Refrigeration variable temperature area refrigeration device, control method thereof and refrigerator

Abstract

The invention relates to the technical field of refrigeration equipment, and discloses a refrigeration variable temperature area refrigeration device, a control method thereof and a refrigerator, the refrigeration variable temperature area refrigeration device comprises a first cold conduction sheet, a semiconductor sheet, a second cold conduction sheet and a heat exchanger, the first cold conduction sheet is arranged on the outer surface of a refrigeration liner, and the semiconductor sheet is installed on the surface of the first cold conduction sheet; one end of the heat exchanger is connected with the surface of the semiconductor sheet, and the other end of the heat exchanger is connected with the surface of the second cold conduction sheet; the semiconductor sheet and the first cold conduction sheet are used for independent refrigeration of the refrigeration variable temperature area, the heat exchanger and the second cold conduction sheet are used for synergistically improving the efficiency through the refrigerating capacity of the evaporator, an additional third evaporator system is not needed, the refrigerator pipeline structure is simplified, the arrangement difficulty and the operation load are reduced, accurate temperature control of the variable temperature area is achieved, food material odor tainting is avoided, energy consumption is reduced, and the energy consumption is reduced. The problems that a traditional three-system refrigerator is complex in structure and high in energy consumption due to an independent evaporator are solved.

Description

Technical Field

[0001] This invention relates to the field of refrigeration equipment technology, specifically to a refrigeration device with a variable temperature zone for cold storage, its control method, and a refrigerator. Background Technology

[0002] Currently, the mainstream three-system refrigerators on the market adopt a three-evaporator independent cooling solution. By equipping the refrigerator compartment, freezer compartment, and variable temperature compartment with dedicated evaporators, a three-system, three-circulation architecture is constructed. This effectively prevents air circulation and cross-contamination of odors between different compartments, ensuring the freshness and flavor independence of food in each compartment. However, to achieve independent temperature control in the variable temperature compartment, this solution requires an additional complete third evaporator cooling system. This not only makes the internal piping structure of the refrigerator more complex, increasing the difficulty of piping layout and the overall system size, but also significantly increases the total length of the refrigeration pipes and fluid resistance, thereby increasing the system's operating load and adversely affecting cooling efficiency and energy consumption control.

[0003] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a refrigeration device with a variable temperature zone for cold storage, its control method and refrigerator, which aims to solve the problems of complex piping and increased system piping load caused by the existing three-evaporator system.

[0005] The technical solution adopted by this invention to solve the technical problem is as follows: A refrigeration device for a variable temperature zone in a cold storage facility, comprising: The first cooling plate is disposed on the outer surface of the refrigerator inner liner and corresponds to the refrigerator temperature change zone inside the refrigerator inner liner; A semiconductor chip is disposed on the surface of the first heat-conducting sheet; the semiconductor chip is electrically connected to the refrigerator's controller; The second cooling plate is disposed on the outer surface of the refrigerator liner and corresponds to the evaporator inside the refrigerator liner; A heat exchanger is disposed at one end on the surface of the semiconductor wafer and at the other end on the surface of the second heat-conducting sheet, so as to transfer the heat of the semiconductor wafer to the second heat-conducting sheet.

[0006] Furthermore, a thermally conductive layer is provided on the side of the semiconductor wafer away from the first cold-conducting sheet, and the thermally conductive layer is in contact with the heat exchanger.

[0007] Furthermore, the heat-conducting layer is provided with mounting grooves for mounting the heat exchanger.

[0008] Furthermore, both ends of the heat exchanger are arranged in an S-shape on the semiconductor plate and the second heat-conducting plate, respectively.

[0009] Furthermore, it also includes: A temperature sensor is located inside the refrigeration variable temperature zone and is connected to the refrigerator's controller.

[0010] Furthermore, the thermally conductive layer may be a copper plate, an aluminum plate, or silicone grease.

[0011] A control method for a refrigeration device, based on the above-mentioned variable temperature zone refrigeration device, includes: The startup and shutdown temperatures of the semiconductor chip are preset; The real-time temperature of the refrigeration temperature-changing zone is obtained and compared with the start-up temperature and the shutdown temperature. Based on the comparison results, the controller sends a start signal or a stop signal to the semiconductor chip to initiate or stop cooling.

