Multi-beam phased array

Abstract

The embodiment of the invention provides a multi-beam phased array, and aims to avoid mutual influence of a receiving array plane, a synthesis network and a power supply control chip in the multi-beam phased array. The multi-beam phased array comprises a plurality of microwave plates, a receiving array plane, a synthesis network and a power supply control chip, the plurality of microwave plates comprise a first microwave plate, a second microwave plate and a third microwave plate which are stacked, the second microwave plate is located between the first microwave plate and the third microwave plate, the receiving array plane is arranged on the first microwave plate, and the synthesis network is arranged on the receiving array plane. The synthesis network is arranged on the second microwave plate, the synthesis network is electrically connected with the receiving array plane, the power supply control chip is arranged on the third microwave plate, and the power supply control chip is electrically connected with the synthesis network; the receiving array plane, the synthesis network and the power supply control chip are separately arranged, and mutual influence of the receiving array plane, the synthesis network and the power supply control chip is avoided.

Description

Technical Field

[0001] This application relates to the field of antenna technology, specifically to a multi-beam phased array. Background Technology

[0002] Currently, most phased array antennas adopt a single-beam design. The limitations of single-beam phased array antennas are quite obvious. They can only track a single target or scan a single direction at the same time. In contrast, multi-beam phased array receiving antennas can effectively solve the problems of inter-satellite handover and frequent beam switching of low-Earth orbit satellites by receiving multiple satellite beams at the same time, thus adapting to the dynamic needs of low-Earth orbit satellite communication. Summary of the Invention

[0003] This application provides a multi-beam phased array, which aims to improve the multi-beam phased array by avoiding mutual interference between the receiving array, the combining network, and the power control chip.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions: This application provides a multi-beam phased array, which includes multiple microwave boards, a receiving array, a combining network, and a power control chip. The multiple microwave boards include a first microwave board, a second microwave board, and a third microwave board stacked together. The second microwave board is located between the first microwave board and the third microwave board. The receiving array is disposed on the first microwave board, and the combining network is disposed on the second microwave board. The combining network and the receiving array are electrically connected. The power control chip is disposed on the third microwave board and is electrically connected to the combining network.

[0005] With the above configuration, the receiving array, the combining network, and the power control chip are respectively set on the first microwave board, the second microwave board, and the third microwave board, so as to achieve the separate configuration of the receiving array, the combining network, and the power control chip and avoid mutual interference between them.

[0006] In some embodiments, the second microwave board includes a first sub-microwave board, a second sub-microwave board, a third sub-microwave board, and a fourth sub-microwave board stacked together; the combining network includes a first beam power divider network, a second beam power divider network, a third beam power divider network, and a fourth beam power divider network; the first beam power divider network is disposed on the first sub-microwave board, the second beam power divider network is disposed on the second sub-microwave board, the third beam power divider network is disposed on the third sub-microwave board, and the fourth beam power divider network is disposed on the fourth sub-microwave board.

[0007] In some embodiments, the multi-beam phased array further includes multiple multi-channel chips, all of which are located between the first microwave board and the second microwave board; the receiving array includes multiple receiving subarrays, each of which includes multiple arrayed antenna elements, and the antenna elements are connected to the first beam power divider network, the second beam power divider network, the third beam power divider network and the fourth beam power divider network through the multi-channel chips.

[0008] In some embodiments, the multi-beam phased array further includes a power divider; the antenna element has two feed points, each feed point being electrically connected to a power divider, and the power divider being electrically connected to a multi-channel chip.

[0009] In some embodiments, the four antenna elements of the array are arranged in a rotating configuration.

[0010] In some embodiments, the four antenna elements of the array have eight feed points, each of which is connected to a power divider. One end of the power divider is connected to a multi-channel chip, and the other end of the power divider is connected to another multi-channel chip. The two multi-channel chips are connected to the first beam power divider network, the second beam power divider network, the third beam power divider network, and the fourth beam power divider network.

[0011] In some embodiments, the multichannel chip includes an electrically tunable phase shifter, an electrically tunable attenuator, and a low-noise amplifier.

[0012] In some embodiments, the multi-beam phased array further includes digital traces and power traces, with the digital traces disposed on a first microwave board and / or a second microwave board and / or a third microwave board; and the power traces disposed on the second microwave board and / or a third microwave board.

