Anisotropic conductive substrate and method for using same

Abstract

A method of making at least one universal substrate from a mass product. The method comprises the following steps: providing a preform with a predetermined profile; winding a plurality of conductors on the outer surface of the preform; implanting a non-conductive matrix between conductors of the plurality of conductors, where the non-conductive matrix penetrates between interstitial spaces of the plurality of conductors to isolate some of the plurality of conductors from each other; forming a bulk product comprising a plurality of conductors and a non-conductive matrix; and slicing at least one section of the batch product to form at least one universal substrate. The plurality of conductors of the at least one universal substrate define a first connection surface, a second connection surface opposite the first connection surface, and a plurality of conductive paths defined between the first connection surface and the second connection surface.

Description

Technical Field

[0001] This disclosure relates to universal interconnects or substrates and methods of using them. Background Technology

[0002] In the electronics market, electronic devices and integrated circuits encompass numerous products and / or components implemented within desired electrical systems or products. Generally, these electronic devices and integrated circuits are arranged vertically to save space and overall footprint. With this arrangement, each device and component must be precisely connected in complex locations within a vertical plane while avoiding electrical problems.

[0003] To overcome these difficulties, current commercially available electronic devices and integrated circuits utilize vertical electrical connection products, such as through-substrate vias (TSVs) or through-chip vias (BVs) for establishing electrical connections. While these products are desirable in electronic devices and integrated circuits, they still present challenges when building them. In one example, TSVs and other similar vertical electrical connection products must be formed from non-conductive substrate materials such as passivated silicon, glass, and other similar non-conductive substrates. While these non-conductive substrate materials are suitable, they are quite expensive and difficult to procure when forming these products. In another scenario, TSVs and other vertical electrical connection products are designed for specific circuits or devices. Due to this specificity, manufacturing these TSVs and similar products requires creating vias and / or channels through the substrate material to lay conductive traces and / or materials for various circuits. This fabrication requires mechanical means to accurately cut these vias and channels, leading to increased costs, increased setup time, and limitations in applying these products to other electronic devices and integrated circuits.

[0004] Furthermore, when solder balls or plated metal pillars are provided in electronic devices and integrated circuits, these products are designed to be used in conjunction with solder balls or plated metal pillars. When solder balls are used in these electronic devices and integrated circuits, they need to be individually placed on through-holes in the substrate and on the device, requiring precise alignment of the shield or ball dropper with the component. When plated metal pillars are used in these electronic devices and integrated circuits, the plating technology requires the use of wet chemicals. However, when these products have varying heights and thicknesses, this plating technology makes it difficult to achieve uniform plating thickness. Summary of the Invention

[0005] The currently disclosed universal substrates enable designers of electronic devices (such as devices-on-devices) or integrated circuits to connect devices and circuits of various types to the universal substrate, which is provided with versatile patterns and / or configurations. The universal substrate is electrically or thermally conductive in a first or vertical axis, and non-electrically or thermally conductive in a second axis orthogonal to the first axis. The universal substrate also includes multiple conductors provided in versatile patterns and / or configurations to allow random and / or unplanned electrical connections between devices and components. In this way, the universal substrates disclosed herein address some of the shortcomings of previously known through-substrate via products.

[0006] In one embodiment, an exemplary embodiment of this disclosure may provide a universal substrate. The universal substrate may include a plurality of conductors defining a first connection surface, a second connection surface opposite to the first connection surface, and a plurality of conductive paths defined between the first and second connection surfaces. The universal substrate may also include a non-conductive matrix surrounding the plurality of conductors and configured to isolate each of the plurality of conductors from each other along an axis perpendicular to the plurality of conductive paths. The universal substrate is capable of achieving conductivity between at least two devices at any two locations along the first and second connection surfaces, which are coaxial with each other.

[0007] This exemplary embodiment or another exemplary embodiment may further include: the plurality of conductors being one of conducting electricity between the first connection surface and the second connection surface to provide electrical communication between at least two devices, and conducting heat between the first connection surface and the second connection surface to provide directional heat flow through a non-conductive matrix. This exemplary embodiment or another exemplary embodiment may further include: each of the plurality of conductors comprising: a first connection end defining a portion of the first connection surface; a second connection end opposite to the first connection end and defining a portion of the second connection surface; and a conductive path defined between the first connection end and the second connection end for enabling one of conductivity and thermal conductivity. This exemplary embodiment or another exemplary embodiment may further include the diameter defined by each of the plurality of conductors between the first connection end and the second connection end; wherein the diameters of each of the plurality of conductors are equal to each other. This exemplary embodiment or another exemplary embodiment may further include: at least one set of conductors of the plurality of conductors, wherein each of the at least one set of conductors defines a first diameter; and at least another set of conductors of the plurality of conductors, wherein each of the at least another set of conductors defines a second diameter, the second diameter being larger than the first diameter defined by each of the at least one set of conductors. This exemplary embodiment or another exemplary embodiment may further include: a pair of first bonding pads defined by a first connection end of at least one set of conductors of the plurality of conductors and a second connection end of at least one set of conductors of the plurality of conductors; and a pair of second bonding pads defined by a first connection end of at least another set of conductors of the plurality of conductors and a second connection end of at least another set of conductors of the plurality of conductors; wherein the pair of first bonding pads and the pair of second bonding pads have diameters equal to or different from each other. This exemplary embodiment or another exemplary embodiment may further include a non-conductive matrix comprising: a first end and a second end longitudinally opposite to the first end; a first side extending between the first end and the second end; and a second side extending between the first end and the second end and laterally opposite to the first side; wherein the non-conductive matrix is ​​a solid, single material between the first end and the second end and between the first side and the second side to encapsulate the plurality of conductors. This exemplary embodiment or another exemplary embodiment may further include a non-conductive matrix comprising: a set of first non-conductive channels defined between the first end and the second end and perpendicular to each of the plurality of conductive channels; wherein the set of first non-conductive channels isolates the conductivity and thermal conductivity between each of the plurality of conductors. This exemplary embodiment or another exemplary embodiment may further include a non-conductive matrix comprising: a set of second non-conductive channels defined between the first side and the second side and perpendicular to each of the plurality of conductive channels; wherein the set of second non-conductive channels isolates the conductivity and thermal conductivity of each of the plurality of conductors from each other.This exemplary embodiment or another exemplary embodiment may further include multiple conductive elements comprising: a group of first conductors conductively bonded to a first electronic device of at least two devices on a first connection surface and to a second electronic device of at least two devices on a second connection surface; and a group of second conductors conductively disengaged from at least two devices at the first connection surface and the second connection surface; wherein at least one conductor of the group of second conductors separates a first group of the group of first conductors from a second group of the group of first conductors. This exemplary embodiment or another exemplary embodiment may further include multiple conductive elements comprising: a group of first conductors conductively bonded to a first electronic device of at least two devices on a first connection surface and to a second electronic device of at least two devices on a second connection surface; a group of second conductors conductively disengaged from at least two devices at the first connection surface and the second connection surface; and a group of third conductors conductively bonded to a first electronic device on a first connection surface and to a second electronic device on a second connection surface; wherein at least two conductors of the group of third conductors shield at least one conductor of the group of first conductors. This exemplary embodiment or another exemplary embodiment may further include at least one conductive trace operatively engaged with at least one of a first connection surface and a second connection surface; wherein the conductive trace is adapted to provide conductivity between a first electronic device of at least two devices and a second electronic device of at least two devices, the devices being non-coaxial with each other. This exemplary embodiment or another exemplary embodiment may further include: a plurality of conductors arranged in a uniform pattern on the inside of a non-conductive substrate, or arranged in a non-uniform pattern on the inside of a non-conductive substrate.

[0008] In another embodiment, an exemplary embodiment of this disclosure provides a method. The method includes the steps of: providing a plurality of conductors in one of a uniform pattern or in a non-uniform pattern; forming a non-conductive matrix around each of the plurality of conductors to create a universal substrate; connecting at least one device to a first connection surface of the universal substrate defined by the plurality of conductors; connecting at least another device to a second connection surface of the universal substrate defined by the plurality of conductors; and enabling electrical conductivity between the at least one device and the at least other device through a plurality of conductive pathways defined between the first connection surface and the second connection surface.

[0009] This exemplary embodiment or another exemplary embodiment may further include the step of forming a non-conductive matrix around each of the plurality of conductors, which further includes isolating each of the plurality of conductors from each other along an axis perpendicular to the plurality of conductive paths through the non-conductive matrix. This exemplary embodiment or another exemplary embodiment may further include the step of connecting at least one device to a first connection surface and connecting at least another device to a second connection surface, which further includes connecting at least one device and at least another device to at least one conductor of the plurality of conductors such that at least one device and at least another device are coaxial with each other or biased with each other relative to at least one conductor. This exemplary embodiment or another exemplary embodiment may further include the step of connecting at least one device to the first connection surface and connecting at least another device to the second connection surface, which further includes connecting at least one device to a pair of first bonding pads defined by a first connection end of at least one set of conductors of the plurality of conductors and a second connection end of at least one set of conductors of the plurality of conductors; and connecting at least another device to a pair of second bonding pads defined by a first connection end of at least another set of conductors of the plurality of conductors and a second connection end of at least another set of conductors of the plurality of conductors; wherein the pair of first bonding pads and the pair of second bonding pads have diameters that are equal to or different from each other. This exemplary embodiment or another exemplary embodiment may further include the steps of connecting at least one device to a first connection surface and connecting at least another device to a second connection surface, which further include: connecting at least one device to a set of first conductors on the first connection surface and connecting at least another device to the set of first conductors on the second connection surface; and connecting at least one device to a set of second conductors on the first connection surface and connecting at least another device to the set of second conductors on the second connection surface; wherein at least two conductors of the set of second conductors shield at least one conductor of the set of first conductors. This exemplary embodiment or another exemplary embodiment may further include the steps of connecting at least one device to the first connection surface and connecting at least another device to the second connection surface, which further include: at least one device and at least another device being freely connected to the first connection surface and the second connection surface at non-designated locations. This exemplary embodiment or another exemplary embodiment may further include the step of enabling conductivity between at least one device and at least another device through a plurality of conductive paths, which further includes: the plurality of conductive paths providing conductivity between at least one device and at least another device, or thermal conductivity between at least one device and at least another device, to provide directional heat flow through a non-conductive substrate.

[0010] In another embodiment, an exemplary embodiment of this disclosure provides a method. The method includes the steps of: providing a preform having a predetermined profile; winding a plurality of conductors around an outer surface of the preform; injecting a non-conductive matrix between the conductors of the plurality of conductors, wherein the non-conductive matrix permeates between the gaps between the conductors to isolate some of the conductors from each other; forming a batch product comprising the plurality of conductors and the non-conductive matrix; and slicing at least one segment of the batch product to form at least one universal substrate, wherein the plurality of conductors of the at least one universal substrate define a first connection surface, a second connection surface opposite to the first connection surface, and a plurality of conductive pathways defined between the first connection surface and the second connection surface.