[0012] Furthermore, the step of sending a start signal or a stop signal to the semiconductor chip based on the comparison result to initiate or stop cooling includes: When the evaporator is working, if the real-time temperature is greater than the start-up temperature, the controller sends a start-up signal to the semiconductor chip and enters the rated working state. If the real-time temperature is lower than the start-up temperature, the controller sends a stop signal to the semiconductor chip to stop cooling.

[0013] Furthermore, the step of sending a start signal or a stop signal to the semiconductor chip based on the comparison result to initiate or stop cooling includes: When the evaporator is not working, if the real-time temperature is greater than the start-up temperature, the controller sends a start-up signal and enters a low-load working state. If the real-time temperature is lower than the semiconductor chip's start-up temperature, the controller sends a stop signal to the semiconductor chip to stop cooling.

[0014] A refrigerator comprising the aforementioned variable temperature refrigeration unit for the refrigeration zone.

[0015] Compared with the prior art, the beneficial effects of the present invention are: In this invention, a first cooling plate corresponding to the variable temperature zone of the refrigerator is set on the inner liner of the refrigerator. A semiconductor chip is placed on the surface of the first cooling plate and electrically connected to the controller. At the same time, a second cooling plate corresponding to the evaporator is set. A heat exchanger is used to connect the semiconductor chip and the second cooling plate to transfer temperature. The variable temperature zone of the refrigerator can be independently cooled by the semiconductor chip and the first cooling plate. At the same time, the cooling efficiency can be improved by using the cooling capacity of the evaporator with the help of the heat exchanger and the second cooling plate. There is no need to add a complete third evaporator system. This simplifies the internal piping structure of the refrigerator, reduces the difficulty of piping layout and operating load, and achieves precise temperature control of the variable temperature zone to avoid cross-contamination of food flavors. It also reduces energy consumption and solves the problems of complex structure and high energy consumption caused by independent evaporators in traditional three-system refrigerators. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0017] Figure 2 This is a schematic diagram of the internal air circulation within the greenhouse glass body of the present invention.

[0018] Figure 3 for Figure 2 A magnified structural diagram at point A in the diagram.

[0019] Figure 4 This is a system block diagram of the refrigeration device for the variable temperature zone of the refrigeration unit of the present invention.

[0020] Figure 5 This is a flowchart of the control method for the refrigeration device of the present invention.

[0021] The numbers in the diagram represent: 1. Refrigerated inner liner; 2. First heat conduction plate; 3. Semiconductor plate; 4. Second heat conduction plate; 5. Heat exchanger; 6. Evaporator; 7. Heat conduction layer; 8. Controller; 9. Temperature sensor. Detailed Implementation

[0022] To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0023] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0024] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0025] In view of the shortcomings of the prior art, this embodiment provides a refrigeration device for a variable temperature zone, its control method, and a refrigerator, which can be referred to as follows: As attached Figure 1 and attached Figure 4 As shown, a refrigeration device for a variable temperature zone in a refrigerator includes a first cooling plate 2, a semiconductor plate 3, a second cooling plate 4, and a heat exchanger 5. The first cooling plate 2 is disposed on the outer surface of the refrigerator inner liner 1, corresponding to the variable temperature zone in the refrigerator to transfer cooling capacity; the semiconductor plate 3 is mounted on the surface of the first cooling plate 2 and is electrically connected to the refrigerator controller 8 to control the start and stop of refrigeration; the second cooling plate 4 is also disposed on the outer surface of the refrigerator inner liner 1, corresponding to the evaporator 6 inside the refrigerator inner liner 1 to receive its cooling capacity; one end of the heat exchanger 5 is connected to the surface of the semiconductor plate 3, and the other end is connected to the surface of the second cooling plate 4, for transferring the heat generated by the semiconductor plate 3 to the second cooling plate 4, forming a synergistic refrigeration path.

[0026] The first cooling plate 2 is a sheet-like structure made of metal (such as aluminum or copper), with an area matching the bottom or side wall of the variable temperature zone. It is fixed to the inner wall of the inner liner with thermally conductive adhesive to ensure efficient transfer of cold energy to the variable temperature zone. The semiconductor plate 3 is a thermoelectric cooling plate, with its cold end attached to the first cooling plate 2 and its hot end connected to the heat exchanger 5. The controller 8 adjusts the direction and magnitude of the current to control cooling or heating. The second cooling plate 4 is made of the same material as the first cooling plate 2, with an area slightly larger than the contact area of ​​the evaporator 6, and is used to collect the cold energy from the evaporator 6. The heat exchanger 5 is a copper or aluminum conduit, which is bent to ensure close contact at both ends with the semiconductor plate 3 and the second cooling plate 4, respectively. It has high thermal conductivity and ensures efficient temperature transfer.

