Low-temperature temperature sensor mounting device

Abstract

The invention discloses a low-temperature temperature sensor mounting device which comprises a temperature sensor, a device base, a heat sink column and a device shell. The temperature sensor and the heat sink column are fixedly installed on the device base, and the device shell is fixed to the device base and surrounds the temperature sensor and the heat sink column to form a protection structure for the temperature sensor. An electric signal lead of the temperature sensor is fixed to the heat sink column in any one mode of winding, gluing, clamping or magnetic force, and then is led out of the low-temperature temperature sensor installation device through a reserved gap formed by the device shell and the device base. And the temperature sensor is connected to a signal generating or processing device matched with the temperature sensor so as to read the temperature value of the measured piece. The temperature sensor has the remarkable advantages of being flexible in installation mode, adaptive to sensors of different specifications, high in temperature measurement accuracy, reliable in sensor protection and the like, and an efficient solution is provided for stable installation and accurate temperature measurement of the temperature sensor in the low-temperature environment.

Description

Technical Field

[0001] This invention relates to the field of temperature sensor installation, and more specifically to a low-temperature temperature sensor installation device. Background Technology

[0002] In the operation of low-temperature testing equipment such as Dewar and cryogenic thermostats, accurate monitoring of the temperature changes of the test piece during the entire process of cooling, testing, and heating is a key link to ensure the reliability of experimental data and the stability of equipment operation. As the core temperature measuring element, the installation method of the low-temperature temperature sensor directly affects the temperature measurement accuracy and service life.

[0003] To achieve high-precision measurement, current mainstream cryogenic temperature sensors typically employ an extremely lightweight design. This results in extremely thin leads, a fragile and delicate structure, and a small overall size, making them highly susceptible to damage from external forces during repeated assembly and disassembly. Furthermore, most measured components lack pre-designed mounting holes or interfaces. While adhesive bonding is the most widely used method, it has significant drawbacks: after repeated disassembly and reassembly, the connection between the sensor and the leads is prone to detachment and breakage, and the adhesive's bonding stability decreases at low temperatures, further exacerbating the risk of sensor damage. Given the high manufacturing cost of cryogenic temperature sensors, frequent replacements would result in significant economic losses.

[0004] Furthermore, the accuracy of temperature measurement in low-temperature environments is highly susceptible to external interference: on the one hand, thermal radiation from the environment directly affects the surface of the temperature sensor, causing the sensor's own temperature to deviate from the actual temperature of the measured object; on the other hand, the sensor's electrical signal leads, acting as a heat conduction carrier, will conduct heat from the external environment to the sensor body, causing additional temperature rise errors. Both types of interference will seriously affect the accuracy of temperature measurement, and existing installation methods lack targeted heat radiation and heat conduction isolation designs, thus failing to effectively solve this problem.

[0005] In summary, existing installation solutions for low-temperature temperature sensors suffer from the dual drawbacks of easy damage during disassembly and assembly, and susceptibility to environmental interference during temperature measurement. There is an urgent need for a dedicated installation device that can achieve non-destructive reinstallation while also possessing resistance to thermal interference. Summary of the Invention

[0006] The purpose of this invention is to provide a low-temperature temperature sensor installation device, thereby solving the problems of low-temperature temperature sensors in the prior art, such as easy damage from repeated disassembly and assembly, high replacement costs, and inaccurate temperature measurement due to susceptibility to external heat radiation and heat conduction.

[0007] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0008] A low-temperature temperature sensor installation device is provided, including a temperature sensor, a device base, a heat sink column, and a device housing; the temperature sensor and the heat sink column are respectively fixedly installed on the device base, and the device housing is fixed on the device base and surrounds the temperature sensor and the heat sink column to form a protection structure for the temperature sensor; the electrical signal lead of the temperature sensor is fixed to the heat sink column by any one of winding, gluing, clamping, or magnetism, and then led out of the low-temperature temperature sensor installation device through the reserved gap formed by the device housing and the device base, and connected to a signal generation or processing device supporting the temperature sensor to read the temperature value of the measured object.

[0009] Preferably, the temperature sensor and the heat sink column are fixed to the device base by any one of fixing screws, pasting, magnetic attraction, or clamping.