[0013] In some embodiments, the second microwave board includes a first sub-microwave board, a second sub-microwave board, a third sub-microwave board, and a fourth sub-microwave board stacked together; the multi-beam phased array also includes digital traces and power traces, which are disposed between the second sub-microwave board and the third sub-microwave board.

[0014] In some embodiments, the multi-beam phased array further includes a first structural cavity and a second structural cavity, the first structural cavity being located between a first microwave plate and a second microwave plate, and the second structural cavity being located between a second microwave plate and a third microwave plate. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in some embodiments of this application will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this application.

[0016] Figure 1 This is a schematic diagram of the structure of the multi-beam phased array in the embodiments of this application; Figure 2 This is a schematic diagram of the connection of the multi-beam phased array in the embodiments of this application; Figure 3 This is a schematic diagram of the receiving array structure in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a group of antenna elements in an embodiment of this application.

[0017] Explanation of reference numerals in the attached figures: 100, Multi-beam phased array; 10, Microwave board; 11, First microwave board; 12, Second microwave board; 121, First sub-microwave board; 122, Second sub-microwave board; 123, Third sub-microwave board; 124, Fourth sub-microwave board; 13, Third microwave board; 21, First structural cavity; 22, Second structural cavity; 30, Receiving array; 31, Receiving subarray; 311, Antenna element; 301, Feed point; 40, Synthesizing network; 41, First beam power divider network; 42, Second beam power divider network; 43, Third beam power divider network; 44, Fourth beam power divider network; 50, Power control chip; 61, Power divider; 62, Multi-channel chip; 63, Digital trace; 64, Power trace. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0020] Furthermore, in the embodiments of this application, directional terms such as "up," "down," "left," "right," "horizontal," and "vertical" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0021] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0022] It should be noted that, in the description of the embodiments of this application, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection or an integral connection; they can also refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0023] Reference Figure 1 and Figure 2 This application provides a multi-beam phased array 100, which includes multiple microwave plates 10. Each microwave plate 10 includes a first microwave plate 11, a second microwave plate 12, and a third microwave plate 13 stacked together, with the second microwave plate 12 located between the first microwave plate 11 and the third microwave plate 13. The multi-beam phased array 100 also includes a first structural cavity 21 and a second structural cavity 22. The first structural cavity 21 is located between the first microwave plate 11 and the second microwave plate 12, and the second structural cavity 22 is located between the second microwave plate 12 and the third microwave plate 13. That is, the first microwave plate 11, the second microwave plate 12, and the third microwave plate 13 are relatively independent.

[0024] In the above embodiments, the multi-beam phased array 100 includes a receiving array 30, a combining network 40, and a power control chip 50. The receiving array 30 is disposed on a first microwave board 11; the combining network 40 is disposed on a second microwave board 12, and the combining network 40 and the receiving array 30 are electrically connected; the power control chip 50 is disposed on a third microwave board 13, and the power control chip 50 is electrically connected to the combining network 40. For example, the receiving array 30, the combining network 40, and the power control chip 50 adopt a separate design, integrated on the first microwave board 11, the second microwave board 12, and the third microwave board 13 respectively. The receiving array 30 and the combining network 40 can be interconnected via a snap-fit ​​connection. The combining network 40 can be directly connected to the power control chip 50 via a low-frequency connector for low-frequency interconnection; then, it is connected to the back-end combining module via an SSMP (Radio Frequency Coaxial Connector) for radio frequency interconnection, and to the mainboard power control via a low-frequency connector for low-frequency interconnection. The receiving array 30, the combining network 40, and the power control chip 50 are each integrated into the first microwave board 11, the second microwave board 12, and the third microwave board 13, respectively, using a vertical stacking mounting method. This gives the receiving array 30 two-dimensional expansion characteristics, allowing it to be freely assembled according to different performance requirements. For example, the first microwave board 11, the second microwave board 12, and the third microwave board 13 can all be high-density multilayer printed circuit boards.

[0025] With the above configuration, the receiving array 30, the combining network 40, and the power control chip 50 are respectively set on the first microwave board 11, the second microwave board 12, and the third microwave board 13, so as to realize the separate configuration of the receiving array 30, the combining network 40, and the power control chip 50, and avoid mutual interference between the receiving array 30, the combining network 40, and the power control chip 50.