[0027] Specifically, when the variable temperature zone of the refrigerator needs to be cooled, the controller 8 sends a start signal to the semiconductor chip 3, whose cold end directly cools the variable temperature zone through the first cooling plate 2. At the same time, the heat exchanger 5 transfers the heat from the hot end of the semiconductor chip 3 (or the cooling energy when reverse-energized) to the second cooling plate 4. If the evaporator 6 is in operation, the second cooling plate 4 can enhance heat dissipation (or assist in cooling) with the cooling energy of the evaporator 6, thereby improving the cooling efficiency of the semiconductor chip 3. When the variable temperature zone reaches the set temperature, the controller 8 sends a stop signal to the semiconductor chip 3, and the semiconductor chip 3 stops cooling.

[0028] Compared to existing technologies, traditional three-system refrigerators require a dedicated independent evaporator 6 to achieve independent temperature control and circulation in the variable temperature zone. This independent evaporator 6 needs to be connected to the refrigerator's main compressor and refrigeration circuit through a complete set of additional refrigeration piping. This design not only increases the total length of the internal refrigeration piping compared to conventional dual-system refrigerators and significantly increases the complexity of the piping layout, but also significantly increases the fluid resistance of the refrigeration system. The compressor needs to consume more energy to drive the refrigerant to circulate in the longer piping, directly resulting in increased system energy consumption. At the same time, the addition of the independent evaporator 6 inevitably involves more piping interfaces, control valves, and connecting components. Combined with the complex piping layout, this not only increases the difficulty and labor costs of production and assembly, but also significantly increases the probability of piping leaks and component failures during equipment operation due to the increased number of potential failure points, causing many inconveniences for later maintenance and repair. This innovative solution adopts a core design combining semiconductor chip 3 and heat exchanger 5, completely abandoning the traditional design approach that relies on an independent evaporator 6. By efficiently integrating the cooling / heating function of semiconductor chip 3 with the refrigerator's original heat exchanger 5, the complete independent evaporator 6 system is eliminated. At the same time, the additional piping and control components are simplified, effectively reducing the space occupied by the piping and fluid resistance, and significantly reducing production and manufacturing costs and long-term operating costs.

[0029] This technical solution, while ensuring the independent temperature control function of the refrigerator's variable temperature zone, eliminates the need for an additional complete evaporator system 6 and supporting piping, significantly simplifying the internal structural layout of the refrigerator. This not only reduces the design difficulty of piping layout and the complexity of production and assembly, but also minimizes space waste caused by complex piping, thus optimizing the internal storage space. Simultaneously, the streamlined piping and simplified structure significantly reduce the operating load of the refrigeration system, lowering the probability of malfunctions and improving the stability and reliability of system operation. Furthermore, the synergistic effect of the semiconductor chip 3 and the heat exchanger 5 further enhances overall refrigeration efficiency. Moreover, this solution retains the advantages of independent storage in the original three-system refrigerator—refrigeration, freezing, and variable temperature zones—effectively preventing cross-contamination of odors between different compartments. While ensuring the freshness of food, significant energy-saving and consumption-reducing effects are achieved through structural simplification and efficiency improvement, balancing user experience, product operational stability, and environmental economy, demonstrating outstanding technical advantages and market application value.

[0030] In this embodiment, as shown in the appendix Figure 2 and attached Figure 3 As shown, a high-performance thermal conductive layer 7 is specially provided on the side of the semiconductor chip 3 away from the first heat-conducting plate 2. The thermal conductive layer 7 is closely attached to the heat exchange surface of the heat exchanger 5. Its core design goal is to significantly enhance the thermal conduction efficiency between the semiconductor chip 3 and the heat exchanger 5 by optimizing the heat conduction path between the semiconductor chip 3 and the heat exchanger 5 and reducing the interface thermal resistance, thereby maximizing the transfer of heat from the semiconductor chip 3 to the second heat-conducting plate 4 and ensuring that the cooling performance of the semiconductor chip 3 is fully utilized.

