Method and device for positioning fault area and nonvolatile storage medium

Abstract

The invention discloses a method and device for positioning a fault area and a nonvolatile storage medium. The method comprises the following steps: receiving a grid file, and determining a complete solution area of an antenna array to be subjected to fault positioning according to the grid file; dividing the complete solving region into a plurality of sub solving regions under the constraint of a preset electromagnetic thermal continuity condition; solving the plurality of electromagnetic field control equations in parallel to obtain a plurality of first solving results, and solving the plurality of heat conduction equations in parallel according to the plurality of first solving results to obtain a plurality of second solving results; determining an overall electromagnetic performance parameter and a temperature distribution cloud picture of the antenna array according to the plurality of first solving results and the plurality of second solving results; and positioning a fault area according to the overall electromagnetic performance parameters and the temperature distribution cloud picture. The technical problem of low accuracy of the analysis result caused by neglecting the influence generated by the temperature in the scheme of carrying out fault analysis on the antenna array in the related technology is solved.

Description

Technical Field

[0001] This application relates to the field of data processing technology, and more specifically, to a method and apparatus for locating fault areas, and a non-volatile storage medium. Background Technology

[0002] In related technologies, antenna analysis often focuses on optimizing electromagnetic characteristics, but seriously neglects the series of faults caused by the conversion of electromagnetic loss into thermal effects. When a large-scale antenna is in a high-power operating state, the antenna structure temperature will continue to rise, which will induce direct faults such as material dielectric constant shift, structural deformation, and solder joint detachment. These faults will not only destroy the original electromagnetic performance parameters of the antenna, but also lead to functional failures such as signal transmission interruption and beam pointing deviation, which will seriously affect the stable operation of the entire communication system. Therefore, there is a problem of inaccurate analysis results of thermal effect faults of antenna arrays.

[0003] There is currently no effective solution to the above problems. Summary of the Invention

[0004] This application provides a method and apparatus for locating fault areas, as well as a non-volatile storage medium, to at least solve the technical problem of low accuracy of analysis results caused by neglecting the influence of temperature in related technologies for fault analysis of antenna arrays.

[0005] According to one aspect of the embodiments of this application, a method for locating a fault region is provided, comprising: receiving a mesh file and determining a complete solution region of an antenna array to be fault located based on the mesh file, wherein the mesh file is used to record relevant information of the antenna array to be fault located, and the complete solution region includes: the space occupied by the antenna array, and the space within the radiation and thermal effect range of the antenna array; dividing the complete solution region into multiple sub-solution regions under the constraint of a preset electromagnetic thermal continuity condition, wherein adjacent sub-solution regions follow the preset electromagnetic thermal continuity condition; solving multiple electromagnetic field control equations in parallel to obtain multiple first solution results, and solving multiple heat conduction equations in parallel based on the multiple first solution results to obtain multiple second solution results, wherein each first solution result is used to indicate the electromagnetic loss power density distribution of each sub-solution region, and each second solution result is used to indicate the temperature distribution of each sub-solution region; determining the overall electromagnetic performance parameters and temperature distribution cloud map of the antenna array based on the multiple first solution results and the multiple second solution results, wherein the temperature distribution cloud map is used to display the temperature parameters of the antenna array; and locating the fault region based on the overall electromagnetic performance parameters and the temperature distribution cloud map.

[0006] Optionally, a preset electromagnetic-thermal continuity condition is used to restrict the electromagnetic field tangential continuity and heat flux density continuity of adjacent sub-solution regions. Under the constraint of the preset electromagnetic-thermal continuity condition, the complete solution region is divided into multiple sub-solution regions, including: obtaining the material property parameters of the antenna array, wherein the material property parameters are recorded in the mesh file, and the material property parameters include at least: dielectric constant and thermal conductivity; determining the partition boundary according to the distribution of the material property parameters in the complete solution region, and dividing the complete solution region at the partition boundary to obtain multiple sub-solution regions.

[0007] Optionally, determining the partition boundary based on the distribution of material property parameters in the complete solution region includes: determining the electromagnetic properties of each antenna element in the complete solution region based on the dielectric constant distributed in each antenna element within the complete solution region, and determining the thermal conductivity properties of each antenna element in the complete solution region based on the thermal conductivity distributed in each antenna element within the complete solution region, wherein the region corresponding to the antenna element includes: the space occupied by a single antenna and the space within the radiation and thermal effect range of a single antenna element; determining a first difference between two dielectric constants distributed in two adjacent antenna elements, and determining a second difference between two thermal conductivitys distributed in two adjacent antenna elements; determining a target first difference greater than a first preset value among multiple first differences, and determining the intersection position of two adjacent antenna elements corresponding to the target first difference as the partition boundary, wherein the first preset value is used to quantify the maximum degree of change in electromagnetic properties; and determining a target second difference greater than a second preset value among multiple second differences, and determining the intersection position of two adjacent antenna elements corresponding to the target second difference as the partition boundary, wherein the second preset value is used to quantify the maximum degree of change in thermal conductivity properties.

[0008] Optionally, multiple electromagnetic field control equations are solved in parallel, including: creating a first type of thread block corresponding to each sub-solution region, wherein the first type of thread block is used to execute the solution task of the electromagnetic field control equations, and each first type of thread block contains multiple threads; loading the mesh data of each sub-solution region into the shared memory of multiple first type of thread blocks, wherein the mesh data is recorded in a mesh file, and the mesh data is used to assist in solving the electromagnetic field control equations, and the mesh data includes at least: the spatial coordinates of the sub-solution region in the complete solution region, the size parameters of the sub-solution region, and the material property parameters distributed in the sub-solution region; and synchronously triggering multiple threads in each first type of thread block to execute the solution task of the electromagnetic field control equations.

[0009] Optionally, multiple heat conduction equations are solved in parallel based on multiple first solution results, including: for each heat conduction equation, determining a target first solution result for the same sub-solution region corresponding to the heat conduction equation, wherein the target first solution result is used to replace the heat source term in the heat conduction equation, and the heat source term is used to describe the heating power per unit volume; creating a second type of thread block corresponding to each sub-solution region, wherein the second type of thread block is used to execute the solution task of the heat conduction equation, and each second type of thread block contains multiple threads; loading the mesh data and target first solution result of each sub-solution region into the shared memory of multiple second type of thread blocks, wherein the mesh data is recorded in a mesh file, and the mesh data is used to assist in solving the heat conduction equation, and the mesh data includes at least: the spatial coordinates of the sub-solution region in the complete solution region, the size parameters of the sub-solution region, and the material property parameters distributed in the sub-solution region; and synchronously triggering multiple threads to execute the solution task of the heat conduction equation in each second type of thread block.

[0010] Optionally, the first solution result is represented in matrix form, and the matrix corresponding to the first solution result contains elements including: electric field components and magnetic field components; determining the overall electromagnetic performance parameters of the antenna array based on multiple first solution results and multiple second solution results includes: determining the overall electromagnetic performance parameters of the antenna array based on multiple first solution results includes: for each first solution result, determining the first splicing order of the first solution result according to the spatial position of the sub-solution region corresponding to the first solution result; splicing multiple first solution results according to the first splicing order to obtain a first target matrix used to describe the global electromagnetic loss power density distribution of the antenna array; and determining the overall electromagnetic performance parameters based on the first target matrix.

[0011] Optionally, the second solution result is represented in matrix form, and the elements contained in the matrix corresponding to the second solution result include: temperature value; determining the overall electromagnetic performance parameters of the antenna array based on multiple first solution results and multiple second solution results includes: determining the temperature distribution cloud map of the antenna array based on multiple second solution results, including: for each second solution result, determining the second splicing order of the second solution result based on the spatial location of the sub-solution region corresponding to the second solution result; splicing multiple second solution results according to the second splicing order to obtain a second target matrix for describing the temperature distribution of the antenna array; visualizing the second target matrix as a temperature distribution cloud map, wherein the temperature parameters displayed in the temperature distribution cloud map include at least: the temperature value at each location of the antenna array, the temperature gradient of the antenna array, and the temperature gradient is the rate of change of the temperature value with spatial location.

