Two-sided PCB ML edging manufacturing method and two-sided PCB
By drilling positioning holes on double-sided PCBs and equipping them with pin devices, the edge grinding production line of multi-layer PCBs can automatically perform edge grinding, solving the problem of high equipment purchase costs in existing technologies and achieving efficient and low-cost edge grinding.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-17
- Publication Date
- 2026-04-03
AI Technical Summary
In the existing technology, the ML edge grinding process for double-sided PCB boards requires the purchase of separate equipment, resulting in high production costs and large factory space requirements.
Positioning holes are drilled on double-sided PCBs and equipped with pin devices. The multi-layer PCB edge grinding production line is used for automatic cutting and grinding, reducing investment in special equipment and space occupation.
It improved equipment utilization, reduced production costs, optimized factory space utilization, and achieved efficient edge grinding.
Smart Images
Figure CN121793249A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of PCB edge grinding technology, specifically to a method for manufacturing double-sided PCB ML edge grinding and a double-sided PCB. Background Technology
[0002] Double-sided PCBs are a commonly used type of printed circuit board in the field of electronic engineering. Their core feature is that both sides of the substrate are covered with copper foil conductive layers, and interlayer electrical connections are achieved through metallized vias. Due to their compact structure, stable performance and controllable cost, double-sided PCBs have become a key basic component for the miniaturization and intelligence of electronic devices, and will continue to evolve towards higher density and more environmentally friendly directions in the future.
[0003] The production process of printed circuit boards (PCBs) involves the edge grinding process of double-sided PCBs. Because double-sided boards are flat coated epoxy resin boards, the edges are cut with a normal cutting knife, which may cause roughness and resin powder to fall off, affecting the production of subsequent PCB processes. Edge grinding is required to successfully complete the subsequent processes.
[0004] In the current technology, the manufacturing method of double-sided PCB boards is to configure a separate double-sided PCB board edge grinding production line, and use edge positioning conveyor rollers to complete the edge grinding on the edge grinding knife. However, this method requires the purchase of separate equipment, occupies a large factory space, and increases the production cost of double-sided PCB boards. Summary of the Invention
[0005] To address the shortcomings of existing technologies, this invention provides a method for manufacturing double-sided PCBs using ML edge grinding and a double-sided PCB, which solves the problem that existing methods for manufacturing double-sided PCBs using ML edge grinding require the purchase of separate equipment, increasing the production cost of double-sided PCBs.
[0006] To achieve the above objectives, the present invention provides the following technical solution: a method for manufacturing double-sided PCB board ML edge grinding, comprising a multilayer PCB board edge grinding production line and a double-sided PCB board, wherein the surface of the double-sided PCB board is provided with two positioning holes drilled by a double-sided PCB board pinning machine, and the multilayer PCB board edge grinding production line is provided with two pinning devices adapted to the positioning holes.
[0007] Furthermore, the double-sided PCB board includes any one of the commonly used FR4, aluminum and copper PCB boards.
[0008] Furthermore, the double-sided pinning machine has openings that are adapted to the two positioning holes.
[0009] Furthermore, the positioning hole can be freely and smoothly fitted onto the pin device for accurate positioning.
[0010] Furthermore, after the pin device is fitted into the positioning hole, the required length and width are input at the control terminal of the multilayer PCB board edge grinding production line for automatic edge grinding.
[0011] A double-sided PCB board is manufactured using the aforementioned double-sided PCB board ML edge grinding method.
[0012] Compared with existing technologies, this invention drills two positioning holes at the required positions on the double-sided PCB board using a double-sided pinning machine. In conjunction with two pinning devices on a multi-layer PCB board edge grinding production line, the two positioning holes are fitted onto the pinning devices to achieve accurate positioning. The multi-layer PCB board edge grinding production line can automatically cut and grind by inputting standard dimensions such as length and width, thereby improving the utilization rate of existing ML cutting and grinding line equipment, reducing investment in special equipment and the utilization rate of factory space, effectively reducing production costs and improving equipment utilization. Attached Figure Description
[0013] Figure 1 This is a top view of the double-sided PCB board in this invention.