[0011] This exemplary embodiment or another exemplary embodiment may further include: the plurality of conductors of at least one general-purpose substrate being conductive between a first connection surface and a second connection surface to provide electrical communication between at least two devices, and conducting heat between the first connection surface and the second connection surface to provide directional heat flow through at least one general-purpose substrate between at least two devices. This exemplary embodiment or another exemplary embodiment may further include: the step of winding the plurality of conductors further includes: winding the plurality of conductors on the outer surface of the preform in one of a uniform pattern or in a non-uniform pattern. This exemplary embodiment or another exemplary embodiment may further include: the step of winding the plurality of conductors further includes: each of the plurality of conductors defining a diameter defined between a first connection end defining a portion of the first connection surface and a second connection end defining a portion of the second connection surface; wherein the diameters of each of the plurality of conductors are equal to each other. This exemplary embodiment or another exemplary embodiment may further include, in the step of winding the plurality of conductors, the step of winding a first set of conductors of the plurality of conductors around the outer surface of the preform, wherein each conductor of the first set of conductors defines a first diameter defined between a first connecting end defining a portion of a first connecting surface and a second connecting end defining a portion of a second connecting surface; and winding a second set of conductors of the plurality of conductors around the outer surface of the preform, wherein each conductor of the second set of conductors defines a second diameter defined between a first connecting end defining a portion of a first connecting surface and a second connecting end defining a portion of a second connecting surface; wherein the second diameter of the second set of conductors is greater than the first diameter of the first set of conductors. This exemplary embodiment or another exemplary embodiment may further include: a first connector for bonding a pair of first bonding pads to a first set of conductors of the plurality of conductors of at least one universal substrate, and a second connector for bonding a pair of second bonding pads to a first connector for a second set of conductors of the plurality of conductors of at least one universal substrate and a second connector for bonding a pair of second bonding pads to a second set of conductors of the plurality of conductors of at least one universal substrate; wherein the pair of first bonding pads and the pair of second bonding pads have diameters that are equal to or different from each other. This exemplary embodiment or another exemplary embodiment may further include: encapsulating at least one general-purpose substrate with a passivation material; and removing several segments of the passivation material from at least one general-purpose substrate before bonding the pair of first bonding pads and the pair of second bonding pads.This exemplary embodiment or another exemplary embodiment may further include: conductively bonding a group of first conductors of a plurality of conductors of at least one general-purpose substrate to a first electronic device of at least two devices on a first connection surface and conductively bonding to a second electronic device of at least two devices on a second connection surface; and conductively disengaging a group of second conductors of a plurality of conductors of at least one general-purpose substrate from the at least two devices on the first and second connection surfaces; wherein at least one conductor of the group of second conductors separates a first group and a second group of the group of first conductors from each other. This exemplary embodiment or another exemplary embodiment may further include: conductively bonding a group of first conductors of a plurality of conductors of at least one general-purpose substrate to a first electronic device of at least two devices on a first connection surface and to a second electronic device of at least two devices on a second connection surface; conductively disengaging a group of second conductors of a plurality of conductors of at least one general-purpose substrate from the at least two devices on the first and second connection surfaces; and conductively bonding a group of third conductors of a plurality of conductors of at least one general-purpose substrate to a first electronic device on a first connection surface and to a second electronic device on a second connection surface; wherein at least two conductors of the group of third conductors shield at least one conductor of the group of first conductors. This exemplary embodiment or another exemplary embodiment may further include: conductively engaging at least one conductive trace with at least one of a first connection surface and a second connection surface of at least one general-purpose substrate; wherein the at least one conductive trace is adapted to provide conductivity between a first electronic device and a second electronic device of at least two devices that are coaxial with each other. This exemplary embodiment or another exemplary embodiment may further include: winding a plurality of dielectric strands around the outer surface of the preform. This exemplary embodiment or another exemplary embodiment may further include the step of providing a preform having a predetermined profile, which further includes: the preform defining a circular profile having a circular outer surface; and wherein the step of slicing at least one segment of the batch product to form at least one general-purpose substrate further includes: at least the general-purpose substrate defining a circular configuration. This exemplary embodiment or another exemplary embodiment may further include: conductively engaging a first radio frequency (RF) connector of at least one general-purpose substrate with a first radio frequency device; and conductively engaging a second radio frequency (RF) connector of at least one general-purpose substrate with a second radio frequency device. This exemplary embodiment or another exemplary embodiment may further include: machining a third connection surface defined between the first connection surface and the second connection surface of at least one general-purpose substrate.This exemplary embodiment or another exemplary embodiment may further include: electrically bonding a first set of conductors of at least one general-purpose substrate to a first electronic device on a first connection surface and to a second electronic device on a second connection surface; and electrically bonding a second set of conductors of at least one general-purpose substrate to a third electronic device on a third connection surface and to the second electronic device on a second connection surface; wherein the third electronic device is positioned between the first electronic device and the second electronic device. This exemplary embodiment or another exemplary embodiment may further include: machining at least one through-hole defined between at least one set of conductors of the plurality of conductors and at least another set of conductors of the plurality of conductors. This exemplary embodiment or another exemplary embodiment may further include: electrically bonding a plurality of conductors of at least one general-purpose substrate to a first electronic device on a first connection surface and to a second electronic device with at least two devices on a second connection surface; and disposing the third electronic device on at least one general-purpose substrate between at least one set of conductors and at least another set of conductors, and electrically bonding it to the second electronic device; wherein the plurality of conductors of at least one general-purpose substrate are not electrically bonded to the third electronic device. This exemplary embodiment or another exemplary embodiment may further include the step of slicing at least one segment of a batch of products to form at least one general-purpose substrate, which further includes: the thickness of at least one general-purpose substrate being at least 100 micrometers. This exemplary embodiment or another exemplary embodiment may further include: the ratio of the plurality of conductors used for at least one general-purpose substrate is greater than 10:1.

[0012] In another embodiment, exemplary embodiments of this disclosure may provide a method. The method includes the steps of: providing a preform having a predetermined profile; winding a plurality of conductors around an outer surface of the preform; injecting a non-conductive matrix between the conductors of the plurality of conductors, wherein the non-conductive matrix permeates between the gaps between the conductors to isolate some conductors from each other; forming a batch product comprising the plurality of conductors and the non-conductive matrix; and slicing at least one segment of the batch product to form at least one universal substrate, wherein the plurality of conductors of the at least one universal substrate defines a first connection surface, a second connection surface opposite to the first connection surface, and a plurality of conductive pathways defined between the first connection surface and the second connection surface; wherein the plurality of conductors of the at least one universal substrate are one of conducting electricity between the first connection surface and the second connection surface to provide electrical communication between at least two devices, and conducting heat between the first connection surface and the second connection surface to provide directional heat flow through the at least one universal substrate between at least two devices. Attached Figure Description

[0013] Exemplary embodiments of this disclosure are set forth in the following description, shown in the accompanying drawings, and particularly and expressly pointed out and set forth in the appended claims.

[0014] Figure 1 A device-on-device product having a universal substrate that interconnects at least two devices with each other, according to one embodiment of the present disclosure, is illustrated.

[0015] Figure 2 A front, top, and first isometric perspective view of a general substrate according to one embodiment of the present disclosure is shown.

[0016] Figure 3 yes Figure 1 The top view of the universal substrate shown in the image;

[0017] Figure 3A yes Figure 3 A magnified view of the highlighted area shown in the image;

[0018] Figure 3B This is a partial top view of a general-purpose substrate according to another embodiment of the present disclosure;

[0019] Figure 4 It is along Figure 3 The longitudinal sectional view of the general-purpose substrate in the direction of section line 4-4 shown in the figure;

[0020] Figure 5 This is a top view of a general-purpose substrate including the bonding pads;

[0021] Figure 6 It is along Figure 5 The longitudinal sectional view of the general substrate in the direction of section line 6-6 shown in the figure;

[0022] Figure 7A It is a longitudinal cross-sectional view of a general-purpose substrate including bonding pads and surface passivation materials;

[0023] Figure 7B It is similar to Figure 7A A longitudinal cross-sectional view of a general-purpose substrate, but with some surface passivation material removed to expose the bonding pads;

[0024] Figure 8A This is a schematic diagram of at least one general-purpose substrate interconnecting at least two devices according to another aspect of the present disclosure, wherein two solder connectors are connected to at least one general-purpose substrate and at least two devices;

[0025] Figure 8B It is along Figure 8A The sectional view shown in the section line 8B-8B direction;

[0026] Figure 9A This is another schematic diagram of at least one general-purpose substrate interconnecting at least two devices according to another aspect of the present disclosure, wherein two solder connectors and two shielding connectors are connected to at least one general-purpose substrate and at least two devices.

[0027] Figure 9B It is along Figure 9A The sectional view shown in the section line 9B-9B direction;

[0028] Figure 10 This is another schematic diagram of at least one general-purpose substrate interconnecting at least two devices according to another aspect of the present disclosure, wherein two solder connectors are biased relative to each other and connected to at least one general-purpose substrate and at least two devices;

[0029] Figure 11A This is a schematic diagram of at least one general-purpose substrate interconnecting at least two devices according to another aspect of the present disclosure, wherein the at least one general-purpose substrate includes a signal conductor group and an unused conductor group;

[0030] Figure 11B This is another schematic diagram of at least one general-purpose substrate interconnecting at least two devices according to another aspect of the present disclosure, wherein at least one general-purpose substrate includes a signal conductor group, an unused conductor group, and a ground conductor group for shielding the signal conductor group;

[0031] Figure 12 This is another schematic diagram of at least one general-purpose substrate interconnecting at least three devices according to another aspect of the present disclosure, wherein the at least one general-purpose substrate includes a stepped configuration for accommodating one of the three devices;

[0032] Figure 13 This is another schematic diagram of at least one general-purpose substrate interconnecting at least three devices according to another aspect of the present disclosure, wherein at least one general-purpose substrate includes a gap for accommodating one of the three devices;

[0033] Figure 14A It is a manufacturing process for producing batches of products, in which multiple conductors are wound around a preform, and a non-conductive matrix is ​​applied to the multiple conductors and the preform;

[0034] Figure 14B yes Figure 14A The enlarged view of the highlighted area shown in the image shows that segments of the batch of products have been removed for further slicing.

[0035] Figure 14C yes Figure 14B The enlarged view of the highlighted area shown in the image shows that this section of the mass-produced product is sliced ​​into multiple separate general-purpose substrates.

[0036] Figure 15A It is another manufacturing process for producing mass-produced products, in which multiple conductors are wound around a preform, and a non-conductive matrix is ​​applied to the multiple conductors and the preform;

[0037] Figure 15B yes Figure 15A The enlarged view of the highlighted area shown in the image shows that segments of the batch of products have been removed for further slicing.

[0038] Figure 16A It is another manufacturing process for producing mass-produced products, in which multiple conductors and a set of blanks are wound around a preform, and a non-conductive matrix is ​​applied to the multiple conductors, the set of blanks, and the preform;

[0039] Figure 16B yes Figure 16A The enlarged view of the highlighted area shown in the image shows that segments of the batch of products have been removed for further slicing.

[0040] Figure 16C yes Figure 16B The enlarged view of the highlighted area shown in the image shows that the segment of this batch of products is sliced ​​into multiple independent general-purpose substrates.

[0041] Figure 17 This is a flowchart of an exemplary method;

[0042] Figure 18 Here is a flowchart of another exemplary method;

[0043] In all the accompanying drawings, the reference numerals for similar drawings indicate similar parts. Detailed Implementation

[0044] Figures 1-7B A universal substrate, generally referred to as digit 1, is illustrated. In this disclosure, the universal substrate 1 can be used to operatively engage at least one electronic device and at least another electronic device to provide electrical communication between the at least one electronic device and at least another electronic device. As discussed in more detail below, the universal substrate 1 enables at least one electronic device and at least another electronic device to be engaged with the universal substrate 1 at any point along the universal substrate 1, only when one or more electrical connections of the at least one electronic device and at least another electronic device are perpendicularly coaxial with each other. These features and components of the universal substrate will be discussed in more detail below.

[0045] refer to Figure 2 The general-purpose substrate 1 may include a first end 1A, a second end 1B longitudinally opposite to the first end 1A, and a longitudinal axis defined therebetween (by...). Figure 1(Represented by the dashed line marked "X" in the diagram). The general-purpose substrate 1 may also include a first side surface 1C extending between the first end 1A and the second end 1B, a second side surface 1D extending between the first end 1A and the second end 1B and laterally opposite to the first side surface 1C, and a transverse axis defined therebetween (by...). Figure 1 (Represented by the dashed line marked "Y" in the diagram). The general-purpose substrate 1 may also include a top end 1E vertically positioned above the first end 1A, the second end 1B, the first side 1C, and the second side 1D; a bottom end 1F vertically positioned below the first end 1A, the second end 1B, the first side 1C, and the second side 1D; and a vertical axis defined therebetween (by...). Figure 1 The dashed line marked with "Z" indicates this.

