Connection member and electrical connection unit

Abstract

The connection member connects the bus bar and the member to be connected. The connecting member includes: a first portion extending in a first direction; a second portion that extends in a second direction intersecting the first direction from one end of the first portion in the first direction, faces the bus bar in the first direction, and is fixed to the bus bar; and the heat dissipation structure is connected with the first part and the second part. The first portion has a first mounting hole facing the member to be connected, and the second portion has a second mounting hole penetrating through the second portion in the first direction and facing the bus bar. The heat dissipation structure comprises one or more fins extending in the first direction and the second direction, and the fins are connected with the first part and connected with the portion, away from the second installation hole, in the second part.

Description

Technical Field

[0001] Embodiments of the present invention relate to connecting components and electrical connection units. Background Technology

[0002] An electrical connection unit is known, comprising: a housing that houses electronic components; and a busbar mounted in an upright position on the housing.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2024-037492 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] However, the electrical connection unit expects improved heat dissipation of the connection components (heat storage components).

[0008] One embodiment provides a connection component and an electrical connection unit that can improve the heat dissipation of the connection component.

[0009] Technical means for solving problems

[0010] One embodiment of the connecting member connects a busbar to a connecting component. The connecting member includes: a first portion extending along a first direction; a second portion extending from one end of the first portion along a second direction intersecting the first direction, facing and fixed to the busbar in the first direction; and a heat dissipation structure connected to the first and second portions. The first portion has a first mounting hole facing the connecting component, and the second portion has a second mounting hole penetrating the second portion in the first direction and facing the busbar. The heat dissipation structure includes one or more fins extending along the first and second directions, the fins being connected to the first portion and to a portion of the second portion that avoids the second mounting hole.

[0011] One embodiment of the electrical connection unit includes a busbar, a connection object component, and the aforementioned connection component.

[0012] Invention Effects

[0013] According to one embodiment, the heat dissipation of the connecting components can be improved. Attached Figure Description

[0014] Figure 1 This is a cross-sectional view of the electrical connection unit illustrating an embodiment.

[0015] Figure 2 This is a perspective view used to illustrate the main body of the embodiment.

[0016] Figure 3 This is a perspective view of a subunit used to illustrate an embodiment.

[0017] Figure 4 This is a perspective view showing a portion of a subunit of the embodiment exploded.

[0018] Figure 5 This is a perspective view illustrating the electronic components and connecting components of the embodiment.

[0019] Figure 6 This is a perspective view illustrating the electronic components and connecting components of the embodiment.

[0020] Figure 7 This is a perspective view showing the connecting components of an embodiment.

[0021] Figure 8 This is a perspective view of a wiring substrate illustrating an embodiment.

[0022] Figure 9 This is a perspective view showing an exploded view of a portion of the wiring substrate of the embodiment.

[0023] Figure 10 This is a top view of the wiring substrate illustrating an embodiment.

[0024] Figure 11 This is a perspective view showing an exploded view of a portion of the connection unit in the embodiment.

[0025] Figure 12 This is a bottom view of the wiring substrate illustrating an embodiment.

[0026] Figure 13 It is along Figure 10 The structure shown is a cross-sectional view along line AA.

[0027] Figure 14 This is a perspective view showing the three-dimensional wiring structure of the busbar according to an embodiment.

[0028] Figure 15 This is a top view of the three-dimensional wiring structure of the busbar in an embodiment.

[0029] Figure 16 This is a cross-sectional view used to illustrate the structure related to the connecting components in the embodiment.

[0030] Figure 17 This is a perspective view illustrating the connecting components of the embodiment.

[0031] Figure 18 This is a perspective view illustrating a first structure in which a heat sink is provided on the connecting component in an embodiment.

[0032] Figure 19This is a perspective view illustrating the second structure in which a heat sink is provided on the connecting component in the embodiment.

[0033] Figure 20 This is a perspective view illustrating a third structure in which a heat sink is provided on the connecting component in an embodiment.

[0034] Figure 21 Viewed from the Z direction Figure 20 A top view of the checkered pattern. Detailed Implementation

[0035] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following description, structures having the same or similar functions will be labeled with the same reference numerals. Furthermore, repeated descriptions of these structures may be omitted. Additionally, the structures described below do not limit the scope of the embodiments.

[0036] In this disclosure, the terms are defined as follows: "Connection" is not limited to mechanical connections and may include electrical connections. That is, "connection" is not limited to the case where two elements are directly connected, but may also include the case where two elements are connected by intervening other elements. "Containment" is not limited to the case where the entire component is contained, but may also include the case where only a portion of the component is contained (the remaining portion of the component protrudes). "Orientation" refers to the overlapping of imaginary projections of two objects when viewed from a specific direction. That is, "orientation" is not limited to the case where two objects are directly facing each other, but may also include the case where two objects are facing each other with other components present between them. "Parallel," "orthogonal," or "identical" may respectively include cases of "approximately parallel," "approximately orthogonal," or "approximately identical."

[0037] In this disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows. The +X direction is the direction from the first end 80e1 of the metal plate 80 (described later) toward the second end 80e2 (see reference). Figure 11 The -X direction is the opposite of the +X direction. Hereinafter, without distinguishing between the +X and -X directions, it will be simply referred to as the "X direction". The +Y and -Y directions are directions that intersect (e.g., are perpendicular to) the X direction. The +Y direction is the direction from the third end 80e3 of the metal plate 80 described later toward the fourth end 80e4 (see reference). Figure 11 The -Y direction is the opposite of the +Y direction. Hereinafter, without distinguishing between the +Y and -Y directions, it will be simply referred to as the "Y direction". The +Z and -Z directions are directions that intersect (e.g., are orthogonal) the X and Y directions. The +Z direction is the direction from the metal plate 80 described later toward the main body MU (see reference). Figure 1The -Z direction is the opposite of the +Z direction. Hereinafter, without distinguishing between the +Z and -Z directions, it will be simply referred to as the "Z direction". The Z direction is an example of the "first direction". The X direction is an example of the "second direction". The Y direction is an example of the "third direction".

[0038] Hereinafter, without distinguishing between the X and Y directions, it will sometimes be referred to as the "horizontal direction". Hereinafter, the Z direction will sometimes be referred to as the "vertical direction". In addition, hereinafter, the +Z direction side will sometimes be referred to as "up" and the -Z direction side will sometimes be referred to as "down". However, these expressions are for ease of explanation and do not limit the direction of gravity of the electrical connection unit 1 (the setting posture of the electrical connection unit 1).

[0039] (Example)

[0040] <1. Structure of the Electrical Connection Unit>

[0041] Figure 1 This is a cross-sectional view illustrating the electrical connection unit 1 of an embodiment. The electrical connection unit 1 is, for example, an on-board device installed in vehicles such as EVs (Electric Vehicles), HEVs (Hybrid Electric Vehicles), or PHEVs (Plug-in Hybrid Electric Vehicles). The electrical connection unit 1 may also be referred to as an "electrical connection box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0042] Electrical connection unit 1, for example, includes a main body MU, a metal plate (support member) 80, and an insulating sheet 91 (see reference). Figure 11 ), multiple heat-conducting components 92 and an insulating cover 93.

[0043] <2. Main Body>

[0044] First, let's explain the main body MU.

[0045] Figure 2 This is a perspective view illustrating the main body MU. The main body MU is the part that implements the main functions of the electrical connection unit 1 (e.g., switching of electrical connection states or overcurrent protection). In this embodiment, the main body MU is divided into multiple sub-units SU. The main body MU is formed by connecting multiple sub-units SU. In this embodiment, the main body MU has 3 sub-units SU (sub-units SUX, SUY, and SUZ). Each sub-unit SU can also be referred to as a "circuit structure".

[0046] The sub-unit SUX has a primary electrical function. The sub-unit SUX includes, for example, multiple electronic components 10X and a first wiring substrate 40X. The multiple electronic components 10X are electrically connected to the first wiring substrate 40X.

[0047] The subunit SUY has a secondary electrical function. This secondary function is different from the primary function. The subunit SUY includes, for example, multiple electronic components 10Y and a second wiring substrate 40Y. The multiple electronic components 10Y are electrically connected to the second wiring substrate 40Y.

[0048] The subunit SUZ has a third electrical function. This third function is different from the first and second functions. The subunit SUZ includes, for example, multiple electronic components 10Z and a third wiring substrate 40Z. The multiple electronic components 10Z are electrically connected to the third wiring substrate 40Z.

[0049] In this embodiment, three sub-units SUX, SUY, and SUZ are arranged in the X direction. For example, sub-unit SUX is positioned relative to sub-unit SUY on the +X direction side. Sub-units SUX and SUY are electrically connected via multiple connecting busbars 75 spanning the first wiring substrate 40X and the second wiring substrate 40Y. On the other hand, sub-unit SUZ is positioned relative to sub-unit SUY on the -X direction side. Sub-units SUZ and SUY are connected via multiple connecting busbars 75 spanning the third wiring substrate 40Z and the second wiring substrate 40Y (in... Figure 2 (Only one is shown in the figure) and electrically connected. The connecting busbar 75 is arranged on the side opposite to the metal plate 80 relative to the multiple sub-units SU.

[0050] In this embodiment, the three wiring substrates 40X, 40Y, and 40Z contained in the three subunits SUX, SUY, and SUZ are arranged on the same plane. In other words, the three wiring substrates 40X, 40Y, and 40Z are arranged at the same height in the Z direction. Therefore, the three wiring substrates 40X, 40Y, and 40Z form a large wiring substrate 40M.

[0051] In this embodiment, the three subunits SUX, SUY, and SUZ have the same or similar basic structures. Therefore, the following detailed description will focus on one subunit SU. Hereinafter, without distinguishing between the subunits SUX, SUY, and SUZ, they will be simply referred to as "subunit SU". Furthermore, without distinguishing between electronic component 10X, electronic component 10Y, and electronic component 10Z, they will be simply referred to as "electronic component 10". Additionally, without distinguishing between the first wiring substrate 40X, the second wiring substrate 40Y, and the third wiring substrate 40Z, they will be simply referred to as "wiring substrate 40".

[0052] Furthermore, instead of the above example, the main body MU may not be divided into multiple sub-units SU. That is, the main body MU may be formed from multiple electronic components 10 and a wiring substrate 40. In addition, two or more sub-units SU are not limited to sub-units SU with different functions, but may also be sub-units SU with the same function.

[0053] <3. Structure of Subunits>

[0054] Next, the structure of the subunit SU will be explained.

[0055] Figure 3 This is a three-dimensional diagram used to illustrate the subunit SU. Figure 4 This is a perspective view showing a portion of a subunit SU exploded. The subunit SU includes, for example, multiple electronic components 10, multiple connecting components 20 for connecting components, multiple connecting components 30 for external connections, and a wiring substrate 40. The connecting components 20 and 30 are components that form vertical power paths. The connecting components 20 and 30 can also be referred to as "vertical wiring components."

[0056] <3.1 Electronic components and connecting components for connecting components>

[0057] First, the electronic component 10 and the connecting component 20 for connecting the components will be described.

[0058] Electronic component 10 is an electronic component mounted according to the functions required by the subunit SU. Electronic component 10 may be, for example, a connector, fuse, relay (e.g., a mechanical relay or a semiconductor relay), capacitor, branch component, various sensors (e.g., current sensors or voltage sensors), electronic control unit, or an electronic component unit composed of two or more of these. Furthermore, the types of electronic component 10 are not limited to the examples described above. Electronic component 10 may be, for example, a heat-generating component that generates heat when energized. Hereinafter, examples of electronic component 10 will be described, including a first type of electronic component 10M and a second type of electronic component 10N.

[0059] The connecting member 20 is a component that electrically connects the electronic component 10 to the wiring substrate 40. The connecting member 20 forms part of the power path in the subunit SU. The connecting member 20 is made of metal (e.g., copper or a copper alloy). The connecting member 20 may also be referred to as a "metal component". Hereinafter, examples of the connecting member 20 will be described, including a first type of connecting member 20M and a second type of connecting member 20N. Similarly, the connecting members 30 and 100 described later may also be referred to as "metal components".

[0060] <3.1.1 Type 1 Electronic Components>

[0061] Figure 5This is a perspective view showing a first type of electronic component 10M and a first type of connecting component 20M. The first type of electronic component 10M is an electronic component in which a plurality of terminals 13 are arranged at one end. The electronic component 10M, for example, has a housing 11, a component body 12, a plurality of terminals 13, and a plurality of mounting portions 14.

[0062] (case)

[0063] The housing 11 is the outer contour component that forms most of the external shape of the electronic component 10M. The housing 11 is made of, for example, synthetic resin and has insulating properties. The housing 11 houses the main body portion 12 of the component. Alternatively, the housing 11 and the main body portion 12 of the component can be formed integrally.

[0064] In this embodiment, the housing 11 has an insulating rib 11a that protrudes in a horizontal direction (e.g., the X direction) and extends in a Z direction. The insulating rib 11a is, for example, plate-shaped along both the horizontal (e.g., X direction) and Z direction. The insulating rib 11a extends, for example, along the entire length of the housing 11 in the Z direction. The insulating rib 11a is disposed between a plurality of terminals 13 (terminals 13A and 13B, described later). The insulating rib 11a electrically insulates between terminals 13A and 13B. Additionally, in this embodiment, a portion of the insulating rib 11a is disposed between the first portions 21 (described later) of two connecting members 20M connected to the electronic component 10M. The insulating rib 11a electrically insulates between the first portions 21 of the two connecting members 20M connected to the electronic component 10M.

