrate 114 of the IC package 108) is fixed to the substrate 114 of the IC package 108, rather than to the heat sink 120.

[0047] Figure 11 It can be used to implement Figures 1-4A simplified cross-sectional view of another example integrated loading mechanism 1100, which is an example integrated loading mechanism 104. Figure 11 Example integrated loading mechanism 1100 and Figure 9 The example integrated loading mechanism is essentially the same as 900, with differences as described below and / or otherwise specified from the context. Accordingly, Figure 11 The shown with Figure 9 Corresponding or similar features are identified by the same reference numerals. Furthermore, the above, in conjunction with... Figure 9 (and extends to) Figures 1-5 The description of this type of feature is about Figure 11 The corresponding features in the text are similarly applicable.

[0048] Figure 11 Examples and Figure 9 The difference in this example is the use of a different central loading mechanism 1102. More specifically, in this example, the central loading mechanism 1102 includes a heat sink 702, which is related to... Figure 7 The same or similar as shown, except that the lip of the heat sink 120 is closer to the bare die 112 relative to the outer periphery 134 of the substrate 114 of the IC package 108. Therefore, a larger portion of the substrate 114 is exposed outside the heat sink 120 to allow the peripheral loading mechanism 904 to engage with (e.g., push against) the substrate 114.

[0049] Figure 12 It can be used to implement Figures 1-4 A simplified cross-sectional view of another example integrated loading mechanism 1200, which is an example integrated loading mechanism 104. Figure 12 Example integrated loading mechanism 1200 and Figure 11 The example integrated loading mechanism 1100 is substantially the same, with differences as described below and / or otherwise specified from the context. Accordingly, Figure 12 The shown with Figure 11 Corresponding or similar features are identified by the same reference numerals. Furthermore, the above, in conjunction with... Figure 11 (and extends to) Figures 1-5 and Figure 9 The description of this type of feature is about Figure 12 The corresponding features in the text are similarly applicable. Figure 12 Examples and Figure 11 The difference in the example is that the pad 110 (either directly or via a reinforcement disposed between the pad 110 and the substrate 114 of the IC package 108) is fixed to the substrate 114 of the IC package 108, rather than to the heat sink 702.

[0050] Figure 13This is an exploded view of an example direct-impact cooling system 1300 constructed based on the teachings disclosed herein. The example direct-impact cooling system 1300 includes an example heat sink 1302 (e.g., a heat dissipation system, heatsink, load block, etc.), an example clamping plate 1304, and an example backplate 1306 for coupling to an example circuit board 1308 that carries and / or supports an IC package 1310. More specifically, in this example, the IC package 1310 includes an example first semiconductor die 1312 and an example second semiconductor die 1314 mounted to an example package substrate 1316. In other examples, the IC package 1310 includes only one die. In other examples, the IC package 1310 includes more than two dies.

[0051] In some examples, the example direct impact cooling system 1300 can be with Figure 7 , Figure 8 , Figure 11 and / or Figure 12 The example integrated loading mechanism is implemented by combining any of the following: 700, 800, 1100, and 1200. That is, in some examples, the example heat sink 1302 is combined with... Figure 7 , Figure 8 , Figure 11 and / or Figure 12 The example heatsink 702 is the same as or similar, having internal channels (e.g., similar to the combination). Figure 7 The channels discussed (706, 708) are used to carry fluid (e.g., coolant) to the nozzle array on the nozzle plate (e.g., similar to a combined...). Figure 7 (The array of nozzles 704 discussed). In such an example, the IC package 1310 is inserted into a socket (e.g., socket 106) on the circuit board 1308 and pushed by a lip on the heat sink 1302 to contact the pins in the socket. Alternatively, the example direct impact cooling system 1300 can be independent of... Figure 7 , Figure 8 , Figure 11 and / or Figure 12Examples of integrated loading mechanisms 700, 800, 1100, and 1200 are used to implement this. That is, in some examples, the IC package 1310 is loaded by the clamp 1304 without requiring a separate loading force from the lip of the heat sink 1302. In other words, in some examples, the heat sink 1302 is not part of the integrated loading mechanism and is only used for cooling the IC package 1310. Therefore, the heat sink 1302 can be used to cool any type of IC package 1310 mounted to the circuit board 1308 in any way (e.g., using sockets other than LGA sockets (e.g., BGA sockets), without sockets (e.g., direct soldering), etc.). Furthermore, as with the other examples discussed above, the heat sink is not limited to bare die packages but can also be used to cool covered packages (e.g., packages including integrated heat sinks (IHS)).