[0031] Among them, the heat-conducting layer 7 must completely cover all effective surfaces of the non-cold-conducting side of the semiconductor wafer 3 to ensure that there are no large areas of suspended space; the material is selected from metals or alloys with high thermal conductivity (such as oxygen-free copper, pure aluminum, copper-aluminum composite materials or silicone grease, etc.) to provide a material basis for efficient heat transfer.

[0032] Specifically, when the semiconductor chip 3 is working, its hot end continuously generates heat. This energy needs to be transferred quickly and efficiently to the heat exchanger 5 for heat dissipation; otherwise, the semiconductor chip 3 will accumulate heat, severely affecting its working efficiency and even shortening its service life. In traditional designs, the semiconductor chip 3 and the heat exchanger 5 are often in direct contact. However, due to the microscopic roughness of the semiconductor chip 3 surface and the processing precision limitations of the contact surface of the heat exchanger 5, tiny air gaps are easily formed when they are in direct contact. These air gaps have extremely low thermal conductivity, resulting in poor heat dissipation. The thermally conductive layer 7 of this application, through its excellent ductility and flatness, can fully contact the semiconductor chip 3 and the heat exchanger 5, further improving heat transfer. At the same time, the thermally conductive layer 7 can also act as a buffer, dispersing the local pressure applied to the semiconductor chip 3 by the heat exchanger 5 during assembly or operation, avoiding mechanical damage such as chip cracking and performance degradation caused by uneven force or local stress concentration, and further ensuring the stable operation of the semiconductor chip 3.

[0033] Through the above technical solutions, the design of the heat-conducting layer 7 in this application has been optimized in terms of material selection, structural dimensions, and other aspects. It not only strengthens the thermal coupling effect between the semiconductor chip 3 and the heat exchanger 5, significantly improving the refrigeration (or heat dissipation) efficiency and the heat exchange effect of the heat exchanger 5, ensuring that the performance of the semiconductor chip 3 is fully utilized; at the same time, the heat-conducting layer 7 provides effective mechanical protection for the semiconductor chip 3, avoiding chip damage caused by poor contact, stress concentration, and other problems, significantly enhancing the working reliability and long-term durability of the device, and providing an important guarantee for the stable and efficient operation of the entire refrigerator refrigeration system.

[0034] In this embodiment, the heat-conducting layer 7 is provided with an installation groove for installing the heat exchanger 5 to increase the contact area, thereby increasing the heat exchange interface, improving the temperature transfer efficiency, and reducing thermal resistance loss.

[0035] The mounting groove is a strip-shaped groove opened along the surface of the heat-conducting layer 7. Its cross-section matches the shape of the heat exchanger 5 conduit (e.g., semi-circular), its length is consistent with the arrangement length of the heat exchanger 5 on the heat-conducting layer 7, and its depth is 1 / 2 to 2 / 3 of the conduit diameter. This ensures that the contact area between the heat exchanger 5 and the groove wall after embedding is larger than the contact area of ​​a flat surface. The inner wall of the mounting groove is smoothed and thermally conductive silicone grease is applied to further fill the gaps.

[0036] Specifically, after the heat exchanger 5 conduit is embedded in the mounting groove, the contact with the heat-conducting layer 7 changes from line contact to surface contact, increasing the contact area and thus reducing the thermal resistance. At the same time, the mounting groove mechanically fixes the heat exchanger 5, preventing loosening of the contact due to refrigerator vibration.

[0037] Through the above technical solutions, the mounting groove design of this application significantly improves heat transfer efficiency and stability by increasing the contact area and fixing the heat exchanger 5, further optimizing the synergistic effect between the semiconductor chip 3 and the heat exchanger 5, and ensuring the efficient operation of the refrigeration device.