[0046] Referring again to the general-purpose substrate 1, the general-purpose substrate 1 also defines the length measured between the first end 1A and the second end 1B (by...). Figure 3 (Indicated by the double arrow marked "1G"). The general-purpose substrate 1 also defines the width measured between the first side 1C and the second side 1D (by...). Figure 1 (Indicated by the dashed line marked "1H"). The general-purpose substrate 1 also defines the height measured between the top end 1E and the bottom end 1F (by... Figure 3 (The double arrow marked "1J" indicates this). In this disclosure, the height 1J is less than the length 1G and the width 1H. In another exemplary embodiment, the general-purpose substrate 1 may be defined as any suitable length 1G, width 1H, and height 1J indicated by the implementation of the general-purpose substrate 1. In one exemplary embodiment, the height (or thickness) of the general-purpose substrate may be at least 100 micrometers. In another exemplary embodiment, the height (or thickness) of the general-purpose substrate may be between at least 100 micrometers and about at least 1 millimeter.

[0047] The general-purpose substrate 1 includes multiple conductors 10. Preferably, as Figure 3 As shown, each of the plurality of conductors 10 includes a first connection terminal 11A located at the top end 1E of the general-purpose substrate 1. Each of the plurality of conductors 10 also includes a second connection terminal 11B located at the bottom end 1F of the general-purpose substrate 1 and perpendicularly opposite to the first connection terminal 11A. Each of the plurality of conductors 10 also includes a conductive path or shaft 11C extending between the first connection terminal 11A and the second connection terminal 11B. In one example, the conductive path 11C of each of the plurality of conductors 10 may provide conductivity between the first connection terminal 11A and the second connection terminal 11B to enable electrical communication between at least two devices. In another example, the conductive path 11C of each of the plurality of conductors 10 may provide thermal conductivity between the first connection terminal 11A and the second connection terminal 11B to enable heat dissipation.

[0048] Referring again to the plurality of conductors 10 and 11, the first connection surface 12 is jointly defined. Ideally... Figure 4 As shown, the first connection surface 12 spans the top end 1E of the general-purpose substrate defined along the first connection ends 11A of the plurality of conductors 10. Similarly, the plurality of conductors 11 also collectively define a second connection surface 14. Preferably as follows... Figure 4 As shown, the second connection surface 14 spans the bottom end 1F of the general-purpose substrate defined along the second connection ends 11B of the plurality of conductors 10. Through such a first connection surface 12 and a second connection surface 14, a plurality of conductive paths 16 are defined between the first connection surface 12 and the second connection surface 14 by the plurality of conductors 10.

[0049] In this disclosure, the plurality of conductors 10 are arranged in a random and / or non-uniform configuration. In other exemplary embodiments, the plurality of conductors may be arranged in any suitable configuration indicated by the implementation of the general substrate 1. In one exemplary embodiment, the plurality of conductors may be arranged in an organized and / or uniform configuration (i.e., aligned in different rows and / or columns). In one exemplary embodiment, at least one set of conductors of the plurality of conductors may be arranged in an organized and / or uniform configuration, and at least another set of conductors of the plurality of conductors may be arranged in a random and / or non-uniform configuration.

[0050] It should also be understood that one or more groups of conductors, as part of a plurality of conductors 10, may define one or more diameters between their respective first connection end 11A and second connection end 11B. In one example, and preferably as follows Figure 3A As shown, each of the plurality of conductors 10 defines a first diameter Ø1, which is continuous along the entire length of each of the plurality of conductors 10 between the first connection end 11A and the second connection end 11B. In another example, and preferably as Figure 3B As shown, the alternative general-purpose substrate 1' includes a first set of conductors 10A' and a second set of conductors 10B' as part of a plurality of conductors 10. In this example, each conductor of the first set of conductors 10A' defines a first diameter Ø1 that is continuous along the entire length of each conductor of the first set of conductors 10A'. In the same example, each general-purpose conductor of the second set of conductors 10B' defines a second diameter Ø2 that is continuous along the entire length of each conductor of the second set of conductors 10B', wherein the second diameter Ø2 is larger than the first diameter Ø1. Such different diameters among the plurality of conductors 10 may be appropriate when the designer of the device-on-device product has devices with different signal densities and / or different sizes and / or occupies different areas.

[0051] The general-purpose substrate 1 also includes a nonconductive matrix or material 20 operably bonded to a plurality of conductors 10. For example... Figure 2 As shown, the non-conductive substrate 20 includes a first end 20A, a second end 20B longitudinally opposite to the first end 20A, and a longitudinal axis defined therebetween. The non-conductive substrate 20 may also include a first side 20C extending between the first end 20A and the second end 20B, a second side 20D extending between the first end 20A and the second end 20B and laterally opposite to the first side 20C, and a transverse axis defined therebetween. The non-conductive substrate 20 may also include a top mating end or surface 20E vertically positioned above the first end 20A, the second end 20B, the first side 20C, and the second side 20D, a bottom mating end or surface 20F vertically positioned below the first end 20A, the second end 20B, the first side 20C, and the second side 20D, and a vertical axis (indicated by dashed lines) defined therebetween.

[0052] Referring again to the non-conductive matrix 20, the non-conductive matrix 20 also includes multiple inner walls 20G defining multiple voids 20H. Ideally... Figure 4 As shown, each of the plurality of inner walls 20G extends vertically between the top engagement end 20E and the bottom engagement end 20F, defining a respective gap of a plurality of gaps 20H. In this disclosure, each of the plurality of conductors 10 is operatively engaged with the inner walls of the plurality of inner walls 20G and is accommodated within the gaps of the plurality of gaps 20H defined by the respective inner walls of the plurality of inner walls 20G. This configuration between the plurality of conductors 10 and the plurality of inner walls 20G separates and / or insulates each of the plurality of conductors 10 from each other to prevent conductivity along an axis perpendicular or orthogonal to the conductive path 11C of each of the plurality of conductors 10; this non-conductive axis is discussed in more detail below.

[0053] Referring again to the non-conductive substrate 20, the non-conductive substrate 20 includes multiple non-conductive pathways 22A and 22B. For example... Figure 3A As shown, each of the plurality of non-conductive pathways 22A, 22B extends longitudinally or laterally between each of the plurality of conductors 10 to prevent any conductivity between adjacent conductors of the plurality of conductors 10. In one example, a set of first non-conductive pathways 22A may extend between a first end 20A and a second end 20B to prevent any conductivity between adjacent conductors of the plurality of conductors 10 in the longitudinal direction. In another example, a set of second non-conductive pathways 22B may extend between a first side 20C and a second side 20D to prevent any conductivity between adjacent conductors of the plurality of conductors 10 in the lateral direction.

[0054] By insulating each of the plurality of conductors 10 from one another, each of the plurality of conductors 10 is non-conductive (either electrical or thermal) in the longitudinal or transverse direction (i.e., along the non-conductive paths 22). In this way, by allowing conduction (electrical or thermal) in the first direction (i.e., the conductive path 11C) while blocking conduction (electrical or thermal) in the second direction orthogonal to the first direction (i.e., the non-conductive path 22), the universal substrate 1 is anisotropic.

[0055] The structural configuration of the universal substrate 1 is considered advantageous, at least because one or more electronic devices or products can be electrically connected at any location along the first connection surface 12 and the second connection surface 14 without the need for any predetermined electrical voids or apertures forming into the first connection surface 12 and the second connection surface 14. In this disclosure, designers of devices-on-device products are able to connect one or more devices by using one or more conductors of a plurality of conductors 10 along the first connection surface 12 and the second connection surface 14 (see [link to product description]). Figure 1 , Figures 8A-8B , Figure 9A , Figure 11A (And Figure 11). In this way, the designers of products with devices on these devices can freely place the devices at any location along the universal substrate 1 as desired, without initially creating or defining predetermined electrical gaps or apertures in the universal substrate 1.

[0056] The structural configuration of the universal substrate 1 is considered advantageous, at least because the universal substrate 1 can be manufactured in various ways as indicated by the available mechanical systems and / or tools. In one example, the universal substrate 1 can be manufactured individually in a batch process (see...). Figure 2 In another example, a single, monolithic universal substrate 1 can be manufactured in a continuous process, wherein the monolithic universal substrate 1 is cut and / or divided into multiple universal substrates.

[0057] The general-purpose substrate 1 may also include bonding pads 30 for enabling one or more devices to be connected to the general-purpose substrate 1. In this disclosure, the bonding pads 30 are operatively bonded to one or more groups of conductors 10. Preferably, Figures 5-7B As shown, the general-purpose substrate 1 may include a first set of upper bonding pads 32, which are operatively bonded along the first connection surface 12 to multiple sets of conductors of the plurality of conductors 10. Still referring to Figure 5 ~- Figure 7BThe general-purpose substrate 1 may also include a first set of lower bonding pads 34, which are operatively bonded along the second connection surface 14 to respective conductor groups of the plurality of conductors 10. In this disclosure, each upper bonding pad of the first set of upper bonding pads 32 is coaxially aligned with the respective lower bonding pad of the first set of lower bonding pads 34 by bonding with the same conductor group of the plurality of conductors 10. Preferably, as Figure 6 As shown, the upper bonding pad 32A of the first set of upper bonding pads 32 is connected to the same set of conductors 10A of the plurality of conductors 10 and is coaxially aligned with the respective lower bonding pads 34A of the first set of lower bonding pads 34 along the central axis 35, such that the upper bonding pads 32A and the lower bonding pads 34A share the conductive path 16A defined by the set of conductors 10A.

[0058] refer to Figure 5 Each upper bonding pad of the first set of upper bonding pads 32 and each lower bonding pad of the first set of lower bonding pads 34 defines a third diameter Ø3. In the same embodiment, the universal substrate 1 may also include a second set of upper bonding pads 36 operatively bonded along the first connection surface 12 to multiple sets of conductors of the plurality of conductors 10; each upper bonding pad of the second set of upper bonding pads 36 defines a fourth diameter Ø4, which is smaller than the third diameter Ø2 of each upper bonding pad of the first set of upper bonding pads 32 and each lower bonding pad of the first set of lower bonding pads 34. The universal substrate 1 may also include a second set of lower bonding pads (not shown) operatively bonded along the second connection surface 14 to respective sets of conductors of the plurality of conductors 10 and coaxial with the second set of upper bonding pads 36; each lower bonding pad of the second set of lower bonding pads will also define a fourth diameter Ø4, which is smaller than the third diameter Ø3 of each upper bonding pad of the first set of upper bonding pads 32 and each lower bonding pad of the first set of lower bonding pads 34.

[0059] It should be understood that the general-purpose substrate 1 may include any bonding pads 30 discussed and described herein, along with other commercially available bonding pads, enabling designers of device products on the device to connect devices of various sizes to the general-purpose substrate 1 based on various reasons, including the signal density of the device and the overall size and / or footprint of the device. In one example, the general-purpose substrate 1 may include a combination of a first set of upper bonding pads 32 and a first set of lower bonding pads 34, or a combination of a second set of upper bonding pads 36 and a second set of lower bonding pads 38. In another example, the general-purpose substrate 1 may include a combination of a first set of upper bonding pads 32 and a first set of lower bonding pads 34, along with a combination of a second set of upper bonding pads 36 and a second set of lower bonding pads. In yet another example, the general-purpose substrate 1 may omit the combination of the first set of upper bonding pads 32 and the first set of lower bonding pads 34 with the combination of the second set of upper bonding pads 36 and the second set of lower bonding pads.

[0060] The general-purpose substrate 1 may also include a surface passivation material 40. Preferably, as... Figures 7A-7B As shown, the surface passivation material 40 can completely surround and encapsulate the plurality of conductors 10 with the non-conductive matrix 20 to prevent unwanted bonding or defects from interfering with the connection between the plurality of conductors 10 and one or more devices. In this particular embodiment, several portions of the surface passivation material 40 can be removed to allow the bonding pad 30 to adhere to the plurality of conductors 10. Preferably as Figure 7A As shown, upper aperture 41A and lower aperture 41B may be defined in surface passivation material 40 to allow bonding pad 30 to attach to conductor 10. This encapsulation of bonding pad 30 by surface passivation material 40 prevents unwanted bonding or defects from interfering with the connection between multiple conductors 10, bonding pad 30, and one or more devices creating a device-on-device connection.

[0061] When the universal substrate 1 includes a surface passivation material 40, various other components can be operatively bonded to the universal substrate. On one hand, conductive traces and similar components can be applied to the universal substrate 1 by bonding pads (e.g., one or more bonding pads of a first set of upper bonding pads 32, a first set of lower bonding pads 34, a second set of upper bonding pads 36, and / or a second set of lower bonding pads 38) to establish an additive circuit. On the other hand, a redistribution layer (RDL) or other similar additive circuitry system may be included to provide additional interconnects in the universal substrate 1 as vertical interconnects (i.e., along the vertical axis "Z") at the fan-out wafer level.