[0010] Preferably, when the temperature sensor is fixed to the device base by a fixing screw, the temperature sensor has a through hole for the fixing screw to pass through. The fixing screw passes through the temperature sensor and reaches the device base, and is screwed tightly with the threaded hole on the device base to fix the temperature sensor on the device base.

[0011] Preferably, when the heat sink column is fixed to the device base by a fixing screw, the heat sink column is of a hollow structure, nested outside the fixing screw and coaxially arranged with the fixing screw, and there is a gap between the heat sink column and the fixing screw. By screwing the fixing screw tightly with the threaded hole on the device base, the heat sink column is fixed on the device base.

[0012] Preferably, the number of turns of the electrical signal lead winding around the heat sink column is not less than 5 turns.

[0013] Preferably, the device housing and the device base form a relatively enclosed space, and only a gap for leading out the electrical signal lead of the temperature sensor is reserved.

[0014] Preferably, the device housing is fixed to the device base by any one of fixing screws, gluing, clamping, or magnetism, and the bottom of the side wall of the device housing abuts against the device base, and the movement is restricted by the base boss on the side.

[0015] Preferably, the device base is fixed and installed on the surface of the measured object by any one of fixing screws, gluing, clamping, or magnetism.

[0016] Preferably, the device base, the device housing, and the heat sink column are made of materials with high thermal conductivity, and the fixing screw is made of a material with a thermal conductivity lower than that of the device base, the device housing, and the heat sink column.

[0017] Preferably, the device base, device housing, and heat sink column are made of copper, silver, gold, or aluminum, and the fixing screws are made of brass.

[0018] According to the present invention, a low-temperature temperature sensor mounting device is provided, wherein the device base together with the device as a whole is fixed to the measured object by means of screw fixing, adhesive, clamping or magnetic force, etc., and the electrical signal lead of the temperature sensor is connected to the signal generation or processing device matched with the temperature sensor, thereby reading the temperature value of the measured object.

[0019] Compared to the existing technology that directly mounts the temperature sensor body, the contact surface between the device and the test piece in this invention is the device base, which does not directly contact the temperature sensor. During handling, installation, and disassembly, the temperature sensor and its electrical signal leads are protected by the device housing, the device base, and the heat sink. External forces such as tension, pressure, impact, and abrasion only act on the device housing, the device base, and the heat sink, and cannot affect the temperature sensor and its electrical signal leads, thus protecting the temperature sensor and its electrical signal leads and avoiding damage during repeated disassembly and assembly. At the same time, the device housing can absorb external heat radiation and form a heat transfer path, conducting the heat from external heat radiation to the low-temperature test piece, reducing the temperature rise caused by the temperature sensor and making the temperature measurement more accurate. The heat sink acts as a heat sink for the electrical signal leads of the temperature sensor, forming a heat conduction path, directly conducting the heat introduced by external heat conduction on the electrical signal leads to the device base, and then to the low-temperature test piece, similarly reducing the temperature rise caused by the temperature sensor and improving the accuracy of temperature measurement.

[0020] The temperature sensor measures the temperature of the low-temperature test object through heat conduction from the device base. The main materials of the device base, device shell and heat sink column can be materials with high thermal conductivity such as copper, silver, gold and aluminum. Copper is used in actual design. In actual application, thermal conductivity, cost and the desired effect need to be comprehensively considered. Brass is used for fixing screws.

[0021] The main inventive point of this invention lies in achieving a sensor installation with multiple functionalities within a compact space: the device housing not only protects the sensor and cables but also conducts external radiant heat to the measured object through its own cooling effect, improving measurement accuracy and preventing sensor damage caused by external impacts; simultaneously, the coaxial connection of the fixing screw and heat sink reduces the overall size of the device, making it adaptable to installation on various confined spaces, and also isolates the sensor from external heat conduction through the cables, further improving the accuracy of temperature measurement. Furthermore, according to a preferred embodiment of the invention, the fixing screw is made of brass, while the device base, device housing, and heat sink are made of copper. Since brass has a higher coefficient of thermal expansion than copper, the fixing screw experiences greater contraction relative to the temperature sensor and device housing at low temperatures. Cooling further tightens the connection, preventing loosening and resulting in a superior connection effect. Utilizing the difference in thermal expansion coefficients between brass and copper makes the connection structure more stable in low-temperature environments.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0023] 1) It has a protective function for low-temperature temperature sensors, protecting them from external forces during repeated disassembly and assembly, and preventing damage caused by tension, pressure, collision, wear, etc.