[0052] In the illustrated example, circuit board 1308 is sandwiched between clamping plate 1304 and backplate 1306. Clamping plate 1304 includes an opening 1318 for providing access to IC package 1310 when heat sink 1302 is attached to clamping plate 1304. In some examples, the periphery of opening 1318 is dimensionally designed to engage (e.g., be pushed against) a first gasket 1320 (e.g., a first seal, an outer seal) positioned along the outer edge or periphery of IC package 1310. In other examples, opening 1318 is larger than the first gasket 1320 to allow heat sink 1302 to engage (e.g., be pushed against) the first gasket 1320.

[0053] As illustrated in the example, a first gasket 1320 surrounds both semiconductor dies 1312 and 1314. In some examples, a second gasket 1322 (e.g., a second seal, an internal seal) is sized to surround each of dies 1312 and 1314 individually. Further, the second gasket 1322 is sized to be closer to dies 1312 and 1314 than the first gasket 1320. That is, as illustrated in the example, the second gasket 1322 is fitted within the first gasket 1320 and defines two holes or openings corresponding to the first die 1312 and the second die 1314. The first gasket 1320 provides a sealant to prevent leakage around the package substrate 1316, and the second gasket 1322 provides a sealant to prevent leakage around each of the first die 1312 and the second die 1314.

[0054] Figure 14 The diagram shows a partially assembled state. Figure 13The example is a top perspective view of a direct impact cooling system 1300, where the heat sink 1302 is spaced apart from the rest of the assembly to show the underside of the sink 1302. Figure 14 As shown, the heat sink 1302 includes a housing 1402 and a nozzle plate 1404 attached to the housing 1402. The nozzle plate 1404 includes a first array 1406 of nozzles 1408 for directing a jet of coolant onto a first spool 1312. The nozzle plate 1404 further includes a second array 1410 of nozzles 1408 for directing a jet of coolant onto a second spool 1314. The nozzle arrays 1406 and 1410 may include any suitable number of nozzles of any suitable size and / or shape, and are arranged in any suitable manner. For example, in some examples, the nozzles are straight orifices with their nozzle outlets substantially equal to their nozzle inlets. In other examples, the nozzles are tapered nozzles with their nozzle outlets smaller than their nozzle inlets. Simulation tests have shown that the heat transfer coefficient induced by the jet impingement using a tapered nozzle is at least twice that achieved using a straight orifice. In some examples, the nozzle plate 1404 may be selectively removed from the housing 1402 (e.g., via threaded fasteners) and may be replaced by different nozzle plates 1404 with different nozzles (e.g., different sizes, shapes, numbers, and / or arrangements).

[0055] In some examples, the nozzle plate 1404 includes a lip 1412 surrounding the two cores 1312, 1314, and the lip 1412 is sized to align with and be pushed against the second gasket 1322. In some examples, such as Figure 14 As shown, the lip 1412 also extends between the dies 1312 and 1314 to engage with the corresponding portion of the second gasket 1322, thereby isolating the first die 1312 and the second die 1314 from each other.

[0056] As discussed above, direct impact cooling on bare dies provides efficient heat transfer for cooling IC packages faster than many other cooling methods that require heat transfer through one or more layers of TIM and / or other materials. Specifically, the direct impact of cold fluid onto the bare die causes forced convection directly on the die, resulting in faster response times, higher heat transfer coefficient (HTC), and a more uniform HTC gradient. Jet impact removes a large heat flux by directly impinging the surface of a hot target (e.g., IC package 1310). Both simulation and real-world testing show that adjusting the nozzle-to-silicon distance (e.g., vertical z-height) alters the flow field characteristics and affects heat transfer properties. More specifically, as the distance between the nozzle and the die increases, there is a decrease in velocity at which the impact hits the die surface. That is, when the distance between the nozzle and the die is small, the fluid jet from the nozzle will impact the die at a greater velocity, while as the distance increases, the fluid jet from the nozzle will impact the die at a lower velocity. This change in velocity at impact leads to a change in the heat transfer coefficient of the impacting fluid. Some examples disclosed in this article utilize this observation to implement temperature cycling testing processes for IC packages.