[0062] The components and features of the general-purpose substrate 1 have now been described. The following describes in more detail various methods and implementations for creating device-on-device products using the general-purpose substrate 1 with electronic components. It should be understood that the following methods and implementations using the general-purpose substrate 1 should not limit the use of the general-purpose substrate 1.

[0063] In one example, a device-on-device 100 may include a general-purpose substrate 101 (identical to general-purpose substrate 1) used to interconnect at least two electronic devices via solder ball connections. Preferably, Figure 1 and Figures 8A-8B As shown, a general-purpose substrate 101 is used to interconnect a first electronic device 150 and a second electronic device 160 with each other via a plurality of conductors 110 to provide electrical or thermal conductivity.

[0064] In this example, the first electronic device 150 includes at least a printed wiring board (PWB) or printed circuit board (PCB) 150A, which is operatively engaged with at least one solder ball connector 150B having a first central axis 150C. Although not illustrated herein, additional electrical components and / or parts (e.g., dies, wire bonds, etc.) may be operatively engaged with the PWB 150A to form the first electronic device 150. Similarly, the second electronic device 160 includes at least a PWB or PCB 160A, which is operatively engaged with at least another solder ball connector 160B having a second central axis 160C coaxial with the first central axis 150C. Although not illustrated herein, additional electrical components and / or parts (e.g., dies, wire bonds, etc.) may be operatively engaged with the PWB 160A to form the second electronic device 160.

[0065] In this example, at least one set of conductors 110A of the plurality of conductors 110 is operatively engaged with at least one solder ball connector 150B of the first electronic device 150 and at least another solder ball connector 160B of the second electronic device 160. In this configuration, at least one solder ball connector 150B is operatively engaged with a first connection terminal 111A of the at least one set of conductors 110A, and at least one solder ball connector 160B is operatively engaged with a second connection terminal 111B of the at least one set of conductors 110A. In this configuration, at least one solder ball connector 150B of the first electronic device 150 and at least one solder ball connector 160B of the second electronic device 160 are also coaxial with each other, such that at least one solder ball connector 150B and at least one solder ball connector 160B are conductive along the conductive path 111C of the at least one set of conductors 110A.

[0066] In other exemplary embodiments, other conductive connections may be used with device-on-device 100 for interconnecting at least two electronic devices with each other. Examples of suitable conductive connections that may be used with device-on-device products for interconnecting at least two electronic devices with each other include wire bonds, thermosonic bonds, gold stud bumps, conductive adhesives, and other suitable conductive connections that may be used with device-on-device products for interconnecting at least two electronic devices with each other.

[0067] In another example, device 200 on another device may include a general-purpose substrate 201 (identical to general-purpose substrate 1), which is used to interconnect at least two electronic devices with each other via solder ball connections and shielding connections. Preferably, Figures 9A-9BAs shown, a general-purpose substrate 201 is used to interconnect a first electronic device 250 and a second electronic device 260 with each other via a plurality of conductors 210 to provide electrical or thermal conductivity.

[0068] In this example, the first electronic device 250 includes at least a printed wiring board (PWB) or printed circuit board (PCB) 250A, which is operatively bonded to at least one solder ball connector 250B and at least one shielding connector 250C. Although not illustrated herein, additional electrical components and / or parts (e.g., dies, wire bonds, etc.) may be operatively bonded to the PWB 250A to form the first electronic device 250. Similarly, the second electronic device 260 includes at least a PWB or PCB 260A, which is operatively bonded to at least another solder ball connector 260B and at least one shielding connector 260C. Although not illustrated herein, additional electrical components and / or parts (e.g., dies, wire bonds, etc.) may be operatively bonded to the PWB 260A to form the second electronic device 260.

[0069] In the same example, at least one set of conductors 210A of the plurality of conductors 210 may be operatively engaged with at least one solder ball connector 250B of the first electronic device 250 and at least another solder ball connector 260B of the second electronic device 260. In this case, at least one solder ball connector 250B may be operatively engaged with a first connection terminal 211A of at least one set of conductors 210A, and at least another solder ball connector 260B may be operatively engaged with a second connection terminal 211B of at least one set of conductors 210A. In this case, at least one solder ball connector 250B of the first electronic device 250 and at least another solder ball connector 260B of the second electronic device 260 are also coaxial with each other, such that at least one solder ball connector 250B and at least another solder ball connector 260B are conductive along the conductive path 211C of at least one set of conductors 210A.

[0070] In the same example, at least another set of conductors 210B of the plurality of conductors 210 may be operatively engaged with at least one shielding connector 250C of the first electronic device 250 and at least one other shielding connector 260C of the second electronic device 260. In this example, at least one shielding connector 250C may be operatively engaged with a first connection terminal 211A of at least another set of conductors 210B, and at least one other shielding connector 260C may be operatively engaged with a second connection terminal 211B of at least another set of conductors 210B. In this case, at least one shielding connector 250C of the first electronic device 250 and at least one other shielding connector 260C of the second electronic device 260 are also coaxial with each other, such that at least one shielding connector 250C and at least one other shielding connector 260C are conductive along the conductive path 211C of at least another set of conductors 210B. During bonding, at least one shielding connector 250C and at least another shielding connector 260C shield and / or isolate at least one solder ball connector 250B and at least another solder ball connector 260B from unwanted and / or incidental charges surrounding the device 200 on the device.

[0071] In yet another example, device 300 on another device may include a general-purpose substrate 301 (identical to general-purpose substrate 1), which is used to interconnect at least two devices with each other via solder ball connections and at least one conductive trace assembly. Preferably, Figure 10 As shown, the general-purpose substrate 301 is used to interconnect the first electronic device 350 and the second electronic device 360 ​​with each other via a plurality of conductors 310 to provide electrical or thermal conductivity.

[0072] In this example, the first electronic device 350 includes at least a printed wiring board (PWB) or printed circuit board (PCB) 350A, which is operatively engaged with at least one solder ball connector 350B having a first central axis 350C. Although not illustrated herein, additional electrical components and / or parts (e.g., dies, wire bonds, etc.) may be operatively engaged with the PWB 350A to form the first electronic device 350. Similarly, the second electronic device 360 ​​includes at least a PWB or PCB 360A, which is operatively engaged with at least another solder ball connector 360B having a second central axis 360C offset from the first central axis 350C. Although not illustrated herein, additional electrical components and / or parts (e.g., dies, wire bonds, etc.) may be operatively engaged with the PWB 360A to form the second electronic device 360.

[0073] In this example, at least one set of conductors 310A of the plurality of conductors 310 can be operatively engaged with at least one solder ball connector 350B of the first electronic device 350 and at least another solder ball connector 360B of the second electronic device 360. However, in this example, since at least another solder ball connector 360B is biased by at least one solder ball connector 350B based on the first and second central axes 350C, 360C, a conductive tracing element 370 is used to connect at least another solder ball connector 360B to at least one solder ball connector 350B. In this case, at least one solder ball connector 350B can be operatively engaged with a first connection terminal 311A ​​of at least one set of conductors 310A, and at least another solder ball connector 360B can be operatively engaged with a second connection terminal 311B of at least one set of conductors 310A via the conductive tracing element 370. In this configuration, the conductive trace assembly 370 enables at least one solder ball connector 350B of the first electronic device 350 and at least another solder ball connector 360B of the second electronic device 360 ​​to be coaxial with each other, such that at least one solder ball connector 350B and at least another solder ball connector 360B are conductive along a conductive path 311C of at least one set of conductors 310A.

[0074] In yet another example, device 400 on another device may include a general-purpose substrate 401 (identical to general-purpose substrate 1) used for interconnecting at least two devices with each other. Preferably, Figure 11A As shown, a universal substrate 401 is used to interconnect a first electronic device 450 and a second electronic device 460 with each other via a plurality of conductors 410 to provide electrical conductivity or thermal conductivity. In the illustrated embodiment, the universal substrate 401 includes a plurality of sets of first conductors or signal conductors 410A, which are used to guide and transmit electrical signals between a first set of connections 450A of the first electronic device 450 and a second set of connections 460A of the second electronic device 460 to achieve conductivity. In the same embodiment, the universal substrate 401 also includes a plurality of sets of second conductors or unused conductors 410B, which are exempt from use by the first set of connections 450A and the second set of connections 460A to guide and transmit electrical signals between the first electronic device 450 and the second electronic device 460A.

[0075] In this example, each set of signal conductors 410A uses at least three conductors to guide and transmit electrical signals between the first set of connections 450A of the first electronic device 450 and the second set of connections 460A of the second electronic device 460 to achieve conductivity. While three conductors are used in each set of signal conductors 410A to provide conductivity between the first electronic device 450 and the second electronic device 460, as indicated by the implementation of the general-purpose substrate 401, each set of signal conductors 410A may include any suitable number of conductors, including the signal density of each device, the overall size and / or area occupied by each device, and other factors required for each device to provide conductivity or thermal conductivity.

[0076] In yet another example, another device-on-device 500 may include a general-purpose substrate 501 (identical to general-purpose substrate 1) used to interconnect the first electronic device 550 and the second electronic device 560 with each other, similar to general-purpose substrate 401, to provide electrical or thermal conductivity through a plurality of conductors 510 (see [link to documentation]). Figure 11B Similar to the general-purpose substrate 401, the general-purpose substrate 501 includes multiple sets of first conductors or signal conductors 510A, which are used to guide and transmit electrical signals between the first set of connectors 550A of the first electronic device 550 and the second set of connectors 560A of the second electronic device 560 to achieve conductivity. Similar to the general-purpose substrate 401, the general-purpose substrate 501 also includes multiple sets of second conductors or unused conductors 510B, which are exempt from use by the first set of connectors 550A and the second set of connectors 560A to guide and transmit electrical signals between the first electronic device 550 and the second electronic device 560.

[0077] However, in the illustrated embodiment, the general-purpose substrate 501 also includes multiple sets of third conductors or ground conductors 510C, which are used to ground the conductivity between the first set of connections 550A of the first electronic device 550 and the second set of connections 560A of the second electronic device 560. In this alternative example, the multiple sets of ground conductors 510C surround and / or encapsulate multiple sets of signal conductors 510A to prevent unwanted and / or undesirable conductivity with the multiple sets of signal conductors 510A. Thus, the multiple conductors 510C provided in this general-purpose substrate 501 can be used both to guide and transmit electrical signals between at least two devices and to ground at least two devices.

[0078] In this example, each set of signal conductors 510A utilizes at least three conductors to guide and transmit electrical signals between the first set of connections 550A of the first electronic device 550 and the second set of connections 560A of the second electronic device 560, for the purpose of achieving conductivity. While three conductors are used in each set of signal conductors 510A to provide conductivity between the first electronic device 550 and the second electronic device 560, as indicated by the implementation of the general-purpose substrate 501, each set of signal conductors 510A may include any suitable number of conductors, including the signal density of each device, the overall size and / or area occupied by each device, and other factors required for each device to provide conductivity or thermal conductivity.

[0079] In this example, each set of ground conductors 510C utilizes at least two conductors to ground the conductivity between the first set of connections 550A of the first electronic device 550 and the second set of connections 560A of the second electronic device 560. While two conductors are used in each set of ground conductors 510C to ground the conductivity between the first electronic device 550 and the second electronic device 560, as indicated by the implementation of the general-purpose substrate 501, each set of ground conductors 510C may include any suitable number of conductors, taking into account factors such as the signal density of each device, the overall size and / or footprint of each device, and other factors required for each device to provide conductivity or thermal conductivity.

[0080] In yet another example, Figure 12 The description of another device 600 may include a general-purpose substrate 601 used to interconnect at least two devices. Except as detailed below, the general-purpose substrate 601 is similar to that discussed above and... Figures 1-4 The general-purpose substrate 1 is described in the text.