[0012] Optionally, locating the fault area based on the overall electromagnetic performance parameters and temperature distribution cloud map includes: locating hotspot areas in the temperature distribution cloud map, wherein the hotspot area is an area with a temperature value greater than a preset temperature threshold; determining the target element corresponding to the hotspot area in the matrix representing the overall electromagnetic performance parameters based on the spatial location of the hotspot area, wherein the spatial location is used to determine the position of the target element in the matrix representing the overall electromagnetic performance parameters; determining the electromagnetic performance change trend of the hotspot area based on the electromagnetic performance parameters of the hotspot area recorded in the target element; and determining the hotspot area as a fault area if the electromagnetic performance change trend deviates from the reference change trend, wherein the reference change trend is determined based on the historical electromagnetic performance parameters generated when the antenna array operates without faults.

[0013] According to another aspect of the embodiments of this application, an apparatus for locating a fault region is also provided, comprising: a receiving module, configured to receive a mesh file and determine, based on the mesh file, a complete solution region of an antenna array to be fault located, wherein the mesh file is used to record relevant information of the antenna array to be fault located, and the complete solution region includes: the space occupied by the antenna array, and the space within the radiation and thermal effect range of the antenna array; a cutting module, configured to divide the complete solution region into multiple sub-solution regions under the constraint of a preset electromagnetic thermal continuity condition, wherein adjacent sub-solution regions follow the preset electromagnetic thermal continuity condition; and an execution module, configured to execute multiple sub-solution regions in parallel. The magnetic field control equations are solved to obtain multiple first solution results. Based on these first solution results, multiple heat conduction equations are solved in parallel to obtain multiple second solution results. Each first solution result indicates the electromagnetic loss power density distribution in each sub-solution region, and each second solution result indicates the temperature distribution in each sub-solution region. A first determination module is used to determine the overall electromagnetic performance parameters and temperature distribution cloud map of the antenna array based on the multiple first and second solution results. The temperature distribution cloud map is used to display the temperature parameters of the antenna array. A second determination module is used to locate the fault area based on the overall electromagnetic performance parameters and the temperature distribution cloud map.

[0014] According to another aspect of the embodiments of this application, a non-volatile storage medium is also provided, wherein a computer program is stored in the non-volatile storage medium, and the above-mentioned method for locating fault areas is executed by running the computer program in the device where the non-volatile storage medium is located.

[0015] According to another aspect of the embodiments of this application, an electronic device is also provided, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to execute the above-described method for locating fault areas through the computer program.

[0016] According to another aspect of the embodiments of this application, a computer program product is also provided, including computer instructions that, when executed by a processor, implement the steps of the above-described method for locating fault areas.

[0017] In this embodiment, a receiving mesh file is used, and the complete solution region of the antenna array to be fault located is determined based on the mesh file. The mesh file records relevant information about the antenna array to be fault located. The complete solution region includes the space occupied by the antenna array and the space within the radiation and thermal effect range of the antenna array. Under the constraint of a preset electromagnetic-thermal continuity condition, the complete solution region is divided into multiple sub-solution regions, where adjacent sub-solution regions follow the preset electromagnetic-thermal continuity condition. Multiple electromagnetic field control equations are solved in parallel to obtain multiple first solution results. Based on the multiple first solution results, multiple heat conduction equations are solved in parallel to obtain multiple second solution results. Each first solution result indicates the electromagnetic loss power density distribution of each sub-solution region, and each second solution result indicates the temperature distribution of each sub-solution region. The first solution and multiple second solutions determine the overall electromagnetic performance parameters and temperature distribution cloud map of the antenna array. The temperature distribution cloud map is used to display the temperature parameters of the antenna array. By locating the fault area based on the overall electromagnetic performance parameters and temperature distribution cloud map, and by simultaneously considering the thermal effects of electromagnetic and temperature parameters during the analysis process, the accuracy of the analysis results is improved. A parallel execution task computing framework is introduced to accelerate the electromagnetic and thermal field solution process, improving the efficiency of fault analysis. Under the premise of ensuring analysis accuracy, the coordinated and rapid analysis of antenna radiation characteristics and temperature distribution is achieved. This achieves the technical effect of improving the accuracy of antenna array analysis results, thereby improving the fault prevention and control capabilities of large-scale antenna arrays. It also solves the technical problem of low accuracy of analysis results caused by neglecting the influence of temperature in related technologies for antenna array fault analysis. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0019] Figure 1 This is a hardware structure block diagram of a computer terminal for implementing a method for locating fault areas according to an embodiment of this application;

[0020] Figure 2 This is a flowchart of the steps of a method for locating a fault area according to an embodiment of this application;

[0021] Figure 3This is a schematic diagram of the solution domain for a large-scale antenna array according to an embodiment of this application;

[0022] Figure 4 This is a schematic diagram of a temperature distribution cloud map according to an embodiment of this application;

[0023] Figure 5 This is a structural diagram of a device for locating fault areas according to an embodiment of this application;

[0024] Figure 6 This is a flowchart of a device for locating fault areas according to an embodiment of this application. Detailed Implementation

[0025] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0026] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0027] To better understand the embodiments of this application, the technical terms involved in the embodiments of this application are explained below:

[0028] Electromagnetic-Thermal Multi-Physics Coupling: By establishing a correlation model between electromagnetic loss and heat conduction, the loss obtained from electromagnetic calculations is used as a heat source input for thermal analysis, realizing the synergistic solution of electromagnetic characteristics and temperature field distribution, reflecting the thermal behavior and performance impact of the structure under electromagnetic influence.

[0029] The Central Processing Unit (CPU) Message Passing Interface (MPI) multi-process framework: This framework enables parallel processing based on message passing and is suitable for multi-node or multi-CPU environments with distributed memory architectures. In parallel computing, each process runs on an independent CPU.

[0030] The core of a graphics processing unit (GPU) is the processing unit inside the GPU, including the basic unit on the GPU that performs parallel computing tasks (CUDA). Each unit that performs parallel computing tasks can be understood as a small processor that can execute instructions independently.

[0031] Resonant cavity: A structure in an antenna array used to amplify electromagnetic waves of a specific frequency.

[0032] Gradient slot lines: Antenna structure design used to improve the high-frequency radiation performance of antennas; one or a series of slot lines are introduced into the radiating part of the antenna, and the width or depth of the slot lines gradually changes with different positions, usually presenting a continuous gradient along the length of the antenna.

[0033] Resonant cavity: A part of an antenna element. Each antenna element may contain a cavity. Its geometry (such as volume, diameter, and height), material properties (dielectric constant, loss factor), and interaction with surrounding structures (such as tapered grooves and ground planes) will affect the antenna's resonant frequency and impedance matching, thereby affecting the overall performance of the array.

[0034] Thread: The smallest unit of execution flow in a computer program.

[0035] In related technologies, electromagnetic and thermal characteristic analyses are typically performed independently without considering their mutual influence, lacking a collaborative solution mechanism for these two analyses. Electromagnetic characteristic analysis primarily relies on the Finite Element Method (FEM). However, when analyzing the electromagnetic characteristics of large-scale antennas, the FEM suffers from a dramatic increase in the number of unknowns after discretizing the solution domain. Limited by computer memory and computing power, this often results in slow or even unsolvable problems. Domain decomposition methods reduce the solution scale of a single domain through subdomain partitioning, but when used alone, they struggle to directly achieve coupled electromagnetic-thermal characteristic analysis. Furthermore, parallel implementations of electromagnetic-thermal coupled analysis are often based on a multi-process framework using the Message Passing Interface (MPI) of the Central Processing Unit (CPU). Limited by the number of CPU cores and computational efficiency, this framework cannot meet the real-time electromagnetic-thermal collaborative analysis requirements of large-scale antenna arrays in high-power scenarios. Therefore, fault analysis of large-scale antenna arrays suffers from slow speed and low accuracy. To address this issue, this application provides relevant solutions, detailed below.

[0036] According to an embodiment of this application, a method embodiment for locating a fault area is provided. It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions. Furthermore, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than that shown here.