[0057] More specifically, in some examples, the nozzle plate 1404 is movable relative to the housing 1402, and thus movable relative to the IC package 1310, to adjust the distance between the nozzle plate 1404 and the IC package 1310. Adjusting this distance causes a change in the impingement jet velocity, which in turn causes a change in the heat transfer coefficient, thereby altering the resulting temperature of the IC package. Furthermore, this temperature change is achieved without requiring a change in the temperature or velocity (or corresponding pressure) of the coolant supplied to the nozzle inlet. In other words, the vertical displacement (e.g., z-height) or distance of the nozzle plate, combined with the inlet coolant temperature and inlet master velocity at the nozzle, can be effectively used as boundary conditions to test the IC package during temperature cycling testing. Further, simulation tests have shown that by adjusting these three boundary conditions (while all other conditions remain the same), a wide range of junction temperatures can be generated for the die generating heat at a fixed rate. Specifically, a simulated nozzle sprays hydrofluoroether (HFE) coolant at an inlet temperature varying from -70°C to 70°C, with a associated Reynolds number (indicating the nozzle inlet velocity) between 8000 and 20000. This causes a heat dissipation of 95W at the junction temperature of the semiconductor die, varying from -2°C to 120°C depending on the distance between the nozzle and the impact surface of the die. More specifically, a junction temperature of -2°C was achieved based on a -70°C HFE, a Reynolds number of 8000, and a nozzle distance (z-height) four times the nozzle outlet diameter. In contrast, a junction temperature of 120°C was achieved based on a 70°C HFE, a Reynolds number of 20000, and a nozzle distance (z-height) 16 times the nozzle outlet diameter. Thus, different target temperatures for testing purposes can be achieved by adjusting the nozzle distance (e.g., by moving the nozzle plate 1404).

[0058] Figure 15 The diagram shows that it can be used in the following ways. Figure 13 The example nozzle plate assembly 1500 is implemented in the example direct impact cooling system 1300. More specifically, the example nozzle plate assembly 1500 includes an example nozzle plate 1502, which can be used to implement... Figure 14The example nozzle plate 1404 is shown. Further, in this example, the nozzle plate assembly 1500 includes an actuator 1504 for moving the nozzle plate 1502 relative to an associated housing (e.g., housing 1402). In this example, the actuator 1504 is a power screw that can be driven (e.g., rotated) by a motor controlled by a microcontroller. In some examples, the nozzle plate assembly 1500 includes one or more guide rods 1506 that slide along corresponding bushings 1508 to guide the nozzle plate 1502 along a linear path substantially perpendicular to the surface of the nozzle plate, across which nozzles 1510 are distributed. Thus, when the actuator 1504 rotates, the nozzle plate 1502 will slide (e.g., rise or fall) along the guide rods 1506, thereby adjusting the nozzles 1510 relative to the underlying IC package (e.g., ...). Figure 13 The distance of the IC package 1310. Figure 15 In the illustrated example, a reinforcement 1512 is shown to indicate the relative position of the lower package. That is, in some examples, the substrate of the IC package includes a reinforcement 1512 on its outer surface facing the nozzle plate 1502. In some examples, the reinforcement 1512 is made of stainless steel. In some examples, the reinforcement 1512 is omitted.

[0059] Figure 16 This is a flowchart illustrating example methods for implementing an example system, which includes... Figures 1-15 Example integrated loading mechanisms 104, 500, 600, 700, 800, 900, 1000, 1100, 1200 and / or example cooling systems 1300. In some examples, Figure 16 Some or all of the operations outlined in the example methods are performed automatically by manufacturing equipment programmed to perform these operations. (Although the reference...) Figure 16 The flowchart shown illustrates an example method of fabrication, but many other methods can be used alternatively. For example, the execution order of the boxes can be changed, and / or some boxes in the described box can be combined, divided, rearranged, omitted, eliminated, and / or implemented in any other way. Furthermore, in some examples, additional processing operations can be performed before, between, and / or after any box in the illustrated example.