[0081] In this embodiment, the general-purpose substrate 601 includes a plurality of conductors 610. Preferably, as Figure 12 As shown, and similar to the general-purpose substrate 1, each of the plurality of conductors 610 includes a first connection terminal 611A, a second connection terminal 611B perpendicularly opposite to the first connection terminal 611A, and a conductive path or shaft 611C extending between the first connection terminal 611A and the second connection terminal 611B. On one hand, the conductive path 611C of each of the plurality of conductors 610 provides conductivity between the first connection terminal 611A and the second connection terminal 611B to enable electrical communication between at least two devices. On the other hand, the conductive path 611C of each of the plurality of conductors 610 provides thermal conductivity between the first connection terminal 611A and the second connection terminal 611B to enable heat dissipation.

[0082] Referring again to the plurality of conductors 610, the plurality of conductors 611 also collectively define the first connection surface 612. Preferably, Figure 12 As shown, a first connection surface 612 spans the top end of the general-purpose substrate 601 and is defined along the first connection ends 611A of the plurality of conductors 610. Similarly, the plurality of conductors 611 also collectively define a second connection surface 614. Preferably... Figure 12 As shown, the second connection surface 614 spans the bottom end of the general-purpose substrate 601 and is defined along the second connection ends 611B of the plurality of conductors 610. With such a first connection surface 612 and a second connection surface 614, a plurality of conductive paths are then defined between the first connection surface 612 and the second connection surface 614 by the plurality of conductors 610.

[0083] However, in this embodiment, the general-purpose substrate 601 includes a first bundle or first group of conductors 610A and a second bundle or second group of conductors 610B with different heights. Preferably, Figure 12 As shown, each conductor of the first group of conductors 610A is defined at a first height 618A extending between the first connection end 611A and the second connection end 611B. Still referring to... Figure 12 Each conductor of the second set of conductors 610B is defined at a second height 618B extending between the first connection end 611A and the second connection end 611B. In the illustrated embodiment, the first height 618A of each conductor of the first set of conductors 610A is greater than the second height 618B of each conductor of the second set of conductors 610B. Utilizing this variation in height, the second set of conductors 610B also defines a third connection surface 617 along the first connection end 611A of the second set of conductors 610B. In the illustrated embodiment, the third connection surface 617 is defined between the first connection surface 612 and the second connection surface 614 to provide a stepped and / or mezzanine configuration for device-on-device packaging, which is discussed in more detail below.

[0084] The general-purpose substrate 601 also includes a non-conductive matrix or dielectric material 620 surrounding each of the plurality of conductors 610. Similar to the non-conductive matrix 20, the non-conductive matrix 620 surrounds and isolates each of the plurality of conductors 610 to prevent electrical and thermal conductivity between adjacent conductors of the plurality of conductors in the longitudinal or transverse directions.

[0085] It should be understood that commercially available tools and / or equipment may be used to machine and / or form various features into the general-purpose substrate 601. Commercially available tools and / or equipment may be used to machine linear, nonlinear, and / or stepped profiles into the general-purpose substrate 601. In another exemplary embodiment, tools and / or equipment may be used to remove one or more conductors 610 and non-conductive substrates 620 from the general-purpose substrate 601 to create linear, nonlinear, and / or stepped profiles into the general-purpose substrate 601.

[0086] Still referencing Figure 12 The general-purpose substrate 601 is used to interconnect the first electronic device 650 and the second electronic device 660 with each other via a plurality of conductors 610 to provide electrical conductivity or thermal conductivity. The general-purpose substrate 601 is also used to interconnect the second electronic device 660 and the third electronic device 670 with each other via a plurality of conductors 610 to provide electrical conductivity or thermal conductivity.

[0087] In the illustrated embodiment, a first set of conductors 610A is used to guide and transmit electrical signals for conductivity between the printed circuit board (PWB) or printed circuit board (PCB) 650A of the first electronic device 650 via solder ball connectors 650B and the printed circuit board (PWB) or printed circuit board (PCB) 660A of the second electronic device 660 via solder ball connectors 660B. In the same embodiment, a second set of conductors 610B is used to guide and transmit electrical signals for conductivity between the printed circuit board (PWB) or printed circuit board (PCB) 670A of the third electronic device 670 via solder ball connectors 670B and the PWB 660A of the second electronic device 660 via solder ball connectors 660B. This configuration of the general-purpose substrate 601 shortens and / or reduces the overall height and / or footprint of the device-on-device product 600 to achieve a smaller and / or more compact device-on-device product.

[0088] In yet another example, Figure 13 The illustrated device 700 may include a general-purpose substrate 701 used to interconnect at least two devices. Except as described in detail below, the general-purpose substrate 701 is similar to those discussed above. Figures 1-4 The general-purpose substrate 1 described herein.

[0089] In this embodiment, the general-purpose substrate 701 includes a plurality of conductors 710. Preferably, as Figure 13 As shown, and similar to the general-purpose substrate 1, each of the plurality of conductors 710 includes a first connection terminal 711A, a second connection terminal 711B perpendicularly opposite to the first connection terminal 711A, and a conductive path or shaft 711C extending between the first connection terminal 711A and the second connection terminal 711B. On one hand, the conductive path 711C of each of the plurality of conductors 710 can provide conductivity between the first connection terminal 711A and the second connection terminal 711B to enable electrical communication between at least two devices. On the other hand, the conductive path 711C of each of the plurality of conductors 710 can provide thermal conductivity between the first connection terminal 711A and the second connection terminal 711B to enable heat dissipation.

[0090] Referring again to the plurality of conductors 710, the plurality of conductors 711 also collectively define the first connection surface 712. Preferably, Figure 13As shown, a first connection surface 712 spans the top end of the general-purpose substrate 701 and is defined along the first connection ends 711A of the plurality of conductors 710. Similarly, the plurality of conductors 711 also collectively define a second connection surface 714. Preferably as follows Figure 13 As shown, the second connection surface 714 spans the bottom end of the general-purpose substrate 701 and is defined along the second connection ends 711B of the plurality of conductors 710. With such a first connection surface 712 and a second connection surface 714, a plurality of conductive paths are then defined between the first connection surface 712 and the second connection surface 714 by the plurality of conductors 710.

[0091] However, in this embodiment, the universal substrate 701 defines at least one via or void 717 between at least two bundles or groups of conductors 710A, 710B of the plurality of conductors. Although the universal substrate 701 defines a single void 717 between two groups of conductors 710A, 710B of the plurality of conductors 710, the universal substrate 701 may define any suitable number of vias or voids between at least two groups of conductors (e.g., conductor groups 710A, 710B) of the plurality of conductors 710.

[0092] The general-purpose substrate 701 also includes a non-conductive matrix or dielectric material 720 surrounding each of the plurality of conductors 710. Similar to the non-conductive material 20, the non-conductive matrix 720 surrounds and insulates each of the plurality of conductors 710 to prevent electrical and thermal conductivity between adjacent conductors of the plurality of conductors in the longitudinal or transverse direction.

[0093] It should be understood that commercially available tools and / or equipment may be used to machine and / or form various features into the general-purpose substrate 701. In one exemplary embodiment, commercially available tools and / or equipment may be used to machine linear, nonlinear, and / or other contours into the general-purpose substrate 701. In another exemplary embodiment, tools and / or equipment may be used to remove one or more conductors 610 and nonconductive substrates 620 from the general-purpose substrate 601 to create linear, nonlinear, and / or stepped contours into the general-purpose substrate 601.

[0094] Still referencing Figure 13 A general-purpose substrate 701 is used to interconnect a first electronic device 750 and a second electronic device 760 with each other via a plurality of conductors 710 to provide electrical or thermal conductivity. The general-purpose substrate 701 is also configured to interconnect a second electronic device 660 and a third electronic device 670 with each other to achieve electrical or thermal conductivity, without bonding the second electronic device 660 or the third electronic device 670.

[0095] In the illustrated embodiment, at least two sets of conductors 710A, 710B are used to guide and transmit electrical signals for conductivity between the printed circuit board (PWB) or printed circuit board (PCB) 750A of the first electronic device 750 via solder ball connectors 750B and the printed circuit board (PWB) or printed circuit board (PCB) 760A of the second electronic device 760 via solder ball connectors 760B. In the same embodiment, at least two sets of conductors 710A, 710B are exempt from being coupled and / or connected to the third electronic device 770 to allow electrical signals to be guided and transmitted between the printed circuit board (PWB) or printed circuit board (PCB) 770A of the third electronic device 770 via solder ball connectors 770B and the PWB 760A of the second electronic device 760 via solder ball connectors 760B. This configuration of the general-purpose substrate 701 shortens and / or reduces the overall height and / or footprint of the device-on-device product 700, thereby enabling a smaller and / or more compact device-on-device product.

[0096] Figures 14A-14C The manufacturing process 800 for creating a batch product 801 is described, which can be cut into one or more general-purpose substrates (e.g., general-purpose substrate 1) as described and illustrated herein. For the manufacturing process 800, these components used to produce the batch product 801 are discussed in more detail below.

[0097] Initially, the preform or template 802 defines a predetermined and / or desired outer contour for producing a batch of general-purpose products 801 (hereinafter referred to as "batch products"), which can be cut into one or more general-purpose substrates (similar to general-purpose substrate 1) described and illustrated herein. Figure 14A As shown, the preform 802 includes a continuous outer surface 802A along its entire length for holding one or more conductors of the batch product 801, which will be discussed in more detail below. In this disclosure, a first end 801' of the batch product 801 engages with the outer surface 802A of the preform 802, and a second end 801'' of the batch product 801 is opposite to the first end 801' and spaced apart from the preform 802 due to the batch product 801 being wound around the preform 802. In an exemplary embodiment, the preform may define a rectangular cross-sectional shape for creating a planar and / or flat general-purpose substrate (see [link to documentation]). Figure 14A In other exemplary embodiments, the preform may be defined as any suitable cross-sectional shape for creating various types of universal substrates indicated by the implementation of the universal substrate.

[0098] Continuing with manufacturing process 800, a plurality of conductors 810 forming batch product 801 are wound and / or wrapped on the outer surface 802A of preform 802 in the desired orientation and / or arrangement indicated by the implementation of one or more general-purpose substrates sliced ​​from batch product 801 (see...). Figure 14A It should be noted that the plurality of conductors 810 may be any conductor described and illustrated herein (e.g., a plurality of conductors 10). In one exemplary embodiment, each of the plurality of conductors 810 wound and / or wrapped around the outer surface 802A of the preform 802 may include a shielding and / or non-conductive material that protects the conductor and isolates it from the external environment. In another exemplary embodiment, each of the plurality of conductors 810 wound and / or wrapped around the outer surface 802A of the preform 802 may be a bare conductor that does not have any shielding and / or non-conductive material that protects the conductor and isolates it from the external environment.

[0099] Once the multiple conductors 810 are wound around the preform 802, a non-conductive matrix or dielectric material 820 can then be introduced to the preform 802 and the multiple conductors 810. Preferably, Figure 14A As shown, a non-conductive matrix 820 is applied to a preform 802 and a plurality of conductors 810, wherein the non-conductive matrix 820 penetrates into the gap spaces between the plurality of conductors 810. This penetration of the non-conductive matrix 820 allows the non-conductive matrix 820 to bond with the plurality of conductors 810 to hold the plurality of conductors 810 together and maintain them in the desired shape of the preform 802 to create the batch product 801. This penetration of the non-conductive matrix 820 also separates and / or isolates the plurality of conductors 810 from each other in the longitudinal and transverse directions, as previously discussed above. It should be noted that the non-conductive matrix and / or dielectric material may be any non-conductive matrix described and illustrated herein (e.g., non-conductive matrix 20).

[0100] Once a batch of product 801 is formed, section 801A of the batch of product 801 can be removed from the batch of product 801 to create one or more individual general-purpose substrates (e.g., general-purpose substrate 801) (see [link to product description]). Figure 15BOnce removed, the segment 801A of the batch product 801 can then be cut and / or sliced ​​into one or more individual general-purpose substrates 801B, having the desired parameters indicated by the implementation of the one or more individual general-purpose substrates 801B (see Figure 15C). It should be understood that any suitable equipment and / or tools can be used to remove one or more segments 801A from the batch product 801 and to slice (wafter) one or more individual general-purpose substrates 801B from the one or more segments 801A. It should also be noted that the one or more individual general-purpose substrates 801B can be any general-purpose substrate discussed herein, including general-purpose substrates 1, 101, 201, 301, 401, 501, 601, and 701.