[0037] The methods and embodiments provided in this application can be executed on mobile terminals, computer terminals, or similar computing devices. Figure 1 A hardware block diagram of a computer terminal for implementing a method for locating fault areas is shown. Figure 1 As shown, the computer terminal 10 may include one or more processors 102 (shown as 102a, 102b, ..., 102n in the figure) 102 (processor 102 may include, but is not limited to, a microprocessor MCU or a programmable logic device FPGA, etc.), a memory 104 for storing data, and a transmission device 106 for communication functions. In addition, it may also include: a display, an input / output interface (I / O interface), a universal serial bus (USB) port (which may be included as one of the ports of a BUS bus), a network interface, a power supply, and / or a camera. Those skilled in the art will understand that... Figure 1 The structure shown is for illustrative purposes only and does not limit the structure of the aforementioned electronic device. For example, computer terminal 10 may also include... Figure 1 The more or fewer components shown, or having the same Figure 1 The different configurations shown.

[0038] It should be noted that the aforementioned one or more processors 102 and / or other data processing circuits are generally referred to herein as "data processing circuits". These data processing circuits may be embodied, in whole or in part, in software, hardware, firmware, or any other combination thereof. Furthermore, the data processing circuits may be a single, independent processing module, or may be integrated, in whole or in part, into any other element within the computer terminal 10. As involved in the embodiments of this application, the data processing circuits serve as processor control (e.g., selection of a variable resistor termination path connected to an interface).

[0039] The memory 104 can be used to store software programs and modules of application software, such as the program instructions / data storage device corresponding to the method for locating fault areas in this embodiment. The processor 102 executes various functional applications and data processing by running the software programs and modules stored in the memory 104, thereby realizing the above-mentioned method for locating fault areas. The memory 104 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include memory remotely located relative to the processor 102, and these remote memories can be connected to the computer terminal 10 via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0040] The transmission device 106 is used to receive or send data via a network. Specific examples of the network described above may include a wireless network provided by the communication provider of the computer terminal 10. In one example, the transmission device 106 includes a Network Interface Controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, the transmission device 106 may be a Radio Frequency (RF) module, used for wireless communication with the Internet.

[0041] The display can be, for example, a touchscreen liquid crystal display (LCD) that allows the user to interact with the user interface of the computer terminal 10.

[0042] This application provides a method for locating fault areas that can operate under the above-described operating environment. Figure 2 This is a flowchart of the method for locating fault areas according to embodiments of this application, as shown below. Figure 2 As shown, the method includes the following steps:

[0043] Step S202: Receive the mesh file and determine the complete solution area of ​​the antenna array to be fault located based on the mesh file. The mesh file is used to record relevant information of the antenna array to be fault located. The complete solution area includes: the space occupied by the antenna array, and the space within the radiation and thermal effect range of the antenna array.

[0044] The method proposed in this embodiment is applied to the simulation processing of antenna arrays. Fault area location is performed based on the simulation file of the antenna array. In step S202, the simulation file (i.e., mesh file) of the antenna array to be fault located is received. The simulation file (i.e., mesh file) is output after completing the three-dimensional modeling of the antenna array. The mesh file records the following relevant information about the antenna array: the material properties of the antenna array, the geometric structure of the antenna array, and layout information. The layout information includes: the size of each mesh (length, width, height, etc.), the spatial area occupied by the antenna array, and the space within the radiation and thermal effect range of the antenna array (referring to the entire area within the antenna radiation and thermal effect range). The spatial area occupied by the antenna array and the space within the radiation and thermal effect range of the antenna array (referring to the entire area within the antenna radiation and thermal effect range) together constitute the complete solution area to be processed and analyzed when performing fault analysis (including fault area location). Figure 3 This is a schematic diagram of the solution domain for a large-scale antenna array. For example, the antenna array to be analyzed for faults is a 3D antenna array. For a 3-bit horn antenna array (Vivaldi antenna array), after modeling the antenna array and performing fine mesh generation, the result is as follows: Figure 3 The modeling results shown are as follows: Figure 3 As shown, the generated mesh file can contain the following information: Size of the mesh cell (i.e., each mesh): (with the x-axis pointing in the direction of length, the length of the mesh cell) The width is 34 millimeters (mm), (with the y-axis pointing in the direction of the width, the width of the grid cell is...) The diameter of the substrate is 36 mm, and the height of the dielectric substrate (d1) is 1.27 mm (the dielectric substrate is a component in the antenna array used to support and isolate other components). The functional expression for the gradient groove line is... The gradient slot line is an exponential function of z, where z is the position coordinate of a specific point in the antenna array structure along the antenna height direction. The maximum opening size (W) of the gradient slot line is approximately 30.046 mm, and the minimum opening size (s) is approximately 0.5 mm. The resonant cavity diameter (R) is 5.0 mm. The vertical height (d) of the resonant cavity center from the upper surface of the ground plane is 4 mm, and the ground plane thickness (d2) is 0.5 mm. The resonant cavity center coordinates coincide with the center of the upper surface of the ground plane. Coaxial feeding is used. The distance (s1) from the center of the coaxial line to the center of the circle is 0.625 mm, the inner core radius of the coaxial line is 0.375 mm, the outer core radius of the coaxial line is 0.875 mm, and the height (h2) of the coaxial line is 5 mm. Based on the above information recorded in the mesh file, the complete solution region of the antenna array can be determined. For example, it can be determined according to... and The physical boundaries of the antenna array are determined, thereby determining the space occupied by the antenna array; the heat conduction path of the antenna array can be determined based on the dielectric substrate height (d1), ground plane thickness (d2), resonant cavity diameter (R), and the vertical height (d) of the resonant cavity center from the upper surface of the ground plane, thereby determining the entire space covered by the thermal effect range; the radiation range of the antenna array can be determined based on the relevant parameters of the gradient groove line.

[0045] Step S204: Under the constraint of the preset electromagnetic thermal continuity condition, the complete solution domain is divided into multiple sub-solution domains, wherein adjacent sub-solution domains follow the preset electromagnetic thermal continuity condition.

[0046] After determining the complete solution region of the antenna array based on the relevant information of the antenna array recorded in the mesh file, in step S204, the complete solution region is divided into multiple sub-solution regions. In the solution provided in this application embodiment, the complete solution region is divided into multiple sub-solution regions under the constraints of the limiting conditions. The limiting conditions (i.e., the preset electromagnetic thermal continuity conditions) include: electromagnetic continuity conditions (including: tangential continuity of electric field and magnetic field) to ensure the electromagnetic continuity of the interface between adjacent sub-solution regions (i.e., the junction position of two sub-solution regions) and thermal conduction conditions (including: temperature continuity and heat flux density continuity) to ensure the temperature continuity of the interface between adjacent sub-solution regions. Cutting the complete solution domain under the aforementioned constraints ensures the tangential continuity of the electric and magnetic fields, as well as temperature continuity, between adjacent sub-solution domains. Tangential continuity of the electric and magnetic fields means that at any given time, the tangential components of the electric and magnetic fields (i.e., along the interface) between adjacent sub-solution domains must be the same. This ensures a smooth transition of electromagnetic waves between sub-solution domains without discontinuities or reflections, thus guaranteeing the consistency of the electromagnetic field in the complete solution domain. Temperature continuity means that the temperature values ​​at the interfaces between adjacent sub-solution domains are the same, while heat flux density continuity requires that the speed at which heat flows through the interfaces is consistent. This ensures stable heat transfer and avoids artificial heat sources in the calculation.

[0047] According to some optional embodiments of this application, a preset electromagnetic thermal continuity condition is used to restrict the electromagnetic field tangential continuity and heat flux density continuity of adjacent sub-solution regions; under the constraint of the preset electromagnetic thermal continuity condition, the complete solution region is divided into multiple sub-solution regions, including: obtaining the material property parameters of the antenna array, wherein the material property parameters are recorded in the mesh file, and the material property parameters include at least: dielectric constant and thermal conductivity; determining the partition boundary according to the distribution of the material property parameters in the complete solution region, and dividing the complete solution region at the partition boundary to obtain multiple sub-solution regions.