[0024] 2) It has the function of isolating external heat radiation and heat sinking the electrical signal leads of the temperature sensor, reducing the temperature rise caused by the temperature sensor and making the temperature measurement more accurate.

[0025] 3) It is applicable to temperature sensors of different shapes and sizes within a certain range, and only minor modifications to the device dimensions are needed to achieve adaptation.

[0026] In summary, the low-temperature sensor installation device provided by this invention enables non-destructive and repeated installation and use of the low-temperature sensor, avoids damage during installation, protects the temperature sensor and cable body from the impact of disassembly and assembly, and adds a local cold shield and cable heat sink structure. This eliminates the need for additional heat radiation protection cold shields and cable heat sinks, reducing the impact of external heat radiation and heat conduction on inaccurate temperature measurement. It has significant advantages such as flexible installation, compatibility with different sensor specifications, high temperature measurement accuracy, reliable sensor protection, and no need for additional heat protection structures, providing an efficient solution for stable installation and accurate temperature measurement of temperature sensors in low-temperature environments. Attached Figure Description

[0027] Figure 1 This is a perspective view of a low-temperature temperature sensor mounting device according to a preferred embodiment of the present invention;

[0028] Figure 2 Is it like this? Figure 1 Side view of the device shown;

[0029] Figure 3 It is along Figure 2 A sectional view derived from section AA;

[0030] Figure 4 For example Figure 1 Top view of the device shown;

[0031] Figure 5 For example Figure 1 A three-dimensional view of the device shown from another perspective. Detailed Implementation

[0032] The present invention will be further described below with reference to specific embodiments. It should be understood that the following embodiments are for illustrative purposes only and are not intended to limit the scope of the invention. Unless otherwise specified, the techniques used in the embodiments are conventional practices in the art, or experimental methods recommended by the instrument manufacturer. Unless otherwise specified, the reagents and materials used in the embodiments are commercially available.

[0033] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0035] like Figure 1 The image shows a low-temperature temperature sensor mounting device according to a preferred embodiment of the present invention, comprising a temperature sensor 1, a device base 2, a first fixing screw 3, a device housing 4, a heat sink 5, and a second fixing screw 6.

[0036] Combination Figures 1-3As shown, the device base 2 has a rectangular block structure with protrusions on the sides; the device housing 4 is a hollow rectangular cover, forming a frame-type protective cover structure that can be fastened to the top of the device base 2. Its side walls adapt to the base contour and engage with the protrusions for positioning. The device housing 4 and the device base 2 form a relatively enclosed space, creating a protective structure for the temperature sensor, with only a gap reserved for the electrical signal leads of the temperature sensor. Preferably, the device housing 4 is fixed to the device base 2 by any one of the following methods: fixing screws, adhesive, clamping, or magnetic force.

[0037] Combination Figure 4 , Figure 5 As shown, the temperature sensor 1 is placed in the receiving cavity of the device base 2. The temperature sensor 1 is fixed to the device base 2 by passing through the first fixing screw 3 and screwing it into the threaded hole of the device base 2.

[0038] like Figure 3 As shown, the heat sink 5 is a hollow structure, nested outside the second fixing screw 6 and coaxially arranged. The second fixing screw 6 is screwed into the threaded hole of the device base 2, fixing the heat sink 5 to the device base 2. According to this preferred embodiment, the outer diameter of the heat sink 5 is 6mm and the wall thickness is 1mm.

[0039] The electrical signal lead of temperature sensor 1 is fixed to heat sink column 5 by any of the following methods: winding, gluing, clamping or magnetic force. Then, it is led out of the low temperature sensor installation device through the reserved gap formed by the device housing 4 and the device base 2, and connected to the signal generation or processing device matched with the temperature sensor to read the temperature value of the measured object.

[0040] Preferably, the number of turns of the electrical signal lead wound around the heat sink 5 is not less than 5 turns.

[0041] It should be understood that, in addition to the above screw fixing method, the temperature sensor 1 and the heat sink 5 can also be fixed to the device base 2 by any of the following methods: adhesive, magnetic attraction or clamping.

[0042] According to a preferred embodiment of the present invention, the bottom of the device base 2 is a flat structure, which can be installed onto the surface of the test piece by adhesive.