[0026] Reference Figure 3 and Figure 4 In some embodiments, the receiving array 30 includes multiple receiving subarrays 31, and each receiving subarray 31 includes multiple arrayed antenna elements 311. For example, in the embodiments of this application, the receiving array 30 includes four receiving subarrays 31, and each receiving subarray 31 includes 256 antenna elements 311, which are arranged in a 16-row, 16-column array. Each antenna element 311 has two feed points 301. In the same receiving subarray 31, the four arrayed antenna elements 311 form a group of antenna elements 311. The four antenna elements 311 in a group of antenna elements 311 are rotated, that is, the four antenna elements 311 are arranged in a 2-row, 2-column rotational layout.

[0027] In the above embodiments, in the same group of antenna elements 311, the antenna elements 311 adopt a dual-feed method. The switching of the array surface to left- or right-hand circular polarization is achieved by configuring the phase difference between channels. In addition, with the rotation layout of 2×2 antenna elements 311, the antenna elements are adjusted by rotating and coordinating with left- or right-hand rotation, which further optimizes the circular polarization performance of the antenna.

[0028] Continue to refer to Figure 1 and Figure 2 In some embodiments, the multi-beam phased array 100 further includes a power divider 61, which is a 1-to-2 power divider 61. Each feed point 301 of the antenna element 311 is connected to a power divider 61, meaning that one feed point 301 of the same antenna element 311 is connected to one power divider 61, and its other feed point 301 is connected to another power divider 61. The feed point 301 of the antenna element 311 can be connected to the 1-to-2 power divider 61 via an LNA. With this configuration, the antenna received signal is fed through dual feed ports to form two channels, and then independently amplified by the LNA to output two signals with low noise. Each of these two signals is then fed through a 1-to-2 power divider 61 to form four independent signals.

[0029] In some embodiments, the multi-beam phased array 100 further includes multiple multi-channel chips 62, all located between the first microwave board 11 and the second microwave board 12. Each multi-channel chip 62 is a dual-beam multi-functional chip, including 8 inputs and 2 outputs, comprising 16 channels. In conjunction with the above embodiments, a group of antenna elements 311 with four antenna elements 311 arrayed together has a total of eight feed points 301, each of which is connected to a power divider 61. One end of each power divider 61 is connected to one multi-channel chip 62, and the other end is connected to another multi-channel chip 62. That is, one group of antenna elements 311 (i.e., four antenna elements 311) is connected to two multi-channel chips 62. Therefore, the 256 antenna elements 311 in the same receiving subarray 31 are connected to 128 multi-channel chips 62.

[0030] In the above embodiment, the multi-channel chip 62 includes an electrically adjustable phase shifter, an electrically adjustable attenuator, and a low-noise amplifier. The four independent signals are amplified, amplitude-modulated, phase-shifted, and synthesized by the multi-channel chip 62, and each outputs two independent beams.

[0031] In some embodiments, the second microwave board 12 includes a first sub-microwave board 121, a second sub-microwave board 122, a third sub-microwave board 123, and a fourth sub-microwave board 124 stacked together. The combining network 40 in the above embodiments includes a first beam power divider network 41, a second beam power divider network 42, a third beam power divider network 43, and a fourth beam power divider network 44; the first beam power divider network 41 is disposed on the first sub-microwave board 121, the second beam power divider network 42 is disposed on the second sub-microwave board 122, the third beam power divider network 43 is disposed on the third sub-microwave board 123, and the fourth beam power divider network 44 is disposed on the fourth sub-microwave board 124. The antenna unit 311 is connected to the first beam power divider network 41, the second beam power divider network 42, the third beam power divider network 43, and the fourth beam power divider network 44 via a multi-channel chip 62. Two multi-channel chips 62 are connected to the first beam power divider network 41, the second beam power divider network 42, the third beam power divider network 43, and the fourth beam power divider network 44. The two independent beams are then combined by the back-end combining networks (first sub-microwave board 121, second sub-microwave board 122, third sub-microwave board 123, and fourth sub-microwave board 124) to finally output four independent beams. This realizes a four-beam phased array architecture.