[0048] The Tearing and Interconnecting (FETI) method is a parallel computing strategy applicable to the design of large-scale structures and multiphysics problems. Its basic idea is to divide the entire solution domain into multiple substructures and achieve coupled solution between substructures by introducing contact conditions between boundary degrees of freedom. The method provided in this application uses an electromagnetic-thermal collaborative solution framework composed of FETI and a platform supporting parallel computing to perform electromagnetic-thermal effect fault analysis on large-scale antenna arrays. In this embodiment, when dividing the complete solution domain of the antenna array into multiple sub-solution domains, the partition boundaries are determined according to the spatial distribution characteristics of the material property parameters recorded in the mesh file. The partition boundaries are contained within the complete solution domain. Cutting the complete solution domain at the partition boundaries yields multiple sub-solution domains. The aforementioned material property parameters include dielectric constant, electrical conductivity, thermal conductivity, and specific heat capacity. These parameters are used to determine whether adjacent sub-solution domains within the multiple sub-solution domains defined by the partition boundaries follow pre-set constraints. Only when adjacent sub-solution domains within the multiple sub-solution domains defined by the partition boundaries follow the pre-set constraints are the complete solution domain cut according to these partition boundaries. As mentioned in the above embodiments, the constraints include two types: electromagnetic field tangential continuity constraints (i.e., electromagnetic continuity conditions) and heat flux density continuity conditions (i.e., heat conduction conditions). Among them, parameters related to electromagnetic properties, such as dielectric constant and conductivity, are used to determine whether adjacent sub-solution regions in the multiple sub-solution regions defined by the partition boundary follow the electromagnetic field tangential continuity constraints, while parameters related to temperature properties, such as thermal conductivity and specific heat capacity, are used to determine whether adjacent sub-solution regions in the multiple sub-solution regions defined by the partition boundary follow the heat flux density continuity constraints.

[0049] Optionally, determining the partition boundary based on the distribution of material property parameters in the complete solution region includes: determining the electromagnetic properties of each antenna element in the complete solution region based on the dielectric constant distributed in each antenna element within the complete solution region, and determining the thermal conductivity properties of each antenna element in the complete solution region based on the thermal conductivity distributed in each antenna element within the complete solution region, wherein the region corresponding to the antenna element includes: the space occupied by a single antenna and the space within the radiation and thermal effect range of a single antenna element; determining a first difference between two dielectric constants distributed in two adjacent antenna elements, and determining a second difference between two thermal conductivitys distributed in two adjacent antenna elements; determining a target first difference greater than a first preset value among multiple first differences, and determining the intersection position of two adjacent antenna elements corresponding to the target first difference as the partition boundary, wherein the first preset value is used to quantify the maximum degree of change in electromagnetic properties; and determining a target second difference greater than a second preset value among multiple second differences, and determining the intersection position of two adjacent antenna elements corresponding to the target second difference as the partition boundary, wherein the second preset value is used to quantify the maximum degree of change in thermal conductivity properties.

[0050] In this embodiment, the partition boundaries are determined based on the relative changes in material property parameters distributed across different regions within the complete solution domain. Specifically, the partition boundaries can be determined using the method described below. First, the space occupied by each antenna element in the antenna array and the space within its surrounding radiation and thermal effect range are considered as a sub-region. The electromagnetic and thermal conductivity properties of each sub-region are determined based on the material property parameters distributed within each sub-region. The electromagnetic properties are determined based on electromagnetic performance parameters such as the dielectric constant of the material within the radiation range of the antenna element, while the thermal conductivity properties are determined based on the thermal conductivity of the antenna element material and the thermal conductivity within its thermal effect range. Next, the differences in electromagnetic performance parameters (i.e., the first difference) and thermal conductivity parameters (i.e., the second difference) between adjacent antenna elements are calculated. These calculated differences reflect the similarities and differences in electromagnetic and thermal conductivity characteristics between adjacent sub-regions. Therefore, the calculated differences can be used to determine whether adjacent antenna elements meet the aforementioned constraints (i.e., the preset electromagnetic-thermal continuity condition). Specifically, when the electromagnetic performance of two adjacent antenna elements differs significantly, the boundary position (i.e., the intersection position) of these two antenna elements is determined as the partition boundary. If the electromagnetic performance of two adjacent antenna elements does not differ significantly, but the thermal conductivity of these two antenna elements differs significantly, the boundary position (i.e., the intersection position) of these two antenna elements is also determined as the partition boundary. Whether there is a significant difference in the electromagnetic performance of the two antenna elements is based on the dielectric constant of these two adjacent antenna elements (…). Alternatively, other electromagnetic performance parameters, such as conductivity, can be used to determine whether the difference (i.e., the first difference) is greater than the maximum change value of the electromagnetic property (i.e., the first preset value). When the first difference is greater than the first preset value, the difference in electromagnetic performance between the two antenna elements is considered significant; when the first difference is less than or equal to the first preset value, the difference in electromagnetic performance between the two antenna elements is considered insignificant. The significant difference in thermal conductivity between the two antenna elements is determined by whether the difference (i.e., the second difference) in thermal conductivity (or other thermal conductivity parameters, such as specific heat capacity) between the two adjacent antenna elements is greater than the maximum change value of the thermal conductivity property (i.e., the second preset value). When the second difference is greater than the second preset value, the difference in thermal conductivity between the two antenna elements is considered significant; when the second difference is less than or equal to the second preset value, the difference in thermal conductivity (thermal conductivity property) between the two antenna elements is considered insignificant. The maximum change value of the electromagnetic property (i.e., the first preset value) and the maximum change value of the thermal conductivity property (i.e., the second preset value) can be preset based on experience or determined based on the historical operating data of the antenna array under test and the design parameters of the antenna array.

[0051] Step S206: Solve multiple electromagnetic field control equations in parallel to obtain multiple first solution results, and solve multiple heat conduction equations in parallel based on the multiple first solution results to obtain multiple second solution results. Each first solution result is used to indicate the electromagnetic loss power density distribution of each sub-solution region, and each second solution result is used to indicate the temperature distribution of each sub-solution region.

[0052] After dividing the complete solution domain into multiple sub-solution domains following the constraints (i.e., preset electromagnetic thermal continuity conditions) according to the method in step S204, in step S206, based on the parallel computing framework provided in this application embodiment, the electromagnetic field control equations corresponding to the multiple sub-solution domains are solved in parallel to obtain the electromagnetic loss power density distribution of each sub-solution domain (i.e., the first solution result); subsequently, the electromagnetic loss power density distribution obtained above (describing the energy loss of each element (antenna element) in the antenna array due to the electromagnetic field) is used as the thermal load input (i.e., the input of the heat conduction equation), and the heat conduction equation of each sub-region is solved in parallel to obtain the temperature distribution information (i.e., the second solution result). In step S206, the parallel computing framework provided in this application embodiment is used to realize parallel data processing, which improves the speed of electromagnetic thermal effect analysis of antenna arrays and the ability to process large-scale data; therefore, the method provided in this application embodiment is applicable to the electromagnetic thermal effect fault analysis of large-scale antenna arrays (such as satellite communication phased arrays, radar arrays, etc.) in high-power scenarios.

[0053] According to some optional embodiments of this application, multiple electromagnetic field control equations are solved in parallel, including: creating a first type of thread block corresponding to each sub-solution region, wherein the first type of thread block is used to execute the task of solving the electromagnetic field control equations, and each first type of thread block contains multiple threads; loading the mesh data of each sub-solution region into the shared memory of multiple first type of thread blocks, wherein the mesh data is recorded in a mesh file, and the mesh data is used to assist in solving the electromagnetic field control equations, and the mesh data includes at least: the spatial coordinates of the sub-solution region in the complete solution region, the size parameters of the sub-solution region, and the material property parameters distributed in the sub-solution region; and synchronously triggering multiple threads to execute the task of solving the electromagnetic field control equations in each first type of thread block.