[0060] Figure 16The example method begins at block 1602 with the following operation: positioning an integrated circuit (IC) package (e.g., IC packages 108, 1310) onto a circuit board (e.g., circuit board 102, 1308). In some examples, this is achieved by inserting the IC package into a socket coupled to the circuit board. In other examples, the IC package is directly mounted to the circuit board using solder. At block 1604, the example method involves positioning one or more spacers (e.g., spacers 110, 1320, 1322) at the interface between the IC package and a heat sink (e.g., heat sinks 120, 702, 1302). In some examples, the spacers may be pre-attached to the IC package and / or to the heat sink.

[0061] At box 1606, the example method determines whether the heat sink includes a cold plate or a nozzle plate used for direct impact cooling. If the heat sink includes a cold plate (e.g., ...), the heat sink determines whether it includes a cold plate (e.g., ...). Figures 1-6 , Figure 9 and Figure 10 In the illustrated example, the method proceeds to box 1608, where a thermal interface material (e.g., thermal interface material 302) is deposited on at least one of the IC package or heat sink. Thereafter, the method proceeds to box 1610. Returning to box 1606, if the heat sink includes a nozzle plate (e.g., ... Figure 7 , Figure 8 and Figures 11-15 In the illustrated example, the method proceeds directly to box 1610. At box 1610, the example method involves applying a load (e.g., a loading force 502) to push the heatsink toward the IC package and to compress one or more pads.

[0062] At box 1612, the example method determines whether an external loading mechanism exists (such as...). Figures 9-12 (as illustrated in the example). If not present, the method proceeds to box 1616. If present, the method proceeds to box 1614, where a secondary load (e.g., compressive load 918) is applied to push the IC package toward the circuit board. Thereafter, the method proceeds to box 1616. At box 1616, the method involves providing coolant to a heat sink while the IC package is in operation.

[0063] At box 1618, the example method determines whether the heat sink includes a cold plate or a nozzle plate for direct impact cooling. This is the same determination made at box 1606 above. If the heat sink includes a cold plate, the method proceeds directly to box 1624. If the heat sink includes a nozzle plate, the method proceeds to box 1620 to determine whether the distance between the nozzle plate and the IC package needs to be adjusted. If adjustment is needed, the method proceeds to box 1622, where the nozzle plate is moved (as described above). Figures 13-15(As discussed). The method then proceeds to box 1624. If the method determines (at box 1620) that the nozzle plate should not be adjusted, the method proceeds directly to box 1624.

[0064] At box 1624, the method involves determining whether to continue the IC packaging operation. If yes, the method returns to box 161. Otherwise, Figure 16 The example method ends here.

[0065] "Including" and "comprising" (and all their forms and tenses) are used herein as open-ended terms. Therefore, whenever a claim uses any form of "including" or "comprising" (e.g., including, containing, including, having, etc.) as a preamble or in the content of any kind of claim, it should be understood that additional elements, terms, etc., may be present and not fall outside the scope of the corresponding claim or statement. As used herein, when the phrase "at least" is used as a transitional term, for example, in the preamble of a claim, it is open-ended in the same way that the terms "comprising" and "containing" are open-ended. The term "and / or," when used, for example, in forms such as A, B, and / or C, refers to any combination or subset of A, B, and C, such as (1) only A, (2) only B, (3) only C, (4) A and B, (5) A and C, (6) B and C, or (7) A and B and C. As used herein in the context of describing structures, components, items, objects, and / or things, the phrase “at least one of A and B” is intended to refer to an implementation that includes any one of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. Similarly, as used herein in the context of describing structures, components, items, objects, and / or things, the phrase “at least one of A and B” is intended to refer to an implementation that includes any one of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. As used herein in the context of describing the conduct or execution of processes, instructions, actions, activities, etc., the phrase “at least one of A and B” is intended to refer to an implementation that includes any one of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. Similarly, as used in this document in the context of describing the conduct or execution of processes, instructions, actions, activities, etc., the phrase “at least one of A or B” is intended to refer to an implementation that includes any of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B.