[0032] In some embodiments, the multi-beam phased array 61 further includes digital traces 63 and power traces 64. Digital traces 63 can be disposed on a first microwave board 11 to provide digital signals to the receiving array 30 disposed on the first microwave board 11; digital traces 63 can also be disposed on a second microwave board 12 to provide digital signals to the combining network 40 disposed on the second microwave board 12; digital traces 63 can also be disposed on a third microwave board 13 to provide digital signals to the power control chip 50 disposed on the third microwave board 13. Power traces 64 can be disposed on the second microwave board 12 to provide power to the combining network 40 disposed on the second microwave board 12; power traces 64 can also be disposed on the third microwave board 13 to provide power to the power control chip 50 disposed on the third microwave board 13.

[0033] In an embodiment where both digital traces 63 and power traces 64 are disposed on the second microwave board 12, and in conjunction with an embodiment where the second microwave board 12 includes a first sub-microwave board 121, a second sub-microwave board 122, a third sub-microwave board 123, and a fourth sub-microwave board 124 stacked together, the digital traces 63 and power traces 64 are disposed between the second sub-microwave board 122 and the third sub-microwave board 123, so that the digital traces 63 and power traces 64 can be uniformly located in the first beam power divider network 41, the second beam power divider network 42, the third beam power divider network 43, and the fourth beam power divider network 44.

[0034] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A multi-beam phased array, characterized in that, include: Multiple microwave boards, including a first microwave board, a second microwave board and a third microwave board stacked together, wherein the second microwave board is located between the first microwave board and the third microwave board; A receiving array, wherein the receiving array is disposed on the first microwave board; A synthesizing network is disposed on the second microwave board and electrically connected to the receiving array. A power control chip is disposed on the third microwave board and is electrically connected to the synthesis network.

2. The multi-beam phased array according to claim 1, characterized in that, The second microwave board includes a first sub-microwave board, a second sub-microwave board, a third sub-microwave board, and a fourth sub-microwave board stacked together; the combining network includes a first beam power divider network, a second beam power divider network, a third beam power divider network, and a fourth beam power divider network; the first beam power divider network is disposed on the first sub-microwave board, the second beam power divider network is disposed on the second sub-microwave board, the third beam power divider network is disposed on the third sub-microwave board, and the fourth beam power divider network is disposed on the fourth sub-microwave board.

3. The multi-beam phased array according to claim 2, characterized in that, The multi-beam phased array further includes multiple multi-channel chips, all of which are located between the first microwave board and the second microwave board; the receiving array includes multiple receiving subarrays, each of which includes multiple arrayed antenna elements, which are connected to the first beam power divider network, the second beam power divider network, the third beam power divider network, and the fourth beam power divider network via the multi-channel chips.

4. The multi-beam phased array according to claim 3, characterized in that, The multi-beam phased array also includes a power divider; the antenna element has two feed points, each of which is electrically connected to one of the power dividers, and the power divider is electrically connected to the multi-channel chip.

5. The multi-beam phased array according to claim 4, characterized in that, The array is configured with four antenna elements arranged in a rotating layout.

6. The multi-beam phased array according to claim 5, characterized in that, The array has four antenna elements with eight feed points, each of which is connected to a power divider. One end of the power divider is connected to one of the multi-channel chips, and the other end of the power divider is connected to another multi-channel chip. The two multi-channel chips are connected to the first beam power divider network, the second beam power divider network, the third beam power divider network, and the fourth beam power divider network.

7. The multi-beam phased array according to claim 6, characterized in that, The multichannel chip includes an electrically adjustable phase shifter, an electrically adjustable attenuator, and a low-noise amplifier.

8. The multi-beam phased array according to any one of claims 1-7, characterized in that, The multi-beam phased array further includes digital traces and power traces. The digital traces are disposed on the first microwave board and / or on the second microwave board and / or on the third microwave board; the power traces are disposed on the second microwave board and / or on the third microwave board.

9. The multi-beam phased array according to claim 8, characterized in that, The second microwave board includes a first sub-microwave board, a second sub-microwave board, a third sub-microwave board, and a fourth sub-microwave board stacked together; the multi-beam phased array also includes digital traces and power traces, which are disposed between the second sub-microwave board and the third sub-microwave board.

10. The multibeam phased array according to any one of claims 1-7, characterized in that, The multi-beam phased array further includes a first structural cavity and a second structural cavity, wherein the first structural cavity is located between the first microwave plate and the second microwave plate, and the second structural cavity is located between the second microwave plate and the third microwave plate.

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