[0054] The parallel computing framework provided in this application allocates the mesh data of the sub-solution region to GPU thread blocks and uses threads to calculate the electric field, magnetic field components and electromagnetic loss distribution in parallel. After the electromagnetic model parameters (including material property parameters, mesh size, etc.) of the sub-solution region are loaded, the parallel computing framework is started to solve the problem and outputs the electromagnetic loss power density distribution of each mesh cell in each sub-solution domain. In other words, in this embodiment, when solving the electromagnetic field control equations of multiple sub-solution regions in parallel, the parallel computing framework creates a thread block (i.e., a first type of thread block) for each sub-solution region after partitioning. The number of thread blocks corresponds to the number of sub-solution regions, and each thread block contains multiple threads. These threads will execute the electromagnetic field control equation solving task for each grid cell within the sub-solution region in parallel. The multiple threads in the first type of thread block use shared memory. The parallel computing framework can access the storage location of the grid file to read the grid data of each sub-solution region and store it in the shared memory. The grid data is the data in the grid file used to describe each sub-solution region. For example, the grid data of each sub-solution region contains the following information: the spatial coordinates of the sub-solution region, and the size parameters (length). ,width The mesh data, derived from a pre-prepared mesh file, contains precise spatial information about the subdomain within the complete solution domain, including spatial coordinates, dimensional parameters, and material properties such as dielectric constant and conductivity. This data is crucial for establishing the electromagnetic field governing equations and forms the basis for subsequent parallel solutions to the electromagnetic field.

[0055] Optionally, multiple heat conduction equations are solved in parallel based on multiple first solution results, including: for each heat conduction equation, determining a target first solution result for the same sub-solution region corresponding to the heat conduction equation, wherein the target first solution result is used to replace the heat source term in the heat conduction equation, and the heat source term is used to describe the heating power per unit volume; creating a second type of thread block corresponding to each sub-solution region, wherein the second type of thread block is used to execute the solution task of the heat conduction equation, and each second type of thread block contains multiple threads; loading the mesh data and target first solution result of each sub-solution region into the shared memory of multiple second type of thread blocks, wherein the mesh data is recorded in a mesh file, and the mesh data is used to assist in solving the heat conduction equation, and the mesh data includes at least: the spatial coordinates of the sub-solution region in the complete solution region, the size parameters of the sub-solution region, and the material property parameters distributed in the sub-solution region; and synchronously triggering multiple threads to execute the solution task of the heat conduction equation in each second type of thread block.

[0056] As mentioned in the above embodiments, the solution result of the electromagnetic field control equation (i.e., the first solution result) will be used as the input when solving the heat conduction equation to replace the heat source term in the conduction equation. Therefore, when solving multiple heat conduction equations corresponding to multiple sub-solution regions in parallel according to the parallel computing framework, the electromagnetic loss power density (i.e., the first solution result) of each sub-solution region is determined from the solution result of multiple electromagnetic field control equations (i.e., the first solution result), and then used as the heat source input of the heat conduction equation of the same sub-solution region. The temperature field is solved by parallel computing mining machine: the heat conduction equation (i.e., the heat conduction equation) is discretized into a system of algebraic equations, and the coefficient matrix operation is accelerated by using the shared memory of the GPU. As mentioned above, this embodiment also uses shared memory when solving the heat conduction equation. After solving the electromagnetic field control equation, the shared memory of the thread block executing the heat conduction equation solution task (i.e., the second type of thread block) is updated with the solution result of the electromagnetic field control equation (i.e., the first solution result). That is, when solving the heat conduction equation in parallel, the shared memory contains not only the mesh data of each sub-solution region (the spatial coordinates of the sub-solution region within the complete solution region, the size parameters of the sub-solution region, the material property parameters distributed in the sub-solution region, etc.), but also the electromagnetic loss power density of each sub-solution region (i.e., the first solution result). When solving multiple heat conduction equations in parallel, the parallel computing framework creates a thread block (i.e., the second type of thread block) for each sub-solution region to execute the heat conduction equation solution task. Each thread block contains multiple threads, and the number of threads is dynamically adjusted according to the number of units and GPU cores in the sub-domain to ensure optimal parallel computing efficiency. During parallel solving, multiple threads are synchronously triggered in each second type of thread block to perform the task of solving the heat conduction equation. Each thread is responsible for calculating the temperature change of the grid cells it covers. When solving the heat conduction equation, the temperature field is updated according to Fourier's law of heat conduction using grid data and heat source data in shared memory.

[0057] The electromagnetic field control equations and heat conduction equations of the aforementioned sub-solution domains are constructed using the FETI method after dividing the complete solution domain. These equations are based on the mesh data (node ​​positions, element information, temperature, etc.) of each sub-solution domain. The electromagnetic field control equations are a discretized form of Maxwell's equations. FETI, by discretizing Maxwell's equations, can transform a continuous domain (sub-solution domain) into a mesh structure (mesh element) composed of a finite number of nodes and elements. These equations are then established and solved at the mesh nodes. The electromagnetic field control equations describe the generation and propagation mechanisms of electric fields, magnetic fields, and electromagnetic waves. The heat conduction equations describe the spatial distribution of temperature and its change over time. FETI transforms the heat conduction equations into a form suitable for numerical solution, such as the stiffness matrix and load vector in the finite element method.

[0058] The parallel computing framework of the method provided in this application is based on the characteristics of the many-core parallel architecture of GPU to achieve parallel computing; it accelerates data-intensive computing through a shared memory mechanism; and it improves the efficiency of data processing.

[0059] Step S208: Determine the overall electromagnetic performance parameters and temperature distribution cloud map of the antenna array based on multiple first solution results and multiple second solution results, wherein the temperature distribution cloud map is used to display the temperature parameters of the antenna array.

[0060] In step S208, the electromagnetic loss power density distribution (i.e., the first solution result) and temperature distribution information (i.e., the second solution result) of all sub-solution regions output in step S206 are integrated to further determine the overall electromagnetic performance parameters and temperature distribution information of the antenna array. The temperature distribution information can be displayed using a temperature distribution cloud map. The temperature distribution cloud map displays the following temperature parameters: temperature values ​​(each point or small area (pixel) on the cloud map has a corresponding temperature value), and the temperature field formed by these temperature values. The temperature distribution cloud map also contains a coordinate system. Therefore, the specific location of each temperature value on the cloud map can also be located through the temperature distribution cloud map.

[0061] According to some optional embodiments of this application, the first solution result is represented in matrix form, and the elements contained in the matrix corresponding to the first solution result include: electric field components and magnetic field components; determining the overall electromagnetic performance parameters of the antenna array based on multiple first solution results and multiple second solution results includes: determining the overall electromagnetic performance parameters of the antenna array based on multiple first solution results includes: for each first solution result, determining a first splicing order of the first solution results based on the spatial location of the sub-solution region corresponding to the first solution result; splicing multiple first solution results according to the first splicing order to obtain a first target matrix for describing the global electromagnetic loss power density distribution of the antenna array; and determining the overall electromagnetic performance parameters based on the first target matrix.

[0062] Step S206 outputs the electromagnetic loss power density distribution of all sub-solution regions (i.e., the first solution result). The electromagnetic loss power density distribution of each sub-solution region is represented as a matrix, which includes the electric field and magnetic field components at each calculation point within the sub-domain. In this embodiment, the electromagnetic loss power density distributions of all sub-solution regions (i.e., the first solution result) are integrated to determine the overall electromagnetic performance parameters of the antenna array. The process of integrating the electromagnetic loss power density distributions can be understood as determining the position of the electromagnetic performance parameters in the matrix based on the spatial position of the corresponding sub-solution regions. Therefore, the first (first) component of the first solution result (electromagnetic loss power density distribution) can be determined based on the spatial relationship of each sub-solution region within the antenna array. Following the sequence, for example, the horizontal coordinates in the spatial coordinates of the sub-solution region are used as the row identifiers of the matrix, and the vertical and horizontal coordinates in the spatial coordinates of the sub-solution region are used as the column identifiers of the matrix. The row and column identifiers of the electric field components and magnetic field components follow the row and column identifiers of their corresponding sub-solution regions. After determining the row and column identifiers of each electric field component and magnetic field component according to the spatial coordinates of the sub-solution region corresponding to the electric field component and magnetic field component, the electric field component and magnetic field component can be filled into the corresponding positions in the matrix. Finally, the matrix form of the electromagnetic loss power density distribution (i.e., the first solution result) (i.e., the first target matrix) is obtained. This matrix integrates the electromagnetic performance parameters of all sub-solution regions. Solving the obtained matrix (i.e., the first target matrix) yields the overall electromagnetic performance parameters of the antenna array.