[0038] Furthermore, the thermally conductive layer 7 can also be silicone grease. During the installation phase, a layer of high thermal conductivity silicone grease can be evenly applied to the side of the semiconductor chip 3 away from the first cooling plate 2 (i.e., the hot end surface that is in contact with the heat exchanger 5). This ensures that the entire effective area of ​​the hot end of the semiconductor chip 3 is covered, and defects such as bubbles and voids are avoided during the application process, laying the foundation for subsequent contact heat transfer. Subsequently, the pipes (or heat exchange contact surfaces) of the heat exchanger 5 are precisely aligned with the area where the silicone grease is applied and slowly placed. Uniform extrusion pressure is applied using a special tooling fixture. Utilizing the good fluidity and plasticity of the silicone grease, the pipes are embedded into the silicone grease layer under the extrusion action, naturally forming an arc-shaped groove that completely conforms to the outer contour of the pipe.

[0039] The core advantage of this assembly process lies in its ability to create a tight, "face-to-face" contact between the silicone grease layer and the outer wall of the heat exchanger's pipes through extrusion molding, completely eliminating the point contact, line contact, or micro-gap problems that easily occur in traditional application methods. On the one hand, the larger contact area shortens the heat transfer path and reduces interfacial thermal resistance; on the other hand, the tight adhesion between the silicone grease and the outer wall of the pipes prevents air residue, further improving heat transfer efficiency.

[0040] In this embodiment, as shown in the appendix Figure 1 As shown, both ends of the heat exchanger 5 are arranged in an S-shape on the semiconductor plate 3 and the second heat-conducting plate 4 respectively. By extending the contact path and increasing the contact area, the temperature transfer effect is enhanced.

[0041] Among them, the S-shaped arrangement refers to the heat exchanger 5 conduit extending on the surface of the semiconductor plate 3 and the second cooling plate 4 in a continuous bending manner, with 3-5 bends to form an S-shaped path, which increases the contact length by 2-3 times compared to the straight arrangement within the same installation space.

[0042] Specifically, the S-shaped arrangement effectively increases the contact area between the heat exchanger 5 and the semiconductor plate 3, and increases the contact area with the second cooling plate 4 simultaneously. When the semiconductor plate 3 is working, the S-shaped path prolongs the temperature transfer time, allowing the heat to be absorbed more fully by the heat exchanger 5, effectively improving the transfer efficiency.

[0043] Through the above technical solutions, the S-type heat exchanger 5 design of this application significantly improves the temperature transfer efficiency and uniformity, accelerates the refrigeration response speed of the cold storage variable temperature zone, and further enhances the temperature control accuracy and energy-saving effect of the device.

[0044] In this embodiment, the heat exchanger 5 is a copper tube or a hydraulic heat exchange system; when the heat exchanger 5 is a copper tube, the copper tube is connected front and back, one end is in contact with the second cooling fin 4, and the other end is in contact with the heat-conducting layer 7 to realize the transfer of heat. Both can achieve efficient heat exchange between the semiconductor chip 3 and the outside, ensuring the temperature control stability of the variable temperature zone. When copper tubes are used as the core component of heat exchanger 5, the copper tubes are processed into an integrated connection structure connected in series through a precision bending and forming process. The pipe routing fits the reserved installation space inside the refrigerator, ensuring the continuity of the heat exchange path and avoiding messy pipe routing that occupies storage space. One end of the copper tube in this series structure is tightly attached to the outer surface of the second heat-conducting plate 4, and the contact surface is pre-applied with thermal grease, so that the cold energy transferred by the second heat-conducting plate 4 can be quickly conducted to the inner wall of the copper tube. The other end of the copper tube completely covers and adheres to the outer surface of the aforementioned heat-conducting layer 7, forming a complete heat transfer path of "semiconductor chip 3 - heat-conducting layer 7 - copper tube - second heat-conducting plate 4", ensuring that there is no significant thermal resistance accumulation between the components and achieving efficient conduction.

[0045] When a liquid-cooled heat exchange system is selected for heat exchanger 5, the system mainly consists of a coolant circulation pipeline and a micro-circulation pump. The coolant circulation pipeline can be made of copper pipe, with coolant installed inside. The micro-circulation pump provides circulation power for the coolant, allowing it to flow continuously within the circulation pipeline. The heat generated by the semiconductor chip 3 during operation is transferred to the coolant through the heat-conducting layer 7 and flows to the heat exchange area of ​​the second cooling plate 4 under the action of the micro-circulation pump. The second cooling plate 4 cools the coolant and circulates it, achieving circulating cooling.