[0014] In the diagram: 1. Multilayer PCB edge grinding production line; 2. Positioning hole; 3. Pin device; 4. ML cutting and grinding line edge grinding knife; 5. Double-sided PCB board. Detailed Implementation
[0015] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0016] Please see Figure 1 The present invention provides a technical solution: a method for manufacturing double-sided PCB board ML edge grinding, including a multilayer PCB board edge grinding production line 1 and a double-sided PCB board 5. The surface of the double-sided PCB board 5 is provided with two positioning holes 2 drilled by a double-sided PCB board pinning machine. The multilayer PCB board edge grinding production line 1 is provided with two pinning devices 3 that are adapted to the positioning holes 2.
[0017] Two pin devices 3 are added to the multi-layer PCB board cutting and grinding production line 1. The double-sided PCB board pinning machine drills two positioning holes 2 at the required positions of the double-sided PCB board 5. With the help of the two pin devices 3 on the multi-layer PCB board grinding production line 1, the two positioning holes 2 are fitted into the pin devices 3 to achieve accurate positioning.
[0018] The multilayer PCB board edge grinding production line 1 inputs standard dimensions such as length and width. After the ML cutting and grinding line edge grinding knife 4 moves along the preset position, it can realize automatic cutting and grinding, improve the utilization rate of existing ML cutting and grinding line equipment, reduce investment in special equipment and the utilization rate of factory space, effectively reduce production costs and improve equipment utilization.
[0019] Double-sided PCB board 5 includes any one of the commonly used FR4, aluminum and copper PCB materials.
[0020] The double-sided pinning machine has openings that match the two positioning holes 2.
[0021] Positioning hole 2 can be freely and smoothly inserted into pin device 3 for accurate positioning.
[0022] After the pin device 3 is fitted onto the positioning hole 2, the required length and width are input at the control end of the multilayer PCB board edge grinding production line 1 for automatic edge grinding.
[0023] During the edge grinding design, two positioning holes 2 are drilled on the edge of the double-sided PCB board 5 to achieve accurate positioning of the multi-layer PCB board edge grinding production line 1. This allows the edge of the double-sided PCB board 5 to be ground off using the multi-layer PCB board edge grinding production line 1. A double-sided PCB board is manufactured using the aforementioned double-sided PCB board ML edge grinding method.
[0024] During operation, the double-sided PCB pinning machine drills two positioning holes 2 at the required positions on the double-sided PCB board 5. In conjunction with the two pinning devices 3 on the multi-layer PCB board edge grinding production line 1, the two positioning holes 2 are fitted onto the pinning devices 3 to achieve accurate positioning. The multi-layer PCB board edge grinding production line 1 inputs standard dimensions such as length and width. After the edge grinding knife 4 of the ML cutting and grinding line moves along the preset position, automatic cutting and grinding can be achieved, improving the utilization rate of the existing ML cutting and grinding line equipment, effectively reducing production costs and improving equipment utilization.
[0025] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0026] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A method for manufacturing double-sided PCB board ML edge grinding, comprising a multilayer PCB board edge grinding production line (1) and a double-sided PCB board (5), characterized in that: The surface of the double-sided PCB board (5) is provided with two positioning holes (2) drilled by a double-sided PCB pinning machine, and the multi-layer PCB board edge grinding production line (1) is provided with two pinning devices (3) that are adapted to the positioning holes (2).
2. The method for manufacturing a double-sided PCB board ML edge grinding according to claim 1, characterized in that: The double-sided PCB board (5) includes any one of the commonly used FR4, aluminum and copper PCB boards.
3. The method for manufacturing a double-sided PCB board ML edge grinding according to claim 1, characterized in that: The double-sided pinning machine has openings that are adapted to the two positioning holes (2).
4. The method for manufacturing a double-sided PCB board ML edge grinding according to claim 1, characterized in that: The positioning hole (2) can be freely and smoothly inserted into the pin device (3) for accurate positioning.
5. The method for manufacturing a double-sided PCB board ML edge grinding according to claim 1, characterized in that: After the positioning hole (2) is fitted with the pin device (3), the required length and width are input at the control end of the multilayer PCB board edge grinding production line (1) for automatic edge grinding.
6. A double-sided PCB board, characterized in that, It is manufactured using the double-sided PCB board ML edge grinding method according to any one of claims 1-5.