[0065] (Main body of the component)

[0066] The main body 12 is the part that performs the main functions of the electronic component 10M. For example, if the electronic component 10M is a relay, the main body 12 includes a switching part (e.g., a contact part) that switches between an on and off state. For example, if the electronic component 10M is a fuse, the main body 12 includes a fuse-breaking part that melts when an overcurrent flows. For example, if the electronic component 10M is a capacitor, the main body 12 includes a part that stores charge.

[0067] (terminal)

[0068] Terminal 13 is an electrical connection portion exposed to the outside of housing 11. Terminal 13 is electrically connected to the main body 12 of component inside housing 11. In this embodiment, electronic component 10M includes terminals 13A and 13B as a plurality of terminals 13. One of terminals 13A and 13B is a positive terminal. The other of terminals 13A and 13B is a negative terminal.

[0069] In this embodiment, terminals 13A and 13B are disposed at one end of the electronic component 10M in a horizontal direction (e.g., the X direction). Terminals 13A and 13B are arranged side by side in a horizontal direction (e.g., the Y direction). Each terminal 13 has a mounting hole 13h for mounting with a fastening member 71 (e.g., a screw or bolt), described later. The mounting hole 13h is open in the horizontal direction (e.g., the X direction). The inner circumferential surface of the mounting hole 13h of the electronic component 10M has a threaded groove.

[0070] (Installation Department)

[0071] Mounting section 14 is a part used to fix electronic component 10M. Mounting section 14 has fastening components 112 (e.g., screws or bolts, see below) for fastening later. Figure 11 The mounting hole 14h is for installation. The mounting hole 14h is open in the Z direction. The mounting hole 14h is a through hole through which the fastening member 112 passes. The object to be fastened to the mounting part 14 will be described later.

[0072] <3.1.2 First type of connecting parts>

[0073] The first type of connecting member 20M is a member disposed between the first type of electronic component 10M and the wiring substrate 40. In this embodiment, the connecting member 20M connects the electronic component 10M and the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 8 Electrical connection. The connection component 20M, for example, has a first portion 21 erected above the wiring substrate 40 and a second portion 22 disposed along the wiring substrate 40.

[0074] (Part 1)

[0075] The first portion 21 of the connecting member 20M is the portion that connects to the terminal 13 of the electronic component 10M. The first portion 21 is a plate-shaped or cuboid portion extending along the Z direction. The first portion 21 extends along one end of the electronic component 10M (e.g., the end in the X direction). The first portion 21 is an erected portion in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42 described later). The first portion 21 is adjacent to the electronic component 10M in the horizontal direction (e.g., the X direction). For example, the first portion 21 is adjacent to the terminal 13 of the electronic component 10M in the horizontal direction (e.g., the X direction) and connected to the terminal 13 of the electronic component 10M from the horizontal direction (e.g., the X direction).

[0076] The first portion 21 of the connecting component 20M has a mounting hole (hereinafter referred to as the second mounting hole) 21h through which a fastening component 71 (e.g., a screw or bolt) passes. The second mounting hole 21h opens in the horizontal direction (e.g., the X direction). Additionally, the first portion 21 has a recess 25 around the second mounting hole 21h. The recess 25 is a receiving portion for accommodating the head of the fastening component 71 inserted into the second mounting hole 21h. The second mounting hole 21h is opposite to the terminal 13 of the electronic component 10M in the X direction. By engaging the fastening component 71 passing through the second mounting hole 21h with the mounting hole 13h of the terminal 13 of the electronic component 10M, the first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10M. Alternatively, the first portion 21 may not have the recess 25.

[0077] Figure 17 This is a perspective view showing the structure that the connecting parts 20, 30, and 100 of this embodiment can adopt. Figure 17 In the accompanying drawings, reference numeral 20A is used to collectively refer to connecting parts 20, 30, and 100, and reference numerals 21A, 21hA, 21hB, 22A, and 22hA are used to collectively refer to the first part, first mounting hole, second mounting hole, second part, and third mounting hole of each connecting part, respectively. Figure 17 The diagram only shows the common structure of the connecting parts.

[0078] Figure 17 The first part 21A shown includes: a first mounting part 21fA containing a first mounting hole 21hA, which uses a fastening member F1 (fastening member 72, etc.) along the Z direction to mount (fix) a connecting object component (a second type of electronic component 10N, busbar 75, 76, etc.) from the Z direction; and a second mounting part 21fB containing a second mounting hole 21hB, which uses a fastening member F2 (fastening member 71, etc.) along the X direction to mount (fix) other connecting object components (a first type of electronic component 10M, etc.) from the X direction.

[0079] Additionally, the second part 22A includes a third mounting portion 22fA containing a third mounting hole 22hA. The third mounting portion 22fA can be mounted (fixed) to the busbar 42 (see reference) using a fastening member (fastening member 43, etc.) along the Z direction. Figure 8 ).

[0080] In the first part 21A, the first mounting portion 21fA and the second mounting portion 21fB are arranged offset from each other in the Y direction. The offset D1 in the Y direction between the first mounting portion 21fA and the second mounting portion 21fB corresponds to the Y-direction interval between the center A1 of the first mounting hole 21hA and the center B1 of the second mounting hole 21hB. The offset D1 can be set such that the first mounting hole 21hA and the second mounting hole 21hB do not overlap in the Y direction.

[0081] The second mounting portion 21fB of the first part 21A and the third mounting portion 22fA of the second part 22A are arranged offset from each other in the Y direction. The offset D2 in the Y direction between the second mounting portion 21fB and the third mounting portion 22fA corresponds to the Y-direction interval between the center B1 of the second mounting hole 21hB and the center C1 of the third mounting hole 22hA. The offset D2 can be set such that the second mounting hole 21hB and the third mounting hole 22hA do not overlap in the Y direction.

[0082] The offsets D1 and D2 are all different. Therefore, the first mounting portion 21fA of the first part 21A and the third mounting portion 22fA of the second part 22A are arranged offset from each other in the Y direction. The offset in the Y direction between the first mounting portion 21fA and the third mounting portion 22fA corresponds to the Y-direction interval between the center A1 of the first mounting hole 21hA and the center C1 of the third mounting hole 22hA.

[0083] (Part Two)

[0084] return Figure 5 The second part 22 of the connecting component 20M is connected to the busbar 42 (see reference). Figure 8 The second part 22 protrudes horizontally (e.g., in the X direction) from the end (base end) of the first part 21 in the -Z direction. The second part 22 is a plate portion along the horizontal direction. The second part 22 is adjacent (coincides) with the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The lower surface (the surface on the -Z direction side, including the lower surface of the first part 21) 22s of the second part 22 faces the upper surface (the surface on the +Z direction side) 42s of the busbar 42 in the Z direction. The lower surface 22s of the connecting member 20M abuts against the upper surface 42s of the busbar 42. In this state, the connecting member 20M is fixed to the busbar 42. Sometimes the lower surfaces 22s, 32s, and 102s of the connecting members 20, 30, and 100 in this embodiment are collectively referred to as the opposing surfaces 22As that face the upper surface 42s of the busbar 42 in the Z direction.

[0085] The second part 22 of the connecting component 20M is mounted from the Z direction to the fastening component 43 (e.g., screw or bolt, see reference) protruding from the busbar 42 in the +Z direction. Figure 8It is physically and electrically connected to the busbar 42. In this embodiment, the second part 22 of the connecting member 20M has a third mounting hole 22h through which the fastening member 43 passes. The third mounting hole 22h is open in the Z direction. The third mounting hole 22h of the second part 22 is passed through by the fastening member 43, which will be described later. And, by making the engaging member 44 (e.g., a nut, see...) Figure 3 The first part 21 engages with the end of the fastening member 43 passing through the third mounting hole 22h, thereby fixing the second part 22 to the busbar 42. In this embodiment, a connecting member 20M is formed in an L-shape by the first part 21 and the second part 22.

[0086] <3.1.3 Second Type of Electronic Components>

[0087] Figure 6 This is a perspective view showing a second type of electronic component 10N and a second type of connecting component 20N. The second type of electronic component 10N is an electronic component with two terminals 13 separately disposed at both ends in the horizontal direction. The electronic component 10N, for example, has a housing 11, a main body 12, and a plurality of terminals 13. Furthermore, in the structure of the electronic component 10N, structures having the same function as electronic component 10M are labeled with the same reference numerals. In this case, for the description of the electronic component 10N, "electronic component 10M" in the above description of electronic component 10M will be replaced with "electronic component 10N".

[0088] In electronic component 10N, terminals 13A and 13B are separately disposed at opposite ends of electronic component 10N in the horizontal direction (e.g., the X direction). Each terminal 13 has a mounting hole 13h for mounting a fastening member 72 (e.g., a screw or bolt), described later. The mounting hole 13h opens in the Z direction. For example, the mounting hole 13h of each terminal 13 is a through hole through which the fastening member 72 passes.

[0089] <3.1.4 Second type of connecting component>

[0090] The second type of connection member 20N is a member that electrically connects the second type of electronic component 10N to the wiring substrate 40. In this embodiment, the connection member 20N connects the electronic component 10N to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 8 Electrical connection. The connecting component 20N has, for example, a first part 21, a second part 22, and a third part 23.

[0091] (Part 1)

[0092] The first portion 21 of the connecting member 20N is the portion that connects to the terminal 13 of the electronic component 10N. The first portion 21 is a cuboid portion extending along the Z direction. The first portion 21 is an erected portion that stands upright in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42). The first portion 21 is adjacent (coincides) to the terminal 13 of the electronic component 10N in the Z direction and is connected to the terminal 13 of the electronic component 10N from the Z direction. The first portion 21 of the connecting member 20N has a first mounting hole 21h for engaging with the fastening member 72. The first mounting hole 21h is open in the Z direction. The inner peripheral surface of the first mounting hole 21h of the connecting member 20N has a threaded groove. In this disclosure, "mounting hole" can be a threaded hole or a through hole without a threaded groove. The first mounting hole 21h is opposite to the terminal 13 of the electronic component 10N in the X direction. By engaging the fastening member 72, which passes through the mounting hole 13h of the terminal 13 of the electronic component 10N, with the first mounting hole 21h of the first part 21, the first part 21 is physically and electrically connected to the terminal 13 of the electronic component 10N.

[0093] The connecting component 20N in this embodiment can adopt a structure such as... Figure 17 As shown.

[0094] (Part Two)

[0095] The second part 22 of the connecting component 20N is connected to the busbar 42 (see reference). Figure 8 The second part 22 protrudes horizontally (e.g., in the X direction) from the end (base end) of the first part 21 in the -Z direction. The second part 22 is a plate portion along the horizontal direction. The second part 22 is adjacent to (coincides with) the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The lower surface (the surface on the -Z direction side, including the lower surface of the first part 21) 22s of the second part 22 faces the upper surface (the surface on the +Z direction side) 42s of the busbar 42 in the Z direction. The lower surface 22s of the connecting member 20N abuts against the upper surface 42s of the busbar 42. In this state, the connecting member 20N is fixed to the busbar 42.

[0096] The second part 22 of the connecting component 20N is mounted from the Z direction to the fastening component 43 (e.g., screw or bolt, see reference) protruding from the busbar 42 in the +Z direction. Figure 8 It is physically and electrically connected to the busbar 42. In this embodiment, the second portion 22 of the connecting member 20N has a third mounting hole 22h through which the fastening member 43 passes. The third mounting hole 22h opens in the Z direction. In the second portion 22, the fastening member 43, described later, passes through the third mounting hole 22h. And, by engaging the engaging member 44 (e.g., a nut, see...) Figure 3The second part 22 engages with the end of the fastening member 43 that passes through the third mounting hole 22h, thereby fixing the second part 22 to the busbar 42.

[0097] (Part Three)

[0098] The third part 23 is an upright wall (side wall) that rises from both ends of the second part 22 in the horizontal direction towards the +Z direction. The third part 23 is a wall along the Z direction. The third part 23 is connected to the first part 21 and to the second part 22. The third part 23 extends obliquely, for example, in a manner that widens in the X direction as it moves towards the -Z direction. Furthermore, the third part 23 may also be provided in the connecting member 20M described above. On the other hand, the connecting member 20N may not have the third part 23. The third part 23 can be understood as an example of the heat sink 24f in this embodiment.

[0099] <3.2 Connecting components for external connections>

[0100] Next, the connecting component 30 for external connection will be described.

[0101] Figure 7 This is a perspective view showing the connection member 30 for external connection. The connection member 30 is a component that electrically connects the external connection busbar 76 to the wiring substrate 40. In this embodiment, the connection member 30 connects the external connection busbar 76 to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 8 Electrical connection. The external connection is electrically connected to the external device via busbar 76. In this disclosure, "external device" refers to an electrical device located outside the electrical connection unit 1. External devices may be, for example, a battery cell mounted on a vehicle, or an inverter for driving a vehicle's motor, but are not limited to these examples. The connection component 30 may have, for example, a first portion 31, a second portion 32, and a third portion 33.