[0066] As used herein, singular references (e.g., “a”, “an”), “first”, “second”, etc.) do not exclude plurals. The term “a” (“a” or “an”) as used herein refers to one or more of those objects. The terms “a” (“a” or “an”), “one or more”, and “at least one” are used interchangeably herein. Furthermore, although listed separately, multiple means, elements, or actions may be implemented by, for example, the same entity or object. Additionally, although individual features may be included in different examples or claims, these features may be combined, and inclusion in different examples or claims does not imply that the combination of features is not feasible and / or not advantageous.

[0067] As used herein, unless otherwise stated, the term "above" describes the relationship between two components relative to the ground. The first component is above the second component if the second component has at least one portion situated between the ground and the first component. Similarly, as used herein, the first component is "below" the second component when the first component is closer to the ground than the second component. As stated above, the first component may be above or below the second component in one or more of the following situations: when there are other components between them, when there are no other components between them, when the first component and the second component are in contact, or when the first component and the second component are not in direct contact with each other.

[0068] Despite the foregoing, when referring to semiconductor devices (e.g., transistors), semiconductor dies containing semiconductor devices, and / or integrated circuit (IC) packages containing semiconductor dies during assembly or manufacturing, "above" is not a reference to the Earth, but rather to the underlying substrate on which the relevant components are mounted, assembled, installed, supported, or otherwise provided. Thus, as used herein and unless the context otherwise indicates or implies, when a first component (e.g., a transistor or other semiconductor device) within a semiconductor die is located further away from the substrate (e.g., a semiconductor wafer) on which both components are mounted or otherwise provided than a second component within the semiconductor die during assembly / manufacturing, the first component is "above" the second component. Similarly, unless the context otherwise indicates or implies, during assembly, when a first component (e.g., a semiconductor die) within an IC package is located further away from the printed circuit board (PCB) on which the IC package is to be mounted or attached, the first component is "above" the second component within the IC package. It should be understood that semiconductor devices are often used during assembly in orientations different from their original orientations. Therefore, when referring to semiconductor devices (e.g., transistors), semiconductor dies containing semiconductor devices, and / or integrated circuit (IC) packages containing semiconductor dies during use, the definition of “above” in the preceding paragraph (i.e., the term “above” describes the relationship between two components relative to the Earth) may be applied based on the context of use.

[0069] As used in this patent, it is stated that any component (e.g., layer, film, part, region, or plate) is in any way (e.g., positioned on, located on, disposed on, or formed on, etc.) another component indicating that the referenced component is in contact with that other component, or that the referenced component is above that other component and one or more intermediate components are positioned between the referenced component and the other component.

[0070] As used herein, unless otherwise indicated, a connection reference (e.g., attached, coupled, connected, and joined) may include intermediate components between the elements referenced by the connection reference and / or relative movement between those elements. Thus, a connection reference does not necessarily imply that two elements are directly connected and / or in a fixed relationship with each other. As used herein, the statement that any component is in “contact” with another component is defined to mean that there is no intermediate component between the two components.

[0071] Unless otherwise specified, descriptors such as “first,” “second,” “third,” etc., are used herein without imposing or otherwise indicating any meaning of priority, physical order, arrangement in a list, and / or any sorting, but merely as labels and / or arbitrary names to distinguish elements for ease of understanding of the disclosed examples. In some examples, the descriptor “first” may be used to refer to an element in a particular embodiment, while different descriptors such as “second” or “third” may be used in the claims to refer to the same element. In such instances, it should be understood that such descriptors are used only to distinguish those elements in the context of this discussion (e.g., in the claims), where elements might otherwise share the same name, for example.

[0072] As used herein, “approximately” and “about” modify their subject / value to identify the potential presence of variations that occur in real-world applications. For example, “approximately” and “about” may modify dimensions that may be imprecise due to manufacturing tolerances and / or other real-world defects as would be understood by one of ordinary skill in the art. For example, “approximately” and “about” may indicate that such dimensions are within a tolerance of + / - 10%, unless otherwise specified herein.