[0046] In this embodiment, as shown in the appendix Figure 4 As shown, the refrigeration device in the variable temperature zone of the refrigerator also includes a temperature sensor 9. The temperature sensor 9 is located inside the variable temperature zone of the refrigerator and is connected to the refrigerator controller 8. It realizes precise start-stop control of the semiconductor chip 3 by monitoring the temperature of the variable temperature zone in real time.

[0047] The temperature sensor 9 is a current technology and is fixed in the middle of the variable temperature zone by a bracket (away from the first cooling plate 2 to avoid local temperature interference). The sensor and the controller 8 are connected by wires to ensure real-time temperature data feedback.

[0048] Specifically, temperature sensor 9 continuously collects the actual temperature of the refrigerated variable temperature zone and sends the data to controller 8. When the actual temperature is higher than the set start-up temperature, controller 8 sends a start signal to semiconductor chip 3; when the temperature drops to the set shutdown temperature, controller 8 sends a stop signal to semiconductor chip 3, forming a closed-loop control.

[0049] Through the above technical solution, the temperature sensor 9 of this application realizes real-time temperature monitoring and closed-loop control of the cold storage variable temperature zone, ensuring the precise start and stop of the semiconductor chip 3, improving the temperature control accuracy and stability, ensuring the freshness of food, and reducing ineffective energy consumption.

[0050] In this embodiment, the thermal conductive layer 7 can be a copper plate, an aluminum plate, or silicone grease. All three materials have high thermal conductivity, which can be adapted to different cost and performance requirements, ensuring efficient heat transfer between the semiconductor chip 3 and the heat exchanger 5.

[0051] Through the above technical solution, the material selection of the heat-conducting layer 7 in this application achieves a balance between performance and cost, ensuring that semiconductor chips 3 of different power can efficiently transfer temperature, thereby enhancing the versatility and economy of the device.

[0052] As attached Figure 5 As shown, this application also proposes a control method for a refrigeration device, based on the above-mentioned variable temperature zone refrigeration device for cold storage, comprising the following steps: Step S100: Preset the start-up temperature and shutdown temperature of the semiconductor chip; Step S200: Obtain the real-time temperature of the refrigeration variable temperature zone and compare the real-time temperature with the start-up temperature and the shutdown temperature; In step S300, based on the comparison result, the controller sends a start signal or a stop signal to the semiconductor chip to perform cooling or stop cooling.

[0053] In this embodiment, by acquiring and comparing the temperature of the variable temperature zone in real time, the controller 8 sends a start or stop signal to the semiconductor chip 3 to achieve precise refrigeration control of the variable temperature zone.

[0054] The preset start-up and shutdown temperatures of the semiconductor chip 3 can be manually adjusted via the refrigerator control panel or set by system defaults. Temperature acquisition is achieved through the temperature sensor 9 inside the variable temperature zone. Comparison is performed by the refrigerator controller 8, which automatically triggers the start and stop of the semiconductor chip 3 based on temperature deviations.

[0055] Specifically, the user sets the start-up temperature and shutdown temperature before use. During operation, if the actual temperature is higher than the start-up temperature, the controller 8 sends a start signal, and the semiconductor chip 3 begins cooling; if the actual temperature is lower than the shutdown temperature, the controller 8 sends a stop signal, and the semiconductor chip 3 stops working.

[0056] Through the above technical solution, the control method of this application achieves precise and efficient temperature control in the cold storage variable temperature zone, ensuring that the temperature is stable within the target range, improving the food preservation effect, and reducing the ineffective operating time of the semiconductor chip 3 to achieve energy saving.

[0057] Specifically, in one implementation of this embodiment, step S300 includes the following steps: Step S301: When the evaporator is working, if the real-time temperature is greater than the start-up temperature, the controller sends a start-up signal to the semiconductor chip and enters the rated working state. In step S302, if the real-time temperature is lower than the start-up temperature, the controller sends a stop signal to the semiconductor chip to stop cooling.

[0058] In the control method of this embodiment, when the evaporator 6 is working, the controller 8 selectively sends a start or stop signal by comparing the real-time temperature of the variable temperature zone with the start temperature and the shutdown temperature: if the real-time temperature of the variable temperature zone is higher than the start temperature, the semiconductor chip 3 enters the rated working state; if it is lower than the start temperature, the semiconductor chip 3 stops cooling, thus achieving efficient coordinated operation with the evaporator 6.