[0063] Optionally, the second solution result is represented in matrix form, and the elements contained in the matrix corresponding to the second solution result include: temperature value; determining the overall electromagnetic performance parameters of the antenna array based on multiple first solution results and multiple second solution results includes: determining the temperature distribution cloud map of the antenna array based on multiple second solution results, including: for each second solution result, determining the second splicing order of the second solution result based on the spatial location of the sub-solution region corresponding to the second solution result; splicing multiple second solution results according to the second splicing order to obtain a second target matrix for describing the temperature distribution of the antenna array; visualizing the second target matrix as a temperature distribution cloud map, wherein the temperature parameters displayed in the temperature distribution cloud map include at least: the temperature value at each location of the antenna array, the temperature gradient of the antenna array, and the temperature gradient is the rate of change of the temperature value with spatial location.

[0064] Step S206 also outputs the temperature distribution of all sub-solution regions (i.e., the second solution result). The temperature distribution of each sub-solution region is represented as a matrix, which includes temperature information for each calculation point within the sub-domain, such as temperature values. In this embodiment, the temperature values ​​of all sub-solution regions (i.e., the first solution result) are integrated to determine the overall temperature distribution of the antenna array and generate a visualized temperature distribution cloud map. The process of integrating the temperature values ​​can be understood as determining the position of the temperature value in the matrix based on the spatial position of the sub-solution region corresponding to the temperature value. Therefore, the (second) splicing order of the second solution result (temperature value) can be determined based on the spatial positional relationship of each sub-solution region in the antenna array. For example, the horizontal coordinate of the sub-solution region is used as the row identifier of the matrix, and the vertical and horizontal coordinates of the sub-solution region are used as the column identifiers. The row and column identifiers of the temperature value follow the row and column identifiers of its corresponding sub-solution region. After determining the row and column identifiers of each temperature value based on the spatial coordinates of the sub-solution region corresponding to the temperature value, i.e. Temperature values ​​can be filled into the corresponding positions in the matrix to obtain a matrix (i.e., the second target matrix) of temperature distribution (i.e., the second solution result). This matrix integrates the temperature information of all sub-solution regions. Therefore, a temperature distribution cloud map showing the overall temperature distribution of the antenna array can be generated based on this matrix (i.e., the second target matrix). The temperature distribution cloud map can show the temperature values ​​at various locations of the antenna array, as well as the rate of change of temperature values ​​with spatial location (i.e., the temperature gradient). For example, the direction and magnitude of the temperature gradient can be shown by overlaying isotherms or arrows on the temperature distribution cloud map. The temperature gradient can help analyze the distribution of heat sources and the direction of heat flow. Figure 4 This is a schematic diagram of the temperature distribution cloud map, such as... Figure 4 As shown, in the temperature distribution cloud map generated based on the second target matrix, the color (or grayscale value) of each point represents the temperature value at that point. Different colors correspond to different temperature values ​​(K represents Kelvin, the unit of temperature). The temperature distribution is visually displayed using color gradients or grayscale changes. Furthermore, the temperature distribution cloud map can also display the coordinates of the antenna array, for example... Figure 4 In this context, x represents the lateral arrangement of antenna elements on the ground plane (i.e., positional information along the width or length of the antenna array). The temperature variation trend of a certain arrangement direction of the antenna array can be determined based on the temperature values ​​distributed along the x-axis. z represents the vertical distribution of different layers inside the antenna (such as dielectric substrate, radiator layer, cooling layer, etc.) (vertical height of each layer from the ground). The temperature distribution of different layers in the antenna array can be determined based on the temperature values ​​distributed along the z-axis.

[0065] Step S210: Locate the fault area based on the overall electromagnetic performance parameters and temperature distribution cloud map.

[0066] Finally, in step S210, the fault area of ​​the antenna array is located based on the overall electromagnetic performance parameters and temperature distribution cloud map of the antenna array to be analyzed output in step S208. For example, the influence of temperature on electromagnetic characteristics and the contribution of electromagnetic loss to the temperature field can be considered. The interaction between electromagnetic performance parameters and temperature distribution is comprehensively analyzed to locate the fault area, such as the area of ​​fault caused by thermal effect.

[0067] According to some alternative embodiments of this application, locating a fault area based on overall electromagnetic performance parameters and a temperature distribution cloud map includes: locating a hotspot area in the temperature distribution cloud map, wherein the hotspot area is an area with a temperature value greater than a preset temperature threshold; determining a target element corresponding to the hotspot area in a matrix representing overall electromagnetic performance parameters based on the spatial location of the hotspot area, wherein the spatial location is used to determine the position of the target element in the matrix representing overall electromagnetic performance parameters; determining the electromagnetic performance change trend of the hotspot area based on the electromagnetic performance parameters of the hotspot area recorded in the target element; and determining the hotspot area as a fault area if the electromagnetic performance change trend deviates from a reference change trend, wherein the reference change trend is determined based on historical electromagnetic performance parameters generated when the antenna array operates without faults.

[0068] In this embodiment, the following method can be used to locate the fault area. Combining electromagnetic performance parameters and temperature distribution, the area of ​​the fault caused by electromagnetic thermal effects can be located. In this embodiment, the following method can be used to locate the fault area: First, based on the temperature distribution cloud map or temperature parameter matrix (i.e., the second target matrix), the area of ​​temperature anomaly (i.e., the hot spot area) in the antenna array can be determined. Whether the temperature is abnormal can be determined by comparing the temperature value of the area with a temperature threshold. If the temperature value of a certain area is greater than the temperature threshold, the area is determined to be temperature abnormal. The aforementioned temperature threshold is preset considering the working environment and material properties of the antenna array. The temperature threshold is the highest temperature value reached under normal working conditions of the antenna array. Areas exceeding the temperature threshold are abnormally high-temperature areas that may cause antenna array faults. Further, based on the spatial location of the hot spot area, the electromagnetic performance parameters of the hot spot area are determined in the matrix representing the overall electromagnetic performance parameters (i.e., the first target matrix). The spatial location of the hot spot area can be determined in the temperature distribution cloud map. For example, when the temperature distribution cloud map is... Figure 4In the presentation format, the spatial location of the hotspot area can be represented by spatial coordinates (x, z). The rows of the matrix are located based on the horizontal coordinate (x) of the hotspot area, and the columns are located based on the vertical coordinate (z). The element labeled with row x and column z is identified as the element recording the electromagnetic performance parameters of the hotspot area (i.e., the target element). Next, the electromagnetic performance parameters of the hotspot area are used to determine whether the trend of electromagnetic performance change in the hotspot area deviates from the normal trend. If the trend of electromagnetic performance change in the hotspot area deviates from the normal trend (i.e., the reference trend), the hotspot area is determined to be the area of ​​failure caused by electromagnetic thermal effects (i.e., the fault area). When determining whether the electromagnetic performance change trend of a hotspot area deviates from the normal trend based on the electromagnetic performance parameters of the hotspot area, the following method can be used: Determine the trend of dielectric constant change with temperature (or the trend of antenna gain change with temperature) based on the electromagnetic performance parameters recorded by the target element; determine the antenna gain based on the electromagnetic performance parameters recorded by the target element; consider the trend of dielectric constant change with temperature (or the trend of antenna gain change with temperature) as the electromagnetic performance change trend; if the deviation of the electromagnetic performance change trend calculated above from the change trend of the reference curve (i.e., the reference change trend) is greater than the baseline deviation, determine whether the electromagnetic performance change trend of the hotspot area deviates from the normal trend; where the reference curve is a temperature-electromagnetic performance parameter curve constructed based on the electromagnetic performance parameters and temperature generated by the antenna array under normal operating conditions, and the baseline deviation can be determined based on the parameters during the design of the antenna array (such as the specified values ​​in the product specification).

[0069] By combining the electromagnetic-thermal coupling solution domain partitioning method with a parallel computing framework through the above steps, electromagnetic and temperature parameters are considered simultaneously when performing fault analysis on antenna arrays, thus improving the accuracy of the analysis results. During the fault analysis process, the use of a parallel computing framework for data processing increases the speed of fault analysis and enables the accurate location of faults that may be caused by temperature rise, such as material dielectric constant shift, structural deformation, and solder joint detachment.