[0102] (Part 1)

[0103] The first portion 31 is the part connected to the external connection busbar 76. The first portion 31 is a cuboid portion extending along the Z direction. The first portion 31 is an erected portion that stands upright in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42). The first portion 31 is adjacent to the external connection busbar 76 in the Z direction and is connected to the external connection busbar 76 from the Z direction. The first portion 31 has a first mounting hole 31h through which a fastening member 73 (e.g., a screw or bolt) passes. The first mounting hole 31h is open in the Z direction. The inner peripheral surface of the first mounting hole 31h has a threaded groove. In this disclosure, "mounting hole" can be a threaded hole or a through hole without a threaded groove. By engaging the fastening member 73 passing through the mounting hole 76h of the external connection busbar 76 with the mounting hole 31h of the first portion 31, the first portion 31 is physically and electrically connected to the external connection busbar 76.

[0104] The connecting component 30 in this embodiment can adopt a structure such as... Figure 17 As shown.

[0105] (Part Two)

[0106] Part 2, 32, is related to busbar 42 (see reference). Figure 8 The second part 32 protrudes horizontally (e.g., in the X direction) from the end (base end) of the first part 31 in the -Z direction. The second part 32 is a plate portion along the horizontal direction. The second part 32 is adjacent to (coincides with) the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The lower surface (the surface on the -Z direction side, including the lower surface of the first part 31) 32s of the second part 32 faces the upper surface (the surface on the +Z direction side) 42s of the busbar 42 in the Z direction. The lower surface 32s of the connecting member 30 abuts against the upper surface 42s of the busbar 42. In this state, the connecting member 30 is fixed to the busbar 42.

[0107] The second part 32 of the connecting component 30 is mounted from the Z direction to the fastening component 43 (e.g., screw or bolt, see reference) protruding from the busbar 42 in the +Z direction. Figure 8 The second part 32 is physically and electrically connected to the busbar 42. In this embodiment, the second part 32 has a third mounting hole 32h through which the fastening member 43 passes. The third mounting hole 32h opens in the Z direction. In the second part 32, the fastening member 43, described later, passes through the third mounting hole 32h. And, by engaging the locking member 44 (e.g., a nut, see...) Figure 3 The second part 32 engages with the end of the fastening member 43 that passes through the third mounting hole 32h, thereby fixing the second part 32 to the busbar 42.

[0108] (Part Three)

[0109] The third part 33 is an upright wall (side wall) that rises from both ends of the second part 32 in the horizontal direction towards the +Z direction. The third part 33 is a wall along the Z direction. The third part 33 is connected to the first part 31 and to the second part 32. The third part 33 extends obliquely, for example, in a manner that widens in the X direction (or Y direction) as it moves towards the -Z direction. Alternatively, the connecting member 30 may not have the third part 33. The third part 33 can be understood as an example of the heat sink 24f in this embodiment.

[0110] <3.3 Substrate for Wiring>

[0111] Next, the wiring substrate 40 will be described.

[0112] Figure 8 This is a perspective view showing a wiring substrate 40. The wiring substrate 40 is a component that forms at least a portion of the power path between a plurality of electronic components 10 and / or at least a portion of the power path between the electronic components 10 and an external device. In this disclosure, "wiring substrate" refers to a substrate-type wiring structure. "Substrate-type" means that, regardless of its fine shape, it is plate-shaped along a plane when viewed as a whole. It should be noted that in this disclosure, "plate-shaped," "sheet-shaped," or "plane" is not limited to a completely flat case, and may include cases where there are fixing structures, ribs, etc., that protrude in the Z direction locally, or cases where there are uneven shapes on the surface that follow the thickness of the busbar, etc. In this embodiment, the wiring substrate 40 is plate-shaped along both the X and Y directions.

[0113] The wiring substrate 40 includes, for example, a base plate 41, one or more busbars 42, and multiple fastening members 43. In this embodiment, the base plate 41 and the multiple busbars 42 are integrated by insert molding. For example, after the fastening members 43 are fixed to the busbars 42, the busbars 42 are insert-molded with the base plate 41, thereby forming the wiring substrate 40 into a sheet-like component. That is, the busbars 42 are integrated with the base plate 41 without using fastening members such as screws or bolts. Alternatively, the wiring substrate 40 may be formed by other structures instead of insert molding. For example, it may be a structure in which an opening (corresponding to the receiving portion 55 described later) is formed in the wiring substrate 40, which is formed separately from the busbars 42, to fix the busbars 42 by embedding or the like, and the busbars 42 are fixed in the opening to form a busbar embedding plate.

[0114] Figure 9 This is an exploded perspective view of a portion of the wiring substrate 40. Hereinafter, for ease of explanation, the substrate 41, busbar 42, and fastening member 43 will be described with reference to the exploded view of the wiring substrate 40.

[0115] (Substrate board)

[0116] The substrate 41 is a retaining member that integrally holds a plurality of busbars 42 arranged horizontally and spaced apart from each other. The substrate 41 is, for example, made of synthetic resin and has insulating properties. The substrate 41 provides electrical insulation between the plurality of busbars 42. The substrate 41 is an example of a "substrate component." The substrate 41 can also be referred to as an "insulating substrate." The substrate 41, for example, has a planar portion 51 and a plurality of fixing portions 52.

[0117] The planar portion 51 is a plate-shaped portion formed in the substrate plate 41. The planar portion 51 is plate-shaped along the horizontal direction. The planar portion 51 forms the main part of the substrate plate 41. The planar portion 51 forms the base (insulating base) of the substrate plate 41. In this embodiment, the planar portion 51 extends throughout the entire range of the substrate plate 41 in the X direction, except for the four corners of the substrate plate 41, and extends throughout the entire range of the substrate plate 41 in the Y direction.

[0118] The planar portion 51 has a first surface 51a and a second surface 51b. The first surface 51a is a surface facing the +Z direction. The first surface 51a is a plane along the horizontal direction. The first surface 51a faces the plurality of electronic components 10 and faces the insulating cover 93 of the electrical connection unit 1 (see reference). Figure 1 The second surface 51b is located on the opposite side to the first surface 51a. The second surface 51b is a surface facing the -Z direction. The second surface 51b is a plane along the horizontal direction. The second surface 51b faces the metal plate 80 (see reference). Figure 1 The thickness direction (plate thickness direction) of the planar portion 51 is the Z direction.

[0119] The planar portion 51 may have one or more receiving portions 55, for example, each receiving a busbar 42. The multiple receiving portions 55 are formed separately from each other in the X or Y direction. Each receiving portion 55 is, for example, a through hole penetrating the planar portion 51 in the Z direction. It should be noted that the receiving portion 55 may also be a recess provided on the first surface 51a or the second surface 51b of the planar portion 51 and recessed in the Z direction, rather than a through hole. It should also be noted that in this disclosure, "the receiving portion penetrating the planar portion in the first direction (Z direction)" may also include a portion of the total length of the receiving portion 55 penetrating the planar portion 51 in the Z direction (for example, the remaining portion of the receiving portion 55 may be a recessed portion in the Z direction, or it may be a form provided inside the base plate 41 and not exposed to the outside of the base plate 41). Similarly, in this disclosure, "the receiving portion is recessed in the first direction (Z direction)" may also include a portion of the entire length of the receiving portion 55 that is recessed in the Z direction (for example, the remaining portion of the receiving portion 55 may be a through hole that penetrates the planar portion 51 in the Z direction, or it may be a form that is provided inside the base plate 41 and does not expose to the outside of the base plate 41).

[0120] Viewed from the Z direction, each receiving portion 55 has a shape corresponding to the shape of the received busbar 42. In this embodiment, the planar portion 51 includes, for example, five receiving portions 55A, 55B, 55C, 55D, and 55E as a plurality of receiving portions 55. Receiving portion 55A is provided corresponding to busbar 42A (described later) and receives busbar 42A. Receiving portion 55B is provided corresponding to busbar 42B (described later) and receives busbar 42B. Receiving portion 55C is provided corresponding to busbar 42C (described later) and receives busbar 42C. Receiving portion 55D is provided corresponding to busbar 42D (described later) and receives busbar 42D. Receiving portion 55E is provided corresponding to busbar 42E (described later) and receives busbar 42E.

[0121] (Busbar)

[0122] Busbar 42 is a wiring component (electrical connection component) included in the wiring substrate 40. Busbar 42 is, for example, a wiring component for electrically connecting multiple electronic components 10. Alternatively, busbar 42 can also be a wiring component for connecting electronic components 10 to external devices. Busbar 42 is made of metal (e.g., copper or copper alloy) and is conductive. In this embodiment, the wiring substrate 40 has, for example, five busbars 42A, 42B, 42C, 42D, and 42E as a plurality of busbars 42. The five busbars 42A, 42B, 42C, 42D, and 42E are arranged horizontally with intervals between them. The five busbars 42A, 42B, 42C, 42D, and 42E include portions arranged on the same plane. The five busbars 42A, 42B, 42C, 42D, and 42E are held by the planar portion 51 of the substrate 41.

[0123] At least a portion of each busbar 42 is plate-shaped along the horizontal direction. At least a portion of each busbar 42 is housed in a housing portion 55 and extends along a planar portion 51. That is, at least a portion of each busbar 42 extends along a first surface 51a of the planar portion 51. At least a portion of each busbar 42 extends horizontally within the housing portion 55. In this embodiment, each busbar 42 is plate-shaped along the entire horizontal direction. Each busbar 42 is housed in the housing portion 55 and extends along the planar portion 51 along its entire length. Hereinafter, the portion of each busbar 42 housed in the housing portion 55 and extending along the planar portion 51 is sometimes referred to as "plate portion 42p". The busbar 42 is a component that forms a horizontal power path. The busbar 42 may also be referred to as a "horizontal wiring component".

[0124] Figure 10 This is a top view showing the wiring substrate 40. Each busbar 42 has, for example, a first connecting portion 61, a second connecting portion 62, and an extension portion 63 on its plate portion 42p.

[0125] The first connecting portion 61 is the portion that contacts a connecting member 20 (hereinafter referred to as "first connecting member 20"). The first connecting member 20 is a connecting member that connects an electronic component 10 (hereinafter referred to as "first electronic component 10") to the busbar 42. The first connecting portion 61 is the portion of the busbar 42 that overlaps with the first connecting member 20 when viewed from the Z direction. The first connecting portion 61 is adjacent to the first connecting member 20 in the Z direction and is connected to the first connecting member 20 from the Z direction.

[0126] The second connecting portion 62 is the portion that contacts other connecting members 20 (hereinafter referred to as "second connecting members 20"). The second connecting member 20 is a connecting member that connects other electronic components 10 (hereinafter referred to as "second electronic components 10") included in a plurality of electronic components 10 to the busbar 42. The second connecting portion 62 is the portion of the busbar 42 that overlaps with the second connecting member 20 when viewed from the Z direction. The second connecting portion 62 is adjacent to the second connecting member 20 in the Z direction and is connected to the second connecting member 20 from the Z direction.

[0127] Alternatively, the second connecting portion 62 may be a portion that contacts other connecting members 30 (hereinafter referred to as "second connecting member 30") instead of the example described above. The connecting member 30 is a connecting member used to connect an external device to the busbar 42. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the second connecting member 30 when viewed from the Z direction. The second connecting portion 62 is adjacent to the second connecting member 30 in the Z direction and is connected to the second connecting member 30 from the Z direction.

[0128] Alternatively, the second connecting portion 62 may be a portion that contacts the connecting busbar 75 for connecting to other subunits SU without contacting the connecting members 20 and 30. In this case, the second connecting portion 62 is the portion of the busbar 42 that overlaps with the connecting busbar 75 when viewed from the Z direction. The second connecting portion 62 is adjacent to and connected to the connecting busbar 75 in the Z direction.

[0129] An extension 63 extends from the first connecting portion 61 along the X or Y direction. The extension 63 is disposed between the first connecting portion 61 and the second connecting portion 62. The extension 63 extends across the first connecting portion 61 and the second connecting portion 62. The extension 63 connects the first connecting portion 61 and the second connecting portion 62.

[0130] In this embodiment, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are plate-shaped along the horizontal direction. In this embodiment, each busbar 42 is housed in the housing portion 55 and extends along the planar portion 51, at least covering the first connecting portion 61 and the second connecting portion 62. For example, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are housed in the housing portion 55 and extend along the planar portion 51.

[0131] In this embodiment, some extensions 63 of the busbars 42 are housed in the housing portion 55, extending through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. For example, the extension 63 has a portion extending linearly along the X direction. This portion extends through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across the +X and -X direction sides of the region R. That is, since the busbars 42 are housed in the housing portion 55, they are not hindered by the presence of the electronic component 10 and can be easily laid out with a better path (e.g., a shorter path).