[0101] When performing this slicing on one or more general-purpose substrates 801B, additional tools and / or equipment may be used to machine and / or form various features into one or more general-purpose substrates 810B. In one exemplary embodiment, tools and / or equipment may be used to machine linear, nonlinear, and / or stepped profiles into one or more general-purpose substrates 801B (e.g., general-purpose substrate 601). In another exemplary embodiment, tools and / or equipment may be used to remove one or more conductors 810 and non-conductive substrates 820 from one or more general-purpose substrates 801B to define apertures, vias, and / or voids in one or more general-purpose substrates 801B (e.g., general-purpose substrate 701).

[0102] Figures 15A-15B Another manufacturing process 900 for creating a batch product 901 is described, which can be cut into one or more general-purpose substrates (e.g., general-purpose substrate 1) as described and illustrated herein. For the manufacturing process 900, these components used to produce the batch product 901 are discussed in more detail below.

[0103] Initially, the preform or template 902 defines a predetermined and / or desired outer contour for producing a batch of general-purpose products 901 (hereinafter referred to as "batch products"), which can be cut into one or more general-purpose substrates (similar to general-purpose substrate 1) described and illustrated herein. Figure 15AAs shown, preform 902 includes a continuous outer surface 902A along its entire length for holding one or more conductors of batch product 901, which will be discussed in more detail below. Similar to batch product 801, a first end 901' of batch product 901 engages with the outer surface 902A of preform 902, and a second end 901'' of batch product 901 is opposite to the first end 901' and spaced apart from preform 902 due to the batch product 901 being wound around preform 902. In the illustrated embodiment, preform 902 defines a circular and / or circular cross-sectional shape for creating a circular and / or non-linear universal substrate. In other exemplary embodiments, the preform may define any suitable cross-sectional shape for creating various types of universal substrates indicated by the implementation of the universal substrate.

[0104] Continuing with manufacturing process 900, a plurality of conductors 910 forming batch product 901 are wound and / or wrapped on the outer surface 902A of preform 902 in the desired orientation and / or arrangement indicated by the implementation of one or more general-purpose substrates sliced ​​from batch product 901 (see...). Figure 15A It should be noted that the plurality of conductors 910 may be any conductor described and illustrated herein (e.g., a plurality of conductors 10). In one exemplary embodiment, each conductor of the plurality of conductors 910 wound and / or wrapped around the outer surface 902A of the preform 902 may include a shielding and / or non-conductive material that protects the conductor and isolates it from the external environment. In another exemplary embodiment, each conductor of the plurality of conductors 910 wound and / or wrapped around the outer surface 902A of the preform 902 may be a bare conductor that does not have any shielding and / or non-conductive material that protects the conductor and isolates it from the external environment.

[0105] Once the multiple conductors 910 are wound around the preform 902, a non-conductive matrix or dielectric material 920 can then be introduced to the preform 902 and the multiple conductors 910. Preferably, Figure 15A As shown, a non-conductive matrix 920 is applied to a preform 902 and a plurality of conductors 910, wherein the non-conductive matrix 920 penetrates into the gap spaces between the plurality of conductors 910. This penetration of the non-conductive matrix 920 allows the non-conductive matrix 920 to bond with the plurality of conductors 910 to hold the plurality of conductors 910 together and maintain them in the desired shape of the preform 902 to create the batch product 901. This penetration of the non-conductive matrix 920 also separates and / or isolates the plurality of conductors 910 from each other in the longitudinal and transverse directions, as previously discussed above. It should be noted that the non-conductive matrix and / or dielectric material may be any non-conductive matrix described and illustrated herein (e.g., non-conductive matrix 20).

[0106] Once a batch of product 901 is formed, segment 901A of the batch of product 901 can be removed from the batch of product 901 to create one or more individual general-purpose substrates (e.g., general-purpose substrate 901) (see [link to product description]). Figure 15B In this embodiment, segment 901A of batch product 901 is defined by a curvilinear shape and / or an arcuate shape based on the outer surface 902A of preform 902. This curvilinear and / or arcuate shape of segment 901A is considered advantageous for connecting at least two radio frequency (RF) devices 904 or similar electronic devices to each other, for guiding and transmitting electronic signals between the at least two RF devices via segment 901A.

[0107] Figures 16A-16C A manufacturing process 1000 for creating a batch of products 1001 is described herein, which may be cut into one or more general-purpose substrates (e.g., general-purpose substrate 1) as described and illustrated herein. For the manufacturing process 1000, these components used in the production of the batch of products 1001 are discussed in more detail below.

[0108] Initially, the preform or template 1002 defines a predetermined and / or desired outer contour for producing a batch of general-purpose products 1001 (hereinafter referred to as "batch products"), which can be cut into one or more general-purpose substrates (similar to general-purpose substrate 1) described and illustrated herein. Figure 16A As shown, preform 1002 includes a continuous outer surface 1002A along the entire length of preform 902 for holding one or more conductors of batch product 1001, which is discussed in more detail below. In one exemplary embodiment, preform 1002 may define a rectangular cross-sectional shape for creating a planar and / or straight general-purpose substrate (see [link to documentation]). Figure 16A In other exemplary embodiments, the preform may be defined as any suitable cross-sectional shape for creating various types of universal substrates indicated by the implementation of the universal substrate.

[0109] It should be understood that, although the batch product 1001 is shown in a concentric configuration for illustrative purposes, the batch product 1001 may be shown having two ends (similar to batch products 801, 901), with the first end engaging with the outer surface 1002A of the preform 1002, and the second end opposite to the first end and spaced apart from the preform 1002 as the batch product is wrapped around the preform 1002.

[0110] Continuing with manufacturing process 1000, a plurality of conductors 1010 forming batch product 1001 are wound and / or wrapped on the outer surface 1002A of preform 1002 in the desired orientation and / or arrangement indicated by the implementation of one or more general-purpose substrates sliced ​​from batch product 1001 (see...). Figure 16A It should be noted that the plurality of conductors 1010 may be any conductor described and illustrated herein (e.g., a plurality of conductors 10). In one exemplary embodiment, each of the plurality of conductors 1010 wound and / or wrapped around the outer surface 1002A of the preform 1002 may include a shielding and / or non-conductive material that protects the conductor and isolates it from the external environment. In another exemplary embodiment, each of the plurality of conductors 1010 wound and / or wrapped around the outer surface 1002A of the preform 1002 may be a bare conductor that does not have any shielding and / or non-conductive material that protects the conductor and isolates it from the external environment.

[0111] In this embodiment, a set of non-conductor strands or blanks 1011 can also be used to form batch products 1001. Preferably, Figure 16A As shown, the set of blanks 1011 is wound and / or wrapped around the outer surface 1002A of the preform 1002 in a desired orientation and / or arrangement indicated by the implementation of one or more general-purpose substrates sliced ​​from the batch product 1001. This inclusion of the blank set 1011 within the batch product 1001 allows the batch product 1001 to have conductive regions (provided by a plurality of conductors 1010) and non-conductive regions (provided by the blank set 1011) selected and / or predetermined by the designer of the batch product 1001.

[0112] In this disclosure, each of the plurality of conductors 1010 is shown as a single strand of metal material having a continuous diameter and / or shape defined along the entire length of each strand of metal material. In other exemplary embodiments, the plurality of conductors of a batch product may include two or more conductors having different geometries and / or configurations indicated by implementations of one or more general-purpose substrates cut from the batch product. In one example, the plurality of conductors of a batch product may include at least one set of conductors having a first geometry or configuration (e.g., a single strand of metal wire with a continuous diameter) and at least another set of conductors having a second geometry or configuration different from the at least one set of conductors (e.g., twisted pair, coaxial cable, etc.).

[0113] In this disclosure, a set of blanks 1011 used in batch product 1001 are dielectric strands and / or materials that suppress and / or prevent conductivity along the vertical axis of a general-purpose substrate. In one exemplary embodiment, each blank in the set of blanks may be formed of a non-metallic, dielectric material that prevents current from flowing freely inside the batch product. In another exemplary embodiment, each blank in the set of blanks may also be a metallic component having a resistance or volume resistance greater than that of the plurality of conductors used in the batch product to resist desired and / or predetermined units of current.

[0114] Once the multiple conductors 1010 are wound around the preform 1002, a non-conductive matrix or dielectric material 1020 can then be introduced to the preform 1002, the multiple conductors 1010, and a set of blanks 1011. Preferably, Figure 16A As shown, a non-conductive matrix 1020 is applied to a preform 1002, a plurality of conductors 1010, and a set of blanks 1011, wherein the non-conductive matrix 1020 penetrates into the gap space between the plurality of conductors 1010 and the set of blanks 1011. This penetration of the non-conductive matrix 1020 allows the non-conductive matrix 1020 to bond with the plurality of conductors 1010 and the set of blanks 1011 to hold the plurality of conductors 1010 and the set of blanks 1011 together and maintain them in the desired shape of the preform 1002 to create a batch of products 1001. This penetration of the non-conductive matrix 1020 also separates and / or isolates the plurality of conductors 1010 from each other in the longitudinal and transverse directions, as previously discussed above. It should be noted that the non-conductive matrix and / or dielectric material may be any non-conductive matrix described and illustrated herein (e.g., non-conductive matrix 20).

[0115] Once a batch of product 1001 is formed, segment 1001A of the batch of product 1001 can be removed from the batch of product 1001 to create one or more individual general-purpose substrates (e.g., general-purpose substrate 1001) (see [link to product description]). Figure 16B Once removed, this segment 1001A of the batch product 1001 can then be cut and / or diced into one or more individual general-purpose substrates 1001B, having the desired parameters indicated by the implementation of the one or more individual general-purpose substrates 1001B (see [link to product description]). Figure 16CIt should be understood that any suitable equipment and / or tools may be used to remove one or more segments 1001A from the batch product 1001 and to slice one or more individual general-purpose substrates 1001B from the one or more segments 1001A. It should also be noted that the one or more individual general-purpose substrates 1001B may be any general-purpose substrate discussed herein, including general-purpose substrates 1, 101, 201, 301, 401, 501, 601, and 701.

[0116] When performing such slicing on one or more general-purpose substrates 1001B, additional tools and / or equipment may be used to machine and / or form various features into one or more general-purpose substrates 1010B. In one exemplary embodiment, the tools and / or equipment may be used to machine linear, nonlinear, and / or stepped contours into one or more general-purpose substrates 1001B (e.g., general-purpose substrate 601). In another exemplary embodiment, the tools and / or equipment may be used to remove one or more conductors 1010 and non-conductive substrates 1020 from one or more general-purpose substrates 1001B to define pores, vias, and / or voids in one or more general-purpose substrates 1001B (e.g., general-purpose substrate 701).

[0117] It should be understood that any general-purpose substrate discussed herein, including general-purpose substrates 1, 101, 201, 301, 401, 501, 601, 701, 801, 901, and 1001, can produce a low aspect ratio or a high aspect ratio for through-holes. In one exemplary embodiment, the general-purpose substrate discussed herein may include an aspect ratio range from about 1:1 to about 10:1. In another exemplary embodiment, the general-purpose substrate discussed herein may include an aspect ratio range from about 1:1 to about 100:1. In yet another exemplary embodiment, the general-purpose substrate discussed herein may include an aspect ratio range from about 1:1 to about 1000:1.

[0118] Figure 17A method 1100 is illustrated. The initial step 1102 of method 1100 includes providing a plurality of conductors in one of a uniform pattern or in a non-uniform pattern. Another step 1104 of method 1100 includes forming a non-conductive matrix around each of the plurality of conductors to create a universal substrate. Another step 1106 of method 1100 includes connecting at least one device to a first connection surface of the universal substrate defined by the plurality of conductors. Another step 1108 of method 1100 includes connecting at least one other device to a second connection surface of the universal substrate defined by the plurality of conductors. Another step 1110 of method 1100 includes achieving conductivity between at least one device and at least one other device through a plurality of conductive pathways defined between the first and second connection surfaces.