[0070] Figure 5 This is a structural diagram of a device for locating fault areas provided in an embodiment of this application, as shown below. Figure 5As shown, the device for locating the fault region includes: a receiving module 50, used to receive a mesh file and determine the complete solution region of the antenna array to be fault located based on the mesh file, wherein the mesh file records relevant information of the antenna array to be fault located, and the complete solution region includes: the space occupied by the antenna array, and the space within the radiation and thermal effect range of the antenna array; a cutting module 52, used to divide the complete solution region into multiple sub-solution regions under the constraint of a preset electromagnetic thermal continuity condition, wherein adjacent sub-solution regions follow the preset electromagnetic thermal continuity condition; and an execution module 54, used to perform multiple electromagnetic field control equations in parallel. The system solves the problem to obtain multiple first solution results, and solves multiple heat conduction equations in parallel based on these first solution results to obtain multiple second solution results. Each first solution result indicates the electromagnetic loss power density distribution of each sub-solution region, and each second solution result indicates the temperature distribution of each sub-solution region. A first determination module 56 is used to determine the overall electromagnetic performance parameters and temperature distribution cloud map of the antenna array based on the multiple first solution results and the multiple second solution results. The temperature distribution cloud map is used to display the temperature parameters of the antenna array. A second determination module 58 is used to locate the fault area based on the overall electromagnetic performance parameters and the temperature distribution cloud map.

[0071] Figure 6 This is a flowchart of the operation of the device for locating the fault area, such as... Figure 6As shown, when using a fault location device to locate the fault area, the device can perform unit modeling of the antenna array. The receiving module 50 receives the mesh file output after the 3D modeling of the antenna array to be fault located (fault analysis). The mesh file contains relevant information about the antenna array, such as its geometry, material properties, and power supply conditions. Therefore, the receiving module 50 can determine the complete solution region of the antenna array based on the mesh file (covering the spatial area occupied by the antenna array and all spatial areas within its radiation and thermal effect range). The cutting module 52, based on a preset electromagnetic-thermal continuity condition, divides the complete solution region determined by the receiving module 50 into multiple sub-solution regions. The division of sub-solution regions takes into account the structural characteristics and heat conduction paths of the antenna array, ensuring that the electromagnetic and temperature fields between adjacent sub-solution regions satisfy the aforementioned preset electromagnetic-thermal continuity condition. After the sub-solution regions are divided, execution module 54 starts the parallel computing framework to solve multiple electromagnetic field control equations and multiple heat conduction equations in multiple sub-solution regions in parallel. The (first) solution result of the electromagnetic field control equation is used as the input of the heat conduction equation to help determine the (second) solution result of the heat conduction equation. The advantage of execution module 54 is that it makes efficient use of GPU resources, improving the speed and accuracy of electromagnetic-thermal coupling solution. After execution module 54 completes the electromagnetic field and temperature field solutions of all sub-solution regions, the first determination module 56 integrates the (first) solution results of the electromagnetic field control equation and the (second) solution results of the heat conduction equation of each sub-solution region to generate the overall electromagnetic performance parameters of the antenna array (such as antenna gain) and the global temperature distribution cloud map. Specifically, it calculates the total electromagnetic loss and distribution of the antenna array by stitching together the electromagnetic loss power density distribution of each sub-solution region, and then combines the temperature distribution results to generate a temperature distribution image covering the entire antenna array and its radiative heat effect range. Finally, the second determining module 58 locates the area in the antenna array that is faulty due to electromagnetic thermal effects (i.e., the fault area) based on the overall electromagnetic performance parameters and temperature distribution cloud map provided by the first determining module 56.

[0072] It should be noted that, Figure 5 Preferred embodiments of the shown examples can be found in [reference needed]. Figure 2 The relevant descriptions of the embodiments shown will not be repeated here.

[0073] This application also provides a non-volatile storage medium storing a computer program, wherein the above-mentioned method for locating fault areas is executed by running the computer program in the device where the non-volatile storage medium is located.

[0074] The aforementioned non-volatile storage medium is used to store a program that performs the following functions: receiving a mesh file and determining the complete solution region of the antenna array to be fault located based on the mesh file, wherein the mesh file records relevant information of the antenna array to be fault located, and the complete solution region includes: the space occupied by the antenna array, and the space within the radiation and thermal effect range of the antenna array; dividing the complete solution region into multiple sub-solution regions under the constraint of a preset electromagnetic thermal continuity condition, wherein adjacent sub-solution regions follow the preset electromagnetic thermal continuity condition; solving multiple electromagnetic field control equations in parallel to obtain multiple first solution results, and solving multiple heat conduction equations in parallel based on the multiple first solution results to obtain multiple second solution results, wherein each first solution result indicates the electromagnetic loss power density distribution of each sub-solution region, and each second solution result indicates the temperature distribution of each sub-solution region; determining the overall electromagnetic performance parameters and temperature distribution cloud map of the antenna array based on the multiple first solution results and the multiple second solution results, wherein the temperature distribution cloud map displays the temperature parameters of the antenna array; and locating the fault region based on the overall electromagnetic performance parameters and the temperature distribution cloud map.

[0075] This application also provides an electronic device, including a memory and a processor. The memory stores a computer program, and the processor is configured to execute the above-described method for locating fault areas through the computer program.

[0076] The processor in the aforementioned electronic device is used to run a program that performs the following functions: receiving a mesh file and determining the complete solution region of the antenna array to be fault located based on the mesh file, wherein the mesh file records relevant information of the antenna array to be fault located, and the complete solution region includes: the space occupied by the antenna array, and the space within the radiation and thermal effect range of the antenna array; dividing the complete solution region into multiple sub-solution regions under the constraint of a preset electromagnetic thermal continuity condition, wherein adjacent sub-solution regions follow the preset electromagnetic thermal continuity condition; solving multiple electromagnetic field control equations in parallel to obtain multiple first solution results, and solving multiple heat conduction equations in parallel based on the multiple first solution results to obtain multiple second solution results, wherein each first solution result is used to indicate the electromagnetic loss power density distribution of each sub-solution region, and each second solution result is used to indicate the temperature distribution of each sub-solution region; determining the overall electromagnetic performance parameters and temperature distribution cloud map of the antenna array based on the multiple first solution results and the multiple second solution results, wherein the temperature distribution cloud map is used to display the temperature parameters of the antenna array; and locating the fault region based on the overall electromagnetic performance parameters and the temperature distribution cloud map.

[0077] This application also provides a computer program product, including computer instructions, which, when executed by a processor, implement the steps of the above-described method for locating fault areas.

[0078] It should be noted that each module in the above-mentioned device for locating fault areas can be a program module (e.g., a set of program instructions that implement a certain function) or a hardware module. For the latter, it can be manifested in the following forms, but is not limited to them: each of the above modules is manifested as a processor, or the functions of each of the above modules are implemented by a processor.

[0079] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0080] In the above embodiments of this application, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0081] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. The device embodiments described above are merely illustrative; for example, the division of units can be a logical functional division, and in actual implementation, there may be other division methods. For instance, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the displayed or discussed mutual coupling, direct coupling, or communication connection may be through some interfaces; the indirect coupling or communication connection between units or modules may be electrical or other forms.

[0082] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0083] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0084] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to related technologies, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks.

[0085] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A method for locating a fault area, characterized in that, include: Receive a mesh file and determine the complete solution region of the antenna array to be fault located based on the mesh file. The mesh file is used to record relevant information of the antenna array to be fault located. The complete solution region includes: the space occupied by the antenna array, and the space within the radiation and thermal effect range of the antenna array. Under the constraint of a preset electromagnetic-thermal continuity condition, the complete solution domain is divided into multiple sub-solution domains, wherein adjacent sub-solution domains follow the preset electromagnetic-thermal continuity condition. Multiple electromagnetic field control equations are solved in parallel to obtain multiple first solution results. Based on the multiple first solution results, multiple heat conduction equations are solved in parallel to obtain multiple second solution results. Each first solution result is used to indicate the electromagnetic loss power density distribution of each sub-solution region, and each second solution result is used to indicate the temperature distribution of each sub-solution region. The overall electromagnetic performance parameters and temperature distribution cloud map of the antenna array are determined based on multiple first solution results and multiple second solution results, wherein the temperature distribution cloud map is used to display the temperature parameters of the antenna array; The fault area is located based on the overall electromagnetic performance parameters and temperature distribution cloud map.