[0132] In addition, one or more busbars 42 may have an extension 64 in addition to the first connecting portion 61, the second connecting portion 62, and the extension portion 63. The extension portion 64 is a portion of the busbar 42 that is extended or branched for the purpose of increasing the heat dissipation area and / or increasing the heat capacity for heat storage (heat absorption). The extension portion 64 is not used for electrical connection. For example, the extension portion 64 is located on the side opposite to the extension portion 63 relative to the first connecting portion 61 (or the second connecting portion 62). The extension portion 64 is plate-shaped along the horizontal direction. The extension portion 64 is housed in the housing portion 55 and extends along the planar portion 51. The extension portion 64 extends to the region R that overlaps with the electronic component 10 when viewed from the Z direction, and has the end 42e1 of the busbar 42 at the position where it overlaps with the electronic component 10 when viewed from the Z direction.

[0133] (Fastening components)

[0134] Next, refer to again Figure 9 The fastening component 43 will now be described. The fastening component 43 is a component used to secure the busbar 42 to a connecting component (connecting component 20, connecting component 30, or connecting busbar 75) of the busbar 42. The fastening component 43 is, for example, a riveting bolt fixed to the busbar 42. The fastening component 43 is an example of a "fastening part".

[0135] In this embodiment, the first connecting portion 61 and the second connecting portion 62 of the busbar 42 each have a through hole 42h. The through hole 42h penetrates the busbar 42 in the Z direction. The fastening member 43 is, for example, a bolt having a shaft portion 43a and a head 43b. The circumferential surface of the shaft portion 43a has a threaded groove. The diameter of the head 43b is larger than the diameter of the shaft portion 43a. With the shaft portion 43a passing through the through hole 42h of the busbar 42, the head 43b of the fastening member 43 is riveted to the busbar 42. Through this fixation, with the shaft portion 43a protruding from the through hole 42h of the busbar 42 in the +Z direction, the fastening member 43 is electrically and physically connected to the busbar 42. In addition, the fastening member 43 is not limited to riveting fixation; it can also be fixed to the busbar 42 by welding or other methods.

[0136] In this embodiment, the connecting member 20 is first fixed to the electronic component 10 by the fastening member 71 or the fastening member 72, and then mounted to the fastening member 43 in the Z direction. For example, the connecting member 20 is used to insert the shaft portion 43a of the fastening member 43 into the third mounting hole 22h of the second part 22. Then, the engaging member 44 (e.g., a nut) engages with the shaft portion 43a of the fastening member 43, which protrudes from the third mounting hole 22h of the second part 22 of the connecting member 20. The engaging member 44 is mounted to the shaft portion 43a, for example, along the Z direction. Through this engagement, the second part 22 of the connecting member 20 is fixed to the fastening member 43.

[0137] <4. Metal plates, insulating sheets, heat-conducting components, and insulating covers>

[0138] Next, the metal plate 80, the insulating sheet 91, the heat-conducting component 92, and the insulating cover 93 will be described.

[0139] <4.1 Metal Plate>

[0140] Figure 11 This is a perspective view showing an exploded portion of the electrical connection unit 1. The metal plate 80 is a component used to ensure the rigidity of the electrical connection unit 1 and improve its heat dissipation. The metal plate 80 is made of metal (e.g., aluminum or aluminum alloy). The metal plate 80 can also be referred to as a "rigid component". The metal plate 80 is a single sheet of metal.

[0141] The metal plate 80 is rectangular in shape along the X direction when viewed from the Z direction. The metal plate 80 has a first end 80e1, a second end 80e2, a third end 80e3, and a fourth end 80e4. The first end 80e1 and the second end 80e2 are a pair of ends along the long side of the metal plate 80 and are separated in the X direction. The third end 80e3 and the fourth end 80e4 are a pair of ends along the short side of the metal plate 80 and are separated in the Y direction. The metal plate 80 includes, for example, a planar portion 81, a plurality of fixing portions 82, and a plurality of fixing portions 83.

[0142] The planar portion 81 is a plate-shaped portion formed in the metal plate 80. The planar portion 81 is plate-shaped along the horizontal direction. The planar portion 81 forms the main portion of the metal plate 80. The planar portion 81 forms the base (metal base) of the metal plate 80. In this embodiment, the planar portion 81 has a size that covers three sub-units SU from below. The planar portion 81 faces the wiring substrate 40 of the three sub-units SU. In this embodiment, the metal plate 80 has a gap S1 (see reference) between it and the second surface 51b of the planar portion 51 of each sub-unit SU. Figure 13 ), and the second surface 51b of the planar portion 51 facing each subunit SU.

[0143] The fixing part 82 is a fixing part used to fix the base plate 41 of each sub-unit SU to the metal plate 80. When viewed from the Z direction, the fixing part 82 is provided at a position corresponding to the fixing part 52 of the base plate 41 of each sub-unit SU. The fixing part 82 is a cylindrical or prismatic boss that protrudes from the flat part 81 of the metal plate 80 in the +Z direction.

[0144] The fixing part 83 is used to fix the electronic components 10 of each subunit SU directly to the metal plate 80 without passing through the base plate 41. When viewed from the Z direction, the fixing part 83 is provided at a position corresponding to the mounting part 14 of the electronic components 10 of each subunit SU. The fixing part 83 is a cylindrical or prismatic boss that protrudes from the flat part 81 in the +Z direction.

[0145] <4.2 Insulating Sheets>

[0146] The insulating sheet 91 is an insulating component used to electrically insulate the metal plate 80 from the busbars 42 of each subunit SU. The insulating sheet 91 is made of a synthetic resin such as polyester or polyimide and has insulating properties. The insulating sheet 91 is rectangular in shape when viewed from the Z-direction. The insulating sheet 91 is sheet-like along the horizontal direction. The insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and the wiring substrate 40 of each subunit SU. For example, the insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and a plurality of heat-conducting components 92.

[0147] In this embodiment, the insulating sheet 91 is adhered to the flat portion 81 of the metal plate 80. The insulating sheet 91 has cutouts or openings to avoid the fixing portions 82 and 83 of the metal plate 80. Alternatively, the insulating sheet 91 may be disposed between the wiring substrate 40 of each subunit SU and the plurality of heat-conducting components 92, instead of the example described above. Furthermore, if the heat-conducting components 92 are insulating and the necessary insulation is ensured by the heat-conducting components 92, the insulating sheet 91 may be omitted.

[0148] <4.3 Thermal Conductive Components>

[0149] The thermally conductive component 92 is a component used to transfer heat generated by the electronic component 10 when energized and / or the heat (Joule heat) generated by the busbar 42 itself when energized to the metal plate 80. The thermally conductive component 92 is, for example, a flexible thermally conductive sheet (e.g., a thermally conductive silicone sheet). However, the thermally conductive component 92 is not limited to the above example and may also be a thermally conductive component formed of thermally conductive gel or other materials.

[0150] Figure 12 This is a bottom view showing the wiring substrate 40. In this embodiment, a plurality of heat-conducting components 92 are partially disposed in the wiring substrate 40. For example, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged at a position overlapping a portion of the busbar 42. Furthermore, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged near the electronic components 10 (e.g., electronic components 10A, 10B) at a position overlapping a portion of the busbar 42. In this embodiment, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged at a position overlapping the connecting component 20.

[0151] Figure 13 It is along Figure 10 The diagram shows a cross-sectional view along line AA of the structure. In this embodiment, a heat-conducting component 92 is disposed between the metal plate 80 and the busbar 42. The heat-conducting component 92 transfers heat from the electronic component 10 to the busbar 42 and / or heat emitted by the busbar 42 from the busbar 42 to the metal plate 80.

[0152] In this embodiment, a portion of the heat-conducting component 92 contacts the busbar 42 at a location where it overlaps with the connecting component 20 when viewed from the Z direction. In this case, the heat-conducting component 92 can easily transfer heat from the terminal 13 of the electronic component 10 to the connecting component 20 via the busbar 42 from the connecting component 20 to the metal plate 80.

[0153] In addition, in this embodiment, a portion of the heat-conducting component 92 is positioned to overlap with and contact the head 43b of the fastening component 43 when viewed from the Z direction. In this case, the heat-conducting component 92 facilitates the transfer of heat from the terminal 13 of the electronic component 10 to the connecting component 20 from the fastening component 43 to the metal plate 80.

[0154] Furthermore, in this embodiment, a portion of the heat-conducting component 92 contacts the busbar 42 at a location where it overlaps with the electronic component 10 when viewed from the Z direction. In this case, the heat-conducting component 92 facilitates the transfer of heat from the electronic component 10 to the busbar 42, and then from the busbar 42 to the metal plate 80. Figure 13 In the example shown, the upper surface of the busbar 42 contacts the electronic component 10, thereby thermally connecting the busbar 42 and the electronic component 10. Furthermore, the portion of the busbar 42 that is thermally connected to the electronic component 10 can be either an extension 63 or an extension 64.

[0155] <4.4 Insulating Cover>

[0156] return Figure 1 The insulating cover 93 will be described below. The insulating cover 93 is a component used to prevent fingers from contacting the electrical path of the main body MU. The insulating cover 93 is, for example, made of synthetic resin and has insulating properties. The insulating cover 93 is, for example, a box-shaped component open in the -Z direction. The insulating cover 93 has multiple vent holes 93h. The insulating cover 93 is mounted relative to the metal plate 80 along the Z direction. Furthermore, the insulating cover 93 is not limited to a box-shaped component; it can also be a sheet-shaped component covering the electrical path of the main body MU.

[0157] <5. Exposed Structure of Busbars>

[0158] Next, the exposed structure of the busbar 42 will be described.

[0159] <5.1 Exposed structure on the upper surface side of the busbar>

[0160] First, refer to Figure 8 The exposed structure on the upper surface side of the busbar 42 will be described. In this embodiment, at least a portion of the extension 63 of the busbar 42 is exposed to the outside of the substrate 41 on the upper surface side (the first surface 51a side of the planar portion 51). For example, the extension 63 of the busbar 42 overlaps with the electronic component 10 at least in the region R (refer to) when viewed from the Z direction. Figure 10 Part of it is exposed on the upper surface laterally to the outside of the substrate plate 41.

[0161] In this embodiment, the busbar 42 is housed in the receiving portion 55 along its entire length between the first connecting portion 61 and the second connecting portion 62 and extends along the first surface 51a of the planar portion 51. The busbar 42 is exposed laterally to the outside of the base plate 41 on the upper surface, along its entire length between the first connecting portion 61 and the second connecting portion 62.

[0162] In this embodiment, the busbar 42 is housed in the receiving portion 55 along its entire length and extends along the first surface 51a of the planar portion 51. The busbar 42 is exposed on the upper surface laterally to the outside of the base plate 41 along its entire length.

[0163] like Figure 13 As shown, at least a portion of the extension 63 of the busbar 42 is exposed to the outside of the base plate 41 on the lower surface side (second surface 51b side), in addition to the upper surface side. For example, the entire length of the busbar 42 is exposed to the outside of the base plate 41 on the lower surface side.

[0164] <5.2 Exposed Structure on the Lower Surface Side of the Busbar>

[0165] Next, refer to Figure 13 The exposed structure on the lower surface side of the busbar 42 will be described. In this embodiment, the plate portion 42p of the busbar 42 includes an exposed portion 42u on the lower surface side (the second surface 51b side of the planar portion 51) that exposes to the outside of the base plate 41. In this embodiment, the exposed portion 42u of the busbar 42 extends along the entire length of the busbar 42. In this embodiment, a heat-conducting member 92 is disposed between the exposed portion 42u of the busbar 42 and the metal plate 80. For example, the heat-conducting member 92 is in contact with the exposed portion 42u of the busbar 42.

[0166] In this embodiment, at least a portion of the exposed portion 42u of the busbar 42 is disposed in the region that overlaps with the connecting member 20 when viewed from the Z direction. At least a portion of the heat-conducting member 92 overlaps with the exposed portion 42u of the busbar 42 in the region that overlaps with the connecting member 20 when viewed from the Z direction. For example, at least a portion of the heat-conducting member 92 is in contact with the exposed portion 42u of the busbar 42 in the region that overlaps with the connecting member 20 when viewed from the Z direction.

[0167] In this embodiment, the exposed portion 42u of the busbar 42 includes a first portion 42ua disposed in the region overlapping with the connecting member 20 when viewed from the Z direction, and a second portion 42ub disposed in the region overlapping with the electronic component 10 when viewed from the Z direction.

[0168] The heat-conducting component 92 includes a first heat-conducting portion 92a and a second heat-conducting portion 92b. The first heat-conducting portion 92a overlaps with a first portion 42ua of the exposed portion 42u of the busbar 42 in the region overlapping with the connecting component 20 when viewed from the Z direction. For example, the first heat-conducting portion 92a is in contact with the first portion 42ua of the exposed portion 42u of the busbar 42. On the other hand, the second heat-conducting portion 92b overlaps with a second portion 42ub of the exposed portion 42u of the busbar 42 in the region overlapping with the electronic component 10 when viewed from the Z direction. For example, the second heat-conducting portion 92b is in contact with the second portion 42ub of the exposed portion 42u of the busbar 42.

[0169] It should be noted that, as described above, at least a portion of the extension 63 of the busbar 42 is exposed to the outside of the substrate plate 41 on the upper surface side (first surface 51a side), in addition to the lower surface side. For example, the entire length of the busbar 42 is exposed to the outside of the substrate plate 41 on the upper surface side. For example, the second portion 42ub of the exposed portion 42u of the busbar 42 is also exposed to the outside of the substrate plate 41 on the upper surface side, in addition to the lower surface side, and faces the electronic component 10.