[0059] The evaporator 6 operating state refers to the evaporator 6 of the refrigerator's main cooling system being in the cooling stage (compressor running). At this time, the second cooling fin 4 can obtain the cooling capacity of the evaporator 6 through the heat exchanger 5 to dissipate heat for the semiconductor chip 3. The rated operating state means that the semiconductor chip 3 operates at 100% power, with the highest cooling efficiency, suitable for scenarios requiring rapid cooling.

[0060] Specifically, when the evaporator 6 is working, the cooling energy it generates is transferred to the hot end of the semiconductor chip 3 through the second cooling fin 4 and the heat exchanger 5, enhancing the heat dissipation effect and effectively improving the cooling efficiency of the semiconductor chip 3. At this time, if the temperature of the variable temperature zone is higher than the start-up temperature, the controller 8 starts the semiconductor chip 3 to operate at full capacity, using the evaporator 6 to assist in rapid cooling; if the temperature is lower than the start-up temperature, the semiconductor chip 3 stops. For example, when the evaporator 6 is working, the variable temperature zone naturally cools down to below the semiconductor start-up temperature, and the semiconductor chip 3 does not need to be started.

[0061] Through the above technical solution, the control logic of this application optimizes the operating state of the semiconductor chip 3 when the evaporator 6 is working, utilizes the cooling capacity of the evaporator 6 to improve the cooling efficiency, and avoids excessive energy consumption, thereby achieving efficient temperature control in the variable temperature zone.

[0062] Specifically, in one implementation of this embodiment, step S300 includes the following steps: Step S310: When the evaporator is not working, if the real-time temperature is greater than the start-up temperature, the controller sends a start-up signal to the evaporator and enters a low-load working state. In step S320, if the real-time temperature is lower than the semiconductor chip's start-up temperature, the controller sends a stop signal to the semiconductor chip to stop cooling.

[0063] In the control method of this embodiment, when the evaporator 6 is not working, the controller 8 selectively sends a start or stop signal by comparing the real-time temperature of the variable temperature zone with the start temperature and the shutdown temperature: if the real-time temperature of the variable temperature zone is higher than the start temperature, the semiconductor chip 3 enters a low-load working state; if it is lower than the start temperature, the semiconductor chip 3 stops cooling, thus balancing the cooling demand and energy consumption control.

[0064] In this context, the "evaporator 6 not working" state refers to the evaporator 6 of the refrigerator's main cooling system being in a shutdown phase (compressor dormancy). At this time, the remaining cooling capacity of the evaporator 6 is insufficient to guarantee the rated operating state of the semiconductor chip 3, and heat dissipation relies more on the environment. The "low load operating state" refers to the semiconductor chip 3 operating at 50%-70% power. Although the cooling capacity decreases, the heat dissipation pressure is reduced, avoiding shutdown caused by overheat protection. At the same time, the semiconductor chip 3 can also provide a defrosting function for the evaporator 6, accelerating the temperature recovery of the evaporator 6 and reducing frost buildup on the refrigerator evaporator 6.

[0065] Specifically, when the evaporator 6 is not working, the heat dissipation of the semiconductor chip 3 deteriorates. If it continues to operate at full capacity, it is prone to triggering a protection shutdown due to excessively high hot-end temperature, affecting the continuity of cooling. At this time, if the temperature of the variable temperature zone is higher than the start-up temperature, the controller 8 will cause the semiconductor chip 3 to operate at a low load, reducing the cooling capacity to below the rated value, but it can continue to work (without shutdown); if the temperature is lower than the start-up temperature, the semiconductor chip 3 will stop to avoid meaningless energy consumption.

[0066] Through the above technical solution, the control logic of this application optimizes the load of semiconductor chip 3 when evaporator 6 is not working, ensuring continuous cooling while reducing energy consumption, and achieving stable temperature control under all operating conditions.

[0067] This application also proposes a refrigerator including the above-mentioned variable temperature zone refrigeration device. By integrating this device, independent and precise temperature control of the variable temperature zone can be achieved without relying on an independent evaporator system, thus simplifying the structure and reducing energy consumption.