[0119] In other exemplary embodiments, method 1100 may include optional and / or additional steps. Optional steps may also include forming a non-conductive matrix surrounding each of the plurality of conductors, further comprising: insulating each of the plurality of conductors from each other along an axis perpendicular to the plurality of conductive paths through the non-conductive matrix. Optional steps may also include connecting at least one device to a first connection surface and connecting at least another device to a second connection surface, further comprising: connecting at least one device and at least another device to at least one conductor of the plurality of conductors such that at least one device and at least another device are coaxial with respect to at least one conductor or biased with respect to at least one conductor. Optional steps may further include connecting at least one device to a first connection surface and connecting at least another device to a second connection surface, which further includes: connecting at least one device to a pair of first bonding pads, the pair of first bonding pads being defined by a first connection end of at least one set of conductors of a plurality of conductors and a second connection end of at least one set of conductors of a plurality of conductors; and connecting at least another device to a pair of second bonding pads, the pair of second bonding pads being defined by a first connection end of at least another set of conductors of a plurality of conductors and a second connection end of at least another set of conductors of a plurality of conductors; wherein the pair of first bonding pads and the pair of second bonding pads have the same or different diameters from each other. Optional steps may further include connecting at least one device to a first connection surface and connecting at least another device to a second connection surface, which further includes: connecting at least one device to a set of first conductors on the first connection surface, and connecting at least another device to the set of first conductors on the second connection surface; connecting at least one device to a set of second conductors on the first connection surface, and connecting at least another device to the set of second conductors on the second connection surface; wherein at least two conductors of the set of second conductors shield at least one conductor of the set of first conductors. Optional steps may further include connecting at least one device to the first connection surface and connecting at least another device to the second connection surface, which further includes: freely connecting at least one device and at least another device to the first and second connection surfaces at unspecified locations. Optional steps may further include enabling conductivity between at least one device and at least another device through multiple conductive paths, which further includes: the multiple conductive paths providing conductivity or thermal conductivity between at least one device and at least another device to provide directional heat flow through the non-conductive substrate.

[0120] Figure 18A method 1200 is illustrated. A starting step 1202 of method 1200 includes providing a preform with a predetermined profile. Another step 1204 of method 1200 includes winding a plurality of conductors around the outer surface of the preform. Another step 1206 of method 1200 includes injecting a non-conductive matrix between the conductors of the plurality of conductors, wherein the non-conductive matrix permeates between the gaps between the conductors to isolate some conductors from each other. Another step 1208 of method 1200 includes forming a batch product comprising the plurality of conductors and the non-conductive matrix. Another step 1210 of method 1200 includes slicing at least one segment of the batch product to form at least one universal substrate, wherein the plurality of conductors of the at least one universal substrate define a first connection surface, a second connection surface opposite to the first connection surface, and a plurality of conductive pathways defined between the first connection surface and the second connection surface.

[0121] In other exemplary embodiments, method 1200 may include optional and / or additional steps. Method 1200 may also include at least one plurality of conductors of a general-purpose substrate being conductive between a first connection surface and a second connection surface to provide electrical communication between at least two devices, and thermally conductive between the first connection surface and the second connection surface to provide directional heat flow through at least one general-purpose substrate between at least two devices. Optional steps of method 1200 may also include the step of winding the plurality of conductors further comprising: winding the plurality of conductors on the outer surface of a preform in one of a uniform pattern or in a non-uniform pattern. Optional steps of method 1200 may also include the step of winding the plurality of conductors further comprising: each of the plurality of conductors defining a diameter defined between a first connection end defining a portion of the first connection surface and a second connection end defining a portion of the second connection surface; wherein the diameters of each of the plurality of conductors are equal to each other. Optional steps of method 1200 may further include the step of winding the plurality of conductors, which further includes: winding a first set of conductors of the plurality of conductors around the outer surface of the preform, wherein each conductor of the first set of conductors defines a first diameter between a first connecting end defining a portion of a first connecting surface and a second connecting end defining a portion of a second connecting surface; and winding a second set of conductors of the plurality of conductors around the outer surface of the preform, wherein each conductor of the second set of conductors defines a second diameter between a first connecting end defining a portion of a first connecting surface and a second connecting end defining a portion of a second connecting surface; wherein the second diameter of the second set of conductors is larger than the first diameter of the first set of conductors. Optional steps of method 1200 may further include: bonding a pair of first bonding pads to a first connector of the first set of conductors of the plurality of conductors of at least one universal substrate, and a second connector of the first set of conductors of the plurality of conductors bonded to at least one universal substrate; and bonding a pair of second bonding pads to a first connector of the second set of conductors of the plurality of conductors of at least one universal substrate, and a second connector of the second set of conductors of the plurality of conductors bonded to at least one universal substrate; wherein the pair of first bonding pads and the pair of second bonding pads have the same or different diameters from each other. Optional steps of method 1200 may further include: encapsulating at least one general-purpose substrate with a passivation material; and removing several segments of the passivation material from the at least one general-purpose substrate before bonding the pair of first bonding pads and the pair of second bonding pads. Optional steps of method 1200 may further include: electrically bonding a group of first conductors of a plurality of conductors of the at least one general-purpose substrate to a first electronic device of at least two devices on a first connection surface and to a second electronic device of at least two devices on a second connection surface; and electrically separating a group of second conductors of a plurality of conductors of the at least one general-purpose substrate from the at least two devices on the first connection surface and the second connection surface; wherein at least one conductor of the group of second conductors separates a first group and a second group of the group of first conductors from each other.Optional steps of method 1200 may further include: electrically bonding a group of first conductors of a plurality of conductors of at least one general-purpose substrate to a first electronic device of at least two devices on a first connection surface and to a second electronic device of at least two devices on a second connection surface; electrically disengaging a group of second conductors of a plurality of conductors of at least one general-purpose substrate from the at least two devices on the first and second connection surfaces; and electrically bonding a group of third conductors of a plurality of conductors of at least one general-purpose substrate to the first electronic device on the first connection surface and to the second electronic device on the second connection surface; wherein at least two conductors of the group of third conductors shield at least one conductor of the group of first conductors. Optional steps of method 1200 may further include: electrically bonding at least one conductive trace to at least one of the first and second connection surfaces of at least one general-purpose substrate; wherein the at least one conductive trace is adapted to provide conductivity between the first electronic device of at least two devices and the second electronic device of at least two devices that are not coaxial with each other. Optional steps of method 1200 may further include: winding a plurality of dielectric strands around the outer surface of a preform. Method 1200 may further include the step of providing a preform having a predetermined profile, which further includes: the preform defining a circular profile having a circular outer surface; and wherein the step of slicing at least one segment of a batch product to form at least one general-purpose substrate further includes: the at least one general-purpose substrate defining a circular configuration. Optionally, method 1200 may further include: conductively bonding a first radio frequency (RF) connector of the at least one general-purpose substrate to a first RF device; and conductively bonding a second radio frequency (RF) connector of the at least one general-purpose substrate to a second RF device. Optionally, method 1200 may further include: machining a third connection surface defined between a first connection surface and a second connection surface of the at least one general-purpose substrate. Optionally, method 1200 may further include: conductively bonding a group of first conductors of a plurality of conductors of the at least one general-purpose substrate to a first electronic device on a first connection surface and to a second electronic device on a second connection surface; and conductively bonding a group of second conductors of a plurality of conductors of the at least one general-purpose substrate to a third electronic device on a third connection surface and to the second electronic device on a second connection surface; wherein the third electronic device is positioned between the first electronic device and the second electronic device. An optional step of method 1200 may further include: machining at least one through-hole defined between at least one set of conductors and at least another set of conductors of the plurality of conductors. An optional step of method 1200 may further include: electrically bonding a plurality of conductors of at least one general-purpose substrate to a first connecting surface and a second electronic device to at least two devices on a second connecting surface; and disposing a third electronic device inside at least one general-purpose substrate between at least one set of conductors and at least another set of conductors and electrically bonding it to the second electronic device; wherein the plurality of conductors of the at least one general-purpose substrate are not electrically bonded to the third electronic device.Method 1200 may further include the step of slicing at least one segment of a batch of products to form at least one general-purpose substrate, wherein the thickness of the at least one general-purpose substrate is at least 100 micrometers. Method 1200 may further include the ratio of the plurality of conductors used for the at least one general-purpose substrate being greater than 10:1.

[0122] Various inventive concepts can be embodied in one or more methods, one example of which has been provided. Actions performed as part of the method can be ordered in any suitable manner. Thus, embodiments in which actions are performed in a different order than those described can be constructed, which may include the simultaneous performance of several actions, even if they are shown as sequential actions in the illustrative embodiments.

[0123] While various embodiments of the invention have been described and illustrated herein, those skilled in the art will readily conceive of various other means and / or structures for performing the functions and / or obtaining the results and / or one or more advantages described herein, and each of these variations and / or modifications is considered within the scope of the embodiments of the invention described herein. More generally, those skilled in the art will readily understand that all parameters, dimensions, materials, and configurations described herein are intended to be exemplary, and actual parameters, dimensions, materials, and / or configurations will depend on the specific application or many applications using the teachings of the invention. Those skilled in the art will recognize, or be able to determine, many equivalents of the particular embodiments of the invention described herein using only conventional experimentation. Therefore, it should be understood that the foregoing embodiments are presented by way of example only, and embodiments of the invention can be practiced in other ways, different from the specific descriptions and claims, within the scope of the appended claims and their equivalents. The embodiments of the invention disclosed herein refer to each individual feature, system, article of manufacture, material, kit, and / or method described herein. Furthermore, if these features, systems, articles, materials, kits, and / or methods are not inconsistent with each other, any combination of two or more of these features, systems, articles, materials, kits, and / or methods is included within the scope of this disclosure.

[0124] Unless explicitly stated otherwise, the articles “a” and “an” as used in the specification and claims shall be understood to mean “at least one”. The phrase “and / or” as used herein in the specification and claims (if any) shall be understood to mean “any one or both” of the components so combined, i.e., components that are combined in some cases and separate in others. Multiple components listed with “and / or” shall be interpreted in the same way, i.e., “one or more” of the components so combined. Other components may optionally be present, whether or not they are related to those specifically identified by the “and / or” clause. Thus, as a non-limiting example, when used in conjunction with open-ended language such as “comprising,” the reference to “A and / or B” may in one embodiment mean only A (optionally including components other than B); in another embodiment, only B (optionally including components other than A); in yet another embodiment, both A and B (optionally including other components); and so on. As used herein in the specification and claims, “or” should be understood to have the same meaning as “and / or” as defined above. For example, when items are listed separately, “or” or “and / or” should be interpreted as including, i.e., including at least one of a number of components or a list of components, but also including more than one component, as well as optional additional unlisted items. Only explicitly indicating the opposite term, such as “only…one of” or “exactly…one of”, or when used in the claims, “consisting of…” will mean exactly including one of a number of components or a list of components. Generally, when preceded by an exclusive term, such as “either of the two,” “…one of,” “only…one of,” or “exactly…one of”, the word “or” as used herein should be interpreted only to indicate an exclusive alternative (i.e., “one or the other, but not both”). When used in the claims, “consisting mainly of…” should have its ordinary meaning as used in the field of patent law.

[0125] As used herein in the specification and claims, the phrase "at least one" referring to a list of one or more components should be understood to mean at least one component selected from any one or more components in the list, but not necessarily including at least one of every component specifically listed in the list, and does not exclude any combination of components in the list. This limitation also allows for the optional presence of components other than those specifically identified in the list of components referred to by the phrase "at least one," whether or not related to those specifically identified components. Therefore, as a non-limiting example, "at least one of A and B" (or equivalently, "at least one of A or B", or equivalently, "at least one of A and / or B") may in one embodiment mean at least one (optionally including more than one) A, with no B (and optionally including components other than B); in another embodiment, mean at least one (optionally including more than one) B, with no A (and optionally including components other than A); in yet another embodiment, mean at least one (optionally including more than one) A, and at least one (optionally including more than one) B (and optionally including other components); and so on.

[0126] Although the components of this disclosure are described herein with respect to each other, any one of the components disclosed herein may include the subject matter of the invention if claimed or used individually. Consistent with the examples above, if the disclosed embodiments teach the characteristics of components A and B, the subject matter of the invention may exist in the combination of A and B, A alone, or B alone, unless otherwise stated herein.