[0043] According to another preferred embodiment of the present invention, the device base 2 has a clamp that can be used to clamp the device onto the surface of the workpiece.

[0044] According to another preferred embodiment of the present invention, the device base 2 has a magnet and can be installed onto the surface of the test piece by magnetic force.

[0045] According to another preferred embodiment of the present invention, the device base 2 has a through hole or a screw hole, which can be installed onto the surface of the test piece by means of a threaded connection.

[0046] The device base 2, device housing 4 and heat sink 5 are made of materials with high thermal conductivity, while the first fixing screw 3 and the second fixing screw 6 are made of materials with relatively low thermal conductivity.

[0047] According to a preferred embodiment of the present invention, the device base 2, device housing 4, and heat sink 5 are made of copper, silver, gold, or aluminum, and the first fixing screw 3 and the second fixing screw 6 are made of brass. Since brass has a greater coefficient of thermal expansion than copper, when the ambient temperature decreases, the brass screws, with their larger coefficient of thermal expansion, will shrink more significantly than the copper device base 2, device housing 4, and heat sink 5. This results in a tighter fit between the screws and the connected components, making the connection structure more secure and less prone to loosening in low-temperature environments.

[0048] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the invention. Various variations can be made to the above embodiments of the present invention. All simple and equivalent changes and modifications made in accordance with the claims and description of this application fall within the protection scope of the claims of this patent. All aspects not described in detail in this invention are conventional technical content.

Claims

1. A low-temperature temperature sensor mounting device, characterized in that, It includes a temperature sensor, a device base, a heat sink column and a device housing; the temperature sensor and the heat sink column are respectively fixedly installed on the device base, and the device housing is fixedly installed on the device base and surrounds the temperature sensor and the heat sink column, forming a protective structure for the temperature sensor; the electrical signal lead of the temperature sensor is fixed to the heat sink column by any one of winding, gluing, clamping or magnetism, and then led out of the low-temperature temperature sensor installation device through the reserved gap formed by the device housing and the device base, and connected to the signal generation or processing device supporting the temperature sensor to read the temperature value of the measured object.

2. The low-temperature temperature sensor mounting device according to claim 1, characterized in that, The temperature sensor and the heat sink column are fixed on the device base by any one of fixing screws, pasting, magnetic attraction or clamping.

3. The low-temperature temperature sensor mounting device according to claim 2, characterized in that, When the temperature sensor is fixed on the device base by fixing screws, the temperature sensor has through holes for the fixing screws to pass through. The fixing screws pass through the temperature sensor and reach the device base, and are screwed tightly with the threaded holes on the device base to realize the fixation of the temperature sensor on the device base.

4. The low-temperature temperature sensor mounting device according to claim 2, characterized in that, When the heat sink column is fixed on the device base by fixing screws, the heat sink column is of a hollow structure, nested outside the fixing screws and coaxially arranged with the fixing screws, and there is a gap between the heat sink column and the fixing screws, and the heat sink column is fixed on the device base by screwing the fixing screws with the threaded holes on the device base.

5. The low-temperature temperature sensor mounting device according to claim 1, characterized in that, The number of turns of the electrical signal lead winding around the heat sink column is not less than 5 turns.

6. The low-temperature temperature sensor mounting device according to claim 1, characterized in that, The device housing and the device base form a relatively enclosed space, and only a gap for leading out the electrical signal lead of the temperature sensor is reserved.

7. The low-temperature temperature sensor mounting device according to claim 1, characterized in that, The device housing is fixed on the device base by any one of fixing screws, gluing, clamping or magnetism, and the bottom of the side wall of the device housing abuts against the device base, and the movement is restricted by the boss on the base on the side.

8. The low-temperature temperature sensor mounting device according to claim 1, characterized in that, The device base is fixedly installed on the surface of the measured object by any one of fixing screws, gluing, clamping or magnetism.

9. The low-temperature temperature sensor mounting device according to claim 1, characterized in that, The device base, the device housing and the heat sink column are made of materials with high thermal conductivity, and the fixing screws are made of materials with a thermal conductivity lower than that of the device base, the device housing and the heat sink column.

10. The low-temperature temperature sensor mounting device according to claim 9, characterized in that, The device base, the device housing and the heat sink column are made of copper, silver, gold or aluminum, and the fixing screws are made of brass materials.

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