[0073] As used in this article, "substantially real-time" means that, recognizing real-world delays in computation time, transmission, etc., it occurs in a near-instantaneous manner. Therefore, unless otherwise specified, "substantially real-time" means real-time + / - 1 second.

[0074] As used herein, the phrase “to communicate” (including variations thereof) includes direct communication and / or indirect communication through one or more intermediate components, and does not require direct physical (e.g., wired) communication and / or continuous communication, but additionally includes selective communication performed at periodic intervals, predetermined intervals, non-periodic intervals, and / or one-off events.

[0075] As used herein, a “programmable circuit system” is defined as including (i) one or more dedicated electrical circuits (e.g., application-specific circuits, ASICs) configured to perform one or more specific operations and including one or more semiconductor-based logic devices (e.g., electrical hardware implemented by one or more transistors), and / or (ii) one or more semiconductor-based general-purpose electrical circuits programmable by instructions to perform one or more specific functions and / or one or more operations and including one or more semiconductor-based logic devices (e.g., electrical hardware implemented by one or more transistors). Examples of programmable circuit systems include: programmable microprocessors (such as central processing unit (CPU)) that can execute first instructions to perform one or more operations and / or functions; field programmable gate arrays (FPGAs) that can be programmed with second instructions to cause the configuration and / or construction of the FPGA to instantiate one or more operations and / or functions corresponding to the first instructions; graphics processing units (GPUs) that can execute first instructions to perform one or more operations and / or functions; digital signal processors (DSPs) that can execute first instructions to perform one or more operations and / or functions; XPUs; network processing units (NPUs); one or more microcontrollers that can execute first instructions to perform one or more operations and / or functions; and / or integrated circuits (such as application-specific integrated circuits (ASICs)). For example, an XPU can be implemented by a heterogeneous computing system that includes various types of programmable circuit systems (e.g., one or more FPGAs, one or more CPUs, one or more GPUs, one or more NPUs, one or more DSPs, etc., and / or any combination thereof) and orchestration techniques (e.g., one or more application programming interfaces (APIs)) that can assign one or more computing tasks to any of the various types of programmable circuit systems that are suitable for and can be used to perform one or more computing tasks.

[0076] As used herein, an integrated circuit / circuit system is defined as one or more semiconductor packages containing one or more circuit elements (such as transistors, capacitors, inductors, resistors, current paths, diodes, etc.). For example, an integrated circuit can be implemented as one or more of an ASIC, FPGA, chip, microchip, programmable circuit system, semiconductor substrate coupling multiple circuit elements, system on chip (SoC), etc.

[0077] As will be understood from the foregoing, example systems, apparatuses, articles of manufacture, and methods have been disclosed that improve heat dissipation generated by semiconductor dies in through-hole IC packages (e.g., LGA packages) by implementing capless packaging (e.g., bare die packages) while protecting the bare die from damage by distributing the load applied to the package between the bare die and the package substrate surrounding the die. In some examples, heat dissipation is improved by enabling a heat sink, used as a cold plate, to be directly thermally coupled to the bare die (e.g., via a single layer of TIM). In other examples, heat dissipation is improved by implementing a heat sink that supports one or more nozzles to spray a jet of coolant that directly impacts the surface of the bare die. In some examples, the bare die is protected from damage by including a gasket positioned near the die to be compressed between the heat sink and the package substrate, thereby absorbing some of the loading force applied by the heat sink. Further, in some direct impact cooling examples, the nozzle plate may be movable relative to the IC package to adjust the distance between the nozzle(s) and the die, thereby adjusting the impact velocity and the corresponding heat transfer coefficient of the impact fluid. In this way, for the purpose of temperature cycling testing, the temperature of the die can be controlled to the target temperature.

[0078] Further examples and combinations thereof include the following:

[0079] Example 1 includes an apparatus comprising: a socket for receiving an integrated circuit package; and a plate for applying a load to the integrated circuit package toward the socket, the plate including an internal channel for carrying a liquid coolant through the plate, the liquid coolant being used to facilitate cooling of the integrated circuit package.

[0080] Example 2 includes the apparatus of Example 1, and further includes a spacer that can be compressed between the plate and the substrate of the integrated circuit package.