[0170] <6. Three-dimensional cabling structure of busbars>

[0171] Next, the three-dimensional wiring structure CS of busbar 42 will be explained.

[0172] Figure 14 This is a three-dimensional view showing the three-dimensional wiring structure CS of busbar 42. Figure 15 This is a top view showing a three-dimensional cabling structure CS with busbars 42. The three-dimensional cabling structure CS has busbars 42F, 42G, 42H, and 42I as multiple busbars 42. Additionally, the three-dimensional cabling structure CS includes multiple connecting components 100. Furthermore, the three-dimensional cabling structure CS includes connecting busbars 75C and 75D as multiple connecting busbars 75.

[0173] Busbars 42F and 42G are, for example, busbars 42 included in subunit SUY. The planar portion 51 of the base plate 41 of subunit SUY has receiving portions 55F and 55G as multiple receiving portions 55. Busbar 42F is received in receiving portion 55F and extends along the planar portion 51. Busbar 42G is received in receiving portion 55G and extends along the planar portion 51. Busbar 42F is an example of a "first busbar". The receiving portion 55F that receives busbar 42F is an example of a "first receiving portion". Busbar 42G is an example of a "fourth busbar". The receiving portion 55G that receives busbar 42G is an example of a "fourth receiving portion". Busbars 42F and 42G are busbars 42 located in the first layer (lower layer) of the three-dimensional wiring structure CS.

[0174] In this embodiment, the busbar 42F has a first portion 42Fa extending along the X direction and a second portion 42Fb that bends from the first portion 42Fa and extends along the Y direction. The second portion 42Fb extends along the boundary B between subunit SUY and subunit SUZ.

[0175] On the other hand, busbars 42H and 42I are, for example, busbars 42 included in subunit SUZ. The planar portion 51 of the base plate 41 of subunit SUZ has receiving portions 55H and 55I as a plurality of receiving portions 55. Busbar 42H is received in receiving portion 55H and extends along planar portion 51. Busbar 42I is received in receiving portion 55I and extends along planar portion 51. Busbars 42H and 42I are busbars 42 located in the first layer (lower layer) of the three-dimensional wiring structure CS.

[0176] The connecting member 100 has the same structure as the connecting member 30 for external connection described above. For example, the connecting member 100 has a first part 101, a second part 102, and a third part 103. Furthermore, regarding the details of the connecting member 100, in the description related to the connecting member 30 described above, simply replace "connecting member 30" with "connecting member 100", "first part 31" with "first part 101", "first mounting hole 31h" with "first mounting hole 101h", "second part 32" with "second part 102", "third mounting hole 32h" with "third mounting hole 102h", and "third part 33" with "third part 103". The connecting member 100 is a member that forms a vertical power path. The connecting member 100 can also be referred to as a "vertical wiring member". Figure 14 Reference numeral 102s in the figure indicates the lower surface of the second part 102 of the connecting member 100 (including the lower surface of the first part 101). The lower surface 102s is opposite to the upper surface 42s of the busbar 42 in the Z direction.

[0177] Multiple connecting components 100 include connecting component 100A and connecting component 100B. Viewed from the Z direction, connecting component 100A overlaps with the second connecting portion 62 of busbar 42G within the subunit SUY. Connecting component 100A is adjacent to the second connecting portion 62 of busbar 42G in the Z direction and is connected to the second connecting portion 62 of busbar 42G from the Z direction. Connecting component 100A extends from busbar 42G in the +Z direction.

[0178] Viewed from the Z direction, the connecting member 100B overlaps with the second connecting portion 62 of the busbar 42I in the subunit SUZ. The connecting member 100B is adjacent to the second connecting portion 62 of the busbar 42I in the Z direction and is connected to the second connecting portion 62 of the busbar 42I from the Z direction. The connecting member 100B stands upright from the busbar 42I in the +Z direction.

[0179] One end of the connecting bus 75C is adjacent to the second connection portion 62 of bus 42F in the Z direction within sub-unit SUY, and is connected to the second connection portion 62 of bus 42F in the Z direction. The other end of the connecting bus 75C is adjacent to the second connection portion 62 of bus 42H in the Z direction within sub-unit SUZ, and is connected to the second connection portion 62 of bus 42H in the Z direction. According to this structure, bus 42F of sub-unit SUY and bus 42H of sub-unit SUZ are electrically connected via the connecting bus 75C. The connecting bus 75C is a bus 75 located in the first layer (lower layer) of the three-dimensional cabling structure CS.

[0180] On the other hand, the connecting busbar 75D is adjacent to the first portion 101 of the connecting member 100A in the Z direction in the sub-unit SUY, and is connected to the first portion 101 of the connecting member 100A in the Z direction. The other end of the connecting busbar 75D is adjacent to the first portion 101 of the connecting member 100B in the Z direction in the sub-unit SUZ, and is connected to the first portion 101 of the connecting member 100B in the Z direction.

[0181] The connecting bus 75D is supported by the first portion 101 of the connecting member 100A and the first portion 101 of the connecting member 100B at a position away from the bus 42F in the Z direction. The connecting bus 75D is supported by the first portion 101 of the connecting member 100A and the first portion 101 of the connecting member 100B, and extends in a horizontal direction (e.g., the X direction). The connecting bus 75D is electrically connected to the first portion 101 of the connecting member 100A and the first portion 101 of the connecting member 100B. According to this structure, the bus 42F of subunit SUY and the bus 42I of subunit SUZ are electrically connected via the two connecting members 100 and the connecting bus 75D.

[0182] In this embodiment, the connecting bus 75D extends across the second portion 42Fb of bus 42F at a position away from bus 42F in the +Z direction. Thus, a three-dimensional wiring structure is formed by the connecting bus 75D and bus 42F. In this embodiment, the connecting bus 75D extends across the boundaries B of multiple sub-units SU.

[0183] In this embodiment, the three-dimensional wiring structure CS of the busbar 42 is positioned across the boundary B of the multiple sub-units SU. With this arrangement, the connection structure between the multiple sub-units SU is strengthened by the three-dimensional wiring structure CS. Alternatively, the three-dimensional wiring structure CS of the busbar 42 may not be positioned at the boundary B of the multiple sub-units SU, but rather within one or more sub-units SU.

[0184] <12. Related Structures of Connecting Components>

[0185] Next, the structure related to the connecting component 20 will be described.

[0186] Figure 16 This is a cross-sectional view illustrating the structure related to the connecting member 20. In this embodiment, the connecting member 20 (e.g., connecting member 20M and connecting member 20N) is a heat storage member (heat absorption member) that increases the heat capacity of the energized path of the electrical connection unit 1. The connecting member 20, for example, stores (absorbs) at least a portion of the heat emitted by the electronic component 10. Alternatively / otherwise, the connecting member 20 may also store (absorb) at least a portion of the heat emitted by the busbar 42 itself due to energization. The connecting member 20 may also be referred to as a "heat storage member" or a "heat absorption member".

[0187] In this embodiment, the busbar 42 is positioned away from the terminal 13 of the electronic component 10 (e.g., away in the Z direction). The connecting member 20 is positioned between the electronic component 10 and the busbar 42. In this invention, "the connecting member is positioned between the electronic component and the busbar" is not limited to the case where a portion of the connecting member is located between the electronic component and the busbar when viewed from the X or Y direction. "The connecting member is positioned between the electronic component and the busbar" can also be equivalent to the case where a portion of the connecting member is located between the electronic component and the busbar when viewed from a direction inclined relative to the X or Y direction. The connecting member 20 electrically connects the terminal 13 of the electronic component 10 to the busbar 42.

[0188] In the present embodiment, the thickness of at least a part of the connecting member 20 is greater than the plate thickness (thickness in the Z direction) T3 of the bus bar 42. For example, the thickness T1 in the X direction of at least a part of the connecting member 20 is greater than the plate thickness T3 of the bus bar 42. In the present embodiment, the thickness T1 in the X direction of the first part 21 of the connecting member 20 is greater than the plate thickness T3 of the bus bar 42. In the present embodiment, the first part 21 has a thickness T1 greater than the plate thickness T3 of the bus bar 42 throughout the entire length in the Z direction of the first part 21, as the thickness in the X direction. The thickness T1 in the X direction of the first part 21 of the connecting member 20 is, for example, more than twice the plate thickness T3 of the bus bar 42. Additionally, in other solutions, the thickness T2 in the Z direction of the second part 22 of the connecting member 20 may also be greater than the plate thickness T3 of the bus bar 42.

[0189] In the present embodiment, the thickness T1 in the X direction of the first part 21 of the connecting member 20 is greater than the thickness T2 in the Z direction of the second part 22 of the connecting member 20. In the present embodiment, the first part 21 has a thickness T1 greater than the thickness T2 in the Z direction of the second part 22 throughout the entire length in the Z direction of the first part 21, as the thickness in the X direction. Thus, as Figure 17 shown, it is easy to form the first mounting hole 21hA within the thickness T1 of the first part 21, and the heat storage capacity of the first part 21 and even the connecting member 20 is increased.

[0190] In addition, the above-described dimensional relationships are also the same for the connecting member 30 connected to the external connection bus bar 76 and / or the connecting member 100 connected to the connecting bus bar 75. For example, regarding the description of the connecting member 30, in the above description of the connecting member 20, just replace "connecting member 20" with "connecting member 30", "first part 21" with "first part 31", and "second part 22" with "second part 32". Similarly, regarding the description of the connecting member 100, in the above description of the connecting member 20, just replace "connecting member 20" with "connecting member 100", "first part 21" with "first part 101", and "second part 22" with "second part 102".

[0191] <14. Advantages of the present embodiment>

[0192] <A. Advantages of the wiring substrate>

[0193] As a comparative example, consider an electrical connection unit in which the bus bar is arranged in a posture standing up with respect to the lower wall of the housing. In the structure of such a comparative example, it is sometimes difficult to achieve thinning of the electrical connection unit due to the width of the standing bus bar.

[0194] On the other hand, in this embodiment, the electrical connection unit 1 includes a first electronic component 10 and a wiring substrate 40. The wiring substrate 40 includes a base plate 41 and a first busbar 42. The base plate 41 has a plate-shaped planar portion 51, which has a first surface 51a facing the first electronic component 10. The planar portion 51 has a first receiving portion 55 that is recessed in the Z direction or extends through the planar portion 51 in the Z direction. At least a portion of the first busbar 42 is received in the first receiving portion 55 and extends along the planar portion 51. According to this structure, at least a portion of the wiring path is formed on a plane. Compared with the structure of the comparative example described above, the busbar is less likely to affect the height direction, making it easier to achieve a thinner electrical connection unit 1.

[0195] In this embodiment, the electrical connection unit 1 has a first connection member 20. The first connection member 20 includes a portion that stands upright relative to the first busbar 42 and electrically connects the first electronic component 10 to the first busbar 42. The first busbar 42 has a first connection portion 61 that contacts the first connection member 20. The first connection portion 61 is housed in a first housing portion 55 and extends along a planar portion 51. With this structure, more of the wiring path is formed on a plane, thus making it easier to achieve a thinner electrical connection unit 1.

[0196] In this embodiment, the electrical connection unit 1 has a second connection member 20. The second connection member 20 includes a portion that stands upright relative to the first busbar 42 and electrically connects a second electronic component or external device to the first busbar 42. The first busbar 42 has a second connection portion 62 that contacts the second connection member 20. The first busbar 42 is housed in a first housing portion 55 and extends along a planar portion 51, at least extending across the first connection portion 61 and the second connection portion 62. With this structure, more of the wiring path is formed on a plane, thus making it easier to achieve a thinner electrical connection unit 1.

[0197] In this embodiment, the first busbar 42 has an extension 63 between the first connecting portion 61 and the second connecting portion 62. The extension 63 is housed in the first housing portion 55 and extends through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. With this structure, by housing the extension 63 in the first housing portion 55, the wiring layout is less constrained by the presence of the electronic component 10. Therefore, a wiring layout that is more favorable to electrical characteristics, such as making it easier to extend the extension 63 in a straight line, can be achieved. Furthermore, routing around busbars such as the electronic component 10 can be avoided. Thus, the electrical characteristics of the electrical connection unit 1 can be improved and / or the electrical connection unit 1 can be miniaturized.

[0198] In this embodiment, the first busbar 42 has an extension 64 that extends to a region R overlapping with the first electronic component 10 when viewed from the Z direction, and has an end portion 42e1 at the position where it overlaps with the first electronic component 10. The extension 64 is housed in a first housing portion 55 and extends along a planar portion 51. With this structure, by housing the extension 64 in the first housing portion 55, the electrical connection unit 1 can be made thinner, and the metallic heat dissipation portion (extension 64) for promoting heat dissipation and / or heat storage of the first electronic component 10 can be positioned below the first electronic component 10. Thus, the heat dissipation and / or heat storage of the electrical connection unit 1 can be improved.