[0068] The refrigerator is a multi-compartment refrigerator with refrigeration, freezing, and variable temperature refrigeration zones. The first cooling plate 2 of the refrigeration unit is embedded in the side wall of the inner liner of the variable temperature zone. The semiconductor plate 3 and the heat exchanger 5 are hidden between the inner liner and the foam layer (without occupying storage space). The temperature sensor 9 is installed in the middle of the variable temperature zone. The controller 8 is integrated into the main control board of the refrigerator to realize coordinated control with other compartments.

[0069] Specifically, when the refrigerator is running, the evaporator 6 of the main refrigeration system cools the refrigeration zone, while the variable temperature zone is independently temperature-controlled by the built-in refrigeration device: when the variable temperature zone needs to be cooled, the controller 8 activates the semiconductor chip 3, the first cooling plate 2 directly cools, and the heat exchanger 5 coordinates to transfer temperature according to the working status (whether it is running) of the evaporator 6; the temperature sensor 9 provides real-time temperature feedback to ensure that it is stable within the set range.

[0070] Through the above technical solution, the refrigerator of this application achieves efficient independent temperature control of the cold storage variable temperature zone. While simplifying the structure, reducing costs and energy consumption, it ensures the freshness of food and the independence of flavor, thereby enhancing product competitiveness.

[0071] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the solutions disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the claims.

Claims

1. A refrigeration device for a variable temperature zone in a cold storage facility, characterized in that, include: The first cooling plate is disposed on the outer surface of the refrigerator inner liner and corresponds to the refrigerator temperature change zone inside the refrigerator inner liner; A semiconductor chip is disposed on the surface of the first heat-conducting sheet; the semiconductor chip is electrically connected to the refrigerator's controller; The second cooling plate is disposed on the outer surface of the refrigerator inner liner and corresponds to the evaporator inside the refrigerator inner liner; A heat exchanger is disposed at one end on the surface of the semiconductor wafer and at the other end on the surface of the second heat-conducting sheet, so as to transfer the heat of the semiconductor wafer to the second heat-conducting sheet.

2. The refrigeration device for a variable temperature zone in a refrigerator according to claim 1, characterized in that, A thermally conductive layer is provided on the side of the semiconductor wafer away from the first cold-conducting sheet, and the thermally conductive layer is in contact with the heat exchanger.

3. A refrigeration device for a variable temperature zone in a cold storage area according to claim 2, characterized in that, The heat-conducting layer is provided with an installation groove for installing the heat exchanger.

4. A refrigeration device for a variable temperature zone in a refrigerator according to claim 1, characterized in that, Both ends of the heat exchanger are arranged in an S-shape on the semiconductor wafer and the second heat-conducting plate, respectively.

5. A refrigeration device for a variable temperature zone in a cold storage area according to claim 1, characterized in that, It also includes: A temperature sensor is located inside the refrigeration variable temperature zone and is connected to the refrigerator's controller.

6. A refrigeration device for a variable temperature zone in a cold storage area according to claim 2, characterized in that, The thermally conductive layer can be a copper plate, an aluminum plate, or silicone grease.

7. A control method for a refrigeration device, based on a cold storage variable temperature zone refrigeration device according to any one of claims 1-6, characterized in that, include: The startup and shutdown temperatures of the semiconductor chip are preset; The real-time temperature of the refrigeration temperature-changing zone is obtained and compared with the start-up temperature and the shutdown temperature. Based on the comparison results, the controller sends a start signal or a stop signal to the semiconductor chip to initiate or stop cooling.

8. The control method for a refrigeration device according to claim 7, characterized in that, Based on the comparison result, the controller sends a start signal or a stop signal to the semiconductor chip to initiate or stop cooling, including: When the evaporator is working, if the real-time temperature is greater than the start-up temperature, the controller sends a start-up signal to the semiconductor chip and enters the rated working state. If the real-time temperature is lower than the start-up temperature, the controller sends a stop signal to the semiconductor chip to stop cooling.

9. The control method for a refrigeration device according to claim 7, characterized in that, Based on the comparison result, the controller sends a start signal or a stop signal to the semiconductor chip to initiate or stop cooling, including: When the evaporator is not working, if the real-time temperature is greater than the start-up temperature, the controller sends a start-up signal and enters a low-load working state. If the real-time temperature is lower than the semiconductor chip's start-up temperature, the controller sends a stop signal to the semiconductor chip to stop cooling.

10. A refrigerator, characterized in that, The refrigeration device includes a variable temperature zone for refrigeration as described in any one of claims 1-6.

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