[0081] Example 3 includes the apparatus of Example 2, wherein the gasket can be secured to the plate.

[0082] Example 4 includes the apparatus of Example 2, wherein the gasket is capable of being secured to the substrate of an integrated circuit package.

[0083] Example 5 includes an apparatus of any of Examples 2-4, wherein, when an integrated circuit package is mounted between a socket and a board, a gasket is formed to provide an hermetically tight seal around the semiconductor die of the integrated circuit package.

[0084] Example 6 includes an apparatus of any one of Examples 2-5, wherein the plate includes a concave surface and a convex lip, a spacer is capable of being positioned between the convex lip and the substrate of the integrated circuit package, and the concave surface is aligned with the semiconductor die of the integrated circuit package.

[0085] Example 7 includes the apparatus of Example 6, wherein a lip and a spacer together span a first distance from a concave surface to the substrate of an integrated circuit package, and the dimensions of the lip and the spacer are designed such that the first distance is greater than the thickness of the semiconductor die by a second distance, the second distance being used to allow the application of a thermal interface material between the semiconductor die and the concave surface.

[0086] Example 8 includes an apparatus of any of Examples 1-7, wherein the plate is a cold plate and the internal channel is a microchannel within the cold plate.

[0087] Example 9 includes the apparatus of any of Examples 1-7, and further includes a nozzle on the board, with an internal channel fluidly coupled to the nozzle, the nozzle being positioned to allow coolant to directly impact the integrated circuit package.

[0088] Example 10 includes the apparatus of Example 9, and further includes a support on the board for connection to a semiconductor die of an integrated circuit package.

[0089] Example 11 includes the apparatus of any one of Examples 9 or 10, wherein the plate includes a housing and a nozzle plate movable relative to the housing, and the nozzle is supported by the nozzle plate.

[0090] Example 12 includes the apparatus of Example 11, and further includes an actuator for moving a nozzle plate relative to the housing to adjust the distance between the nozzle and the integrated circuit package.

[0091] Example 13 includes an apparatus of any of Examples 1-12, wherein the integrated circuit package is a bare die package.

[0092] Example 14 includes an apparatus of any of Examples 1-13, wherein the integrated circuit package is a land grid array (LGA) package.

[0093] Example 15 includes an apparatus comprising: a load block removably coupled to an integrated circuit package, the load block being used to generate a load pressing against the integrated circuit package, the load block including a fluid channel for carrying liquid through which the liquid is used to facilitate cooling of the integrated circuit package; and a gasket for being compressed between the load block and the integrated circuit package.

[0094] Example 16 includes the apparatus of Example 15, wherein the load is a first load, and the apparatus further includes a first spring and a second spring, the first spring for generating a first load applied to the integrated circuit package by the load block, and the second spring for generating a second load applied to the integrated circuit package, the second load being applied to a location closer to the outer periphery of the integrated circuit package than the location where the first load is to be applied.

[0095] Example 17 includes the apparatus of Example 16, wherein the second load is greater than the first load.

[0096] Example 18 includes an apparatus of any of Examples 15-17, wherein the load block is used to begin compressing the pad by the first portion of the load before the load block begins to apply the second portion of the load to the semiconductor chip of the integrated circuit package.

[0097] Example 19 includes an apparatus comprising: a plate including at least one of: (i) a microchannel through which coolant is used to remove heat from the plate thermally coupled to the integrated circuit package; or (ii) a nozzle array for directly impinging coolant onto the integrated circuit package; and a spring for pushing the plate against the integrated circuit package.

[0098] Example 20 includes the apparatus of Example 19, further including a seal for compression between the plate and the substrate of the integrated circuit package, the seal being adjacent to a semiconductor chip on the substrate.

[0099] Example 21 includes a method comprising: applying a load to a board to push the board toward an integrated circuit package coupled to a printed circuit board, at least a portion of the load being used to push the integrated circuit package toward the printed circuit board; and providing a liquid coolant to the board for at least one of: (i) cooling the board through microchannels in the board, or (ii) being sprayed directly onto the integrated circuit package through nozzles on the board.