[0199] In this embodiment, the first busbar 42 is housed in the first receiving portion 55 along its entire length and extends along the planar portion 51. With this structure, more of the wiring path is formed on the plane, thus making it easier to achieve a thinner electrical connection unit 1.

[0200] In this embodiment, the electrical connection unit 1 has a second busbar 42 electrically connected to the second terminal 13B of the first electronic component 10. The planar portion 51 has a second receiving portion 55 recessed in the Z direction or extending through the planar portion 51 in the Z direction at a location away from the first receiving portion 55. At least a portion of the second busbar 42 is received in the second receiving portion 55 and extends along the planar portion 51. With this structure, a larger portion of the wiring path containing multiple busbars 42 is held in a plane by a substrate 41, thus making it easier to achieve a thinner electrical connection unit 1.

[0201] In this embodiment, the electrical connection unit 1 has a third busbar 42. The first busbar 42 is the busbar included in the positive line PL. The third busbar 42 is the busbar included in the negative line NL. The planar portion 51 has a third receiving portion 55 that is recessed in the Z direction or extends through the planar portion 51 in the Z direction at a position away from the first receiving portion 55. At least a portion of the third busbar 42 is received in the third receiving portion 55 and extends along the planar portion 51. According to this structure, more of the wiring path forming the positive line PL and the negative line NL is held in a plane by a substrate plate 41, thus making it easier to achieve a thinner electrical connection unit 1.

[0202] In the present embodiment, the electrical connection unit 1 has a fourth bus bar 42, a fifth bus bar 42, and a third connection member 100 that electrically connects the fourth bus bar 42 and the fifth bus bar 42. The flat portion 51 has a fourth housing portion 55 that is recessed in the Z direction or penetrates the flat portion 51 in the Z direction at a position away from the first housing portion 55. At least a part of the fourth bus bar 42 is housed in the fourth housing portion 55 and extends along the flat portion 51. The third connection member 100 includes a portion that stands up with respect to the fourth bus bar 42. The fifth bus bar 42 is supported by the third connection member 100 at a position away from the first bus bar 42 in the Z direction and extends parallel to the first surface 51a. With such a structure, it is easy to form a three-dimensional wiring path through the fourth bus bar 42, the third connection member 100, and the fifth bus bar 42. Thereby, an electrical connection unit 1 with excellent assembly property can be provided. In addition, by arranging the fourth bus bar 42 in the housing portion 55 of the base plate 41, a part of the three-dimensional wiring path is formed within the thickness of the base plate 41. Thereby, it is easier to make the electrical connection unit 1 thinner.

[0203] In the present embodiment, the fifth bus bar 42 extends in a manner that straddles the first bus bar 42 at a position away from the first bus bar 42 in the Z direction. With such a structure, it is easy to form a wiring path that three-dimensionally crosses the first bus bar 42 through the third connection member 100 and the fifth bus bar 42. Thereby, an electrical connection unit 1 with excellent assembly property can be provided.

[0204] <B. Advantages related to flat bus bars>

[0205] As a comparative example, consider an electrical connection unit in which the bus bar is arranged in a posture that stands up with respect to the lower wall of the housing. In the structure of such a comparative example, it is necessary to fix the bus bar in a standing posture to the housing, and it is difficult to improve the workability related to the installation of the bus bar. In this case, it may be difficult to improve the assembly property of the electrical connection unit 1.

[0206] On the other hand, in the present embodiment, the electrical connection unit 1 has a base plate 41 and a bus bar 42. The base plate 41 includes a plate-shaped flat portion 51. The flat portion 51 has a first housing portion 55 that is recessed in the Z direction or penetrates the flat portion 51 in the Z direction. At least a part of the bus bar 42 is housed in the first housing portion 55 and extends along the flat portion 51. With such a structure, it is easy to integrally handle the base plate 41 and the bus bar 42, and compared with the structure of the above comparative example, the workability related to the installation of the bus bar can be improved. Thereby, an improvement in the assembly property of the electrical connection unit 1 can be achieved.

[0207] In the present embodiment, the bus bar 42 is housed in the housing portion 55 over the entire length of the bus bar 42 and extends along the planar portion 51. With such a structure, it is possible to improve the assemblability of the electrical connection unit 1 and to easily make the electrical connection unit 1 thinner.

[0208] In the present embodiment, the bus bar 42 is integrated with the base plate 41 by insert molding. With such a structure, it is possible to eliminate or reduce the operation of manually mounting the bus bar 42 to the housing. Thereby, it is possible to further improve the assemblability of the electrical connection unit 1.

[0209] In the present embodiment, there are provided fastening members 43 protruding from the bus bar 42 in the Z direction and connection members 20, 30 mounted to the fastening members 43 from the Z direction. The connection members 20, 30 electrically connect the electronic component 10 or the external device to the bus bar 42. With such a structure, it is easy to make the direction of the operation of mounting the connection target component to the bus bar 42 coincide with the Z direction. If the direction of the operation can be made to coincide, it is possible to further improve the assemblability of the electrical connection unit 1.

[0210] In the present embodiment, the connection member 20 is connected to the electronic component 10 from the X direction (or the Y direction). With such a structure, by using the connection member 20 for the electronic component 10 that needs to be connected from the X direction, the connection direction of the electronic component 10 relative to the bus bar 42 can be changed to the Z direction. Thereby, it is possible to further improve the assemblability of the electrical connection unit 1.

[0211] <C. Advantages related to the exposed structure on the upper surface side of the bus bar>

[0212] As a comparative example, an electrical connection unit in which the upper surface side of the bus bar 42 is covered with synthetic resin is considered. In the structure of such a comparative example, it is difficult to improve the heat dissipation performance of the bus bar 42.

[0213] On the other hand, in this embodiment, the electrical connection unit 1 includes a first electronic component 10 and a wiring substrate 40. The wiring substrate 40 includes a base plate 41 and a busbar 42. The base plate 41 has a plate-shaped planar portion 51, which has a first surface 51a facing the first electronic component 10 and a second surface 51b located on the side opposite to the first surface 51a. The planar portion 51 has a receiving portion 55 that is recessed in the Z direction or extends through the planar portion 51 in the Z direction. At least a portion of the busbar 42 has a plate portion 42p that is received in the receiving portion 55 and extends along the planar portion 51. The plate portion 42p includes a first connecting portion 61 that overlaps with the first connecting component 20 when viewed in the Z direction and an extension portion 63 that extends from the first connecting portion 61 in a direction intersecting the Z direction. At least a portion of the extension portion 63 is exposed to the outside of the base plate 41 on the side of the first surface 51a. With this structure, at least a portion of the part of the busbar 42 other than the connecting portions 61 and 62 that connect to other components is exposed to the outside, functioning as an area for heat release. In this case, the heat dissipation performance of the electrical connection unit 1 can be improved.

[0214] In this embodiment, at least a portion of the area R in which the extension 63 overlaps with the first connecting member 20 when viewed from the Z direction is exposed to the outside of the base plate 41 on the first surface 51a side. With this structure, a portion of the extension 63 can easily function as a heat dissipation portion that moves heat away from the first connecting member 20. In this case, improved heat dissipation of the electrical connection unit 1 can be achieved.

[0215] In this embodiment, the first busbar 42 has a second connecting portion 62 that overlaps with the second connecting members 20 and 30 when viewed in the Z direction. The first busbar 42 is housed in the receiving portion 55 along its entire length, at least across the first connecting portion 61 and the second connecting portion 62, and extends along the planar portion 51, and is exposed on the exterior of the base plate 41 on the first surface 51a. With this structure, a larger portion functions as a heat dissipation area, thus further improving the heat dissipation of the electrical connection unit 1.

[0216] In this embodiment, the busbar 42 is housed in the housing portion 55 along its entire length and extends along the planar portion 51, and is exposed on the exterior of the base plate 41 on the first surface 51a. With this structure, a larger portion functions as a heat dissipation area, thus further improving the heat dissipation of the electrical connection unit 1.

[0217] At least a portion of the extension 63 is exposed to the outside of the base plate 41 on the second surface 51b, in addition to the first surface 51a side. With this structure, a larger portion functions as a heat dissipation area, thus further improving the heat dissipation of the electrical connection unit 1.

[0218] In a modified example of the present embodiment, the electrical connection unit 1 includes: a metal plate 80 facing the flat portion 51 and having a gap S1 therebetween; and a heat conductive member 92 disposed between the bus bar 42 and the metal plate 80. The base plate 41 has a cover portion 51v covering at least a part of the covering extension portion 63 on the second surface 51b side. According to such a structure, even when heat is likely to accumulate in the gap S1 between the base plate 41 and the metal plate 80, by providing the cover portion 51v, it is possible to suppress heat from easily accumulating in the gap S1.

[0219] <D. Advantages related to the exposed structure on the lower surface side of the bus bar>

[0220] In order to improve the retention of the bus bar 42, sometimes a structure in which the bus bar 42 other than the connection surface with the electronic component 10 or the like is covered with resin is adopted. However, in the structure covering the connection surface other than the connection surface of the bus bar 42, there is a problem that the heat dissipation of the bus bar 42 deteriorates. In the present embodiment, the lower surface (the surface opposite to the component mounting surface) of the bus bar 42 is exposed, and a heat conductive sheet is provided on the exposed surface. The heat conductive sheet is connected to a metal plate 80 (rigid member, heat dissipation member) provided below the wiring substrate 40. Thereby, heat can be well conducted from the bus bar 42 to the metal plate 80 (the side opposite to the component mounting surface) via the heat conductive sheet. <***

[0221] <E. Advantages related to the structure of the connection member>

[0222] The connection members 20, 30, 100 of the present embodiment are connection members that connect the first bus bar 42 to connection target components (electronic component 10, second bus bars 75, 76), and include: a first portion 21, 31, 101 extending in the first direction (Z direction); and a second portion 22, 32, 102 extending from one end of the first portion 21, 31, 101 in a second direction (X direction) intersecting the first direction, facing the first bus bar 42 in the first direction and fixed to the first bus bar 42.

[0223] When applying the first connection target components 10N, 75, 76 as the connection target components, the first portion 21, 31, 101 may also include a first mounting portion 21fA capable of mounting fastening members 72, 73 along the first direction. Additionally, when applying the second connection target component 10M as the connection target component, the first portion 21, 31, 101 may also include a second mounting portion 21fB capable of mounting a fastening member 71 along the second direction.

[0224] According to this structure, the connecting member disposed between the first busbar 42 and the connecting objects 10, 75, 76 is L-shaped, having portions extending along intersecting first and second directions. The first portions 21, 31, 101, which stand upright in the first direction opposite to the first busbar 42, may also have a first mounting portion 21fA for mounting the first object object via fastening members 72, 73 along the first direction, and a second mounting portion 21fB for mounting the second object object via fastening member 71 along the second direction. Thus, a first object object requiring fastening from the direction opposite to the first busbar 42 and a second object object requiring fastening from the direction along the first busbar 42 can be mounted to the first busbar 42 using a single connecting member. This promotes the generalization of the components of the electrical connection unit 1.

[0225] In addition, in the connecting parts 20, 30, and 100 of this embodiment, the first mounting part 21fA has a first mounting hole 21hA that penetrates the first part in the first direction, and the second mounting part 21fB has a second mounting hole 21hB that penetrates the first part in the second direction.

[0226] According to this structure, by making each mounting hole 21hA and 21hB a through hole, each mounting part 21fA and 21fB can be easily formed, and the connecting parts can be made lightweight.

[0227] Furthermore, in the connecting components 20, 30, and 100 of this embodiment, the thickness T1 of the first portion 21, 31, and 101 in the second direction is greater than the thickness T2 of the second portion 22, 32, and 102 in the first direction.

[0228] According to this structure, by making the first parts 21, 31, 101 thicker than the second parts 22, 32, 102, even if mounting portions 21fA and 21fB in two mutually orthogonal directions are formed in the first parts 21, 31, 101, these mounting portions can be easily formed, and the heat storage capacity of the first parts 21, 31, 101 and even the entire connecting component can be increased, thereby improving the thermal characteristics of the electrical connection unit 1.

[0229] Furthermore, in the connecting components 20, 30, and 100 of this embodiment, when the direction intersecting the first direction and the second direction is set as the third direction (Y direction), the first mounting part 21fA and the second mounting part 21fB are arranged at different positions in the third direction.

[0230] According to this structure, even when mounting portions 21fA and 21fB are formed in two directions, by arranging the first mounting portion 21fA and the second mounting portion 21fB in the first portions 21, 31, and 101 at offset positions in a third direction intersecting the first and second directions, it is easy to obtain a spacing between the mounting portions 21fA and 21fB in the two mutually orthogonal directions in the first portion. This facilitates the formation of each mounting portion 21fA and 21fB, and also allows the fastening components for each mounting portion 21fA and 21fB to be separated from each other, making fastening operations easier.

[0231] In addition, in the connecting components 20, 30, and 100 of this embodiment, the second portion 22, 32, and 102 have a third mounting portion 22fA that is fixed to the first busbar 42 by installing a fastening component 43 along the first direction.

[0232] According to this structure, the second parts 22, 32, 102 have a third mounting part 22fA that is fixed to the first busbar 42, thereby being fixed to the first busbar 42 by the second parts 22, 32, 102 that are separate from the first parts 21, 31, 101 which have multiple mounting parts.