2. The method according to claim 1, characterized in that, The preset electromagnetic-thermal continuity condition is used to restrict the electromagnetic field tangential continuity and heat flux density continuity of adjacent sub-solution regions; under the constraint of the preset electromagnetic-thermal continuity condition, the complete solution region is divided into multiple sub-solution regions, including: Obtain the material property parameters of the antenna array, wherein the material property parameters are recorded in the mesh file, and the material property parameters include at least: dielectric constant and thermal conductivity; The partition boundaries are determined based on the distribution of the material property parameters in the complete solution region, and the complete solution region is divided at the partition boundaries to obtain multiple sub-solution regions.

3. The method according to claim 2, characterized in that, Determining partition boundaries based on the distribution of the material property parameters in the complete solution domain includes: The electromagnetic properties of each antenna element in the complete solution region are determined based on the dielectric constant distributed in each antenna element in the complete solution region, and the thermal conductivity of each antenna element in the complete solution region is determined based on the thermal conductivity distributed in each antenna element in the complete solution region. The region corresponding to the antenna element includes: the space occupied by a single antenna and the space within the radiation and thermal effect range of a single antenna element. Determine a first difference in the dielectric constants of two adjacent antenna elements, and determine a second difference in the thermal conductivity of two adjacent antenna elements. Among multiple first differences, a target first difference greater than a first preset value is determined; the intersection position of two adjacent antenna elements corresponding to the target first difference is determined as the partition boundary; wherein, the first preset value is used to quantify the maximum degree of change in electromagnetic properties; and... Among multiple second differences, a target second difference greater than a second preset value is determined, and the intersection position of two adjacent antenna elements corresponding to the target second difference is determined as the partition boundary, wherein the second preset value is used to quantify the maximum degree of change in thermal conductivity properties.

4. The method according to claim 1, characterized in that, Multiple electromagnetic field control equations are solved in parallel, including: Create a first type of thread block corresponding to each of the sub-solution regions, wherein the first type of thread block is used to perform the task of solving the electromagnetic field control equations, and each first type of thread block contains multiple threads; The mesh data of each sub-solution region is loaded into the shared memory of multiple first-type thread blocks, wherein the mesh data is recorded in the mesh file and is used to assist in solving the electromagnetic field control equations. The mesh data includes at least: the spatial coordinates of the sub-solution region in the complete solution region, the size parameters of the sub-solution region, and the material property parameters distributed in the sub-solution region. In each of the first type of thread blocks, multiple threads are synchronously triggered to perform the task of solving the electromagnetic field control equations.

5. The method according to claim 1, characterized in that, Based on multiple first solution results, multiple heat conduction equations are solved in parallel, including: For each heat conduction equation, a target first solution result is determined that corresponds to the same sub-solution region as the heat conduction equation, wherein the target first solution result is used to replace the heat source term in the heat conduction equation, and the heat source term is used to describe the heating power per unit volume; Create a second type of thread block corresponding to each of the sub-solution regions, wherein the second type of thread block is used to perform the task of solving the heat conduction equation, and each second type of thread block contains multiple threads; The mesh data of each sub-solution region and the target first solution result are loaded into the shared memory of multiple second-type thread blocks. The mesh data is recorded in the mesh file and is used to assist in solving the heat conduction equation. The mesh data includes at least: the spatial coordinates of the sub-solution region in the complete solution region, the size parameters of the sub-solution region, and the material property parameters distributed in the sub-solution region. In each of the second type of thread blocks, multiple threads are synchronously triggered to perform the task of solving the heat conduction equation.

6. The method according to claim 1, characterized in that, The first solution result is expressed in matrix form, and the matrix corresponding to the first solution result contains elements including: electric field components and magnetic field components; Determining the overall electromagnetic performance parameters of the antenna array based on multiple first solution results and multiple second solution results includes: determining the overall electromagnetic performance parameters of the antenna array based on multiple first solution results, including: For each of the first solution results, the first splicing order of the first solution results is determined according to the spatial position of the sub-solution region corresponding to the first solution result; Multiple first solution results are spliced ​​together according to the first splicing order to obtain a first target matrix for describing the global electromagnetic loss power density distribution of the antenna array; The overall electromagnetic performance parameters are determined based on the first target matrix.

7. The method according to claim 1, characterized in that, The second solution result is represented in matrix form, and the elements contained in the matrix corresponding to the second solution result include: temperature values; Determining the overall electromagnetic performance parameters of the antenna array based on multiple first solution results and multiple second solution results includes: determining the temperature distribution cloud map of the antenna array based on multiple second solution results, including: For each second solution result, the second splicing order of the second solution result is determined according to the spatial location of the sub-solution region corresponding to the second solution result; Multiple second solution results are spliced ​​together according to the second splicing order to obtain a second target matrix used to describe the temperature distribution of the antenna array; The second target matrix is ​​visualized as the temperature distribution cloud map, wherein the temperature parameters displayed by the temperature distribution cloud map include at least: the temperature value at each location of the antenna array and the temperature gradient of the antenna array, wherein the temperature gradient is the rate of change of the temperature value with spatial location.

8. The method according to claim 1, characterized in that, Based on the overall electromagnetic performance parameters and temperature distribution cloud map, the fault area is located, including: Locate hotspot areas in the temperature distribution cloud map, wherein the hotspot areas are areas where the temperature value is greater than a preset temperature threshold; Based on the spatial location of the hotspot region, the target element corresponding to the hotspot region is determined in the matrix representing the overall electromagnetic performance parameters, wherein the spatial location is used to determine the position of the target element in the matrix representing the overall electromagnetic performance parameters; The electromagnetic performance variation trend of the hot spot region is determined based on the electromagnetic performance parameters of the hot spot region recorded in the target element. When the electromagnetic performance change trend deviates from the reference change trend, the hot spot area is identified as the fault area, wherein the reference change trend is determined based on the historical electromagnetic performance parameters generated when the antenna array operates without faults.

9. A device for locating a fault area, characterized in that, include: A receiving module is used to receive a mesh file and determine the complete solution area of ​​the antenna array to be fault located based on the mesh file. The mesh file is used to record relevant information of the antenna array to be fault located. The complete solution area includes: the space occupied by the antenna array, and the space within the radiation and thermal effect range of the antenna array. A cutting module is used to divide the complete solution domain into multiple sub-solution domains under the constraint of a preset electromagnetic thermal continuity condition, wherein adjacent sub-solution domains follow the preset electromagnetic thermal continuity condition. An execution module is used to solve multiple electromagnetic field control equations in parallel to obtain multiple first solution results, and to solve multiple heat conduction equations in parallel based on the multiple first solution results to obtain multiple second solution results. Each first solution result is used to indicate the electromagnetic loss power density distribution of each sub-solution region, and each second solution result is used to indicate the temperature distribution of each sub-solution region. The first determining module is used to determine the overall electromagnetic performance parameters and temperature distribution cloud map of the antenna array based on multiple first solution results and multiple second solution results, wherein the temperature distribution cloud map is used to display the temperature parameters of the antenna array; The second determining module is used to locate the fault area based on the overall electromagnetic performance parameters and temperature distribution cloud map.

10. A non-volatile storage medium, characterized in that, The non-volatile storage medium stores a computer program, wherein the device containing the non-volatile storage medium executes the method for locating fault regions as described in any one of claims 1 to 8 by running the computer program.

11. An electronic device comprising a memory and a processor, characterized in that, The memory stores a computer program, and the processor is configured to execute the method for locating a fault area as described in any one of claims 1 to 8 through the computer program.

12. A computer program product comprising computer instructions, characterized in that, When the computer instructions are executed by the processor, they implement the steps of the method for locating fault areas as described in any one of claims 8.

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