[0127] As used herein in the specification and claims, the word "effecting" or phrases beginning with "effecting" or claim components should be understood to mean causing something to happen or bringing about something. For example, the occurrence of an event can be caused by the action of the first party, even if the second party actually performs the event or causes the event to occur on the second party. It is further stated that "effecting" means that one party provides tools, objects, or resources to the other party to cause the event to occur. Therefore, in this example, a claim element "causing the event to occur" would mean that the first party provides the second party with the tools or resources necessary for the second party to perform the event; however, the single, affirmative action is the responsibility of the first party to provide the tools or resources that cause the event to occur.

[0128] When a feature or component is referred to herein as being “on” another feature or component, it may be directly on the other feature or component, or there may be intermediary features and / or components present. In contrast, when a feature or component is referred to as being “directly on” another feature or component, there are no intermediary features or components. It will also be understood that when a feature or component is referred to as being “connected,” “attached,” or “coupled” to another feature or component, it may be directly connected, attached, or coupled to the other feature or component, or there may be intermediary features or components present. In contrast, when a feature or component is referred to as being “directly connected,” “directly attached,” or “directly coupled” to another feature or component, there are no intermediary features or components. Although described or shown with respect to one embodiment, the features and components so described or shown are applicable to other embodiments. Those skilled in the art will also understand that references to structures or features positioned “adjacent” to another feature may have portions overlapping with or below the adjacent feature.

[0129] Spatial relative terms, such as “below,” “under,” “below,” “above,” “above,” “behind,” “behind,” “in front,” etc., may be used herein for ease of description in order to depict the relationship of one component or feature to another, as illustrated in the figures. It will be understood that, in addition to the orientations depicted in the figures, spatial relative terms are intended to cover different orientations of the device in use or operation. For example, if the device in the figure were inverted, the component described as “below” or “below” other components or features would then be oriented “above” other components or features. Thus, the exemplary term “below” can cover both the directions above and below. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly. Similarly, words such as “up,” “down,” “vertical,” “horizontal,” “lateral,” “transverse,” and “longitudinal” are used herein only for explanatory purposes unless otherwise specifically indicated.

[0130] While terms such as “first” and “second” may be used herein to describe various features / components, these features / components should not be limited by these terms unless the context otherwise indicates. These terms may be used to distinguish one feature / component from another. Thus, a first feature / component discussed herein may be referred to as a second feature / component, and similarly, a second feature / component discussed herein may be referred to as a first feature / component, without departing from the teachings of the invention.

[0131] One embodiment is a implementation or example of this disclosure. References to "embodiment," "one embodiment," "some embodiments," "a specific embodiment," "exemplary embodiment," or "other embodiments," etc., in this specification mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least some embodiments of the invention, but does not necessarily include all embodiments of the invention. Various occurrences of "embodiment," "one embodiment," "some embodiments," "a specific embodiment," "exemplary embodiment," or "other embodiments," etc., do not necessarily refer to the same embodiment.

[0132] If this specification uses the words "may," "perhaps," or "may" to include a component, feature, structure, or characteristic, then it is not necessary to include that specific component, feature, structure, or characteristic. If the specification or claims refer to "a" or "an" component, it does not mean that only one of that component exists. If the specification or claims refer to "additional" component, it does not exclude the possibility of more than one additional component.

[0133] As used herein in the specification and claims, including as in the examples, and unless expressly specified otherwise, all figures shall be understood as if beginning with the single word “about” or “approximately”, even if the term is not explicitly stated. The phrase “about” or “approximately” may be used when describing a range and / or location to indicate that the stated value and / or location is within a reasonably expected range of the value and / or location. For example, a numerical value may have a value that is + / - 0.1% of the stated value (or range of values), + / - 1% of the stated value (or range of values), + / - 2% of the stated value (or range of values), + / - 5% of the stated value (or range of values), + / - 10% of the stated value (or range of values), etc. Any numerical range referenced herein is intended to include all subranges incorporated herein.

[0134] Furthermore, the methods disclosed herein can be performed in different orders than those described herein. Therefore, unless explicitly stated otherwise, the order of the methods should not be construed as limiting. It will be appreciated that performing some steps of the method in different orders can achieve similar results.

[0135] In the claims and in the description above, all transitional phrases such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “holding,” and “consisting of” should be understood as open-ended, meaning including but not limited to. Only the transitional phrases “consisting of” and “substantially consisting of” should be closed or semi-closed transitional phrases, as described in the U.S. Patent and Trademark Office’s Manual of Patent Examination Procedure.

[0136] To the extent that the term “invention” has been used in the headings or sections of this specification, the term is included as required by the formatting requirements of the U.S. Patent and Trademark Office guidelines / requirements submitted via Word document and shall not in any way be construed as a denial of any subject matter.

[0137] In the preceding description, certain terms have been used for the sake of brevity, clarity, and understanding. No unnecessary limitations should be implied from these terms except as required by the prior art, as they are used for narrative purposes and are intended to be broadly interpreted.

[0138] Furthermore, the descriptions and illustrations of various embodiments of this disclosure are exemplary, and this disclosure is not limited to the exact details shown or described.

Claims

1. A method comprising: Provide prefabricated parts with a predetermined outline; Multiple conductors are wound around the outer surface of the preform; A non-conductive matrix is ​​injected between the conductors of the plurality of conductors, wherein the non-conductive matrix permeates between the gaps between the plurality of conductors to isolate some of the conductors from each other; Forming a batch of products comprising the multiple conductors and the non-conductive matrix; as well as At least one segment of the batch product is sliced ​​to form at least one general-purpose substrate, wherein the plurality of conductors of the at least one general-purpose substrate define a first connection surface, a second connection surface opposite to the first connection surface, and a plurality of conductive paths defined between the first connection surface and the second connection surface.

2. The method of claim 1, wherein the plurality of conductors of the at least one general-purpose substrate are one of conducting electricity between the first connection surface and the second connection surface to provide electrical communication between at least two devices, and conducting heat between the first connection surface and the second connection surface to provide directional heat flow through the at least one general-purpose substrate between the at least two devices.

3. The method of claim 1, wherein the step of winding the plurality of conductors further comprises: The plurality of conductors are wound around the outer surface of the preform in one of the uniform patterns or in a non-uniform pattern.

4. The method of claim 1, wherein the step of winding the plurality of conductors further comprises: Each of the plurality of conductors defines a diameter between a first connection end defining a portion of the first connection surface and a second connection end defining a portion of the second connection surface; The diameter of each of the plurality of conductors is equal to that of the others.

5. The method of claim 1, wherein the step of winding the plurality of conductors further comprises: A first set of conductors of the plurality of conductors is wound around the outer surface of the preform, wherein each conductor of the first set of conductors defines a first diameter, the first diameter being defined between a first connecting end defining a portion of the first connecting surface and a second connecting end defining a portion of the second connecting surface; and A second set of conductors of the plurality of conductors is wound around the outer surface of the preform, wherein each conductor of the second set of conductors defines a second diameter, the second diameter being defined between a first connecting end defining a portion of the first connecting surface and a second connecting end defining a portion of the second connecting surface; The second diameter of the second group of conductors is larger than the first diameter of the first group of conductors.

6. The method according to claim 1, further comprising: A first connector for a first set of conductors of a plurality of conductors bonded to a pair of first bonding pads, and a second connector for the first set of conductors of a plurality of conductors bonded to the at least one general-purpose substrate; as well as A first connector for bonding a pair of second bonding pads to a second set of conductors of the plurality of conductors of the at least one general-purpose substrate, and a second connector for bonding the second set of conductors of the plurality of conductors to the at least one general-purpose substrate; The first mating pad and the second mating pad have diameters that are equal to or different from each other.

7. The method according to claim 6, further comprising: The at least one general-purpose substrate is encapsulated with a passivating material; as well as Before bonding the pair of first bonding pads and the pair of second bonding pads, several segments of the passivation material are removed from the at least one general-purpose substrate.

8. The method according to claim 1, further comprising: A first conductor of the plurality of conductors of the at least one general-purpose substrate is electrically bonded to a first electronic device of at least two devices on the first connection surface and to a second electronic device of at least two devices on the second connection surface. as well as A set of second conductors of the plurality of conductors of the at least one general-purpose substrate is electrically disconnected from the first connection surface and the second connection surface from at least two devices; At least one conductor of the second conductor in the group separates the first group of the first conductors and the second group of the first conductors from each other.

9. The method according to claim 1, further comprising: A first conductor of the plurality of conductors of the at least one general-purpose substrate is electrically bonded to a first electronic device of at least two devices on the first connection surface and to a second electronic device of at least two devices on the second connection surface. A set of second conductors of the plurality of conductors of the at least one general-purpose substrate is electrically disconnected from at least two devices at the first connection surface and the second connection surface; as well as A third conductor of the plurality of conductors of the at least one general-purpose substrate is electrically bonded to the first electronic device on the first connection surface and to the second electronic device on the second connection surface. At least two conductors of the third conductor in the group shield at least one conductor of the first conductor in the group.

10. The method according to claim 1, further comprising: At least one conductive trace is electrically bonded to at least one of the first connection surface and the second connection surface of the at least one general-purpose substrate. The at least one conductive trace is adapted to provide conductivity between a first electronic component of the at least two devices that are coaxial with each other and a second electronic component of the at least two devices.

11. The method according to claim 1, further comprising: Multiple dielectric strands are wound around the outer surface of the preform.

12. The method of claim 1, wherein the step of providing a preform having the predetermined profile further comprises: The preform defines a circular profile with a circular outer surface; as well as The step of slicing at least one segment of the batch of products to form the at least one general-purpose substrate further includes: the at least one general-purpose substrate defining a circular configuration.

13. The method of claim 12, further comprising: The first radio frequency (RF) connector of the at least one general-purpose substrate is electrically bonded to the first RF device; as well as The second radio frequency (RF) connector of the at least one general-purpose substrate is electrically bonded to the second RF device.

14. The method according to claim 1, further comprising: The third connection surface, defined between the first connection surface and the second connection surface of the at least one general-purpose substrate, is machined.

15. The method of claim 14, further comprising: A first conductor of the plurality of conductors of the at least one general-purpose substrate is electrically bonded to a first electronic device on the first connection surface and to a second electronic device on the second connection surface. as well as A set of second conductors of the plurality of conductors of the at least one general-purpose substrate are electrically bonded to the third electronic device on the third connection surface and to the second electronic device on the second connection surface. The third electronic device is positioned between the first electronic device and the second electronic device.

16. The method according to claim 1, further comprising: At least one through hole between at least one set of conductors and at least another set of conductors of the plurality of conductors is machined.

17. The method of claim 16, further comprising: The plurality of conductors of the at least one general-purpose substrate are electrically bonded to the first electronic device on the first connection surface and to the second electronic device with at least two devices on the second connection surface. as well as The third electronic device is disposed on the inside of at least one general-purpose substrate between the at least one set of conductors and the at least another set of conductors, and is electrically connected to the second electronic device; The plurality of conductors of the at least one general-purpose substrate are not electrically bonded to the third electronic device.

18. The method of claim 1, wherein the step of slicing at least one segment of the batch product to form at least one general-purpose substrate further comprises: The thickness of the at least one general-purpose substrate is at least 100 micrometers.

19. The method of claim 1, wherein the ratio of the plurality of conductors used for the at least one general-purpose substrate is greater than 10:

1.

20. A method comprising: Provide prefabricated parts with a predetermined outline; Multiple conductors are wound around the outer surface of the preform; A non-conductive matrix is ​​injected between the conductors of the plurality of conductors, wherein the non-conductive matrix permeates between the gaps between the plurality of conductors to isolate some of the conductors from each other; Forming a batch of products comprising the multiple conductors and the non-conductive matrix; as well as At least one segment of the batch product is sliced ​​to form at least one general-purpose substrate, wherein the plurality of conductors of the at least one general-purpose substrate define a first connection surface, a second connection surface opposite to the first connection surface, and a plurality of conductive paths defined between the first connection surface and the second connection surface. The plurality of conductors of the at least one general-purpose substrate are either conductive between the first connection surface and the second connection surface to provide electrical communication between at least two devices, or conductive between the first connection surface and the second connection surface to provide directional heat flow through the at least one general-purpose substrate between the at least two devices.

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