[0233] Furthermore, in the connecting components 20, 30, and 100 of this embodiment, when the direction intersecting the first direction and the second direction is set as the third direction (Y direction), the first mounting part 21fA, the second mounting part 21fB, and the third mounting part 22fA are arranged at different positions in the third direction.

[0234] According to this structure, by arranging the three mounting parts in a staggered manner, the fastening components used in each mounting part can be separated from each other, making fastening operations easy.

[0235] In addition, in the connecting components 20, 30, and 100 of this embodiment, the connecting target component is the electronic component 10 or the second busbars 75 and 76.

[0236] According to this structure, multiple connection objects can be installed on the first busbar 42 using a single connecting component, thereby promoting the generalization of the components of the electrical connection unit 1.

[0237] Furthermore, the electrical connection unit 1 of this embodiment includes the first busbar 42 and the connecting components 20, 30, and 100, thereby enabling the first object component that needs to be fastened from the direction opposite to the first busbar 42 and the second object component that needs to be fastened from the direction along the first busbar 42 to be mounted on the first busbar 42 by a connecting component, thus achieving the generalization of the constituent components.

[0238] <Heat dissipation structure of connecting components>

[0239] Figures 18 to 21 This is a perspective view showing the structure of the heat dissipation structure 24 that can be used in the connecting parts 20, 30, and 100 of this embodiment.

[0240] like Figures 18 to 20 As shown, when viewed from the Y direction (third direction), the rectangular plane on the +X direction side of the first part 21A (hereinafter referred to as the front surface 21b) and the rectangular plane on the +Z direction side of the second part 22A (hereinafter referred to as the upper surface 22b) form an angle θ1 of 90 degrees. A heat sink 24f of a heat dissipation structure 24 is provided in the concave region R3 formed by the front surface 21b and the upper surface 22b of the connected component 20A, where the angle θ1 is formed. For example, the heat dissipation structure 24 includes a plurality of heat sinks 24f arranged at intervals in the Y direction.

[0241] Multiple heat sinks 24f are, for example, identical in shape. Viewed from the Y direction, each heat sink 24f is, for example, triangular in shape. Viewed from the Y direction, each heat sink 24f has a first side 24f1 along the front surface 21b of the first portion 21A, a second side 242 along the upper surface 22b of the second portion 22A, and an inclined side 24f3 from the upper edge 21c of the front surface 21b to the front edge 22c of the upper surface 22b. The closer each heat sink 24f is to the second portion 22A in the Z direction, the greater its length 24x in the X direction. The closer each heat sink 24f is to the first portion 21A in the X direction, the greater its length 24z in the Z direction. By forming each heat sink 24f into a triangular shape, the connecting member 20A becomes a form with its upper front portion chamfered into a flat shape, thus suppressing the enlargement of the connecting member 20A.

[0242] Each heat sink 24f is not limited to having an inclined edge 24f3 from the upper edge 21c of the front surface 21b to the front edge 22c of the upper surface 22b. For example... Figure 20 As shown, the inclined edge 24f3 of each heat sink 24f can be located at a position where the upper end is lower than the upper edge 21c of the front surface 21b (position in the -Z direction), or the lower end can be located at a position behind the front edge 22c of the upper surface 22b (position in the -X direction).

[0243] Figure 6 , Figure 7 The region R3 forming the included angle θ1 in the connecting parts 20 and 30 is shown (see reference). Figure 17 The structure has a pair of wall-shaped third parts 23, 33 (an example of heat sink 24f) at both ends in the Y direction. Furthermore, although detailed illustrations are omitted, Figure 14The connecting component 100 also has the same structure as the connecting components 20 and 30. The structure of the connecting component 100 is as described in paragraph 0107, except that the description related to the connecting component 30 is replaced.

[0244] The second portions 22 and 32 of the connecting components 20 and 30 have third mounting holes 22h and 32h, which penetrate the second portions 22 and 32 along the Z direction (first direction) and can be fastened to the busbar 42. Each third mounting hole 22h and 32h is circular when viewed from above in the Z direction, and the center of each third mounting hole 22h and 32h is located at the center of the width direction (center of the Y direction) of the second portions 22 and 32, respectively.

[0245] A pair of heat sinks 24f are separated from the outer edges of the third mounting holes 22h and 32h, located at the two ends in the width direction of the first portions 21 and 31 and the second portions 22 and 32, respectively. By arranging the pair of heat sinks 24f in a manner that avoids the third mounting holes 22h and 32h in the second portions 22 and 32, a fastening operation can be performed to fasten the busbar 42 using the third mounting holes 22h and 32h. At this time, not only are the heat sinks 24f arranged to avoid the third mounting holes 22h and 32h, but also, for example, an area corresponding to the size of the head of the bolt inserted into the third mounting holes 22h and 32h is avoided (see reference). Figure 18 A pair of heat sinks 24f are configured in the fastening area (hereinafter referred to as R2).

[0246] The bolts are, for example, hexagonal bolts as specified in JIS B 1180 or internal hexagonal bolts as specified in JIS B 1176. The pair of heat sink fins 24f not only avoid the fastening area R2 on the upper surface 22b of the second parts 22 and 32, but also avoid the fastening area R2 at their separated positions above the upper surface 22b. That is, when viewed from the Z direction (axial direction of the third mounting holes 22h and 32h), the pair of heat sink fins 24f do not overlap with the fastening area R2. With this structure, bolt installation, removal, and tightening operations can be performed from the Z direction towards the third mounting holes 22h and 32h. If the bolts are bolts with hexagonal holes, compared to the case of hexagonal bolts, no space for fastening tools is required, making it easier to ensure space for the heat sink fins 24f.

[0247] Figure 7 The heat sink 24f of the connecting component 30 and Figure 6 Compared to the heat sink 24f of the connecting component 20, the upper end of the inclined edge 24f3 is located further forward than the upper edge 21c of the front surface 21b of the first part 31. According to this structure, when viewed from the Y direction, Figure 7 The heat sink 24f is formed as a trapezoid with a specified width on the top.

[0248] Figure 18The structure shown is that wall-shaped heat sinks 24f are respectively provided at three locations in the region R3 forming the included angle θ1 in the Y direction of the connecting member 20A.

[0249] Figure 18 The first part 21A has a second mounting hole 21hB that extends through the first part 21A in the X direction (second direction) to securely connect the object component. The second mounting hole 21hB is circular when viewed from the X direction in a frontal view, and the center of the second mounting hole 21hB is offset to one side in the width direction relative to the center in the width direction (center in the Y direction) of the first part 21A.

[0250] The second part 22A has a third mounting hole 22hA that penetrates the second part 22A in the Z direction (first direction) and can be fastened to the busbar. The third mounting hole 22hA is circular when viewed from above in the Z direction, and its center is offset to the opposite side in the width direction relative to the center of the second part 22A in the Y direction. That is, the second mounting hole 21hB and the third mounting hole 22hA are offset from each other in the Y direction.

[0251] Of the three heat sinks 24f, a pair of heat sinks 24f located at both ends in the width direction are separated from the outer edges of the second mounting hole 21hB and the third mounting hole 22hA, respectively, and are located at the two ends in the width direction of the first part 21A and the second part 22A. Another heat sink 24f located at the center in the width direction is separated from the outer edges of the second mounting hole 21hB and the third mounting hole 22hA, and is located at the center in the width direction of the first part 21A and the second part 22A.

[0252] By arranging multiple heat sinks 24f in a manner that avoids the second mounting hole 21hB in the first part 21A and the third mounting hole 22hA in the second part 22A, it is possible to perform a fastening operation by using the second mounting hole 21hB to fasten the connected object component and a fastening operation by using the third mounting hole 22hA to fasten the busbar 42.

[0253] At this point, the heat sink 24f is configured not only to avoid the second mounting hole 21hB and the third mounting hole 22hA, but also to avoid, for example, an area (fastening area R3) corresponding to the size of the head of the bolt that is inserted into the second mounting hole 21hB and the third mounting hole 22hA respectively. The multiple heat sinks 24f not only avoid the fastening area R3 on the front surface 21b of the second mounting hole 21hB and the upper surface 22b of the second part 22A respectively, but also avoid the fastening area R3 at the position where they separate in front of the front surface 21b, and also avoid the fastening area R3 at the position where they separate above the upper surface 22b.

[0254] That is, when viewed from the X direction (axial direction of the second mounting hole 21hB), the multiple heat sinks 24f do not overlap with the fastening area R3. This structure allows for the installation, removal, and tightening of bolts from the X direction into the second mounting hole 21hB. Furthermore, when viewed from the Z direction (axial direction of the third mounting hole 22hA), the multiple heat sinks 24f do not overlap with the fastening area R3. This structure also allows for the installation, removal, and tightening of bolts from the Z direction into the third mounting hole 22hA.

[0255] Figure 19 The structure shown is that in the connecting member 20A, four locations, including the middle part of the region R3 forming the included angle θ1 in the Y direction, are provided with wall-shaped heat sinks 24f.

[0256] The first part 21A has a second mounting hole 21hB that extends through the first part 21A along the X direction (second direction) and can be fastened to the connecting object component. The second mounting hole 21hB is circular when viewed from the front in the X direction, and the center of the second mounting hole 21hB is located at the center of the width direction (center in the Y direction) of the first part 21A.

[0257] The second part 22A has a third mounting hole 22hA that extends through the second part 22A along the Z direction (first direction) and can be fastened to the busbar 42. The third mounting hole 22hA is circular when viewed from above in the Z direction, and the center of the third mounting hole 22hA is located at the center of the width direction (center of the Y direction) of the second part 22A.

[0258] A pair of heat sinks 24f in the middle part of the Y direction of region R3 are separated from the outer edges of the second mounting hole 21hB and the third mounting hole 22hA, respectively, and are located at the two ends of the width direction of the first part 21A and the second part 22A.

[0259] Figure 19 The four heat sinks 24f shown are arranged at unequal intervals in the width direction (Y direction). The interval between the heat sinks 24f is widened in the center of the width direction to easily avoid the second mounting hole 21hB and the third mounting hole 22hA. Figure 18 , Figure 20 The multiple heat sinks 24f shown are arranged at equal intervals in the width direction (Y direction).

[0260] By arranging multiple heat sinks 24f in a manner that avoids the second mounting hole 21hB in the first part 21A and the third mounting hole 22hA in the second part 22A, it is possible to perform a fastening operation by using the second mounting hole 21hB to fasten the connected object component and a fastening operation by using the third mounting hole 22hA to fasten the busbar 42.

[0261] Figure 20 This indicates a structure in which wall-shaped heat sinks 24f are provided at three locations in the middle part and five locations at both ends of the region forming an included angle θ1 in the Y direction of the connecting component 20A. Figure 21 yes Figure 20 Z1 view.

[0262] The first part 21A has a second mounting hole 21hB that extends through the first part 21A in the X direction (second direction) and can be fastened to a connecting component. The second mounting hole 21hB is circular when viewed from the X direction in a frontal view, and the center of the second mounting hole 21hB is offset to one side in the width direction relative to the center in the width direction (center in the Y direction) of the first part 21A.

[0263] The second part 22A has a third mounting hole 22hA that penetrates the second part 22A in the Z direction (first direction) and can be fastened to the busbar 42. The third mounting hole 22hA is circular when viewed from above in the Z direction, and its center is offset to the other side in the width direction relative to the center of the second part 22A in the width direction (center in the Y direction). That is, the second mounting hole 21hB and the third mounting hole 22hA are offset from each other in the Y direction.

[0264] Of the five heat sinks 24f, a pair of heat sinks 24f located at both ends in the width direction are separated from the outer edges of the second mounting hole 21hB and the third mounting hole 22hA, respectively, and are located at the two ends in the width direction of the first part 21A and the second part 22A. The three heat sinks 24f located in the middle of the width direction include: a heat sink 24f located at a position overlapping the second mounting hole 21hB in the width direction; a heat sink 24f located at a position overlapping the third mounting hole 22hA in the width direction; and a heat sink 24f located in the middle of the width direction, separated from the outer edges of the second mounting hole 21hB and the third mounting hole 22hA.

[0265] The heat sink 24f (denoted by reference numeral 24f” in the figure) located at a position overlapping with the third mounting hole 22hA of the second portion 22A in the width direction is formed to be shorter in the second direction (X direction) than the heat sink 24f located at a position not overlapping with the third mounting hole 22hA in the width direction. According to this structure, the length of the heat sink 24f” in the second direction can be set to be close to the third mounting hole 22hA, avoiding interference between the heat sink 24f” and the third mounting hole 22hA.

[0266] The heat sink 24f (denoted by reference numeral 24f' in the figure), located at a position overlapping the second mounting hole 21hB of the first portion 21A in the width direction, is formed to be shorter in the first direction (Z direction) than the heat sink 24f located at a position not overlapping the second mounting hole 21hB in the width direction. According to this structure, the length of the heat sink 24f' in the first direction can be set close to the second mounting hole 21hB, avoiding interference between the heat sink 24f' and the second mounting hole 21hB.