[0100] The appended claims are hereby incorporated herein by reference. While certain example systems, apparatuses, articles of manufacture, and methods have been disclosed herein, the scope of this patent is not limited thereto. Rather, this patent covers all systems, apparatuses, articles of manufacture, and methods that, fairly speaking, fall within the scope of the claims of this patent.

Claims

1. An apparatus comprising: a socket to receive an integrated circuit package; and a board to apply a load on the integrated circuit package toward the socket, the board including internal passages to carry a liquid coolant through the board, the liquid coolant to facilitate cooling of the integrated circuit package.

2. The apparatus of claim 1, further comprising a gasket compressible between the board and a substrate of the integrated circuit package. the gasket securable to the board.

3. The apparatus of claim 2, wherein, the gasket securable to the substrate of the integrated circuit package.

4. The apparatus of claim 2, wherein, the gasket formed to provide a hermetic seal around a semiconductor die of the integrated circuit package when the integrated circuit package is mounted between the socket and the board.

5. The apparatus of claim 2, wherein, the board including a concave surface and a convex lip, the gasket able to be between the convex lip and the substrate of the integrated circuit package, the concave surface aligned with a semiconductor die of the integrated circuit package.

6. The apparatus of claim 2, wherein, the convex lip and the gasket collectively spanning a first distance from the concave surface to the substrate of the integrated circuit package, the convex lip and the gasket sized where the first distance is greater than a thickness of the semiconductor die by a second distance to permit application of a thermal interface material between the semiconductor die and the concave surface.

7. The apparatus of claim 6, wherein, the board is a cold plate and the internal passages are microchannels within the cold plate.

8. The apparatus of any one of claims 1-7, wherein, 9. The apparatus of any of claims 1-7, further comprising a nozzle on the board, the internal passages fluidly coupled with the nozzle, the nozzle positioned to impinge the coolant directly on the integrated circuit package.

10. The apparatus of claim 9, further comprising a standoff on the board to interface with a semiconductor die of the integrated circuit package. the board including a housing and a nozzle plate movable relative to the housing, the nozzle supported by the nozzle plate.

11. The apparatus of claim 9, wherein, 12. The apparatus of claim 11, further comprising an actuator to move the nozzle plate relative to the housing to adjust a distance between the nozzle and the integrated circuit package. the integrated circuit package is a bare die package.

13. The apparatus of any one of claims 1-7, wherein, the integrated circuit package is a land grid array (LGA) package.

14. The apparatus of any one of claims 1-7, wherein, 15. An apparatus comprising: a load block removably coupleable to an integrated circuit package, the load block to generate a load against the integrated circuit package, the load block including fluid passages to carry a liquid therethrough, the liquid to facilitate cooling of the integrated circuit package; and a gasket to be compressed between the load block and the integrated circuit package. the load is a first load, the apparatus further comprising:

16. The apparatus of claim 15, wherein, a first spring to generate the first load applied by the load block to the integrated circuit package; and a second spring to generate a second load applied to the integrated circuit package, the second load to be applied to a location closer to an outer periphery of the integrated circuit package than a location to which the first load is to be applied. the second load is greater than the first load.

17. The apparatus of claim 16, wherein, ​ 18. The apparatus of any of claims 15-17, wherein, The load block is to compress the gasket by a first portion of the load before the load block begins to apply a second portion of the load to the semiconductor die of the integrated circuit package.

19. An apparatus comprising: a plate including at least one of (i) microchannels through which a coolant is to pass to draw heat away from a plate coupled to an integrated circuit package or (ii) a nozzle array to impinge the coolant directly onto the integrated circuit package; and a spring to urge the plate against the integrated circuit package.

20. The apparatus of claim 19, further comprising a seal to be compressed between the plate and a substrate of the integrated circuit package, the seal being adjacent to a semiconductor die on the substrate.

21. A method comprising: applying a load to a plate to urge the plate toward an integrated circuit package coupled to a printed circuit board, at least a portion of the load to urge the integrated circuit package toward the printed circuit board; and providing a liquid coolant to the plate, the liquid coolant to at least one of (i) pass through microchannels in the plate to cool the plate or (ii) be directly sprayed onto the integrated circuit package through nozzles on the plate. ​ ​

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