[0267] By arranging multiple heat sinks 24f in a manner that avoids the second mounting hole 21hB of the first part 21A and the third mounting hole 22hA of the second part 22A, it is possible to perform a fastening operation by using the second mounting hole 21hB to fasten the connected object component and a fastening operation by using the third mounting hole 22hA to fasten the busbar 42.

[0268] At this point, the heat sink 24f is configured not only to avoid the second mounting hole 21hB and the third mounting hole 22hA, but also to avoid, for example, an area (fastening area R3) corresponding to the size of the head of the bolt that is inserted into the second mounting hole 21hB and the third mounting hole 22hA respectively. The multiple heat sinks 24f not only avoid the fastening area R3 on the front surface 21b of the first part 21A and the upper surface 22b of the second part 22A respectively, but also avoid the fastening area R3 at the position where they separate in front of the front surface 21b, and also avoid the fastening area R3 at the position where they separate above the upper surface 22b.

[0269] That is, when viewed from the X direction (axial direction of the second mounting hole 21hB), the multiple heat sinks 24f do not overlap with the fastening area R3. This structure allows for the installation, removal, and tightening of bolts from the X direction into the second mounting hole 21hB. Furthermore, when viewed from the Z direction (axial direction of the third mounting hole 22hA), the multiple heat sinks 24f do not overlap with the fastening area R3. This structure also allows for the installation, removal, and tightening of bolts from the Z direction into the third mounting hole 22hA.

[0270] Figure 21 yes Figure 20 Z1 view.

[0271] like Figure 21As shown, in the region R4 below the second part 22A of the connecting member 20A (the region overlapping with the plurality of heat sinks 24f in the Z direction), a heat-conducting member 95, identical to the heat-conducting member 92, is disposed between the metal plate 80 and the wiring substrate 40 (including the busbar 42). In other words, the heat-conducting member 95 is disposed at a position overlapping with the plurality of heat sinks 24f of the connecting member 20A (and region R3) when viewed from the Z direction. According to this structure, the heat accumulated in the connecting member 20A is dissipated not only from the heat sinks 24f but also via the busbar 42 and the heat-conducting member 95 to the metal plate 80 on the bottom side of the electrical connection unit 1.

[0272] Reference Figure 6 , Figure 7 as well as Figures 18 to 20 In this embodiment, the connecting member 20A includes a plurality of heat sinks 24f extending along a first direction (Z direction) and a second direction (X direction) as a heat dissipation structure 24 connected to the first part 21A and the second part 22A. The heat sinks 24f are connected to the first part 21A and to a portion of the second part 22A that avoids the third mounting hole 22hA.

[0273] According to this structure, by using the connecting member 20A as a heat storage member to receive heat from the connected component, and by providing a heat dissipation structure 24 having multiple heat sinks 24f connected to the first part 21A and the second part 22A, the heat dissipation performance of the connected component can be improved. By connecting the heat sinks 24f to the portion of the second part 22A that avoids the third mounting hole 22hA, it is possible to prevent the heat sinks 24f from becoming an obstruction when fixing the connecting member 20A to the busbar 42. Furthermore, while the heat dissipation structure 24 of this embodiment has multiple heat sinks 24f, it does not preclude the heat sinks 24f from being a single structure.

[0274] Reference Figures 18 to 20 In the connecting component 20A of the embodiment, the second mounting hole 21hB penetrates the first part 21A in the second direction (X direction), and the heat sink 24f is connected to the part of the first part 21A that avoids the second mounting hole 21hB.

[0275] According to this structure, the heat sink 24f is connected to the portion of the first part 21A that avoids the second mounting hole 21hB, thereby preventing the heat sink 24f from becoming an obstacle when fixing the connecting member 20A to the connecting member.

[0276] In the connecting member 20A of the embodiment, the closer the heat sink 24f is to the second part 22A in the first direction (Z direction), the greater its length in the second direction (X direction).

[0277] According to this structure, the heat sink 24f is longer the closer it is to the second part 22A in the first direction, thereby ensuring the heat dissipation area of ​​the heat sink 24f. The heat sink 24f is shorter the further it is from the second part 22A in the first direction, which enables the compactness of the connecting component 20A.

[0278] Reference Figure 20 In the connecting member 20A of the embodiment, there are a plurality of heat sinks 24f arranged in a third direction (Y direction) that intersects the first direction and the second direction. The heat sink 24f” located in the third direction that overlaps with the third mounting hole 22hA of the second part 22A is formed to be shorter in the second direction than the heat sink 24f located in the third direction that does not overlap with the third mounting hole 22hA.

[0279] According to this structure, the heat sink 24f” located at the position overlapping with the third mounting hole 22hA in the third direction is formed to be shorter in the second direction, thereby avoiding interference between the third mounting hole 22hA and the heat sink 24f in the second direction.

[0280] In the connection component of the embodiment, the first mounting hole penetrates the first portion 21A in the second direction (X direction), and the heat sink 24f' located at the position overlapping with the second mounting hole 21hB of the first portion 21A in the third direction (Y direction) is formed to be shorter in the first direction than the heat sink 24f located at the position not overlapping with the second mounting hole 21hB in the third direction.

[0281] According to this structure, the heat sink 24f' located at the position where it overlaps with the second mounting hole 21hB in the third direction is formed to be shorter in the first direction, thereby avoiding interference between the second mounting hole 21hB and the heat sink 24f in the first direction.

[0282] Reference Figure 18 , Figure 20 In the connecting member 20A of the embodiment, the second mounting hole 21hB and the third mounting hole 22hA are configured at different positions in the third direction.

[0283] According to this structure, by staggering the second mounting hole 21hB and the third mounting hole 22hA, the freedom of configuration and shape of the multiple heat sinks 24f can be increased, thereby improving the heat dissipation of the connected components.

[0284] Here, refer to Figure 16 , Figures 17 to 20 In the connecting component 20A of the embodiment, the plate thickness T1 of the first part 21A and the plate thickness T2 of the second part 22A are respectively thicker than the plate thickness T3 of the busbar 42, and the plate thickness T4 of the heat sink 24f is formed to be thinner than the plate thickness T3 of the busbar 42.

[0285] According to this structure, by making the thicknesses T1 and T2 of the first part 21A and the second part 22A thicker than the thickness T3 of the busbar 42, the heat capacity of the connecting component 20A can be ensured, and by making the thickness T4 of the heat sink 24f thinner than the thickness T3 of the busbar 42, the number of heat sinks 24f can be increased to improve heat dissipation.

[0286] Reference Figures 1 to 4 The electrical connection unit 1 in the embodiment includes a busbar 42, connection objects 10, 75, 76 and a connection member 20A.

[0287] According to this structure, the connecting component 20A can function as a heat storage component that receives heat from the connected components 10, 75, and 76, and the heat dissipation of the connecting component 20A and even the connected components 10, 75, and 76 can be improved.

[0288] Reference Figure 13 , Figure 16 , Figure 21 In the electrical connection unit 1 of the embodiment, there is also a metal plate 80 on the bottom side and a heat-conducting component 95 disposed between the metal plate 80 and the busbar 42. When viewed from the first direction (Z direction), the heat-conducting component 95 is located at a position overlapping with the heat sink 24f.

[0289] According to this structure, the connecting member 20A functions as a heat storage member that receives heat from the connected components 10, 75, and 76, and the heat accumulated in the connecting member 20A is dissipated from the heat sink 24f and dispersed to the bottom metal plate 80 via the busbar 42 and the heat-conducting member 95. Therefore, the heat dissipation of the connecting member 20A and even the connected components 10, 75, and 76 can be improved.

[0290] <Variation Example>

[0291] Next, several variations will be described. Furthermore, in each variation, the structure other than that described below is the same as the structure of the above embodiment.

[0292] (First variation)

[0293] The wiring substrate 40 is not limited to a structure in which the base plate 41 and the busbar 42 are integrally formed by insert molding. For example, the busbar 42 may be disposed in the receiving portion 55 after the base plate 41, which is provided with a receiving portion 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 may be fixed to the receiving portion 55 by fitting, or by adhesive or other fixing methods. In these cases, potting may also be performed to fill the gap between the busbar 42 and the receiving portion 55.

[0294] (Second variation)

[0295] The base component of the wiring substrate 40 is not limited to a base plate 41 having a plate-shaped planar portion 51. The wiring substrate 40 may also be a base component having a sheet-shaped planar portion 51 (e.g., an insulating sheet). In this case, the receiving portion 55 may be formed by making a portion of the planar portion 51 follow the shape of the busbar 42. It should be noted that in the present invention, "sheet-shaped" or "sheet" is not limited to a component with a thickness of 1 mm or more, and may also be a component with a thickness of less than 1 mm (a so-called film).

[0296] (Third variation)

[0297] The substrate 41 of the wiring substrate 40 may include multiple components (plate components or sheet components). These multiple components are arranged such that multiple busbars 42 arranged in a horizontal direction are sandwiched between, for example, both sides in the Z direction. For example, the multiple components are integrally formed by sandwiching the multiple busbars 42 together, for example, through lamination. The multiple components form a planar portion 51. In this case, a receiving portion 55 may also be formed hollow inside the substrate 41 (between the multiple components). The multiple components may be multiple plate components, multiple sheet components, or a combination of plate components and sheet components. A sheet component may, for example, be a flexible sheet component. The planar portion 51 formed by the multiple components has an opening that exposes at least the first connecting portion 61 and the second connecting portion 62 of the busbars 42. For example, in this case, the receiving portion 55 formed between the multiple components is equivalent to an example of a "receiving portion recessed in the first direction (Z direction)".

[0298] (Fourth variation)

[0299] The connection between the electronic component 10 and the busbar 42 is not limited to the connection via the connecting member 20. The electronic component 10 may also be directly connected to the busbar 42 using fastening members (e.g., bolts, screws) or welding.

[0300] The above describes several embodiments and modifications. However, the embodiments and modifications are not limited to the examples described above. For example, multiple embodiments can be combined with each other to achieve the desired effect.

[0301] Explanation of reference numerals in the attached figures

[0302] 1 Electrical connection unit

[0303] 10, 75, 76 Connecting Object Components

[0304] 10. Electronic components (connecting components)

[0305] 13 terminals

[0306] 20A Connecting Components

[0307] 21A First part

[0308] 21hA First mounting hole

[0309] 22A Second part

[0310] 22hA Third mounting hole (Second mounting hole)

[0311] 24 Heat dissipation structure

[0312] 24f, 24f’ Heat sink (fin)

[0313] 24x Length in the second direction

[0314] 42 Bus bar

[0315] 75 Connecting bus bar (Connected object part)

[0316] 76 External connection bus bar (Connected object part)

[0317] 80 Metal plate (Japanese: Metal plate)

[0318] 95 Heat conducting part

[0319] T1 Plate thickness of the first part

[0320] T2 Plate thickness of the second part

[0321] T3 Plate thickness of the bus bar

[0322] T4 Plate thickness of the fin

Claims

1. A connecting component, characterized in that, Connect the busbar to the connecting component, wherein the connecting component includes: The first part extends along a first direction; The second part extends from one end of the first part in the first direction along a second direction intersecting the first direction, and is fixed to the busbar in the first direction opposite to the busbar; and A heat dissipation structure, which is connected to the first part and the second part. The first part has a first mounting hole opposite to the connected object component. The second portion has a second mounting hole that extends through the second portion along the first direction and is opposite to the busbar. The heat dissipation structure includes one or more fins extending along the first direction and the second direction. The fins are connected to the first portion and to a portion of the second portion that avoids the second mounting hole.

2. The connecting component according to claim 1, characterized in that, The first mounting hole penetrates the first portion in the second direction. The fins are connected to the portion of the first part that avoids the first mounting hole.

3. The connecting component according to claim 1, characterized in that, The closer the fin is to the second portion in the first direction, the greater its length in the second direction.

4. The connecting component according to claim 1, characterized in that, When the direction intersecting the first direction and the second direction is designated as the third direction... The connecting component has a plurality of fins arranged upwards on the third side. The fin located in the third direction at a position overlapping with the second mounting hole of the second portion is formed to be shorter in the second direction than the fin located in the third direction at a position not overlapping with the second mounting hole.

5. The connecting component according to claim 1, characterized in that, When the direction intersecting the first direction and the second direction is designated as the third direction... The connecting component has a plurality of fins arranged upwards on the third side. The first mounting hole penetrates the first portion in the second direction. The fin located in the third direction at a position overlapping with the first mounting hole of the first portion is formed to be shorter in the first direction than the fin located in the third direction at a position not overlapping with the first mounting hole.

6. The connecting component according to claim 5, characterized in that, The first mounting hole and the second mounting hole are configured at different positions in the third direction.

7. The connecting component according to claim 1, characterized in that, The thickness of the first portion and the thickness of the second portion are both greater than the thickness of the busbar, and the thickness of the fin is less than the thickness of the busbar.

8. An electrical connection unit, characterized in that... It comprises: the busbar; the connecting object component; and the connecting component according to any one of claims 1 to 7.

9. The electrical connection unit according to claim 8, characterized in that, The electrical connection unit also includes: The metal plate on the bottom side; and A heat-conducting component is disposed between the metal plate and the busbar. The heat-conducting component overlaps with the fins when viewed from the first direction.

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